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MEMS

Introduction :
This report deals with emerging field of micro electro mechanical system
Or MEMS is a process technology use to create tiny integrate devices or
systems tha combine mechanical and electrical components.
They are febricated using integrated circuit batch processing techies and
they range in size from a few micro meters to milimiters.
These devices have the ability to sense control and accurate on the micro
scale and generate effects on the micro scale . The interdisciplinary nature
MEMS utilised designe engineering manufacturing expertiese from a wide
and diverse range of technical areas including integrated circuit febrication
technology mechanical engineering material since optics , instrumentation
and packaging. The complexity of MEMS is also shown in the extensive
range of markets and applications that incorporate MEMS devices. MEMS
can b e found in systems ranging across automotive , medical , electronic,
communication application. Current MEMS device includes eccelerometerr
for airbag sensers, inject printers head computer disc drive read / write head
projection display chips, blood pressure sensor, optical switches
,microvalves bio-sensors and many others products that all manufacturers
and shaped in high commercial volumes. MEMS has been identified as one
of the most promising technologies for the 21th. century and has the
potential to revolutionise both industrial and consumer products by
combining silicone .
That is based microelectronics with micro machining technology,.it's
techniques and microsystem based devices have the potential to dramatically
effect of all of overs lives and they have we live if semiconductor micro
febrication was seen to be the first micro manufacturing revolution, MEMS,
is the second revolution. This report introduced the field of MEMS and is
divided into four main sections.
1 In the first section , the reader is introduced to MEMS , it's definitions,
history,current and potential application, asa well as the state of the MEMS
market and issues concerning miniaturisation.
1 the second section deals with the fundamental febrication methods of MEMS
including photolithography, bulk micro machinering, the surface micro machine
and high- aspect ratio micromachinering. Assembly, system integration and
packaging of MEMS devices also described here .
2 the third section reviews the range of MEMS sensors and accurate, the basic
sensing and actuation mechanism
3 the final and the 4th section illustrate the challenge the facing the MEMS
industry for the commercialisation and success of MEMS.
MEMS refer to a collection of microseconds and accurates that can sense it's
environment and have the ability to react to chnges in that environment with the use of a
microcircuit control. They include, addition to the conventional microelectronics
packaging, integrated antenna structure for command signals in microelectromechanical
structure for desired sensing and actuation functions. The system may also need
micropower supply,micro relay, and micro signals processing units ,micro components
make the system faster, more reliable, chipper and capable of incorporating more
complex functions. In the beginning of 1990s. MEMS emerged with the aid of the
development of integrated circuit (IC) febrication processes ,in which sensors , accurates
,and control functions are cofebricate in silicone . Since then , remarkable research
progresses have been achieved in MEMS under the strong capital promotion from both
government and industries . In addition to the commercialisation of sum less-integrated
MEMS devices ,such as microaccelerometers, inject printer head micromirrors for
projection, etc.
The concept and feasible for more complex MEMS devices have been proposed and
demonstrated for the application in such varied field as miro flues arrow space , bio
medical , chemical analysis, wireless communication, data storage, display, optics, etc.
Some branches of MEMS , appearing as micro optoelectro mechanical system
(MOEMS), micro total analysis system etc.
Have attracted a great deal of research interests since there potential applications
markets

1.1. What is MEMS ?


MEMS stand for micro electro mechanical system. MEMS techniques allow both
electronic circuits and mechanical devices to be manufactured on a silicone chips ,
Similar to the process used for integrated circuit this allows the construction of atoms
such as sensor chips with built in electronics that are fraction of the size that was
previously possible
MEMS products :
four devices using MEMS technology commercially successful for several
years MEMS .
u MEMS accelerometer Chips:
used to trigger airbags
u MEMS Micro chips:
It is used to projection screen TV
u MEMS Inject nozzles:
It is used in printers
u MEms Pressure sensors
It is used in medical applications
Micro-electro mechanical systems ( MEMS ) is a process technology used
to create tiny integrated devices or system that combine mechanical and
electrical components,. They are fabricated using integrated circuit (IC)
batch processing techniques and can rang in size from a few micrometer to
milli meter . These devices ( or system ) have the ability to sense , control
and actuate on the micro scale , and generate effects on the macro scale.

MEMS an acronym that originated in the United States is also referred to


as miro systems technology (MST) in Europe and micro machines in Japan
Regardless of termoninology, the uniting factor of a MEMS devices is in
the made. while the device electronics are fabricated using computer chips
IC technology, the micromechanical components are fabricated by
sophisticated manipulation of silicone another subtracts using micro
machining processor. Processor such as bulk and surface micro machines ,
asa well as high aspect-ratio-micro machines.
HARM) selectively remove parts of silicone or at additional structure layers
to form the mechanical and electromechanical structural layers to from the
mechanical and electromechanical components. while integrated circuit
exploit property are both it's electrical and mechanical property. In the most
general form , MEMS consist of mechanical micro structures , micro sense ,
micro accurate and microelectronics, all integrated on to the same silicone
chip this is shown in figure.

Microsensors detect charges in the systems environment by measuring mechanical ,


thermal magnetic, chemical electromagnetic information are phenomenon.
Microelectronics process this information and signals the micro electrons to react and
create some from of charge to the environment. MEMS devices are very small, under
there components are usually microscopic. Levers , gears ,pistons as well as moters and
even steam engines have all been fabricated by MEMS ( figure 2)

figure (a) shown that


MEMS silicone moter to gather with a stand of human air
In figure (b) :
The legs of spider mite standing on gears from a micro engine
1.2. Definition and classification
The section defined some of the key terminology and classification associated
with MEMS . It is intended to help the reader and new comers to the field of
micro machining become familiar with some of the more common terms . A
more detailed glossary of terms has been included in appendix.

That is classified into four terms


1 Microsensor
2 Microacuators
3 Microelectronics
4 Microstructure
micro optoelectromechanical system (MOEMS) is also subset of MST and to gather
with MEMS forms the specialised technology fields using miniaturised combination of
optics, electronics and mechanism , both there microsystem in coporate the use of micro
electronics batch processing techniques for there design and fabrication. There are
considerable over laps between fields in terms of there integrating technology and there
applications and hence it is extremely deficult to categorise MEMS devices in terms of
sensing domain or there subset of MST . They real difference b tween MEMS and NST is
that MEMS tens to use semiconductor processes to create mechanical part . Contrast ,
deposition of a material of silicon for example , thus not constitute MEMS but is an
application of MST.

Transducer:

A transducer is a devise that transfer one form of energy into an other form. The terms
transducer can there for be use to include both sensor an accurates and is taccurate the
most generic and widely use in term of MEMS
Sensor:
A sensor is the device that measure information from a surrounding environment and
provides an electrical output signals in response to the parameter it measured . Overs the
years this information (or phenomenon ) has been categories in terms of the type of
enrgy domains but MEMS devices generally overlap several domains or don't even
belong in any one category.
The energy domain include .
l Mechanical-force,pressure, velocity, acceleration, position
l Thermal - concentration , composition, reaction rate
l Radiant - electromagnetic waves have intensity ,phase , wavelength,
polarization.
Actuator :
An Actuator is a device that converts an electrical signals into an action it can
create a force to manipulate itself,the mechanical devices, or he surrounding environment
to perform some useful function.
History:
The history of MEMS is useful to illustrate it's diversity ,challenges and application .
The following list summaries some of the kesy MEMS miles stones
1950's

1958 Silicone strain gauges commercially available


1959,
"There's plenty of room at the bottom " - Richard Feynman gives a miles stone
presentation at the California institute of Technology. He issues a public challenge by
offering $1000th the first person to create an electrical moter smaller than 1/64th an inch

1960's
1961 For silicon pressure sensor demonstrated
1967 invention of surface miro machininWesting house creates by resolved gate field
effect transistor, ( RGT) description of use of sacrificial material to free miro mechanical
devices from the silicon subtrate
1970's
1970 first silicon accelemeter demonstrate 1979 the first micro machines injctnozzal
1980's Early 1980's
first experiments in the surface micro machine silicon Micro machining leverages micro
electronics industry and wide spears experimation and documentation increase public
interest

1982
Disposable blood pressure transducer

1982
" silicon as a mechanical material " . Instrumental paper to intice the scientific community
reference for material properties and etching data for silicon
1987
LIGA process
1988
First MEMS conference
1990,S

Method of micro machining aimed to words improving sensor .


1992
MCNC starts the multi - User MEMS process (MUMPS) sponsored by define Advanced
Research project agency (DARPA )

1992
First micro machines hinge
1993
First surface micro machined accelerometer sold (Analogy Device ' ADXL 50) 1994
Deep reactive lon

Febrication of MEMS :
Micro Electro Mechanical System is a system of miniaturised device and structure that
can be manufactured using micro fabrication techniques. It is a system of Microsensor
Microacuators, and other microstructure fabrication together on a common silicon
substrate . A typical MEMS system consists of a Microsensor that sense the environment
and converts the environment variable into an electrical circuit. The microelectronics
process the electrical signal and the Microacuators accordingly works to produce a change
in the environment.
Fabrication of MEMS device involves the basic IC fabrication methods along with the
micromachinig process involving the selective removal of silicon or the addition of other
structural layers.

Steps of MEMS Fabrication using Bulk Micromachining :

Ø Step 1: The first step involves the circuit design and drawing of the circuit either on
a paper or on using software like SPpice or proteus.
Ø Step 2 : The second step involves the simulation of the circuit and modeling using
CAD ( computer Aided Design ) . CAD is using to design the photo lithographic.
mask which consists of the glass plate coated with chromium pattern.
Ø

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