Resin Bonds

The resin bond consists of a synthetic resin or synthetic resin combination with or without
fillers. For particular grinding wheel types, applications or different fabrication methods,
there are many resins available. In the case of the dry mix method, phenol resol is used for
the grit wetting as well as a phenol resin powder based on novolak hexamethylenetetramine
[COLL88]. Despite the variety of synthetic resins available today, phenol resins or phenol
plasters are still the most common bond components for grinding wheels bonded with
synthetic resin.
In order to give the bond certain properties, it is customary to modify the phenol resin
powder. Besides variations in the proportion of hexamethylenetetramine, bond hardness and
brittleness can be manipulated by the addition of elastomeric bonds. In this way, wheel speed
can be increased and the danger of crack formation due to large changes in temperature and
pressure loads can be significantly decreased. In this context, particularly polyvinylbutyral,
certain types of rubber and epoxy resins have proved useful. In the case of grinding wheels
reinforced with glass fibre, adhesion to the fibreglass can be improved by means of epoxy
resin modification [COLL88].
Of lesser importance among abrasive products bonded with synthetic resin are bond systems
based on polyurethane, polyester and epoxy resin. In order to achieve particular grinding
effects, like especially soft, smooth grinding or polishing effects, epoxy or polyester resins
are utilised. An extremely high elasticity in the abrasive can be gained by using polyurethane
resin.
When in contact with alkaline cooling lubricants, resin-bonded abrasives show a decrease in
bond strength and hardness, which is attributable to the penetration of water molecules and
particularly OH ions into the interface between the grit surface and the resin bond. To reduce
this influence, grits are pre-treated with special adhesive agents and the wetting and wear
properties of the resin are specifically influenced by a suitable choice of resin system
[COLL88]. When using resin bonded grinding wheels, cooling lubricants mixed with water
should not exceed a pH value of 9 [FRAN88].
Bonds
Grinding wheels manufactured with synthetic resin bonds
• are insensitive to impact or shock as well as lateral pressure,
• allow for high rotational speeds and chipping volumes for abrasive cutters and rough
grinders,
• permit high surface qualities by means of a high elasticity in the case of polishing and
smoothing discs [COLL88].
Consequently, the primary areas of use for grinding wheels bonded with synthetic resin are
abrasive cutting and rough grinding.
Vitrified Bonds
Vitrified bonds are formed by mixtures from the natural silicates red and white clay, kaolin
and feldspar, as well as quartz and, as an additive, frits [HADE66, PADB93].
Frits are glassy, previously melted and pulverised organic and inorganic mixes which serve as
fluxing agents and give the vitrified bond certain properties. Among other things, they help
lower the firing temperature of the bond mixture. For grinding wheels, these mixtures are
composed mostly of boron silicates or glass containing magnesium. Especially with frits
containing boron, the propensity of borax, as in the hard soldering of metals, to form molten
masses with metal oxides at low temperatures (these masses then congealing into glassy state
after cooling) is evident [HADE66].
The usual components and their volumetric portions determine the strength of the bond
bridges. All components are prepared, after checking the raw material, by crushing, milling,
sifting and air sifting. Mixture proportions are varied in accordance with the desired target
properties. The bonds must be attuned to the respective machining conditions and the
abrasive grit material in use. In view of this, we distinguish according to the proportion of the
glass phase in the bond mixture
• fused bonds with a high amount of glass phase,
• bonds with a medium amount of glass phase and
• sintered bonds with a small amount of glass phase.
In fused bonds, grits bonding occurs by means of a glass phase with low viscosity.
In sintered bonds, adhesive force is a result of rearrangement or solid reactions [PADB93].
The sintering and melting points of the bond mixture are essential, characteristic values for
every bond. They determine the firing temperature and the process behaviour of the
abrasives.
Furthermore, the bond should be made to conform to the abrasive’s properties. Certain
sintered corundum materials, for example, are attacked by alkaline silicates. Besides a
diffusion of sodium and silicon in the interior of the grit, crystal 40 3 Structure and
Composition of Grinding Wheels growth transpires when exposed to higher temperatures.
This interferes with the self-sharpening properties of the abrasive grits. Thus, in the case of
sintered corundum, low-alkaline fused bonds with the lowest possible melting point are used.
Should high requirements be placed on the grinding component’s profile accuracy and
dressing capability of the wheel, the hardness and strength of the bond can be enhanced by
increasing the amount of glass phase. Thereby, next to an improvement in the bonding of the
individual grit, a facilitation of the dressing process is achieved [PADB93].
In essence, the properties of ceramic bonds can be summarised as follows:
• brittle and thus comparatively sensitive to impact,
• high elasticity modulus,
• temperature-resistant, yet sensitive to temperature change,
• chemically resistant to oil and water.
Metallic Bonds
Metallic bonds exist in multiple varieties. All metallic bonds exhibit, in contrast to grinding
wheels bonded with resins or vitrified mixtures, an increased level of heat conductivity. The
properties of metallic bonds can be summarised along these lines:
• high resistance to wear,
• difficult to dress, or, in the case of single-layered grinding wheels, not dressable, • high heat
conductivity,
• increase in frictional heat.
Metallic bonds are of particular importance for grinding wheels with superabrasive materials.
This will be further explored in chapter 3.4.2.