Customer 에스앤텍코리아 Raw Material Supplier TUC

Part Number Material Type FR4 Hi-TG Stackup Proposal

Finish Resin System TU768

Controlled Impedance Table( If required )

Stackup Construction
Single 50 Ohms
Based On Fab Information Daeduck Designed Value
Lay Base Cu Expected Simulated
Type Diagram of Layer Sequence Glass Type Trace (㎛)
er # wt.(Oz) Thick.(mm) Zo (Ohm)
Plating 0.030
1 0.5 Foil layer 1 SIG 0.015
Pre-preg 2113 0.095
2 1.0 layer 2 GND 0.030
Core 0.380
3 1.0 layer 3 SIG 0.030
Pre-preg 2113 0.080
Pre-preg 2113 0.095
4 1.0 layer 4 GND 0.030
Core 0.380
5 1.0 layer 5 GND 0.030
2113 0.095
2113 0.080
6 1.0 layer 6 SIG 0.030
Core 0.380
7 1.0 layer 7 GND 0.030
2113 0.095
8 0.5 Foil layer 8 SIG 0.015
Sum 0.2 Plating 0.030
0.050
Required PCB Thick. 2.000 +/-10%
Calculated Overall Thick. 2.000

Daeduck Notes.
Customer Raw Material Supplier
Part Number Material Type Stackup Proposal
Finish Resin System

Controlled Impedance Table( If required )

Stackup Construction
Single 50 Ohms
Based On Fab Information Daeduck Designed Value
Lay Base Cu Expected Simulated
Type Diagram of Layer Sequence Glass Type Trace (㎛)
er # wt.(Oz) Thick.(mm) Zo (Ohm)
Plating 0.030
1 0.5 Foil layer 1 SIG
Pre-preg
2 0.5 layer 2 GND ###
Core
3 0.5 layer 3 SIG ###
Pre-preg
Pre-preg
4 0.5 layer 4 GND ###
Core
5 0.5 layer 5 SIG ###

6 0.5 layer 6 GND ###

Core
7 0.5 layer 7 GND ###

8 0.5 layer 8 GND ###

Core
9 0.5 layer 9 GND ###

10 0.5 layer 10 SIG ###

Core
11 0.5 layer 11 GND ###

12 0.5 layer 12 SIG ###

Core
13 0.5 layer 13 GND ###

14 0.5 Foil layer 14 SIG

Sum 0.2 Plating 0.030
0.050
Required PCB Thick. 2.000 +/-10%
Calculated Overall Thick. 0.110

Daeduck Notes.