Applications, Specifications, & Requirements

Process Characteristic Units USL LSL Sample Size Required Cpk

Screen Printer Solder Height mils Xbar + 2mils Xbar - 2 mils 100 pads 1.66
Solder Area square mils L*0.5*(pitch+padwidth) (padwidth-1)/2 across 1.66
Solder Volume cubic mils AperatureA*(Xbar(height)+2) A*(Xbar(height) -2) at least 1.66
Solder Release*** % TBD TBD 10 boards 1.66
(Meas. Vol. / Theoretical)

Chips X-axis Displacement mils 7.5 -7.5 30 1.66

Y-axis Displacement mils 7.5 -7.5 components 1.66
Rotation degrees N/A N/A across at least 1.66
5 boards

Fine Pitch Placement X-axis Displacement mils 4 -4 30 1.66

Y-axis Displacement mils 4 -4 components 1.66
Rotation degrees 0.3 -0.3 across at least 1.66
5 boards

Oven Maximum Ramp Rate Degrees C per Second 3 n/a at least 5 1.66
Time Above Reflow (183C) Seconds 90 45 moles 1.66
Maximum Temperature Degrees C 225 205 1.66

Wave Solder Solder Pot Temperature Degees C 250 260 At least 5 1.66
Board Temp. Before Wave Degrees C 100 50 moles or 1.66
Ramp Rate Degrees C per Second 3 1 wave riders 1.66

Wash Ionic Contamination ug/cm**2 or ug/inch**2 1.56 ug/cm**2 or 10 ug/inch**2 N/A 30 1.66

*** The percent of paste released from the aperature, as a percentage of the aperature size, is the way we should go in the future.
It covers all critical aspects of a print, if the aperture is properly defined, where a consitent print is the goal.