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Datasheet 2243 Ti PDF
Datasheet 2243 Ti PDF
AWR2243
SWRS223 – FEBRUARY 2020
1.1
1
Features
• FMCW transceiver • ASIL B targeted
– Integrated PLL, transmitter, receiver, baseband, • AECQ100 qualified
and A2D • AWR2243 advanced features
– 76- to 81-GHz coverage with 5 GHz available – Embedded self-monitoring with limited Host
bandwidth processor involvement
– Four receive channels – Complex baseband architecture
– Three transmit channels – Option of cascading multiple devices to increase
– Ultra-accurate chirp engine based on Fractional- channel count
N PLL – Embedded interference detection capability
– TX power: 13 dBm • Power management
– RX noise figure: 12 dB – Built-in LDO Network for enhanced PSRR
ADVANCE INFORMATION
– Phase noise at 1 MHz: – I/Os support dual voltage 3.3 V/1.8 V
– –96 dBc/Hz (76 to 77 GHz) • Clock source
– –94 dBc/Hz (77 to 81 GHz) – Supports externally driven clock (square/sine) at
• Built-in calibration and self-test 40 MHz
– Built-in firmware (ROM) – Supports 40 MHz crystal connection with load
– Self-calibrating system across frequency and capacitors
temperature • Easy hardware design
• Host interface – 0.65-mm pitch, 161-pin 10.4 mm × 10.4 mm flip
– Control interface with external processor over chip BGA package for easy assembly and low-
SPI or I2C interface cost PCB design
– Data interface with external processor over MIPI – Small solution size
D-PHY and CSI2 v1.1 • Supports automotive temperature operating range
– Interrupts for Fault Reporting
1.2 Applications
• Automated Highway Driving • Adaptive Cruise Control
• Automatic Emergency Braking • Imaging Radar using Cascading Configuration
Antenna RX1
Structure RX2 SPI/I2C
RX3 External
RX4 MCU Automotive
AWR2243
(For Example Interface PHY
CSI2 (4 Lane Data + 1 Clock lane)
TDA3x)
TX1
Reset
TX2
TX3 Error
MCU Clock
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. ADVANCE INFORMATION for pre-production products; subject to
change without notice.
AWR2243
SWRS223 – FEBRUARY 2020 www.ti.com
1.3 Description
The AWR2243 device is an integrated single-chip FMCW transceiver capable of operation in the 76- to
81-GHz band. The device enables unprecedented levels of integration in an extremely small form factor.
AWR2243 is an ideal solution for low power, self-monitored, ultra-accurate radar systems in the
automotive space.
The AWR2243 device is a self-contained FMCW transceiver single-chip solution that simplifies the
implementation of Automotive Radar sensors in the band of 76 to 81 GHz. It is built on TI’s low-power 45-
nm RFCMOS process, which enables a monolithic implementation of a 3TX, 4RX system with built-in PLL
and A2D converters. Simple programming model changes can enable a wide variety of sensor
implementation (Short, Mid, Long) with the possibility of dynamic reconfiguration for implementing a
multimode sensor. Additionally, the device is provided as a complete platform solution including reference
hardware design, software drivers, sample configurations, API guide, and user documentation.
LNA IF ADC
LNA IF ADC
Digital Front-end
(Decimation filter
chain)
LNA IF ADC
LNA IF ADC
ADC output
ADC Buffer CSI2
interface
PA û- Phase
Shifter
ADVANCE INFORMATION
Control (1)
Synth
Ramp Generator
PA û- x4 (20 GHz)
Table of Contents
1 Device Overview ......................................... 1 6.1 Overview ............................................ 36
1.1 Features .............................................. 1 6.2 Functional Block Diagram ........................... 36
1.2 Applications ........................................... 1 6.3 Subsystems ......................................... 37
1.3 Description ............................................ 2 6.4 Other Subsystems................................... 41
1.4 Functional Block Diagram ............................ 3 7 Applications, Implementation, and Layout........ 43
2 Revision History ......................................... 5 7.1 Application Information .............................. 43
3 Device Comparison ..................................... 6 7.2 Short-, Medium-, and Long-Range Radar .......... 43
3.1 Related Products ..................................... 7 7.3 Imaging Radar using Cascade Configuration ....... 44
4 Terminal Configuration and Functions .............. 8 7.4 Reference Schematic ............................... 44
4.1 .......................................... 8
Pin Diagram 7.5 Layout ............................................... 46
4.2 Signal Descriptions .................................. 12 8 Device and Documentation Support ............... 51
5 Specifications ........................................... 16 8.1 Device Nomenclature ............................... 51
5.1 Absolute Maximum Ratings ......................... 16 8.2 Tools and Software ................................. 52
5.2 ESD Ratings ........................................ 16 8.3 Documentation Support ............................. 52
5.3 Power-On Hours (POH) ............................. 17 8.4 Support Resources .................................. 53
5.4 Recommended Operating Conditions ............... 17 8.5 Trademarks.......................................... 53
ADVANCE INFORMATION
5.5 Power Supply Specifications ........................ 18 8.6 Electrostatic Discharge Caution ..................... 53
5.6 Power Consumption Summary...................... 18 8.7 Export Control Notice ............................... 53
5.7 RF Specification ..................................... 20 8.8 Glossary ............................................. 53
5.8 Thermal Resistance Characteristics for FCBGA 9 Mechanical, Packaging, and Orderable
Package [ABL0161] ................................. 21 Information .............................................. 54
5.9 Timing and Switching Characteristics ............... 22 9.1 Packaging Information .............................. 54
6 Detailed Description ................................... 36
2 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
DATE REVISION NOTES
February 2020 * Initial Release
ADVANCE INFORMATION
3 Device Comparison
ADVANCE INFORMATION
E VSSA VSSA VSSA VSS VSS VSS VSS VSS VSSA CLKP VSSA
VIN
J VSSA VSSA VSSA VSS VSS VSS VSS TDO CSI2_CLKM CSI2_CLKP
_13RF1
CSI2 CSI2
K RX2 VSSA VIN_18BB VSS VSS VSS VSS VSS VIOIN_18
_TXM[2] _TXP[2]
CSI2 CSI2
L VSSA VSSA VSSA VSS VSS VSS VSS TMS
_TXM[3] _TXP[3]
HS_M HS_P
M RX1 VSSA TCK
_Debug1 _Debug1
P Analog Test 1 Analog Test 2 Analog Test 3 I2C_SCL MISO_1 SPI_HOST_INTR_1NERROR_IN QSPI_CS QSPI[1] QSPI[3] Sync_out NRESET PMIC_CLK_OUT VNWA VDDIN
R VSSA Analog Test 4 I2C_SDA Reserved Reserved VDDIN SPI_CS_1 MOSI_1 SPI_CLK_1 QSPI_CLK QSPI[0] QSPI[2] VIOIN VIN_SRAM VSS
Not to scale
1 2 3 4 5 6 7 8
FM_CW
B VOUT_PA VSSA TX1 VSSA TX2 VSSA TX3
_SYNCIN1
VIN
C VSSA VSSA VSSA VSSA VSSA VSSA VSSA
_13RF2
FM_CW VIN
D
_SYNCOUT _13RF2
ADVANCE INFORMATION
VIN
G VSSA VSSA VSSA VSS VSS VSS
_13RF1
Not to scale
1 2
3 4
9 10 11 12 13 14 15
VIOIN FM_CW
D
_18DIFF _SYNCIN2
CSI2 CSI2
G VSS Reserved
_TXM[0] _TXP[0]
Not to scale
1 2
3 4
1 2 3 4 5 6 7 8
VIN
H RX3 VSSA VSS
_13RF1
VIN
J VSSA VSSA VSSA VSS VSS VSS
_13RF1
M RX1 VSSA
P Analog Test 1 Analog Test 2 Analog Test 3 I2C_SCL MISO_1 SPI_HOST_INTR_1NERROR_IN QSPI_CS
Not to scale
1 2
3 4
9 10 11 12 13 14 15
CSI2 CSI2
H VSS VSS TDI
_TXM[1] _TXP[1]
CSI2 CSI2
K VSS VSS VSS VIOIN_18
_TXM[2] _TXP[2]
CSI2 CSI2
L VSS TMS
_TXM[3] _TXP[3]
HS_M HS_P
M TCK
_Debug1 _Debug1
ADVANCE INFORMATION
P QSPI[1] QSPI[3] Sync_out NRESET PMIC_CLK_OUT VNWA VDDIN
Not to scale
1 2
3 4
NOTE
All IO pins of the device (except NERROR IN, NERROR_OUT, and WARM_RESET) are
non-failsafe; hence, care needs to be taken that they are not driven externally without the
VIO supply being present to the device.
(1) Status of PULL structures associated with the IO after device POWER UP.
(2) Cascading feature is available only in the AWR2243 device.
12 Terminal Configuration and Functions Copyright © 2020, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: AWR2243
AWR2243
www.ti.com SWRS223 – FEBRUARY 2020
ADVANCE INFORMATION
criticality fault has happened. Recovery would be
through reset.
Safety
Fail-safe input to the device. Error output from any
other device can be concentrated in the error
NERROR_IN P7 I Open Drain
signaling monitor module inside the device and
appropriate action can be taken by firmware
TMS L13 I Pull Up
TCK M13 I Pull Down JTAG port for TI internal development.
JTAG For debug purposes, it is recommended to have test
TDI H13 I Pull Up points on these pins.
TDO J13 O —
CLKP E14 I — In XTAL mode: Differential port for reference crystal
Reference
In External clock mode: Single ended input reference
oscillator CLKM F14 O — clock port (Output CLKM is grounded in this case)
Band-gap
VBGAP B10 O —
voltage
(3) For the AWR2243, WARM_RESET can be used as an output only pin for status indication.
Copyright © 2020, Texas Instruments Incorporated Terminal Configuration and Functions 13
Submit Documentation Feedback
Product Folder Links: AWR2243
AWR2243
SWRS223 – FEBRUARY 2020 www.ti.com
ADVANCE INFORMATION
Analog Test4 R2 IO — Internal test signal
production
hardware for ANAMUX C13 IO — Internal test signal
field debug VSENSE C14 IO — Internal test signal
5 Specifications
ADVANCE INFORMATION
I/O supply (3.3 V or 1.8 V): 3.135 3.3 3.465
VIOIN V
All CMOS I/Os would operate on this supply. 1.71 1.8 1.89
VIOIN_18 1.8 V supply for CMOS IO 1.71 1.8 1.9 V
VIN_18CLK 1.8 V supply for clock module 1.71 1.8 1.9 V
VIOIN_18DIFF 1.8 V supply for CSI2 port 1.71 1.8 1.9 V
VIN_13RF1 1.3 V Analog and RF supply. VIN_13RF1 and VIN_13RF2
1.23 1.3 1.36 V
VIN_13RF2 could be shorted on the board
VIN_13RF1
(1-V Internal LDO
bypass mode)
0.95 1 1.05 V
VIN_13RF2
(1-V Internal LDO
bypass mode)
VIN18BB 1.8-V Analog baseband power supply 1.71 1.8 1.9 V
VIN_18VCO 1.8V RF VCO supply 1.71 1.8 1.9 V
Voltage Input High (1.8 V mode) 1.17
VIH V
Voltage Input High (3.3 V mode) 2.25
Voltage Input Low (1.8 V mode) 0.3*VIOIN
VIL V
Voltage Input Low (3.3 V mode) 0.62
VOH High-level output threshold (IOH = 6 mA) VIOIN – 450 mV
VOL Low-level output threshold (IOL = 6 mA) 450 mV
VIL (1.8V Mode) 0.45
NRESET VIH (1.8V Mode) 0.96
V
SOP[2:0] VIL (3.3V Mode) 0.65
VIH (3.3V Mode) 1.57
The 1.3V (1.0V) and 1.8V power supply ripple specifications mentioned in Table 5-2 are defined to meet a
target spur level of –105dBc (RF Pin = –15dBm) at the RX. The spur and ripple levels have a dB to dB
relationship, for example, a 1dB increase in supply ripple leads to a ~1dB increase in spur level. Values
ADVANCE INFORMATION
quoted are rms levels for a sinusoidal input applied at the specified frequency.
ADVANCE INFORMATION
5.7 RF Specification
over recommended operating conditions and with run time calibrations enabled (unless otherwise noted)
PARAMETER MIN TYP MAX UNIT
Noise figure 12 dB
1-dB compression point (Out Of Band) (1) –8 dBm
Maximum gain 52 dB
Gain range 20 dB
Gain step size 2 dB
Image Rejection Ratio (IMRR) 30 dB
IF bandwidth (2) 20 MHz
A2D sampling rate (real) 45 Msps
A2D sampling rate (complex) 22.5 Msps
Receiver
A2D resolution 12 Bits
Return loss (S11) <–10 dB
Gain mismatch variation (over temperature) ±0.5 dB
Phase mismatch variation (over temperature) ±3 °
RX gain = 30dB
ADVANCE INFORMATION
Figure 5-1 shows variations of noise figure and in-band P1dB parameters with respect to receiver gain
programmed.
15 -28
NF (dB)
14.4 P1dB (dBm) -30
13.8 -32
13.2 -34
P1dB (dBm)
12.6 -36
NF (dB)
12 -38
11.4 -40
10.8 -42
10.2 -44
9.6 -46
9 -48
30 32 34 36 38 40 42 44 46 48 50
Rx Gain (dB) D001
ADVANCE INFORMATION
5.8 Thermal Resistance Characteristics for FCBGA Package [ABL0161] (1)
THERMAL METRICS (2) °C/W (3) (4)
RΘJC Junction-to-case 5
RΘJB Junction-to-board 5.9
RΘJA Junction-to-free air 21.6
RΘJMA Junction-to-moving air 15.3 (1)
PsiJT Junction-to-package top 0.69
PsiJB Junction-to-board 5.8
(1) Air flow = 1 m/s
(2) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.
(3) °C/W = degrees Celsius per watt.
(4) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a
JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these
EIA/JEDEC standards:
• JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
A junction temperature of 125ºC is assumed.
VDDIN,
VIN_SRAM
VNWA
VIOIN_18
VIN18_CLK
VIOIN_18DIFF
VIN18_BB
ADVANCE INFORMATION
VIN_13RF1
VIN_13RF2
VIOIN
SOP[2.1.0]
VBGAP
OUTPUT
CLKP, CLKM
Using Crystal
MCUCLK
OUTPUT (1)
(1) MCU_CLK_OUT in autonomous mode, where AWR2243 application is booted from the serial flash, MCU_CLK_OUT is not enabled
by default by the device bootloader.
Tactive_frame
SYNC_IN
(Hardware
Trigger)
Radar
Frames
Tpulse
Tlag
Frame-1 Frame-2
ADVANCE INFORMATION
Tpulse 25 < Tactive_frame
Cf1
CLKP
Cp 40 MHz
CLKM
Cf2
NOTE
The load capacitors, Cf1 and Cf2 in Figure 5-4, should be chosen such that Equation 1 is
satisfied. CL in the equation is the load specified by the crystal manufacturer. All discrete
ADVANCE INFORMATION
components used to implement the oscillator circuit should be placed as close as possible to
the associated oscillator CLKP and CLKM pins.Note that Cf1 and Cf2 include the parasitic
capacitances due to PCB routing.
C f2
C L = C f1 ´ +CP
C f1 + C f 2 (1)
In the case where an external clock is used as the clock resource, the signal is fed to the CLKP pin only;
CLKM is grounded. The phase noise requirement is very important when a 40-MHz clock is fed externally.
Table 5-7 lists the electrical characteristics of the external clock signal.
ADVANCE INFORMATION
Table 5-9. SPI Slave Mode Switching Parameters (SPICLK = input, SPISIMO = input,
and SPISOMI = output)
NO. PARAMETER MIN TYP MAX UNIT
1 tc(SPC)S Cycle time, SPICLK 25 ns
2 tw(SPCH)S Pulse duration, SPICLK high 10 ns
3 tw(SPCL)S Pulse duration, SPICLK low 10 ns
4 td(SPCL-SOMI)S Delay time, SPISOMI valid after SPICLK low 10 ns
5 th(SPCL-SOMI)S Hold time, SPISOMI data valid after SPICLK low 2 ns
Table 5-10. SPI Slave Mode Timing Requirements (SPICLK = input, SPISIMO = input,
and SPISOMI = output)
NO. MIN TYP MAX UNIT
6 tsu(SIMO-SPCH)S Setup time, SPISIMO before SPICLK high 3 ns
7 th(SPCH-SIMO)S Hold time, SPISIMO data valid after SPICLK high 1 ns
ADVANCE INFORMATION
Figure 5-5. SPI Slave Mode External Timing
CS
CLK
0x1234 0x4321 CRC 0x5678 0x8765
MOSI
0xDCBA 0xABCD CRC
16 bytes
MISO
IRQ
ADVANCE INFORMATION
• Two DMA events (transmit and receive)
• DMA event enable/disable capability
• Module enable/disable capability
• The SDA and SCL are optionally configurable as general purpose I/O
• Slew rate control of the outputs
• Open drain control of the outputs
• Programmable pullup/pulldown capability on the inputs
• Supports Ignore NACK mode
NOTE
This I2C module does not support:
• High-speed (HS) mode
• C-bus compatibility mode
• The combined format in 10-bit address mode (the I2C sends the slave address second
byte every time it sends the slave address first byte)
(1) The I2C pins SDA and SCL do not feature fail-safe I/O buffers. These pins could potentially draw current when the device is powered
down.
(2) The maximum th(SDA-SCLL) for I2C bus devices has only to be met if the device does not stretch the low period (tw(SCLL)) of the SCL
signal.
(3) Cb = total capacitance of one bus line in pF. If mixed with fast-mode devices, faster fall-times are allowed.
SDA
SCL
NOTE
• A device must internally provide a hold time of at least 300 ns for the SDA signal
(referred to the VIHmin of the SCL signal) to bridge the undefined region of the falling
edge of SCL.
• The maximum th(SDA-SCLL) has only to be met if the device does not stretch the LOW
period (tw(SCLL)) of the SCL signal. E.A Fast-mode I2C-bus device can be used in a
Standard-mode I2C-bus system, but the requirement tsu(SDA-SCLH) ≥ 250 ns must then be
met. This will automatically be the case if the device does not stretch the LOW period of
the SCL signal. If such a device does stretch the LOW period of the SCL signal, it must
output the next data bit to the SDA line tr max + tsu(SDA-SCLH).
ADVANCE INFORMATION
LVDS_TXP/M
LVDS_FRCLKP/M
Data bitwidth
LVDS_CLKP/M
Trise
LVDS_CLK
1100 ps
Table 5-13. Switching Characteristics for Output Timing versus Load Capacitance (CL) (1) (2)
PARAMETER TEST CONDITIONS VIOIN = 1.8V VIOIN = 3.3V UNIT
CL = 20 pF 2.8 3.0
tr Max rise time CL = 50 pF 6.4 6.9 ns
CL = 75 pF 9.4 10.2
Slew control = 0
CL = 20 pF 2.8 2.8
tf Max fall time CL = 50 pF 6.4 6.6 ns
CL = 75 pF 9.4 9.8
CL = 20 pF 3.3 3.3
tr Max rise time CL = 50 pF 6.7 7.2 ns
CL = 75 pF 9.6 10.5
Slew control = 1
CL = 20 pF 3.1 3.1
tf Max fall time CL = 50 pF 6.6 6.6 ns
CL = 75 pF 9.6 9.6
ADVANCE INFORMATION
(1) Slew control, which is configured by PADxx_CFG_REG, changes behavior of the output driver (faster or slower output slew rate).
(2) The rise/fall time is measured as the time taken by the signal to transition from 10% and 90% of VIOIN voltage.
12*UI
DATA-CLOCK Timing Specification
UINOM Nominal Unit Interval 1.67 13.33 ns
UIINST,MIN Minimum instantaneous Unit Interval 1.131 ns
UIINST,
TSKEW[TX] Data to clock skew measured at transmitter –0.15 0.15
MIN
CSI2 TIMING SPECIFICATION
Time that the HS clock shall be driven by the transmitter before
TCLK-PRE any associated data lane beginning the transition from LP to HS 8 ns
mode.
Time that the transmitter drives the clock lane LP-00 line state
TCLK-PREPARE immediately before the HS-0 line state starting the HS 38 95 ns
transmission.
TCLK-PREPARE + time that the transmitter drives the HS-0 state
TCLK-PREPARE + TCLK-ZERO 300 ns
before starting the clock.
Transmitted time interval from the start of THS-TRAIL or TCLKTRAIL, 105 ns
TEOT ns
to the start of the LP-11 state following a HS burst. + 12*UI
Time that the transmitter drives the data lane LP-00 line state
85 +
THS-PREPARE immediately before the HS-0 line state starting the HS 40 + 4*UI ns
6*UI
transmission
THS-PREPARE + time that the transmitter drives the HS-0 state 145 ns +
THS-PREPARE + THS-ZERO ns
prior to transmitting the Sync sequence. 10*UI
THS-EXIT Time that the transmitter drives LP-11 following a HS burst. 100 ns
max(8*UI,
Time that the transmitter drives the flipped differential state after
THS-TRAIL 60 ns + ns
last payload data bit of a HS transmission burst
4*UI)
TLPX TXXXransmitted length of any low-power state period 50 ns
CSI2_CLK(P/M)
0.5UI + Tskew
CSI2_TX(P/M)
1 UI
Clock
Lane
Data Lane
Dp/Dn
VOL TREOT
Capture
TD-TERM-EN st THS-SKIP LP-11
1 Data Bit
LP-11 LP-01 LP-00 TEOT
THS-SETTLE
THS-TRAIL THS-EXIT
ADVANCE INFORMATION
Disconnect
Clock Lane Terminator
Dp/Dn
TCLK-SETTLE
VIH(min)
VIL(max)
VIH(min)
VIL(max)
THS-SKIP
THS-SETTLE
(1) The HS to LP transition of the CLK does not actually take place since the CLK is always ON in HS mode.
Figure 5-12. Switching the Clock Lane Between Clock Transmission and Low-Power Mode
6 Detailed Description
6.1 Overview
The AWR2243 device is a single-chip highly integrated 77-GHz transceiver and front end that includes
three transmit and four receive chains. The device can be used in long-range automotive radar
applications such as automatic emergency braking and automatic adaptive cruise control. The AWR2243
has extremely small form factor and provides ultra-high resolution with very low power consumption. This
device, when used with the TDA3X or TDA2X, offers higher levels of performance and flexibility through a
programmable digital signal processor (DSP); thus addressing the standard short-, mid-, and long-range
automotive radar applications.
LNA IF ADC
LNA IF ADC
ADVANCE INFORMATION
Digital Front-end
(Decimation filter
chain)
LNA IF ADC
LNA IF ADC
ADC output
ADC Buffer CSI2
interface
PA û- Phase
Shifter
Control (1)
Synth
Ramp Generator
PA û- x4 (20 GHz)
6.3 Subsystems
ADVANCE INFORMATION
Lock Detect
RX LO
x4
ADVANCE INFORMATION
MULT
TX LO
Timing SYNC_OUT
Engine
SYNC_IN
RFSYNTH
Lock Detect
Clean-Up
PLL
SoC Clock
XO /
CLK Detect
Slicer
FM_CW_SYNCIN1*
FM_CW_SYNCIN2*
OSC_CLKOUT
FM_CW_SYNCOUT
FM_CW_CLKOUT
40 MHz
* These pins are 20GHz LO input pins. Connect LO to one pin while grounding the
other pin.
PCB 6 bits
Chip
13dBm
û- LO
@ 50 Ÿ
ADVANCE INFORMATION
0/180°
(from Timing Engine)
Self Test
Saturation
Detect
Self Test
DAC
Loopback
Path
Package
Chip DSM
Image Rejection
PCB
I/Q Correction
Decimation
ADC Buffer
I RSSI
50 W
LO
GSG
Q
DSM
DAC
ADVANCE INFORMATION
external MCU. This is shown in Figure 6-5.
• Supports four data lanes
• CSI-2 data rate scalable from 150 Mbps to 600 Mbps per lane
• Virtual channel based
• CRC generation
Normal Mode
Frame Period
Acquisition Period
Frame
Ramp/Chirp 1 2 3 N
Data Ready
F L H L L H L L H L L H L F
S S S E S S E S S E S S E E
Short
Packet
Short Long Short
ST SP ET LPS Packet Packet Packet
Chirp 1 data
.5μs-.8μs Data rate/Lane should be such that "Chirp + Interchirp" period
should be able to accommodate the data transfer
Copyright © 2017, Texas Instruments Incorporated
Frame Start – CSi2 VSYNC Start Short Packet
Line Start – CSI2 HSYNC Start Short Packet
Line End – CSI2 HSYNC End Short Packet
Frame End – CSi2 VSYNC End Short Packet
The data payload is constructed with the following three types of information:
• Chirp profile information
• The actual chirp number
• A2D data corresponding to chirps of all four channels
– Interleaved fashion
• Chirp quality data (configurable)
The payload is then split across the four physical data lanes and transmitted to the receiving D-PHY. The
data packet packing format is shown in Figure 6-6
First
11 5 1 0 11 0
CH Chirp Channel
NU Profile Number Chirp Num
11 5 1 0 11 0
CH Chirp Channel
NU Profile Number Chirp Num
11 5 1 0 11 0
CH Chirp Channel
ADVANCE INFORMATION
Last
Figure 6-6. Data Packet Packing Format for 12-Bit Complex Configuration
NOTE
Information in the following Applications section is not part of the TI component specification,
and TI does not warrant its accuracy or completeness. TI's customers are responsible for
determining suitability of components for their purposes. Customers should validate and test
their design implementation to confirm system functionality.
ADVANCE INFORMATION
Antenna RX1
Structure RX2 SPI/I2C
RX3 External
RX4 MCU Automotive
AWR2243
(For Example Interface PHY
CSI2 (4 Lane Data + 1 Clock lane)
TDA3x)
TX1
Reset
TX2
TX3 Error
MCU Clock
CSI-2 (4 lanes)
RX1
RX2 Control (SPI, GPIOs)
RX3 Reset
RX4 FMCW_SYNCOUT
AWR2243
Master
TX1
FMCW_SYNCIN
TX2
SYNC_OUT
TX3
SYNC_IN
CLKP CLKM
OSC_CLK_OUT
External
Host
40MHz
CLKM CLKP
RX1
SYNC_IN
RX2
RX3
ADVANCE INFORMATION
RX4 FMCW_SYNCIN
AWR2243 Reset
Slave
TX1
TX2 Control (SPI, GPIOs, RESET)
TX3
CSI-2 (4 lanes)
8 7 6 5 4 3 2 1
REV REVISIONS
<SYM> <DESC>
2
C12
HOST_DRIVEN_NET1
12XX_1V8_DIG
12XX_1V8_DIG
0.1UF 0.1UF SOR LINES
2
HOST_DRIVEN_NET2
12XX_DIG_1V2
12XX_1P3V_RF1
12XX_1V8_ANA
C13
12XX_1V4_SYNTH
3V3
12XX_DIG_1V2
12XX_DIG_1V2
1
12XX_1V8_ANA
HOST_DRIVEN_NET3
12XX_1P3V_RF2
12XX_VBGAP
12XX_1V4_APLL
12XX_VOUT_PA
12XX_1V8_ANA
12XX_1V8_ANA
ALL THE ABOVE NETS
1
ARE DRIVEN BY THE
D HOST_DRIVEN_NET3 HOST PROCESSOR D
12XX_TDO_SOP0 VIA 10K SERIES RESISTORS
G13
D13
R13
R14
R234
K13
P15
P14
B12
A13
A10
B10
N11
F13
B11
G5
R6
H5
D2
C2
K5
B2
A2
F5
J5
2 1
0 HOST_DRIVEN_NET2
RES
VIOIN_18
VIOIN_18DIFF
VIOIN
VDDIN4
VDDIN3
VDDIN2
VDDIN1
VIN_SRAM
VIN_13RF1
VIN_13RF1
VIN_13RF1
VIN_13RF2
VIN_13RF2
VIN_18CLK
VIN_18BB
VIN_18BB
VIN_18VCO
VOUT_14SYNTH
VOUT_14APLL
VBGAP
VNWA
VOUT_PA2
VOUT_PA1
12XX_PMICOUT_SOP2
R233
12XX_RX1 M2 RX1 CSI2_TXP_0 G15 12XX_CSI2_TXP0 2 1
THE 4 RX AND 3 TX WILL 12XX_RX2 K2 RX2 CSI2_TXM_0 G14 12XX_CSI2_TXM0 0
BE CONNECTED TO THE PCB HOST_DRIVEN_NET1
12XX_RX3 H2 RX3 CSI2_TXP_1 H15 12XX_CSI2_TXP1 12XX_DIG_SYNCOUT_SOP1 R232
ANTENNA 2 1
12XX_RX4 F2 RX4 CSI2_TXM_1 H14 12XX_CSI2_TXM1 0
12XX_TX1 B4 TX1 CSI2_CLKP J15 12XX_CSI2_CLKP
12XX_TX2 B6 TX2 U1 CSI2_CLKM J14 12XX_CSI2_CLKM
12XX_TX3 B8 TX3 CSI2_TXP_2 K15 12XX_CSI2_TXP2
CSI2_TXM_2 K14 12XX_CSI2_TXM2
B1 FM_CW_SYNCIN1 CSI2_TXP_3 L15 12XX_CSI2_TXP3
12XX_FM_CW_CLKOUT
D15
B15
FM_CW_SYNCIN2
FM_CW_CLKOUT
CSI2_TXM_3
HS_DEBUG1_P
L14
M15
12XX_CSI2_TXM3
12XX_DBG1_P
CRYSTAL
ADVANCE INFORMATION
12XX_FM_CW_SYNCOUT D1 FM_CW_SYNCOUT HS_DEBUG1_M M14 12XX_DBG1_M
HS_DEBUG2_P N15 12XX_DBG2_P
10K 12XX_DIG_SYNCIN N10 SYNC_IN HS_DEBUG2_M N14 12XX_DBG2_M 12XX_XTALP
12XX_DIG_SYNCOUT_SOP0 1% 12XX_XTALM
1 2 12XX_DIG_SYNCOUT P11 SYNC_OUT
R1 R14 33.2
QSPI_CS P8 12XX_QSPI_CS_DEV 2 1 12XX_QSPI_CS 40MHZ
A14 OSC_CLKOUT QSPI_CLK R1012XX_QSPI_CLK_DEV 2 R15 33.2 1 12XX_QSPI_CLK CX3225SA40000D0PTWCC
33.2 Y1
12XX_XTALP E14 CLKP QSPI_0 R11 12XX_QSPI_D0_DEV 2 R7 1 12XX_QSPI_D0 4
12XX_XTALM F14 CLKM QSPI_1 P9 12XX_QSPI_D1_DEV 2 R8 33.2 1 12XX_QSPI_D1
12XX_PMICOUT_SOP2 QSPI_2 R12 12XX_QSPI_D2_DEV 2 R9 33.2 1 12XX_QSPI_D2
1% R2 33.2
1 2 12XX_PMIC_CLKOUT P13 PMIC_CLKOUT QSPI_3 P10 12XX_QSPI_D3_DEV 2 R10 1 12XX_QSPI_D3 Y1 40MHZ
N9 MCU_CLKOUT 1 3 40MHZ
12XX_MCU_CLKOUT 10K 2 33.2 R612XX_MCU_CLKOUT_DEV
1
C TCK M13 12XX_TCK CX3225SA40000D0PTWCC
C
2
Y1
C14 VSENSE TMS L13 12XX_TMS R53 2
10K
+/-0.1PF
+/-0.1PF
C216
C217
4.7PF
4.7PF
C13 ANAMUX TDO J13 12XX_TDO 1 2 12XX_TDO_SOP0
P1 ANALOGTEST1 AWR2243 TDI H13 12XX_TDI
P2 ANALOGTEST2
1
P3 ANALOGTEST3 SPI_HOST_INTR_1 P6 12XX_SPI_HOST_INTR_1
R11 33.2 1 12XX_SPI_CLK1
R2 ANALOGTEST4 SPI_CLK_1 R9 12XX_SPI_CLK1_DEV 2
SPI_CS_1 R7 12XX_SPI_CS1_DEV 2 R12 33.2 1 12XX_SPI_CS1 CX3225SA40000D0PTWCC
12XX_NRST P12 NRESET MISO_1 P5 12XX_SPI_MISO_1
R13 33.2 1 12XX_SPI_MOSI_1
12XX_WARM_RST N12 WARM_RESET MOSI_1 R8 12XX_SPI_MOSI_1_DEV 2
12XX_NERRORIN P7 NERROR_IN
12XX_NERROROUT N8 NERROR_OUT GPIO_0
GPIO_1
N4 12XX_GPIO_0
N7 12XX_GPIO_1
QSPI FLASH
N5 RS232_RX GPIO_2 N1312XX_GPIO_2
N6 RS232_TX
RES P4
E6 VSS RES R3 3V3
E8 VSS RES R4
E10 VSS RES R5
E11 VSS VSSA B13
G7 VSS VSSA R1
0.1UF
1UF
F9 VSS VSSA N3
2
F11 VSS VSSA N2
10UF
C214
C8
C215
G6 VSS VSSA N1
G8 VSS VSSA M3 3V3 3V3
2
G10 VSS VSSA L3
1
B H7 VSS VSSA L2
B
47.5K
1
VSSA
VSSA
VSSA
VSSA
VSSA
VSSA
VSSA
VSSA
VSSA
VSSA
VSSA
VSSA
VSSA
VSSA
VSSA
VSSA
VSSA
VSSA
VSSA
VSSA
VSSA
VSSA
VSSA
VSSA
VSSA
VSSA
VSSA
VSSA
VSSA
VSSA
VSSA
VSSA
VSSA
VSSA
VSSA
R362
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
S25FL116K0XNFV010
R4
H9
J7
J6
J8
J10
E5
K7
K8
K9
K10
L5
L6
L8
L10
R15
A1
A3
A5
A7
A9
A15
B3
B5
B7
B9
B14
C1
C3
C4
C5
C6
C7
C8
C9
C15
E1
E2
E3
E13
E15
F3
G1
G2
G3
H3
J1
J2
J3
K3
L1
1
H11
K11
U20 10K
12XX_QSPI_CS
S25FL116K0XNFV010
2
1 CS_N VCC 8
R363
12XX_QSPI_D1 1 2 33.2 2 SO/IO1 HOLD_N/IO3 7 2 R54 1 33.2 12XX_QSPI_D3
R364
12XX_QSPI_D2 1 2 33.2 3 WP_N/IO2 SCK 6 12XX_QSPI_CLK
12XX_1V8_ANA
12XX_1V8_ANA 4 VSS SI/IO0 5 2 R369 1 33.2 12XX_QSPI_D0
R3 EP
3V3
EP
12XX_1P3V_RF1 12XX_VBGAP 1 2
12XX_1P3V_RF2
12XX_VOUT_PA
10K
0.22UF
0.22UF
10UF
10UF
0.22UF
0.22UF
0.22UF
0.22UF
0.22UF
10UF
10UF
10UF
2
2
PLACE C104 NEAR B11
3V3 12XX_1V4_APLL
PLACE C17,C18 NEAR F5
2
12XX_1V4_SYNTH 12XX_DIG_1V2
C165
C166
C121
10%
10%
C104
10%
C15
C16
C19
C17
C18
12XX_1V8_DIG
0.22UF
C1
C2
1UF
12XX_1V8_DIG
0.22UF
C4
1UF
0.22UF
1
2
0.22UF
1
2
2
C125
2
C107
PLACE C14 NEAR D13
C3
C110
PLACE C124 NEAR K13
I308 I309
C14
I305
C124
I302
1
1
1
1
A CAPS FOR 12XX_RF BLOCKS CAPS FOR 12XX_1V8_ANA A
CAPS FOR IO,PLL AND DIGITAL CORE
AWR1243 REFERENCE SCHEMATIC
DRAFTSMAN: DATE CODE IDENTITY
TEXAS INSTRUMENTS
CAPS FOR 12XX_1V8_DIG ANJAN
DESIGNER:
04/29/2016
DATE
SEMICONDUCTOR OPERATIONS
NUMBER
01295
ANJAN 04/29/2016
TITLE: AWR1243 DEVICE,CRYSTAL
CHECKER: DATE
ANIL 04/29/2016 QSPI FLASH AND DECAPS FOR
ENGINEER: DATE
ANJAN 04/29/2016
AWR1243
APPROVED: DATE
SUDIPTO 04/29/2016
RELEASED: DATE SCALE SIZE REV SHEET
<BRD_NUM>
YES 04/29/2016 N D A2 2 OF 3
8 7 6 5 4 3 2 1
Copyright © 2017, Texas Instruments Incorporated
7.5 Layout
The top layer routing, top layer closeup, and bottom layer routing are shown in Figure 7-4, Figure 7-5, and
Figure 7-6, respectively.
ADVANCE INFORMATION
ADVANCE INFORMATION
ADVANCE INFORMATION
ADVANCE INFORMATION
Support tool development evolutionary flow:
TMDX Development-support product that has not yet completed Texas Instruments internal
qualification testing.
TMDS Fully-qualified development-support product.
X and P devices and TMDX development-support tools are shipped against the following disclaimer:
"Developmental product is intended for internal evaluation purposes."
Production devices and TMDS development-support tools have been characterized fully, and the quality
and reliability of the device have been demonstrated fully. TI's standard warranty applies.
Predictions show that prototype devices (X or P) have a greater failure rate than the standard production
devices. Texas Instruments recommends that these devices not be used in any production system
because their expected end-use failure rate still is undefined. Only qualified production devices are to be
used.
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the
package type (for example, ABL0161), the temperature range (for example, blank is the default
commercial temperature range). Figure 8-1 provides a legend for reading the complete device name for
any AWR2243 device.
For orderable part numbers of AWR2243 devices in the ABL0161 package types, see the Package Option
Addendum of this document, the TI website (www.ti.com), or contact your TI sales representative.
For additional description of the device nomenclature markings on the die, see the AWR2243 Device
Errata Silicon Revision 1.0.
XA 2 2 43 B G ABL Q1
Qualification
Q1 = Q100
Prefix Blank = no special Qual
XA = Pre-production
AWR = Production Tray or Tape & Reel
Generation R = Big Reel
2 = 76 ± 81 GHz Blank = Tray
Variant Package
2 = FE ABL = BGA
4 = FE + FFT + MCU
6 = FE + MCU + DSP + 1.5 MB
Security
Num RX/TX Channels G = General
RX = 1,2,3,4 S = Secure
TX = 1,2,3 D = Development Secure
Silicon PG Revision
Blank = Rev 1.0
ADVANCE INFORMATION
Features
Blank = Baseline
P = High Performance
Safety Level
A = ASIL A Targeted
B = ASIL B Targeted
8.5 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
ADVANCE INFORMATION
Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data
(as defined by the U.S., EU, and other Export Administration Regulations) including software, or any
controlled product restricted by other applicable national regulations, received from disclosing party under
nondisclosure obligations (if any), or any direct product of such technology, to any destination to which
such export or re-export is restricted or prohibited by U.S. or other applicable laws, without obtaining prior
authorization from U.S. Department of Commerce and other competent Government authorities to the
extent required by those laws.
8.8 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.
CAUTION
The following package information is subject to change without notice.
ADVANCE INFORMATION
54 Mechanical, Packaging, and Orderable Information Copyright © 2020, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: AWR2243
PACKAGE OPTION ADDENDUM
www.ti.com 19-Feb-2020
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
XA2243PBGABL ACTIVE FC/CSP ABL 161 1 Green (RoHS Call TI Level-3-260C-168 HR -40 to 125 XAWR2243P
& no Sb/Br) BG
583 ABL G1
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OUTLINE
ABL0161A SCALE 1.400
FCBGA - 1.17 mm max height
PLASTIC BALL GRID ARRAY
10.5 B
A
10.3
BALL A1 CORNER
10.5
10.3
1.17 MAX
C
SEATING PLANE
P
(0.65) TYP
N
M
L
K
J PKG
9.1 H
TYP G
F
E
D 0.45
161X
C 0.35
0.15 C A B
B 0.08 C
A
0.65 TYP 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
EXAMPLE BOARD LAYOUT
ABL0161A FCBGA - 1.17 mm max height
PLASTIC BALL GRID ARRAY
(0.65) TYP
161X ( 0.32)
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
B
(0.65) TYP
C
G
PKG
H
PKG
( 0.32)
SOLDER MASK SOLDER MASK
OPENING OPENING
SOLDER MASK
NON-SOLDER MASK
DEFINED
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
NOT TO SCALE
4222493/B 10/2016
NOTES: (continued)
3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
For information, see Texas Instruments literature number SPRAA99 (www.ti.com/lit/spraa99).
www.ti.com
EXAMPLE STENCIL DESIGN
ABL0161A FCBGA - 1.17 mm max height
PLASTIC BALL GRID ARRAY
(0.65) TYP
161X ( 0.32)
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
B
(0.65) TYP C
G
PKG
H
PKG
4222493/B 10/2016
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
www.ti.com
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