Professional Documents
Culture Documents
HY27SS(08/16)121A Series
512Mbit (64Mx8bit / 32Mx16bit) NAND Flash
Document Title
512Mbit (64Mx8bit / 32Mx16bit) NAND Flash Memory
Revision History
Revision
History Draft Date Remark
No.
0.0 Initial Draft. Sep. 2004 Preliminary
Revision
History Draft Date Remark
No.
before 50 25 15 50 25 15 30
after 60 40 20 60 40 20 40
2) Change AC Parameter
0.3 Jul. 08. 2005 Preliminary
tCRY(3.3V) tCRY(1.8V) tOH
tCRY(3.3V)
tRC=50ns,
Before CE#=VIL,
0.4 IOUT=0mA Jul. 15. 2005 Preliminary
tRC(1.8V=60ns,
3.3V=50ns)
After
CE#=VIL,
IOUT=0mA
Revision
History Draft Date Remark
No.
1) The test conditions is corrected.
Test Conditions (ICC1) Test Conditions (ILI, ILO)
tRC=50ns,
Before CE#=VIL, VIN=VOUT=0 to 3.6V
IOUT=0mA
tRC(1.8V=60ns,
3.3V=50ns) VIN=VOUT=(1.8V, 0 to 1.95V)
After
0.5 CE#=VIL, =(3.3V, 0 to 3.6V) Jul. 20. 2005 Preliminary
IOUT=0mA
2) Change VIL parameter (max.)
1.8V 3.3V
VIN=VOUT=(1.8V, 0 to 1.95V)
Before
=(3.3V, 0 to 3.6V)
0.6 After VIN=VOUT=0 to Vcc (max) Jul. 22. 2005 Preliminary
after 25 30
After 0.100
Revision
History Draft Date Remark
No.
1.0 1) Delet Preliminary. Nov. 08. 2005
1.1 1) Correct Figure 32. Feb. 06. 2006
1) Add ECC algorithm. (1bit/512bytes)
1.2 May. 09. 2006
2) Correct Read ID naming
1) Change AC Parameter
tWHR
1.3 Jun. 20. 2006
Before 60 ns
After 50 ns
FEATURES SUMMARY
HIGH DENSITY NAND Flash MEMORIES FAST BLOCK ERASE
- Cost effective solutions for mass storage applications - Block erase time: 2ms (Typ.)
1. SUMMARY DESCRIPTION
The HYNIX HY27(U/S)S(08/16)121A series is a 64Mx8bit with spare 2Mx8 bit capacity. The device is offered in 1.8V
Vcc Power Supply and in 3.3V Vcc Power Supply.
Its NAND cell provides the most cost-effective solution for the solid state mass storage market.
The memory is divided into blocks that can be erased independently so it is possible to preserve valid data while old
data is erased.
The device contains 4096 blocks, composed by 32 pages consisting in two NAND structures of 16 series connected
Flash cells.
A program operation allows to write the 512-byte page in typical 200us and an erase operation can be performed in
typical 2ms on a 16Kbyte(X8 device) block.
Data in the page mode can be read out at 50ns cycle time(3.3V device) per byte. The I/O pins serve as the ports for
address and data input/output as well as command input. This interface allows a reduced pin count and easy migration
towards different densities, without any rearrangement of footprint.
Commands, Data and Addresses are synchronously introduced using CE, WE, ALE and CLE input pin.
The on-chip Program/Erase Controller automates all program and erase functions including pulse repetition, where
required, and internal verification and margining of data.
The modifying can be lockde using the WP input pin.
The output pin R/B (open drain buffer) signals the status of the device during each operation. In a system with multi-
ple memories the R/B pins can be connected all together to provide a global status signal.
Even the write-intensive systems can take advantage of the HY27(U/S)S(08/16)121A extended reliability of 100K pro-
gram/erase cycles by providing ECC (Error Correcting Code) with real time mapping-out algorithm.
The chip could be offered with the CE don’t care function. This function allows the direct download of the code from
the NAND Flash memory device by a microcontroller, since the CE transitions do not stop the read operation.
The copy back function allows the optimization of defective blocks management: when a page program operation fails
the data can be directly programmed in another page inside the same array section without the time consuming serial
data insertion phase.
This device includes also extra features like OTP/Unique ID area, Block Lock mechanism, Automatic Read at Power Up,
Read ID2 extension.
HY27SS08121A x8
1.70 - 1.95 Volt
HY27SS16121A x16
63FBGA / 48TSOP1 / 48USOP1
HY27US08121A x8
2.7V - 3.6 Volt
HY27US16121A x16
9&&
&( ,2a,2
:( ,2a,2[2QO\
5( 5%
$/(
&/(
:3
35(
966
CE Chip Enable
RE Read Enable
WE Write Enable
WP Write Protect
Vss Ground
NC No Connection
NOTE:
1. For x16 version only
2. A 0.1uF capacitor should be connected between the Vcc Supply Voltage pin and the Vss Ground pin to decouple
the current surges from the power supply. The PCB track widths must be sufficient to carry the currents required
during program and erase operations.
NOTE:
1. L must be set to Low.
2. A8 is set to LOW or High by the 00h or 01h Command.
NOTE:
1. L must be set to Low.
Acceptable command
FUNCTION 1st CYCLE 2nd CYCLE 3rd CYCLE 4th CYCLE
during busy
READ 1 00h/01h - -
READ 2 50h - -
READ ID 90h - -
RESET FFh - - Yes
PAGE PROGRAM 80h 10h -
COPY BACK PGM 00h 8Ah (10h)
BLOCK ERASE 60h D0h -
READ STATUS REGISTER 70h - - Yes
LOCK BLOCK 2Ah
LOCK TIGHT 2Ch
UNLOCK (start area) 23h
UNLOCK (end area) 24h
READ LOCK STATUS 7Ah
Table 5: Command Set
NOTE:
1. With the CE high during latency time does not stop the read operation
2. BUS OPERATION
There are six standard bus operations that control the device. These are Command Input, Address Input, Data Input,
Data Output, Write Protect, and Standby.
Typically glitches less than 5 ns on Chip Enable, Write Enable and Read Enable are ignored by the memory and do not
affect bus operations.
2.6 Standby.
In Standby mode the device is deselected, outputs are disabled and Power Consumption is reduced.
3. DEVICE OPERATION
3.7 Reset.
The device offers a reset feature, executed by writing FFh to the command register. When the device is in Busy state
during random read, program or erase mode, the reset operation will abort these operations. The contents of memory
cells being altered are no longer valid, as the data will be partially programmed or erased. The command register is
cleared to wait for the next command, and the Status Register is cleared to value E0h when WP is high. Refer to table
12 for device status after reset operation. If the device is already in reset state a new reset command will not be
accepted by the command register. The R/B pin transitions to low for tRST after the Reset command is written. Refer
to figure 25.
4. OTHER FEATURES
4.2 Ready/Busy.
The device has a Ready/Busy output that provides method of indicating the completion of a page program, erase,
copy-back and random read completion. The R/B pin is normally high and goes to low when the device is busy (after a
reset, read, program, erase operation). It returns to high when the internal controller has finished the operation. The
pin is an open-drain driver thereby allowing two or more R/B outputs to be Or-tied. Because pull-up resistor value is
related to tr(R/B) and current drain during busy (Ibusy), an appropriate value can be obtained with the following ref-
erence chart (Fig 27). Its value can be determined by the following guidance.
In high state of PRE pin, Block lock mode and Power on Auto read are enabled, otherwise it is regarded
as NAND Flash without PRE pin.
Block Lock mode is enabled while PRE pin state is high, which is to offer protection features for NAND Flash data. The
Block Lock mode is divided into Unlock, Lock, Lock-tight operation. Consecutive blocks protects data allows those
blocks to be locked or lock-tighten with no latency. This block lock scheme offers two levels of protection. The first
allows software control (command input method) of block locking that is useful for frequently changed data blocks,
while the second requires hardware control (WP low pulse input method) before locking can be changed that is useful
for protecting infrequently changed code blocks. The followings summarized the locking functionality.
- All blocks are in a locked state on power-up. Unlock sequence can unlock the locked blocks.
- The Lock-tight command locks blocks and prevents from being unlocked. Lock-tight state can be returned to lock
state only by Hardware control(WP low pulse input).
2) Unlock
- Command Sequence: Unlock block Command (23h) + Start block address + Command (24h) + End block address.
See Fig. 21.
- Unlocked blocks can be programmed or erased.
- An unlocked block’s status can be changed to the locked or lock-tighten state using the appropriate sequence of
commands.
- Only one consecutive area can be released to unlock state from lock state; Unlocking multi area is not available.
- Start block address must be nearer to the logical LSB (Least Significant Bit) than End block address.
- One block is selected for unlocking block when Start block address is same as End block address.
3) Lock-tight
- Command Sequence: Lock-tight block Command (2Ch). See Fig. 22.
- Lock-tighten blocks offer the user an additional level of write protection beyond that of a regular lock block. A block
that is lock-tighten can’t have its state changed by software control, only by hardware control (WP low pulse
input); Unlocking multi area is not available
- Only locked blocks can be lock-tighten by lock-tight command.
- On the program or erase operation in Locked or Lock-tighten block, Busy state holds 1~10us(tLBSY)
4) Lock Block Boundaries after Unlock Command issuing
- If Start Block address = 0000h and End Block Address = FFFFh , the device is all unlocked
- If Start Block address = End Block Address = FFFFh , the device is all locked except for the last Block
- If Start Block address = End Block Address = 0000h , the device is all locked except for the first Block
NOTE:
1. The 1st block is guaranteed to be a valid block up to 1K cycles without ECC. (1bit/512bytes)
Value
Symbol Parameter Unit
1.8V 3.3V
NOTE:
1. Except for the rating “Operating Temperature Range”, stresses above those listed in the Table “Absolute
Maximum Ratings” may cause permanent damage to the device. These are stress ratings only and operation of
the device at these or any other conditions above those indicated in the Operating sections of this specification is
not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability.
2. Minimum Voltage may undershoot to -2V during transition and for less than 20ns during transitions.
$a$
$''5(66
5(*,67(5
&2817(5
352*5$0
(5$6( ;
&21752//(5 0ELW0ELW
+9*(1(5$7,21 '
1$1')ODVK (
35( &
$/(
0(025<$55$< 2
'
&/( (
:( 5
&( &200$1'
:3 ,17(5)$&(
/2*,&
5(
3$*(%8))(5
&200$1'
5(*,67(5
<'(&2'(5
'$7$
5(*,67(5
%8))(56
,2
1.8Volt 3.3Volt
Parameter Symbol Test Conditions Unit
Min Typ Max Min Typ Max
tRC(1.8V=60ns,
Sequential
ICC1 3.3V=50ns) - 8 15 - 10 20 mA
Read
Operating CE=VIL, IOUT=0mA
Current
Program ICC2 - - 8 15 - 10 20 mA
Erase ICC3 - - 8 15 - 10 20 mA
CE=VIH,
Stand-by Current (TTL) ICC4 - - 1 - 1 mA
WP=PRE=0V/Vcc
CE=Vcc-0.2,
Stand-by Current (CMOS) ICC5 - 10 50 - 10 50 uA
WP=PRE=0V/Vcc
Input Leakage Current ILI VIN=0 to Vcc (max) - - ± 10 - - ± 10 uA
Output Leakage Current ILO VOUT =0 to Vcc (max) - - ± 10 - - ± 10 uA
Vcc+0. Vcc+0
Input High Voltage VIH - Vcc-0.4 - 2 - V
3 .3
Input Low Voltage VIL - -0.3 - 0.4 -0.3 - 0.8 V
IOH=-100uA Vcc-0.1 - - - - - V
Output High Voltage Level VOH
IOH=-400uA - - - 2.4 - - V
IOL=100uA - - 0.1 - - - V
Output Low Voltage Level VOL
IOL=2.1mA - - - - - 0.4 V
IOL VOL=0.2V 3 4 - - - - mA
Output Low Current (R/B)
(R/B) VOL=0.4V - - - 8 10 - mA
Table 8: DC and Operating Characteristics
Value
Parameter
1.8Volt 3.3Volt
Input Pulse Levels 0V to Vcc 0.4V to 2.4V
Input Rise and Fall Times 5ns 5ns
Input and Output Timing Levels Vcc / 2 1.5V
Output Load (1.7V - 1.95Volt & 2.7V - 3.3V) 1 TTL GATE and CL=30pF 1 TTL GATE and CL=50pF
Output Load (3.0V - 3.6V) 1 TTL GATE and CL=100pF
Table 9: AC Conditions
CE High Hold Time (at the last serial read) (3) tCEH 100 100 ns
2. If Reset Command (FFh) is written at Ready state, the device goes into Busy for maximum 5us
3. To break the sequential read cycle, CE must be held for longer time than tCEH.
4. The time to Ready depends on the value of the pull-up resistor tied R/B pin.
5. Program / Erase Enable Operation : WP high to WE High.
Program / Erase Disable Operation : WP Low to WE High.
Pagae Block
IO Read CODING
Program Erase
2 NA NA NA -
3 NA NA NA -
4 NA NA NA -
Protected: ‘0’
7 Write Protect Write Protect Write Protect
Not Protected: ‘1’
W&/6 W&/+
&/(
W&6 W&+
&(
W:3
:(
W$/6 W$/+
$/(
W'6 W'+
,2a &RPPDQG
W&/6
&/(
$/(
W'+
W'6 W'+ W'6 W'6 W'+ W'6 W'+
W&/+
&/(
W&+
&(
W$/6 W:&
$/(
tCEA
CE
tCHZ*
tREH
tREA tREA tREA tOH
tRP
RE
tRHZ tRHZ*
tOH
I/Ox Dout Dout Dout
tRR tRC
R/B
Notes : Transition is measured ±200mV from steady state voltage with load.
This parameter is sampled and not 100% tested.
Figure 10: Sequential Out Cycle after Read (CLE=L, WE=H, ALE=L)
W&/5
&/(
W&/6
W&/+
W&6
&(
W&+
W:3
:(
W&($
W:+5 W&+=
5(
W'+ W5($
W'6 W,5
W5+=
,2[ K 6WDWXV2XWSXW
&/(
W&(+
&(
W:& W&+=
:(
W:%
W&5<
W$5
$/(
W5 W5+=
W5&
5(
W53
,2[ KRUK &RO$GG 5RZ$GG 5RZ$GG 5RZ$GG 'RXW1 'RXW1 'RXW1 'RXW
&ROXPQ W5%
3DJH5RZ$GGUHVV
$GGUHVV
5% %XV\
&/(
&(
:(
W:%
W&+=
W$5
$/(
W5
W5&
5(
W55
5% %XV\
&/(
&/(
&(
&(
:(
:( W5
W5
W:%
W:%
W$5
W$5
$/(
$/(
W55
W55
5(
5(
6WDUW
6WDUW
$GGUHVV0
$GGUHVV0
&/(
&(
:(
$/(
5(
K &RO$GG 5RZ$GG 5RZ$GG 5RZ$GG 'RXW 'RXW 'RXW 'RXW 'RXW 'RXW
,2[ 1 1
5HDG\
5% %XV\ %XV\
0
0
1 2XWSXW 2XWSXW
&/(
&(
W:& W:& W:&
:(
W:% W352*
$/(
5(
,2[ K &RO$GG 5RZ$GG 5RZ$GG 5RZ$GG 'LQ 'LQ K K ,2R
1 0
6HULDO'DWD &ROXPQ 5RZ$GGUHVV XSWR%\WH 3URJUDP 5HDG6WDWXV
,QSXW&RPPDQG $GGUHVV 6HULDO,QSXW &RPPDQG &RPPDQG
5%
,2R 6XFFHVVIXO3URJUDP
,2R (UURULQ3URJUDP
&(
W:&
:(
W:%
W352*
$/(
W5
5(
,2[ K &RO$GG 5RZ$GG 5RZ$GG 5RZ$GG $K &RO$GG 5RZ$GG 5RZ$GG 5RZ$GG K ,2
5%
%XV\ %XV\ ,2 6XFFHVVIXO3URJUDP
&RS\%DFN'DWD ,2 (UURULQ3URJUDP
,QSXW&RPPDQG
KZULWHF\FOHQRPRUH
512Mbit (64Mx8bit / 32Mx16bit) NAND Flash
HY27US(08/16)121A Series
32
HY27SS(08/16)121A Series
HY27US(08/16)121A Series
HY27SS(08/16)121A Series
512Mbit (64Mx8bit / 32Mx16bit) NAND Flash
&/(
&(
W:&
:(
W:% W%(56
$/(
5(
CLE
CE
WE
tAR
ALE
RE
tREA
:3
&/(
&(
:(
,2[ $K
/RFN&RPPDQG
:3
&/(
&(
:(
$/(
:3
&/(
&(
:(
,2[ &K
/RFNWLJKW&RPPDQG
:3
&/(
&(
:(
$/(
W:+5
5(
1.8V
Vcc
WE
CE
ALE
CLE
tR
R/B
PRE
RE
Last
I/Ox Data1 Data2 Data3 Data
Data Output
:(
$/(
&/(
5(
,2 ))K
W567
5%
9FF
97+
:3
:(
XV
VTH = 1.5 Volt for 1.8 Volt Supply devices; 2.5 Volt for 3.3 Volt Supply devices
5S LEXV\
9FF
5HDG\ 9FF
5%
RSHQGUDLQRXWSXW 9
9 %XV\
WI WU
*1'
'HYLFH
)LJ5SYVWUWI 5SYVLEXV\
#9FF 97D &&/ S)
LEXV\
Q P
WUWI>V@
LEXV\>$@
Q
P
Q P
WI
N N N N
5SRKP
5SYDOXHJXLGHQFH
ZKHUH,/LVWKHVXPRIWKHLQSXWFXUUQWVRIDOOGHYLFHVWLHGWRWKH5%SLQ
5SPD[LVGHWHUPLQHGE\PD[LPXPSHUPLVVLEOHOLPLWRIWU
['HYLFHV ['HYLFHV
$UHD$ $UHD% $UHD& $UHD$ $UHD&
K K K K K
%\WHV %\WHV %\WHV %\WHV %\WHV
3RLQWHU 3RLQWHU
KKK KK
$5($$
,2 K K $GGUHVV 'DWD,QSXW K K K $GGUHVV 'DWD,QSXW K
,QSXWV ,QSXWV
$UHDV$%&FDQEHSURJUDPPHGGHSHQGLQJRQKRZPXFKGDWDLVLQSXW6XEVHTXHQWKFRPPDQGVFDQEHRPLWWHG
$5($%
$GGUHVV $GGUHVV
,2 K K ,QSXWV 'DWD,QSXW K K K ,QSXWV 'DWD,QSXW K
$UHDV%&FDQEHSURJUDPPHGGHSHQGLQJRQKRZPXFKGDWDLVLQSXW7KHKFRPPDQGPXVWEHUHLVVXHGEHIRUHHDFKSURJUDP
$5($&
,2 K K $GGUHVV 'DWD,QSXW K K K $GGUHVV 'DWD,QSXW K
,QSXWV ,QSXWV
2QO\$UHDV&FDQEHSURJUDPPHG6XEVHTXHQWKFRPPDQGFDQEHRPLWWHG
&/(
&(GRQ¶WFDUH
&(
:(
$/(
&/(
,IVHTXHQWLDOURZUHDGHQDEOHG
&(PXVWEHKHOGORZGXULQJW5 &(GRQ¶WFDUH
&(
5(
$/(
5%
W5
:(
Block Replacement
Over the lifetime of the device additional Bad Blocks may develop. In this case the block has to be replaced by copying
the data to a valid block. These additional Bad Blocks can be identified as attempts to program or erase them will give
errors in the Status Register.
As the failure of a page program operation does not affect the data in other pages in the same block, the block can be
replaced by re-programming the current data and copying the rest of the replaced block to an available valid block.
The Copy Back Program command can be used to copy the data to a valid block.
See the “Copy Back Program” section for more details.
Refer to Table 17 for the recommended procedure to follow if an error occurs during an operation.
67$57
%ORFN$GGUHVV
%ORFN
,QFUHPHQW
%ORFN$GGUHVV
'DWD 1R 8SGDWH
))K" %DG%ORFNWDEOH
<HV
/DVW 1R
EORFN"
<HV
(1'
The Erase and Program Operations are automatically reset when WP goes Low (tWW = 100ns, min). The operations
are enabled and disabled as follows (Figure 34~37)
:(
W ::
:3
5%
:(
W ::
:3
5%
:(
W ::
:3
5%
:(
W ::
:3
5%
H $ $
' %
$ Į /
',(
( &
(
&3
millimeters
Symbol
Min Typ Max
A 1.200
A1 0.050 0.150
A2 0.980 1.030
B 0.170 0.250
C 0.100 0.200
CP 0.100
e 0.500
L 0.500 0.680
alpha 0 5
$
%
'
H
$
$QJOH DOSKD
( $
' & Į
&3
&
millimeters
Symbol
Min Typ Max
A 0.650
A1 0 0.050 0.080
A2 0.470 0.520 0.570
B 0.130 0.160 0.230
C 0.065 0.100 0.175
C1 0.450 0.650 0.750
CP 0.100
D 16.900 17.000 17.100
D1 11.910 12.000 12.120
E 15.300 15.400 15.500
e 0.500
alpha 0 8
'
'
'
)'
6'
)'
H
( ( ( 6(
)(
)(
%$//³FS´
H E
$ $
$
Figure 40. 63-ball FBGA - 9 x 11 ball array 0.8mm pitch, Pakage Outline
NOTE: Drawing is not to scale.
Millimeters
Symbol
Min Typ Max
A 0.80 0.90 1.00
A1 0.25 0.30 0.35
A2 0.55 0.60 0.65
b 0.40 0.45 0.50
D 8.90 9.00 9.10
D1 4.00
D2 7.20
E 10.90 11.00 11.10
E1 5.60
E2 8.80
e 0.80
FD 2.50
FD1 0.90
FE 2.70
FE1 1.10
SD 0.40
SE 0.40
Table 20: 63-ball FBGA - 9 x 11 ball array 0.8mm pitch, Pakage Mechanical Data
Packag M a r k in g E x a m p le
K O R
TSOP1
/ H Y 2 7 x S x x 1 2 X A
USOP
x x x x Y W W x x
- h y n ix : H y n ix S y m b o l
- KOR : O r ig in C o u n tr y
- H Y27xSxx12xA xxxx : P a rt N u m b e r
H Y : H Y N IX
2 7 : N A N D F la s h
x : P o w e r S u p p ly : U ( 2 .7 V ~ 3 .6 V ) , L ( 2 .7 V ) , S ( 1 .8 V )
S : C la s s ific a tio n : S in g le L e v e l C e ll+ S in g le D ie + S m a ll B lo c k
x x : B it O r g a n iz a tio n : 0 8 (x8 ), 1 6 (x1 6 )
1 2 : D e n s ity : 5 1 2 M b it
x: M ode : 1 ( 1 n C E & 1 R / n B ; S e q u e n tia l R o w R e a d e n a b le )
2 ( 1 n C E & 1 R / n B ; S e q u e n tia l R o w R e a d D is a b le )
A : V e r s io n : 2 n d G e n e r a tio n
x : Package T ype : T (4 8 -T S O P 1 ), S (4 8 -U S O P )
x : P a c k a g e M a te r ia l : B la n k ( N o r m a l) , P ( L e a d F r e e )
x : O p e r a tin g T e m p e r a tu r e : C (0 ℃ ~ 7 0 ℃ ), E (-2 5 ℃ ~ 8 5 ℃ )
M (-3 0 ℃ ~ 8 5 ℃ ), I(-4 0 ℃ ~ 8 5 ℃ )
x : B a d B lo c k : B ( I n c lu d e d B a d B lo c k ) , S ( 1 ~ 5 B a d B lo c k ) ,
P ( A ll G o o d B lo c k )
- Y : Y e a r (e x: 5 = ye a r 2 0 0 5 , 0 6 = ye a r 2 0 0 6 )
- w w : W o rk W e e k (e x : 1 2 = w o rk w e e k 1 2 )
- x x : P ro c e ss C o d e
N o te
- C a p it a l L e t t e r : F ix e d I te m
- S m a ll L e t t e r : N o n - fix e d I te m
P a ck a g M a rk in g E x a m p le
K O R
FBGA H Y 2 7 x S x x 1 2 x A
x x x x Y W W x x
- h y n ix : H y n ix S y m b o l
- KOR : O rig in C o u n try
- H Y27xSxx12xA xxxx : P a rt N u m b er
H Y : H Y N IX
2 7 : N A N D F lash
x : P o w e r S u p p ly : U (2 .7 V ~ 3 .6 V ), L (2 .7 V ), S (1 .8 V )
S : C la ssifica tio n : S in g le Le v el C ell+ S in g le D ie+ S m all B lo ck
x x : B it O rg an izatio n : 0 8 (x 8 ), 1 6 (x1 6 )
1 2 : D e n sity : 5 1 2 M b it
x: M ode : 1 (1 n C E & 1 R /n B ; S e q u e n tia l R o w R ea d E n a b le )
2 (1 n C E & 1 R /n B ; S e q u e n tial R o w R e a d D isa b le )
A : V e rsio n : 2 n d G e n eration
x : P acka g e T yp e : F (6 3 F B G A )