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– 25Ω
INTERFACE
IN+ DA
–60
82pF DB
LTC2387-18 –80
82pF TWOLANES
–100
IN– TESTPAT
4.096V + 25Ω
VCM PD –120
LTC6228 0.1µF SAMPLE
0V CNV
– REFB CLOCK –140
–2.5V 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 7.5
6228 TA01a
FREQUENCY (MHz)
6228 TA02
Rev. A
Total Supply Voltage (V– to V+)..................................12V Output Current (OUT, FB)(Note 3)....................... ±100mA
Input Voltage (–IN, +IN, SHDN).... V– – 0.3V to V+ + 0.3V Output Short-Circuit Duration..............Thermally Limited
Input Current (–IN, +IN, SHDN) (Note 2)............... ±10mA Storage Temperature Range................... –65°C to 150°C
Operating Temperature Range Maximum Junction Temperature........................... 150°C
LTC6228I/LTC6229I (Note 4)................–40°C to 85°C Lead Temperature (Soldering 10s)
LTC6228H/LTC6229H (Note 4)........... –40°C to 125°C (MSOP/S8/TSOT Only).......................................... 300°C
Specified Temperature Range
LTC6228I/LTC6229I (Note 4)................–40°C to 85°C
LTC6228H/LTC6229H (Note 4)........... –40°C to 125°C
PIN CONFIGURATION
TOP VIEW
TOP VIEW
FB 1 8 SHDN
OUT 1 6 V+
–IN 2 7 V+
V– 2
– +
+ – 5 SHDN
+IN 3 6 OUT
+IN 3 4 –IN
V– 4 5 V–
S6 PACKAGE
S8 PACKAGE 6-LEAD PLASTIC TSOT-23
8-LEAD PLASTIC SO TJMAX = 150°C, θJA = 192°C/W (NOTE 7)
TJMAX = 150°C, θJA = 120°C/W (NOTE 7)
TOP VIEW
TOP VIEW
OUTA 1 10 V+
V+ 1 6 OUT
–INA 2 9 OUTB
7 11
+IN 2 5 –IN +INA 3 8 –INB
V– V–
V– 3 4 SHDN V– 4 7 +INB
SHDNA 5 6 SHDNB
DC PACKAGE
6-LEAD (2mm × 2mm) PLASTIC DFN DD PACKAGE
TJMAX = 150°C, θJA = 80°C/W (NOTE 7) 10-LEAD (3mm × 3mm) PLASTIC DFN
EXPOSED PAD (PIN 7) IS V–, MUST BE SOLDERED TO PCB TJMAX = 125°C, θJA = 43°C/W (NOTE 2)
EXPOSED PAD (PIN 11) IS V–, MUST BE SOLDERED TO PCB
TOP VIEW
OUTA 1 8 V+
–INA 2 7 OUTB
– +
+INA 3 9 6 –INB
+ –
V– 4 V– 5 +INB
MSE PACKAGE
8-LEAD PLASTIC MSOP
TJMAX = 150°C, θJA = 35°C/W (NOTE 8)
EXPOSED PAD (PIN 9) IS V–, MUST BE SOLDERED TO PCB
Rev. A
ELECTRICAL
The CHARACTERISTICS (VS = ±5V) l denotes the specifications which apply over the
full operating temperature range, otherwise specifications are at TA = 25°C. VS = ±5V,VCM = 0V, VSHDN = floating unless otherwise noted.
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
VOS Input Offset Voltage –95 20 95 μV
l –250 250 μV
∆VOS Input Offset Voltage Match (LTC6229) –140 18 140 µV
l –400 400 µV
TCVOS Input Offset Voltage Drift l 0.4 μV/°C
IB Input Bias Current (Note 6) Bias Cancellation Disabled –40 –16 μA
l –44 μA
Bias Cancellation Enabled –2.5 0.6 2.5 μA
l –4.1 4.1 μA
∆IB Input Bias Current Match (LTC6229) Bias Cancellation Disabled –2 0.3 2 µA
l –3 3 µA
Bias Cancellation Enabled –3 0.3 3 µA
l –4 4 µA
IOS Input Offset Current Bias Cancellation Disabled –0.55 0.1 0.55 μA
l –0.8 0.8 μA
Bias Cancellation Enabled –0.9 0.1 0.9 μA
l –1 1 μA
∆IOS Input Offset Current Match (LTC6229) Bias Cancellation Disabled –1 0.15 1 µA
l –1.4 1.4 µA
Bias Cancellation Enabled –1.3 0.25 1.3 µA
l –1.6 1.6 µA
en Input Noise Voltage Spectral Density f = 1MHz 0.88 nV/√Hz
Integrated 1/f Noise 0.1Hz to 10Hz 0.94 μVP-P
in Input Current Noise Spectral Density f = 1MHz Bias Cancellation Disabled 3 pA/√Hz
f = 1MHz Bias Cancellation Enabled 6.3 pA/√Hz
CIN Input Capacitance Differential Mode 3.5 pF
Common Mode 1.5 pF
RIN Input Resistance Differential Mode 2.6 kΩ
Common Mode 4 MΩ
Rev. A
ELECTRICAL
The CHARACTERISTICS (VS = 5V, 0V) l denotes the specifications which apply
over the full operating temperature range, otherwise specifications are at TA = 25°C. VS = 5V, 0V,VCM = VOUT = 2.5V, VSHDN = floating
unless otherwise noted.
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
VOS Input Offset Voltage –105 20 105 μV
l –290 290 μV
∆VOS Input Offset Voltage Match (LTC6229) –140 18 140 µV
l –400 400 µV
TCVOS Input Offset Voltage Drift l 0.4 μV/°C
IB Input Bias Current (Note 6) Bias Cancellation Disabled –40 –16 μA
l –44 μA
Bias Cancellation Enabled –3 1 3 μA
l –4.4 4.4 μA
∆IB Input Bias Current Match (LTC6229) Bias Cancellation Disabled –2 0.3 2 µA
l –3 3 µA
Bias Cancellation Enabled –3 0.3 3 µA
l –4 4 µA
IOS Input Offset Current Bias Cancellation Disabled –0.55 0.1 0.55 μA
l –0.8 0.8 μA
Bias Cancellation Enabled –0.9 0.15 0.9 μA
l –1 1 μA
∆IOS Input Offset Current Match (LTC6229) Bias Cancellation Disabled –1 0.15 1 µA
l –1.4 1.4 µA
Bias Cancellation Enabled –1.3 0.25 1.3 µA
l –1.6 1.6 µA
Rev. A
Rev. A
ELECTRICAL
The CHARACTERISTICS (VS = 3V, 0V) l denotes the specifications which apply
over the full operating temperature range, otherwise specifications are at TA = 25°C. VS = 3V, 0V,VCM = 1.5V, VSHDN = floating unless
otherwise noted.
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
VOS Input Offset Voltage –110 24 110 μV
l –300 300 μV
∆VOS Input Offset Voltage Match (LTC6229) –140 18 140 µV
l –400 400 µV
TCVOS Input Offset Voltage Drift l 0.4 μV/°C
IB Input Bias Current (Note 6) Bias Cancellation Disabled –38 –16 μA
l –44 μA
Bias Cancellation Enabled –3.5 1.5 3.5 μA
l –4.3 4.1 μA
∆IB Input Bias Current Match (LTC6229) Bias Cancellation Disabled –2 0.3 2 µA
l –3 3 µA
Bias Cancellation Enabled –3 0.3 3 µA
l –4 4 µA
Rev. A
Rev. A
Note 1: Stresses beyond those listed under Absolute Maximum Ratings Note 4: The LTC6228I/LTC6229I is guaranteed functional and specified
may cause permanent damage to the device. Exposure to any Absolute over the temperature range of –40°C to 85°C. The LTC6228H/LTC6229H is
Maximum Rating condition for extended periods may affect device guaranteed functional and specified over the temperature range of –40°C
reliability and lifetime. to 125°C.
Note 2: The inputs are protected by back-to-back diodes. If any of Note 5: Supply range voltage is guaranteed by power supply rejection ratio test.
the input or shutdown pins goes 300mV beyond either supply or the Note 6: The input bias current is the average of the currents through the
differential input voltage exceeds 0.7V, the input current should be limited non-inverting and inverting input pins.
to less than 10mA. Note 7: Thermal resistance varies with the amount of PC board metal
Note 3: A heat sink may be required to keep the junction temperature connected to the package. The specified values are with short traces
below the absolute maximum rating when the output current is high. connected to the leads with minimal metal area.
Note 8: Middle 2/3 of the output waveform is observed. RL = 1kΩ at half supply.
Rev. A
VOS vs Temperature, 10V Supply VOS vs Temperature, 5V Supply VOS vs Temperature, 3V Supply
160 160 160
VS = ±5V VS = ±2.5V VS = 3V, 0V
140 VCM = 0V 140 VCM = 0V 140 VCM = 1.5V
5 DEVICES 5 DEVICES 5 DEVICES
INPUT OFFSET VOLTAGE (µV)
80 80 80
60 60 60
40 40 40
20 20 20
0 0 0
–55 –35 –15 5 25 45 65 85 105 125 –55 –35 –15 5 25 45 65 85 105 125 –55 –35 –15 5 25 45 65 85 105 125
TEMPERATURE (°C) TEMPERATURE (°C) TEMPERATURE (°C)
6228 G04 6228 G05 6228 G06
70 160
60
OFFSET VOLTAGE (µV)
TA = 125°C 140
50 30
TA = 85°C 120
40
30 100 TA = 125°C 20
20
80
10 10
0 60 TA = 85°C
–10 TA = –55°C 40 TA = –55°C
–20 0
TA = 25°C 20 TA = 25°C
–30
–40 0 –10
–6 –5 –4 –3 –2 –1 0 1 2 3 4 5 –50 –40 –30 –20 –10 0 10 20 30 40 50 0 1 2 3 4 5 6 7 8
INPUT COMMON MODE VOLTAGE (V) OUTPUT CURRENT (mA) TIME AFTER POWER UP (s)
6228 G07 6228 G08 6228 G09
Rev. A
–25 TA = 85°C –8
–9
–30 –10 6228 G12
–5.1 –4.2 –3.3 –2.4 –1.5 –0.7 0.2 1.1 2.0 2.9 3.8 –5.1 –4.2 –3.3 –2.4 –1.5 –0.7 0.2 1.1 2.0 2.9 3.8 1s/DIV
INPUT COMMON MODE VOLTAGE (V) INPUT COMMON MODE VOLTAGE (V)
6228 G10 6228 G11
Input
InputVoltage
VoltageNoise
Noiseand Current
and Noise
Current Noise Supply Current vs Input Common
Spectral Densities
Spectral DensitiesvsvsFrequency
Frequency Supply Current vs Supply Voltage Mode Voltage
5k 20 20
iN,bias cancellation disabled VS = ±5V TA = 125°C
TA=25°C 18 TA = 125°C 19
1k
INPUT CURRENT NOISE (pA/√Hz)
INPUT VOLTAGE NOISE (nV/√Hz)
16 18
TA = 25°C
2 11
1 VCM = VS/2
0.5 0 10
0.1 1 10 100 1k 10k 100k 1M 10M100M 0 2 4 6 8 10 12 –5.1 –4.2 –3.3 –2.4 –1.5 –0.6 0.3 1.2 2.1 3.0 3.9
FREQUENCY (Hz) TOTAL SUPPLY VOLTAGE (V) INPUT COMMON MODE VOLTAGE (V)
6228 G13 6228 G14 6228 G15
Supply Current vs SHDN Pin Input Bias Current vs SHDN Pin SHDN Pin Current vs SHDN Pin
Voltage Voltage
SHDN Pin Voltage Voltage
SHDN Pin Voltage
20 5.0 5.0
VS = ±5V VS = ±5V
18 TA = 125°C 2.5 2.5 VS = ±5V
16 0 0
INPUT BIAS CURRENT (µA)
Rev. A
TA = 125°C TA = 125°C
80
40 TA = 25°C
TA = 25°C TA = 25°C
0 0.1 0.1
–40 TA = –55°C
–80
–120 TA = –55°C
–160 TA = –55°C
–200 0.01 0.01
2 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0 0.001 0.01 0.1 1 10 100 0.001 0.01 0.1 1 10 100
TOTAL SUPPLY VOLTAGE (V) LOAD CURRENT (mA) LOAD CURRENT (mA)
6228 G19 6228 G20 6228 G21
170 24 24
TA = 25°C
130 TA = 85°C 16 16
90 TA = 125°C 8 8
50 0 0
10 –8 –8
–30 TA = 85°C –16 –16
TA = 125°C
–70 –24 –24
–110 SOURCE TA = 25°C –32 –32
TA = –55°C TA = 25°C TA = 25°C
–150 –40 –40
2.8 3.7 4.6 5.5 6.4 7.3 8.2 9.1 10.0 10.9 11.8 –5 –4 –3 –2 –1 0 1 2 3 4 5 –2.5 –2 –1.5 –1 –0.5 0 0.5 1 1.5 2 2.5
TOTAL SUPPLY VOLTAGE (V) OUTPUT VOLTAGE (V) OUTPUT VOLTAGE (V)
6228 G22 6228 G23 6228 G24
0
16 0
–2 –3
8
GAIN (dB)
GAIN (dB)
–6
0 –4
–9
–8 –6 –12
–16
–8 –15 VS = ±5V
–24 VS = ±5V –18 TA = 25°C
–10 RL = 1kΩ RF = RG = 301Ω C F = 2.7pF
–32 –21
TA = 25°C TA = 25°C RL = 1kΩ
–40 –12 –24
–1.5 –1 –0.5 0 0.5 1 1.5 10k 100k 1M 10M 100M 1G 10k 100k 1M 10M 100M 1G
OUTPUT VOLTAGE (V) FREQUENCY (Hz) FREQUENCY (Hz)
6228 G25 6228 G26 6228 G27
Rev. A
TA = 25°C
110
90
10
OUTPUT IMPEDANCE (Ω)
80 90
70 PSRR (dB)
60 70
AV = 10
1
AV = 2 50 50
40
AV = 1 30 30
0.1
20 VS = ±5V
10 VCM = 0V
10
TA = 25°C
0.01 0 –10
10k 100k 1M 10M 100M 1G 100k 1M 10M 100M 500M 100 1k 10k 100k 1M 10M 100M
FREQUENCY (Hz) FREQUENCY (Hz) FREQUENCY (Hz)
6228 G31 6228 G32 6228 G33
500
OVERSHOOT (%)
+
OVERSHOOT (%)
RISING
35 90 VIN
1kΩ CL
400 30 RS = 20Ω 75
FALLING RS = 10Ω
25 60
VS = ±2.5V, VOUT = 4VP-P
300
20 RS = 50Ω 45
VS = ±1.5V, VOUT = 2VP-P RISING
15 30
200
FALLING 10 15
100 5 0
–55 –35 –15 5 25 45 65 85 105 125 10 100 1000 10000 10 100 1000 10000
TEMPERATURE (°C) CAPACITIVE LOAD (pF) CAPACITIVE LOAD (pF)
6228 G35
SLEW RATE MEASURED AT RS = 10Ω, CF = 0pF RS = 10Ω, CF = 2.7pF
MIDDLE 2/3 OF OUTPUT 6228 G34
RS = 20Ω, CF = 0pF RS = 20Ω, CF = 2.7pF
RS = 50Ω, CF = 0pF RS = 50Ω, CF = 2.7pF
6228 G36
Rev. A
Distortion vs
Distortion vs Frequency,
Frequency, AAVV == 11, Distortion vs
Distortion vs Frequency,
Frequency, AAVV == 11, Distortion vs Frequency, AV = 11,
±5V Supply
Supply 5V Supply
5V 3V Supply
Supply
–30 –30 –10
VS = ±5V VS = 5V,0V VS = 3V,0V
–40 VOUT = 4VP–P TA=25°C –40 VOUT=2VP–P –20 VOUT=1VP–P
RL =1kΩ, 2nd RL to Mid–Supply –30 VCM=1.25V
–50 VOUT = 2VP–P –50 TA=25°C RL to VCM
VOUT = 4VP–P –40
–60 RL = 1kΩ, 3
rd RL = 1kΩ, 2nd –60 TA=25°C
RL = 100Ω, 2nd
DISTORTION (dBc)
DISTORTION (dBc)
–50
DISTORTION (dBc)
DISTORTION (dBc)
DISTORTION (dBc)
V = 4VP–P –60
–70 ROUT nd –70
L = 100Ω, 2 RL = 100Ω, 2ND
–70
–80 –80
VOUT = 4VP–P RL = 1kΩ, 2nd –80 RL = 1kΩ, 2ND
–90 RL = 100Ω, 3rd –90
–90
–100 –100 –100
RL = 100Ω, 3RD
–110 VOUT = 2VP–P –110 RL = 1kΩ, 3rd –110
RL = 1kΩ, 2nd
–120 VOUT = 2VP–P –120 –120
RL = 1kΩ, 3rd RL = 100Ω, 3rd RL = 1kΩ, 3RD
–130 –130 –130
100k 1M 10M 100k 1M 10M 100k 1M 10M 50M
FREQUENCY (Hz) FREQUENCY (Hz) FREQUENCY (Hz)
6228 G40 6228 G41 6228 G42
Maximum Undistorted Output 0.1% Settling Time vs Output 0.1% Settling Time vs Output
Signal vs Frequency Step
vs (Non-Inverting)
Output Step (Non–inverting) Step (Inverting)
vs Output Step (Inverting)
10 50 50
VS = ±5V AV = –1 Av = +1
2.7pF
9 AV = 2
TA=25°C
45 45 301Ω
OUTPUT VOLTAGE SWING (VP-P)
VOUT
40 – 40
6 1kΩ
VS = ±2.5V AV = 2 VIN +
5 35 1kΩ 35
AV = –1
4
VS = ±1.5V 30 30
3
AV = –1
2 TA = 25°C Av = –1
25 25
1 RL = 1kΩ TA=25°C
HD2, HD3 < –40dBc VS=±5V
0 20 20
0.1 1 10 40 –8 –7 –6 –5 –4 –3 –2 –1 0 1 2 3 4 5 6 7 8 –8 –7 –6 –5 –4 –3 –2 –1 0 1 2 3 4 5 6 7 8
FREQUENCY (MHz) OUTPUT STEP (V) OUTPUT STEP (V)
6228 G43 6228 G44 6228 G45
Rev. A
SHDN
2.25V
1V/DIV
6228 G46 6228 G47
1µs/DIV 20ns/DIV
Rev. A
Rev. A
V+
pwr_dn I3 pwr_dn M2
Q15
+ V+ V– + R3 R4 R5
pwr_dn I2 pwr_dn I1 C2 ESDD5
ESDD1 ESDD2 Q12
Q11 Q13
+IN
pwr_dn V– CC
SHDN D5 D7
INTERFACE Q1 Q2 OUT
SHDN
BLOCK
–IN V+
disable_bias
ESDD4 ESDD3 pwr_dn I4 BUFFER
AND
OUTPUT BIAS
Q16 V– V+
Q9 Q8 ESDD6
Q10
Q17 Q18
Q19
pwr_dn M1 C1
disable_bias M3 Q14
R1 R2 R3
V–
6228 F01
Rev. A
Rev. A
Figure 2. 7pF Feedback Cancels Parasitic Pole Example: For an LTC6228 in a 6-lead DC package operat-
ing on ±5V supplies and driving a 500Ω load to ground,
the worst-case power dissipation is approximately given
For high speed designs, minimizing parasitic inductance by PD(MAX)/Amp = (10 • 19mA) + (5)2/500 = 240mW.
is important. The use of capacitors where the electrodes
are terminated on the long side instead of the short side At the Absolute Maximum ambient operating temperature,
(for example the use of 0306 instead of 0603 compo- the junction temperature under these conditions will be:
nents) can help in this regard. TJ = TA + (PD • θJA) = 125 + 0.24 • 80 = 144.2°C
Shutdown which is slightly less than the absolute maximum junction
temperature for the LTC6228/LTC6229.
The LTC6228/LTC6229 have shutdown pins (SHDN),
which disable the amplifiers and reduce the quiescent Refer to the Pin Configuration section for thermal resis-
current per channel to approximately 500µA. The SHDN tances of various packages
pin needs to be driven at least 2.75V below V+ to disable
amplifier operation. For total supply voltages of 5V and or Board Layout and Bypass Capacitors
less, the amplifier can be disabled at a pin voltage of V+ – High speed and RF board layout techniques should be
2.65V. During shutdown, the output transistors Q15 and used due to the very high speeds of the signals involved.
Q14 in Figure 1 are placed into a high impedance state. If For the LTC6228 SOIC-8 package option, the feedback
SHDN is left floating, the pin is internally biased to 1.2V should be taken from the FB pin rather than from the
below the positive supply, and the amplifier remains on. output pin, to reduce signal trace length.
Rev. A
7.5V
4.096V + CLK
LTC6228 DCO LVDS
0V 25Ω
IN+ DA INTERFACE
–
82pF DB
LTC2387-18
82pF TWOLANES
4.096V + IN–
TESTPAT
25Ω
LTC6228 VCM PD
0V
0.1µF
– REFB CNV
SAMPLE
CLOCK
–2.5V 6228 F04
–60
–80
–100
–120
–140
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 7.5
FREQUENCY (MHz)
6228 F05
+IN + R4 R6
U1 750Ω 750Ω
1/2 LTC6229
–
R1 R2 VS+
30Ω 1.2k
R9 +
49.9Ω U3
R8 R3 VOUT
30Ω 1.2k LTC6228
C2 –
200pF
– VS– VS = ±1.65V
R5 R7 GAIN = 41V/V
U2 750Ω 750Ω ISUPPLY = 49mA
1/2 LTC6229 BW = 24MHz
+ en (1MHz) = 1.79nV/√Hz
–IN
C1
VS–
2.2pF 6228 F06
40 100
COMMON MODE REJECTION RATIO (dB) 90
30
80
20
70
10 60
GAIN (dB)
0 50
40
–10
30
–20
20
–30 10
–40 0
10k 100k 1M 10M 100M 500M 10k 100k 1M 10M 100M 500M
FREQUENCY (Hz) FREQUENCY (Hz)
6228 F07 6228 F08
OUTPUT
1V/DIV
0V
INPUT
25mV/DIV
0V
6228 F09
50ns/DIV
Rev. A
R1
200Ω
R3 R7 5V
49.9Ω 348Ω – RO1
VIN1
+ 49.9Ω
CF2 LTC6228 VOUT
18pF + –
–5V
R6 R5 R4
49.9Ω 150Ω 100Ω
VIN2
6228 F10
0 10
–3 0 USING 1% RESISTORS
–6 –10
–9 –20
–12 –30
GAIN (dB)
GAIN (dB)
–15 –40
–18 –50
–21 –60
–24 –70
–27 –80
–30 –90
100kHz 1MHz 10MHz 100MHz 100k 1M 10M 100M
FREQUENCY(Hz) FREQUENCY (Hz)
6228 F11 6228 F12
100mV/DIV
6228 F13
200ns/DIV
.245
MIN .160 ±.005
.150 – .157
.228 – .244
(3.810 – 3.988)
(5.791 – 6.197)
NOTE 3
.030 ±.005
TYP
1 2 3 4
RECOMMENDED SOLDER PAD LAYOUT
.010 – .020
× 45° .053 – .069
(0.254 – 0.508)
(1.346 – 1.752)
.004 – .010
.008 – .010
0°– 8° TYP (0.101 – 0.254)
(0.203 – 0.254)
.016 – .050
.014 – .019 .050
(0.406 – 1.270)
(0.355 – 0.483) (1.270)
NOTE: TYP BSC
INCHES
1. DIMENSIONS IN
(MILLIMETERS)
2. DRAWING NOT TO SCALE
3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm) SO8 REV G 0212
Rev. A
0.70 ±0.05
2.55 ±0.05
1.15 ±0.05 0.60 ±0.10
(2 SIDES)
PACKAGE
OUTLINE
0.25 ±0.05
0.50 BSC
1.37 ±0.10
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
R = 0.125 0.40 ±0.10
TYP
0.60 ±0.10 4 6
(2 SIDES)
TYP 3 1
0.25 ±0.05
0.200 REF 0.75 ±0.05 0.50 BSC
1.37 ±0.10
(2 SIDES)
0.00 – 0.05 BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WCCD-2)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
Rev. A
1.22 REF
PIN ONE ID
0.80 – 0.90
0.20 BSC
0.01 – 0.10
1.00 MAX
DATUM ‘A’
Rev. A
0.70 ±0.05
PACKAGE
OUTLINE
0.25 ±0.05
0.50
BSC
2.38 ±0.05
(2 SIDES)
5 1
0.200 REF 0.75 ±0.05 0.25 ±0.05
0.50 BSC
2.38 ±0.10
(2 SIDES)
0.00 – 0.05
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
Rev. A
0.05 REF
5.10 DETAIL “B”
1.68 ±0.102 3.20 – 3.45 CORNER TAIL IS PART OF
(.201)
(.066 ±.004) (.126 – .136)
MIN DETAIL “B” THE LEADFRAME FEATURE.
FOR REFERENCE ONLY
8
NO MEASUREMENT PURPOSE
3.00 ±0.102
0.65 0.52
0.42 ±0.038 (.118 ±.004)
(.0256)
(.0165 ±.0015) (NOTE 3) 8 7 6 5 (.0205)
BSC
TYP REF
RECOMMENDED SOLDER PAD LAYOUT
3.00 ±0.102
4.90 ±0.152
DETAIL “A” (.118 ±.004)
0.254 (.193 ±.006)
(NOTE 4)
(.010)
0° – 6° TYP
GAUGE PLANE
1 2 3 4
0.53 ±0.152
(.021 ±.006) 1.10 0.86
(.043) (.034)
DETAIL “A” MAX REF
0.18
(.007)
SEATING
PLANE 0.22 – 0.38 0.1016 ±0.0508
(.009 – .015) (.004 ±.002)
0.65
TYP MSOP (MS8E) 0213 REV K
(.0256)
NOTE:
BSC
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
6. EXPOSED PAD DIMENSION DOES INCLUDE MOLD FLASH. MOLD FLASH ON E-PAD
SHALL NOT EXCEED 0.254mm (.010") PER SIDE.
Rev. A
Rev. A
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog
Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications
Forgranted
subject to change without notice. No license is morebyinformation www.analog.com
implication or otherwise under any patent or patent rights of Analog Devices. 29
LTC6228/LTC6229
TYPICAL APPLICATION
Photodiode Amplifier Noise Spectrum
1000
R1 600
1MΩ
5 400
C3 R3 200
1µF 604Ω
C1 0
0.055pF 100kHz 1MHz 10MHz
J1 (PARASITIC)
5 6228 TA02b
ON-SEMI
D1 2SK932-22 –
PHOTODIODE + Photodiode Amplifier Transient Response
SFH213 R7
LTC6228
–5 1.21kΩ
+ – OUT
–5
–5 RISE TIME = 77ns
–3dB BW = 4.6MHz
200mV/DIV
INTEGRATED NOISE = 661µVRMS
OVER 4.6MHz 6228 TA02a
6228 TA02c
100ns/DIV
RELATED PARTS
PART NUMBER DESCRIPTION COMMENTS
Operational Amplifiers
LTC6252/LTC6253/ Single/Dual/Quad High Speed Rail-to-Rail Input and Output 720MHz, 3.5mA, 2.75nV/√Hz, 280V/µs, 0.35mV, Unity Gain Stable
LTC6254 Op Amps
LTC6268-10/ Single/Dual High Speed FET Input Op Amp 4GHz, 4nV/√Hz, ±3fA Input Bias Current
LTC6269-10
ADA4897-1 1nV/√Hz, Low Power Rail-to-Rail Output 230MHz, 120V/µs
LT1806/LT1807 Single/Dual Low Noise Rail-to-Rail Input and Output Op Amps 325MHz, 13mA, 3.5nV/√Hz, 140V/µs, 550µV, 85mA Output Drive
LTC6246/LTC6247/ Single/Dual/Quad High Speed Rail-to-Rail Input and Output 180MHz, 1mA, 4.2nV/√Hz, 90V/µs, 0.5mV
LTC6248 Op Amps
LT6238/LT6237/ Single/Dual/Quad Low Noise Rail-to-Rail Output Op Amps 215MHz, 3.5mA, 1.1nV/√Hz, 70V/µs, 350µV
LT6232
LT6200/LT6201 Single/Dual Ultralow Noise Rail-to-Rail Input/Output Op Amps 165MHz, 20mA, 0.95nV/√Hz, 44V/µs, 1mV
AD8099 Ultralow Distortion Low Noise High Speed Op Amp 0.95nV/√Hz, 3.8GHz GBW
LT1468 16-Bit Accurate Precision High Speed Op Amp 90MHz, 3.9mA, 5nV/√Hz, 22V/µs, 175µV,
–96.5dB THD at 10VP-P, 100kHz
ADA4899-1 Unity Gain Stable Ultra Low Distortion 1nV/√Hz 600MHz, 310V/µs, 4.5V to 10V Operation
LT1028/LT1128 Ultralow Noise, Precision High Speed Op Amps 75MHz, 9.5mA, 0.85nV/√Hz, 11V/µs, 40µV
ADCs
LTC2387-18 18-Bit, 15Msps SAR-ADC 95.7dB SNR
LTC2393-16 1Msps 16-Bit SAR-ADC 94dB DNR
LTC2378-20 20-bit,1 Msps Low Power SAR-ADC 104 dB SNR/105 dB THD at 100kHz
AD7625 16-Bit 6Msps PulSAR ADC ®
93dB SNR
AD4020 20-Bit, 1.8Msps Precision SAR-ADC 99dB SNR/100db THD at 100kHz
Rev. A
30
09/19
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For more information www.analog.com ANALOG DEVICES, INC. 2019