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Universal Serial Bus Micro-USB Cables and Connectors Specification
Universal Serial Bus Micro-USB Cables and Connectors Specification
Revisión 1.01
April4,2007
MicroUSB Specification to the USB 2.0 Specification, April 4,
Revisión 1.01 2007
Revisión History
Revisión Issue Date Comment
0.6 1/30/2006 Revisions to all sections
0.7 3/24/2006 Added revised Micro-USB drawings to Rev.0.8
0.8 4/19/2006 Editorial changes and additions by Jan Fahllund (Nokia)
0.8b 4/26/2006 Corrections to the 0.8 versión (based by comments from
0.9 6/7/2006 contributors)
Corrections based on comments from the 0.8b versión
1.0RC 8/2/2006 Added lubricant recommendation, LLRC delta change specified
1.01RC 11/10/2006 Editorial changes and addition based on Oct-06 USB-IF
CCWG meeting.
1.02RC 12/10/2006 Shell material thickness tolerances changed so that material can
be 0.25 mm or 0.3 mm; edited three pictures (Figure 4-10, 4-11
and 4-12).
1.03RC 12/11/2006 Two pictures edited (Figure 4-8 and 4-9). In fig 4-8 max height
to be 2.8mm MAX. In fig 4-9 R0.25mm MAX to be R0.30mm
1.0RC3 12/19/2006 MAX.
For BoD approval
1.0 1/12/2007 Approved
1.0 1/22/2007 Cosmetic edits for publication
1.01 4/4/2007 Editorial corrections and additions to contributor list. Reinserted
shell and plug material requirements as section 6.10. Clarified
wording on Plating Recommendations.
2
MicroUSB Specification to the USB 2.0 Specification, April 4,
Revisión 1.01 2007
Contri butors
Mark Rodda, (editor) Motorola (Acón)
Jan Fahllund, (editor) Nokia Toshinori Sasaki, Across Techno
Jim Koser, (CCWG Chairman), Foxconn Minoru Ohara, Allion
Glen Chandier, Advanced-Connectek Brad Brown, ATL
(Acón) Christopher Mattson, ATL
Charles Wang, Advanced-Connectek Marcus Darrington, ATL
Jaremy Flake, ATL Technology Yousuke Takeuchi, Hirose
George Olear, Contech Research Tsuyoshi Kitagawa, Hosiden
Roy Ting, Elka Jim Eilers, Hosiden
Sophia Liu, ETC Kazuhiro Saito, JAE
Bill Northey, FCI Ron Muir, JAE
Tsuneki Watanabe, Foxconn Mark Saubert, JAE
Jim Zhao, Foxconn Yasuhira Miya, JST
David Ko, Foxconn Takahiro Diguchi, JST
Jong Tseng, Foxconn Yoichi Nakazawa, JST
Jack Lu, Foxlink
Tim Chang, Foxlink
Sathid Inthon, Fujikura
Toshi Mimura, Fujijura
Alan Berkema, Hewlett-Packard
Karl Kwiat, Hirose
Shinya Tono, Hirose
Kazu Ichikawa, Hirose
Ryozo Koyama, Hirose
Kevin Fang, Longwell Electronics Mikko Poikselka, Molex
Morgan Jair, Main SuperCo. Sam Liu, Newnex Technology Corp.
Tom Kawaguchi, Matsushita Electric Richard Petrie, Nokia
Works Kai Silvennoinen, Nokia
Ron Ward, Matsushita Electric Works Panu Ylihaavisto, Nokia
Satoshi Yamamoto, Matsushita Electric ArthurZarnowitz, Palm
Works Douglas Riemer, SMK
Yasuhiko Shinohara, Mitsumi EricYagi, SMK
Atsushi Nishio, Mitsumi Abid Hussain, Summit Microelectronics
Hitoshi Kawamura, Mitsumi Kaz Osada, Tyco
Scott Sommers, Molex Masaru Ueno, Tyco
Kevin Delaney, Molex Yoshikazu Hirata, Tyco
Kieran Wright, Molex Ed Beeman, USB Implementers Forum
Padraig McDaid, Molex Mark Paxson, USB Implementers Forum
3
MicroUSB Specification to the USB 2.0 Specification, April 4,
Revisión 1.01 2007
Table of Contents
1 Introduction..................................................................................................................................
6
1.1 General..................................................................................................................................
6
1.2 Objective of the Specification...............................................................................................
6
1.3 Intended Audience/Scope......................................................................................................
6
1.4 Related Documents................................................................................................................
6
1.5 Acronyms and Terms...................................................................................................................
7
1.6 Significant Features......................................................................................................................
8
1.7 USB 2.0 Specification Compliance.......................................................................................
8
1.8 On-The-Go Device................................................................................................................
8
1.9 Connectors.............................................................................................................................
8
1.10 Compliant Cable Assemblies................................................................................................
8
1.11 Plug Overmolds.....................................................................................................................
9
4 Cables and Connectors..............................................................................................................
10
1.12 Introduction..........................................................................................................................
10
1.13 Micro-Connector Mating.....................................................................................................
10
1.14 Color Coding........................................................................................................................
11
1.15 Device, Cable and Adapter Delays......................................................................................
11
1.16 Compliant Usage of Connectors and Cables........................................................................
12
1.17 Cables......................................................................................................................
12
1.18 Overmolds...............................................................................................................
12
1.19 Mechanical Interfaces..............................................................................................
12
1.20 Surface mount standard versión drawings...............................................................
12
1.21 DIP-type and Midmount-type receptacles...............................................................
12
1.22 Connector Keying....................................................................................................
12
1.23 RightAngle Plugs....................................................................................................
12
1.24 Adapters..................................................................................................................
13
4.6 Drawings..............................................................................................................................
13
5 Electrical Compliance Requirements.........................................................................................
33
1.25 Data Rates Beyond USB 2.0 (480Mb/s ->).........................................................................
33
1.26 Low Level Contact Resistance............................................................................................
33
1.27 Contact Current Rating........................................................................................................
33
1.28 Signal Contacts Only (2, 3, and 4)...........................................................................
33
1.29 With Power Applied Contacts (1 and 5)..................................................................
33
6 Mechanical Compliance Requirements.....................................................................................
34
6.1 Operating Temperature Range.............................................................................................
34
1.30 Option I...................................................................................................................
34
1.31 Option II..................................................................................................................
34
1.32 Insertion Forcé.....................................................................................................................
34
1.33 Extraction Forcé...................................................................................................................
34
1.34 Plating..................................................................................................................................
34
1.35 Option I...................................................................................................................
35
1.36 Option II..................................................................................................................
35
1.37 Solderability.........................................................................................................................
35
1.38 Peel Strength (Reference Only)...........................................................................................
35
1.39 Wrenching Strength (Reference Only).................................................................................
35
1.40 Lead Co-Planarity................................................................................................................
35
1.41 RoHS Compliance...............................................................................................................
36
1.42 Shell &Latch Materials........................................................................................................
36
4
MicroUSB Specification to the USB 2.0 Specification, April 4,
Revisión 1.01 2007
Figures
Figure 4-1 Micro-Ato Micro-B Cable..............................................................................................
14
Figure 4-2 Standard-Ato Micro-B Cable...........................................................................................
15
Figure 4-3 Micro-Ato Captive Cable.................................................................................................
16
Figure 4-4 Micro-A Plug Overmold, Straight....................................................................................
17
Figure 4-5 Micro-B Plug Overmold, Straight....................................................................................
18
Figure 4-6 Micro-A Plug Interface....................................................................................................
19
Figure 4-7 Micro-B Plug Interface....................................................................................................
20
Figure 4-8 Micro-A/B Plug Interface (Cut-section)..........................................................................
21
Figure 4-9 Micro-AB receptacle interface.........................................................................................
22
Figure 4-10 Micro-B receptacle interface..........................................................................................
23
Figure 4-11 Micro-AB Receptacle Design........................................................................................
24
Figure4-12 Micro-B Receptacle Design............................................................................................
25
Figure 4-13 Micro-A Plug Blockage.................................................................................................
26
Figure 4-14 Micro-B Plug Blockage.................................................................................................
27
Figure 4-15 Micro-A Plug, Side Right Angle....................................................................................
28
Figure 4-16 Micro-A Plug, Down Right Angle.................................................................................
29
Figure 4-17 Micro-B Plug, Side Right Angle....................................................................................
30
Figure 4-18 Micro-B Plug, Down Right Angle.................................................................................
31
Figure 4-19 Adapter, Standard-A receptacle to Micro-A plug...........................................................
32
Tables
Table 4-1. Plugs Accepted By Receptacles..........................................................................................
10
Table 4-2. Micro-A Plug Pin Assignments..........................................................................................
10
Table 4-3. Color Coding for Plugs and Receptacles...........................................................................
11
Table 4-4. Máximum Delay for Micro-Connector and Cable.............................................................
11
Table 4-5. Máximum Delay for Standard Connector Cable................................................................
11
5
MicroUSB Specification to the USB 2.0 Specification, April 4,
Revisión 1.01 2007
1 Introduction
1.1 General
USB has become a popular interface for exchanging data between cell phone and
portable devices. Many of these devices have become so small it is impossible to use
standard USB components as defined in the USB 2.0 specification. In addition the
durability requirements of the Cell Phone and Portable Devices market exceed the
specifications of the current interconnects. Since Cell Phones and other small Portable
Devices are the largest market potential for USB, this specification is addressing this
very large market while meeting all the requirements for electrical performance within
the USB 2.0 specification.
1.4 Related
Documents
USB 2.0
USB OTG Supplement
6
MicroUSB Specification to the USB 2.0 Specification, Revisión 1.01 April 4,
2007
Application A generic term referring to any software that is running on a device that
can control the behavior or actions of the USB port(s) on a device.
B-Device A device with a Type-B plug inserted into its receptacle. The B-device is
a peripheral atthe start of a session. If the B-device is OTG, it may be
granted the role of host from an OTG A-device.
DIP-type A connector with contact and shield solder tails that are soldered through
the printed circuit board
FS Full Speed (max 12Mb/s)
Higher than HS (480Mb/s -> 5 Gb/s)
HS High Speed (max 480 Mb/s)
Host A physical entity that is attached to a USB cable and is acting in the role
of the USB host as defined in the USB Specification, Revisión 2.0.
This entity initiates all data transactions and provides periodic Start of
Frames.
OTG On-The-Go
3 Significant Features
This section identifies the significant features of the Micro-USB specification. The purpose of
this section is not to present all the technical details associated with each majorfeature, but
ratherto highlight its existence. Where appropriate, this section references other parts of the
document where further details can be found.
3.3 Connectors
The USB 2.0 specification defines the following connectors:
8
MicroUSB Specification to the USB 2.0 Specification, April 4,
Revisión 1.01 2007
The usage and wiring assignments of the five pins in the Micro-A plug are defined in the
following table.
The ID pin on a Micro-A plug shall be connected to the GND pin. The ID pin on a Micro-B
plug is not connected or is connected to ground by a resistance of greaterthan Rb_PLUG_ID
(100kQ MIN). An On-The-Go device is required to be able to detect whether a Micro-A or
Micro-B plug is inserted by determining if the ID pin resistance to ground is less than
Ra_PLUG_ID (10Q MAX) or if the resistance to ground is greaterthan Rb_PLUG_ID . Any
ID resistance less than Ra_PLUG_ID shall be treated as ID = FALSE and any resistance
greaterthan Rb_PLUG_ID shall be treated as ID = TRUE.
10
MicroUSB Specification to the USB 2.0 Specification, April 4,
Revisión 1.01 2007
11
MicroUSB Specification to the USB 2.0 Specification, April 4,
Revisión 1.01 2007
4.5.1 Cables
The cables allowed by the Micro-USB specification are shown in Figure 4-1, Figure 4-2, and
Figure 4-3. Cables must have a propagation delay of 10 ns or less, have a physical length of no
more than 2.0 meters, and meet all other requirements of a USB cable.
4.5.2 Overmolds
The size and shape of the Micro-A and Micro-B plug overmolds must conform to the
constraints shown in Figure 4-4 and Figure 4-5 .
Figure 4-11 and Figure4-12 shows designs forthe Micro-AB and Micro-B receptacles
respectively.
12
MicroUSB Specification to the USB 2.0 Specification, April 4,
Revisión 1.01 2007
4.5.8 Adapters
Requirements:
4.6 Drawings
This section contains the mechanical drawings that are referenced in the previous section.
13
MicroUSB Specification to the USB 2.0 Specification, April 4,
Revisión 1.01 2007
Micro-A Plug
Micro-B
Detail C-C
iTypica] USB Stiielúetí Cablel
Detail B-B Green I OH
IMicro-B PlugI
«hite ID-1
Ctilnri* Jackel
Dptional
Moldeó Str-
air Ftelief
14
MicroUSB Specification to the USB 2.0 Specification, April 4,
Revisión 1.01 2007
wax cable length - shorter of g.Qrc CP lOnsec electPical length
Micro-B Plug
Std-i Plug
^
Detai] B-B iMicrirB Plug)
i--------------
&
□ D
I____
□
S ■. i^f
A
I_____ Jl
B ■
s
lí)
1
Rülyvinyl OMcride Jacket
15
MicroUSB Specification to the USB 2.0 Specification, April 4,
Revisión 1.01 2007
Max catilc luf^tli - üliurter of 2-0m cr lUnsec eiL'utfiLai l'jr¡:j-f
Preparen1 lerminaUon
B
1
>8K hnnec CCfper 8r3i*d Sitóla Polyvinyl CNJori* Jscket
. A
QptJQnal Mülded Sti ¡in H e l i e f Diiensions are TYPICAL and are for general referente purposes only.
RthLHLNCt DHAWING
;AI F
Rev. 1.0 MICRO USB
Hicro-A Plug to Cut hnd
Free USB High-/full-speed Hardwire Cable Assembly
hOHM HÜ- 22B
i ¡ i : r
Figure 4-3 Micro-A to Captive Cable
16
MicroUSB Specification to the USB 2.0 Specification, April 4,
Revisión 1.01 2007
G
«hila Ji - ll-'i:
□
i,
ni
j-| r i
; (W > :!
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17
MicroUSB Specification to the USB 2.0 Specification, April 4,
Revisión 1.01 2007
H.H.K JltUUrUtl
nnn ry :'
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:
;
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UB
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NOTES ¡
1.45 Any surface can have texturing up to 0-3 mu üelow the suríace-
1.46 A sqiare área around the letter ' B ' can be lowered by as much as O-Smm-
1.47 LEB auttinrized logn mart. cannectnr type letter ctesignation-lA or Bl. color ot the insulator tiody and máximum dimensions
are mend3tory. Overmolúing outer configuraron- color and final shape are reference
Free
Micro-B Plug - Straight Mcilded Boot
M9
' ü :■■' NC .-...13
18
MicroUSB Specification to the USB 2.0 Specification, April 4,
Revisión 1.01 2007
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19
MicroUSB Specification to the USB 2.0 Specification, April 4,
Revisión 1.01 2007
Hicro-6 Plug
NOTE ¡
20
MicroUSB Specification to the USB 2.0 Specification, April 4,
Revisión 1.01 2007
CONTACT No- L5
CONTACT No. 2. 3-4
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■i
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Interface Drawing
Free_________
21
MicroUSB Specification to the USB 2.0 Specification, April 4,
Revisión 1.01 2007
HJ
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NOTE
22
MicroUSB Specification to the USB 2.0 Specification, April 4,
Revisión 1.01 2007
í \
¿7\= J^
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23
MicroUSB Specification to the USB 2.0 Specification, April 4,
Revisión 1.01 2007
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\KSW
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1.53 Critica! Diuensions are rDLEPJMM) and stiould nnt De deviated-
1.54 Dimensions wifcnout tolerances are-REF- -and may vary from manufacturer to manufacturen
9.8
6.2
1.3 lí
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Reference Drawing
Micro-A Plug
í»
Micno_B Receptacle
(a, aña A)
•■-:■
&
^
0-68
Micno-AB
Receptacle
Micno-B Receptacle
tf^ST)
11 ■■-■
"SI
^C
0-68
Mim-B Receptacle
Reference Drawing
Micro-B Plug
^ ■'■■■
L .
J
■--:
Micro-B
Receptacle
0.4
Micro-AB
Receptacle
Mini-B Receptacle
rOAM NO.22G
Figure 4-14 Micro-B Plug Blockage
27
MicroUSB Specification to the USB 2.0 Specification, April 4,
Revisión 1.01 2007
REFERENCE ONLY
&_5
O
u
/"
F t _____
ñ: F V
V,
'
!-^
The shape and si¿e constraints for the side right angle Micro A piug overmold are the same as tiros e for
straigh Micro-A plug overmold-
28
MicroUSB Specification to the USB 2.0 Specification, April 4,
Revisión 1.01 2007
REFERENCE ONLY
h I......>
29
MicroUSB Specification to the USB 2.0 Specification, April 4,
Revisión 1.01 2007
REFERENCE ONLY
f--------\
£5
O
UkHf
a
U
I 1 The shape and size constraints for :h: ;;iite right angle HicrD B piug nveninld are
the sane as tnose for straigh Micro-B plug overrold-
V.
30
MicroUSB Specification to the USB 2.0 Specification, April 4,
Revisión 1.01 2007
REFERENCE ONLY
^"^
n
■;;■
f illtH- 1
31
MicroUSB Specification to the USB 2.0 Specification, April 4,
Revisión 1.01 2007
I
A a
■*« ~<wHH
Micro-A Plug
1
Detail
>6EK A-A üraided 3iie)d
Tinned CnppBr
[Std-A ReceptacleI Detail B-B (Micro-A PlugI
in
Detail c-c [Typical USA Sliielded Cable)
A
Green iDfl
*ite ID-]
Optiana] Molded
strain Reüef
Diiensions are TYPICAL and are tor general reference purposes only.
32
MicroUSB Specification to the USB 2.0 Specification, April 4,
Revisión 1.01 2007
33
MicroUSB Specification to the USB 2.0 Specification, April 4,
Revisión 1.01 2007
6.1.1 Option I
-30°C to +80°C
6.1.2 Option II
-30°C to +85°C (and above)
6.4 Plating
Recommendatio
ns:
Contact plating should be done after stamping and forming
Burrs should not be present on contact áreas
Contact área as smooth as possible before plating
Use a sealing treatment to control plating porosity (contact área)
34
MicroUSB Specification to the USB 2.0 Specification, Revisión 1.01 April 4, 2007
6.4.1 Option I
6.4.1.1 Receptacle
Contact área: (Min) 0.05 um Au + (Min) 0.75 um Ni-Pd on top of (Min) 2.0 um Ni
6.4.1.2 Plug
Contact área: (Min) 0.05 um Au + (Min) 0.75 um Ni-Pd on top of (Min) 2.0 um Ni
6.4.2 Option II
6.4.2.1 Receptacle
Contact área: (Min) 0.75 um Au on top of (Min) 2.0 um Ni
6.4.2.2 Plug
Contact área: (Min) 0.75 um Au on top of (Min) 2.0 um Ni
6.5 Solderability
Soldershall covera mínimum of 95% of the surface being immersed, when soldered attemperature
255°C +/-5°C for immersion duration 5S (component is to be lead-free component) using Type R
flux.
• The plug can be damaged, but in such a way that the receptacle does not sustain damage: 25 -
50N