1

This presentation to be used in

conjunction with:

• Spec Sheets: SA-GRSP10, SA-GRSP09, SA-GRSP11

• Samples in DC-GROUND-KIT

8/16/2012
 2

Network Bonding and Grounding:

TIA-607-B – Generic Telecommunications Bonding and
Grounding (Earthing) for Customer Premises

Tom Turner
Product Manager, Power & Grounding
tom.turner@panduit.com
800-777-3300 x88290
8/16/2012
Presentation objectives 3

Topics
• Scope of TIA-607-B, Generic Telecommunications Bonding and Grounding
(Earthing) for Customer Premises
• Grounding and bonding system implementation according to TIA-607-B,
including:
– Data centers
– Telecommunications closets

Throughout the presentation

• Requirements from TIA-607-B and products that solve issues identified in the
standard
• Common problems and how to avoid those issues

Order of presentation: start at equipment and work out to earth

BICSI credits available for this presentation 4

Qualifies for one credit:

• RCDD CEC
• Installer
• Technician
• Certified Trainer

Please make sure we have your:

• Name, as you want it to appear on your certificate of course completion
• Name of the company you work for
• Your E-mail address (so we can send you the certificate)
Purpose and scope of TIA-607-B
TIA-607-B grounding is normative
and applies to entire building, not
just data center

Scope now
includes
grounding of
ITE
TIA-607-B, ―Generic
Telecommunications
Bonding and
Grounding (Earthing)
for Customer
Premises‖, is now
approved!
What is TIA-607-B? Scope of TIA-607-B

Distributors

Scope: Specifies requirements for a

generic telecommunications bonding
and grounding infrastructure, and its
interconnection to other systems, for Computer
Rooms
locations where telecommunications
equipment will be or are installed

Major revision of J-STD-607-A:

• Includes G&B of telecommunications
spaces (distributors and computer TGB
rooms) TMGB
TBB
• Continued harmonization efforts (as
practicable) on terminology and
practices with international
standards
Implementation of a telecommunications grounding and
bonding system per TIA-607-B

• Bond the equipment to the racks/cabinets

• Ensure that the racks/cabinets have electrical
continuity
• Bond the racks/cabinets back to the electrical
panel
• Bond nearby conductive items such as pathways
and building steel to the telecommunications
grounding and bonding system
Equipment in cabinets and racks

TIA-607-B:

“Rather than relying

on the ac power cord
ground wire, it is
desirable that
equipment be
grounded in a
verifiable manner as
described in this
Standard.”
Figure 7—Example of three methods to bond
equipment and racks to ground
Implementing the equipment Bonding screws have thread-
9

grounding requirement forming threads and

serrations under the head
that remove the paint off
Bond equipment mounting flanges and patch
with a jumper panels (RGTBSG-C)
when possible

Bonding cage nuts have

teeth that cut paint when
installed (CBN4K)
Some equipment isn’t designed for a supplemental
bonding system

• Can’t add a jumper

• Can’t add a bonding screw or a bonding cage nut

That’s OK. So long as the AC power system and the telecom bonding
system are bonded together, no safety issues result

Most servers cannot be

grounded directly to the
telecommunications
grounding system
Ground strip kits RGS Family

• Ground strips have same x-

sectional area as #6 AWG wire
• Strips also future-proof against a
future installer bonding to the rack
without thread-forming screws Install the
strip on the
vertical rail
and bond all
other
jumpers to it
TIA-607-B requires racks and cabinets to
be electrically continuous

• Electrical continuity must be

confirmed through the use of
bonding jumpers, bonding
hardware, or the removal of paint
• Bonding jumpers must be a Bare metal bonding tabs that
automatically create electrical
minimum of #12 AWG continuity when cabinet is assembled

All Panduit racks and

cabinets are electrically
continuous, eliminating the
need for jumpers
If the rack/cabinet is not electrically continuous, use a
busbar

• Bond busbar to rack/cabinets

with thread-forming screws to
create electrical continuity
between the equipment
mounting rails
• Bond to busbar with 2-hole lug
tongues for long-term
connection reliability

Thread-
forming 2-hole lug
screws mounting
New terminology introduced by TIA-607-B:
Telecommunications Equipment Bonding
Conductor (TEBC)

Example TEBCs routed along auxiliary cable brackets

(which help to maintain 50 mm separation)
• “The TEBC
connects the
TMGB/TGB to
TEBCs equipment
racks/cabinets”
• Minimum
TEBCs are bonded to the TGB separation from
power and
telecom cables is
50 mm (2 in)
Acceptable telecommunications equipment bonding
conductor topologies for the telco closet, per TIA-607-B

Rack
bonding
conductor
(RBC)

Telecommunications
equipment bonding
conductor (TEBC)
Use two-hole lugs to bond to busbars and racks &
cabinets. Compression is required on busbars

Two hole compression lug

One hole mechanical lug

Connector considerations – TIA-607-B

Mechanical connectors are

allowed for bonding the
TEBC/RGB to racks, but
Panduit recommends
compression to prevent
loosening
Mesh-BN: a collection of components (As per CENELEC documents, includes
TIA-942’s Data Center Grounding Infrastructure as the “Supplemental
Bonding Network” and IEEE Std 1100 calls the MCBN), per TIA-607-B

Building steel Information

technology
equipment (ITE)

Conduits Racks and

cabinets

Supplemental
Cabling
bonding grid
pathways
(SBG)
(not shown)
Rack bonding
conductor
(RBC)
Watch for this common problem

Common Bonding Network

Jumper Kit (RGCBNJ660P22)

Specify who
bonds the racks
to the SBG!

When you see a supplemental bonding grid (SBG) with nothing attached to
it, the customer intended to have grounding but got nothing!!! Making this
bond was in no one’s scope of work...
(20% of the data centers have this problem)
HTAP Crimping

• HTCT HTAPs require 12

Patented
tons of compression
locating rib
• CT-2930/L is guarantees full-
recommended width crimp 1st
time, every
• Can use other time!
manufacturers’ tools CT-2930/L
and retain UL
Listing/CSA Certification
• Must use Panduit
locator dies

CD-930H-250 Locator Die

HTCT HTAP
Conductor sizing isn’t only about electrical issues…

Standards call for a minimum #6

AWG for mechanical strength

Size matters! Source: Picture from Internet

Supplemental bonding grid construction per TIA-607-B

• #6 AWG round wire or

2‖ wide copper strips
bonded at intersections
• Minimum grid density is
3 m (10 ft) centers
• Minimum 1/0 bond to
TGB/TMGB

Example supplemental bonding grid

Example SBG construction

Make aisle grounds

convenient to racks
and cabinets

Cross aisle grounds

every 10 feet

•Use #6 AWG wire

•Use pedestal
grounding clamps at
conductor
intersections
• Bond to AC power
ground through a
local TGB
GPQC family of access floor grounding (Mesh-BN)
products

• Up to two each of #6 AWG-2/0

conductors
• Rated for fault current (not all
commonly installed access floor
connectors are)
• Models for access floor
pedestals from ¾‖ to 2‖
diameters
Hinged U-bolt design allows
for ―no look‖ installation—
saving 67% of installation
time
Preventing loose busbar connections 25

Two-hole
compression Telecommunications BICSI-607 stainless
lugs required Grounding Busbar steel TGB hardware
on TGB & (TGB), BICSI/TIA-607 stack-up
TMGB hole pattern
(Parts HDW1/4-KT, HDW3/8-KT)
(Type LCC-W) (Type GB2B, or Part GB2B0306TPI-1)
 Operability testing of power
connectors
UL 486A, CSA 22.2
4 samples must pass all tests
• Wire secureness test
• Static heating test
• Wire pull-out test
NEBS Level 3
Must be UL Listed
9 samples must pass all tests
• Vibration test
• Wire pull-out
• Temp & humidity cycle
• Hydrogen sulfide corrosion
• 30 day salt fog corrosion
• Wire pull-out
• AC fault current
• Lightning test
• Wire pull-out test
• Stress corrosion cracking
Do you already own the tools?

Panduit lugs can be crimped with select competitors’ tools and

dies and still retain UL/CSA approvals and NEBS Level 3
performance
ASTM 545-97: Electroplated Coatings of Tin 28

Panduit doesn’t rest—while others are

cheapening their lugs to compete
with foreign competition, Panduit is
improving quality by moving to Class
C plating as a standard offering*

Others

Panduit

* Running change, in process

What else needs to be bonded?

• IEEE studies have indicated that the point of diminishing

financial returns with respect to lightning strikes is 2 meters
(6 feet)
• Bond anything that could become charged that a person
could bump while working on a rack/cabinet for safety
• Therefore, bond any conductive path within six feet of your
racks/cabinets
Bond cable tray and ladder rack sections

Split bolts – use tin plated if

outdoors (Panduit SBC &
SBCT, respectively)

#6 AWG conductor,
green w/yellow jacket

– OR –
Specify systems that
automatically bond to
reduce chances of error

PANDUIT® Wyr-Grid™ and

GRIDRUNNER™ hardware
automatically bonds sections,
eliminating the need for jumper
wires
Armored fiber cables per TIA-607-B
 Armored fiber grounding cable clamp
Armored fiber optic
cable To grounding
system
• Mechanical clamp design is
entirely external to armor—no
risk of damage to fibers
• Clamp assembly has more
Cover protects current-carrying capability
clamp and than the armor it attaches to
provides neat
appearance

Mechanical
clamp
assembly
Telecommunications Bonding Backbone (TBB)
TBB and its bonds, adapted from Figure 32,
TIA-607-B

• Purpose of TBB is to reduce

potential differences between
interconnected
telecommunications systems
on different floors
• Originates at TMGB and
extends throughout building
using telecom pathways
• Connects TGBs that exist in
each distributor
TIA-607-B TBB sizing 34
Summary 35

• Specify current-rated connectors

(access floor)
• Specify compression connectors
rather than mechanical
connectors (connections to
racks)
• Panduit builds features into its
products that facilitate grounding
• Panduit has a broad line of
power and grounding
connectors that are tested to the
most rigorous reliability
assurance standards. Specifying
these standards minimizes your
risk

Thank you! Questions?