Product End-of-Life Disassembly Instructions

Product Category: Notebooks and Tablet PCs

Marketing Name / Model

[List multiple models if applicable.]
HP Pavilion x360 14 Convertible PC

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for
the disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive
2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).

NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on
the plastic part. For any questions on plastic marking, please contact HP’s Sustainability Contact.
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Quantity of
items
Item Description Notes
included in
product
Printed Circuit Boards (PCB) or Printed Circuit With a surface greater than 10 sq cm 2
Assemblies (PCA) PCA
Batteries, excluding Li-Ion batteries. All types including standard alkaline, coin or button 1
style batteries Battery pack
Li-Ion batteries. Include all Li-Ion batteries if more Battery(ies) are attached to the product by (check all 1
than one is provided with the product (such as a that apply with an “x” inside the “[ ]”):
detachable notebook keyboard battery, RTC coin cell, [x] screws
etc.) [ ] snaps
[ ] adhesive
[ ] other. Explain
NOTE: Add detailed removal procedures including
required tools in the sections 3.1 and 3.2.
Mercury-containing components For example, mercury in lamps, display backlights, 0
scanner lamps, switches, batteries N/A
Liquid Crystal Displays (LCD) with a surface greater Includes background illuminated displays with gas LED
than 100 sq cm discharge lamps 1
Cathode Ray Tubes (CRT) N/A 0
Capacitors / condensers (Containing PCB/PCT) N/A 0
Electrolytic Capacitors / Condensers measuring N/A 0
greater than 2.5 cm in diameter or height
External electrical cables and cords DC Cable for External Power Supply 1
Gas Discharge Lamps N/A 0
Plastics containing Brominated Flame Retardants N/A 0
EL-MF877-00 Page 1
Template Revision C

Last revalidation date 09-May-2018

HPI instructions for this template are available at EL-MF877-01

 Quantity of
items
Item Description Notes
included in
product
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink, Include the cartridges, print heads, tubes, vent 0
including liquids, semi-liquids (gel/paste) and toner chambers, and service stations. N/A
Components and waste containing asbestos N/A 0
Components, parts and materials containing N/A 0
refractory ceramic fibers
Components, parts and materials containing N/A 0
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components and
materials requiring selective treatment can be removed.
Tool Description Tool Size (if
applicable)
Description #1 Philips screwdriver (for 4PCS on bottom case) 2.5~3kg-cm

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment
including the required steps to remove the external enclosure:

1. Release 2PCS rubber foot refer figure 1

2. Release 4PCS screw, next disassemble L-Case refer figure 2
3. Release 5PCS screw, next disassemble Battery and HDD refer figure 3
4. Disassemble PW FFC, TP FFC, KB FPC, Fan cable, Edp cable, SPK cable, CCD cable, Antenna and DC-IN cable refer figure
4
5. Release 15PCS screw, next disassemble Speaker, Fan, Heat pipe, Power board, Audio board and MB refer figure 5
6. Release 4PCS screw, next disassemble system hinge bracket refer figure 6
7. Disassemble Hinge up refer figure 7
8. Release 6PCS screw from right & left hinge bracket refer figure 8

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained
in the product that require selective treatment (with descriptions and arrows identifying locations).

EL-MF877-00 Page 2
Template Revision C

Last revalidation date 09-May-2018

HPI instructions for this template are available at EL-MF877-01

 Figure 1

Figure 2

Figure 3

EL-MF877-00 Page 3
Template Revision C Figure 4

Last revalidation date 09-May-2018

HPI instructions for this template are available at EL-MF877-01

 Figure 5

Figure 6

Figure 7

Figure 8
EL-MF877-00 Page 4
Template Revision C

Last revalidation date 09-May-2018

HPI instructions for this template are available at EL-MF877-01

EL-MF877-00 Page 5
Template Revision C

Last revalidation date 09-May-2018

HPI instructions for this template are available at EL-MF877-01