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Tech 32
Tech 32
Contents
Introduction .......................................................................................................... 1
1. Amines............................................................................................................. 2
1-1. Aliphatic amine ......................................................................................... 2
1-2. Aromatic amine ........................................................................................ 4
1-3. Modified amines ....................................................................................... 4
2. Polyamide resin ............................................................................................... 5
3. Tertiary and secondary amines ....................................................................... 5
4. Imidazoles ....................................................................................................... 6
5. Polymercaptan curing agent............................................................................ 6
5-1. Liquid polymercaptan ............................................................................... 6
5-2. Polysulfide resin ....................................................................................... 6
6. Anhydrides....................................................................................................... 8
7. Latent curing agents ........................................................................................ 8
7-1. Boron trifluoride-amine complexes........................................................... 8
7-2. Dicyandiamide.......................................................................................... 8
7-3. Organic acid hydrazide ............................................................................ 9
8. Photo- and ultraviolet-curing agents................................................................ 9
Conclusion ......................................................................................................... 10
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1. Amines _______________________________________________ •
Amine compounds are classified into primary, agent for epoxy resin ant able to cure at room
secondary, and tertiary amines, in which one, two, temperature. The cured resin has excellent
and three hydrogen molecule(s) of ammonia (NH3) properties, and its heat resistance is 100°C.
have been substituted for hydrocarbon, respectively. Aromatic amine has been developed to achieve
Amines are called monoamine, diamine, tri-amine, greater heat resistance and chemical resistance than
or polyamine according to the number of amines in those of aliphatic amine.
one molecule. Amines are classified into aliphatic, The curing of epoxy resin by amine curing agents
alicyclic (Three Bond 2106), and aromatic amines is expressed by the formula shown below; the active
according to the types of hydrocarbons involved, hydrogen in primary amine reacts with an epoxy
and the all are important curing agents for epoxy group to form secondary amine, and the secondary
resin. amine reacts with an epoxy group to cure. Then, the
Aliphatic amine (Three Bond 2103) is curing resultant tertiary amine polymerizes epoxy groups.
In general, curing agent must have more than temperature, but inner epoxy type such as
three active hydrogen atoms and two amino groups cyclohexene oxide and epoxidized polybutadiene is
in a molecule so that the cured resin becomes hardly cured. Glycidyl-ester type cures quite faster
crosslinked polymer, according to the reaction of than glycidyl-ether type. Diglycidyl ether of
the above equation. The loading of the curing agent bisphenol A (DGEBA), which is a condensation
in epoxy resin becomes optimal when the number product of bisphenol A and epichlorohydrin, is
of moles in epoxy groups is equal to that of active primarily cured by aliphatic amines at room
hydrogen. temperature, but is slowly cured by aromatic amines
The curing speed of individual amines depends and requires thermal curing.
on the type and loading of amine, and the type of Table 1 shows the properties and performances of
epoxy resin. The most commonly used representative polyamines used as curing agents for
glycidyl-ether type resins easily cure at room epoxy resin.
1-1. Aliphatic amine (Three Bond 2103) room temperature are improved. The heat-deformation
Aliphatic amine, which rapidly reacts with epoxy temperature (HDT) of cured object of DGEBA is 120°C
resin, is a representative room-temperature curing agent. at the highest.
However, it generates a large quantity of heat and has a Resins that have been cured using aliphatic amines
short pot life (usable time). Loading of amines are strong, and are excellent in bonding properties. They
containing no tertiary amine is made at the exact or very have resistance to alkalis and some inorganic acids, and
closed amount that is said in stoichiometry, and use have good resistance to water and solvents, but they are
amount of amines containing tertiary amine is made less not so good to many organic solvents. Aliphatic amine
than that. If latter curing is performed at high irritates the skin and possesses toxicity. Although those
temperature, properties of curing agents that cure at that have high molecular weight and low vapor pressure
are less toxic, good cares for handling are required.
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Table 1. Properties and performance of amine based curing agents
Active - Loading
Specific Curing conditions Heat Applicability
Viscosity hydrogen amount to Pot life
Name of curing gravity deformation
Class Subclass Appearance cps equivale liquid (100 g) Temperature Time Remark
agent (25°C) nt (amine epoxy
(g/ml)
(batch)
temperature Bonding Lamination Casting Paint
(20°C) (°C) (minutes) (°C)
value) resin (phr)
5 - 10
Transparent
0.954 20 Normal to 30 minutes
Diethylenetriamine (DTA)
liquid
5.6 20.7 Standard
minutes 100 to 4 days 115
value: 8
6 - 12
Triethylenetetramine Transparent
0.98 20 to 30 Normal to 30 minutes
(TTA) liquid
19.4 24.4 Standard
minutes 100 to 4 days 115
value: 9
7 - 14
Tetraethylenepentamine Transparent
1.00 30 to 40 Normal to 30 minutes
(TEPA) liquid
51.9 27.1 Standard
minutes 100 to 7 days 115
Chain value: 12
aliphatic
polyamine Diproprenediamine Transparent 20 to 30 Normal to 30 minutes
(DPDA) liquid
29.0 12 - 15
minutes 200 to 7 days 110
4-8
Bonding
= 8,
Diethylaminopropylamine Transparent 1 to 4 65 - 115 1 - 4 hours
(DEAPA) liquid
65.0 Casting
hours 85
= 4,
Lamination
=6
Transparent 1000 - 30 Normal to 30 minutes
AMINE 248
liquid 3000 42.9 35 0.83
minutes 100 to 4 days 92 Rare Hexamethylenediamine
N-aminoethylpiperazine Transparent
43 20 - 22 0.984 20 to 30 Normal to 30 minutes
(N-AEP) liquid minutes 200 to 3 days 103
Transparent
31 - 33 31 - 33 0.945 80+150 2 hours + 2
Lamiron C-260
liquid
60 hours 150
Transparent
15 - 20 0.94 120 Normal 7 days
Araldit HY-964
liquid
70 minutes
Isophoronediamine Transparent
18.2 41 24 0.924 1 hour 80+150 4+1 hours 149
(IPDA) liquid
Transparent
17 - 21 0.96 30 Normal to 2 hours to 7
S Cure 211 47
liquid minutes 70 days
Transparent
12 - 16 0.98 40 Normal to 2 hours to 7
S cure 212 48
liquid minutes 70 days
m•p
Wandamin HM 53 30 0.95 60+150 3+2 hours 150
40°C
m-xylenediamine Crystalline
34.1 16 - 18 1.05 20 Normal to 1 hour to 7
(m-XDA) liquid minutes 60 days 115
20 Normal to 1 hour to 7
Sho-amine X Liquid 68° 33 - 34 16 - 18 1.05
minutes 60 days 113 Xylylenediamine
(50°C)
Viscous 2000 40 Normal to 1 hour to 7
Aliphatic Amine black
liquid -
30 - 60 1.20
minutes 60 days Xylylenediamine trimer
aromatic
6000
amine
6000
Viscous 40 Normal to 1 hour to 7
Sho-amine black
liquid
- 25 - 35 1.18
minutes 60 days 116 Xylylenediamine trimer
10000
80 Normal to 1 hour to 7
Sho-amine N Liquid 5° (690) 25 1.18
minutes 60 days 81 Xylylenediamine derivative
Normal to 1 hour to 7
Sho-amine 1001 Liquid 100.0 27 1.07
60 days 73 Xylylenediamine derivative
Normal to 1 hour to 7
Sho-amine 1010 Liquid 40.0 27
60 days 70 Xylylenediamine derivative
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1-2. Aromatic amine (Three Bond 2163) consumes all of the epoxy groups, an amine adduct
Aromatic amine has weaker basicity than having active hydrogen of the residual amino
aliphatic amine and slowly cures at room groups is formed. As the adduct has a high
temperature due to steric hindrance by the aromatic molecular weight, it is less volatile, releases less
ring. The curing virtually stops in the B-stage of a amine odor, is less toxic, and is less exothermic.
linear polymer solid due to the large difference in The loading of the adduct in resins is so much, then
the reaction of primary and secondary amines. the weighing error becomes small.
Normally, the curing of aromatic amine requires
heating in two steps. The first heating is carried out (2) (Ketimine (Ketoimine)
at a rather low temperature of approximately 80°C Ketimine, which is attracting attention as a curing
so as to lessen heat generation, and the second agent for high solid paints, is formed by the reaction
heating is carried out at a high temperature of between aliphatic polyamine such as DTA, TTA,
150°C to 170°C. DPDA, and m-XDA, and ketone such as
Aromatic amine provides excellent heat methylethyl ketone (MEK) and isobutylketone
resistance, HDT of 150°C to 160°C, and is good in (MIBK).
mechanical properties and strong. In addition, the
amine has good electrical properties and excellent
chemical resistance, particularly against alkalis, and
thus it is a curing agent that is highly resistant to
Ketimine cures very slowly when mixed with
solvents.
epoxy resin, but it works as a kind of latent curing
agent, when it is made to coat or the like, by
1-3. Modified amines
absorbing moisture in the air and regenerating
The modification of amine curing agents
amines to cure at room temperature.
improves the workability as follows:
Practically, ketimine cures at normal temperature
1. Extends the pot life
in approximately 8 hours, and is used in high solid
2. Increases or decreases the curing speed
paints. The cured resin has properties almost same
3. Improves compatibility with resins
as those of resin cured by the original polyamine,
4. Liquefies curing agents
but its application is limited to thin films due to the
5. Reduces reactivity to carbon dioxide in the air
fact that it regenerates ketones, and its curing speed
6. Reduces toxicity and irritation to the skin
is slow.
7. Decreases weighing error because loading
amount is increased
Two-part epoxy-compound resin Adhesion between glass and metal Encapsulation of a coil
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2. Polyamide resin (Three Bond 2105, 2105C, 2105F and 2107) ____ •
Polyamide resin, which has been widely used as a that it has a long pot life.
curing agent for epoxy resin, is formed by the As polyamide has high hydrocarbon moiety in its
condensation reaction between dimer acid and molecules, it cures epoxy resin into a highly
polyamine, and contains reactive primary and plasticized rigid thermosetting polymer. The cured
secondary amines in its molecules. resin features high tensile, compression, and
Polyamide amine reacts with bisphenol-A-type bending strengths, while it is stiff, strong, and
epoxy resin to cure at or below normal temperature excellent in shock resistance.
with moderate heat generation. It cures so slowly
Benzyldimethylamine 2-(dimethylaminomethyl)phenol
(BDMA) (DMP-10)
One-part epoxy-compound resin Bonding between ferrite and the yoke Impregnated locking of the motor coil
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4. Imidazoles (Three Bond 2162F, 2163C) _____________________ •
Like tertiary amines such as BDMA and DMP-30, high pot life and rapid curing at a desired
imidazoles are a type of anionic polymerizing temperature (100°C to 180°C), and have been used
curing agent for epoxy resin. Imidazoles are in compound resin compositions such as one-part
characterized by a relatively long pot life, the ability thermosetting coating adhesives, casting materials,
to form cured resin with a high heat deformation and filling materials.
temperature by thermally treating at a medium In addition, as in the case of other types of
temperature (80°C to 120°C) for a short time, and tertiary amine, imidazoles can be used as a curing
the availability of various derivatives having accelerator or co-curing agent for organic-acid
moderate reactivity that improves workability. For anhydrides, dicyandiamide, polyhydric phenol, and
example, imidazole carboxylate, epoxy-imidazole aromatic amine. In such cases, imidazoles exhibit
adduct, metal salt-imidazole complex compounds, better properties than other types of tertiary amines,
and imidazole that has been reacted with acidic including a longer pot life, faster curing speed, and
substances are used as curing agents. All are higher heat resistance of the cured substance.
intended to improve workability by achieving a
Epoxy-imidazole adduct
Like liquid polymercaptan, polysulfide resin has mercaptan groups at its terminals, but the resin does not have
low-temperature and fast-curing properties and is used as a curing agent doubling as a flexibilizer. Normally, the
resin works as a room-temperature curing agent when used in combination with a tertiary amine or polyamine
curing agent. The loading is 50 to 100 wt% and as the loading of polysulfide increases, the cured resin increases in
flexibility, shock resistance, and permittivity, while it decreases in curing shrinkage. Due to its good water
resistance, polysulfide resin has been used in adhesives, sealing agents, and casting materials.
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Table 2. List of acid anhydrides
Acid
anhydride Melting Specific
Product Molecular Viscosity Boiling point
Type of curing agent Appearance equivalent point gravity
name weight cps. 25°C °C /mmHg
(neutralization °C 25°C
equivalent)
Phthalic anhydride Solid 148.1 148 - 130.8 1.527 295/760
Methylbutenyl YH-306 Liquid 234 117 ca. 130 -15> 1.09±0.01 150/1
tetrahydrophthalic
anhydride
Hexahydrophthalic Rikacid HH Solid 154 154 23.0 (40°C) 34.0< 1.18 (40°C) 110/5
anhydride
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6. Anhydrides (Three Bond 2162G, 2280C) ______________________ •
Anhydrides used as epoxy-resin curing agents principal curing agents are methyltetrahydro
have been used as curing agents for electrical phthalic anhydride, tetrahydro phthalic anhydride,
insulating materials. Anhydrides require severer methyl nadic anhydride, hexahydro phthalic
curing conditions than amine-based curing agents, anhydride, and methylhexahydro phthalic
but are suitable for making large moldings, as they anhydride.
have a long pot life and form cured resins having
relatively well-balanced electrical, chemical, and (3) Aliphatic anhydrides
mechanical properties while generating a small Polycarboxylic anhydrides, which are formed by
quantity of heat. the dehydration condensation reaction between
aliphatic dibasic-acid molecules, exhibit excellent
(1) Aromatic anhydrides flexibility and thermal shock resistance, and have
Aromatic anhydrides are generally solid. They been used alone or in combination with other
have been used in powder paints for powder anhydrides in powder paints and casting resin
molding, and their varnishes and solutions in liquid curing agents.
anhydrides have been used in insulating coating for When anhydrides are used as curing agents,
condensers and casting. curing accelerators are normally used. Many types
of accelerators, such as tertiary amine, boric-acid
(2) Alicyclic anhydrides ester, Lewis acid, organic metal compounds,
Alicyclic anhydrides are the most common curing organic metal salts, and imidazole, have been
agents for epoxy resin. Most of the generally used studied.
anhydrides fall into this category. Of these, the
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life of 24 hours when it is dissolved in epoxy resin 7-3. Organic-acid hydrazide
using a solvent or the like, but it is normally used in Organic-acid hydrazide, a powder that has a high
the form of fine powder dispersed in the resin, melting point and is synthesized from carboxylate
which has a very long pot life of 6 to 12 months. ester and hydrazine, is dispersed in epoxy resin to
DICY cures at high temperatures of 160°C to 180°C work as a latent curing agent.
in 20 to 60 minutes, and generates a large quantity
of heat during curing. Thus, it has used only in thin
films such as paints, adhesives, and laminates. The Normally, organic-acid hydrazide has a pot life of
cured resins have good adhesiveness and are less 4 to 6 months, and cures at ca. 150°C in 1 to 2
prone to staining. DICY has frequently been used in hours. Organic-acid hydrazide cures at lower
one-part adhesives, powder paints, and pre-pregs. temperatures and has better water resistance and
Although DICY has good latency, its curing adhesiveness than DICY, and has been used in
temperature is so high and its curing time so long powder paints and one-part adhesives.
that it requires an accelerator. Commonly used basic
compounds include tertiary amine, imidazole, and
aromatic amine.
Triphenylsulfonium hexafluorophosphate
9
Conclusion________________________________________________ •
In this issue, we have reviewed various curing that epoxy resins are widely used in many fields.
agents for epoxy resin. The most suitable curing
agent must be selected according to the use
conditions, application, workability, and other Osamu Hara
factors. Only the curing agents for epoxy resin are Custom Group,
discussed in this issue; in practical use, however, Technical Department
they are mixed with diluents, coupling agents, Research Laboratory
fillers, and other agents to improve the curing Three Bond Co., Ltd.
properties and workability. As closing, I would hope
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