Modalitati de

livrare a
componentelor
SMD
 φ=9mm

TOP SIDE
BOTTOM SIDE
 Structura unui Package Electronic de pe nivelul 2
Componente
electromecanice
Componente
Componente electronice
mecanice

Subsistem
Placă de bază
Modul Electronic
 Detalii ale unui modul electronic:
Componente standardizate Componente dedicate (PCB)

Tehnologii electronice
 Componente

Componente standardizate (normalizate)

dezvoltate şi produse de producători
specializaţi.
(exemple: IC, Componente discrete active şi
pasive, etc.)
Componente dedicate
dezvoltate chiar de companii corespunzător cu
necesităţile cerute de aplicaţie.
(exemple: PCB, componente pasive integrate, etc.)

Education and Training

Criterii de proiectare a cablajelor imprimate

Economice

Mecanice Termice

9 / 37
 Cum poți folosi aceste cunostințe în timpul facultății?

În proiectele obligatorii.

În activități extracurriculare (Minerva, RoboChallenge
etc.)
În proiecte personale.

 TIE → premii + calificare profesională!

20-22 aprilie 2017
IASI
www.tie.ro
 2020

2015 2021 2017

2014 2013
2018
2019

2016

Participant universities
 TIE Project – http://www.tie.ro
Interconnection Techniques in Electronics-TIE is a major project
established to promote eSkills of students in electrical & electronics
engineering education. The topics are focused on CAD
activities for electronic design of modules and micro-
modules. TIE was developed to cover the presence of all universities
involved in electrical & electronics engineering education in
Romania. Because English is the TIE official language, the event is
open towards all European universities. The Budapest University for
Technology and Economics from Hungary has a constant participation
in the last years. TIE is highly appreciated by the IEEE CPMT Society
and is strongly supported by its IEEE CPMT Hu&Ro Joint
Chapter. TIE, in fact, aims to raise awareness the growing demand of
highly skilled ICT practitioners and users in industry in a domain with
high added value products, like electronics industry is.
In this perspective, one of TIE’s committees, the Industrial
Advisory Committee (IAC), composed only by
professionals coming from well known companies (Continental
Automotive, Siemens, Microchip, etc), works closely with the
Technical Program Committee for preparing the topics, the subjects,
and the evaluation sheets of the competitors. At the end of the
event, IAC establishes the level over which the participants are
considered to have an accepted knowledge to be considered PCB
designers, able to participate in industrial design teams and
companies. The TIE project offers to students an extra-
curricular environment for gaining design skills in
CAE-CAD-CAM for electronics. The acquired knowledge
and competence represent one of the main elements destined to
promote the mandatory electronic industrial requirements in
engineering education and training. Through this, the event
provides by academia a concrete answer to the European” Europe
2020” strategy.
 Posterul
Editiei TIE
2016
Suceava
20-23. 04
2016
 Posterul
evenimentului
TIE 2012

www.tie.ro
Poster TIE
Posterul
eveniment
ului
TIE 2013

www.tie.ro
 Posterul
Editiei TIE
2014
TIMIŞOARA
9-12. 04 2014
 Posterul
evenimentului
TIE 2009

www.tie.ro
 Posterul
evenimentului
TIE 2010

www.tie.ro
 Posterul
evenimentului
TIE 2011,
ediţia cu
numărul 20!

www.tie.ro
 Structură de
interconectare Potenţiometre
Gaură de
prindere Gaură de
prindere

Conector

Circuite
integrate
Transformator

Componente
discrete
Gaură de
prindere

Comutator ON/OFF Componente optoelectronice Butoane

STRUCTURA GENERALĂ A UNUI MODUL ELECTRONIC

 Marcaje pentru tăiere Mască de lipire Plan de masă
(frezare) (Solder mask) (alimentare) intern

Nume PCB

Gaură de
prindere

Gaură de
trecere
Trasee
“Mitre
corner”

Pastile
Mască de
inscripţionare
(Silk mask)

Element mecanic de fixare pentru o Contururi de

Text cu cupru
componentă electronică componente

STRUCTURA DE INTERCONECTARE ATAŞATĂ

MODULULUI ELECTRONIC
 Fluxul de proiectare automatizată
Proiectare schemă Concepţie
electrică

CAE
Simulare schemă electrică

Plasare componente

C Analiză termică
A Postprocesări

D
Proiectare structură de
Fabricaţie
interconectare CAM

Analiză EMC şi a
Testare
integrităţii semnalelor
PSPICE SIMULATION
Analiza termică
Analiza integrităţii semnalelor
TXLINE

CITS25
EMC ANALYSIS
 EMC ANALYSIS

TTL CMOS
Simulare electromagnetică a structurilor PCB