Professional Documents
Culture Documents
Continuous-Time Switch Family: A1101, A1102, A1103, A1104, and A1106
Continuous-Time Switch Family: A1101, A1102, A1103, A1104, and A1106
VCC
VOUT
Amp
Gain Offset
Trim
Control
GND
SPECIFICATIONS
SELECTION GUIDE
Part Number Packing [1] Mounting Ambient, TA BRP (Min) BOP (Max)
A1101ELHLT-T 7-in. reel, 3000 pieces/reel 3-pin SOT23W surface mount
A1101ELHLX-T 13-in. reel, 10000 pieces/reel 3-pin SOT23W surface mount –40°C to 85°C
A1101EUA-T [2] Bulk, 500 pieces/bag 3-pin SIP through hole
10 175
A1101LLHLT-T 7-in. reel, 3000 pieces/reel 3-pin SOT23W surface mount
–40°C to
A1101LLHLX-T 13-in. reel, 10000 pieces/reel 3-pin SOT23W surface mount
150°C
A1101LUA-T [2] Bulk, 500 pieces/bag 3-pin SIP through hole
A1102ELHLT-T 7-in. reel, 3000 pieces/reel 3-pin SOT23W surface mount
A1102ELHLX-T 13-in. reel, 10000 pieces/reel 3-pin SOT23W surface mount –40°C to 85°C
A1102EUA-T [2] Bulk, 500 pieces/bag 3-pin SIP through hole
60 245
A1102LLHLT-T 7-in. reel, 3000 pieces/reel 3-pin SOT23W surface mount
–40°C to
A1102LLHLX-T 13-in. reel, 10000 pieces/reel 3-pin SOT23W surface mount
150°C
A1102LUA-T [2] Bulk, 500 pieces/bag 3-pin SIP through hole
A1103ELHLT-T 7-in. reel, 3000 pieces/reel 3-pin SOT23W surface mount
–40°C to 85°C
A1103ELHLX-T 13-in. reel, 10000 pieces/reel 3-pin SOT23W surface mount
A1103LLHLT-T 7-in. reel, 3000 pieces/reel 3-pin SOT23W surface mount 150 355
–40°C to
A1103LLHLX-T 13-in. reel, 10000 pieces/reel 3-pin SOT23W surface mount
150°C
A1103LUA-T [2] Bulk, 500 pieces/bag 3-pin SIP through hole
A1104EUA-T [2] Bulk, 500 pieces/bag 3-pin SIP through hole –40°C to 85°C
A1104LLHLT-T 7-in. reel, 3000 pieces/reel 3-pin SOT23W surface mount
–40°C to 25 450
A1104LLHLX-T 13-in. reel, 10000 pieces/reel 3-pin SOT23W surface mount
150°C
A1104LUA-T [2] Bulk, 500 pieces/bag 3-pin SIP through hole
A1106EUA-T Bulk, 500 pieces/bag 3-pin SIP through hole –40°C to 85°C
A1106LLHLT-T 7-in. reel, 3000 pieces/reel 3-pin SOT23W surface mount
–40°C to 160 430
A1106LLHLX-T 13-in. reel, 10000 pieces/reel 3-pin SOT23W surface mount
150°C
A1106LUA-T Bulk, 500 pieces/bag 3-pin SIP through hole
1 Contact Allegro for additional packing options.
2 The chopper-style UA package is not for new design; the matrix HD style UA package is recommended for new designs.
ELECTRICAL OPERATING CHARACTERISTICS over full operating voltage and ambient temperature ranges,
unless otherwise noted
Characteristic Symbol Test Conditions Min. Typ. Max. Units
Supply Voltage [1] VCC Operating, TJ < 165°C 3.8 – 24 V
Output Leakage Current IOUTOFF VOUT = 24 V, B < BRP – – 10 µA
Output On Voltage VOUT(SAT) IOUT = 20 mA, B > BOP – 215 400 mV
Slew rate (dVCC/dt) < 2.5 V/μs, B > BOP + 5 G or B < BRP
Power-On Time [2] tPO – – 4 µs
–5G
Output Rise Time [3] tr VCC = 12 V, RLOAD = 820 Ω, CS = 12 pF – – 400 ns
Output Fall Time [3] tf VCC = 12 V, RLOAD = 820 Ω, CS = 12 pF – – 400 ns
ICCON B > BOP – 4.1 7.5 mA
Supply Current
ICCOFF B < BRP – 3.8 7.5 mA
Reverse Battery Current IRCC VRCC = –30 V – – –10 mA
Supply Zener Clamp Voltage VZ ICC = 10.5 mA; TA = 25°C 32 – – V
Supply Zener Current [4] IZ VZ = 32 V; TA = 25°C – – 10.5 mA
1 Maximum voltage must be adjusted for power dissipation and junction temperature, see Power Derating section.
2 For VCC slew rates greater than 250 V/μs, and TA = 150°C, the Power-On Time can reach its maximum value.
3 C =oscilloscope probe capacitance.
S
4 Maximum current limit is equal to the maximum I
CC(max) + 3 mA.
1 2 1 2 3
VCC
VOUT
GND
VCC
VOUT
Terminal List
Number
Name Description
Package LH Package UA
1 1 VCC Connects power supply to chip
2 3 VOUT Output from circuit
3 2 GND Ground
MAGNETIC OPERATING CHARACTERISTICS [1]: over full operating voltage and ambient temperature ranges,
unless otherwise noted
Characteristic Symbol Test Conditions Min. Typ. Max. Units
TA = 25°C 50 100 160 G
A1101
Operating Temperature Range 30 100 175 G
TA = 25°C 130 180 230 G
A1102
Operating Temperature Range 115 180 245 G
TA = 25°C 220 280 340 G
Operate Point BOP A1103
Operating Temperature Range 205 280 355 G
TA = 25°C 70 – 350 G
A1104
Operating Temperature Range 35 – 450 G
TA = 25°C 280 340 400 G
A1106
Operating Temperature Range 260 340 430 G
TA = 25°C 10 45 130 G
A1101
Operating Temperature Range 10 45 145 G
TA = 25°C 75 125 175 G
A1102
Operating Temperature Range 60 125 190 G
TA = 25°C 165 225 285 G
Release Point BRP A1103
Operating Temperature Range 150 225 300 G
TA = 25°C 50 – 330 G
A1104
Operating Temperature Range 25 – 430 G
TA = 25°C 180 240 300 G
A1106
Operating Temperature Range 160 240 330 G
TA = 25°C 20 55 80 G
A1101
Operating Temperature Range 20 55 80 G
TA = 25°C 30 55 80 G
A1102
Operating Temperature Range 30 55 80 G
TA = 25°C 30 55 80 G
Hysteresis BHYS A1103
Operating Temperature Range 30 55 80 G
TA = 25°C 20 55 – G
A1104
Operating Temperature Range 20 55 – G
TA = 25°C 70 105 140 G
A1106
Operating Temperature Range 70 105 140 G
1 Magnetic flux density, B, is indicated as a negative value for north-polarity magnetic fields, and as a positive value for south-polarity magnetic fields. This so-called alge-
braic convention supports arithmetic comparison of north and south polarity values, where the relative strength of the field is indicated by the absolute value of B, and the
sign indicates the polarity of the field (for example, a –100 G field and a 100 G field have equivalent strength, but opposite polarity).
THERMAL CHARACTERISTICS: May require derating at maximum conditions; see application information
21
20
19
18
17
16
15
14
13
12
Package LH, 2-layer PCB
11 (RθJA = 110 ºC/W)
10
9 Package UA, 1-layer PCB
8 (RθJA = 165 ºC/W)
7
6 Package LH, 1-layer PCB
5 (RθJA = 228 ºC/W)
4 VCC(min)
3
2
20 40 60 80 100 120 140 160 180
Temperature
Power Dissipation (ºC)
versus Ambient Temperature
1900
1800
1700
1600
1500
1400
1300
Power Dissipation, PD (mW)
1200 Pa
1100 (R cka
θJ ge
A = L
1000 11 H, 2
Pac 0 º -la
900 C/ ye
800 (R kage W
) r PC
θJA = UA B
165 1-la,
700 ºC/ yer
W) PC
600 B
500 Pac
k
400 (R age LH
,
300 θJA =
228 1-laye
ºC/W r PC
200 ) B
100
0
20 40 60 80 100 120 140 160 180
Temperature (°C)
CHARACTERISTIC DATA
Supply Current (On) versus Ambient Temperature Supply Current (On) versus Supply Voltage
(A1101/02/03/04/06) (A1101/02/03/04/06)
8.0 8.0
7.0 7.0
6.0 6.0 TA (°C)
VCC (V)
ICCON (mA)
ICCON (mA)
5.0 5.0 –40
24
4.0 4.0 25
3.8
150
3.0 3.0
2.0 2.0
1.0 1.0
0 0
–50 0 50 100 150 0 5 10 15 20 25
TA (°C) VCC (V)
Supply Current (Off) versus Ambient Temperature Supply Current (Off) versus Supply Voltage
(A1101/02/03/04/06) (A1101/02/03/04/06)
8.0 8.0
7.0 7.0
6.0 6.0 TA (°C)
VCC (V)
ICCOFF (mA)
ICCOFF (mA)
Output Voltage (On) versus Ambient Temperature Output Voltage (On) versus Supply Voltage
(A1101/02/03/04/06) (A1101/02/03/04/06)
400 400
350 350
300 300
VOUT(SAT) (mV)
TA (°C)
VOUT(SAT) (mV)
100 100
50 50
0 0
–50 0 50 100 150 0 5 10 15 20 25
TA (°C) VCC (V)
FUNCTIONAL DESCRIPTION
(A) (B)
VS
V+
VCC
VCC RL
Switch to High
Switch to Low
VOUT
Output
A110x VOUT
GND
VOUT(SAT)
0
B– 0 B+
BOP
BRP
BHYS
1 2 3 4 5
VCC
VOUT
t
Output Sampled
tPO(max)
POWER DERATING
Power Derating A worst-case estimate, PD(max), represents the maximum allow-
able power level (VCC(max), ICC(max)), without exceeding TJ(max),
The device must be operated below the maximum junction
at a selected RθJA and TA.
temperature of the device, TJ(max). Under certain combinations of
peak conditions, reliable operation may require derating supplied Example: Reliability for VCC at TA = 150°C, package UA, using
power or improving the heat dissipation properties of the appli- minimum-K PCB.
cation. This section presents a procedure for correlating factors
Observe the worst-case ratings for the device, specifically:
affecting operating TJ. (Thermal data is also available on the
RθJA = 165°C/W, TJ(max) = 165°C, VCC(max) = 24 V, and
Allegro MicroSystems website.)
ICC(max) = 7.5 mA.
The Package Thermal Resistance, RθJA, is a figure of merit sum-
Calculate the maximum allowable power level, PD(max). First,
marizing the ability of the application and the device to dissipate
invert equation 3:
heat from the junction (die), through all paths to the ambient air.
Its primary component is the Effective Thermal Conductivity, K, ΔTmax = TJ(max) – TA = 165 °C – 150 °C = 15 °C
of the printed circuit board, including adjacent devices and traces.
Radiation from the die through the device case, RθJC, is relatively This provides the allowable increase to TJ resulting from internal
small component of RθJA. Ambient air temperature, TA, and air power dissipation. Then, invert equation 2:
motion are significant external factors, damped by overmolding.
PD(max) = ΔTmax ÷ RθJA = 15°C ÷ 165°C/W = 91 mW
The effect of varying power levels (Power Dissipation, PD), can Finally, invert equation 1 with respect to voltage:
be estimated. The following formulas represent the fundamental
relationships used to estimate TJ, at PD. VCC(est) = PD(max) ÷ ICC(max) = 91 mW ÷ 7.5 mA = 12.1 V
PD = VIN × IIN (1) The result indicates that, at TA, the application and device can dis-
sipate adequate amounts of heat at voltages ≤VCC(est).
ΔT = PD × RθJA (2)
Compare VCC(est) to VCC(max). If VCC(est) ≤ VCC(max), then reli-
TJ = TA + ΔT (3) able operation between VCC(est) and VCC(max) requires enhanced
RθJA. If VCC(est) ≥ VCC(max), then operation between VCC(est) and
For example, given common conditions such as: TA= 25°C, VCC(max) is reliable under these conditions.
VCC = 12 V, ICC = 4 mA, and RθJA = 140 °C/W, then:
PD = VCC × ICC = 12 V × 4 mA = 48 mW
+0.12
2.98 –0.08
D
1.49
4° ±4°
A
3
+0.020
0.180 –0.053
0.96 D
+0.19
+0.10 1.91 –0.06 2.40
2.90 –0.20
0.70
D
1.00
0.25 MIN
1 2
0.55 REF
0.25 BSC 0.95
Seating Plane
Branded Face Gauge Plane B PCB Layout Reference View
8X 10°
REF
1.00 ±0.13
A1101, A1102,
A1103, A1104, NNT
and A1106
+0.10
0.05 –0.05
0.95 BSC
0.40 ±0.10
N = Last three digits of device part number
T = Temperature Code (Letter)
B Reference land pattern layout; all pads a minimum of 0.20 mm from all adjacent pads;
adjust as necessary to meet application process requirements and PCB layout tolerances
A1101, A1102,
C Branding scale and appearance at supplier discretion A1103, A1104, NNN
and A1106
D Hall elements, not to scale
+0.08
4.09 –0.05
45°
B D Standard Branding Reference View
C
E
2.04
1.52 ±0.05
NNN
1.44 E
Mold Ejector
+0.08 2X10°
3.02 –0.05 Pin Indent
E 1
Branded 45°
= Supplier emblem
Face N = Last three digits of device part number
A
1.02 0.79 REF
MAX
0.51 NNT
REF
1 2 3
1
= Supplier emblem
N = Last two digits of device part number
14.99 ±0.25 +0.03 T = Temperature code
0.41 –0.06
+0.08
4.09 –0.05
45°
B
C
E
2.04
1.52 ±0.05
1.44 E
Mold Ejector
+0.08 Pin Indent
3.02 –0.05
E
Branded 45°
Face
2.16
MAX D Standard Branding Reference View
0.79 REF
0.51
REF
A
NOT FOR NNT
NEW DESIGN
1 2 3
1
= Supplier emblem
+0.03 N = Last two digits of device part number
0.41 –0.06
15.75 ±0.51 T = Temperature code
Revision History
Number Date Description
14 May 29, 2012 Add A1106 UA package drawing
15 January 1, 2015 Added the LX option to Selection Guide
16 September 30, 2015 Corrected LH package Active Area Depth value and LH package branding; added AEC-Q100
qualification under Features and Benefits
17 October 27, 2016 Chopper-style UA package designated as not for new design
www.allegromicro.com