Lenovo A850 Maintenance Manual v1.0

Service Manual of
Lenovo A850 Mobile

Phone
LENOVO
Repair Manual of Lenovo S920 Mobile Phone
Document name Service Manual of Lenovo A850Mobile Phone

Version: V100
Date: Sept. 19, 2013
Document No.:
Status:
Preface
This manual is intended for online repair guidance and after-sale repair guidance of Lenovo
A750 mobile phone produced by the Company
The content of this manual will be upgraded according to the needs of technology
development.
Copyright
The copyright of this manual belongs to Lenovo Mobile; anyone who reproduces this manual
without written consent of the Company shall bear legal responsibility.
2
Content
1. APPEARANCE...............................................................................................................................6
2. LAYOUT OF MAIN BOARD.........................................................................................................7
3. BASEBAND....................................................................................................................................9
3.1 LCD DISPLAY...........................................................................................................................10

3.1.1 No display on screen after power-on..................................................................................10
3.1.2 LCD backlight without lighting..........................................................................................11
3.2 CAMERA DEFECTS....................................................................................................................12
3.2.1 Rear camera defects...........................................................................................................12
3.2.2 Front camera defects..........................................................................................................13
3.3 RING AND VIBRATION..............................................................................................................14
3.3.1 No vibration........................................................................................................................14
3.3.2 No ring................................................................................................................................15
3.4 CHARGING...............................................................................................................................16
3.4.1 No charging display after plugging the charger in...............................................................16
3.4.2 Charging shown but not full charging...................................................................................17
3.5 KEYBOARD AND KEYBOARD BACKLIGHT................................................................................18
3.5.1 Abnormal operation of side keys...........................................................................................18
3.5.2 Abnormal operation of CTP keyboard..................................................................................19
3.5.3 Abnormal Display of RGB LED.............................................................................................19
3.6 CALLING..................................................................................................................................20
3.6.1 No voice heard from the other side during the call...............................................................20
3.6.2 No voice heard from your side during the call......................................................................21
3.7 POWER-ON FAILURE.................................................................................................................22
3.8 LCD ON WHEN CLOSE TO THE EAR DURING THE CALL; LCD OFF WHEN AWAY FROM THE EAR.
23
4. RADIO FREQUENCY (RF).........................................................................................................24
4.1 SOFTWARE DOWNLOAD FAILURE...................................................................................................24

4.2 PRODUCTION CALIBRATION............................................................................................................25
4.2.1 AFC calibration......................................................................................................................25
4.2.2 AGC........................................................................................................................................26
4.2.3 APC........................................................................................................................................27
4.3 FAULT IN COMPLETE SET TEST/ REWORK.......................................................................................29
4.3.1 Switch spectrum & PVT template with excessive standard....................................................29
4.3.2 High Frequency Error............................................................................................................30
4.3.3 High Phase Error...................................................................................................................30
4.3.4 Power output problems..........................................................................................................31
4.4 WCDMA FORECAST.......................................................................................................................32
4.4.1 RSSI_Cal................................................................................................................................32
4.4.2 TPC_Cal.................................................................................................................................32
4.5 WCDMA COMPREHENSIVE TEST...................................................................................................34
3
4.5.1 ACLR or SEM.........................................................................................................................34

4.5.2 ILPC comprehensive test abnormal.......................................................................................34
4.5.3 FrequencyErr.........................................................................................................................34
5. STRUCTURE ASSEMBLY..........................................................................................................35
5.1 ASSEMBLY PROCESS SEQUENCE OF LENOVO S820 MAIN BODY.....................................................35

5.2 PRECAUTIONS IN LENOVO S820 MAIN BODY ASSEMBLY...............................................................37
5.3 Precautions in disassembly of Lenovo S820 main body for repairing..........................................38
4
Version Prepared by/ Prepared/M Reason for
Main changes
No. Modified by odified on change
1 Appearance
2 Layout of main board

Front of main board:
Back of main board:
7
8
3 Baseband
Block diagram of hardware system
9
10
LCD display
3.1.1 No display on screen after power-on
White screen or blank screen without display; backlight

with lighting
Check whether the connection of LCD FPC is Y

good and re-assembled FPC phone is normal OK
Check whether the display is normal after Y

replacing LCD, OK
Check whether the EMI device E1601,E1602, Y

OK
E1603 of LCD circuit on main board is welded
incompletely; re-weld EMI device
Check whether there is cold solder joint on other

device around LCD and on LCD connector.
11
3.1.2 LCD backlight without lighting
12
LCD backlight without lighting
Check whether the connection of FPC on

LCD module and connector on main board is Y
good and whether the LCD backlight is OK
normal after reconnection
Re-verify whether the LCD backlight is Y

normal after replacing LCD. OK
N
Y
Check whether there are voltages more than If the backlight circuit is
20V between both ends of C1606 when LCD normal, it is the problem
is lit. of LCD
Check the welding condition of U1601

and peripheral devices, including Y
L1601, D1601, OK
C1606,C1604 ， R1606,R1608 ， R16
09
13
Camera defects
3.1.3 Rear camera defects
14
Can not take photos
Check to see whether the camera Y

module is in the right position by
disassembling and whether the module OK
is OK after reassembling module
Whether the camera is OK

Y
after replacing the camera OK
module
Y
Check to see whether the camera
module connector is welded well; OK
whether the camera is OK after
overlaying welding the connector?
Check to see whether the EMI N

device is complete and welding is Recheck after overlaying welding
in good condition; if not; repair
EMI device
Check to see whether

the front camera is Y
Recheck after replacing front
abnormal camera
Check to see whether the main Re-weld or replace U1201

chip U1201 are normally N
welded?
15
3.1.4 Front camera defects
Can not take photos
Y
Check to see whether the front
OK
camera is abnormal After
replacing it,
Check whether E1604, Y

E1608 ,E1609 is well OK
welded.
N
N
Re-weld or replace
Check whether the U1201
U1201 and U1302
and are normally welded?
16
Ring and vibration
3.1.5 No vibration
No vibration
Check whether the motor is interfered by

structure; Recheck whether it is normal after Y
OK
reassembling the phone.
Replace the motor or main FPC

to see whether it is ok? Check to Y
see whether the circuit around the OK
motor is normal
Replace U1302 chip
17
3.1.6 No ring
No ring
Replace Speaker and recheck whether it is Y

normal?
Check to see whether the SPK contact OK
shrapnel is normal?
Replace main FPC and check whether it is OK . Y

Check whether main FPC connector is welded OK
well
Use earphone to test whether there is sound; if

there is sound from earphone, there is audio Y
signal to input. Check whether U1201(@Sub OK
PCBA) module device is of cold solder joint;
recheck whether it is ok after re-welding,
Check to see whether the main chip U1302 is

damaged. Replace it if damaged.
18
Charging
3.4.1 No charging display after plugging the charger in
No charging display after

plugging the charger in
Y
Check whether the charging is normal
after replacing the charger. Replace the charger
Y
Replace the battery and see whether the
Replace the battery
charging is normal? Measure the battery
voltage to see whether it is less than 3V
Y
Check to see whether U1301 module
device is well welded? Whether it is OK
normal after re-welding
N
Y
Replace U1302 OK
19
3.4.2 Charging shown but not full charging
Charging shown but not

full charging
Y
Replace the battery and then check whether it
OK
is fully charged
Check to see whether R1305 is wellY There is charging

welded. During charging, measure Y
current; go to check the
whether the voltage between both ends battery.
of R1305 is over 68mV
Replace U1301 module device and Y

then recheck OK
N
Y
Replace U1302 OK
20
Keyboard
3.5.1 Abnormal operation of CTP keyboard
CTP
CTP keyboard
keyboard is
is invalid
invalid
Y CTP damaged,
Whether the CTP test is
replace it
normal?
Replace one CTP to see Y

whether it is the problem of Replace CTP
touch screen or main board?
It is the problem of CTP connector

J1603or main chip U1201 welding
21
Calling
3.6.1 No voice heard from the other side during the call
22
No voice heard from the

other side during the call
N
Cold solder joint
Use earphone and hands-free to verify of main chip or
whether there is voice? main chip is
abnormal
Y
Y
Replace the headphones and then OK
rechek whether it is normal
Check whether B1401,B1403 are well Y

welded. Re-weld and test OK
Replace U1201
23
3.6.2 No voice heard from your side during the call
No voice heard from your side during the

call
Check whether MIC and the peripheral devices are Y

well welded; whether it is ok after re-welding? Re-weld
N
Y
Whether it is ok after replacing SUB ＯＫ
board?
N
Y
Whether it is ok after replacing main FPC? OK
Check whether MIC module device is well

welded. Re-welded this device and see whether it Y
is ok? OK
Check U1201
24
Power-on failure
Failed to Power-on
Y
Check whether the power key FPC is Re-weld
assembled well , reassembling the
power FPC ?
Power on the phone on separate main Y The main board is damaged;

board , whether there is high current? replace the main board and check
the failure board step by step
N
Check whether the 26MHz on
U2104 is normal? Whether there is Re-weld and recheck
26MHz signal on R2118?
Y
N
Check whether X1301, C1336
and C1337are well welded Re-weld and recheck
Check whether the main power supply of U1302 N Re-weld or

is normal? replace device
（ VCORE,VAPROC,VDD18,VTCXO,VDD25_ U1302 to
VA1,VDD28,VMC, etc. ） recheck
Replace the main chip U1201
25
LCD on when close to the ear during the call; LCD off
when away from the ear.
Abnormal display of LCD

during the call.
Y
Check whether P-Sensor related circuit is p-sensorFPC
normal? Or replace p-sensorFPC Problem
N
Y Replace the application
Whether the touch screen is well of gum of touch screen
pasted with the shell and re-paste
Check whether G-SENSOR and touch screen

is normal. If G-SENSOR and touch screen is
normal, I2C is normal, or else, U1201 is
abnormal..
Check U1201
26
4 Radio frequency (RF)
4.1 Software Download Failure
 Faults: Software can’t be normally downloaded.

 Reason: Baseband chip is oppositely pasted or is in cold solder joint; CRYSTAL is oppositely
pasted (no clock signal) or is in cold solder joint.
 Shooting:
27
Software can’t be normally downloaded or the

phone can’t Power-onbe turned on.
Whether baseband chip Y

MT6582 （ U1201 ） is Re-weld U1201
oppositely pasted
N
Check whether U2101 is Y

in cold solder joint Re-weld U2101
Check whether TCXO Y

Re-weld U2104
（ U2104 ） is oppositely
pasted?
Separately check whether U2104 is in cold solder joint?
Re-weld the elements in cold solder joint
 Re-download software when it is normal after replacing elements,.
4.2 Production calibration
4.2.1 AFC calibration
 Fault: AFC calibration Fail.

 Reason: RF test cable is not connected well during calibration; TCXO is oppositely pasted or in
cold solder joint.
28
 Shooting:
AFC calibration
Fail
Check whether RF cable and

N
fixture is well connected? Reconnect and calibrate
Check whether TCXO Y Re-weld U2104

（ U2104 ） is oppositely
pasted?
Check whether TCXO Y Re-weld U2104

（ U2104 ） is in cold solder
joint?
N
Check whether there is power Y Replace

output from PA (U2102) PA （ U2102 ）
Recalibrate
 Notes: Remember to recalibrate after replacing elements.
4.2.2 AGC
 Fault: AGC calibration Fail.

 Reason: RF test cable is not connected well during calibration; the devices in receiving cable are
in cold solder joint (such as RF connectors, antenna switch, saw the filter and the surrounding
capacitance).
29
 Shooting：
Rx path lo
calibration
fails
N Check calibration report to see Y

whether the two frequency
bands fail?
GSM frequency Y Whether C2117,L2101 is in Y Re-weld Check whether RF cable N

cold solder joint and fixtures are well Reconnect
band fails? and calibrate
connected?
N
N
Y
Whether C2130,L2102is in
Y cold solder joint? Whether Rx is in cold
Re-weld Y Re-weld or Check whether RF
solder joint? replace Y Re-weld
connector CON2201 is in
cold solder joint? CON2201
N
N
Whether Rx is in Whether L2104, L2105,L2106 Re-weld or
Y
Re-weld/Replace cold solder joint? are in cold solder joint? replace Whether R2115,C2131 is
coupler Y Re-weld
in cold solder joint?
N
N
Whether differential pathare
Replace the Y
welding
Check the transceiver chip

MT6166(U2101U601)and
the baseband chip U1201
 Notes: Remeber to recalibrate after replacing compements.
4.2.3 APC
Fault 1
30
 Fault: APC calibration Fail.

 Cause: RF test cable is not connected well during calibration; PA is oppositely pasted; PA and
peripheral circuit are in cold solder joint; The patch of RF input circuit of PA is deviated with
short-circuit shield box.
 Shooting:
PCL calibration Fail
N Check calibration report to Y

see whether each frequency
bands fail?
N DCS1800/PCS190 Check whether RF

GSM frequency N Reconnect
0 frequency fail cable and fixtures are
fails? and calibrate
well connected?
Y Y
Y
PA input PA input R2115, Replace
Re-weld R2115,C2131 are C2131are welded with Y Whether RF connector
components Y Re-weld
welded with disconnection ？ CON2201are in cold
disconnection? solder joint?
N
N
N
Weld PA Y Whether PA is in Whether Y Replace PA
Whether PA （ U2102 ） Y Re-weld
U2102 cold solder joint? PA(U2102) is in
is in cold solder joint? U2102
cold solder joint?
 Notes:Remeber to recalibrate after replacing compements; the problem analysis of PCS TX APC
is the same as DCS.
31
Fault 2:
 Fault: The output power of the mobile phone is too high.
 Cause: The cable isn't well connected in calibration.
 Shooting:
Calibration power is too high
Check RF cable and fixtures to

ensure well connection
Reconnect and calibrate
Fault 3:
 Fault: After repeated calibration, the power is still low.
 Cause: Some element patches of PA and surrounding VAPC input are displaced or PA is damaged.
 Shooting:
After repeated calibration, the

power is still low.
PA （ U2102 ） may be
partially damaged; N Replace Vramp circuit
recalibrate.
32
4.3 Fault in complete set test/ rework
4.3.1 Switch spectrum & PVT template with excessive standard
 Fault: The switch spectrum and PVT template of GSM and DCS frequency bands are excessive.
 Cause: The cold solder joint or damage to R2111in V_ramp of PV may result in the excessive
switch spectrum.
 Shooting:
Switch spectrum and Ramp

Mask with excessive standard
Measure to see whether the voltage of Pin18 of PA

（ U2102, ） is in the normal range (1.8V or less)?
Check whether the input and output matching is

Replace the elements in cold

solder joint
Replace PA if necessary
33
4.3.2 High Frequency Error
 Fault: Frequency Error exceeds standard in complete set test.

 Cause: There is problem in VAFC input circuit of TCXO.
 Shooting:
Excessive Frequency Error
Recalibrate
Check whether U2104 is in cold solder joint or

damaged
Replace the elements in cold solder joint
4.3.3 High Phase Error
 Fault: Phase Error exceeds standard in complete set test.

 Cause: The capacitors of power supply part of PA and transceiver are in cold solder joint or in
short circuit with other resistance.
 Shooting:
34
Excessive Phase Error
Check the power supply part of PA （ U2102 ） and

transceiver（U2101）
Replace the elements in cold

solder joint
4.3.4 Power output problems
 Fault: Normally power-on and receive, but when outputting two frequency bands or single
frequency band power, there is no input power or the input power is very low.
 Cause: There are many reasons for no output power or very low power, which may be the results
of faults of Transceiver output part, PA input and output circuit, antenna connector and antenna
switch control signal or power supply circuit. Specific circumstances are:
 RF connector（CON2101）
Checking: Whether RF connector CON2101 and the test probe of RF test cable are well connected
or the patch is oppositely pasted or the antenna connector is damaged.
Shooting: Replace antenna connector and ensure right direction of patch.
 RF power amplifier (PA)

A. Whether the control signal PA_ENABLE （Pin17）of PA is high level (about 2.8V); if it is
low level, there is no output of PA;
B. Check the Pin3 Pin4 of PA power supply part to see whether the power supply voltage is in the
normal range (typically 3.6V ~ 4.2V);
C. Whether the RF input parts of PA are in cold solder joint;
D. Whether the RF output R2115,C2131 of PA is in cold solder joint;
E. Part circuit of V_ramp control signal of PA: if it is in old solder joint or in interruption of
circuit, PA also has no output power.
 Transceiver（U2101）
A. Whether the power supply voltage of Transceiver （U2101） is within normal range; check
the power supply voltage between power supply filtration capacitor and U2101 connection and
then check whether the surrounding circuit is in cold solder joint.
B. Whether there is cold solder joint or short circuit in Transceiver （U2101）.
35
If it is possible to repair the complete set, the output power of each module on transmission
channel can be detected through spectrum analyzer probes when keeping the phone in the constant state
of maximum power. Under normal circumstances,
A. About GSM 33dBm and DCS/PCS 30dBm output power can be detected on the output end of
RF connector.
B. About 3dBm output power can be detected on matching circuit C2102,R2105,C2101,R2102 of
PA input end;
C. About 32dBm or 29dBm output power can be respectively detected on pin26 connection of PA
output end;
D. About 3dBm output power can be detected on Transceiver (U2101) output end.
4.4 WCDMA forecast
4.4.1 RSSI_Cal
Fault: RSSI fails

Cause: There are problems in receiving channel
Repair manner:
RSSI_cal
RSSI Fail ？
Whether TX module U2102 Y

and RF connector CON2101 Re-weld
are in cold solder joint?
Check whether Band1 and the

surrounding circuit devices are Y
Re-weld
in cold solder joint or partially
pasted
36
4.4.2 TPC_Cal
Fault: TPC fails

Cause: There are problems in transmission channel
Repair manner:
TPC
Check whether RF cable and fixtures are Y Reconnect and c

well connected? alibration
Whether Rf connector CON2101 ， Tx

module U2201 and the surrounding circuit Y Re-weld
devices are in cold solder joint ？
Whether WCDMA PA
U2102 is oppositely pasted Y Re-weld
or in cold solder joint?
Whether the duplexer

U2201 through which Y
Re-weld
WCDMA transmission
channel passes is in cold
solder joint?
37
4.5 WCDMA comprehensive test
4.5.1 ACLR or SEM
Fault: ACLR or SEM

Cause: No calibration or WCDMA PA （ U2202 ） is in cold solder joint; RF transceiver
(U2101) doesn’t work well.
Repair manner:
ACLR or SEM
Whether it is OK after recalibrating WCDMA?
Re-weld PA or replace PA and the devices in

transmission circuit?
Re-weld or replace
transceiver
4.5.2 ILPC comprehensive test abnormal
Fault: ILPC
Cause: No calibration or just passing calibration.
Repair manner: The same as 4.5.1.
38
4.5.3 FrequencyErr
Fault: FrequencyErr
Cause: No calibration, or suffered outside interference
Repair manner: Recalibrate WCDMA and test; replace U2104.
5 Structure assembly
5.1 Assembly
1.main pcb assembly

20.volume key
22.P-sensor Silica gel
11.P-sensor FPC 19.power key 6.0.3M sub camera
4.5M main camera 8.receiver 40.sub camera foam
12.volume key FPC
21.light guidance
18.camera lens
39.earphone mylar
30.bat_cov heat-conductive graphite
16.P-sensor frame
29.LCD heat-conductive
graphite
27.bolts
41.CPU thermally conductive
43.BB thermally conductive
42.PMUthermally conductive
13.RF cable line

15.battery cover assembly 28. battery film
44.battery
33. LCD elecloth 32.LCD foam 3.LCD
17.rear housing assembly
7. SPK 14.front housing assembly
9.motor
35.spk seal foam
33.LCD elecloth 10.main FPC 5.TP
38.SPK elecloth 2.sub pcb
23.BB shielding
34.sub pcb elecloth
Figure 5-1 Exploded View of LENOVO A850

As the explode drawing 5-1
（1）Assemble BB shield cover to main PCBA；
（2）Soldering volume key FPC to main PCBA；
（ 3 ） Insert ZIF connecting finger of PS/power key FPC to ZIF conn on
main PCBA. Snap BB conn of main camera, sub camera and main FPC to
main PCBA. Snap the plug of RF cable to the socket on main PCBA.
39
（4） Assemble the bracket for PS FPC to main PCB. Assemble PS FPC to
the bracket. Assemble PS rubber sleeve onto PS. Snap BB conn of main FPC
to sub PCBA. Snap the plug of RF cable to the socket on sub PCBA.
（5）Assemble LCD to front housing assembly.
（6）Assemble TP to front housing assembly.
（7）Assemble main PCBA and sub PCBA to front housing assembly. Insert
ZIF connecting finger of CTP FPC to ZIF conn on the main PCBA. Snap BB
conn of LCD to the socket on the main PCBA. Put the cable into the slot of
front housing. Fasten 2 screws for the main PCBA. Assemble sub PCBA to
front housing.
（8）Affix the film for battery cavity onto the sheet metal of front housing.
（9）Assemble the speaker to rear housing.
（10）Assemble volume key and power key to front housing.
（11）Assemble rear housing to front housing, and then fasten 9 screws for
housing.
（12）Assemble battery cover to the general assembly.
5.2 Attentions in Lenovo A850 assembly
（1）assemble TP to front housing need to use pressing fixture.

（2）Main FPC should be matched to the right terminal.
（3）Sleeve for PS should be assembled with the right orientation.
（4）Before soldering, volume key FPC should be aligned to the print mark.
The FPC should be bended gently when assembling to front housing.
（5） Assembly Cable line in right place to prevent rear housing flattening
cable line
（6）Speaker should be assembled with the right orientation.
40

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Service Manual of

Lenovo A850 Mobile

Document name Service Manual of Lenovo A850Mobile Phone

2. LAYOUT OF MAIN BOARD.........................................................................................................7

3.1 LCD DISPLAY...........................................................................................................................10

4. RADIO FREQUENCY (RF).........................................................................................................24

4.1 SOFTWARE DOWNLOAD FAILURE...................................................................................................24

4.5.1 ACLR or SEM.........................................................................................................................34

5.1 ASSEMBLY PROCESS SEQUENCE OF LENOVO S820 MAIN BODY.....................................................35

2 Layout of main board

Back of main board:

Block diagram of hardware system

3.1.1 No display on screen after power-on

White screen or blank screen without display; backlight

Check whether the connection of LCD FPC is Y

Check whether the display is normal after Y

Check whether the EMI device E1601,E1602, Y

Check whether there is cold solder joint on other

3.1.2 LCD backlight without lighting

LCD backlight without lighting

Check whether the connection of FPC on

Re-verify whether the LCD backlight is Y

Check the welding condition of U1601

3.1.3 Rear camera defects

Can not take photos

Check to see whether the camera Y

Whether the camera is OK

Check to see whether the EMI N

Check to see whether

Check to see whether the main Re-weld or replace U1201

3.1.4 Front camera defects

Can not take photos

Check whether E1604, Y

Ring and vibration

Check whether the motor is interfered by

Replace the motor or main FPC

Replace U1302 chip

Replace Speaker and recheck whether it is Y

Replace main FPC and check whether it is OK . Y

Use earphone to test whether there is sound; if

Check to see whether the main chip U1302 is

3.4.1 No charging display after plugging the charger in

No charging display after

3.4.2 Charging shown but not full charging

Charging shown but not

Check to see whether R1305 is wellY There is charging

Replace U1301 module device and Y

3.5.1 Abnormal operation of CTP keyboard

Replace one CTP to see Y

It is the problem of CTP connector

No voice heard from the

Check whether B1401,B1403 are well Y

3.6.2 No voice heard from your side during the call

No voice heard from your side during the

Check whether MIC and the peripheral devices are Y

Check whether MIC module device is well

Power on the phone on separate main Y The main board is damaged;

Check whether the main power supply of U1302 N Re-weld or

Replace the main chip U1201

when away from the ear.

Abnormal display of LCD

Check whether G-SENSOR and touch screen

4 Radio frequency (RF)