Question bank - 6thsem

THE OXFORD COLLEGE OF ENGINEERING

Hosur Road, Bommanahalli, Bengaluru-560 068

DEPARTMENT OF MECHATRONICS ENGINEERING

Mission and Vision of the Department

VISION
To develop the Mechatronics Engineering Department as a leading educational and research
department with innovation in the design and development of electro-mechanical systems,
intelligent machines and products.

MISSION

To provide an outstanding education in Mechatronics Engineering with a rich diversity

M1.
of skills.

M2. To contribute to the community prosperity through professional services and research.

To prepare graduates with ability to engage in life-long learning and capable of

M3. carrying out engineering practice with competence. 

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Question bank - 6thsem

CONTENTS

SL.NO SUBJECT NO PAGE NO

1 PROCESS INSTRUMENTATION 3-6

2 RAPID PROTOTYPING 7-13

3 PLC AND SCADA 14-18

ARM BASED SYSTEM DESIGN

4 19-23

5 POWER ELECTRONICS 24-27

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Question bank - 6thsem

Process Instrumentation
[As per Choice Based Credit System (CBCS) scheme]
SEMESTER – VI
Subject Code 17MT662 IA Marks - 40
Number of Lecture Hours/Week 03 Exam Marks- 60
Total Number of Exam Hours 03
Lecture Hours 40 CREDITS – 03

Course objectives:
Students will be able to
· Gain the Knowledge of basic principles of transducers systems.
· Understand the significant material on important specific areas such as pressure, temperature,
measurement,
Heat-flux sensors, flow meters etc.
· Use the Instrumentation & Controls for various industrial applications.

Module -1
Generalized Configuration, Functional Description & Performance Characteristics Of
Measuring Instruments: Functional elements of an instrument: analog & digital modes of
operation: null & deflection methods: I/O configuration of measuring instruments & instrument
system- methods of correction for interfering & modifying inputs.
Measurement Of Displacement: Principle of measurement of displacement, resistive
potentiometers, variable inductance & variable reluctance pickups, LVDT, capacitance pickup.

Module -2
Measurement Of Force, Torque & Shaft Power: Principle of measurement of Force, Torque,
Shaft power standards and calibration: basic methods of force measurement; characteristics of
elastic force transducer- Bonded strain gauge, differential transformer, piezo electric transducer,
variable reluctance/ FMOscillator digital systems, loading effects; torque measurement on
rotating shafts, shaft power measurement (dynamometers).

Module -3
Temperature Measurement: Standards & calibration: thermal expansion me bimetallic
thermometers, liquid-in-glass thermometers, pressure thermo thermoelectric sensor
(thermocouple)- common Thermocouples, reference ju consideration, special materials,
configuration & techniques; electrical resistance se conductive sensor (resistance thermometers),
bulk semiconductors sensors (thermi junction semiconductor sensors; digital thermometers.

Module -4
Pressure Measurement: Standards & calibration: basic methods of pressure measurement;
dead weight gauges & manometer, manometer dynamics; elastic transducers, high pressure
measurement; low pressure (vacuum) measurement- McLeod gauge, Knudsen gauge,

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Question bank - 6thsem

momentum-transfer (viscosity) gauges, thermal conductivity gauges, ionization gauges, dual

gauge technique.

Module -5
Flow Measurement: Local flow velocity, magnitude and direction. Flow visuali Velocity
magnitude from pitot static tube. Velocity direction from yaw tube, pivoted vane, served sphere,
dynamic wind vector indicator. Hot wire and hot film anemometer. Hot film shock-tube velocity
sensors.

Course outcomes: On completion of the course students will

CO1: have the knowledge of design instruments with good precision and Calibrate the designed
instruments.
CO2: understand measurement as applied to research & development operations & also to
monitoring
& control of industrial & military systems & processors.
CO3: illustrate the various applications in the field of DCS & SCADA .

Graduate Attributes (as per NBA):

Question paper pattern:

 The question paper will have TEN questions.
 Each full question consists of 16 marks.
 There will be 2 full questions (with maximum of FOUR sub questions) from each
module.
 Each full question will have sub questions covering all the topics under a module.
 The students will have to answer 5 full questions, selecting one full question from each
module.

TEXT BOOKS:
1. Measurement systems application and design- ERNEST O DOEBELIN, 5th Edition Tata
McGraw Hill.

Reference Books:

1. Instrumentation Devices & Systems- Rangan, Mani and Sharma 2nd Edition, Tata McGraw
Hill.
2. Process Instruments & Controls Hand Book Considine- D.M. Mc Graw Hill.
3. Transducers & Instrumentation- DVS Murthy, Prentice Hall of India.
4. Instrumentation & Process Measurements- W.Bolton,Universities Press.

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Question bank - 6thsem

Process Instrumentation
[As per Choice Based Credit System (CBCS) scheme]
MODULE 1

1. What is measurement system? Explain functional element of an instrument.

2. With neat block diagram explain generalized input and output configuration.
3. Explain a) analog and digital modes of operation, b) null and deflection methods
4. Explain the methods of correction for interfacing and modifying inputs.
5. Explain the method of opposing input in details
6. Write a short note on resistive potentiometer.
7. Explain a) variable inductance and variable reluctance pickups, b) capacitive pickups.
8. Explain generalised input-output configuration with neat block diagram.
9. Explain active and passive transducer.
10. Explain variable reluctance accelerometer.

MODULE 2

11. Define Dynamometer. Explain with a neat sketch the working of dynamometer.
12. Explain the basic methods of force measurement with neat figure.
13. Explain the shaft power measurement with relevant figures
14. Explain torque measurement on rotating shafts with relevant diagrams.
15. Explain bonded strain gauge transducer with neat diagram.
16. With a neat diagram explain the characteristics of elastic force transducer.
17. Explain a) variable reluctance, b) loading effects
18. Explain piezo electric transducer with neat diagram.
19. Explain torque measurement on rotating shaft for feedback torque sensor

MODULE 3

20. Explain the 5 laws of thermocouple behavior.

21. With the neat diagram explain conductive sensor.
22. Explain junction semiconductor sensor and its applications.
23. Explain bulk semiconductor sensor and digital thermometer.
24. With a neat diagram explain reference junction.
25. Explain Pressure thermometer with neat sketch.
26. with relevant equations and diagram explain thermo electric sensors.

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27. Explain Thermal conductivity gauge taking thermocouple gauge as one of its type with
neat diagram.

MODULE 4

28. Explain manometer as an input /output configuration of measurement instrument.

29. Explain ionisation guage with neat diagram and equation.
30. Explain dead weight gauges with neat diagram and equation for guage pressure.
31. with relevant equation and diagram explain Mc Lead gauge.

MODULE 5

32. Explain with neat diagram hot film schock tube velocity sensors
33. Explain the velocity magnitude from pitot static tube along with possible source of error
present.
34. Explain dynamic wind vector indicator?
35. Explain Velocity direction from yawtube, pivoted vane and served sphere?
36. Explain Local flow velocity magnitude and direction.
37. Explain Flow visuali Velocity magnitude from pitot static tube.
38. Explain Velocity direction from yaw tube, pivoted vane, served sphere, dynamic wind
vector indicator.
39. Explain Hot wire and hot film anemometer with diagram
40. Explain Hot film shock-tube velocity sensors with diagram.

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Question bank - 6thsem

RAPID PROTOTYPING
(As per Choice Based Credit System (CBCS) scheme)

SEMESTER –VI

Subject Code 17MT652 IA Marks 40

Number of Lecture 03 Exam Marks 60
Hours/Week
Total Number of 40 Exam Hours 03
Lecture Hours
Credits – 03
Course Objectives: Students will be able to
1. gain knowledge of selective Laser Sintering, Fusion Deposition Modeling Solid Ground
Curing, 3D Printers,
2. understand the working Principles of various Rapid Prototyping Manufacturing process,
3. know the applications of RP Technology

MODULE 1:
Introduction: Need for the compression in product development, history of RP systems, Growth
of RP industry, and classification of RP systems.

Stereo Lithography Systems: Principle, Process parameter, data files and machine details,
Application. MODULE 2

Fusion Deposition Modelling: Principle, Process parameter, Path generation, Applications.

Solid Ground Curing: Principle of operation, Machine details, Applications. Laminated object
Manufacturing: LOM materials. Application.

MODULE 3

Selective Laser sintering: Type of machine, Principle of operation, process parameters, Data
preparation for SLS, Applications. Thermal jet printer, 3-D printer.

MODULE 4

Rapid Tooling: Indirect Rapid tooling, Silicon rubber tooling, Aluminium filled epoxy tooling,
Spray tooling, 3Q keltool, etc. Direct Rapid Tooling, Quick cast process, Sand casting tooling,
Laminate tooling soft Tooling vs. Hard tooling.

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Question bank - 6thsem

MODULE 5

Software for RP: STL files, pverview of Solid view, magics, imics, magic communicator, etc.
Internet based software

Rapid Manufacturing Process Optimization: factors influencing accuracy. Data Preparation

errors, Part building errors, Error in finishing.

Course Outcomes:
On completion of course students will

CO 1: have fundamental knowledge of Rapid Prototyping process, Selective Laser Sintering,

Fusion Deposition Modeling, Solid Ground Curing, 3D Printers, Rapid Tooling, Software and
Errors.

CO 2: understand the working Principles of Selective Laser Sintering, Fusion Deposition

Modeling Solid Ground uring, 3D Printers,.

CO 3: Know the applications of Selective Laser Sintering, Fusion Deposition Modeling, Solid
Ground Curing, 3D Printers, also software tools like Magic, MMIC.

Graduate Attributes(as per NBA):

Question paper pattern:

 The question paper will have TEN questions.

 Each full question consists of 16 marks.
 There will be 2 full questions(with maximum of FOUR sub questions) from each module.
 Each full question will have sub questions covering all the topics under a module.

The students will have to answer 5 full questions, selecting one full question from each module

Text Books:
1. Stereo Lithography and other RP & M Technologies, Paul F.Jacobs: SME, NY 1996.
2. Rapid Manufacturing, Flham D.T & Dinjoy S.S Verlog London2001.

Reference Books:
1. Rapid Prototyping, Terry Wohlers Wohler’s Report 2000”Wohler’s Association 2000.
2. Rapid Prototyping Materials, Gurumurthi, IIScBanglore.
3. Rapid Automated, Lament wood. Indus press New York

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Question bank - 6thsem

RAPID PROTOTYPING
17MT562

MODULE-1

1. With a neat sketch explain principle and working of stereo lithography system.
2. What are the different steps for developing a product with rapid prototyping process?
3. Explain the basic process in RP technology.
4. Explain the classification of RP system, explain any two RP system.
5. Explain the growth of rapid prototyping industry.
6. Explain the applications of rapid prototyping.
7. Discuss in detail, the classification of RP system. June/july2013
8. Discuss the principle behind SLA process and also discuss the various applications of
SLA process.
9. Name any two photosensitive resins used in SLA process.
10. Explain the time compression engineering (TCE), with the help of block diagram.
11. Explain the working principle of stereo lithography process, with a neat sketch.
12. Define rapid prototyping. Classify different methods.
13. Explain basic process in rapid prototyping technique.
14. What are the different build styles used to create stereo lithography parts? Explain with
sketches.
15. What are the types involved in data preparation

MODULE-2

1. Explain with a neat sketch principle of operation of fused deposition modeling.

2. List the various process parameters that effect the performance and functionalities of
FDM process.
3. Describe the FDM process, with a neat sketch.
4. What are advantages and disadvantages of FDM process?
5. Explain the path generation of FDM.
6. What is the working principle of fused deposition modeling? Explain with a neat sketch.
7. With neat sketch explain the principle operation and construction of SGC technique.

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Question bank - 6thsem

8. With the neat sketch explain Laminated Object Manufacturing (LOM).

9. Explain the neat sketch SGC (solid ground curing).
10. Explain the applications of SGC (solid ground curing).
11. Explain the LOM materials (Laminated object manufacturing materials).
12. With the neat sketch, explain the laminated object manufacturing process and also list the
applications of LOM.
13. What do you understand by solid curing process? Explain with neat sketch.
14. What are various LOM materials and their typical applications? State any four important
applications of LOM process.
15. Describeoperational principle of SGC illustrating data flow and process.
16. With a neat sketch explain the features of laminated object manufacturing.
17. Explain the following terms in solid ground curing
i) Data representation
ii) Mask generation
iii) Model making

MODULE 3

1) With a neat sketch explain the following concept modelling technique

a) 3D printer
b) Sander’s model marker
c) thermal jet printer
d) object Quadra systems.
2) Explain with neat sketch 3-D Printer.
3) Explain with the neat sketch the working principle of thermal jet Printer.
4) What are the applications of 3-D Printer?
5) Write a brief note on object Quadra system.
6) Explain the importance of concept modelers employing JP system 5 with a neat sketch.
7) What area concept modelers? What are its advantages? Name any four concept modelers
apart from JP system 5.
8) Explain the steps involved in fabrication of models employing JP system 5. Drawthe sketch
of process steps.

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Question bank - 6thsem

9) What are concept modelers? What are their advantages? Name four concept modelers.
10) Explain different steps involved in fabrication of a model using JP system 5. Draw a neat
sketch.
11) Explain the concept of 3-D printing. What is object Quadra system?
12) Sketchand describe the setup of a 3-D printing unit. What are the standard makes available in
the market?
13) With neat sketch, explain selective laser sintering
14) Explain the data preparation of SLS (selective laser sintering).
15) Which are the applications of SLS technology.
16) Explain with a neat sketch SLS (selective laser sintering) principle of operation.
17) List the types of SLS (selective laser sintering) machines.
18) What are advantages and disadvantages of SLS process?
19) Describe the specifications of selective laser sintering unit.
20) Compare the selective laser sintering process with other equivalent processes.

MODULE 4

1) With a neat sketch, explain the following rapid tooling processes

a) Silicone rubber tooling
b) Aluminum filled epoxy tooling
c) 3Q keltool
2) Compare Direct rapid tooling with Indirect rapid tooling.
3) Explain:
a) Silicon Rubber Tooling.
b) Spray metal tooling.
4) Explain the role of indirect methods in rapid tool production.
5) Compare rapid tooling with conventional tooling.
6) How are inserts produced using 3D KELTOOL process? Explain.
7) With neat sketches, explain the different steps involved in vacuum casting process, used for
producing silicon rubber tools.
8) Classify direct rapid tooling methods.
9) With sketches explain spray metal deposition technique.

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Question bank - 6thsem

10) What are ACES injection moulds (AIM)? Describe its features.
11) With neat sketch, explain copper polyamide tooling technique and laminate tooling
technique.
12) Write the difference between soft tooling and hard tooling.
13) Explain the requirements that must be followed during STL file generation.
14) What is quick cast process? Explain with neat sketch.
15) How do you make investment casting through quick cast process? Explain, with neat
sketches.
16) Explain briefly the sand cast tooling process.
17) What is soft tooling? Compare it with hard tooling.

MODULE 5

1) Explain magics rapid prototyping and what are its features.

2) Write short notes on:
i) Overview of solid view
ii) STL files
3) Which are the collaboration tools used in RP Technology?
4) Explain with a neat sketch magic communicator.
5) What are the internet based software’s used in RP technology?
6) What is an STL file and what do you understand by degenerate facets and overlapping facets
with respect to STL files.
7) Write short notes on the following RP software
a) Magics
b) Mimics
8) Explain the two very important requirements that must be followed, during STL life
generation.
9) What are the two formats in which STL files can be stored? Explain briefly.
10) Write brief notes on STL files used in CAD modeling.
11) Write short notes on the following:
a) Factors influencing accuracy
b) Selection of part build orientation

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c) Part building errors

d) File exchange errors
e) Data preparation errors
f) errors in finishing

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Question bank - 6thsem

PLC AND SCADA

B.E, VI Semester, Mechatronics Engineering
[As per Choice Based Credit System (CBCS) scheme 2017-2018]
Course Code 17MT61 CIE Marks 40
Number of Lecture Hours/Week 04 SEE Marks 60
Total Number of Lecture Hours 50(10 Hours per Module) Exam Hours 03

Credits – 04

Course Objectives: Students will be able to

 Gain the Knowledge of various skills necessary for Industrial applications of
Programmable logic controller(PLC)
 Understand the basic programming concepts and various logical Instructions used in
Programmable logic controller ( PLC )
 Solve the problems related to I/O module, Data Acquisition System and Communication
Networks using Standard Devices.
 Design and analysis of general structure of an automated process for real time
applications using Programmable logic controller ( PLC ) and SCADA
Module - 1
what is A PLC, Technical Definition of PLC, What are its advantages, characteristics functions
of A PLC, Chronological Evolution of PLC, Types of PLC, Unitary PLC, Modular PLC, Small
PLC, Medium PLC, Large PLC, Block Diagram of PLC: Input/output (I/O) section, Processor
Section, Power supply, Memory central Processing Unit: Processor Software / Executive
Software, Multi asking, Languages, Ladder Language.
Module - 2
Bit Logic Instructions: introduction: Input and Output contact program symbols, Numbering
system of inputs and outputs, Program format, introduction to logic: Equivalent Ladder diagram
of AND gate, Equivalent ladder diagram of or Gate, equivalents Ladder Diagram of NOT gate,
equivalent ladder diagram of XOR gate, equivalent ladder diagram of NAND gate, equivalent
ladder diagram of NOR gate, equivalent ladder diagram to demonstrate De Morgan theorem.
Ladder design. Examples: Training Stopping, Multiplexer, DE multiplexers
Module - 3

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Question bank - 6thsem

PLC Timers and Counters: On Delay and OFF delay timers, Timer-on Delay, Timer off delay,
Retentive and non-retentive timers. Format of a timer instruction. PLC Counter: Operation of
PLC Counter, Counter Parameters, Counters Instructions Overview Count up (CTU) Count
down (CTD). Advanced instructions: Introduction: Comparison instructions, discussions on
comparison instructions, “EQUAL” or “EQU” instruction, “NOT EQUAL” or “NEQ”
instruction, “LESS THAN” or “LESS” instruction, “LESS THANOR EQUAL’ or “LEQ”
instruction, GREATER THAN” OR “GRT” instruction, “GREATER THAN OR EQUAL TO”
or “GRO” instruction, “MASKED COMPARISON FOR EQUAL” or “MEQ” instruction,
“LIMIT TEST” or “LIM” instruction.
Module - 4
PLC input output (I/O) modules and power supply: Introduction: Classification of I/O, I/O
system overview, practical I/O system and its mapping addressing local and expansion I/O,
input-output systems, direct I/O, parallel I/O systems serial I/O systems. Sinking and sourcing.
Discrete input module. Rectifier with filter, threshold detection, Isolation, logic section,
specifications of discrete input module, types of analog input module, special input modules,
analog output module, I/O modules in hazardous locations power supply requirements, power
supply configuration, filters.
Module - 5
SCADA SYSTEMS
Introduction, definition and history of Supervisory Control and Data Acquisition, typical
SCADA System Architecture, Communication Requirements, Desirable properties of SCADA
system, Features, advantages, disadvantages and applications of SCADA. SCADA
Architecture( First generation Monolithic, Second Generation-Distributed, Third generation-
Networked Architecture), SCADA systems in operation and control of interconnected power
system, Power System Automation, Petroleum Refining Process, Water Purification System,
Chemical Plant
Course outcomes: On completion of the course students will
CO 1: have knowledge of Programmable Logic Controller domain on various Logical Operation
and Various Advanced Logical Instruction, I/O Module, Sensor,Actuator, Communication and
Measurement System.

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Question bank - 6thsem

CO 2: Understand the basic programming concepts and various logical Instructions used in
Programmable logic controller (PLC).
CO 3: Compute the extent and nature of electronic circuitry in Programmable logic controller
(PLC) and SCADA including monitoring and control circuits for Communication and
Interfacing.
CO 4: Design and analyze the general structure of an automated process for real time industrial
applications
TEXT BOOKS:
1. “PLC and Industrial application”, MadhuchhandanGupts and SamarjitSen Gupta,
pernram international pub. (Indian) Pvt. Ltd., 2011.
2.Ronald L Krutz, “Securing SCADA System”, Wiley Publication
REFERENCE BOOKS
1.1.GaryDunning,”Introduction to Programmable Logic Controllers”, Thomson,2nd Edition.
2.John W Webb, Ronald A Reis,”Programmable Logic Controllers: Principles and Application”,
PHI Learning, Newdelhi, 5th Edition
3.Stuart A Boyer, “SCADA Supervisory Control and Data Acqusition”, ISA, 4th Revised edition

MODULE-1

1. Define PLC. DISCUSS the functional characteristics of plc and its advantages

2.Illustrate the functional block diagram of plc

3. Explain types of plc

4. What is PLC? Write a technical definition of PLC.

5. List the characteristics of PLC.

6. Explain types of PLC with neat specification

7. Draw a block diagram of PLC and also explain each component

MODULE-2

1. Explain and draw equivalent ladder diagram of AND,OR,NOT gate

2. Explain input output contact program symbols

3. Explain numbering system of INPUT & OUTPUT

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4. Explain bit logic instruction

5. Explain ladder language with examples

6. Explain equivalent ladder diagram for De-Morgan theorem in detail

7. Discuss the process of processor software/executive software

8. Draw and explain input and output contact program symbol

9.wrire the steps present in program format

MODULE-3

1.Explain comparison instruction

2.Explain classification of PLC timer

3.Explain functions of counter parameter and counter instructions

4. Draw a ladder diagram for two motor system having the following conditions

I) starting push button starts motor 1

II) after 10 seconds, motor 2 is ON

III) stopping the switch stops motor 1 and 2

5. Explain the following with neat diagram

I) timer on delay ii) retentive timer

III) count up (CTU) iv) count down (CTD)

MODULE-4

1. Explain the following

I) Direct I/O system

II) parallel I/O system

III) serial I/O system

2. Write special input modules functions

3. Explain power supply requirements

4.Explain sinking and sourcing concept

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5. Explain I/O modules in Hazardous location

6.Summarize the power supply requirements in PLC

MODULE-5

1. What are the desirable properties of SCADA

2. Draw & explain three generation SCADA architecture

3. Explain petroleum refining and water purification system

4. Explain typical ScADA system architecture

5. Explain the following in SCADA system

I) features

II) advantages

III) disadvantages

6. Explain the architecture and communication system of SCADA system with a neat
diagram

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Question bank - 6thsem

ARM BASED SYSTEM DESIGN

B.E, VI Semester, Mechatronics Engineering
[As per Choice Based Credit System (CBCS) scheme 2017-2018]
Course Code 17MT62 CIE Marks 40
Number of Lecture Hours/Week 04 SEE Marks 60
Total Number of Lecture Hours 50(10 Hours per Module) Exam Hours 03

Credits – 04
Course Objectives: Students will be able to
 gain the knowledge of various RISC and CISC architectures of processors.
 understand the embedded system based ARM processor , its programming with
Embedded C and assembly language, various memory issues and memory mapping.
Module - 1
Introduction: The RISC design philosophy; The ARM design philosophy; Embedded system
hardware and software. ARM processor fundamentals: Registers;
Current Program Status Register; Pipeline; Exceptions, interrupts and the Vector Table; Core
extensions; Architecture revisions; ARM processor families.
Module - 2
Arm Instruction Set And Thumb Instruction Set: ARM instruction set: Data processing
instructions; Branch instructions; Load-store instructions; Software interrupt instruction;
Program Status Register functions; Loading constants; ARMv5E extensions; Conditional
execution. Thumb instruction set: Thumb register usage; ARM –Thumb interworking; Other
branch instructions; Data processing instructions; Single-Register Load-Store instructions;
Multiple-Register Load-Store instructions; Stack instructions; Software interrupt instruction
Module - 3
Writing And Optimizing ARM Assembly Code: Writing assembly code; Profiling and cycle
counting; Instruction scheduling; Register allocation; Conditional execution; Looping constructs;
Bit manipulation; Efficient switches; Handling unaligned data.
Module - 4
The memory hierarchy and the cache memory; Cache architecture; Cache policy; Coprocessor 15
and cache; Flushing and cleaning cache memory; Cache lockdown; Caches and software
performance
Module - 5
Exception And Interrupt Handling: Exception handling; Interrupts and interrupt handling
Schemes
Course outcomes: On completion of the course students will
· CO 1: have knowledge of embedded system based on the ARM processor, various cache
methods and instruction set.

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Question bank - 6thsem

·CO 2: understand the various instruction set for writing and optimizing ARM assembly and C
code

MODULE 1

1.Explain arm design philosophy in detail.

2.Discuss the memory and peripherals concept in embedded system hardware.

3.Explain the following

I.Current program status register

II.Banked register

III.Processor mode

4.Describe pipeline concept in detail.

5.Explain core extension with neat diagram.

6.Explain the following embedded hardware components

I.ARM bus technology

II.ARM bus protocol

III.Memory

MODULE-2

1.Explain the following instructions with syntax

I. Logical instructions

II. Comparison instructions

2. Explain the following instructions with example

I. Branch instruction

II. Multiply instruction

3. Write software interrupt instruction with example of pre and post condition.

4. Explain LDR pseudo instruction conversion with loading the constants 0Xff00ffff using MVN

5. Explain the thumb load store instruction using

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i. Single register

ii. Multiple register

6. Explain the following arm data processing instructions

i.Coprocessor instruction

ii. Coprocessor 15 instruction

7. Explain the following thumb instruction

i) ARM thumb interworking

ii) Branch instruction

iii)Multiple register load store instruction

IV)Software interrupt instruction

V)Stack instruction

8. List out the addressing mode for load store multiple instruction

MODULE-3

1. Write one cycle interlock caused by delayed load use with example

2. Describe the following load scheduling process

i) Load scheduling by preloading

ii) Load scheduling by unrolling

3. Explain the following concept in register allocation with example

i) Using more than 14 local variables

ii) Making the most of available register

4. Explain the instruction scheduling & parallel operation performed in ARM processor

5. Describe the interlock concept in one cycle interlock caused by load use & delayed load use

6. Scheduling of load instruction by preloading

7. Explain the allocating variables to register numbers with example

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8. Making the most of available register in register allocation with count shift example

9. Write short notes about conditional execution

10. Describe bit manipulation concept in brief

MODULE-4

1. Explain memory hierarchy & cache memory

2. Draw the blocks of cache and memory management units

3. Draw main memory maps to a direct mapped cache in cache architecture

4. Explain flushing and cleaning cache memory

5. Explain the relationship between the processor core and main memory

6. Write cache lockdown concept present in locking code and data in cache

7. Explain cleaning the D-cache using way and set index addressing

8. Explain the following cache policy

i) write policy

ii) cache line replacement policies

iii) allocation policy on a cache miss

9. Describe the following

i) set associativity

ii) Increasing set associativity

iii) write buffers

10. Describe the following concept in cache lockdown

i) locking the cache by incrementing the way index

ii) locking a cache using lock bits

MODULE-5

1. Write following concept with neat description

i) assigning interrupts

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Question bank - 6thsem

ii) interrupt latency

iii)FIQ and IRQ exception

2. Explain the following

i) Non nested interrupt handler

ii)Nested interrupt handler

iii)Prioritized interrupt handler

iv)Prioritized standard interrupt handler

3. Explain the following exception handling concepts

i) Vector table

ii) Exception priorities

iii)Link register offset

4. List out the types of interrupt handling schemes

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Question bank - 6thsem

Power Electronics
B.E, VI Semester, Mechatronics Engineering
[As per Choice Based Credit System (CBCS) scheme 2017-2018]

Course Code 17MT63 CIE Marks 40

Number of Lecture Hours/Week 04 SEE Marks 60
Total Number of Lecture Hours 50(10 Hours per Module) Exam Hours 03

Credits – 04
Course Objectives:
1. gain the knowledge of various conversion techniques of electrical energy using power electronic
components.
2. understand the link between efficient usage of power and conservation of energy resources of the world
3. use various power electronic converters for different applications in industry.

Module - 1
Introduction, Power semiconductor Devices: Applications of Power Electronics, Power semiconductor
devices, Control Characteristics, Types of power electronics circuits, Peripheral effects. Power MOSFETs
– switching characteristics, gate drive, IGBTs, di/dt and dv/dt limitations, Isolation of gate and base
drives, Simple design of gate and base drives.
Module - 2
Thyristors: Introduction, characteristics, Two Transistor Model. Turn-on and turn-off, di/dt and dv/dt
protection, Thyristor types, Thyristors firing circuits, Simple design of firing circuits using UJT.
Commutation Techniques: Introduction. Natural Communication, Forced commutation: self
commutation, impulse commutation, resonant pulse commutation and complementary commutations.
Module - 3
AC Voltage Controllers: Introduction. Principle of ON-OFF and phase control. Single-phase
bidirectional controllers with resistive and inductive loads. Controlled Rectifiers: Introduction. Principle
of phase controlled converter operation. Single phase semi-converters. Full converters. Three-phase half-
wave converters.Three-phase full-wave converters.
Module - 4
DC Choppers: Introduction. Principle of step-down and step-up chopper with R-L load. Performance
parameters. Choppers classification. Analysis of impulse commutated thyristor chopper (only qualitative
analysis)
Module - 5
Inverters: Introduction, Principle of operation. Performance parameters. Single-phase bridge inverters.
Three phase inverters. Voltage control of single-phase Inverters single pulse width, multiple pulse width,
and sinusoidal pulse width modulation.

Course outcomes: On completion of the course student will

 CO1: have knowledge of power semiconductor devices, thyristors, AC voltage controllers, choppers and
inverters.
 CO2: understand the characteristics and working principle of thyristors, AC voltage controllers, choppers
and inverters.
 CO3: apply control techniques to meet desired switching objectives.

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Question bank - 6thsem

MODULE 1

1.What is Power electronics and state important applications of power electronics.

2.Explain in brief about power electronic devices.

3.Explain the control characteristics of power devices.

4.What is a static power converter ? Name the different types of power converters and mention
their functions.

5.Give the list of power electronic circuits of different input/output requirements.

6.What are the peripheral effects of power electronic equipments ? What are the remedies for
them.

7.What are the peripheral effects of power electronic equipments ? What are the remedies for
them ?

8.Explain the control characteristics of the following semiconductor devices:

(1)Power BJT (2)MOSFET (3)IGBT

9.Draw the circuit symbol of IGBT.Compare its advantages over MOSFET.

10.Explain the steady and switching characteristics of MOSFET.

MODULE 2

1.Distinguish between latching and holding current.

2.Explain two transistor analogy of thyristor.

3.Explain the turn on and turn off characteristics of thyristor.

4.What is di/dt and dv/dt protection.How devices are protected against di/dt and dv/dt.

5.What are the different thyristor turn on methods.

6.With the circuit diagram and relevant waveforms discuss the operation of synchronized UJT
firing circuit for a full wave SCR semi converter.
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Question bank - 6thsem

7.What is commutation. What are the types of commutation.

8.Distinguish between natural and forced commutation.

9.Explain in brief the types of forced commutation.

10.Explain the difference between self and natural commutation.

11.What are the conditions to be satisfied for successful commutation of a thyristor.

MODULE 3

1.Discuss the operation of a single phase controller supplying a resistive load.

2.What are unidirectional controllers. Explain the operation of the same with waveforms and
obtain the expression for rms value of output voltage.

3. What are bidirectional controllers. Explain the operation of the same with waveforms and
obtain the expression for rms value of output voltage.

4.With neat circuit diagrams and waveforms explain the working of single phase half wave
rectifier using SCR for R load. Derive the expressions for Vdc and Idc.

5. With neat circuit diagrams and waveforms explain the working of three phase half wave
rectifier using SCR .Derive the expressions for Vdc and Idc

6.A single phase half wave converter is operated from a 120v,60hz supply.If the resistive load
r=10 ohms and delay angle is alpha=pi/3 determine a)efficiency b)form factor c)transformer
utilisation factor d)form factor.

7.Explain the principle of AC voltage controllers.

8.Explain the principle of phase controlled converter operation.

9.Determine the performance factors for single phase half controlled rectifier circuit.

10.With neat circuit diagram and waveforms explain the working of single phase fully controlled
rectifiers.

MODULE 4

1.Explain the principle of operation of a chopper.

2.Briefly explain the time ratio control and PWM as applied to chopper.

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Question bank - 6thsem

3.Explain the working of step down chopper.

4.Explain the working of step up chopper.Determine its performance parameters.

5.Give the classification of step down choppers.

6.Explain with the help of circuit diagram one quadrant and four quadrant converters.

7.With neat circuit diagram and waveforms explain class C chopper.

8.With neat circuit diagram and waveforms explain class D choppers.

9.Distinguish between class A and class B chopper with suitable circuit diagram and waveforms.

10 Explain class E chopper with relevant circuit diagram and waveforms.

MODULE 5

1.What is the principle of operation of inverters.

2.What are the differences between half and full bridge inverters?

3.What are the main differences between VSI and CSI?

4.What are the methods of voltage control of single phase inverters?

5.What are the purposes of feedback diodes in inverters?

6.With a neat circuit diagram explain single phase CSI.

7.Explain the performance parameters of inverters.

8.Compare half bridge and full bridge inverters.

9.Explain with neat circuit diagram variable DC link inverter.

10.With relevant circuit diagrams explain the operation of single phase bridge inverter with RL
load.

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Question bank - 6thsem

Dept of MTE,TOCE Page 28