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USOO 860071 OB2

(12) United States Patent (10) Patent No.: US 8,600,710 B2


Arif et al. (45) Date of Patent: Dec. 3, 2013
(54) METHOD OF MODELING THERMAL 2010/0174515 A1 7/2010 Madhavan et al.
PROBLEMIS USING ANON-DMENSIONAL 2010/0204963 A1* 8/2010 Shapiro ............................. TO3/1
2010/0280800 A1 11, 2010 Y1bas et al.
FINITE ELEMENT METHOD
OTHER PUBLICATIONS
(75) Inventors: Abdul Fazal Muhammad Arif, Dhahran Kryslet al. ("Dimensional model reduction in non-linear finite ele
(SA); Sulaman Pashah, Dhahran (SA); ment dynamics of Solids and structures'. International Journal for
Syed M. Zubair, Dhahran (SA) Numerical Methods in Engineering, 2001, pp. 479-504).*
Kimetal. ("Quadrature Error of the LoadVector in the Finite Element
(73) Assignee: King Fahd University of Petroleum Method”. Korean J. Comput. & Appl. Math. vol. 5 (1998), No. 3, pp.
and Minerals, Dhahran (SA) 645-657).*
Klaus-Jfirgen Bathe and Mohammad R. Khoshgoftaar, "Finite Ele
ment Formulation and Solution of Nonlinear HeatTransfer'. Nuclear
(*) Notice: Subject to any disclaimer, the term of this Engineering and Design, 51 (1979) 389-401.
patent is extended or adjusted under 35 Jia Tzer Hsu and Loc Vu-Quos, "A Rational Formulation of Thermal
U.S.C. 154(b) by 261 days. Circuit Models for Electrothermal Simulation-Part I: Finite Element
Method”. IEEE Transactions on Circuits and Systems-I Fundamen
(21) Appl. No.: 13/253,778 tal Theory and Applications, vol.43, No. 9, Sep. 1996.

(22) Filed: Oct. 5, 2011


(Continued)
Primary Examiner — Omar Fernandez Rivas
(65) Prior Publication Data Assistant Examiner — Iftekhar Khan
US 2013/0090899 A1 Apr. 11, 2013 (74) Attorney, Agent, or Firm — Richard C. Litman
(57) ABSTRACT
(51) Int. Cl. The method of modeling thermal problems using a non-di
G06F 7/60 (2006.01) mensional finite element method is a computerized method
(52) U.S. Cl. for modeling thermal systems that relies on the variational
USPC ...................................... 703/2; 703/5: 703/22 principle. The variational principle specifies the total poten
(58) Field of Classification Search tial of the system, given by a scalar quantity II, which is
None defined by an integral form for a continuum problem. The
See application file for complete search history. solution of the continuum problem is a function that makes II
stationary with respect to the state variables. The governing
(56) References Cited
equation of the problem is used to calculate the potential II.
The non-dimensional form of the potential is obtained by
U.S. PATENT DOCUMENTS insertion of the defined non-dimensionless parameters. The
element non-dimensional stiffness matrix and the non-di
5.437,190 A * 8/1995 Ehrenpreis et al. ............. T3,802 mensional load vectors are then obtained by invoking the
7,647.216 B2 1/2010 Bermejo Alvarez et al. stationarity of the non-dimensional potential II with respect
2004/0194051 A1* 9, 2004 Croft ............................... T16/20 to a non-dimensional temperature vector {0}.
2008.0099569 A1 5/2008 Plumpton et al.
2009,0259447 A1 10/2009 Langemyr et al. 5 Claims, 13 Drawing Sheets
US 8,600,710 B2
Page 2

(56) References Cited Jeong-Ha Kim and G. H. Paulino, “Isoparametric Graded Finite Ele
ments for Nonhomegeneous Isotropic and Orthotropic Materials”,
OTHER PUBLICATIONS Transactions of the ASME, vol. 69, pp. 502-514, Jul. 2002.
M. R. Frewin and D. A. Scott, "Finite Element Model of Pulsed Laser S. Pashah, A.F.M. Arif, and Syed M. Zubair, “Study of orthotropic pin
M. A. Zocher and S. E. Groves, "A Three-Dimensional Finite Ele fin performance through axisymmetric thermal non-dimensional
ment Formulation for Thermoviscoelastic Orthotropic Media'. Inter finite element”. Applied Thermal Engineering, vol. 31, Issues 2-3,
national Journal for Numerical Methods in Engineering, vol. 40, Feb. 2011, pp. 376-384.
2267-2288 (1997). Welding”, Welding Journal New York, 1999, vol.
78; No. 1, pp. 15-22. * cited by examiner
U.S. Patent Dec. 3, 2013 Sheet 1 of 13 US 8,600,710 B2
U.S. Patent Dec. 3, 2013 Sheet 2 of 13 US 8,600,710 B2

-la.
ww.
w

r
U.S. Patent Dec. 3, 2013 Sheet 3 of 13 US 8,600,710 B2

VE’61-I
U.S. Patent Dec. 3, 2013 Sheet 4 of 13 US 8,600,710 B2
U.S. Patent Dec. 3, 2013 Sheet 5 of 13 US 8,600,710 B2

E-------
-->E---------
e- N R

:
U.S. Patent Dec. 3, 2013 Sheet 6 of 13 US 8,600,710 B2

N
O O

S.
l
S.
U

S
s
l
s
l
U.S. Patent Dec. 3, 2013 Sheet 7 of 13 US 8,600,710 B2
U.S. Patent Dec. 3, 2013 Sheet 8 of 13 US 8,600,710 B2

st

O CO. N. co - w co (Y) v- O
U.S. Patent Dec. 3, 2013 Sheet 9 of 13 US 8,600,710 B2

- Cylindrical
-o-Taper
- A - Convex Parabolic
-o- Concave Parabolic

r = 0.25,4 = 10
OOO1 OO1 O. 1

- Cylindrical
-o-Taper
-- Convex Parabolic
-o- Concave Parabolic

t is 0.01. k - 0.04,
r = 0.25, 4 = 10
OOO OO1 O1 1
Bir,
Fig. 9B
U.S. Patent Dec. 3, 2013 Sheet 10 of 13 US 8,600,710 B2

- Cylindrical
-o-Taper
- A - Convex Parabolic
-- Concave Parabolic

t = 0.01. k = 0.04,
lf - 0.05, k - 0.1,
r = 0.25, c = 10
OOO1 OO1 0.1 1

- Rectangular
-o-Taper
-a- Convex Parabolic
-C- Concave Parabolic

OOO1 O.O1 O. 1 1
Biy
Fig. 10A
U.S. Patent Dec. 3, 2013 Sheet 11 of 13 US 8,600,710 B2

- Rectangular
-o-Taper
-A- Convex Parabolic
-- Concave Parabolic

it. - 0.0, ko? - 0.04


th 0.25, 4 = O
OOO O.O1 O. 1 1
Biy
Fig. 10B

-Rectangular
-o-Taper
-A - Convex Parabolic
-C- Concave Parabolic

i = 0.01, k = 0.04,
t = 0.05, k - 0.1,
t = 0.25, G = 10
OOO1 O. Of O. 1
Biy
Fig. 10C
U.S. Patent Dec. 3, 2013 Sheet 12 of 13 US 8,600,710 B2

="Tujugz
09
'ulu
OG=(
'uri
='),
|

fil
?

(-)
U.S. Patent US 8,600,710 B2

‘61-I
ZL
US 8,600,710 B2
1. 2
METHOD OF MODELING THERMAL for Sa; and where k, k, and k are thermal conductivities in
PROBLEMIS USING ANON-DIMIENSIONAL Cartesian X, y and Z-directions, respectively, G is a rate of
FINITE ELEMENT METHOD internal heat generation per unit volume, T is temperature, T,
and T are specified and ambient temperatures, respectively,
BACKGROUND OF THE INVENTION q* is a specified heat flux, his a coefficient of convective heat
transfer, and i, in and n are surface normals, respectively,
1. Field of the Invention corresponding to the Cartesian X, y and Z-directions; (b)
The present invention relates to computerized methods and establishing a scalar functional quantity II-U+2.92+C2,
systems for modeling thermal systems, and particularly to a 10
where U represents a term related to internal energy, S2.
method of modeling thermal problems using a non-dimen represents a term related to internal heat generation, S2, rep
sional finite element method that relies on the variational resents a term related to heat convection, and S2, represents a
principle. term related to heat conduction, and
2. Description of the Related Art
The application of non-dimensional analysis is very com 15
mon for heat transfer problems, where most of the experi
mental correlations are given as a function of non-dimen
sional groups. However, in order to generate numerical
solutions for the differential and integral equations of thermal
systems, which may not have analytical Solutions, the solu
tion of heat transfer problems is commonly based on finite
element or finite Volume, using quantities with dimensions.
Conventionally, a commercial finite element method
based system, such as ANSYS (which is basically a dimen
sional code), is used for the solution of dimensional prob 25
lems, and then the finite element results are converted into
non-dimensional form. Rather than performing this two-step
process, which may be very heavy on computational power where V represents volume; and (c) establishing a set of
and time, it would be desirable to obtain the finite element non-dimensional parameters
formulation in a non-dimensional form Such that the finite 30
element results may be directly produced without dimen
Sions.
Further, conventional finite element techniques are only d == ..., xs = X. , y = 3.
-
Ly andd 2.:
2.
L.
valid for a specific problem. It would be desirable to provide
a general non-dimensional finite element method that is valid 35
for an entire class of problems. where 0 is non-dimensional temperature, x, y and z are non
Thus, a method of modeling thermal problems using a dimensional spatial variables, and L. L. and L are maxi
non-dimensional finite element method solving the afore mum dimensions of a domain to be discretized along the X, y
mentioned problems is desired. and Z-directions, respectively.
40 The method further includes the steps of (d) expressing the
SUMMARY OF THE INVENTION Scalar functional quantity in matrix form as:
The method of modeling thermal problems using a non
dimensional finite element method is a computerized method
that includes the following steps: (a) establishing a steady 45
state heat conduction equation in three dimensions for an
orthotropic material as:

50
ka. +kya. +k.a. + G = 0, where N is a shape function matrix, {g} is a non-dimen
sional temperature gradient vector, {0} is a non-dimensional
temperature vector, D is a non-dimensional material prop
where the domain has surface areas SS and S.; where TT, erty matrix, and L is a geometric dimensions ratio matrix,
for S, 55 wherein

ksalt
is k2n
a m ++ k2n
: an ++4a' = 0 80 0000
{g}=CTA and g = (Ble),
60
for S, and where:

ki
y -- k',
a m + kn
: an + h(T-T)
(T-T) == 0
x - - - - - - - T
65
(B-Y99, and
US 8,600,710 B2
3 4
-continued FIG. 4A diagrammatically illustrates a pin fin to be mod
1/Bi () O 1 O O
eled by method of modeling thermal problems using a non
dimensional finite element method according to the present
|D) = 0 1/Bi, () , (L) = 0 L/L 0 invention.
0 0 1/Bi. 0 0 L/L. FIG. 4B diagrammatically illustrates a longitudinal fin to
be modeled by method of modeling thermal problems using a
non-dimensional finite element method according to the
where Bi, Bi, and Bi are Biot numbers given by present invention.
FIG. 5A diagrammatically illustrates a rectangular pin fin
10 in profile.
h hL hL FIG. 5B diagrammatically illustrates a tapered pin fin in
Bi = ". Bi, = ky0 and Bi. = k.3 profile.
FIG. 5C diagrammatically illustrates a convex parabolic
and non-dimensional specified heat flux q* is given by pin fin in profile.
15 FIG. 5D diagrammatically illustrates a concave parabolic
pin fin in profile.
FIG. 6A diagrammatically illustrates a rectangular longi
tudinal fin in profile.
FIG. 6B diagrammatically illustrates a trapezoidal longi
tudinal fin in profile.
(e) minimizing a dimensionless Scalar functional quantity FIG. 6C diagrammatically illustrates a convex parabolic
given as II-II/h.T.L.L. with respect to {0} to yield: longitudinal fin in profile.
FIG. 6D diagrammatically illustrates a concave parabolic
longitudinal fin in profile.
25 FIG. 7A diagrammatically illustrates a composite pin fin
with thermal interface material.
FIG. 7B diagrammatically illustrates a composite longitu
dinal fin with thermal interface material.
FIG. 8A is a graph illustrating an actual aspect ratio for a
30 rectangular pin fin with a coating (C-10).
FIG.8B is a graph illustrating a non-dimensional mesh for
Continuing further, the method provides for: (f) calculating the rectangular pin fin with a coating (=10) of FIG. 8A.
FIG. 9A is a graph illustrating efficiencies of multiple
an element stiffness matrix as k-k+k), where profiles of pin fins.
35 FIG. 9B is a graph illustrating efficiencies of multiple
profiles of pin fins for a pin fin with a coating.
(,)= f(b)f(LIDIBay and (R)= f(N) (Nas:
-v- S3
FIG. 9C is a graph illustrating efficiencies of multiple
profiles of pin fins for a pin fin with a coating and with a
thermal interface material.
40 FIG. 10A is a graph illustrating efficiencies of multiple
and (g) calculating an element load vector as {f}={f}+{f,},
where:
profiles of longitudinal fins.
FIG. 10B is a graph illustrating efficiencies of multiple
profiles of longitudinal fins for a longitudinal fin with a coat
1ng.
45 FIG. 10C is a graph illustrating efficiencies of multiple
profiles of longitudinal fins for a longitudinal fin with a coat
ing and with a thermal interface material.
FIG. 11 is a table comparing results produced by the
These and other features of the present invention will method of modeling thermal problems using a non-dimen
become readily apparent upon further review of the following 50 sional finite element method according to the present inven
specification and drawings. tion against results produced by conventional prior art meth
ods, as applied to a pin fin.
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 12 is a table comparing results produced by the
method of modeling thermal problems using a non-dimen
FIG. 1 is a block diagram illustrating system components 55 sional finite element method according to the present inven
for implementing the method of modeling thermal problems tion against results produced by conventional prior art meth
using a non-dimensional finite element method according to ods, as applied to a longitudinal fin.
the present invention. Similar reference characters denote corresponding fea
FIG. 2A illustrates a linear square element in natural s-t tures consistently throughout the attached drawings.
60
coordinates. DETAILED DESCRIPTION OF THE PREFERRED
FIG. 2B illustrates a square element mapped into quadri EMBODIMENTS
lateral in global (r. z) coordinates.
FIG. 3A illustrates a linear square element in natural s-t The present invention relates to a computerized method of
coordinates. 65 modeling thermal problems using a non-dimensional finite
FIG. 3B illustrates a square element mapped into quadri element method. Particularly, the non-dimensional finite ele
lateral in global (x,y) coordinates. ment method relies on the variational principle. The varia
US 8,600,710 B2
5 6
tional principle specifies the total potential of the system, -continued
given by a scalar quantity II, which is defined by an integral
form for a continuum problem. The solution of the continuum
problem is a function that makes II stationary with respect to
the state variables. The governing equation of the problem is
used to calculate the potential II. In order to generate the non-dimensional form of the poten
The governing differential equation for steady state heat tial II, the following non-dimensional variables must be
conduction in three dimensions for an orthotropic material is defined:
given as: 10

8 y 2. (6)
32T 32T (1) = T ,x= L. , y = Lau
d:
and 2.- L.
yay2 + k +G=0
15 where 0 is the non-dimensional temperature, x, y and z are
with the following boundary conditions on Surfaces S.S. and non-dimensional spatial variables, and L. L. and L are the
S. respectively: maximum dimensions of the domain to be discretised along
the X, y and Z-directions, respectively.
The potential given by equation (5) may be expressed in
terms of defined non-dimensional parameters as follows:

- : (7)
hT
25
2i? I? L.1 Bitay)
y
1 (I) L,1 Bilay)"
1 (2) L.1 Bila:
1 () W
where, k, k, and k are the thermal conductivities in the
Cartesian X, y and Z-directions, respectively. G is the rate of 1 2
internal heat generation per unit volume, T, and T. are speci
fied and ambient temperatures, respectively, q is the speci 30
If rods i? ?e-1) dS
S2 S3

fied heat flux, his the coefficient of convective heat transfer,


and l, m and h are the surface normals. where
The total potential for the heat transfer problem is given by:
35
...i 4 (8)
where the four terms on the right hand side are associated with
internal energy U, internal heat generation S2 heat convec
tion S2, and heat conduction S2. For the governing equation is the non-dimensional specified heat flux, and
(1) with associated boundary conditions (2), these terms may 40
be written as equation set (4):
hL. hL hL
Bii =
k, Tky and Bi. = k.3
1 a) TY2 a) TY2 a) TY2
u-III (E)-(E)-(E) as 45
are Biot numbers.
The potential given by equation (7) may be written in
a = -?. I?otd v y
matrix form as

a, = - I??a Tas
S2
50
(9)
1 2
Oh = ?h T-T) dS
S3

55
where S and Ss are separate Surface areas over which heat
flux q and convection loss h(TT) are specified because where N is the shape function matrix, {g} is the non
they cannot occur simultaneously on the same Surface. It dimensional temperature gradient vector, D is the non-di
should be noted that heat flux q is positive into the surface. In mensional material property matrix, and L is the geometric
the case of no internal heat generation, equation (3) reduces 60
dimensions ratio matrix, given by
tO:

I - III.()k(A) +k(A) lav (5)


65
(g)=1 8
dy
US 8,600,710 B2
7
- a N a N a Nil
Roll (N) (N)
dy 33
(16)
and
If, -?? (Nirds and 7.1- If(Nias.
S2 S3
-- O O 1 O O (10)
Bi L
1 0 - O
(D) = 0 0 ||L = L | It may be observed that the derived formulation is ingen
y L
10
eral form. In the following, the general form is used to obtain
O O
Bi.
- O O L. the formulations for two-dimensional plane and axisymmet
ric cases by inserting the corresponding values of B, L,
D. IN and integrating over element non-dimensional vol
By putting {g}=B{0} and dividing by LL to transform ume and surface areas. The objective of deriving the two
the functional into dimensionless form, equation (9) 15
dimensional formulations is to validate the derived formula
becomes: tion and to demonstrate its use in providing the solution to a
class of problems with a single finite element Solution.
An isoparametric quadrilateral element having four
II (11) degrees of freedom, 0, 0, 0 and 0 associated with the
hTEL L. global non-dimensional r-z coordinates is considered. The
element has arbitrary shape but straight sides, as shown in
FIG. 2B. The non-dimensional coordinates are defined as
(with reference to equation (6)):
25
r= and z = (17)
L. L.
where II–II/hT.L.L is the dimensionless form of the func
tional while dV and dS are non-dimensional differential vol where the parameters L, and L are the largest radius and
30
ume and Surface area elements respectively. largest length of the axisymmetric domain to be discretized,
The non-dimensional finite element method can now be respectively.
formulated by invoking the stationarity of the dimensionless The term isoparametric refers to the use of the same shape
potential II with respect to {0}. In fact, {0} can be taken out functions to define the element shapes as well as the tempera
of the integral in (11), as it is independent of the general 35 ture within an element. Therefore, the element shape is
coordinate system, yielding: defined as follows:

(18)
40 3.
F2
N, O N () N3 () Na () || 3.
{}- , , , , , , , r 2, 3
45
and the minimization of II with respect to {0} yields: f
3, 4

13
{0} = (13) Similarly, the non-dimensional temperature is defined as:
50

81 (19)
N
55
Equation (13) is of the form:
(14) where N is the matrix of shape functions. Linear shape
Thus, the element stiffness matrix and load vectors may be functions are also considered, and are given by equation set
deduced as k-k+|k,l, with 60 (20):

1
N
(,)= f(b)f(LIDIBav and (k) = f(N) (Nias. (15) 1 - 4 (1 - S)(1-t);
W- S3 65
US 8,600,710 B2
9 10
-continued The transformation is valid irrespective of the number of
– 1
coordinates used. Therefore, for the element non-dimen
N3 = 4 (1 +S) (1 + i); and sional edge length dl:
N = (l -S) (1 + i). : (26)
, z)d l = -
f(s)/(s)|ds for constant it
:
The element stiffness matrix may now be expressed in , z)d l = -
f(t)/(Oldt for constant S,
terms of s-t coordinates. From equation (15), the element 10
stiffness matrix is:
where J(s) and J(t) are one-dimensional Jacobians related
to an element edge with constant t and S, respectively, as
(k) = |?(B' (LIDIBdV
W S3
LN) (Nias, 15
described in greater detail below.
The convection or transfer of heat flux may only occur
through the element edges (i.e., the sides 1-2, 2-3, 3-4 or 4-1
where the differential volume dV and area dScan be obtained in FIGS. 2A and 2B). As the quadrilateral element in the r-z
aS
plane becomes a square element in the s-t plane, on each
element edge either S or t becomes constant. This explains
dV=2ardA and dS=2ard, (21)
why the element edges' non-dimensional length dl is trans
formed in either J(s)lds or J(t)ldt.
where Thus, for the isoparametric quadrilateral element of FIG.
25
2B, equation (23) becomes:
(22)

30
wherer, is the mean non-dimensional radius for the n-node
element, A is the element non-dimensional area, and I is the where equation (27) considers that convection occurs from
element edges' non-dimensional length. Thus, the element the element edge with constant t.
stiffness matrix may be written as: |J and B result in relatively complicated expressions
35 within the integral of equation (27), thus the integration is
performed using any suitable numerical integration tech
(23) nique.
From equation (15), the element force vector is given by
40
1 (24)
(f) = N i? a ral + Viral,
2 3

45 which may be written as:


where D is the non-dimensional material property matrix,
L is the geometric dimension ratio matrix, and is the aspect
ratio of the domain to be discretized.
50
It should be noted that r, and the flux-temperature matrix
B may be expressed interms of natural coordinates by using where equation (28) assumes that the convection occurs from
equations (10), (18) and (20), whereas the material property the element edge with constantt, whereas the flux is specified
matrix D and geometric ratio matrix L are constants for on the edge with constant S.
given material and geometry. Nevertheless, the element Sur 55
Similar to the isoparametric axisymmetric element, the
face and length over which the integration has to be carried isoparametric plane element is shown in FIG. 3B (with the
out must be expressed in terms of s-t coordinates with an linear square element of FIG.3A resembling that of FIG. 2A).
appropriate change of integration limits. The standard trans From equation (6), the non-dimensional coordinates are
formation procedure that involves the Jacobian (i.e., the defined as
determinant JI) is given by: 60

X 3Cdy y
--
(25) I and y L.
If f(r, gard: = f(s. t) disdt.
A. A.
65
As in the above, the element shapes and temperature within
an element are described as:
US 8,600,710 B2
11 12
Rectangular profile composite fins with thermal interfaces
(29) are illustrated in FIG. 7 in order to describe different geomet
ric dimensions. The interface is considered to be a thermal
2 interface material, as described below. Depending on the fin
N 4. O 2 and prime surface materials and the manufacturing process,
the fins are manufactured as the integral part of the prime
Surface, or they are attached through a joining process. If the
fins are attached to the prime surface by a joining process, the
y 10
Surface roughness of the mating Surfaces at the interface is
composed of discrete micro-contact spots with trapped air in
interstitial gaps.
The interface resistance appears due to low thermal con
noting that the shape functions are the same as for the axi ductivity of the trapped air. This problem can be overcome by
symmetric element. 15 using thermal interface materials (TIM). TIM is typically a
The element stiffness matrix may be obtained by following high conductive material that can be in the form of grease,
a similar mathematical method as described above: compliant polymers, metallic foils, or phase change materi
als. TIM replaces the air contained in the gaps at non-con
forming Surfaces, thus reducing the interface resistance due to
(31) its high thermal conductivity. The interfaces at fin-TIM and
dS, TIM-prime surfaces may be considered to be ideal. Thus, the
governing parameter for the thermal interface resistance
would be the TIM thermal conductivity and its layer thick
where equation (31) considers that the convection occurs ness. This approach is adopted in this analysis to show the
from element edges with constant t. 25 effects of interface resistance on fin performance.
The element force vector is given as: The governing dimensionless parameters for composite
fins are the fin base material-to-coating thickness and thermal
conductivity ratios. For this analysis, the parameters are
30
selected from a practical application point of view. The com
posite longitudinal and annular fins of triangular and para
bolic profiles are examined, and their combinations of prac
where it is assumed that the convection occurs from element tical fins and coating materials are given a thermal
edges with constant t, whereas the flux is specified on edges conductivity ratio in the range of 0.04-13.60 (i.e., k, k/ka
with constant S. 35 where Subscripts c and fare for coating and fin base material,
In the following, the nominal cases for axisymmetric and respectively). The coating thickness ranges from 30-80 um,
plane elements are solved in order to demonstrate the effi which is typically achieved by dipping and electroplating
ciency of the non-dimensional finite element method, with techniques. For the fin half thickness in the range 3-8mm, the
the accuracy thereof being compared with Solutions produced thickness ratio would vary in the range of 0.004sta0.03.
by commercial finite element software ANSYS. 40 Therefore, the values of the conductivity and thickness ratios
The significance of the dimensionless finite element for for the present analysis are selected as k=0.04 and t, 0.01.
mulation can be well utilized by constructing design charts Similarly, the governing dimensionless parameters for the
for the problems that do not have analytical Solutions; e.g., a interface resistance are k-k/k, and t, t/t. The values of
composite fin. A composite fin is formed from a substrate these parameters are k, 0.1 and t, 0.05.
(i.e., fin base material) and a coating, each being formed from 45 In the following, Solutions produced by commercial finite
different materials. A typical example is scale formation over element (FE) software ANSYS are considered as the refer
the fin Surface, caused by the operating environment. ence. Thermal element PLANE 55 is used for ANSYS FE
Depending on the application, a coating layer can also be models, which can be used for both axisymmetric and plane
applied to the fin surface to either protect it from a harsh 50
problems. Some test cases are selected for each fin profile for
working environment or, in Some cases, to enhance its per different composite fin configurations. Sufficiently fine mesh
formance. The pin fin geometry of FIG. 4A and the longitu has been used for both non-dimensional and ANSYS FE
dinal fin geometry of FIG. 4B are used in the following models. The rectangular profile pin fin with coating is
analysis. selected to depict a typical non-dimensional finite element
FIGS. 5A-5D illustrate profiles for varying pin fin geom 55 mesh. For this case, the actual fin aspect ratio is shown in FIG.
etries, and FIGS. 6A-6D similarly illustrate profiles for vary 8A. The dimensionless mesh of the fin is shown in FIG. 8B. It
ing longitudinal fin geometries. The profiles are described by: should be noted that the maximum dimensionless radius and
length is equal to one. Further, the proportion of coating
thickness is different in the radial and axial directions due to
r = R, + (R, - R (, sy and (33) 60 normalization (with reference to equation (6) above). Suffi
ciently fine mesh is used for the fin (150x150) so that it is fine
y = 1 + (1,-1) ty
L (34) near the base and coarse at the tip. The mesh size for the
coating at the fin tip and the right edge is fine as well.
The results for total heat loss from the fins are compared in
where n=0, 1, 0.5 and 2 for rectangular, tapered, convex 65 Table 1 (of FIG. 11) and Table 2 (of FIG. 12). It can be seen
parabolic and concave parabolic profiles, respectively. R. R. that the maximum difference does not exceed 0.79%. The
(t, t) for rectangular profile fins. dimensionless heat loss Qobtained through non-dimensional
US 8,600,710 B2
13 14
FE formulations has been converted into dimensional form ated computer readable recording media are in communica
Q, by the following relation for the pin fin: tion with one another by any suitable type of data bus, as is
well known in the art.
QNo(hRLT.)O (35) Examples of computer-readable recording media include a
and for the longitudinal fin: magnetic recording apparatus, an optical disk, a magneto
optical disk, and/or a semiconductor memory (for example,
9 (hi.T.)9. (36) RAM, ROM, etc.). Examples of magnetic recording appara
tus that may be used in addition to memory 14, or in place of
The effects of coating and thermal interface resistance can memory 14, include a hard disk device (HDD), a flexible disk
now be examined for different profile fins using non-dimen 10
(FD), and a magnetic tape (MT). Examples of the optical disk
sional finite elements. A fin without any coating or interface include a DVD (Digital Versatile Disc), a DVD-RAM, a CD
resistance is considered as the base case of the analysis. The ROM (Compact Disc-Read Only Memory), and a CD-R (Re
results of the base case serve as a reference for the assessment
cordable)/RW.
of coating and interface thermal resistance effects. The 15 It is to be understood that the present invention is not
dimensionless parameters of the base case are a fin aspect limited to the embodiments described above, but encom
ratio of (C-L/R)=10 or (C-L/t)=10 (with fin base dimen passes any and all embodiments within the scope of the fol
sions R, and t, used in the case of variable cross section fins): lowing claims.
a fin tip to base ratio of r-R/R, 0.25 or tit/t0.25 and a
dimensionless base temperature of (0,-T/T)=2. It should We claim:
be noted that all considered cases are for convective fin tip 1. A method of modeling thermal problems using a non
boundary conditions, and that all materials have isotropic dimensional finite element method, comprising a computer
thermal properties. executing the steps of
The performance of the fin is described through its effi (a) establishing a steady state heat conduction equation in
ciency, which is given by: 25
three dimensions for an orthotropic material as
Qf (37)
ka? +kya. +k.a. + G = 0,
30

where Q, is the heat loss by the fin and Q, is the maximum wherein the orthotropic material has three surfaces hav
possible heat loss through the fin (i.e., a fin with no internal
temperature gradient so that the complete fin is at the tem ing surface areas S. S. and S. respectively, wherein
perature equal to that of prime Surface). T=T, holds for S,
35
The fin efficiency is examined as a function offin lateral
Biot numbers, which are defined as:

38
Birr = hiRf htf (38)
--. By = 40
holds for S, and
where the subscript f is used to emphasize the fact that the
parameters are for the fin only (i.e., without any coating or 2. -- k.'
a m + kn
: an + h(T-T)
(T-T) == 0
interface material). As in the above, the fin base dimensions 45
R, and t, are used in the case of variable cross section fins.
The finefficiencies with different configurations for differ holds for Ss, where k, k, and k are thermal conduc
ent profile fins are presented in FIGS. 9A-9C for pin fins and tivities in Cartesian X, y and Z-directions, respectively, G
in FIGS. 10A-10C for longitudinal fins. The results are in is a rate of internal heat generation per unit volume, T is
dimensionless form so they provide the solution to a class of 50
temperature, T, and T are specified and ambient tem
problems. Thus, they can be used as design charts for the peratures, respectively, q is specified heat flux, h is a
composite pin and longitudinal fins with the same values of coefficient of convective heat transfer, andi, in and hare
dimensionless parameters. Surface normals, respectively corresponding to the Car
It should be understood that the calculations may be per tesian X, y and Z-directions;
formed by any suitable computer system, such as that dia 55
(b) establishing a scalar functional quantity II U--G2+
grammatically shown in FIG. 1. Data is entered into the S2+C2, wherein U represents internal energy, S2, rep
system 10 via any suitable type of user interface 18, and may resents internal heat generation, S2, represents heat con
be stored in memory 14, which may be any suitable type of vection, and S2, represents heat conduction, and:
computer readable and programmable memory. Calculations
are performed by a processor 12, which may be any suitable 60
type of computer processor, and may be displayed to the user
on display 16, which may be any Suitable type of computer
display.
The processor 12 may be associated with, or incorporated
u-III-G (G) (G) a.
into, any suitable type of computing device, for example, a
personal computer or a programmable logic controller. The
65
a-II foray.
display 16, the processor 12, the memory 14 and any associ
US 8,600,710 B2
15 16
-continued

a, = -?a Tas, and


S2

1 2 (e) minimizing a dimensionless Scalar functional quantity


Oh = S3
?h T-T) dS, given as II-II/hT.L.L. with respect to {0} to yield:
10
wherein V represents volume:
(c) establishing a set of non-dimensional parameters

T X y 15
6=- X= and z = -
T. & L. Ly L.
(f) calculating an element stiffness matrix ask-k+k).
wherein
where 0 is non-dimensional temperature, x,y and Z are
non-dimensional spatial variables, corresponding to a
domain to be discretized and L. L. and L-are maximum
dimensions of a domain to be discretized along the X, y
and Z-directions, respectively;
(,)= f(b)f(LIDIBav and (R)= LN)'NJas:
W

(d) expressing the scalar functional quantity for no internal 25


heat generation in matrix form as: and
(g) calculating an element load vector as {f}={f}+{f,}.
wherein:

30

35 2. The method as recited in claim 1, further comprising the


steps of:
where N is a shape function matrix, {g} is a non calculating the element stiffness matrix and the element
dimensional temperature gradient, {0} is a non-dimen load vector through insertion of the corresponding val
sional temperature vector, D is a non-dimensional ues of B, L, D, and N: and
material property matrix, and L is a geometric dimen 40 integrating over the non-dimensional element Volume and
sions ratio matrix, wherein Surface areas.
3. A system for modeling thermal problems using a non
dimensional finite element method, comprising:
a processor;
{g}=180 88 80
and 45 computer readable memory coupled to the processor,
a user interface coupled to the processor;
- =- B{0},
{g} A where B = | ON 0N
ay 0as
(NT , and a display coupled to the processor;
software stored in the memory and executable by the pro
cessor, the Software having:
50 means for establishing a steady state heat conduction
equation in three dimensions for an orthotropic mate
rial as
-- O O 1 O O
Bi La
1 0 - O
D = 0 Bi. () , L = Ly
y L
55 k 21: . 32T +k 21: G =0
3x2 'ay2 * 3:2
1 0 0 -
O O Bi. L.
wherein the orthotropic material has three surfaces
having Surface areas S. S. and Ss, wherein TT, for
where Bi, Bi, and Bi are Biot numbers given by 60
S.

hL. hL
Bi =
i k, Bi, = k,2 and Bi. = k3 k211
salt k2n
a m ++ k2n
: an ++4a' = 0
65

and non-dimensional specified heat flux q is given by for S, and


US 8,600,710 B2
17 18
where

for S, where k, k, and k are thermal conductivities


in Cartesian X, y and Z-directions, respectively, G is a 1
rate of internal heat generation per unit volume, T is Bi. O O 1 O O
temperature, T, and T. are specified and ambient 1 ?o a 0
temperatures, respectively, q is specified heat flux, h 10 D = 0 Bi, 0 , L = Ly
is a coefficient of convective heat transfer, andi, mand 1 0 0 a.
hare surface normals, respectively corresponding to O O Bi. L.
the Cartesian X, y and Z-directions;
means for establishing a scalar functional quantity
II-U+2+2+2, wherein U represents internal 15 where Bi, Bi, and Bi are Biot numbers given by
energy, S2 represents internal heat generation, S2,
represents heat convection, and S2, represents heat
conduction, and Bi = hL,
k
Biy = hLy
ky
and Bi = hL.
k.
2O
U=l2 ??? k (i.3x +k??ay +k* (3: W and non-dimensional specified heatflux q is given by
y

SO G = - | IfGTd V, (aC = - If a*Tai S, and


al 25 q =- 4f;.
y S2

Oh = ?h.T -T) dS, means for minimizing a dimensionless scalar functional


S3 quantity given as II-II/h.T.L.L. with respect to {0}
30
to yield
wherein V represents volume:
means for establishing a set of non-dimensional param- - --- - F-Tr's fall
eters W
?ib (LIDIBdV i? ?tini (Nase =S3
35
T T

e = 1 ... yr == .... . yy == 2.
= -, x = -, y =
i, and
and zz == 1.i
-, an = -, I?iNita
S2 as I?iN)
S3 as:

where 0 is non-dimensional temperature, x, y and Z 40 means for calculating an element stiffness matrix as
are non-dimensional spatial variables, corresponding k-k+k,l, wherein
tomaximum
a domaindimensions
to be discretized, and L. L. and L- are
of a domain to be discretized
T
along the x, y and Z-directions, respectively; kg = ??? B LDBdV and ki- ??(N'NdS;
means for expressing the scalar functional quantity for W S3
no internal heat generation in matrix form as
and
I 1 means for calculating an element load vector as {f}={
| = |?ig" (Ligav-
y
50 f}+{f,}, wherein
?e" (Nya as +: ??(0) IN' - 1) dS,
S2 (1,- I ?ing as and 17, -? finds.
S2 S3
55

where N is a shape function matrix, {g} is a non 4. The system for modeling thermal problems using a non
dimensional temperature gradient, {0} is a non-di dimensional finite element method as recited in claim 3,
mensional temperature vector, D is a non-dimen wherein said means for calculating the element stiffness
sional material property matrix, and Lisa geometric 60 matrix and the element load vector comprises:
dimensions ratio matrix, wherein means for inserting the corresponding values of B. L.
D. and N into the element stiffness matrix and the
T element load vector, and
(g)=180 ay88 ag80 and {g} = B{6},
65
means for integrating over the non-dimensional element
Volume and Surface areas.
5. A computer Software product that includes a non-tran
sitory storage medium readable by a processor, the non-tran
US 8,600,710 B2
19 20
sitory storage medium having stored thereon a set of instruc
tions for modeling thermal problems using a non
dimensional
comprising:
finite element method, the instructions U - III () +k(A) +k(A) av,
5
(a) a first sequence of instructions which, when executed
by the processor, causes the processor to establish a set
of non-dimensional parameters
10
T X 2.
6 = T-- X = L. Ly
, and z = L.-

where 0 is non-dimensional temperature, x,y and Z are 15


non-dimensional spatial variables, corresponding to a
domain to be discretized,and L. L. and L are maximum wherein V represents volume, and wherein the scalar func
dimensions of a domain to be discretized along the X, y tional quantity for no internal heat generation is repre
and Z-directions, respectively; sented in matrix form as:
(b) a second sequence of instructions which, when 2O
executed by the processor, causes the processor to cal
culate an element stiffness matrix as k-k+k).
wherein
25

- - - - - FT-x - I -
kg = ??? B LDBdV and k = ??(N'NdS,
W S3

30 where N is a shape function matrix, {g} is a non-dimen


wherein a steady state heat conduction equation in three sional temperature gradient, {0} is a non-dimensional
dimensions for an orthotropic material is given by temperature vector, D is a non-dimensional material
property matrix, and L is a geometric dimensions ratio
matrix, wherein
35
k2* 2 --- yay2
21 -- k2za-2 -+ GG =-o(),
g}=222
00 00 007 andd{g}
g)=(B10), where
= B48, wh

such that the orthotropic material has three surfaces a


having surface areas S. S. and S. respectively, wherein
T=T, holds for S,
(B-1|0|No|No|N)
919 and
k1
ax + k2n
yam + k2n
za." + a'd == 0 45 1/Bi O O 1 O O
D = 0 1/Bi, () , (L) = 0 L / Ly 0 ,
O O 1/Bi, 0 0 L / L.
holds for S, and
50

k1 where Bi, Bi, and Bi are Biot numbers given by


ax + k2n
yam + k2n+h(T-T.)=0
za." (T-T) =
hL. hL

holds for Ss, where k, k, and k are thermal conduc- 55


Bi =
i k, Bi, = k,2 and Bi. = k3
tivities in Cartesian X, y and Z-directions, respectively, G
is a rate of internal heat generation per unit volume, T is and non-dimensional specified heat flux q is given by
temperature, T, and T. are specified and ambient tem
peratures, respectively, q' is specified heat flux, h is a
coefficient of convective heat transfer, and im and hare
Surface normals, respectively corresponding to the Car
tesian X, y and Z-directions, and wherein a scalar func
tional quantity is given as II-U+2+2+2 wherein U
represents internal energy, S2 represents internal heat 65 Such that a dimensionless Scalar functional quantity
generation, S2, represents heat convection, and S2, rep given as II-II/h.T.L.L may be minimized with respect
resents heat conduction, and: to {0} to yield:
US 8,600,710 B2
21 22

and 10
(c) a third sequence of instructions which, when executed
by the processor, causes the processor to calculate an
element load vector as {f}={T}+{f}, wherein
15

If, = f'? (Nirds and 17.1- If(Nias.


S2 S3
UNITED STATES PATENT AND TRADEMARK OFFICE
CERTIFICATE OF CORRECTION
PATENT NO. : 8,600,710 B2 Page 1 of 1
APPLICATIONNO. : 13/253778
DATED : December 3, 2013
INVENTOR(S) : Abul Fazal Muhammad Arifet al.

It is certified that error appears in the above-identified patent and that said Letters Patent is hereby corrected as shown below:

Title Page (75) First Inventor's given name is misspelled and should be: Abul Fazal Muhammad Arif

Signed and Sealed this


Sixth Day of May, 2014
74-4-04- 2% 4 Michelle K. Lee
Deputy Director of the United States Patent and Trademark Office

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