DFM

Design For Manufacturing

Fundamentals and Analysis of PCB Design

Focused in Manufacturing

HSIS
Engineering Solutions
M. Castro / F. Briceño
Apr - 2019
DFM / Detalis
Theory and Practice
Using current designs and data from your Company.

 Based in IPC Standards, SMTA and the best industry practices.

 Conducted by 2 instructors.
 Participants: 6 to 9.
 Course duration: 4 days (32hrs).
 Who can attend:
 Design Eng, Product Eng, Project Eng, NPI Eng,
 Manufacturing Eng, Process Eng, Test Eng, Quality Eng, Supplier Qlty Eng.
 Manufacturing Supervisors, Procurement
 Engineering Managers
 Requirements to conduct the practices:
 LapTop PC.
 Gerber Files of 1 or 2 products running or in design process.
 Deliverables:
 Prints of the course (Manual).
 CD, including IPC standards for Design and Acceptability.
 Land Pattern Calculator Software.

HSIS
Engineering Solutions
M. Castro / F. Briceño
Apr - 2019
DFM / Contents
1. Introduction
1.1 The importance of perform DFM in the PCB Design Process.
1.2 PCB’s: types, materials, surface finishing, use and applications.
1.3 SMT & PTH manufacturing process overview.
1.4 PCB fabrication process.
1.5 Quality requirements: IPC, IPC-Jstd-001 and IPC-A-600.
1.6 PCB’s arrays or panels.

2. DFM (Design For Manufacturing)

2.1 Gerber files, structure.
2.2 Gerber files viewers and editors.
2.3 DFM, PCB Design Rules, IPC Design standards application.
2.4 Land Pattern Calculator application.
2.5 DFM, PCBA’s general design rules for assembly.
2.6 DFM for High Speed Boards and RF Boards. Includes terms, definitions and Design Rules.
2.7 DFT, Design for Test introduction.

3. Component Selection
3.1 Component MSL, Temp Sensitive Level, ESD level and Critical components.

4. DFE / DFR. Design For Environment and Design For Reliability.

5. Practice and Applications.

5.1 Practical analysis with products used in the company.
HSIS
Engineering Solutions
M. Castro / F. Briceño
Apr - 2019
 Design

Where DFM is important in the

Design-Production Cycle
Virtual Board
Layout

DFM

Fabrication Assembly Box Build

Bare Board Assembled Board & System

HSIS
Engineering Solutions
M. Castro / F. Briceño
Apr - 2019
Introduction

DFM : Design for Manufacturing, it’s a global term that combines different application
areas.

It’s the process to assure that a Design can be manufactured consistently good for the
supply chain (not only the PCB fabricator) with zero defects tendency, using the best cost
and time.

Application areas:
• DFM - Design For Manufacturability o Manufacturing (includes PCB fabrication DFF and SMT, PTH and
Box Build manufacturing).
• DFT - Design For Testability or Test.
• DFA – Design For Assembly (used for Mechanical Assemblies).
• DFS - Design For Service (used to facilitate servicing products).
• DFR - Design For Reliability.
• DFC - Design For Cost.
• DFE – Design For Environment (green technologies).
• DFU - Design For Usability.

It’s also known as DfX, where X means “eXcellence” that uses all application areas.

But it’s best knowing as DFM.

HSIS
Engineering Solutions
M. Castro / F. Briceño
Apr - 2019
 About the trainers
Mauricio Castro G.
mcastro@hsis.com.mx
Phone: (+521)(33) 3349-1360
 More than 30 years of experience in the Electronics Industry.
 IBM de México, Molex de México and HSIS.
 Degree in Electronics Engineering by ITESO in Guadalajara (Instituto Tecnológico y de Estudios Superiores de Occidente).
 DFM Consultant and Trainer, Test Engineering, Supplier Quality, Supplier Certifications, Supplier Auditor, NPI's and PCB
Design.

Francisco Briceño
briceno@hsis.com.mx
Phone: (52)(33) 1665-4766
 With 28 years of experience in the Electronics Industry in Plants as Temic Daimler-Benz.
 Philips Telecommunications-TSP, Molex de México, Continental Automotive and HSIS-Engineering Solutions.
 Degree in Electro-Mechanical Engineering by IPN (Instituto Politécnico Nacional) in México City.
 Master Degree in Engineering of Materials by IPN (Instituto Politécnico Nacional) in México City.
 Dipl. in SMT Process Design by THI (Technische Hochschule Ingolstad) in Germany.
 Dipl. in Soldering in Electronics by MIT (Massachusetts Institute of Technology) in Boston MA.
 Certified as Black Belt by ITESM (Instituto Tecnológico de Estudios Superiores de Monterrey).
 Certified as IPC Master Trainer in IPC-A-610, IPC-JStd-001 and IPC-7711/21.
 Member of IPC-610 Task Group (7-31b).

Guadalajara office: Rejoneador 6845, Hacienda del Tepeyac, Zapopan Jalisco, 45053. Tel (33) 3125-3525
Querétaro office: Av. El Mirador de Querétaro No. 12 int. 60, Fracc. El Mirador, El Marqués, Querétaro.

HSIS
Engineering Solutions Pag 6
M. Castro / F. Briceño
Apr - 2019