Oppo Find X: Teardown and Key Components Identification

STRUCTURAL REPORT
Oppo Find X
Teardown and Key Components Identification
Teardown report by Farid Hamrani
October 2018 – version 1
22 Bd Benoni Goullin
44200 NANTES - FRANCE +33 2 40 18 09 16 info@systemplus.fr www.systemplus.fr
©2018 by System Plus Consulting | Oppo Find X Teardown Smartphone 1
Table of Contents
Overview / Introduction 3 Repartition 49
o Executive Summary o IC Manufacturer Design

o Specifications
o IC Package Repartition
o Methodology
o IC Package Footprint repartition
Teardown of the Oppo Find X 7

PCB Analysis 53
o Views & Dimensions

o Main Board Cross-section
o Interfaces
o Main Board – Line/Space Width
o Teardown
Components Identification 19
Give us your Feedbacks!
o Main Board
 Views & Dimensions
 ICs Markings Company services 58
 ICs Identification
 ICs Referencing
 ICs Applications
o Sim Board
o Screen Flex Board
o Flex Connector Board

Views & Dimensions
Overview / Introduction
Teardown Dimensions
o Views & Dimensions o Height: XXX mm
o Interfaces o Width: XXX mm
o Teardown o Thickness: XXX mm
Components Identification
Weight
Repartition o XXXg
PCB Analysis
Related Reports
About System Plus
Find X Front & Back Views

©2018 by System Plus Consulting
Find X Front & Rear Views


Interfaces
Teardown
o Interfaces
o Teardown
Repartition
PCB Analysis
Related Reports
About System Plus
Oppo Find X Front Drawing - Opened

Oppo Find X
Oppo Find X Front View - Closed Oppo Find X Front View - Opened
©2018 by System Plus Consulting ©2018 by System Plus Consulting

Teardown
Teardown
o Interfaces
o Teardown
Cable harness folded in low position
Repartition
Upper Internal Cover
PCB Analysis
Related Reports
About System Plus
Motor Close-up
Upper Internal Cover Removal


Teardown
Teardown
o Interfaces
o Teardown Flood Illuminator
Infrared
Repartition Camera
PCB Analysis
Ranging
Related Reports Sensor
About System Plus
Receiver
Rear Camera Module

Front Camera
Flex Board Dot Projector
Front Camera Module

Upper Chassis
Camera Module Disassembly

Main Board – Top Side
PCB Area: XXX mm²
Teardown Front Side ICs Count: XXX
Front Side ICs area: XXX mm²
o Main Board
o Sim Connector Board
o Flex Connector
o Screen Flex
Repartition
PCB Analysis
Related Reports
About System Plus
Find X Main Board (Front Side)

©2018 by System Plus Consulting ©2018 by System Plus Consulting | Oppo Find X Teardown Smartphone 7
Main Board – Top Side – Component Marking
Teardown
o Main Board
o Flex Connector
o Screen Flex
Repartition
PCB Analysis
Related Reports
About System Plus
Find X Main Board (Front Side)

Main Board – Bottom Side – Component Description
Teardown
o Main Board
o Flex Connector
o Screen Flex
Repartition
PCB Analysis
Related Reports
About System Plus

Flex Board– Top Side – Identification
Teardown
o Main Board
o Flex Connector
xxxxxx
o Screen Flex
xxxx
2-axis gyroscope
QFN16
Repartition
PCB Analysis
Related Reports
About System Plus

R E PA R T I T I O N

IC MANUFACTURERS DESIGN SHARES
Teardown
Repartition
PCB Analysis
Related Reports
About System Plus

IC Package Footprint Repartition
Teardown
Repartition
PCB Analysis
Related Reports
About System Plus

PCB ANALYSIS

PCB Board – Cross-Section
Teardown
Repartition
PCB Analysis
o Cross section
o Line/Space width
Related Reports
About System Plus
Find X Main Board – PCB Cross-Section

PCB Board – Line/Space Width
Teardown
Repartition
PCB Analysis
o Cross section
o Line/Space width
Related Reports
About System Plus

XX µm
XX µm
Find X Main Board –PCB metal Layer
Find X Main Board – Spacing

Related Reports
Teardown
Components Identification MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT

REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
Repartition
SYSTEM & PACKAGING ADVANCED PACKAGING & IMAGING & RF
PCB Analysis • Samsung Galaxy S9+ Teardown and Identification of Key • Status of the Advanced Packaging Industry 2018
Components • Status of the CMOS Image Sensor Industry 2018
Related Reports • Apple iPhone X Teardown and Identification of Key • VCSELs - Technology, Industry and Market Trends
Components • 3D Imaging & Sensing 2018
About System Plus • Huawei P20 Pro Teardown and Identification of Key • 5G’s Impact on RF Front-End Module and Connectivity for Cell
Components Phones 2018
• Status of the MEMS Industry 2018
• Hardware and Software for AI 2018 – Consumer focus

COMPANY
SERVICES

Business Models Fields of Expertise
Teardown
Repartition
Custom Analyses
PCB Analysis (>130 analyses per year)
Related Reports
About System Plus

o Company Services
o Contact
Reports
(>40 reports per year)
Costing Tools
Trainings

Contact
Teardown
FRANKFURT/MAIN
Repartition Europe Sales Office
PCB Analysis NANTES LYON

Headquarter YOLE HQ
TOKYO
Related Reports PHOENIX YOLE KK
YOLE Inc.
About System Plus GREATER CHINA
o Company Services YOLE
o Contact
Headquarters Europe Sales Office America Sales Office Asia Sales Office
21 rue La Noue Bras de Fer Lizzie LEVENEZ Steve LAFERRIERE Takashi ONOZAWA
44200 Nantes Frankfurt am Main Phoenix, AZ Tokyo
FRANCE GERMANY WESTERN US JAPAN
+33 2 40 18 09 16 +49 151 23 54 41 82 T : +1 310 600 8267 onozawa@yole.fr
sales@systemplus.fr llevenez@systemplus.fr laferriere@yole.fr
Mavis WANG
Troy Blanchette GREATER CHINA
EASTERN US wang@yole.fr
www.systemplus.fr T : +1 704 859 0456
troy.blanchette@yole.fr

OPPO FIND X TEARDOWN AND IDENTIFICATION OF KEY COMPONENTS STRUCTURE REPORT
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STRUCTURAL REPORT

o Executive Summary o IC Manufacturer Design

Teardown of the Oppo Find X 7

o Views & Dimensions

©2018 by System Plus Consulting | Oppo Find X Teardown Smartphone 2

About System Plus

Find X Front & Back Views

Find X Front & Rear Views

©2018 by System Plus Consulting | Oppo Find X Teardown Smartphone 3

About System Plus

Oppo Find X Front Drawing - Opened

©2018 by System Plus Consulting | Oppo Find X Teardown Smartphone 4

About System Plus

Upper Internal Cover Removal

©2018 by System Plus Consulting | Oppo Find X Teardown Smartphone 5

About System Plus

Rear Camera Module

Flex Board Dot Projector

Front Camera Module

Camera Module Disassembly

About System Plus

Find X Main Board (Front Side)

About System Plus

Find X Main Board (Front Side)

About System Plus

©2018 by System Plus Consulting | Oppo Find X Teardown Smartphone 9

About System Plus

©2018 by System Plus Consulting | Oppo Find X Teardown Smartphone 10

©2018 by System Plus Consulting | Oppo Find X Teardown Smartphone 11

About System Plus

©2018 by System Plus Consulting | Oppo Find X Teardown Smartphone 12

About System Plus

©2018 by System Plus Consulting | Oppo Find X Teardown Smartphone 13

©2018 by System Plus Consulting | Oppo Find X Teardown Smartphone 14

About System Plus

Find X Main Board – PCB Cross-Section

About System Plus

Find X Main Board – Spacing

Components Identification MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT

©2018 by System Plus Consulting | Oppo Find X Teardown Smartphone 17

©2018 by System Plus Consulting | Oppo Find X Teardown Smartphone 18

About System Plus

©2018 by System Plus Consulting | Oppo Find X Teardown Smartphone 19

PCB Analysis NANTES LYON

©2018 by System Plus Consulting | Oppo Find X Teardown Smartphone 20

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