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Call For Papers INTERCON 2018 PDF
Call For Papers INTERCON 2018 PDF
Rama Estudiantil
UNMSM
www.intercon.org.pe
INTERCON 2018
25th International Conference on Electronics, Electrical Engineering and Computing
th th
Lima, Perú, 8 to 10 August 2018
Information Contact: Computing (C) Electronics and Communications (EC) Electrical Engineering (EE)
Jorge Guzmán Paucar-ExCom Chair Ÿ Algorithms and Complexity Ÿ Broad Band Communication Ÿ Geo-informative Systems
jorgeluisgp@ieee.org Ÿ Architecture and Organization Ÿ Computer and Intelligent Communication Ÿ Soft Computing Techniques in
Ÿ Graphics and Visualization Ÿ Mobile and Optical Communication Power Systems
Adela Contreras Gamboa-ExCom
Vice Chair Ÿ Human-Computer Interaction Ÿ Wireless Communication Ÿ Feedback Control Systems
adela.contreras.gamboa@ieee.org Ÿ Information Assurance and Security Ÿ Mobile and Optical Networks Ÿ Power Electronics and Energy
Ÿ Information Management Ÿ Wireless Sensor Networks Efficient Drives
Estefanie Espinoza Quispe-ExCom Ÿ Intelligent Systems Ÿ Network Security Ÿ Renewable Power Conversion
Secretary Ÿ Networking and Communications Ÿ Microelectronics Technologies
estefanie.espinozaquispe@ieee.org
Ÿ Operating Systems Ÿ Embedded Wireless Systems Ÿ Instrumentation and Control
Alessandra Olazabal Dominguez- Ÿ Parallel and Distributed Computing Ÿ Signal and Image Processsing Ÿ Power Quality Improvement
ExCom Member-at-Large Ÿ Software Engineering Ÿ Artificial Intelligence Techniques
alessandra.olazabal@ieee.org Ÿ Social Issues and Professional Ÿ Aerospace Technology Ÿ Expert Systems and Artificial
Practice Ÿ Biomedical Engineering Intelligence Techniques
Ÿ Control Systems
Ÿ Robotics
Ÿ Analog and digital circuits and systems
Important Dates
Full paper submission deadline: April 30th, 2018
Notification of acceptance: June 15th, 2018
Final paper submission deadline: June 30th, 2018
Conference dates: August 08th to 10th, 2018
Technical Sponsor:
Organized by:
www.intercon.org.pe