www.osram-os.

com
Produktdatenblatt | Version 1.1
KG DELLS1.22
 

KG DELLS1.22
TOPLED ® E1608
The TOPLED E1608 expands OSRAM Opto Semi-
conductors’ low power portfolio by offering one of the
smallest LED Industry standard footprints in a highly
reliable and well proven package concept.
Its outstanding performance is suitable for a huge
variety of applications especially automotive interior
where a small package design with excellent reli-
ability is needed. The TOPLED E1608 is available in
different colors and brightness levels.

Applications
——Cluster, Button Backlighting ——Interior Illumination (e.g. Ambient Map)
——Electronic Equipment

Features:
——Package: white SMT package, colorless clear resin
——Chip technology: InGaAlP


——Typ. Radiation: 120° (Lambertian emitter)
——Color: λdom = 570 nm (● green)
——Corrosion Robustness Class: 2B
——Qualifications: AEC-Q102 Qualified
——ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)


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Ordering Information 
Type Luminous Intensity 1) Ordering Code
IF = 2 mA
Iv

KG DELLS1.22-JGKH-24 4.5 ... 9.7 mcd Q65112A4849




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Maximum Ratings
Parameter Symbol Values

Operating Temperature Top min. -40 °C

max. 110 °C
Storage Temperature Tstg min. -40 °C
max. 110 °C
Junction Temperature Tj max. 125 °C
Forward current IF max. 20 mA
TS = 25 °C
Surge Current IFS max. 100 mA
t ≤ 10 µs; D = 0.005 ; TS = 25 °C
Reverse voltage 2) VR max. 12 V
TS = 25 °C
ESD withstand voltage VESD 2 kV
acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)




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Characteristics
IF = 2 mA; TS = 25 °C
Parameter Symbol Values

Peak Wavelength λpeak typ. 572 nm

Dominant Wavelength 3) λdom min. 565 nm
IF = 2 mA typ. 570 nm
max. 575 nm
Spectral Bandwidth at 50% Irel,max ∆λ typ. 22 nm
Viewing angle at 50% IV 2φ typ. 120 °
Forward Voltage 4) VF min. 1.70 V
IF = 2 mA typ. 1.80 V
max. 2.20 V
Reverse current 2) IR max. 10 µA
VR = 12 V 
Temperature Coefficient of Peak Wavelength TCλpeak typ. 0.1 nm / K
-10°C ≤ T ≤ 100°C
Temperature Coefficient of Dominant Wavelength TCλdom typ. 0.1 nm / K
-10°C ≤ T ≤ 100°C
Temperature Coefficient of Forward Voltage TCVF typ. -2.4 mV / K
-10°C ≤ T ≤ 100°C
Real thermal resistance junction/ambient 5)6) RthJA real max. 490 K / W
Real thermal resistance junction/solderpoint 5) RthJS real typ. 100 K / W
max. 130 K / W




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Brightness Groups 
Group Luminous Intensity 1) Luminous Intensity. 1) Luminous Flux 7)
IF = 2 mA IF = 2 mA IF = 2 mA
min. max. typ.
Iv Iv ΦV

JG 4.5 mcd 5.2 mcd 16.0 mlm

JH 5.2 mcd 6.1 mcd 18.6 mlm
JI 6.1 mcd 7.1 mcd 21.8 mlm
KG 7.1 mcd 8.2 mcd 25.2 mlm
KH 8.2 mcd 9.7 mcd 29.5 mlm

Wavelength Groups 
Group Dominant Wavelength 3) Dominant Wavelength 3)
IF = 2 mA IF = 2 mA
min. max.
λdom λdom

2 565 nm 569 nm
3 569 nm 572 nm
4 572 nm 575 nm




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Group Name on Label 

Example: JG-2
Brightness Wavelength

JG 2




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Relative Spectral Emission 7)

Irel = f (λ); IF = 2 mA; TS = 25 °C

KG DELLS1.22
1,0
Irel
: Vλ
: green

0,8

0,6

0,4

0,2

0,0
350 400 450 500 550 600 650 700 750 800
λ [nm]

Radiation Characteristics 7)

Irel = f (ϕ); TS = 25 °C
KG DELLS1.22

ϕ [°]
-10° 0° 10° 20° 30° 40° 50° 60° 70° 80° 90°
-20° 1,0
Irel


-30° : 0°
: 90°
-40° 0,8

-50°
0,6
-60°

0,4
-70°

-80° 0,2

-90° 0,0

-100°


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Forward current 7) Relative Luminous Intensity 7), 8)

IF = f(VF); TS = 25 °C Iv/Iv(2 mA) = f(IF); TS = 25 °C

KG DELLS1.22
20
KG DELLS1.22 IV
IF [mA]
IV(2mA) 14
18

12
16

14 10

12
8

10
6
8

4
6

4 2

2
1 0
1,7 1,75 1,80 1,85 1,90 1,95 2,00
1

4
6
8
10
12
14

20
16
18
VF [V] IF [mA]




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Relative Luminous Intensity 7)

Iv/Iv(25 °C) = f(Tj); IF = 2 mA
KG DELLS1.22
Iv 3,0
Iv(25°C)

2,5

2,0

1,5

1,0

0,5

0,0
-40 -20 0 20 40 60 80 100 120
Tj [°C]




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Max. Permissible Forward Current

IF = f(T)

22
IF / mA
20

18

16

14

12
: Ta
10 : Ts

0
0 20 40 60 80 100
T / °C

Permissible Pulse Handling Capability

IF = f(tp); D: Duty cycle
KG DELLS1.22

TS = 0°C ... 110°C

IF [A] 0,12

0,10 
: D = 1.0
: D = 0.5
0,08 : D = 0.2
: D = 0.1
: D = 0.05
: D = 0.02
0,06 : D = 0.01
: D = 0.005

0,04

0,02
10-6 10-5 10-4 10-3 0,01 0,1 1 10
Pulse time [s]


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Dimensional Drawing 9)

Further Information:
Approximate Weight: 2.0 mg

Package marking: Cathode

Corrosion test: Class: 2B

Test condition: 25°C / 75 % RH / 10 ppm H2S / 21 days (IEC 60068-2-43)




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Recommended Solder Pad 9)

All products are packed in a dry pack bag (Moisture Barrier Bag, MBB) according MIL-PRF-81705, after opening the MBB the
products should go to reflow soldering process. Unused remaining LEDs should be protected from environment due to silver
plated soldering terminal. In order to maintain solderability it is recommended to protect the silver plated solder terminals from
corrosive environment before soldering. For superior solder joint connectivity results we recommend soldering under standard
nitrogen atmosphere.




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Reflow Soldering Profile

Product complies to MSL Level 2 acc. to JEDEC J-STD-020E
OHA04525
300
˚C
T 250
240 ˚C Tp 245 ˚C
217 ˚C tP
200
tL

150
tS

100

50
25 ˚C
0
0 50 100 150 200 250 s 300
t

Profile Feature Symbol Pb-Free (SnAgCu) Assembly Unit

Minimum Recommendation Maximum
Ramp-up rate to preheat*) 2 3 K/s
25 °C to 150 °C
Time tS tS 60 100 120 s
TSmin to TSmax
Ramp-up rate to peak*) 2 3 K/s


TSmax to TP
Liquidus temperature TL 217 °C
Time above liquidus temperature tL 80 100 s
Peak temperature TP 245 260 °C
Time within 5 °C of the specified peak tP 10 20 30 s
temperature TP - 5 K
Ramp-down rate* 3 6 K/s
TP to 100 °C
Time 480 s
25 °C to TP

All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range


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Taping 9)




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Tape and Reel 10)

Reel Dimensions
A W Nmin W1 W2 max Pieces per PU

180 mm 8 + 0.3 / - 0.1 mm 60 mm 8.4 + 2 mm 14.4 mm 5000




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Barcode-Product-Label (BPL)

Dry Packing Process and Materials 9)

Moisture-sensitive label or print

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Humidity indicator
Barcode label
Do not eat.
Avoid metal contact.
Discard if circles overrun.
bag opening.
Please check the HIC immidiately after

check dot WET

Comparator

bake units
examine units, if necessary 15%
If wet,

bake units
examine units, if necessary 10%
If wet,

change desiccant
parts still adequately dry. 5%
If wet,

MIL-I-8835
Humidity Indicator

Desiccant
AM
OSR

OHA00539
Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.


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Type Designation System

Emission Color Color coordinates according Technology Concept

CIE 1931/Emission color: S: Silicone encapsulation
O: orange (606 nm) W: white (casted)
Y: yellow (587 nm) Platform: pre-molded
P: pure green (560 nm)
T: true green (528 nm)
S: super red (633 nm)

K: Automotive Package Type

and Industry D: Top emitting device Product
Product Leadframe based version
White reflector package

K O D E L P S 1 . 2 2

Lead / Package Properties

TOPlooker:
E: 1608 Special Characteristic
1: InGaN saturated colors
Sidelooker:


2: INGaAlP or AlGaAs
E: 5515
saturated colors
Ceramic packages: F: Full conversion (color
E: 1915 depending on color
description)
R: standard cold white

Encapsulant Type / Lens Properties

L: No lens (Lambertian)
Binning Information:
2: mcd
A: Automotive interior
binning: FKPL
Chip Technology: P: COD Puregreen
P: Standard power class
Q: Elevated power class
M: Medium performance


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Notes
The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of
lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this
data sheet falls into the class exempt group (exposure time 10000 s). Under real circumstances (for expo-
sure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the
eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light
sources have a high secondary exposure potential due to their blinding effect. When looking at bright light
sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irrita-
tion, annoyance, visual impairment, and even accidents, depending on the situation.
Subcomponents of this device contain, in addition to other substances, metal filled materials including silver.
Metal filled materials can be affected by environments that contain traces of aggressive substances. There-
fore, we recommend that customers minimize device exposure to aggressive substances during storage,
production, and use. Devices that showed visible discoloration when tested using the described tests above
did show no performance deviations within failure limits during the stated test duration. Respective failure
limits are described in the IEC60810.
For further application related information please visit www.osram-os.com/appnotes




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Disclaimer
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may
contain dangerous substances.
For information on the types in question please contact our Sales Organization.
If printed or downloaded, please find the latest version on the OSRAM OS website.

Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest
sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of
transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we
shall have to invoice you for any costs incurred.

Product and functional safety devices/applications or medical devices/applications

OSRAM OS components are not developed, constructed or tested for the application as safety relevant
component or for the application in medical devices.
OSRAM OS products are not qualified at module and system level for such application.

In case buyer – or customer supplied by buyer – considers using OSRAM OS components in product safety
devices/applications or medical devices/applications, buyer and/or customer has to inform the local sales
partner of OSRAM OS immediately and OSRAM OS and buyer and /or customer will analyze and coordi-
nate the customer-specific request between OSRAM OS and buyer and/or customer.




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Glossary
1)
Brightness: Brightness values are measured during a current pulse of typically 25 ms, with an internal
reproducibility of ±8 % and an expanded uncertainty of ±11 % (acc. to GUM with a coverage factor of
k = 3).
2)
Reverse Operation: This product is intended to be operated applying a forward current within the
specified range. Applying any continuous reverse bias or forward bias below the voltage range of light
emission shall be avoided because it may cause migration which can change the electro-optical char-
acteristics or damage the LED.
3)
Wavelength: The wavelength is measured at a current pulse of typically 25 ms, with an internal repro-
ducibility of ±0.5 nm and an expanded uncertainty of ±1 nm (acc. to GUM with a coverage factor of k =
3).
4)
Forward Voltage: The forward voltage is measured during a current pulse of typically 8 ms, with an
internal reproducibility of ±0.05 V and an expanded uncertainty of ±0.1 V (acc. to GUM with a coverage
factor of k = 3).
5)
Thermal Resistance: Rth max is based on statistic values (6σ).
6)
Thermal Resistance: RthJA results from mounting on PC board FR 4 (pad size 16 mm² per pad)
7)
Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devic-
es, the typical data or calculated correlations of technical parameters can only reflect statistical figures.
These do not necessarily correspond to the actual parameters of each single product, which could dif-
fer from the typical data and calculated correlations or the typical characteristic line. If requested, e.g.
because of technical improvements, these typ. data will be changed without any further notice.
8)
Characteristic curve: In the range where the line of the graph is broken, you must expect higher differ-
ences between single devices within one packing unit.
9)
Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and
dimensions are specified in mm.
10)
Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.




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Revision History
Version Date Change

1.1 2019-01-24 Maximum Ratings

1.2 2020-03-05 Derating (Diagrams)
1.3 2020-03-09 Schematic Transportation Box
Dimensions of Transportation Box
1.4 2020-06-04 Further Information




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Published by OSRAM Opto Semiconductors GmbH

Leibnizstraße 4, D-93055 Regensburg
www.osram-os.com © All Rights Reserved.


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