Stack-up Simulator history

일자 Revision 개정 내용 담당자 비고
2019.02.01 01 최초 발행 장윤영
2019.02.08 02 두산 자재 추가 장윤영
2019.03.28 03 100G Resin-out 변경 장윤영
2019.05.03 04 7409DV update 장윤영
2019.06.11 05 DS7409SN PPG 두께 수정 장윤영
2019.07.18 06 Megtron7, Megtron7N, MW1000, MW2000, MW3000, MW3350 추가 장윤영
2019.07.23 07 MW3350 라인업 추가 장윤영

항목 모두 영어로 변경 (DDPI 공용 사용 목적) 장윤영

2019.11.15 08
7409DX update 장윤영
 PPG Thickness Simulation
Items PPG1 PPG2 PPG3 PPG4 Sum
Material DS7402C TU_768 Layer
Glass & R/C 1078 62% 1080 63% Average
Resin out 2% 2% #N/A #N/A Er Outer
Typical thinkness 72 76 #N/A #N/A
Dk@2GHz 4.06 4.00 #N/A #N/A #N/A
Resin Er 3.00 3.00 #N/A #N/A #N/A Board
1.0Oz 1.0Oz None None Type
Cu Thinkness 1
30 30 0 0
Copper area 1 75% 75% Total Rect.
None None None None Thickness
Cu Thinkness 2
0 0 0 0
Copper area 2 0% 0%
PPG Thinkness (um) 63 67 #N/A #N/A #N/A
Items
PPG Thinkness (mil) 2.48 2.64 #N/A #N/A #N/A
FSDF
]
 Etch factor / PSR Thickness
Etch Factor PSR Thickness (Dk=3.8@2GHz)
Etch Cu thick.
um mil um mil
Process (um)
W1-W2 W1-W2 Epoxy Cu Cu to cu Epoxy Cu Cu to cu
Normal 40 20 0.8 30 25 30 1.2 1.0 1.2

PNL Cu area Simulation

PCB (mm) PNL (mm) Coupon(EA) PCB PNL
SIG/GND Array
X Y X Y Impedance IST Cu area Cu area
Signal 200 165 538 618 4 0 85% 8 80%
GND 200 165 538 618 4 0 93% 8 87%
ZBC 200 165 538 618 4 0 93% 8 93%

Impedance Target Standard

Product type Measure Material Maker S/E Diff
Network Average Other 50.0 49.5 100.0 99.0

1 SIG
 2 GND
3 SIG
4 GND
5 SIG
6 GND
7 GND
8 GND
9 GND
10 GND
11 GND
12 SIG
13 GND
14 SIG
15 GND
16 SIG
17 GND
18 SIG