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SERVICE MANUAL

InfinixEX572
AR
W
RM
FI
SY
Photograph Features Description

EA
A1 BOM Southeast Asia:
GSM : 850/900/1800/1900
WCDMA: B1/B5/B8
LTE(TDD&FDD):
FDDLTE: B1/B3/B5/B7/B8 /B20
TDD LTE:B38/ B40
Band
B1 BOM Latin America:
GSM : 850/900/1800/1900
WCDMA: B1/B2/B4/B5
LTE(TDD&FDD):
FDD LTE: B2/B3/B4/B7/B28b

Display 5.7 HD 1080*1920

Back CAM: 13.0 MP PDAF


CAM
Front CAM:8.0MP FF

MT6753
Processor
Octa-core Cortex1.3GHz
Memory 16GB ROM + 2GB RAM

Charging
3A
Current

Battery 4300mAh

SIM: Dual micro card


SIM/TF/USB TF : Support MAX 128GB
USB: USB 2.0

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The basic repairing rules of X572 product


Material
Main Materials Repair or not
Type
Key SMT material such as CPU,
R E
Repair if you are authorized
PMU, Flash, TVS A
W
Soldering material such as CAM,
RM Repair if you are authorized
Main Board
SPK, MOT FI
S Y
SIM Slot, SD Slot, B2B Slot. Repair if you are authorized

E A
USB CON, Earphone CON, BAT
Repair if you are authorized
CON

Sub Board USB CON, MIC, TVS Repair if you are authorized

3 in 1 TP&LCD&uphousing No repair, just change it.

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Table of contents
Page
1. INTRODUCE.................................................................................................................................................... 4
2. ESD PROTECTION ......................................................................................................................................... 5
3. EXPLODED VIEW ........................................................................................................................................... 6
4. ACCESSORIES ............................................................................................................................................... 7
5. PCBA MAINBOARD & SUB BOARD COMPONENTS .................................................................................. 8
6. MATERIAL BOM ........................................................................................................................................... 10
7. R E
PCBA BOM ................................................................................................................................................... 11
A
8.
W
SERVICE DEVICES ...................................................................................................................................... 12
9.
RM
SOFTWARE UPDATE ..................................................................................................................................
I
13
10. F
DISASSEMBLY INSTRUCTIONS ................................................................................................................. 14

S Y
11. 3 IN 1 DISASSEMBLY .................................................................................................................................. 19

E A
12. NETWORK AND CALL FUNCTION TEST ................................................................................................... 20

Change History
Author Version Status Date Remarks
Wang bo V1.0 Release 2017-7-4 First version

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1. INTRODUCE

The purpose of this document is to help Carlcare Service Center workshop technicians to carry out service to
products. This Service Manual content of it is confidential.

While every endeavor has been made to ensure the accuracy of this document, some errors may exist.
If you find any errors or if you have further suggestions, please notify Carlcare using the address below:
Mailto: technical.support@carlcare.com

Please keep in mind also that this documentation is continuously being updated and modified, so watch always
out for the newest version.
R E
A
Warnings and cautions W
R M
F I
Please refer to the phone’s user guide for instructions relating to operation, care and maintenance including
Y
important safety information. Note also the following:
S
Warnings
E A
1. Service center must be taken on installation in vehicles fitted with electronic engine management
systems and anti–skid braking systems (ABS). Under certain fault conditions, emitted RF energy
can affect their operation. If necessary, consult the vehicle dealer/manufacturer to determine the
immunity of vehicle electronic systems to RF energy.

2. The hand portable telephone must not be operated in areas likely to contain potentially explosive
atmospheres, EG petrol stations (service stations), blasting areas etc.

3. Operation of any radio transmitting equipment, including cellular telephones, may interfere with the
functionality of inadequately protected medical devices. Consult a physician or the manufacturer of
the medical device if you have any questions. Other electronic equipment may also be subject to
interference.

Cautions

1. Servicing and alignment must be undertaken by qualified personnel only.


2. Ensure all work is carried out at an anti–static workstation and that an anti–static wrist strap is worn.
3. Use only approved components as specified in the parts list.
4. Ensure all components, modules screws and insulators are correctly re–fitted after servicing and
alignment.
5. Ensure all cables and wires are re-positioned correctly.

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2. ESD PROTECTION

Carlcare requires that service points have sufficient ESD protection (against static
electricity) when servicing the phone.

Any product of which the covers are removed must be handled with ESD protection. The
SIM card can be replaced without ESD protection if the product is otherwise ready for use.

To replace the covers ESD protection must be applied.

All electronic parts of the product are susceptible to ESD. Resistors, too, can be damaged
by static electricity discharge. R E
A
W
RM Area (EPA).
All ESD sensitive parts must be packed in metallized protective bags during shipping and
handling outside any ESDIProtected
F
S Y
Every repair action involving opening the product or handling the product components must
A
be done under ESD protection.
E
ESD protected spare part packages MUST NOT be opened/closed out of an ESD Protected
Area.

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3. EXPLODED VIEW

Attention: No repairing on the TP/LCD and uphousing

17201390 12102602 17201429 21101852 21101852


19101087 19501029 12201650
Front Main Back Sensor Back
RF Cable Receiver Battery cover
camera board camera rubber housing

R E
A
W
R M
FI
S Y
EA

23001419 23502013 23001420 23701147


19301031 12102565 19401107 25001251
Main Finger Speaker Steel sheet for
Vibrator Sub board Speaker Battery
board print frame PFC battery protector

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4. ACCESSORIES

Attention:This shielding cover can be replaced


when we change the main board.

R E
A
W
R M
FI
S Y
E A

Attention:There are black points around the


Attention: A silk is around the screw hole. This is
screw hole on the battery steel, this point you
to show that you need to put the screw into it.
must put M1.4*L2.5 screws.

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5. PCBA MAINBOARD & SUB BOARD COMPONENTS

Earphone jack
Sensor (U6302) (J6001)

Back camera
connector (J6201)
4 in 1 (U5001)

R E RF transceiver IC
A (U3001)
W
EMMC
R M
(U4001)
FI RF PA (U3201)

S Y
E A
PMU (U2101) LCD LED driver IC
CPU (U1001)
(U2301)

CTP Connector
(U2303)

Front camera FPC Back camera FPC


connector (J6202) connector (J6505)

SD card slot (J6501) Flash LED driver


IC (U2304)

Charge IC (U2202)
RF 3&4G PA
(J6504)

LCD Battery Main FPC


LTE PA
connector connector connector
(U3101)
(J6101) (J2201) (J6401)

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OVP IC over voltage


protection(U102)

R E
A
W
RM
FI
USB (J101) MIC (MIC101)

S Y
EA

TVS (D101)

Finger print Main FPC


connector (J104) connector (J102)

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6. MATERIAL BOM
Pls get the official BOM from the Material Team. The picture you can get from the 3.EXPLODED VIEW and 4.
Accessories.

SAP Description(Chinese) Description(English)


CODE
1200476 单机头_Infinix_X572_H5312_C1_冰川蓝 dev Infinix X572 H5312 C1 blue 16+2 N
8
1760016 指纹模组(SW9362T)_X572_黑色_Holitech
_16+2_N_D05 FM(SW9362T) X572 Black Holitech
6
1940110 SPK_1115_SPR_H3.0_铝膜_RoHS_HS SPK 1115 SPR H3.0 RoHS HS
7
1950102 REC_1206W_H23_宽频_高 REC 1206W H23_SPL ROHS 20mW AAC
9
1930103 SPL_ROHS_20mW_AAC
MOT_COIN_1020_L12_H_JX_带导电胶 MOT COIN 1020 L12 H JX Conductive Fabric
1
2500125 BAT_Infinix_BL_42AX_4200mAh_ATL_IN BAT Infinix BL 42AX 4200mAh ATL IN
1
1720139 CAM_8M_3H7_X571_Front_ST
R E CAM 8M 3H7 X571 Front ST
0
1720142 CAM_13M_3L8_X572_Back_Ofilm A CAM 13M 3L8 X572 Back Ofilm
9
1910108 同轴线_X572_RoHS W coaXial cable X572 RoHS
7
2300141 RM FPC for side key X572
FI
FPC_侧键_X572
8
2300141 FPC_大小板_X572 FPC for main sub PCB X572
9
2300142
0
FPC_喇叭_X572
S Y FPC for speaker X572
前闪光灯罩_X572
A
2350201 front flash lens X572
2
2350200
8
2350200
耳机座硅胶套_X572
指示灯胶套_X572
E Ear jack rubber X572
Led rubber X572
9
2350201 光距传感器胶套_X572 light sensor rubber X572
0
2350201 前摄像头胶套_X572 front cam rubber X572
1
2340000 机械螺钉 M1.4*L2.5*D2.5*H0.5_银色_打防松胶 Screw M1.4*L2.5*D2.5*H0.5 silver glue
2
2320157 后摄像头镜片_X572 back cam lens X572
5
2330323 前壳 USB 密封泡棉_14.05*6.03*0.5_X572 usb seal foam 14.05*6.03*0.5 X572
7
2330323 耳机座密封泡棉_12.21*7.85*0.83_X572 audio jack seal foam12.21*7.85*0.83 X572
8
2330323 前摄接地导电布_11.82*6*0.1_X572 cam conductive fabric 11.82*6*0.1 X572
9
2330324 电池易拉胶_73.9*10_X572 Battery Adhesive 73.9*10 X572
3
2330324 听筒后音腔密封泡棉_12.8*0.9*0.3_X572 receive seal foam 12.8*0.9*0.3 X572
5
2370114 电池保护钢片组件_X572 steel sheet for batter cover X572
7
2350201 指纹模组支架组件_X572 fingerprint frame X572
3
2380010 防水贴_3mm_RoHS Waterproof_label RoHS
5
2380004 易碎标贴_D2.8mm_RoHS Fragile_Label_diameter2.8MM_ROHS
8
2380005 IMEI 码标贴_40*34mm_RoHS Dual_IMEI_code_Label_40*34MM_RoHS
0
2340111 机械镙钉 M1.4*L3.5*D2.5*H0.5_银色_打防松胶(红 screw M1.4*L3.5*D2.5*H0.5silver red glue
4
2330337 色) 屏蔽罩散热片_40*30*0.05_X572
4G 4G heat radiation film 40*30*0.05 X572
1
2330337 CPU 散热_65*18*0.05_X572 CPU heat radiation 65*18*0.05 X572
2
2360171 TP 卖点护膜_Infinix_X572_RoHS TP selling point protector film X572RoHS
6
1220146 预加工组件_面壳+LCD+CTP_X572_黑色 Preformed uphousing+LCD+CTP X572 black
5
1740128 组合件(CTP+LCM)_X572_H5312 _黑色 Module(CTP+LCM) X572 H5312 Black RoHS V1
1
2100170 _RoHS_V1
面壳组件_X572_黑色 uphousing X572 black
1
2330324 指纹模组缓冲麦拉_18.8*9.5*0.1_X572 fingerprint mylar 18.8*9.5*0.1 X572
2
2110185 底壳组件_X572_冰川蓝 lowhousing X572 ice blue
2
2350200 喇叭天线支架组件_X572_冰川蓝 speaker antenna frame X572 ice blue
6
1210260 PCBA_MB_H5312_C1_16GB+16Gb_V1.2_自制 PCBA MB H5312 C1 16GB+16Gb V1.2
2
1210256 PCBA_SUB_H5312_2_A_V1.0_自制 PCBA SUB H5312 2 A V1.0
5
2380218 配置贴纸_Infinix_X572_16+2GB_RoHS configuration label Infinix X572 RoHS
4
2520002 耳机_INFINIX_3.5MM_EW_31AX_WWD_美标 Earphone_INFINIX_3.5MM_EW_31AX
3
2530000 USB 数据线_Infinix_XL502_5Pin_RoHS USB_cable_5PIN_XL52_ROHS
5
2510112 充电器_Infinix_欧规_USB_CQ_18AX_RoHS/CE Charger Infinix EU USB CQ 18AX RoHS/CE
2
1220165 预加工组件_电池盖+护膜_X572_冰川蓝 PF batterycover ptotector X572 ice blue
0
2120209 电池盖组件_X572_冰川蓝 battery cover X572 ice blue
2
2360171 电池盖贴膜_Infinix_X572_RoHS battery cover protector film X572 RoHS
7
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7. PCBA BOM
Pls get the official BOM from the Material Team. The picture you can get from the 5. PCBA MAINBOARD
COMPONENTS.

SAP code Description Placement


12102602 PCBA_MB_H5312_C1_16GB+16Gb_V1.2
15600056 IC_CPU_MT6753V/WAHH U1001
15700031 PMU-5BUCK&28LDOs,VFBGA205,H1.0 U2101
14401091 IC-Charger,5A/4.425V,2.4A-OTG,P-P,H1.0 U2202
14601021 IC-LED-Driver,39V,250mA,duty1%,SOT,H0.9 U2301
14401093 IC-DC/DC Converter,2.26*1.36*0.68 U2302
14401050 LDO-2.8V/200mA,UTDFN1*1,H0.6
R E U2303,U2305
14601115
A
IC-LED Driver,3CH-0.5/1/1.5A,WLCSP,H0.67 U2304
15700032 IC_TS_MT6169V/AT
W U3001
14801165 M
IC-DUP,W/FL-B1,1.8*1.4*0.6,D6RB2G140E1AL
R
U3202

FI
14801043 IC-DUP,W/FL-B3,1.8*1.4*0.6 U3205
14801202
14801135
S Y
IC-DUP,W/FL-B5,1.8*1.4*0.6
IC-DUP,W-B8,D5RB942M5E1CF
U3208
U3210
14801239
14301111 E A
SAW-RX-B8,1.1*0.9*0.5
IC-SW,SP8T-3.0GHz,2*2*0.6
U3306
U3301
14801232 SAW-RX-B1/B4,1.1*0.9*0.5 U3302
14801235 SAW-RX-B3,1.1*0.9*0.5 U3303
14801236 SAW-RX-B5,1.1*0.9*0.5 U3304
14801243 SAW-RX-B40,1.1*0.9*0.5 U3309
14201147 IC-eMMC+LPDDR3,16GB+16Gb,H1.0 U4001
15700028 IC-WIFI BT FM,GPS,QFN40,5.0*5.0*0.85 U5001
14801119 IC-SAW-GPS/BD/GLON-Unbal,1.1*0.9*0.5 U5002
14801172 IC-LNA-GPS,1.5*1.0*0.75 U5003
14801090 IC-BAW-WB&B7-CO-Unbal,1.4*1.1*0.4 U5004
14801041 IC-TRIP,W/B/G,2*1.25*1 U5005
14701019 IC-AMP,AB/D CLASS,0.65W/0.85W,H0.6 U6001
14501059 IC-PS&ALS&LED sensor,4.94*3.36*3.55 U6302
14401080 IC-Hall,Npole,1.8V,B0P:-3.0mT,H0.6 U6303
14501051 IC-Gyro+Gsensor,6axis,16bit,LGA14,2.5*3.0*0.88 U6306
15001078 Filters-Common,2CH,0.87*0.67*0.52 F6101,F6102,F6103,F6104,F6105,F
15001075 Schottky-VF:0.5V,1A,40V,SOD323,H1.0 6201,F6202,F6203,F6204,F6205,F6
D2301
15001066 BJT-NPN,Vce:50V,Ic:100mA,Hfe:80,R2,MT3 206,F6207,F6208,F6209,F6210
Q6401
14601153 LED-RGB,VF=3.1@10mA,VR=5V,1.0*1.0,H0.75 LED6401
15201094 BTB,H0.6,PLUG,3.57*2*0.5,6PIN,SMK J2201
15201036 RF-COAXIAL,2.0x2.0x1.0,ECT J3201,J3301
15201023 USS RF CONN,T/H1.3,2.0x2.0x0.7,ECT J3202
15301334 JACK,B/S,-2.45,11.5x7.1x4.3,5pin,LETCON J6001
15201110 BTB,T/H=0.6,7.7x2.0x0.58,30PIN,MOLEX J6101,J6201,J6202,J6401
15201101 BTB,T/H=0.8,WH,4.5x2.58x0.79,10PIN,ACON J6102
15301257 SIM,S MICRO,12.45x14.4x1.27,9PIN J6504,J6505
14801131 IC_HB_Balun,0.6*0.5*0.4 U3207
14301119 IC-PA,MMMB-C/T/W/L,4.0* 6.8*0.8 U3101
14301118 IC-TXM,QB-G/G/E/T/TL+10TRX,5.5*5.3*0.8 U3201
14801234 SAW-RX-B2,1.1*0.9*0.5 U3204
14801230 IC-SAW-TRX-UnBaL-B40,1.35*1.05*0.5 U3102
14501072 IC-Compass,3AXIS,16bit,BGA8,H0.76 U6305

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8. SERVICE DEVICES

Micro USB Cable Computer Battery

Tools for
Upgrade

R E
A
W
RM
Warped rods
FI Disassemble Piece Soldering Iron

S Y
EA

Phillips Screwdriver ESD Tweezers Hot Gun

Tools for
Disassemble
and
Assemble

Disassemble Piece
Card Pin

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9. SOFTWARE UPDATE

Service
Software Micro USB Cable

R E
A
W
RM
FI
S Y
EA

Driver: Driver_Auto_Installer_EXE_v5.1524.03
Please keep
Download tool: Softwaredownloadv3.17XX.XX.XX_for_AfterSales the battery
enough power
IMEI write tool: AfterSalesFull_20170518

Engineering Mode: *#87#

Factory Mode: *#9646633#

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10. DISASSEMBLY INSTRUCTIONS


1.Infinix X572 dis-assembly. 2. You need Phillips Screwdriver, ESD tweezers,
Disassemble Piece,Warped rods,Hot gun,Card pin

R E
A
W
RM
FI
S Y
EA
3. Release the battery cover as shown. 4. Unscrew the 14 M1.4*L3.5 and 6 M1.4*L2.5 screws.

M1.4*L2.5 M1.4*L3.5

5. Remove the steel sheet for battery protector. 6. Use disassemble piece release the back housing
as shown.

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7. Release the back housing as shown. 8. Release the back housing as shown.

R E
A
W
RM
FI
SY
9. Release back housing as shown. 10. Release the back housing as shown.

EA

11. Remove the back housing. 12. Remove the 4G heat radiation film.

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13. Release the battery FPC. 14. Release the LCD FPC connector.

R E
A
W
RM
FI
SY
15. Release the main FPC connector. 16. Release the RF cable.

EA

17. Use the heat gun (100℃) to heat the sub board 18. Remove the speaker.
about 60s before we remove it.

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19. Remove the battery adhesive as shown. 20. Remove the battery.

R E
A
W
RM
FI
S
21. Unscrew the 2 M1.4*L2.5 screws. Y 22. Use the heat gun(120℃)to heat the CTP FPC

EA about 60s.

23. Release the CTP FPC. 24. Remove the main board, pay attention to remove
the rubbers and the RF cable.

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25. Remove the front and back camera. 26. X572 dis assembly is completed.

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11. 3 IN 1 DISASSEMBLY

No repairing on the 3 IN 1.

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12. NETWORK AND CALL FUNCTION TEST


o Insert a SIM card into the tested cell phone, and make sure the network function of SIM card has been opened.
o Long press the power button to switch on the mobile phone.
o Checkwhether the signal of the network is in good order.
o Dial a fixed telephone number.
o Check the quality of network through the calling.
o If there have any problemaboutthe network or the quality of calling, please send the phone to repair in our factory.
o End the test both of the network and call.

…………….END……………

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