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Global Solar Technology Magazine May 2010
Global Solar Technology Magazine May 2010
com
Matt Holzmann
Interview inside
A practical guide for improving
crystalline solar cell efficiencies
through firing process optimization NEW PRODUCTS
Smart packages
for CPV cell devices
Andy Longford, consultant, and Domenic Federici, Interplex Engineered Products
Figure 1. The photovoltaic concentrator developed by the ‘Fullspectrum’ project.
However the high cost of advanced, substrate or package to allow the connec- packages are also developed to be suitable
high-efficiency solar cells must utilise tions between one another and the outside for assembly on high throughput assembly
cost-effective concentrator optics and cell world. This is course similar to the needs equipment as used by semiconductor chip
assemblies to enable concentrated sunlight of the LED devices. LEDs and high bright- assembly companies. The package is typi-
systems to achieve a comparison with other ness (HB)LEDS in particular, are mounted cally on a carrier, or lead frame, that can
solar power options. in small surface mount housings (packages) work with automated pick and place ‘die
that have integral heatsinks and are sealed attach,’ wirebond, sealing and testing ma-
CPV cells with a silicone optical gel (Figure 3). chinery. The assembly equipment ensures
Solar cell size is a key aspect in In the CPV world, most cell mod- that the chips are accurately located (within
concentration applications. The optimum ules also incorporate bypass diodes as microns) to provide exact optical alignment
size for a GaAs solar cell operating at protection from “dark current.” This is a with the seal or lens focal planes. Devices
1000 suns is about 1 mm2. (Operation at potential problem when one of the cells are then singulated and packed into tubes
1000 suns means a light power density of in the system is damaged, weak or (most or carrier tapes to enable handling, storage
1 MW/m2.) A small size cell maximises likely) in shade. Then there is the risk that and ease of use for insertion and assembly
the efficiency and if a 1 mm x 1 mm size full current from the rest of the cells could into the application requiring the LED.
is chosen, this is very close to that of a pass through the shaded device and cause The application subsystem will also provide
LED device (Figure 2). Yet because III-V overcurrent damage. additional thermal management (heat sink-
multijunction solar cells operate at lower Essentially, concentrator cells must ing), electrical connections and probably
photocurrent than single junction, a therefore comprise a small, high efficient, additional optical alignment.
triple junction (3J) with a size of 1 mm2 multijunction cell, together with a bypass A CPV solar application has identical
requires a high light intensity in order diode, suitably housed in a robust package assembly requirements and the use of pre-
to provide a good conversion. However, that will provide thermal management, packaged cell units is now becoming the
operating at 1000 suns means that the light protection of the device from ambient optimum solution to ensure high quality
power received by the solar cell is 1watt. dust, dirt and moisture, and an optical and long term reliability of CPV modules.
Assuming an efficiency of 35%, then interface (support and alignment) with
350 mW of this energy is converted into the light gathering structures (lenses). This CPV cell packages
electricity, while 650 mW is transformed package must also ensure long term reli- Thermoplastic injection molding
into heat. Although a heat intensity of 650 ability and be low cost...definitely a “smart technologies used to provide cavity chip
mW/mm2 does not require active cooling, package.” package solutions is one the key emerging
and heat extraction of several hundred technologies for the electronics industry. A
of mW is well developed for high power Comparison to HB-LED technology chip package is just a box with connectors,
LEDs, the CPV devices do need good Typically there are 4 main parts required and plastic molded connectors are in
thermal management built into the system for a HB LED or a CPV cell package, as themselves part of a fast moving industry
to ensure long term reliability. shown in Figure 3. high technology, high volume industry.
The MJ CPV cell device is a semicon- • A housing (package body) Molding high performance engineering
ductor device that needs to be interfaced • Interconnection terminals (leads) plastics, such as liquid crystal polymers
and mounted onto a base that can provide • Thermal management (heatsink) (LCP), to pre-formed copper leadframes, is
an electrical interconnection as well as • Optics support. the choice for packages for sensors, MEMs,
some form of thermal dissipation. In semi- LEDs and other electronic devices. This
conductor terms, the cell devices are quite These elements do not necessarily technology is now the cost effective choice
large as typically the industry is moving have to be individual items and for for “smart” CPV packages.
towards the 5 mm x 5 mm size rather than cost advantages. Lhe LED industry has As discussed, there are a number of
the smaller 1 mm x 1 mm. Some applica- developed a number of packages that crucial factors that must be combined
tions are using even larger 10 mm x 10 mm combine most of these elements together. into the design of a CPV cell package. As
devices. Even so, all semiconductor devices In terms of the manufacturing processes, volumes develop, it would seem prudent
need to be protected from damage caused LED fabrication yields of 95-98% are to ensure that such devices incorporate
by handling, mounting into systems, ambi- standard while silicon PV is in a lower the use of low cost Assembly capabilities
ent conditions and moisture. Hence, these range of 90-95%. and adoption of “standard” semiconductor
devices need some form of circuit board, If the HB-LED is considered, the ‘back-end’ assembly processes is the only
Conclusion
Interplex have taken the lead in developing
a range of ‘smart’ package options for
the developing CPV solar energy market.
They have developed a range of package
designs offering a user friendly solution
for the component user as well as the
device supplier (Figure 7). To ensure that
cost effective devices will become available
Figure 4. A CPV package Figure 5. The assembly of a basic Figure 6. Cross section of a basic
unit on leadframe carrier. CPV package unit. CPV package unit. they have produced a package that enables
the CPV technology industry to adopt
manufacturing skills already developed for
way to go for this. The package must there- for the system components, a methodol- the Semiconductor, particularly the LED,
fore take into account the requirements ogy for optical alignment and connection industry. The “standard” semiconductor
of the manufacturing systems: small sizes, apertures for electrical interconnection to assembly processes offer proven
carrier frames, die attach, wirebond, pick the rest of the system. technology, with efficiency and automation
and place, etc. to meet low cost assembly needs of the
Optical alignment is also a crucial part SMART packages CPV industry. The designs to match these
of the solar cell unit. Chip packaging is, in The package design in Figure 4 incorporates processes utilise readily available low cost
general, a proven technology for ensuring the Interplex unique, patented, dual materials, to provide a package solution
alignment of devices in the ‘X’ and ‘Y’ lead-frame design, integrating a thick that is the ideal option for both sample
planes but a CPV cell is actually a “3D” copper base die pad as a heatsink, with testing and production applications.
device. There has to be a focus of light a standard lead-frame structure in a high These “smart package” developments
onto the chip, and therefore, depending temperature LCP thermoplastic enclosure. now offer the manufacturers and users of
upon optics, the package has to be aligned This ensures excellent heat transfer from photosensing power LED and CPV devices
to the “Z” plane to ensure optical conver- cell to heat sink via the copper lead-frame a robust, thermally enhanced housing
sion efficiency. It is feasible, as with LED ensuring increased cell efficiency. The coupled with simple interface connectivity.
packages to build some form of X, Y and design of the package molding allows for
Z alignment into the packages and this is flexible secondary optics mounting, suiting
easily done utilising plastic injection mold the varied and different module designs
capabilities. However, as there is no “stan- that CPV system manufacturers are now
dard” optical design, the package design is considering. It is also designed to have
then really a match for the “unique” optics inexpensive interconnect spade terminals
that may be used. It may be more effective for low cost integration of cell systems
to use an available “standard” low cost enabling a lower total cost of assembled
package, always a smart choice, and utilise receiver due to simplified assembly
a separate “lens holder” to customise the operations.
system. These packages offer significant
Power dissipation needs are foremost, advantages compared to the alternative
to ensure efficiency and reliability of the methods of component assembly utilizing
cell. Utilising a leadframe technology as metallised circuit boards such as ceramic Figure 7. A CPV cell fully assembled. (Courtesy of
opposed to a ceramic or organic substrate substrates or mounted onto direct bond Spire)
allows for a substantial metal mass to be copper (DBC) or insulated metal substrates
utilised as a die pad. This pad also acts (IMS). Thermal management is built in,
as a heat-sink and enables much simpler secondary optics are easily mounted, and
thermal management within applica- isolation between cell and system housing
tions. Interplex Engineered Products have can be achieved very simply with a variety Andy Longford is a technical support
developed a number of unique injection of materials. Furthermore, a packaged cell consultant and Domenic Federici is the business
molding systems that allow two separate device allows easier and safer handling, development director for Interplex Engineered
leadframe formats to be molded together quicker assembly and test of the system Products (IEP), 231 Ferris Avenue,East Provi-
at the same time, and by incorporating as well as simpler repair and replacement, dence , RI 02916 USA. Tel:(401) 434 6543.
this technology into the designs, they have making the designs more future proof as www.interplex.com/iep IEP is a turnkey, verti-
produced a package technology that allows better ‘III-V’ cell designs and efficiencies cally integrated world-class supplier of applica-
the interconnection leadframe to be electri- are developed. tion specific thermoplastic Electronic Packages
cally isolated from the die pad/heatsink This design of package will also easily and a division of Interplex Industries Inc.
frame. Using frame technologies, rather lend itself to customisation or scaling to
than “drop in” metal slugs is a much lower suit different size cell devices and differ-
cost process and is much more applicable ent interconnection needs. Examples of
to high volume applications. such designs are shown in Figure 5 and 6.
The design of a simple looking chip One is for surface mount and the other is
housing, the molded plastic part, is really designed for interconnection wires (cables)
the ‘smart’ part of the package. It provides to be soldered to the packages.
protection for the metalwork, insulation