Philips Semiconductors Product specification

Silicon Diffused Power Transistor BU1507AX

GENERAL DESCRIPTION
Enhanced performance, new generation, high-voltage, high-speed switching npn transistor in a plastic full-pack
envelope intended for use in horizontal deflection circuits of colour television receivers and computer monitors.
Features exceptional tolerance to base drive and collector current load variations resulting in a very low worst case
dissipation.

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT
VCESM Collector-emitter voltage peak value VBE = 0 V - 1500 V
VCEO Collector-emitter voltage (open base) - 700 V
IC Collector current (DC) - 8 A
ICM Collector current peak value - 15 A
Ptot Total power dissipation Ths ≤ 25 ˚C - 45 W
VCEsat Collector-emitter saturation voltage IC = 4 A; IB = 0.95 A - 1.0 V
VCEsat Collector-emitter saturation voltage IC = 4 A; IB = 0.8 A - 5.0 V
ICsat Collector saturation current f = 16kHz 4 - A
tf Fall time ICsat = 4 A; f = 16kHz 0.25 0.5 µs

PINNING - SOT186A PIN CONFIGURATION SYMBOL

PIN DESCRIPTION c
case

1 base
2 collector
b
3 emitter

case isolated
1 2 3 e

LIMITING VALUES
Limiting values in accordance with the Absolute Maximum Rating System (IEC 134)
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VCESM Collector-emitter voltage peak value VBE = 0 V - 1500 V
VCEO Collector-emitter voltage (open base) - 700 V
IC Collector current (DC) - 8 A
ICM Collector current peak value - 15 A
IB Base current (DC) - 4 A
IBM Base current peak value - 6 A
-IB(AV) Reverse base current average over any 20 ms period - 100 mA
-IBM Reverse base current peak value 1 - 5 A
Ptot Total power dissipation Ths ≤ 25 ˚C - 45 W
Tstg Storage temperature -65 150 ˚C
Tj Junction temperature - 150 ˚C

THERMAL RESISTANCES
SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT
Rth j-hs Junction to heatsink with heatsink compound - 3.7 K/W
Rth j-a Junction to ambient in free air 55 - K/W

1 Turn-off current.

October 1997 1 Rev 1.100

Philips Semiconductors Product specification

Silicon Diffused Power Transistor BU1507AX

ISOLATION LIMITING VALUE & CHARACTERISTIC

Ths = 25 ˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Visol R.M.S. isolation voltage from all f = 50-60 Hz; sinusoidal - 2500 V
three terminals to external waveform;
heatsink R.H. ≤ 65% ; clean and dustfree
Cisol Capacitance from T2 to external f = 1 MHz - 10 - pF
heatsink

STATIC CHARACTERISTICS
Ths = 25 ˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
2
ICES Collector cut-off current VBE = 0 V; VCE = VCESMmax - - 1.0 mA
ICES VBE = 0 V; VCE = VCESMmax - - 2.0 mA
Tj = 125 ˚C
IEBO Emitter cut-off current VEB = 7.5 V; IC = 0 A - - 1.0 mA
BVEBO Emitter-base breakdown voltage IB = 1 mA 7.5 13.5 - V
VCEOsust Collector-emitter sustaining voltage IB = 0 A; IC = 100 mA; 700 - - V
L = 25 mH
VCEsat Collector-emitter saturation voltages IC = 4 A; IB = 0.8 A - - 5.0 V

VBEsat Base-emitter saturation voltage IC = 4 A; IB = 0.8 A - - 1.1 V

hFE DC current gain IC = 100 mA; VCE = 5 V - 17 -
hFE IC = 4 A; VCE = 5 V 5.0 7.0 9.0

DYNAMIC CHARACTERISTICS
Ths = 25 ˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT
Cc Collector capacitance IE = 0 A; VCB = 10 V; f = 1 MHz 68 - pF
Switching times (16 kHz line ICsat = 4 A; IB(end) = 0.7 A; LB = 6 µH;
deflection circuit) -VBB = 4 V
ts Turn-off storage time 5.0 6.0 µs
tf Turn-off fall time 0.25 0.5 µs

2 Measured with half sine-wave voltage (curve tracer).

October 1997 2 Rev 1.100

Philips Semiconductors Product specification

Silicon Diffused Power Transistor BU1507AX

ICsat hFE BU2507AF/X

TRANSISTOR
100
IC DIODE VCE = 1 V
Ths = 25 C
t Ths = 85 C

IB IBend

t 10

20us 26us

64us

VCE

1
t 0.01 0.1 1 10 IC / A 100

Fig.1. Switching times waveforms. Fig.4. High and low DC current gain. hFE = f (IC)
VCE = 1 V

ICsat hFE BU2507AF/X

100
90 %
VCE = 5 V
Ths = 25 C
IC Ths = 85 C

10 %
tf 10
t
ts
IB
IBend

1
- IBM 0.01 0.1 1 10 IC / A 100

Fig.2. Switching times definitions. Fig.5. High and low DC current gain. hFE = f (IC)
VCE = 5 V

+ 150 v nominal VCEsat / V BU2507AF/X

adjust for ICsat 10

Ths = 25 C
Ths = 85 C

Lc 1

IC/IB = 3
IC/IB = 4
IC/IB = 5
IBend LB T.U.T. 0.1
Cfb

-VBB
0.01
0.1 1 10 IC / A 100

Fig.3. Switching times test circuit. Fig.6. Typical collector-emitter saturation voltage.
VCEsat = f (IC); parameter IC/IB

October 1997 3 Rev 1.100

Philips Semiconductors Product specification

Silicon Diffused Power Transistor BU1507AX

PD% Normalised Power Derating

VBEsat / V BU2507AF/AX 120
1.2 with heatsink compound
Ths = 25 C 110
Ths = 85 C 100
1.1
90
IC = 4 A 80
1
70
60
0.9
50
IC = 3 A 40
0.8 30
20
0.7 10
0
0.6 0 20 40 60 80 100 120 140
0 0.5 1 1.5 IB / A 2 Ths / C
Fig.7. Typical base-emitter saturation voltage. Fig.10. Normalised power dissipation.
VBEsat = f (IB); parameter IC PD% = 100⋅PD/PD 25˚C = f (Tmb)

Ptot / W BU2507AF/DF/AX/DX Zth / K/W BU2507AF/X/DF/X

10 10

Ths = 25 C
Ths = 85 C 0.5
1
0.2
0.1
0.05
1 0.1
0.02

PD tp tp
D=
T
0.01 D=0
t
T

0.001
0.1 1E-06 1E-4 10E-2 1E+00
0 0.5 1 IB / A 1.5 2
t/s

Fig.8. Typical losses. Fig.11. Transient thermal impedance.

PTOT = f (IB); IC = 4 A; f = 16 kHz Zth j-hs = f(t); parameter D = tp/T

ts/tf/ us BU2507AF/AX/Df/DX85ts/tf
10

0
0 0.5 1 1.5 IB / A 2

Fig.9. Typical collector storage and fall time.

ts = f (IB); tf = f (IB); IC = 4.0 A; Tj = 85˚C; f = 16 kHz

October 1997 4 Rev 1.100

Philips Semiconductors Product specification

Silicon Diffused Power Transistor BU1507AX

MECHANICAL DATA

Dimensions in mm
Net Mass: 2 g 10.3
max
4.6
max
3.2
3.0 2.9 max

Recesses (2x) 2.8

2.5 6.4
0.8 max. depth
15.8
15.8 19 seating max
max. max. plane
3 max.
not tinned

3
2.5

13.5
min.

1 2 3

0.4 M 1.0 (2x)

0.6
2.54 0.9
0.5 0.7
5.08 2.5 1.3

Fig.12. SOT186A; The seating plane is electrically isolated from all terminals.

Notes
1. Refer to mounting instructions for F-pack envelopes.
2. Epoxy meets UL94 V0 at 1/8".

October 1997 5 Rev 1.100

Philips Semiconductors Product specification

Silicon Diffused Power Transistor BU1507AX

DEFINITIONS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and
operation of the device at these or at any other conditions above those given in the Characteristics sections of
this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
 Philips Electronics N.V. 1997
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the
copyright owner.
The information presented in this document does not form part of any quotation or contract, it is believed to be
accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under patent or other
industrial or intellectual property rights.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices or systems where malfunction of these
products can be reasonably expected to result in personal injury. Philips customers using or selling these products
for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting
from such improper use or sale.

October 1997 6 Rev 1.100

This datasheet has been download from:

www.datasheetcatalog.com

Datasheets for electronics components.