EDFAAO (2014) 2:18:23 1537-0755/$19.00 ©ASM International® Tantalum Capacitor FA An Overview of Failure Analysis of Tantalum Capacitors Javaid Qazi, Kemet Electronics javaidgazi@kemet.com Introduction ‘A meaningful failure analysis of a capacitor (CAP) requires a thorough understanding of its construct tion. Capacitors can be classified into different types based on their materials and construction: tantalum, ceramics, aluminum, and so on (Table 1). Each of- fers. unique set of properties suited for a particular application. A simple CAP consists of a dielectric material sandwiched between two conductors with a bias applied across them. The capacitance (C) of a CAP is given by the following equation, where, A, and tare the dielectric constant, surface area, and thickness, respectively: C=eA/t (Eq1) Miniaturization of electronic devices demands higher and higher capacitance in a smaller volume. One way to achieve higher capacitance in a small volumes to increase the “A” in Eq 1. Thisis achieved differently in different types of capacitors. In the case of tantalum CAPs, for example, it is achieved with porous tantalum anodes (high surface area/volume), which are produced by pressing and sintering tane Table 1 Different types of CAPs talum powder, with an attached tantalum wire. An amorphous TaOs dielectric is then electrochemically grown on this high-surface-area porous tantalum an de. The TayQs is typically a few tens of nanometers thick. The porous anode is then impregnated with a counterelectrode layer (MnO; or conductive poly mer), providing high capacitance in a small volume (Fig. 1). Solid-state tantalum capacitors are typically used for 100 V or below, with most of them being 50 V or lower. Wet tantalum capacitors (the coun- terelectrode being a liquid) allow higher working, voltages, up to a few hundred volts In film and ceramic CAPs, thin layers of dielectric and electrode materials are stacked alternately, with alternating electrodes displaced to avoid contact between the opposing terminals. Figure 2 shows the typical construction ofa ceramic capacitor. A few tens tohundreds (in ceramic CAPs) or even thousands (in film CAPs) of these layers can be stacked to obtain the desired capacitance. Because of significant dissimilarity in the mate= rials and construction of different types of CAPs (Table 1, Fig. 1 and 2), the cause oftheir failure is also different. Consequently, each condition requires Type Dielectric Electrodelcounterelctode Construction Polardevices nique failure analysis Tantalum Tantalum, Tantalum/MnO; Porous tantalum Yes (FA) approach. Itis worth ‘oxide Tantalum/conduetive polymer anode for high noting that the FA of the Tantalum/liquid eletrohyte surface aea failed CAP is part of the Aluminum Aluminum Aluminum/conductive polymer Etchedaluminum Yes overall roat-cause analy oxide Aluminum/Iiquid clecnolyte foils for high sis, along with circuit surface aea and application analy- Ceramics BaTiO:, _Basometalelectode (BME), _Layeredstricture Noses, This paper provides ZeMiO, ete, suchascopper nickel for highsurface tea an overview of FA for Peet accivenpeliaiven surface-mount tantalum Film Polypropylene, Metal, such as zine, Layered structure No CAPs polyethylene alumiaim, te for high surface area Electrical failure modes T 18 Electronic Device Failure Analysis of tantalum CAPS can be