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Description
Uni-directional
The SMDJ series is designed specifically to protect
sensitive electronic equipment from voltage transients
induced by lightning and other transient voltage events.
Features
• 3000W PPPM capability • Low incremental
at 10/1000μs waveform, surge resistance
repetition rate (duty • Typical IR less than 2μA when
Bi-directional cycles):0.01% VBR min>12V
• For surface mounted • High temperature to reflow
applications in order to soldering guaranteed:
Agency Approvals optimize board space 260°C/40sec
• Low profile package • VBR @ TJ= VBR@25°C x (1+αT
Agency Agency File Number
• Typical failure mode is short x (TJ - 25))(αT:Temperature
E230531 from over-specified voltage or Coefficient, typical
current value is 0.1%)
Maximum Ratings and Thermal Characteristics • Whisker test is conducted • UL Recognized compound
based on JEDEC JESD201A meeting flammability rating
(TA=25OC unless otherwise noted)
per its table 4a and 4c V-0
Parameter Symbol Value Unit • IEC-61000-4-2 ESD 30kV(Air), • Meet MSL level1, per
30kV (Contact) J-STD-020, LF maximun peak
Peak Pulse Power Dissipation at TA=25ºC
by 10/1000µs Waveform (Fig. 2,4) PPPM 3000 W • ESD protection of data lines of 260°C
(Note 1,2,5) in accordance with • Matte tin lead–free plated
IEC 61000-4-2 • Halogen free and
Power Dissipation on Infinite Heat Sink
PD 6.5 W • EFT protection of data lines in RoHS compliant
at TL=50OC
accordance with • Pb-free E3 means 2nd level
Peak Forward Surge Current, 8.3ms IEC 61000-4-4
IFSM 300 A interconnect is Pb-free and
Single Half Sine Wave (Note 3)
• Built-in strain relief the terminal finish material is
Maximum Instantaneous Forward • Glass passivated chip junction tin(Sn) (IPC/JEDEC J-STD-
Voltage at 100A for Unidirectional VF 3.5/5.0 V 609A.01)
Only(Note 4) • Fast response time: typically
less than 1.0ps from
-65 to
Operating Temperature Range TJ °C 0V to BV min
150
• Excellent clamping capability
-65 to
Storage Temperature Range TSTG °C
175
Typical Thermal Resistance Junction to
RƟJL 15 °C/W
Lead
Applications
Typical Thermal Resistance Junction to
RƟJA 75 °C/W
Ambient
Notes:
TVS components are ideal for the protection of I/O
1. Non-repetitive current pulse , per Fig. 4 and derated above TJ (initial) =25OC per Fig. 3. Interfaces, VCC bus and other vulnerable circuits used in
2. Mounted on copper pad area of 0.31x0.31” (8.0 x 8.0mm) to each terminal. telecom, computer, Industrial and consumer electronic
3. Measured on 8.3ms single half sine wave or equivalent square wave for unidirectional applications.
component only, duty cycle=4 per minute maximum.
4. VF < 3.5V for single die parts and VF< 5.0V for stacked-die parts.
5. The PPPM of stacked-die parts is 4000W and please contact Littelfuse for stacked-die part
details.
Additional Infomarion
Functional Diagram
Cathode Anode
Uni-directional
Uni-directional Bi-directional
Ipp
IT
Vc VBR VR Vc VBR VR IR
V V
IR VF IR VR VBR Vc
IT IT
Ipp
Ipp
Figure 1 - TVS Transients Clamping Waveform Figure 2 - Peak Pulse Power Rating
Voltage Transients
100
PPPM-Peak Pulse Power (kW)
stacked-die, 4kW
at 10/1000µs, 25°C
TJ initial = Tamb
0.1
0.001 0.01 0.1 1 10
Time
td-Pulse Width (ms)
100
150
Peak Pulse Power (PPP) or Current (IPP)
tr=10µsec TJ=25°C
40
IPPM IPPM ( )2
50 10/1000µsec. Waveform
as defined by R.E.A
20
td
0
0 0 1.0 2.0 3.0 4.0
0 25 50 75 100 125 150 175
t-Time (ms)
TJ - Initial Junction Temperature (ºC)
100000
100
Transient Thermal Impedance (°C/W)
Uni-direconal V=0V
10000 Bi-direconal V=0V
10
1000
Uni-direconal V=VR
Cj(pF)
Bi-direconal V=VR 1
100
0.1
10
1 0.01
1 10 100 1000 0.001 0.01 0.1 1 10 100 1000
VBR - Reverse Breakdown Voltage(V)
TP - Pulse Duration (s)
Figure 7 - Maximum Non-Repetitive Peak Forward Figure 8 - Peak Forward Voltage Drop vs Peak Forward
Surge Current Uni-Directional Only Current (Typical Values)
500
100 Single die
450
IFSM - Peak Forward Surve Current (A)
400
350 10
Stack-die
300
250 1
200
150
0.1
100
50
0.01
0
0.00 1.00 2.00 3.00 4.00 5.00 6.00 7.00 8.00
1 10 100
VF-Peak Forward Voltage(V)
Number of Cycles at 60 Hz
Soldering Parameters
Temperature (T)
- Time (min to max) (ts) 60 – 180 secs Ts(max)
Dimensions
DO-214AB (SMC J-Bend)
Cathode Band Inches Millimeters
(for uni-directional products only) Dimensions
Min Max Min Max
A 0.114 0.126 2.900 3.200
A C B 0.260 0.280 6.600 7.110
C 0.220 0.245 5.590 6.220
D 0.079 0.103 2.060 2.620
B
E 0.030 0.060 0.760 1.520
F - 0.008 - 0.203
H
G 0.305 0.320 7.750 8.130
D
H 0.006 0.012 0.152 0.305
I 0.129 - 3.300 -
F
E G J 0.094 - 2.400 -
K - 0.165 4.200
Dimensions in J L
inches andK(millimeters) L 0.094 - 2.400 -
Solder Pads
(all dimensions in mm) © 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/15/19
TVS Diodes
Surface Mount – 3000W > SMDJ series
SMDJ XXX C A
Cathode Band
(for uni-directional products only)
F
Littelfuse Logo
5% VBR VOLTAGE TOLERANCE
BI-DIRECTIONAL
SERIES
VR VOLTAGE XXX
YMXXX
Marking Code
Packaging Options
Component Packaging
Part number Quantity Packaging Specification
Package Option
SMDJxxxXX DO-214AB 3000 Tape & Reel - 16mm tape/13” reel EIA STD RS-481
SMDJxxxXX-T7 DO-214AB 500 Tape & Reel – 16mm tape/7” reel EIA STD RS-481
0.157
(4.0)
0.63
(16.0)
Cathode
Direction of Feed
0.65
(16.4)
Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each
product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications.
Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/15/19