Intel® 945G/945GZ/945GC/

945P/945PL Express Chipset

Family
Thermal and Mechanical Design Guidelines (TMDG)
- For the Intel® 82945G/82945GZ/82945GC Graphics Memory
Controller Hub (GMCH) and Intel® 82945P/82945PL Memory
Controller Hub (MCH)

February 2008

Document Number: 307504-004

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR
IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT
AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY
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PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY,
OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
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APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR
DEATH MAY OCCUR.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel
reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from
future changes to them.
The Intel® 82945G/82945GZ/82945GC GMCH and Intel® 82945P/82945PL MCH may contain design defects or errors known as
errata, which may cause the product to deviate from published specifications. Current characterized errata are available on
request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Intel, Pentium, and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries.
*Other names and brands may be claimed as the property of others.
Copyright © 2005–2008, Intel Corporation. All rights reserved.

2 Thermal and Mechanical Design Guidelines

Contents
1 Introduction .....................................................................................................7
1.1 Terminology ..........................................................................................8
1.2 Reference Documents .............................................................................9

2 Product Specifications......................................................................................11
2.1 Package Description..............................................................................11
2.1.1 Non-Grid Array Package Ball Placement ......................................11
2.2 Package Loading Specifications...............................................................12
2.3 Thermal Specifications ..........................................................................13
2.4 Thermal Design Power (TDP)..................................................................13
2.4.1 Methodology...........................................................................14
2.4.2 Application Power ....................................................................14
2.4.3 Specifications .........................................................................14
3 Thermal Metrology ..........................................................................................15
3.1 Case Temperature Measurements ...........................................................15
3.1.1 Thermocouple Attach Methodology.............................................15
3.2 Airflow Characterization ........................................................................16

4 Reference Thermal Solution..............................................................................19

4.1 Operating Environment .........................................................................19
4.1.1 ATX Form Factor Operating Environment ....................................19
4.1.2 Balanced Technology Extended (BTX) Form Factor Operating
Environment...........................................................................20
4.2 Mechanical Design Envelope...................................................................21
4.3 Thermal Solution Assembly....................................................................21
4.4 Environmental Reliability Requirements ...................................................24

Appendix A Enabled Suppliers ...........................................................................................25

Appendix B Mechanical Drawings .......................................................................................27

Thermal and Mechanical Design Guidelines 3

Figures
Figure 1. (G)MCH Non-Grid Array ......................................................................12
Figure 2. 0° Angle Attach Methodology (top view, not to scale)..............................16
Figure 3. 0° Angle Attach Heatsink Modifications (generic heatsink side and bottom
view shown, not to scale)...........................................................................16
Figure 4. Airflow Temperature Measurement Locations .........................................17
Figure 5. Processor Heatsink Orientation to Provide Airflow to (G)MCH Heatsink on an
ATX Platform ............................................................................................20
Figure 6. Processor Heatsink Orientation to Provide Airflow to (G)MCH Heatsink on a
Balanced Technology Extended (BTX) Platform..............................................21
Figure 7. ATX GMCH Heatsink Installed on Board .................................................22
Figure 8. Balanced Technology Extended (BTX) GMCH Heatsink Installed on Board ...23
Figure 9. (G)MCH Package Drawing ...................................................................28
Figure 10. (G)MCH Component Keep-Out Restrictions for ATX Platforms .................29
Figure 11. (G)MCH Component Keep-Out Restrictions for Balanced Technology
Extended (BTX) Platforms ..........................................................................30
Figure 12. (G)MCH Reference Heatsink for ATX Platforms – Sheet 1 .......................31
Figure 13. (G)MCH Reference Heatsink for ATX Platforms – Sheet 2 .......................32
Figure 14. (G)MCH Reference Heatsink for ATX Platforms – Anchor ........................33
Figure 15. (G)MCH Reference Heatsink for ATX Platforms – Ramp Retainer Sheet 1 ..34
Figure 16. (G)MCH Reference Heatsink for ATX Platforms – Ramp Retainer Sheet 2 ..35
Figure 17. (G)MCH Reference Heatsink for ATX Platforms – Wire Preload Clip ..........36
Figure 18. (G)MCH Reference Heatsink for Balanced Technology Extended (BTX)
Platforms.................................................................................................37
Figure 19. (G)MCH Reference Heatsink for Balanced Technology Extended (BTX)
Platforms – Clip ........................................................................................38
Figure 20. (G)MCH Reference Heatsink for Balanced Technology Extended (BTX)
Platforms – Heatsink Assembly ...................................................................39

Tables
Table 1. (G)MCH Loading Specifications..............................................................12
Table 2. (G)MCH Case Temperature Specifications .............................................13
Table 3. (G)MCH Thermal Design Power Specifications ........................................ 14
Table 4. Reference Thermal Solution Environmental Reliability Requirements ......... 24
Table 5. (G)MCH ATX Intel Reference Heatsink Enabled Suppliers.........................25
Table 6. (G)MCH Balanced Technology Extended (BTX) Intel Reference Heatsink
Enabled Suppliers .....................................................................................26

4 Thermal and Mechanical Design Guidelines

Revision History

Revision Description Date

Number

-001 • Initial Release May 2005

®
-002 • Added Intel 82945PL specifications October 2005

-003 • Added Intel® 82945GZ specifications December

2005

-004 • Added Intel® 82945GC specifications February 2008

Thermal and Mechanical Design Guidelines 5

6 Thermal and Mechanical Design Guidelines
Introduction

1 Introduction
As the complexity of computer systems increases, so do power dissipation
requirements. The additional power of next generation systems must be properly
dissipated. Heat can be dissipated using improved system cooling, selective use of
ducting, and/or active/passive heatsinks.

The objective of thermal management is to ensure that the temperatures of all

components in a system are maintained within functional limits. The functional
temperature limit is the range within which the electrical circuits can be expected to
meet specified performance requirements. Operation outside the functional limit can
degrade system performance, cause logic errors, or cause component and/or system
damage. Temperatures exceeding the maximum operating limits may result in
irreversible changes in the operating characteristics of the component. The goal of this
document is to provide an understanding of the operating limits of the Intel®
82945G/82945GZ/82945GC Graphics and Memory Controller Hub (GMCH) and Intel®
82945P/82945PL Memory Controller Hub (MCH), and discuss a reference thermal
solution.

The simplest and most cost-effective method to improve the inherent system cooling
characteristics of the (G)MCH is through careful design and placement of fans, vents,
and ducts. When additional cooling is required, component thermal solutions may be
implemented in conjunction with system thermal solutions. The size of the fan or
heatsink can be varied to balance size and space constraints with acoustic noise.

This document presents the conditions and requirements to properly design a cooling
solution for systems that implement the 82945G/82945GZ/82945GC GMCH or
82945P/82945PL MCH. Properly designed solutions provide adequate cooling to
maintain the (G)MCH case temperature at or below thermal specifications. This is
accomplished by providing a low local-ambient temperature, ensuring adequate local
airflow, and minimizing the case to local-ambient thermal resistance. By maintaining
the (G)MCH case temperature at or below those recommended in this document, a
system designer can ensure the proper functionality, performance, and reliability of
these components.

Note: Unless otherwise specified, the information in this document applies to the Intel®
82945G/82945GZ/82945GC Graphics and Memory Controller Hub (GMCH) and the
Intel® 82945P/82945PL Memory Controller Hub (MCH). The term (G)MCH refers to the
82945G GMCH, 82945GZ GMCH, 82945GC GMCH, 82945P MCH, and 82945PL MCH.

Note: Unless otherwise specified, ICH7 refers to the Intel® 82801GB ICH7 and 82801GR
ICH7R I/O Controller Hub 7 components.

Thermal and Mechanical Design Guidelines 7

 Introduction

1.1 Terminology
Term Description

BGA Ball Grid Array. A package type defined by a resin-fiber substrate where a die is
mounted and bonded. The primary electrical interface is an array of solder balls
attached to the substrate opposite the die and molding compound.

FC-BGA Flip Chip Ball Grid Array. A package type defined by a plastic substrate where a
die is mounted using an underfill C4 (Controlled Collapse Chip Connection)
attach style. The primary electrical interface is an array of solder balls attached
to the substrate opposite the die. Note that the device arrives at the customer
with solder balls attached.

Intel® ICH7 Intel® I/O Controller Hub 7. The chipset component that contains the primary
PCI interface, LPC interface, USB, ATA, and/or other legacy functions.

GMCH Graphic Memory Controller Hub. The chipset component that contains the
processor and memory interface and integrated graphics device.

MCH Memory Controller Hub. The chipset component that contains the processor
and memory interface. It does not contain an integrated graphics device.

TA The measured ambient temperature locally to the component of interest. The

ambient temperature should be measured just upstream of airflow for a
passive heatsink or at the fan inlet for an active heatsink.

TC The measured case temperature of a component. For processors, TC is

measured at the geometric center of the integrated heat spreader (IHS). For
other component types, it is generally measured at the geometric center of the
die or case.

TC-MAX The maximum case/die temperature with an attached heatsink. This

temperature is measured at the geometric center of the top of the package
case/die.

TC-MIN The minimum case/die temperature with an attached heatsink. This

temperature is measured at the geometric center of the top of the package
case/die.

TDP Thermal Design Power. TDP is specified as the highest sustainable power level
of most or all of the real applications expected to be run on the given product,
based on extrapolations in both hardware and software technology over the life
of the component. Thermal solutions should be designed to dissipate this target
power level.

TIM Thermal Interface Material. TIM is the thermally conductive material installed
between two surfaces to improve heat transfer and reduce interface contact
resistance.

lfm Linear Feet per Minute. Unit of airflow speed.

ΨCA Case-to-ambient thermal characterization parameter (Psi). This is a measure of

thermal solution performance using total package power. It is defined as (TC –
TA) / Total Package Power. Heat source size should always be specified for Ψ
measurements.

8 Thermal and Mechanical Design Guidelines

Introduction

1.2 Reference Documents

Document Comments

Intel 945G/945GZ/945P/945PL Express Chipset Family http://developer.intel.com/des

®

Datasheet ign/chipsets/datashts/307502.
htm

Intel® I/O Controller Hub 7 (ICH7) Datasheet http://developer.intel.com//de

sign/chipsets/datashts/30701
3.htm

Intel® I/O Controller Hub 7 (ICH7) Thermal Design Guidelines http://developer.intel.com//de

sign/chipsets/designex/30701
5.htm

Intel® Pentium® 4 Processor 670, 660, 650, 640, and 630 and http://developer.intel.com
Intel® Pentium® 4 Processor Extreme Edition Datasheet /design/pentium4/datashts
/306382.htm

Intel® Pentium®4 Processors 570/571, 560/561, http://developer.intel.com

550/551,540/541, 530/531 and 520/521 Supporting Hyper- /design/Pentium4/datashts
Threading Technology Datasheet /302351.htm

Intel® Pentium® D Processor 840, 830 and 820 Datasheet http://developer.intel.com

/design/PentiumD//datasht
s/307506.htm

Intel® Pentium® 4 Processor on 90 nm Process in the 775– http://developer.intel.com

Land LGA Package Thermal and Mechanical Design Guidelines /design/Pentium4/guides/3
02553.htm

Intel® Pentium® D® Processor and Intel® Pentium® Processor http://developer.intel.com/

Extreme Edition 830 Thermal and Mechanical Design Guidelines design/pentiumXE/designe
x/306830.htm

LGA775 Socket Mechanical Design Guide http://developer.intel.com/

design/pentium4/guides/3
02666.htm

Various System Thermal Design Suggestions http://www.formfactors.or

g

Thermal and Mechanical Design Guidelines 9

 Introduction

10 Thermal and Mechanical Design Guidelines

Product Specifications

2 Product Specifications
This chapter provides the package description and loading specifications. The chapter
also provides component thermal specifications and thermal design power descriptions
for the (G)MCH.

2.1 Package Description

The (G)MCH is available in a 34 mm [1.34 in] x 34 mm [1.34 in] Flip Chip Ball Grid
Array (FC-BGA) package with 1202 solder balls. The die size is currently 9.6 mm
[0.378in] x 10.6 mm [0.417in]. A mechanical drawing of the package is shown in
Figure 9, Appendix B.

2.1.1 Non-Grid Array Package Ball Placement

The (G)MCH package uses a “balls anywhere” concept. The minimum ball pitch is
0.8 mm [0.031 in], but ball ordering does not follow a 0.8-mm grid. Board designers
should ensure correct ball placement when designing for the non-grid array pattern.
For exact ball locations relative to the package, contact your Field Sales
Representative.

Thermal and Mechanical Design Guidelines 11

 Product Specifications

Figure 1. (G)MCH Non-Grid Array

2.2 Package Loading Specifications

Table 1 provides static load specifications for the chipset package. This mechanical
maximum load limit should not be exceeded during heatsink assembly, shipping
conditions, or standard use conditions. Also, any mechanical system or component
testing should not exceed the maximum limit. The chipset package substrate should
not be used as a mechanical reference or load-bearing surface for the thermal and
mechanical solution.

Table 1. (G)MCH Loading Specifications

Parameter Maximum Notes

Static 15 lbf 1,2,3

NOTES:
1. These specifications apply to uniform compressive loading in a direction normal to the
(G)MCH package.
2. This is the maximum force that can be applied by a heatsink retention clip. The clip must
also provide the minimum specified load on the (G)MCH package.
3. These specifications are based on limited testing for design characterization. Loading limits
are for the package only.

12 Thermal and Mechanical Design Guidelines

Product Specifications

2.3 Thermal Specifications

To ensure proper operation and reliability of the (G)MCH, the temperature must be at
or below the maximum value specified in Table 2. System and component level
thermal enhancements are required to dissipate the heat generated and maintain the
(G)MCH within specifications. Chapter 3 provides the thermal metrology guidelines for
case temperature measurements.

The (G)MCH must also operate above the minimum case temperature specification
listed in Table 2.

Table 2. (G)MCH Case Temperature Specifications

Parameter Value

82945G/82945GZ/82945GC GMCH: 99 °C
TC-MAX
82945P/82945PL MCH : 103°C

TC-MIN 0 °C

NOTE: Thermal specifications assume an attached heatsink is present.

2.4 Thermal Design Power (TDP)

Thermal design power (TDP) is the estimated power dissipation of the (G)MCH based
on normal operating conditions including VCC and TC-MAX while executing real worst-
case power intensive applications. This value is based on expected worst-case data
traffic patterns and usage of the (G)MCH and does not represent a specific software
application. TDP attempts to account for expected increases in power due to variation
in (G)MCH current consumption due to silicon process variation, processor speed,
DRAM capacitive bus loading and temperature. However, since these variations are
subject to change, the TDP cannot ensure that all applications will not exceed the TDP
value.

The system designer must design a thermal solution for the (G)MCH such that it
maintains TC below TC-MAX for a sustained power level equal to TDP. Note that the TC-
MAX specification is a requirement for a sustained power level equal to TDP, and that
the case temperature must be maintained at temperatures less than TC-MAX when
operating at power levels less than TDP. This temperature compliance is to ensure
(G)MCH reliability over its useful life. The TDP value can be used for thermal design if
the (G)MCH thermal protection mechanisms are enabled. Intel chipsets incorporate a
hardware-based fail-safe mechanism to help keep the product temperature within
specifications in the event of unusually strenuous usage above the TDP power limit.

Thermal and Mechanical Design Guidelines 13

 Product Specifications

2.4.1 Methodology
2.4.1.1 Pre-Silicon
To determine TDP for pre-silicon products in development, it is necessary to make
estimates based on analytical models. These models rely on extensive knowledge of
the past chipset power dissipation behavior along with knowledge of planned
architectural and process changes that may affect TDP. Knowledge of applications
available today and their ability to stress various components of the chipset is also
included in the model. Since the number of applications available today is beyond
what Intel can test, only real world high-power applications are tested to predict TDP.
The values determined are used to set specific data transfer rates. The projection for
TDP assumes (G)MCH operation at TC-MAX. The TDP estimate also includes a margin to
account for process variation.

2.4.1.2 Post-Silicon
Once the product silicon is available, post-silicon validation is performed to assess the
validity of pre-silicon projections. Testing is performed on both commercially available
and synthetic high power applications and power data is compared to pre-silicon
estimates. Post-silicon validation may result in a small adjustment to pre-silicon TDP
estimates.

2.4.2 Application Power

Designing to the TDP can ensure that a particular thermal solution meets the cooling
needs of future applications. Testing with currently available commercial applications
has shown that the components may dissipate power levels below the published TDP
specification in Section 2.4.3. Intel strongly recommends that thermal engineers
design to the published TDP specification to develop a robust thermal solution that will
meet the needs of current and future applications.

2.4.3 Specifications
The (G)MCH is estimated to dissipate the Thermal Design Power values provided in
Table 3 when using two DIMMs of 667 MHz (553 MHz for the 82945PL/82945GZ) dual
channel DDR2 with a 1066 MHz (800 MHz for the 82945PL/82945GZ/82945GC)
processor system bus speed. For the 82945G/82945GZ/82945GC GMCH, the graphics
core is assumed to run at 400 MHz. FC-BGA packages have limited heat transfer
capability into the board and have minimal thermal capability without thermal
solutions. Intel requires that system designers plan for an attached heatsink when
using the (G)MCH.

Table 3. (G)MCH Thermal Design Power Specifications

Component System Bus Speed Memory Frequency TDP Value

82945G GMCH 1066 MHz 667 MHz 22.2 W

82945GZ GMCH 800 MHz 533 MHz 22.2 W
82945GC GMCH 800 MHz 667 MHz 22.2 W
82945P MCH 1066 MHz 667 MHz 15.2 W
82945PL MCH 800 MHz 533 MHz 15.2 W
§

14 Thermal and Mechanical Design Guidelines

Thermal Metrology

3 Thermal Metrology
The system designer must measure temperatures to accurately determine the thermal
performance of the system. Intel has established guidelines for proper techniques of
measuring (G)MCH component case temperatures.

3.1 Case Temperature Measurements

To ensure functionality and reliability, the (G)MCH is specified for proper operation
when TC is maintained at or below the maximum temperature listed in Table 2. The
surface temperature at the geometric center of the die corresponds to TC. Measuring
TC requires special care to ensure an accurate temperature reading.

Temperature differences between the temperature of a surface and the surrounding

local ambient air can introduce error in the measurements. The measurement errors
could be due to a poor thermal contact between the thermocouple junction and the
surface of the package, heat loss by radiation and/or convection, conduction through
thermocouple leads, or contact between the thermocouple cement and the heatsink
base (if a heatsink is used). To minimize these measurement errors a thermocouple
attach with a zero-degree methodology is recommended.

3.1.1 Thermocouple Attach Methodology

1. Mill a 3.3 mm [0.13 in] diameter hole centered on bottom of the heatsink base.
The milled hole should be approximately 1.5 mm [0.06 in] deep.
2. Mill a 1.3 mm [0.05 in] wide slot, 0.5 mm [0.02 in] deep, from the centered hole
to one edge of the heatsink. The slot should be in the direction parallel to the
heatsink fins (see Figure 3).
3. Attach thermal interface material (TIM) to the bottom of the heatsink base.
4. Cut out portions of the TIM to make room for the thermocouple wire and bead.
The cutouts should match the slot and hole milled into the heatsink base.
5. Attach a 36 gauge or smaller calibrated K-type thermocouple bead or junction to
the center of the top surface of the die using a high thermal conductivity cement.
During this step, make sure no contact is present between the thermocouple
cement and the heatsink base because any contact will affect the thermocouple
reading. It is critical that the thermocouple bead makes contact with the
die (see Figure 2).
6. Attach heatsink assembly to the (G)MCH and route thermocouple wires out
through the milled slot.

Thermal and Mechanical Design Guidelines 15

 Thermal Metrology

Figure 2. 0° Angle Attach Methodology (top view, not to scale)

Figure 3. 0° Angle Attach Heatsink Modifications (generic heatsink side and bottom
view shown, not to scale)

3.2 Airflow Characterization

Figure 4 describes the recommended location for air temperature measurements

measured relative to the component. For a more accurate measurement of the
average approach air temperature, Intel recommends averaging temperatures
recorded from two thermocouples spaced about 25 mm [1.0 in] apart. Locations for
both a single thermocouple and a pair of thermocouples are presented.

16 Thermal and Mechanical Design Guidelines

Thermal Metrology

Figure 4. Airflow Temperature Measurement Locations

Airflow velocity should be measured using industry standard air velocity sensors.
Typical airflow sensor technology may include hot wire anemometers. Figure 4
provides guidance for airflow velocity measurement locations. These locations are for
a typical JEDEC test setup and may not be compatible with chassis layouts due to the
proximity of the processor to the (G)MCH. The user may have to adjust the locations
for a specific chassis. Be aware that sensors may need to be aligned perpendicular to
the airflow velocity vector or an inaccurate measurement may result. Measurements
should be taken with the chassis fully sealed in its operational configuration to achieve
a representative airflow profile within the chassis.

Thermal and Mechanical Design Guidelines 17

 Thermal Metrology

18 Thermal and Mechanical Design Guidelines

Reference Thermal Solution

4 Reference Thermal Solution

The reference component thermal solution for the (G)MCH for ATX platforms uses two
ramp retainers, a wire preload clip, and four custom MB anchors. The Intel Balanced
Technology Extended (BTX) reference design uses a Z-clip attach for the (G)MCH
heatsink. This chapter provides detailed information on operating environment
assumptions, heatsink manufacturing, and mechanical reliability requirements for the
(G)MCH.

4.1 Operating Environment

The operating environment of the (G)MCH will differ depending on system

configuration and motherboard layout. This section defines operating environment
boundary conditions that are typical for ATX and BTX form factors. The system
designer should perform analysis on the platform operating environment to assess any
impact to thermal solution selection.

4.1.1 ATX Form Factor Operating Environment

In ATX platforms, an airflow speed of 0.76 m/s [150 lfm] is assumed to be present
25 mm [1 in] in front of the heatsink air inlet side of the attached reference thermal
solution. The system integrator should note that board layout may be such that there
will not be 25mm [1in] between the processor heatsink and the (G)MCH. The potential
for increased airflow speeds may be realized by ensuring that airflow from the
processor heatsink fan exhausts in the direction of the (G)MCH heatsink. This can be
achieved by using a heatsink providing omni directional airflow, such as a radial fin or
“X” pattern heatsink. Such heatsinks can deliver airflow to both the (G)MCH and other
areas like the voltage regulator, as shown in Figure 5. In addition, the (G)MCH board
placement should ensure that the (G)MCH heatsink is within the air exhaust area of
the processor heatsink.

Note that heatsink orientation alone does not ensure that 0.76 m/s [150 lfm]
airflow speed will be achieved. The system integrator should use analytical or
experimental means to determine whether a system design provides adequate airflow
speed for a particular (G)MCH heatsink.

The local ambient air temperature, TA, at the (G)MCH heatsink in an ATX platform is
assumed to be 47 °C. The thermal designer must carefully select the location to
measure airflow to get a representative sampling. These environmental assumptions
are based on a 35 °C system external temperature measured at sea level.

Thermal and Mechanical Design Guidelines 19

 Reference Thermal Solution

Figure 5. Processor Heatsink Orientation to Provide Airflow to (G)MCH Heatsink on an

ATX Platform

Airflow
Airflow Direction
Direction
Airflow
Airflow Direction
Direction
Airflow
Airflow Direction
Direction

(G)MCH Heatsink
Omi Directional Flow

Airflow Direction
Processor Heatsink
(Fan Not Shown)

Airflow Direction

TOP VIEW
Proc_HS_Orient_ATX

Other methods exist for providing airflow to the (G)MCH heatsink, including the use of
system fans and/or ducting, or the use of an attached fan (active heatsink).

4.1.2 Balanced Technology Extended (BTX) Form Factor

Operating Environment

The operating environment for the (G)MCH in typical BTX systems has not been
profiled. This section provides operating environment conditions based on what has
been exhibited on the Intel micro-BTX reference design. On a BTX platform, the
(G)MCH obtains in-line airflow directly from the processor thermal module. Since the
processor thermal module provides lower inlet temperature airflow to the processor,
reduced inlet ambient temperatures are also often seen at the (G)MCH as compared to
ATX. An example of how airflow is delivered to the (G)MCH on a BTX platform is
shown in Figure 6.

The local ambient air temperature, TA, at the (G)MCH heatsink in the Intel micro-BTX
reference design is predicted to be ~45 °C. The thermal designer must carefully select
the location to measure airflow to get a representative sampling. These environmental
assumptions are based on a 35 °C system external temperature measured at sea
level.

Note: The local ambient air temperature is a projection based on anticipated power
increases on a 2005 platform and may be subject to change in future revisions of this
document.

20 Thermal and Mechanical Design Guidelines

Reference Thermal Solution

Figure 6. Processor Heatsink Orientation to Provide Airflow to (G)MCH Heatsink on a

Balanced Technology Extended (BTX) Platform

Balanced Technology
Airflow Direction Extended (BTX) Thermal
Module Assembly Over
(G)MCH Processor

Top View
Proc_HS_Orient

4.2 Mechanical Design Envelope

The motherboard component keep-out restrictions for the (G)MCH on an ATX platform
are included in Appendix B, Figure 10. The motherboard component keep-out
restrictions for the (G)MCH on a BTX platform are included in Figure 11.

System integrators should ensure no board or chassis components would intrude into
the volume occupied by the (G)MCH thermal solution.

4.3 Thermal Solution Assembly

The reference thermal solution for the (G)MCH for an ATX platform is shown in
Figure 7 and Appendix B and is an aluminum extruded heatsink that uses two ramp
retainers, a wire preload clip, and four custom motherboard anchors. The heatsink is
attached to the motherboard by assembling the anchors into the board, placing the
heatsink over the (G)MCH and anchors at each of the corners, and securing the plastic
ramp retainers through the anchor loops before snapping each retainer into the fin
gap. The assembly is then sent through the wave process. Post wave, the wire preload
clip is assembled using the hooks on each of the ramp retainers. The clip provides the
mechanical preload to the package. A thermal interface material (Chomerics* T710) is
pre-applied to the heatsink bottom over an area that contacts the package die.

The reference thermal solution for the (G)MCH for a BTX platform is shown in
Figure 8. The heatsink is aluminum extruded and uses a Z-clip for attach. The clip is
secured to the system motherboard via two solder-down anchors around the (G)MCH.
The clip helps to provide a mechanical preload to the package via the heatsink. A
thermal interface material (Chomerics* T710) is pre-applied to the heatsink bottom
over an area in contact with the package die.

The ATX reference thermal solution differs from the BTX reference solution because a
BTX platform requires a Support and Retention Mechanism (SRM) that helps to meet
the mechanical requirements listed in Table 4.

Thermal and Mechanical Design Guidelines 21

 Reference Thermal Solution

Figure 7. ATX GMCH Heatsink Installed on Board

22 Thermal and Mechanical Design Guidelines

Reference Thermal Solution

Figure 8. Balanced Technology Extended (BTX) GMCH Heatsink Installed on Board

Thermal and Mechanical Design Guidelines 23

 Reference Thermal Solution

4.4 Environmental Reliability Requirements

The environmental reliability requirements for the reference thermal solution are
shown in Table 4. These should be considered as general guidelines. Validation test
plans should be defined by the user based on anticipated use conditions and resulting
reliability requirements.

Table 4. Reference Thermal Solution Environmental Reliability Requirements

Test1 Requirement Pass/Fail

Criteria2

Mechanical • 3 drops for + and - directions in each of 3 Visual\Electrical

Shock perpendicular axes (i.e., total 18 drops). Check
• Profile: 50 G trapezoidal waveform, 11 ms duration,
4.3 m/s [170 in/s] minimum velocity change.
• Setup: Mount sample board on test fixture. Include
550 g processor heatsink.
Random • Duration: 10 min/axis, 3 axes Visual/Electrical
Vibration • Frequency Range: 5 Hz to 500 Hz Check

• Power Spectral Density (PSD) Profile: 3.13 g RMS

Thermal • -40 °C to +85 °C, 900 cycles Thermal
Cycling Performance
Unbiased • 85 % relative humidity / 55 °C, 500 hours Visual Check
Humidity

NOTES:
1. The above tests should be performed on a sample size of at least 12 assemblies from 3
different lots of material.
2. Additional Pass/Fail Criteria may be added at the discretion of the user.

24 Thermal and Mechanical Design Guidelines

Enabled Suppliers

Appendix A Enabled Suppliers

Current suppliers for the Intel® 945G/945GZ/945GC/945P/945PL Express chipset
(G)MCH reference thermal solution are listed in Table 5 and Table 6.

Table 5. (G)MCH ATX Intel Reference Heatsink Enabled Suppliers

Supplier Intel Part Vendor Part Contact Information

Number Number

C85366-001 00C863501A Monica Chih - +886 (-2) -

(heatsink) 29952666
monica_chih@ccic.com.tw
C85370-001 334C863501A
CCI (Chaun Choung
(ramp Harry Lin - (714) 739-5797
Technology Corp)
retainer) hlinack@aol.com
334C863502A
C85373-001
(wire clip)

C85376-001 G2100C888-143 Rick Lin - +886 (-2) -

WiesonElectronic Co. (anchor) 26471896 ext.6342
rick@wieson.com.tw

C85366-001 2Z802-016 Jack Chen – (714) 626-1233

(heatsink)
Jack.chen@foxconn.com
C85370-001 3EE77-002
Foxconn/HonHai
(ramp
Precision
retainer)
3KS02-066
C85373-001
(wire clip)

Foxconn/HonHai C85376-001 2Z802-015 Jack Chen – (714) 626-1233

Precision (anchor)
Jack.chen@foxconn.com

Note: These vendors and devices are listed by Intel as a convenience to Intel's general
customer base, but Intel does not make any representations or warranties whatsoever
regarding quality, availability, reliability, functionality, or compatibility of these
devices. This list and/or these devices may be subject to change without notice.

Thermal and Mechanical Design Guidelines 25

 Enabled Suppliers

Table 6. (G)MCH Balanced Technology Extended (BTX) Intel Reference Heatsink

Enabled Suppliers

Supplier Intel Part Vendor Part Contact Information

Number Number

C57359-001 00C863401A Monica Chih - +886 (-2) -

CCI (Chaun 29952666
Choung monica_chih@ccic.com.tw
Technology
Corp.) Harry Lin - (714) 739-5797
hlinack@aol.com

C57359-001 S909700001 David Chao - +886 (-2) -2299-

AVC (Asia Vital 6930 x619
Components)
david_chao@avc.com.tw

Foxconn/HonHai C57359-001 2Z802-010 Jack Chen – (714) 626-1233

Precision Jack.chen@foxconn.com

26 Thermal and Mechanical Design Guidelines

Mechanical Drawings

Appendix B Mechanical Drawings

The following table lists the mechanical drawings available in this document.

Drawing Name Page

Number

(G)MCH Package Drawing 28

(G)MCH Component Keep-Out Restrictions for ATX Platforms 29

(G)MCH Component Keep-Out Restrictions for Balanced Technology Extended 30

(BTX) Platforms

(G)MCH Reference Heatsink for ATX Platforms – Sheet 1 31

(G)MCH Reference Heatsink for ATX Platforms – Sheet 2 32

(G)MCH Reference Heatsink for ATX Platforms – Anchor 33

(G)MCH Reference Heatsink for ATX Platforms – Ramp Retainer Sheet 1 34

(G)MCH Reference Heatsink for ATX Platforms – Ramp Retainer Sheet 2 35

(G)MCH Reference Heatsink for ATX Platforms – Wire Preload Clip 36

. (G)MCH Reference Heatsink for Balanced Technology Extended (BTX) 37

Platforms

(G)MCH Reference Heatsink for Balanced Technology Extended (BTX) 38

Platforms – Clip

(G)MCH Reference Heatsink for Balanced Technology Extended (BTX) 39

Platforms – Heatsink Assembly

NOTE: Unless otherwise specified, all figures in this appendix are dimensioned in millimeters.
Dimensions shown in brackets are in inches.

Thermal and Mechanical Design Guidelines 27

 Mechanical Drawingss

Figure 9. (G)MCH Package Drawing

28 Thermal and Mechanical Design Guidelines

 Mechanical Drawings

Figure 10. (G)MCH Component Keep-Out Restrictions for ATX Platforms

NORTH
60.6 4X 8.76
[ 2.386 ] [ .345 ]
48 NO COMPONENT S T HIS AREA
[ 1.890 ]
DET AIL A
26.79
[ 1.055 ]

4X 5.08 4X 8.76
[ .200 ] [ .345 ]

81
[ 3.189 ]

4X 1.84
[ .072 ]
74 DETAIL A
67 [ 2.9134 ]
[ 2.638 ] SCALE 8
60.92
[ 2.398 ]

45.79 8X 0.97 [ .038 ] PLAT ED T HRU HOLE

[ 1.803 ]
EAST 8X 1.42[.056] T RACE KEEPOUT

COMPONENT CENT ER

MAX 1.27 [.050] NOT ES:

COMPONENT HEIGHT 1 HOLE PLACEMENT FABRICAT ION
(NON-MCH COMPONENT S) T OLERANCE PER INT EL 454979, CLASS 1,2,3
2. HEAT SINK COMPONENT HEIGHT NOT T O EXCEED
MAX 25 [1.000] 38.1MM ABOVE MOT HERBOARD SURFACE.
COMPONENT HEIGHT
135

47 4
[ 1.85 ] [ .1575 ]

Thermal and Mechanical Design Guidelines 29

 Mechanical Drawingss

Figure 11. (G)MCH Component Keep-Out Restrictions for Balanced Technology Extended (BTX) Platforms

8X 0.97 [ .038 ] PLATED THRU HOLE

8X 1.42[.056] TRACE KEEPOUT 4X 4.19
[ .165 ]

NO COMPONENTS THIS AREA 4X 1.85

[ .073 ]

DETAIL A
48.26
[ 1.900 ] 4X 5.08 4X 8.76
[ .200 ] [ .345 ]

4X 2.1
[ .0 83 ]

DETAIL A
COMPONENT CENTER
SCALE 8
MAX 1.78[.070] COMPONENT HEIGHT
55.88
61.98 [ 2.200 ]
[ 2.440 ]
2X 2.54
[ .100 ]

2X 5.72
[ .225 ]

2X 2.29 2X 3.3
[ .090 ] [ .130 ]

DETAIL B NOTES:
1 . HOLE PLACEMENT FABRICATION
SCALE 5 TOLERANCE PER INTEL 454979, CLASS 1,2,3
2. HEATSINK COMPONENT HEIGHT NOT TO EXCEED
26.9MM ABOVE MOTHERBOARD SURFACE.
MAX 1.27[.050] COMPONENT HEIGHT

46.48 B
[ 1.830 ]

SCALE 4 DETAIL B

30 Thermal and Mechanical Design Guidelines

 Mechanical Drawings

Figure 12. (G)MCH Reference Heatsink for ATX Platforms – Sheet 1

2X 58. 6 T Y P 35. 5
[ 2. 307 ] [ 1. 398 ]

47 T Y P 3. 7 5 0. 15 6
[ 1. 850 ] [ . 148 . 005 ]
F U LL R O U N D

14X E Q U A L
S P A CING

4
[ . 157 ]

2X
30. 5
2X 80 59. 28 0. 15 6 [ 1. 201 ]
[ 3. 150 ] [ 2. 334 . 005 ]

16X 1. 2 0. 15 NO T E S :
[ . 047 . 005 ]
1. T H I S D R A W I N G T O B E U S E D I N C O N J U N C T I O N W I T H S U P P LI E D 3D
D A T A B A S E F I LE . A LL D I M E N S I O N S A N D T O LE R A N C E S O N T H I S
D R A W I N G T A K E P R E C E D E N C E O V E R S U P P LI E D F I LE A N D A R E
SE E DET A IL B A P P LI C A B LE A T P A R T F R E E , U N C O N S T R A I N E D S T A T E U N LE S S
INDICA T E D O T HE RW IS E .
2. T O LE R A N C E S O N D I M E N S I O N E D A N D U N D I M E N S I O N E D
S E E DE T A IL A F E A T U R E S U N LE S S O T H E R W I S E S P E C I F I E D :
2X 48 0. 15 6 D I M E N S I O N S A R E I N M I LLI M E T E R S .
[ 1. 890 . 005 ] T O LE R A N C E S :
LI N E A R 0. 25
A N G U LA R 1
3. M A T E R I A L: 6063-T 5 A LU M I N U M
4. F I N I S H : N O N E
36 5 M A RK P A RT W IT H INT E L P /N A ND RE V IS IO N A P P RO X
[ 1. 417 ]
W H E R E S H O W N P E R I N T E L M A R K I N G S T A N D A R D 164997
6 CRIT ICA L T O F UNCT IO N DIM E NS IO N
7X E Q U A L 8X 2. 7 0. 15
S P A CING [ . 106 . 005 ] 7. E D G E S S H O W N A S S H A R P R 0. 1 M A X .
8. T O O LI N G R E Q U I R E D T O M A K E T H I S P A R T S H A LL B E T H E
P R O P E R T Y O F I N T E L, A N D S H A LL B E P E R M A N E N T LY M A R K E D
W I T H I N T E L'S N A M E A N D A P P R O P R I A T E P A R T N U M B E R .
9. A LL S E C O N D A R Y U N I T D I M E N S I O N S A R E F O R R E F E R E N C E O N LY .
10. A LL D I M E N S I O N S S H O W N S H A LL B E M E A S U R E D F O R F A I
11. R E M O V E A LL B U R R S O R S H A R P E D G E S A R O U N D P E R I M E T E R
O F P A R T . S H A R P N E S S O F E D G E S S U B J E C T T O H A N D LI N G A R E
R E Q U I R E D T O M E E T U L1439 T E S T .

Thermal and Mechanical Design Guidelines 31

 Mechanical Drawingss

Figure 13. (G)MCH Reference Heatsink for ATX Platforms – Sheet 2

16
[ . 630 ]
2X 0. 6 6
[ .02 4 ]

T Y P 135

0. 1 [ . 003] R0. 5
[ . 020 ]
66
[ 2. 5984 ] 2X 15
[ . 591 ]

6. 72 0. 15 6
[ . 265 . 005 ]

25. 5
C H OM E R IC S : [ 1. 004 ]
69-12-22350-T 710

TYP R 1
[ . 039 ]
N O B U R R A LL A R O U N D
1. 5 0. 15 6
[ . 059 . 005 ]
4X 45 X 1 [ . 039] TYP 4
[ . 1575 ]

5 T Y P DE T A IL A T Y P 2. 75 0. 1 6
S C A LE 5 [ . 108 . 003 ]
BO T T O M VIEW TYP.

DE T A IL B
S C A LE 5

32 Thermal and Mechanical Design Guidelines

 Mechanical Drawings

Figure 14. (G)MCH Reference Heatsink for ATX Platforms – Anchor

7. 62 0. 15 2X 0. 77 0. 1 6 2X C H A M F E R A LL A R O U N D
[ . 300 . 005 ] [ . 030 . 003 ] C O N T A C T T O I N S U LA T O R I N T E R F A C E
A T S U P P LI E R S O P T I O N

0. 64 0
-0. 07
. 025 + . 000
[ -. 002 ]
2. 5 0. 15
[ . 098 . 005 ]
2X 45 2
NO T ES :

1. T H I S D R A W I N G T O B E U S E D I N C O N J U N C T I O N W I T H S U P P LI E D 3D
2X 4 D A T A B A S E F I LE . A LL D I M E N S I O N S A N D T O LE R A N C E S O N T H I S
[ . 157 ] D R A W I N G T A K E P R E C E D E N C E O V E R S U P P LI E D F I LE A N D A R E
45 X 0. 2 M I N A P P LI C A B LE A T P A R T F R E E , U N C O N S T R A I N E D S T A T E U N LE S S
INDICA T E D O T HE RW IS E .
2. T O LE R A N C E S O N D I M E N S I O N E D A N D U N D I M E N S I O N E D
F E A T U R E S U N LE S S O T H E R W I S E S P E C I F I E D :
2X 3. 94 0. 15 D I M E N S I O N S A R E I N M I LLI M E T E R S .
[ . 155 . 005 ] F O R F E A T U R E S I Z E S < 10M M : LI N E A R . 07
F O R F E A T U R E S I Z E S > 10M M : LI N E A R . 08
2X 0. 75 2X 0. 5 0. 05 A N G LE S : 0. 5
[ . 030 ] [ . 020 . 001 ] 3. M A T E R I A LS :
I N S U LA T O R : P O LY C A R B O N A T E T H E R M O P LA S T I C , U L 94V -0, B LA C K (739)
(R E F . G E LE X A N 3412R -739)
C O N T A C T : B R A S S O R E Q U I V A LE N T U P O N I N T E L A P P R O V A L
C O N T A C T F I N I S H : . 000050u" M I N . N I C K E L U N D E R P LA T I N G ;
S O LD E R T A I LS , 0. 000100" M I N T I N O N LY S O LD E R (LE A D F R E E ).
5. M A R K W I T H I N T E L P / N A N D R E V I S I O N P E R I N T E L M A R K I N G
S T A N D A R D 164997; P E R S E C 3. 8 (P O LY E T H Y LE N E B A G )
6 CRIT ICA L T O F UNCT IO N DIM E NS IO N
7. A LL D I M E N S I O N S S H O W N S H A LL B E M E A S U R E D F O R F A I
8. N O T E R E M O V E D
9. D E G A T E : F LU S H T O 0. 35 B E LO W S T R U C T U R A L T H I C K N E S S
(G A T E W E LL O R G A T E R E C E S S A C C E P T A B LE )
10. F LA S H : 0. 15 M A X .
11. S I N K : 0. 25 M A X .
5. 21 0. 12 6 12. E J E C T O R M A R K S : F LU S H T O -0. 25
[ . 205 . 004 ] 13. P A R T I N G LI N E M I S M A T C H N O T T O E X C E E D 0. 25.
14. E J E C T I O N P I N B O S S E S , G A T I N G , A N D T O O LI N G I N S E R T S R E Q U I R E
4X 7. 83 0. 12 6 I N T E L'S A P P R O V A L P R I O R T O T O O L C O N S T R U C T I O N .
[ . 308 . 004 ] 2X 10. 13 0. 12 A LL E J E C T I O N P I N B O S S E S A N D G A T E F E A T U R E S S H O W N
[ . 39 9 . 004 ] A R E F O R R E F E R E N C E O N LY .
15. E D G E S S H O W N A S S H A R P R 0. 1 M A X .
16. T O O LI N G R E Q U I R E D T O M A K E T H I S P A R T S H A LL B E T H E
P R O P E R T Y O F I N T E L, A N D S H A LL B E P E R M A N E N T LY M A R K E D
W I T H I N T E L'S N A M E A N D A P P R O P R I A T E P A R T N U M B E R .
17. A LL S E C O N D A R Y U N I T D I M E N S I O N S A R E F O R R E F E R E N C E O N LY .

0. 64 0
-0. 07
. 025 + . 000
[ -. 002 ]
5. 08 0. 12 6
[ . 200 . 004 ]

Thermal and Mechanical Design Guidelines 33

 Mechanical Drawingss

Figure 15. (G)MCH Reference Heatsink for ATX Platforms – Ramp Retainer Sheet 1

NO T E S :

1. T H I S D R A W I N G T O B E U S E D I N C O N J U N C T I O N W I T H S U P P LI E D 3D
70. 49 6 D A T A B A S E F I LE . A LL D I M E N S I O N S A N D T O LE R A N C E S O N T H I S
[ 2. 775 ] D R A W I N G T A K E P R E C E D E N C E O V E R S U P P LI E D F I LE A N D A R E
A P P LI C A B LE A T P A R T F R E E , U N C O N S T R A I N E D S T A T E U N LE S S
INDICA T E D O T HE RW IS E .
61. 51 6 2. T O LE R A N C E S O N D I M E N S I O N E D A N D U N D I M E N S I O N E D
[ 2. 422 ] F E A T U R E S U N LE S S O T H E R W I S E S P E C I F I E D :
D I M E N S I O N S A R E I N M I LLI M E T E R S .
F O R F E A T U R E S I Z E S < 10M M : LI N E A R . 07
S E E DE T A IL C F O R F E A T U R E S I Z E S B E T W E E N 10 A N D 25 M M : LI N E A R . 08
F O R F E A T U R E S I Z E S B E T W E E N 25 A N D 50 M M : LI N E A R . 10
F O R F E A T U R E S I Z E S > 50M M : LI N E A R . 18
A N G LE S : 0. 5
3. M A T E R I A L:
A ) T Y P E : E N V I R O N M E N T A LLY C O M P LI A N T T H E R M O P LA S T I C O R
E Q U I V A LE N T U P O N I N T E L A P P R O V A L (R E F . G E LE X A N 500E C R -739)
B ) CRIT ICA L M E CHA NICA L M A T E RIA L P RO P E RT IE S
F O R E Q U I V A LE N T M A T E R I A L S E LE C T I O N :
3 T E N S I LE Y I E LD S T R E N G T H (A S T M D 638) > 57 M P a
[ . 118 ] T E N S I LE E LO N G A T I O N A T B R E A K (A S T M D 638) > = 46%
F LE X U R A L M O D U LU S (A S T M D 638) 3116 M P a 10%
S O F T E N I N G T E M P (V I C A T , R A T E B ): 154 C
C ) C O LO R : A P P R O X I M A T I N G B LA C K , (R E F G E 739)
D ) R E G R I N D : 25% P E R M I S S I B LE .
E ) V O LU M E - 1. 73e+ 03 C U B I C -M M (R E F )
W E I G H T - 2. 16 G R A M S (R E F )
5 M A RK P A RT W IT H INT E L P /N, RE V IS IO N, CA V IT Y NUM B E R
A ND DA T E CO DE A P P RO X W HE RE S HO W N P E R INT E L M A RK ING
S T A N D A R D 164997
6 CRIT ICA L T O F UNCT IO N DIM E NS IO N
7. A LL D I M E N S I O N S S H O W N S H A LL B E M E A S U R E D F O R F A I
8. N O T E R E M O V E D
9. D E G A T E : F LU S H T O 0. 35 B E LO W S T R U C T U R A L T H I C K N E S S
(G A T E W E LL O R G A T E R E C E S S A C C E P T A B LE )
10. F LA S H : 0. 15 M A X .
11. S I N K : 0. 25 M A X .
12. E J E C T O R M A R K S : F LU S H T O -0. 25
13. P A R T I N G LI N E M I S M A T C H N O T T O E X C E E D 0. 25.
14. E J E C T I O N P I N B O S S E S , G A T I N G , A N D T O O LI N G I N S E R T S R E Q U I R E
I N T E L'S A P P R O V A L P R I O R T O T O O L C O N S T R U C T I O N .
A LL E J E C T I O N P I N B O S S E S A N D G A T E F E A T U R E S S H O W N
A R E F O R R E F E R E N C E O N LY .
2X 31. 1 15. E D G E S S H O W N A S S H A R P R 0. 1 M A X .
[ 1. 225 ] 16. T O O LI N G R E Q U I R E D T O M A K E T H I S P A R T S H A LL B E T H E
2X 27. 95 P R O P E R T Y O F I N T E L, A N D S H A LL B E P E R M A N E N T LY M A R K E D
[ 1. 100 ] W I T H I N T E L'S N A M E A N D A P P R O P R I A T E P A R T N U M B E R .
17. A LL S E C O N D A R Y U N I T D I M E N S I O N S A R E F O R R E F E R E N C E O N LY .

2 0. 05 6
[ . 079 . 001 ]

S EE DE T A IL A

34 Thermal and Mechanical Design Guidelines

 Mechanical Drawings

Figure 16. (G)MCH Reference Heatsink for ATX Platforms – Ramp Retainer Sheet 2

5. 56 6 4
[ . 219 ] [ . 157 ]

DE T A IL C
S C A LE 10

2X 2. 9 6
[ . 114 ]

6. 4
[ . 252 ]

4. 7 5 6 3. 15 6
[ . 187 ] [ . 124 ]
2X 5. 76 6
2. 75 [ . 227 ]
[ . 108 ]

1. 75 6
[ . 069 ]

0. 5 6
5. 2 [ . 020 ]
[ . 205 ]

1. 19
[ . 047 ]

SE CT IO N B -B
3 2X D E T A I L A
[ . 118 ] S C A LE 20
6. 55
[ . 258 ]

Thermal and Mechanical Design Guidelines 35

 Mechanical Drawingss

Figure 17. (G)MCH Reference Heatsink for ATX Platforms – Wire Preload Clip

19. 3 0. 5
[ . 76 0 . 019 ]

A2 F A R S IDE A2
27. 3 0. 5
[ 1. 075 . 019 ] A
A

46. 6 0. 5
[ 1. 8 35 . 019 ]

F A R S ID E A3
A3
T Y P R 1. 8
[ . 071 ] NO T E S :

1. T H I S D R A W I N G T O B E U S E D I N C O R R E LA T I O N W I T H S U P P LI E D 3D
2X 90 D A T A B A S E F I LE . A LL D I M E N S I O N S A N D T O LE R A N C E S O N T H I S
D R A W I N G T A K E P R E C E D E N C E O V E R S U P P LI E D F I LE A N D A R E
A P P LI C A B LE A T P A R T F R E E , U N C O N S T R A I N E D S T A T E U N LE S S
INDICA T E D O T HE RW IS E .
2. T O LE R A N C E S O N D I M E N S I O N E D A N D U N D I M E N S I O N E D
F E A T U R E S U N LE S S O T H E R W I S E S P E C I F I E D :
D I M E N S I O N S A R E I N M I LLI M E T E R S .
T O LE R A N C E S : LI N E A R 0. 25
A N G LE S : 1
3. M A T E R I A L:
A ) T Y P E : A S T M A 228 M U S I C W I R E 1. 8 0. 1M M 4
P LA T I N G : E LE C T R O -LE S S N I C K E L O R E Q U I V A LE N T U P O N
I N T E L A P P R O V A L.
B ) CRIT ICA L M E CHA NICA L M A T E RIA L P RO P E RT IE S
F O R E Q U I V A LE N T M A T E R I A L S E LE C T I O N :
T E N S I LE Y I E LD S T R E N G T H (A S T M D 638) > 965 M P a
F LE X U R A L M O D U LU S (A S T M D 638) 210 G P a 10%
A 4 CRIT ICA L T O F UNCT IO N DIM E NS IO N
5. M A R K W I T H I N T E L P / N A N D R E V I S I O N P E R I N T E L M A R K I N G
S T A N D A R D 164997; P E R S E C 3. 8 (P O LY E T H Y LE N E B A G )
A1 6. R E M O V E A LL S H A R P E D G E S A N D B U R R S .
A
7. A LL D I M E N S I O N S S H O W N S H A LL B E M E A S U R E D F O R F A I
8. A LL S E C O N D A R Y U N I T D I M E N S I O N S A R E F O R R E F E R E N C E O N LY .
37. 06
[ 1. 459 ]

2. 65
[ . 104 ]

S E CT IO N A -A

27. 7 4
[ 1. 090 ]
61. 74 0. 5
[ 2. 431 . 019 ]

A2 A3

36 Thermal and Mechanical Design Guidelines

 Mechanical Drawings

Figure 18. (G)MCH Reference Heatsink for Balanced Technology Extended (BTX) Platforms

( 55.88 ) C
[ 2.20 ] N OTES:
1. PR OC U R EM EN T SPEC IFIC ATION A02160 SH ALL APPLY
2. R EM OVE ALL BU R R S AN D SH AR P ED GES
3 . C R ITIC AL TO FU N C TION D IM EN SION S

( 33 )
[ 1.30 ]

47.88
B [ 1.885 ]
( 15 )
15X EQU AL SPAC ES [ .591 ]
( 1.94 ) 16X 1.17
3 0.25
FU LL R [ .08 ] R 0 TO FU LL [ .046 ]
[ .118 .009 ]
2X 7.25 0.2
[ .285 .007 ]

2X 1.17 A 24.2
[ .046 ] [ .953 ]

2X 1.2 3.4 0.2

[ .047 ] 19 [ .134 .007 ]
[ .748 ]
3 3 0.2
R 0 TO 0.5[.020]
[ .118 .007 ] 3

19
[ .748 ]

0.08 [.003]
0.25 [.009] B C

Thermal and Mechanical Design Guidelines 37

 Mechanical Drawingss

Figure 19. (G)MCH Reference Heatsink for Balanced Technology Extended (BTX) Platforms – Clip

( 1.80 ) A1 FAR SIDE

[ .071 ]

25.14 4.1
[ .990 ] [ .161 ]

27.3 2X 90 B
[ 1.075 ] B

35.3
[ 1.390 ] A2
FAR SIDE
WIRE TERMINATION
FAR SIDE WITHIN 10.0
A3
62.6 1
[ 2.465 .039 ] SECTION B-B
SCALE 10:1
A

2X 26.16
DETAIL C [ 1.030 ]
SCALE 8:1
( 10.27 )
A [ .404 ]

47.36
[ 1.865 ]
( 3.80 )
4 [ .150 ]
8.87 1.25 VIEW A
[ .349 .049 ] NOTES:
1. REMOVE ALL SHARP EDGES AND BURRS
4 2. MATERIAL: ASTM A228 MUSIC WIRE 1.8 MM STOCK
3.8 3. TOTAL WIRE LENGTH = 121.9 MM
A [ .150 ] 4 CRITICAL TO FUNCTION DIMENSIONS
5. PLATING: ELECTRO-LESS NICKEL
A1
R 1.3 4X R 1.8
[ .051 ] [ .071 ]
TYP A
A3

A2

SEE DETAIL C

38 Thermal and Mechanical Design Guidelines

 Mechanical Drawings

Figure 20. (G)MCH Reference Heatsink for Balanced Technology Extended (BTX) Platforms – Heatsink Assembly

NOTES:
1. THIS DRAWING TO BE USED IN CONJUNCTION WITH SUPPLIED 3D
DATABASE FILE. ALL DIMENSIONS AND TOLERANCES ON THIS
3 DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE AND ARE
APPLICABLE AT PART FREE, UNCONSTRAINED STATE UNLESS
INDICATED OTHERWISE.
2. FINISH: NONE
3. ALL SECONDARY UNIT DIMENSIONS ARE FOR REFERENCE ONLY. TOLERANCES
SHALL BE CALCULATED FROM PRIMARY UNITS TO AVOID TRUNCATION ERRORS.
4. ITEMS WITHOUT INTEL PART NUMBER SHALL BE MANAGED
AND PROCURED BY SUPPLIER
5 .ASSEMBLY TO BE MARKED WITH INTEL P/N APPROX. WHERE SHOWN.
6. ATTACH THERMAL INTERFACE MATERIAL WHERE SHOWN. REMOVABLE PROTECTIVE
BARRIER APPLIED OVER INTERFACE MATERIAL.
C ( 55.88 )
[ 2.200 ]

( 19 )
[ .748 ]

( 33 )
( 19 ) [ 1.299 ]
[ .748 ]
2

0.25 [.009] A B C

Thermal and Mechanical Design Guidelines 39