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Data Sheet
Description Features
The SFH757 is a low-cost transmitter diode for optical • High speed transmitter for up to 100MBd applications
data transmission with polymer optical fiber. Its InGaAlP (with peaking circuits)
LED chip provides enhanced resistance to humidity and • 2.2mm aperture holds standard 980/1000/2200µm
is designed to emit light at 650 nm. The robust SFH757 plastic fibers
can be used for speeds up to 100 MBd and complements
the Avago SFH250 photodiode receiver and SFH551/1-1 • No fiber stripping required
integrated photo detector receiver. • Molded microlens for efficient coupling
The SFH series is optimized for easy coupling. No fiber
stripping is required; just insert the cut fiber into the Plastic Direct Fiber Connector housing
selected SFH component. (V-housing)
SFH757 • Locking screw attached to the connector
The transparent plastic package has an aperture where a • Interference-free transmission by the light-tight
2.2 mm fiber end can be inserted. This very easy coupling housing
method is extremely cost-effective. • Transmitter and receiver can be positioned flexibly
• No cross talk
SFH757V
• Auto insertable and wave solderable
The V-housing allows easy coupling of unconnectorized
2.2 mm polymer optical fiber with an axial locking screw. • Supplied in tubes
Application Literature
SFH757 SFH757V
AN # Description
Type Ordering Code 5342 General information about the SFH series
SFH757 SP000063871 with Selection Guide and recommendations
regarding System Planning and Mounting
SFH757V SP000063858
5341 Information about Basic and Special Circuits for
Transmitter and Receiver of the SFH series
Package Dimensions
SFH757
8.6 view from A
surface not flat
0.5
7.65
0.6
0.5
A
2.54
1.5
∅ 2.275
28 4.6
5.3
∅ 4.625
Cathode
Dimensions in mm
SFH757V
24.0
13.5 9.0
Cathode
SFH757
component
8.8
4.8
3.5
Dimensions in mm
2
Technical Data
Absolute Maximum Ratings
Parameter Symbol Min Typ Max Unit Notes Figure
Operating Temperature range TC -40 +85 °C
Storage Temperature range Tstg -40 +100 °C
Junction Temperature TJ +100 °C
Soldering Temperature TS +260 °C
(2mm from case bottom, t≤5s)
Reverse Voltage VR 3 V
Forward Current IF 50 mA
Power Dissipation Ptot 120 mW
Thermal Resistance (Junction/Air) RthJA 450 K/W 1
Electrostatic Discharge Voltage Capability ESD 2000 V 1
Electrostatic Discharge Voltage Capability ESD 400 V 2
Notes:
1. ESD Capability for all Pins HBM(Human Body Model) according JESD22-A114
2. ESD Capability for all Pins MM (Machine Model) according JESD22-A115
3
Maximum Forward Current
80 R_ILED
Vcc
100 uF
10 uF
IF - Forward Current (mA)
60
1k Ohm
R thJA = 450 K/W SN75451BD
40 Data In GND 1A Vcc
SFH757
1A 2B
20 1Y 2A
51 Ohm
GND 2Y
0
0 20 40 60 80 100 GND GND
GND
TA - Temperature (°C)
Figure 1. Maximum Forward Current Figure 2. Measurement circuit
-2 2
-4
80
70
60
50
40
30
20
10
0
600 625 650 675 700
Wavelength (nm)
Figure 5. Typical Spectral Emission
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2011 Avago Technologies. All rights reserved. Obsoletes AV01-0717EN
AV02-2597EN - December 1, 2011