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, 3, 231–239, 2014
www.j-sens-sens-syst.net/3/231/2014/
doi:10.5194/jsss-3-231-2014
© Author(s) 2014. CC Attribution 3.0 License.
Abstract. Field-effect hydrogen gas sensor devices were fabricated with the structure of a series connection
between Schottky junctions and β-Ga2 O3 /6H-SiC heterojunctions. β-Ga2 O3 thin films were deposited on n-type
and p-type 6H-SiC substrates by gallium evaporation in oxygen plasma. These devices have rectifying properties
and were characterized as hydrogen sensors by a Pt electrode. The hydrogen-sensing properties of both devices
were measured in the range of 300–500 ◦ C. The Pt/Ga2 O3 /n-SiC device revealed hydrogen-sensing properties as
conventional Schottky diode-type devices. The forward current of the Pt/Ga2 O3 /p-SiC device was significantly
increased under exposure to hydrogen. The behaviors of hydrogen sensing of the devices were explained using
band diagrams of the Pt/Ga2 O3 /SiC structure biased in the forward and reverse directions.
Published by Copernicus Publications on behalf of the AMA Association for Sensor Technology.
1
2 Experimental Al / Ti / Al / Pt
+
2.1 Preparation of β -Ga2 O3 thin film
Figure 1. (a) Schematic diagram of a hydrogen gas sensor device
The β-Ga2 O3 layer was prepared using gallium evapora- 2 based on the Pt/Ga2 O3 /n-SiC structure. A positive Pt electrode is
tion in oxygen plasma. After the SiC substrate was heated referred to as forward bias. (b) Schematic diagram of a hydrogen
3 gas sensor device based on the Pt/Ga O /p-SiC structure. A positive
to 800 ◦ C, 4 mL min−1 of O2 was supplied into the vacuum 2 3
4 p-type SiC
Figure 1. layer is referred
(a) Schematic to asofforward
diagram bias.
a hydrogen gas sensor device based on the Pt/Ga2O3/n-S
chamber to form oxygen plasma at 100 W RF power. The 5 positive Pt electrode is referred to as forward bias. (b) Schematic diagram of a hydrogen gas
pressure of the chamber at that time was about 5×10−4 Torr. 6 on the Pt/Ga2O3/p-SiC structure. A positive p-type SiC layer is referred to as forward bias.
Gallium was thermally evaporated using a crucible in the 7 forward bias is where the n-type SiC is biased negatively or
chamber. Then the β-Ga2 O3 thin film was formed on the
when the p-type SiC is biased positively. The device based
SiC substrate. The preparation and crystal orientation of β-
on the Pt/Ga2 O3 /n-SiC structure corresponds to a series con-
Ga2 O3 layers on sapphire substrates with this method have
nection between a Schottky diode and a Ga2 O3 /SiC hetero-
been previously reported (Nakagomi and Kokubun, 2013).
junction diode in the same direction. The device based on the
We prepared the Ga2 O3 layer on a (001) c-plane 6H-SiC sub-
Pt/Ga2 O3 /p-SiC structure corresponds to a series connection
strate using the same method as in the case of sapphire sub-
between a Schottky diode and a Ga2 O3 /SiC heterojunction
strates and then evaluated the Ga2 O3 layer. From the mea-
diode in opposite directions to each other.
surement of the X-ray diffraction pattern of the Ga2 O3 layer,
the estimated peak from β-Ga2 O3 (111) was observed. This
indicated that the Ga2 O3 layer formed on the 6H-SiC sub- 2.3 Device evaluation
strate is β-Ga2 O3 . Additionally, several crystal grains were A sensor device was placed in a quartz tube furnace with
observed in a cross-sectional TEM image of the Ga2 O3 layer. a thermocouple to monitor the temperature. The tempera-
We think that the β-Ga2 O3 layer included several crystal ori- ture of the device was controlled for measurements at 300,
entations. 400 and 500 ◦ C. SiC and β-Ga2 O3 are well known as wide
band gap semiconductors; therefore, these devices based on
2.2 Fabrication of device structures β-Ga2 O3 and SiC can operate at higher temperatures.
A mixed gas of N2 , O2 , H2 and 1 % H2 / N2 set using
Two types of sensor devices, shown in Fig. 1, were fabri- mass-flow controllers was supplied into the 25 mm diame-
cated. One device consisted of a β-Ga2 O3 layer deposited on ter quartz tube. Oxygen and hydrogen concentrations were
an n-type 6H-SiC substrate with a resistivity of 0.09 cm. As determined by means of a control flow rate for each gas. The
an ohmic electrode for n-type SiC, Ni (100 nm)/Ti (30 nm)/Pt total flow rate was maintained at 500 mL min−1 for all mea-
(100 nm) layers were evaporated successively onto the sub- surements. The I –V characteristics were measured in 20 %
strate, followed by annealing at 1000 ◦ C for 2 min in ni- O2 / N2 and 200 ppm H2 / N2 atmospheres at 300, 400 and
trogen. The other device consisted of a β-Ga2 O3 layer de- 500 ◦ C using a source meter (Keithley 2400). A constant cur-
posited on a p-type 6H-SiC substrate with a resistivity of rent source and digital recorder were used to measure hy-
2.2 cm. As an ohmic electrode, Al (10 nm)/Ti (20 nm)/Al drogen response curves. The hydrogen concentration was in-
(100 nm)/Pt (100 nm) layers were evaporated successively termittently increased from 40 to 10 000 ppm in the 20 %
onto the p-type 6H-SiC substrate, followed by annealing at O2 / N2 atmosphere at 5 min intervals.
1000 ◦ C for 2 min in nitrogen. A thin Pt layer (30 nm) with a
diameter of ca. 1 mm was evaporated onto the β-Ga2 O3 layer
through a metal mask as a Schottky electrode. In this study,
200ppm H2 in N2 1.0
Current (mA)
o
300 C 1.0
500oC
Current (mA)
(a)
0.5
200ppm H2
0.0 0.5
-10 -8 -6 -4 -2 0 2
Current (mA)
20% O2 Voltage (V)
o
0.5
(b) 400 C
Voltage (V)
20% O2 -3 -2 -1 0 1
0.0 0.0
-3 -2 -1 0 1 0ppm
Voltage (V) 100ppm
200ppm H 200ppm
Current (mA)
2 -0.5
(c) o 1.0 500ppm
500 C
0.5 1000ppm -0.5
20% O2
0.0
-3 -2 -1 0 1 2000ppm
-0.5 Voltage (V)
20% O2+200ppm H2
-1.0 H2 concentration
200ppm H2 under 20% O2 in N2-1.0
Figure 2. I –V characteristics of Pt/Ga2 O3 /n-SiC device in 20 % Figure 3. Dependence of I –V characteristics of a Pt/Ga2 O3 /n-SiC
O2 / N2 , 200 ppm H2 / N2 and 20 % O2 + 200 ppm H2 in N2 mea- 2 device on H2 concentration under 20 % O2 atmosphere at 500 ◦ C.
sured at (a) 300, (b) 400 and (c) 500 ◦ C. I –V characteristics in 200ppm H2 / N2 are also shown.
3
3 Results and discussion are similar to the behavior in a conventional gas sensor de-
2
4 vice with a Schottky diode structure. We have reported on
3 Figure 2. I-V characteristics
3.1 I –V characteristics
of Pt/Ga O
2 3
/n-SiC device in 20% O 2
/Na2,hydrogen
200 ppm H gas
2
/Nsensor
2
and 20%
withOa2+200ppm H2 in structure fab-
Schottky diode
4 N2 measured at (a) 300, (b) 400 and (c) 500 °C. ricated using a β-Ga O single-crystal substrate (Nakagomi
5 Figure 3. Dependence 2 3 of I-V characteristics of Pt/Ga O /n-SiC de
5 3.1.1 Pt/Ga2 O3 /n-type SiC heterojunction device et al., 2011b). The dependence of I –V characteristics on hy- 2 3
0.075
Current (mA)
200ppm H2 20% oxygen in nitrogen
0.050 0.6
(a) o 20% O2+ hydrogen
300 C 40 100
200ppm H2 200 500 1000 4000 6000 10000
0.025 ppm
0.5
Voltage (V)
20% O2
0.000
-10 -8 -6 -4 -2 0 2 4 6
500oC, 100µA
0.75
Voltage (V)
(b) Current (mA) 200ppm H2 0.4
o 0.50
400 C 20% O2+
0.25 200ppm H2
0.3
20% O2
0.00
-10 -8 -6 -4 -2 0 2 4 6 0 20 40 60 80
Voltage (V)
Time (minute)
Current (mA)
1.0
(c) 200ppm H
2 2
o
500 C 20% O2+
0.5 Figure 6. Response voltage curves for the Pt/Ga2 O3 /n-SiC gas sen-
200ppm H2 3 sor device with intermittent increases in the H2 concentration in a
0.0 20% O2 20 % O2 / N2 atmosphere at 500 ◦ C. The forward bias current of the
-10 -8 -6 -4 -2 0 2 4 6
4 device was kept at 100 µA.
Voltage (V)
1.5
3.2.1 Pt/Ga2 O3 /n-type SiC heterojunction device
1000ppm
1.0 Response curves of the sensor devices were measured to
investigate the hydrogen gas sensitivity, response time and
500ppm recovery time. Figure 6 shows voltage response curves for
0.5
the Pt/Ga2 O3 /n-SiC structure device under constant current
200ppm
100ppm (100 µA) at 500 ◦ C where the device was biased in the for-
0ppm
0.0 ward direction. The H2 concentration was intermittently in-
0 2 4 6 8
Voltage (V) creased from 40 to 10 000 ppm in the 20 % O2 /N2 atmo-
sphere. The voltage changed with an increase in the H2 con-
Figure 25. Dependence of I –V characteristics of Pt/Ga2 O3 /p-SiC centration, except for hydrogen concentrations lower than
device on H concentration under 20 % O atmosphere at 500 ◦ C.
3 Figure 5 . Dependence of I-V characteristics of Pt/Ga2O3/p-SiC device200
2 2 on Hppm. A sharp
2 concentration change
under 20% O2 in the voltage was observed in
I –V characteristics in 200ppm H2 / N2 are also shown. the region of 500–10 000 ppm H2 . The response and recov-
4 atmosphere at 500 °C. I-V characteristics in 200ppm H2/N2 are also shown.
ery were almost completed within a few seconds. The results
demonstrate that the sensor device can detect almost 500 ppm
the Pt/Ga2 O3 /p-SiC heterojunction structure is considered to H2 gas in air. Despite the very small response voltage of
be a feasible hydrogen sensor device with a large response less than 0.2 V and the higher sensing limit of 500 ppm, the
under forward bias conditions. Pt/Ga2 O3 /n-SiC device structure under forward bias demon-
Figure 5 shows dependence of the forward I –V charac- strated a quick response and recovery.
teristics of the Pt/Ga2 O3 /p-SiC device on hydrogen concen- When the Pt/Ga2 O3 /n-SiC structure was biased in reverse,
tration under 20 % O2 in N2 at 500 ◦ C. I –V characteristics the device could detect lower hydrogen concentrations and
in 200 ppm H2 / N2 are also shown. In 20 % O2 atmosphere give a larger voltage response than when forward biased.
1
without hydrogen, the forward current was low. The for- Figure 7 shows voltage response curves for the device un-
ward current increased with increasing hydrogen concentra- der constant current (50 µA) at 300, 400 and 500 ◦ C. The de-
tion. The current was more increased in 200 ppm H2 in a N2 vice was able to detect 40 ppm hydrogen gas in 20 % O2 .
atmosphere without O2 . In the conditions of higher hydro- The behavior at 500 ◦ C was remarkable. The change in volt-
gen concentration than 500 ppm, the rate of current increase age amounted to 5 V for 4000 ppm hydrogen, whereas the
7 12
hydrogen hydrogen
40 100 200 500 1000 4000 6000 10000 40 100 200 500 1000 4000 6000 10000
6 ppm 10 ppm
5 500oC, 50µA
Voltage (V)
20% oxygen 8
300oC, 50µA
Voltage (V)
0 0
0 20 40 60 80 0 20 40 60 80
Time (minute) Time (minute)
2 2
Figure 7. Response voltage curves for the Pt/Ga2 O3 /n-SiC gas sen- Figure 8. Response voltage curves for the Pt/Ga2 O3 /p-SiC gas sen-
3 sor device with intermittent increases in the H2 concentration 3
in a sor device with intermittent increases in the H2 concentration in a
20 % O2 / N2 atmosphere at 300, 400 and 500 ◦ C. The reverse bias 20 % O2 / N2 atmosphere at 300, 400 and 500 ◦ C. The forward bias
4 current7.
Figure of Response
the device was kept at curves
voltage 50 µA. for the Pt/Ga O /n-SiC
2 3
gas sensor
current device
of the devicewith intermittent
was kept at 50 µA. increases in the H
2
5 concentration in a 20% O2/N2 atmosphere at 300, 400 4 and 500 °C. The reverse bias current of the device was
6 kept at 50
voltage µA. almost zero for the hydrogen concentrations
reached In the measurement of the response curve shown in Fig. 8,
higher than 4000 ppm. Although the response time for 5 hy- the temperature of the device rose and fell by around 1 ◦ C
drogen concentrations higher than 4000 ppm was within 6a for
Figureeach temperaturevoltage
8. Response condition at intervals
curves for theofPt/Ga
about O
10 /p-SiC
min. gas senso
few seconds, the recovery time became slower than that when 2 3
These temperature fluctuations did not have a large influence
forward biased. 7 concentration
on the responseinofa 20% O2/N2 atmosphere at 300, 400 and 500 °C. T
the device.
In the measurements of the response curve shown8 in at 50 µA.
keptBecause the present sensor devices with Pt/Ga2 O3 /n-
Figs. 6 and 7, the temperature of the device rose and fell SiC or Pt/Ga2 O3 /p-SiC structure are fabricated from semi-
9
by around 1 ◦ C for each temperature condition at intervals conductor materials, the sensor devices must be influenced
of about 10 min. These temperature fluctuations did not have by temperature fluctuation. If the sensors are used under the
a large influence on the response of the device. condition with large temperature fluctuation, the tempera-
ture compensation system should be contrived as we demon-
3.2.2 Pt/Ga2 O3 /p-type SiC heterojunction device strated in the previous report (Nakagomi et al., 2013a).
o
300 C, 50µA
∆EV
o 2.43 eV
400 C, 50µA
4
(b)
Pt β-Ga2O3 (p) 6H-SiC
2
Pt/Ga2O3/n-SiC qVD+∆EC
(reverse) 2.28 eV 3.02 eV
0 1.65 eV
100 1000 10000
Hydrogen concentration (ppm)
4.9 eV qVD +∆EV
Figure 9. Relationship between the voltage response and hydrogen
concentration for the Pt/Ga2 O3 /n-SiC and Pt/Ga2 O3 /p-SiC devices 4.16 eV
in a 20 % O2 / N2 atmosphere at 300, 400 and 500 ◦ C.
Figure 10. Energy band diagrams for hydrogen gas sensor devices
Figure 9.4 Relationship
Discussion between the voltage response and based
hydrogen
on the (a)concentration for(b)the
Pt/Ga2 O3 /n-SiC and Pt/Ga
Pt/Ga 2O3struc-
2 O3 /p-SiC
/n-SiC and
Pt/Ga2O3/p-SiC devices in a 20% O2/N2 atmosphere 2 at 300,
tures.400 and 500 °C.
4.1 Energy band diagram
The expected band diagram for the hydrogen gas sensor3de- considerably higher than the barrier of 2.28 eV for conduc-
vice based on the Pt/Ga2 O3 /n-SiC and Pt/Ga2 O3 /p-SiC struc- tion electrons from β-Ga2 O3 to p-type 6H-SiC when p-type
4 Figure 10. Energy band diagrams for hydrogen gas sensor devices based
SiC is used as a substrate. Even when n-type SiC is used as
tures under zero bias is shown in Fig. 10a and b. β-Ga2 O3 has
5 Pt/Ga 2 O 3/p-SiC
substrate,
structures.
the energy barrier for holes from n-type 6H-SiC
a wider band gap than 6H-SiC, and the electron affinity of
β-Ga2 O3 and 6H-SiC has been reported as 4.0 and 3.456eV, to β-Ga2 O3 of 2.43 eV is considerably higher than the bar-
respectively (Mohamed et al., 2012; Davydov 2007). There- rier for conduction electrons from 6H-SiC to β-Ga2 O3 in the
fore, the offset in the conduction band, 1EC of 0.55 eV, and conduction band. Therefore, only electrons can be consid-
the offset in the valence band, 1EV of 2.43 eV, should exist ered as the charge carriers for both device structures.
at the heterointerface in the ideal case. As a result, it is es-
timated that there was a barrier (qVD -1EC ) of 0.45 eV for 4.2 Ga2 O3 /n-type SiC heterojunction device
conduction electrons in n-type SiC of the Pt/Ga2 O3 /n-SiC
structure. VD is the sum of the built-in potential formed at We considered reasons why the device based on heterojunc-
both sides of heterointerface. For the Pt/Ga2 O3 /p-SiC struc- tions of Ga2 O3 /n-type SiC has hydrogen-sensing properties
ture device, the barrier (qVD + 1EC ) for conduction elec- for each bias condition. Figure 11a and b show schematic
trons in the Ga2 O3 layer is 2.28 eV. A Schottky barrier of band diagrams for the Pt/Ga2 O3 /n-type SiC structure in the
1.65 eV is also formed between Pt and the β-Ga2 O3 layer forward and reverse bias directions, respectively. The applied
if the work function of Pt is 5.65 eV. However, it is known voltage of the device V is distributed to the bias voltage V1
that this Schottky barrier height is changed depending on the applied to the Schottky junction and the bias voltage V2 ap-
hydrogen concentration in the atmosphere. plied to the n–n heterojunction between Ga2 O3 and n-type
It is important that holes in the SiC region not be able SiC.
to flow into the β-Ga2 O3 layer, because the energy barrier
of 4.16 eV for holes from p-type 6H-SiC to β-Ga2 O3 is
Pt β-Ga2O3 (n) 6H-SiC When the device with the Pt/Ga2 O3 /n-type SiC structure
is forward biased, both the Schottky junction and the n–n
heterojunction are biased in the forward direction. Therefore,
(a) both V1 and V2 are positive. The band diagram in Fig. 11a
qφBn shows that electrons in n-type SiC flow into the Ga2 O3 region
q(V1+V2) by getting over the barrier at the interface and flow to the Pt
+ qV1 electrode over the Schottky barrier. In this case, two barriers
are lowered because both barriers are forward biased. When
the barrier qϕBn is lowered due to hydrogen gas exposure,
the flow of electrons from Ga2 O3 to Pt is increased. However,
the influence of the barrier height change is small because the
Schottky junction is already biased in the forward direction
and the barrier height for conduction electrons from Ga2 O3
(b) to Pt is already lowered.
qφBn The barrier for electron transport from Ga2 O3 to Pt is
higher than the barrier of qVD − 1EC from n-type SiC to
q(V1+V2) Ga2 O3 ; therefore, V1 V2 and assume V = V1 , and so
qV1
+ V = ϕBn + const. (4)
1
1
sensing was explained using several band diagrams for bias Nakagomi, S. and Kokubun, Y.: Crystal Orientation of β-Ga2 O3
in the forward and reverse directions. Thin Films Formed on c-Plane and a-Plane Sapphire Substrate,
J. Cryst. Growth, 349, 12–18, 2013.
Edited by: Y. X. Li Nakagomi, S., Kaneko, M., and Kokubun, Y.: Hydrogen Sensitive
Reviewed by: two anonymous referees Schottky Diode Based on β-Ga2 O3 Single Crystal, Sensor Lett.,
9, 35–39, 2011a.
Nakagomi, S., Ikeda, M., and Kokubun, Y.: Comparison of Hydro-
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