Professional Documents
Culture Documents
NLR-TP-2013-314
Anthony Fokkerweg 2
P.O. Box 90502
1006 BM Amsterdam
The Netherlands
Telephone +31 (0)88 511 31 13
Fax +31 (0)88 511 32 10
Web site: http://www.nlr.nl
UNCLASSIFIED Nationaal Lucht- en Ruimtevaartlaboratorium
National Aerospace Laboratory NLR
Executive summary
Report no.
NLR-TP-2013-314
Author(s)
J. van Es
H.J. van Gerner
Report classification
UNCLASSIFIED
Date
July 2013
Knowledge area(s)
Ruimtevaartinfrastructuur
Avionicasystemen
Lucht- en Ruimtevaart constructie-
en fabricagetechnologie
Descriptor(s)
Heat Pipes
Cooling Systems
Problem area are elucidated by recent examples in Flying Platforms
Increasing power densities in Space Platforms
space and aerospace projects.
Ships
platform electronic subsystems lead
to more common use of latent heat Results and conclusions
as means of heat transportation to Design guidelines are presented to
make use of the large evaporation define the applicability of two-
heat per mass unit working fluid. phase technologies for land- air-
space- and marine-based systems.
Description of work The article concludes with
In this article first an overview of development needs for successful
the state-of-the-art two-phase heat introduction of two-phase
transport systems is given. Then the technologies in near future
advantages and disadvantages of platforms.
two-phase heat transport systems
This report is based on an article published in the Electronics Cooling Magazine of March 2013.
UNCLASSIFIED
UNCLASSIFIED Benefits and Drawbacks of Using Two-Phase Cooling
Technologies in Military platforms
NLR-TP-2013-314
http://www.electronics-cooling.com/2013/03/benefits-and-drawbacks-of-using-two-phase-cooling-
technologies-in-military-platforms/.
This report is based on an article published in the Electronics Cooling Magazine of March 2013
The contents of this report may be cited on condition that full credit is given to NLR and the authors.
Contents
Heat Pipes 3
Thermosyphons 3
Vapor Chambers 5
Conclusions 8
References 8
2
NLR-TP-2013-314
Featured
Heat Pipes
Thermosyphons
HE NEX T GENERATION is to optimize the systems to enable pipe a capillary structure is imple-
T
military platforms will be them to fully exploit their existing ca- mented (axial grooves and/or a capillary
equipped with more and pabilities. One of the focal points will be wick) and therefore contains the liquid
more powerful sensors the reduction of the temperature drop in the pipe.
and avionics. The increas- between the dissipating electronics and On one end of the heat pipe dis-
ing power densities in the heat sink as illustrated in Figure 1. sipating electronics are attached. The
electronic subsystems demand more In this article, an overview of the dissipated heat evaporates the liquid,
cooling power while survivability re- different types of two-phase cooling and absorbs the heat. By the creation of
quirements limit the possibilities for systems is given, including the main ad- the additional vapor the vapor flows to
extending or adding cooling systems. vantages and drawbacks, and examples the other side of the heat pipe where it
This trend inevitably leads to thermal of their use. condenses and subsequently rejects the
challenges which need to be solved. heat. The liquid is pumped back by capil-
There are two main approaches for HEAT PIPES lary action closing the loop. Because the
solving these problems. The first aims The most well-known two-phase evaporation and condensation “occurs”
to increase the cooling capacity of the heat transport system is the heat pipe at the same temperature the tempera-
system. It is most practical for new plat- [2]. A heat pipe is a closed pipe filled ture drop over the pipe is only a few
forms. The second approach, more suit- with vapor and liquid of a dedicated degrees induced by the vapor pressure
able for upgrades of existing platforms, working fluid. On the walls of the heat drop over the pipe. Heat pipes are widely
used in terrestrial design (laptops,
CPU-cooling) and spacecraft thermal
design (heat pipe radiators). The main
Johannes van Es is senior R&D manager of the Thermal Control Group of drawback of heat pipes is their poor
the National Aerospace Laboratory NLR. He is responsible for new system and performance when used against gravity.
component developments in satellite and aircraft thermal management. His
activities range from S/C thermal system design, consultancy in special heat
pipe design and radar cooling, to new thermal component developments. He THERMOSYPHONS
was as project manager responsible for the Tracker Thermal Control System A special type of heat pipe is the
(TTCS) Development for the Alpha Magnetic Spectrometer (AMS02). He is also
point of contact for the Dutch National Space Roadmap “Thermal Management thermosyphon. A thermosyphon is a
and Cooling Systems” to coordinate Dutch developments in S/C thermal heat pipe which uses gravity to trans-
management and streamline with ESA developments. van Es has a MSc in port the liquid. The heat is therefore
physics engineering and and MSc in process engineering, both at Twente
University in the Netherlands. always collected and evaporated on
the bottom side and condensed at the
top side where the heat is removed by
Henk Jan van Gerner is a research engineer at the Thermal Control forced cooling or radiation. The liquid
Group of the NLR. He has extensive experience in the design and development
of advanced two-phase cooling systems for both terrestrial and space flows back to the bottom to close the
applications. His current work is focused on the development of lightweight loop. Thermosyphons are for example
vapour-compression cycles, numerical modeling of pumped two-phase
cooling systems, and systems with very accurate temperature control (0.001°C used in mountainous areas to keep
accuracy) at varying heat loads. van Gerner studied mechanical engineering roads or railways snow-free. The design
and obtained his Ph.D. in the Physics of Fluids group at Twente University in is straightforward and robust, however
the Netherlands.
even more dependent on orientation
than a normal heat pipe.
FIGURE 1a: Typical electronics box with indicated thermal path from junc- FIGURE 1b: Typical temperature drop from junction to environment. The
tion to ambient air. lower line shows a system without two-phase technology implemented.
Red: junction temperature, orange: case temperature, green: wedge-lock The upper line shows a system with two two-phase systems implemented
temperature, light blue: coolant temperature after collecting the heat from indicated with red line segments. A heat pipe system is integrated in the
the electronics, dark blue: coolant temperature cold side, purple: environ- electronics board between case and wedge-lock and a two-phase pumped
ment temperature. system is integrated to replace a liquid cooling system. This results in a
Remark: A wedge-lock is rugged fastener or card retainer used to clamp a lower ∆T. A reduced temperature drop allows to reject/transfer the dissi-
PCB within electronics box slot [1]. pated heat at a higher temperature level to the environment. This can relax
the overall cooling system requirements.
4 Electronics COOLING 29
NLR-TP-2013-314
Vapor Chambers
FIGURE 2 (a) Heat pipe working principle (Source: Wikipedia), (b,c) typical cross sections of commercially available heat pipes.
VAPOR CHAMBERS
A less common type of heat pipe is the vapor chamber. In
fact it is a flat heat pipe with a very small length over diameter
ratio. Vapor chambers are used to increase heat transfer of
heat sinks, for example to enhance CPU- or power electronics
cooling. Vapor chambers are gravity dependent but flat ver-
THERMAL INTERFACE sions or types with the right wick design can be ruggedized
MATERIALS to withstand acceleration forces. This type of heat pipes are
mainly used as heat spreader but can also be used for accurate
HIGH PERFORMANCE & LOW COST OPTIONS (mK-level) temperature control.
FROM 1 to 17 Watt/M-K!
LOOP HEAT PIPES (LHP) AND CAPILLARY PUMPED LOOPS (CPL)
The Loop Heat Pipe (LHP) and Capillary Pumped Loop
(CPL) are more advanced types of heat pipes. These loops
separate, concentrate and optimize the capillary pumping
action in the evaporator section (See Figure 3).
LHP’s and CPL’s can therefore provide more pumping
Gap Filler Pads Thin Films Greases Putty Form-In-Place power and work to a certain extent (few meters) against grav-
Die-Cuts Extrusions Non-Silicone ity. Main difference between the LHP and CPL is that the
CPL has a separate temperature controlled reservoir which
can dictate the saturation temperature in the evaporator and
therefore set the payload temperature. In a LHP the reservoir
(or compensation chamber) and evaporator are combined, this
gives an advantage in starting up over the CPL as the wick of
the evaporator is wetted in all conditions. Drawback of the
LHP is the variation in payload temperature with payload
power. LHP’s are available over a large range of heat transport
capacities (10W to 1kW), and are used extensively in satellite
design and ground-based applications and also in specific
applications for fighter aircraft (F-16 and UAV’s).
For Technical Data, Samples, Engineering Support
Get Our Catalog,Visit Our Site www.fujipoly.com or Another drawback of LHP’s and CPL’s is the difficulty
Call 732.969.0100 to extend them to multi-evaporator systems. Extensive re-
search to multi-evaporator LHP’s has been performed [4]
6 Electronics COOLING 31
NLR-TP-2013-314
8 Electronics COOLING 33