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Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Sheet No.: D2-A08101EN
1 Date Mar. 31. 2004
© SHARP Corporation
PC3SF21YVZ Series
1.2±0.3 1.2±0.3
0.6±0.2
0.6±0.2 Model No.
Model No. 6 5 4
SHARP
SHARP 6 5 4
mark
mark Rank mark
Rank mark "S"
"S" 3SF21
3SF21
6.5±0.5
6.5±0.5
Anode 4
Anode 4 mark
mark
Date code (2 digit)
1 Date code (2 digit)
2 3
VDE 1 3
Factory identification mark 2
identification mark VDE Factory identification mark
7.12±0.5 7.62±0.3 identification mark
±0.3
7.12±0.5 7.62
0.5TYP.
3.5±0.5
2.9±0.5
TYP.
3.5±0.5
2.7MIN.
2.9±0.5
0.5
Epoxy resin
3.25±0.5
Epoxy resin
3.25±0.5
±0.1
2.54±0.25 0.5 ±0.1
θ θ ±0.5 0.26
2.54±0.25 0.5±0.1 10.16
θ : 0 to 13˚
Product mass : approx. 0.35g Product mass : approx. 0.35g
3. SMT Gullwing Lead-Form [ex. PC3SF21YXP] 4. Wide SMT Gullwing Lead-Form [ex. PC3SF21YWP]
1.2±0.3 0.6±0.2
0.6±0.2 1.2±0.3
6 5 4 6 5 4 Model No.
Model No. SHARP
SHARP mark
mark Rank mark
Rank mark "S"
"S"
3SF21 3SF21
6.5±0.5
6.5±0.5
Anode 4
Anode 4 mark
mark
Date code (2 digit)
Date code (2 digit)
1 2 3 1 2 3
VDE Factory identification mark
VDE Factory identification mark identification mark
identification mark
7.12±0.5 7.62±0.3
7.12±0.5 7.62±0.3
0.25±0.25
±0.1
3.5±0.5
0.35±0.25
0.26±0.1
3.5±0.5
0.26
Epoxy resin
2.54±0.25 Epoxy resin 2.54±0.25
1.0+0.4
−0 1.0+0.4
−0 0.75 ±0.25
10.16±0.5 0.75±0.25
10.0+0
−0.5
12.0 MAX.
2
PC3SF21YVZ Series
Indonesia
Philippines
China
* This factory marking is for identification purpose only.
Please contact the local SHARP sales representative to see the actural status of the
production.
Rank mark
Refer to the Model Line-up table
3
PC3SF21YVZ Series
1mm
Repetitive peak OFF-state voltage VDRM 600 V
*1
Isolation voltage Viso (rms) 5.0 kV
Operating temperature Topr −30 to +100 ˚C
Storage temperature Tstg −55 to +125 ˚C Soldering area
*2
Soldering temperature Tsol 270 *4 ˚C
*1 40 to 60%RH, AC for 1minute, f=60Hz
*2 For 10s
*3 f=50Hz sine wave
*4 Lead solder plating models: 260˚C
4
PC3SF21YVZ Series
Lead Form Wide SMT Gullwing SMT Gullwing Wide SMT Gullwing
Sleeve Taping IFT[mA]
Shipping Package
50pcs/sleeve 1 000pcs/reel Rank mark (VD=4V,
DIN RL=100Ω)
- Approved - Approved - Approved
EN60747-5-2
- PC3SF21YWZAF - PC3SF21YXPAF - PC3SF21YWPAF A MAX.10
Model No.
- PC3SF21YWZBF - PC3SF21YXPBF - PC3SF21YWPBF B MAX.7
Lead Form Wide SMT Gullwing SMT Gullwing Wide SMT Gullwing
Sleeve Taping IFT[mA]
Shipping Package
50pcs/sleeve 1 000pcs/reel Rank mark (VD=4V,
DIN RL=100Ω)
- Approved - Approved - Approved
EN60747-5-2
- PC3SF21YWZA - PC3SF21YXPA - PC3SF21YWPA A MAX.10
Model No.
- PC3SF21YWZB - PC3SF21YXPB - PC3SF21YWPB B MAX.7
Please contact a local SHARP sales representative to inquire about production status.
5
PC3SF21YVZ Series
Fig.1 Forward Current vs. Ambient Fig.2 RMS ON-state Current vs.
Temperature Ambient Temperature
70 175
60 150
50 125
40 100
30 75
20 50
10 25
0 0
−30 0 50 100 −30 0 50 100
Fig.3 Forward Current vs. Forward Voltage Fig.4 Minimum Trigger Current vs.
Ambient Temperature
10
VD=4V
100 9
RL=100Ω
Ta=75˚C Minimum trigger current IFT (mA)
8
50
Forward current IF (mA)
50˚C 7
6
25˚C 0˚C
5
10
4
5 3
−25˚C
2
1
1 0
0.9 1 1.1 1.2 1.3 1.4 1.5 −40 −20 0 20 40 60 80 100
Forward voltage VF (V) Ambient temperature Ta (˚C)
1.2
VDRM (Tj=Ta) / VDRM (Tj=25˚C)
2.2
ON-state voltage VT (V)
1.1 2
1.8
1
1.6
0.9
1.4
0.8
1.2
0.7 1
−40 −20 0 20 40 60 80 100 −40 −20 0 20 40 60 80 100
Ambient temperature Ta (˚C) Ambient temperature Ta (˚C)
6
PC3SF21YVZ Series
Fig.7 Holding Current vs. Fig.8 Repetitive Peak OFF-state Current vs.
Ambient Temperature Ambient Temperature
1 10−5
VD=4V
10−6
Holding current IH (mA)
0.1 10−7
10−8
0.01 10−9
−40 −20 0 20 40 60 80 100 −40 −20 0 20 40 60 80 100
Ambient temperature Ta (˚C) Ambient temperature Ta (˚C)
Fig.9 Turn-on Time vs. Forward Current Fig.10 Zero-cross Voltage vs.
Ambient Temperature
100 20
VD=6V
Resistance load,
RL=100Ω 18
IF=15mA
Ta=25˚C
16
Zero-cross voltage VOX (V)
14
Turn-on time tON (µs)
12
10 10
2
1 0
1 10 100 −40 −20 0 20 40 60 80 100
Forward current IF (mA) Ambient temperature Ta (˚C)
Remarks : Please be aware that all data in the graph are just for reference.
7
PC3SF21YVZ Series
■ Design Considerations
● Design guide
In order for the Phototriac to turn off, the triggering current (IF) must be 0.1mA or less.
Please refrain from using these devices in a direct drive configuration. These Phototriac Coupler are
intended to be used as triggering device for main Triacs. Please ensure that the output rating of these
devices will be sufficient for triggering the main output Triac of your choice. Failure to do may result in
malfunctions.
For applications with inductive loads such as motors,please use caution in utilizing a zero crossing type
Phototraiac Coupler as this may cause undesired operations due to the phase difference between voltage
and current of load.
For designs that will experience excessive noise or sudden changes in load voltage, please include an
appropriate snubber circuit as shown in the below circuit. Please keep in mind the Sharp Phototriac Coupler
incorporate superrior dV/dt ratings which can eliminate the need for a snubber circuit.
● Degradation
In general, the emission of the IRED used in Phototriac Couplers will degrade over time.
In the case where long term operation and / or constant extreme temperature fluctuations will be applied to
the devices, please allow for a worst case scenario of 50% degradation over 5years.
Therefore in order to maintain proper operation, a design implementing these Phototriac Couplers should
provide at least twice the minimum required triggering current from initial operation.
2.54
2.54
1.7
1.7
2.2 2.2
(Unit : mm)
8
PC3SF21YVZ Series
PC3SF21YVZ
1 6
Load
2
5 AC Line
Triac
3 4
Zero Crossing
Circuit
✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes.
9
PC3SF21YVZ Series
■ Manufacturing Guidelines
● Soldering Method
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
(˚C)
200
Reflow
220˚C or more, 60s or less
Preheat
100
150 to 180˚C, 120s or less
0
0 1 2 3 4 (min)
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
10
PC3SF21YVZ Series
● Cleaning instructions
Solvent cleaning :
Solvent temperature should be 45˚C or below. Immersion time should be 3minutes or less.
Ultrasonic cleaning :
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
● Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this device.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
11
PC3SF21YVZ Series
■ Package specification
● Sleeve package
1. Through-Hole or SMT Gullwing
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 50pcs of products shall be packaged in a sleeve.
Both ends shall be closed by tabbed and tabless stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.
MAX. 20 sleeves in one case.
±2
520
10.8
5.8
Package method
MAX. 50pcs of products shall be packaged in a sleeve.
Both ends shall be closed by tabbed and tabless stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.
MAX. 20 sleeves in one case.
±2
520
10.8
5.9
6.35
(Unit : mm)
Sheet No.: D2-A08101EN
12
PC3SF21YVZ Series
C
B
A
H
H
X.
MA
5˚
K
e d
g
c
Pull-out direction
[Packing : 1 000pcs/reel]
13
PC3SF21YVZ Series
A
H
H
X.
MA
K
5˚
Dimensions List (Unit : mm)
A B C D E F G
24.0±0.3 11.5±0.1 1.75±0.1 12.0±0.1 2.0±0.1 4.0±0.1 +0.1
φ1.5−0
H I J K
12.2 ±0.1 0.4±0.05 4.15±0.1 7.6±0.1
e d
g
c
Pull-out direction
[Packing : 1 000pcs/reel]
14
PC3SF21YVZ Series
■ Important Notices
· The circuit application examples in this publication are with equipment that requires higher reliability such as:
provided to explain representative applications of --- Transportation control and safety equipment (i.e.,
SHARP devices and are not intended to guarantee any aircraft, trains, automobiles, etc.)
circuit design or license any intellectual property rights. --- Traffic signals
SHARP takes no responsibility for any problems rela- --- Gas leakage sensor breakers
ted to any intellectual property right of a third party re- --- Alarm equipment
sulting from the use of SHARP's devices. --- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in connec-
· Contact SHARP in order to obtain the latest device tion with equipment that requires an extremely high lev-
specification sheets before using any SHARP device. el of reliability and safety such as:
SHARP reserves the right to make changes in the spec- --- Space applications
ifications, characteristics, data, materials, structure, --- Telecommunication equipment [trunk lines]
and other contents described herein at any time without --- Nuclear power control equipment
notice in order to improve design or reliability. Manufac- --- Medical and other life support equipment (e.g.,
turing locations are also subject to change without no- scuba).
tice.
· If the SHARP devices listed in this publication fall with-
· Observe the following points when using any devices in the scope of strategic products described in the For-
in this publication. SHARP takes no responsibility for eign Exchange and Foreign Trade Law of Japan, it is
damage caused by improper use of the devices which necessary to obtain approval to export such SHARP de-
does not meet the conditions and absolute maximum vices.
ratings to be used specified in the relevant specification
sheet nor meet the following conditions: · This publication is the proprietary product of SHARP
(i) The devices in this publication are designed for use and is copyrighted, with all rights reserved. Under the
in general electronic equipment designs such as: copyright laws, no part of this publication may be repro-
--- Personal computers duced or transmitted in any form or by any means, elec-
--- Office automation equipment tronic or mechanical, for any purpose, in whole or in
--- Telecommunication equipment [terminal] part, without the express written permission of SHARP.
--- Test and measurement equipment Express written permission is also required before any
--- Industrial control use of this publication may be made by a third party.
--- Audio visual equipment
--- Consumer electronics · Contact and consult with a SHARP representative if
(ii) Measures such as fail-safe function and redundant there are any questions about the contents of this pub-
design should be taken to ensure reliability and safety lication.
when SHARP devices are used for or in connection
15