SEMIKRON Mounting Instruction SEMITOP Press-Fit en 2017-08-28 Rev-03

Mounting Instruction Revision: 03
SEMITOP2,3,4 Issue date:

Prepared by:
2017-08-28
Roberto Agostini
Press-Fit Approved by: Werner Obermaier
Keyword: SEMITOP, mounting instructions, one screw mounting,

no baseplate, press-fit pins, 12mm height, thermal paste,
assembly, torque, washer, screw, heatsink.
Revision history ...............................................................................................................................2

1. SEMITOP® 2, 3, 4 with Press-Fit pins ............................................................................................3
1.1 PCB specifications .................................................................................................................3
1.2 Specification for components close to module pins ....................................................................4
2. Matching the power module and the PCB .......................................................................................5
2.1 Press-in setup .......................................................................................................................5
2.2 Press-in process ....................................................................................................................6
2.2.1 Basic requirements..........................................................................................................6
2.2.2 Press-in tool parameters ..................................................................................................6
2.2.3 Press-in control parameters ..............................................................................................6
2.3 Press-out setup .....................................................................................................................7
2.3.1 Press-out tool parameters ................................................................................................8
2.3.2 Press-out control parameters ............................................................................................8
2.4 Reworking of the assembly “module and PCB” ..........................................................................9
2.5 Multiple per PCB ....................................................................................................................9
3. Heatsink specifications and preparation .........................................................................................9
4. Module specifications ................................................................................................................ 10
5. Assembly ................................................................................................................................ 10
5.1 Thermal grease application ................................................................................................... 10
5.2 Standard thermal grease specification.................................................................................... 11
5.3 Assembling SEMITOP® Press-fit+PCB onto heatsink ................................................................. 11
6. ESD Protection ......................................................................................................................... 12
7. Caption of figures ..................................................................................................................... 13
8. Caption of tables ...................................................................................................................... 13
9. References .............................................................................................................................. 13
10. Disclaimer ............................................................................................................................... 14
© by SEMIKRON / Mounting Instruction / SEMITOP2,3,4 Press-Fit / 2017-08-28 Page 1/14

PROMGT.1027/ Rev.3/ Template Mounting Instruction
Revision history
SEMIKRON reserves the right to make changes without further notice herein
Revision
Date Description Pages
n°
10.05.2014 01 First release 13
06.06.2014 01 Improvement of contents 13
07.07.2014 01 PTH tin plating details for direct soldering to the PCB 13
08.05.2017 02 New template and general review 14
- Update of Mounting specifications for SEMITOP® (Table 6);

28.08.2017 03 14
- Harmonization of thermal grease thicknesses (Table 5).

1. SEMITOP® 2, 3, 4 with Press-Fit pins
SEMITOP® Press-Fit is the alternative solution to SEMITOP® solder mounting version. One step PCB
assembly to the module is possible thanks to solder free terminals; replacement of PCB is also possible.
The new platform is still 12mm height module in order to offer a 100% mechanical compatibility with the
soldered version.
The following chapters describe the assembly procedure and parameter specifications to fix the module to
the PCB and onto the heatsink.
1.1 PCB specifications

The following requirements as regards the Plated Through Hole (PTH) of the PCB need to be fulfilled
according to international standard IEC 60352-5 in order to ensure the proper functioning. SEMIKRON
performed all the qualification tests following these requirements. The qualification tests were done using a
standard FR4 PCB with an immersion tin (I-Sn) surface finish.
The following table shows the specification of the PTH:
Table 1: Specification of PTH for the press-in process
Min. Typ. Max.
Recommended size of drill 1.6mm
Drilled hole diameter 1.575mm 1.6mm 1.625mm
Copper thickness in via 25µm
Tin plating in via 0.5µm
Final hole diameter 1.39mm 1.45mm 1.54mm
Cu width of the Annular ring 100µm
Thickness of PCB 1.6mm
In case of soldering of Press-Fit pins directly to the PCB, the following table shows the PTH specification:
Table 2: Specification of PTH for soldering of Press-Fit pins to the PCB
Min. Typ. Max.
Drilled hole diameter 2.10mm 2.15mm 2.25mm
Copper thickness in via 25µm
Tin plating in via 10µm
Final hole diameter 2.00mm
Cu width of the Annular ring 100µm
Thickness of PCB 0.8mm 1.6mm

The recommended hole diameter for the mounting post to fix the SEMITOP® Press-Fit to the PCB should be
in accordance with the following table:
Table 3: Specification of PCB hole diameter for the mounting post
Module type Diameter [mm]
SEMITOP4® Press-Fit 3.6
SEMITOP3® Press-Fit 2
Mounting post
SEMITOP2® Press-Fit 2
1.2 Specification for components close to module pins

Particular attention must be paid for those components that need to be placed close to the module pins like
resistors, capacitors or diodes. A minimum distance of 4mm is required between the edge of these
components and the center of the PTH; this ensures enough space for the pressing tool.
Figure 1: Minimum distance between components and hole center of PTH

2. Matching the power module and the PCB
For a successful press-in process with high process capability, it is recommended to use equipment that
allows control of relevant process parameters like force and distance.
The following table shows an overview of the available presses and their main characteristics:
Table 4: Specification of press-type
Control of Control of
Press type Comments
force distance
Additional visual inspection is

Manual, hydraulic and pneumatic Low Low recommended to ensure
reliable press-in process
Accurate control of speed and

position enables instant
Servo electric High High
reaction to changes of press-
in force
Servo electric presses are recommended to mate PCB and press-fit modules. SEMIKRON performed tests
using an electric press by KISTLER.
2.1 Press-in setup

The following picture shows a concept view of the press-in equipment:
Figure 2: Schematic view of the press-in setup
Press-in tool top
SEMITOP® press-fit module

Module anchor pins
PCB
Space for press-fit pins
PCB holes for module

Anchor post anchor pins
Press-in tool base
Support part for PCB
The lower part of the press-in tool must be designed in order to provide free space for the components
mounted on the surface of the PCB. Therefore shape and size of the available space for pins and
components depends on size and position of the components on the PCB.
The anchor posts are needed to keep the PCB aligned during the press-in phase. The base of the anchor
post should support the PCB during the press-in process and therefore has to have the same height than
the support part to avoid bending of the PCB.
The support part should be fixed to the press-in tool. The PCB will be first positioned onto the support part
through the anchor posts. The module is then placed on the PCB and aligned via the module anchor pins.

The module is pressed with the top of the press-in tool which has to be parallel to the support part and the
press-in tool base. Particular care should be taken for the bottom part of the press-in tool top side, it has to
be clean and free from any particles that could damage the module.
2.2 Press-in process
2.2.1 Basic requirements

To ensure a proper press-fit contact, the center of the press-fit pin head has to be at least 0.5mm below
the top surface and at least 0.5mm above the bottom surface of the PCB (refer to the following picture).
Figure 3: Press-in depth in PCB
Center of press-fit pin head
min. 0.5mm
min. 1.6mm
min. 0.5mm
2.2.2 Press-in tool parameters

The following parameters are based on SEMIKRON press-in tool in use:
Press-in force per terminal: 95±10N
Press-in speed: 5-10mm/s
2.2.3 Press-in control parameters

In case the press is equipped with the possibility to record the force and distance during the press-in
process, the following relevant values should be considered.
A typical force vs. distance profile for a press-in process is shown in the following picture. There are three
sections that are typical for the press-in curve (valid only for the first insertion):
Black curve: first raising section. The press-fit terminal slides into the holes and will be deformed to
fit the holes. Here, maximum deformation of press-fit terminal occurs.
Blue curve: second section. The pin heads are fully inserted into the holes and slides to the final
position
Red curve: third section. Sliding of the pin is stopped. The anchor pins get in contact with the PCB
and they start to bend the PCB.
The press-in process has to be stopped at the beginning of the second raising section (red curve) to avoid
damaging the PCB.
The press-in force for each terminal is between 95N±10N. If the press-in force did not show the typical
shape with the intervals before mentioned , this could indicate faulty plating, improper diameter of the
holes or pin displacement.

Figure 4: Typical press-in diagram for a 26 pins module
2.3 Press-out setup

The following picture shows a concept view of the press-out equipment:
Figure 5: Schematic view of the press-out setup
Press-out tool top
PCB
Centring pin
SEMITOP press-fit
module
Space for press-fit module
after press-out process
Support part for PCB
Base of support part for PCB

Press-out tool bottom
The lower part of the press-in tool should be fixed. The system “module and PCB” will be positioned onto
the support part. The alignment is possible thanks to the centring pin. Between the module and the base of
the support part some space is needed to provide clearance for the pushed out module. The module is
pressed out with the upper tool that has to be aligned parallel to the lower part. Once the module is
pressed-out, it will be located on the base of the support part.

In the following picture the press-out process is shown:
Figure 6: Press-out process
1 2 3
Module+PCB is placed on the The press-out tool will start to go The press-out tool stops to go
support part down until it will be in contact with down when it touches the support
the terminals; the terminals will tool. The module will be located
slide out of the PCB on the base of the support part.
2.3.1 Press-out tool parameters

The following parameters are based on SEMIKRON press in use:
Press-out force per terminal: > 40N
Press-out speed: 2-5mm/s
2.3.2 Press-out control parameters

A typical force vs. distance profile for a press-out process is shown in the following picture. The curve
exhibits a peak that indicates the breaking of the cold weld joint connection between terminal and PCB.
Figure 7: Typical press-out diagram for a module with 26 pins
Connections brake

2.4 Reworking of the assembly “module and PCB”
Each SEMITOP® Press-Fit type can be used only once. In case the system “module+PCB” needs to be
disassembled, following options are possible:
Module can be reused by soldering the press-fit pins to the PCB. Due to the pin deformation by
the initial press-in process, any additional press-in process will result in low holding forces between
the terminal and the PCB hole and is therefore not recommended.
PCB can be reused. The number of times depends on the plating of the via :
Sn > 0.5µm: PCB can be disassembled and used two additional times
Au 0.05 - 0.2 µm over 2.5 - 5 µm Ni: PCB cannot be reused.
2.5 Multiple per PCB

It is possible to assemble multiple modules onto one PCB. In this case the modules can be pressed one by
one (subsequently) or all at once.
Pressing multiple modules at once requires a press-in tool according to the above detailed single tool. The
tool has to ensure the correct levelling of the modules and PCB to avoid mechanical stresses.
3. Heatsink specifications and preparation
To obtain the maximum thermal conductivity, the bottom side of the module must be free from dust and
dirt.
The heat sink must fulfil following mechanical specifications:
Figure 8: Heat sink surface specifications
≤ 50 µm per 100 mm
Heat sink
Rz ≤ 6.3µm
Flatness of heat sink mounting area must be ≤ 50µm per 100 mm (DIN EN ISO 1101)
Roughness “Rz” ≤ 6,3 µm (DIN EN ISO 4287)
No steps
Machined without overlaps
Surface of heat sink should be free of grease, e.g. by cleaning the heat sink in a fat-dissolving solvent. A
good indication is given by the DIN 53364, surface tension ≥ 32 N/m. Tap holes must be free of turnings.
The supplier of the heat sinks should chose adequate packaging to avoid contamination and mechanical
damage during transport.

4. Module specifications
The mounting surface of SEMITOP® modules must be free from grease and particles. Fingerprints on the
bottom side do not affect the thermal behaviour.
Due to manufacturing process, the bottom side of SEMITOP® may exhibit scratches, holes or similar marks.
Discoloration of bottom side do not affect the thermal behaviour.
The following pictures define surface characteristics, which do not affect the thermal behaviour:
Figure 9: Scratch specification for SEMITOP modules
Figure 10: Discoloration of SEMITOP on bottom side
No influences in the thermal behavior
5. Assembly
Before setting up the electrical connection (including any electrical incoming test), the module must first be
mounted onto the heat sink as described as follows.
5.1 Thermal grease application

To avoid air gaps at the interface between the module and the heat sink a thermal grease must be applied.
The grease should follow the shape of the two surfaces (module and heatsink), allowing a metal-to-metal
contact where it is possible, and filling the remaining gaps. This metal-to-metal contact can be ensured by
using a standard thermal grease or by pre-applied thermal paste.

5.2 Standard thermal grease specification
Recommended thermal grease material is Wacker-Chemie P12. SEMIKRON recommends an hard rubber
roller or a screen print for an even distribution of the grease.
Following table shows the recommended average thickness of the applied grease layer.
Table 5: Recommended thermal grease thickness for SEMITOP® modules

Maximum allowed Minimum allowed
Module types General Specification
thickness thickness
SEMITOP® 2,3,4
40µm ± 25% 50µm 30µm
Press-Fit
If there is a margin in the thermal dissipation in the specific application, and under customer approval, this
thickness can be further moderated. Further evaluations have shown that even layers with thicknesses in
the range of 50µm - 80µm do not cause any functional problem if an even distribution of the layer is
respected.
SEMIKRON has qualified the SEMITOP® power modules under the above mentioned conditions. It is
customer’s responsibility to qualify his own paste printing process as deviations from the recommended
process may impact reliability or technical performance of the modules.
The thickness of the applied grease can be checked by a measuring gauge (e.g. Fa, ELCOMETER
Instrument Gmbh, Ulmer Straße 68, 73431 Aalen, + 49-7361-528060, Sechseck-Kamm 5 - 150 µm) like
the one shown in the picture:
Figure 11: Example of gauge to measure the thermal grease thickness
5.3 Assembling SEMITOP® Press-fit+PCB onto heatsink

In a first process step the module will be press in to the PCB. In a second step the mounting surface of the
heatsink should be cleaned. The thermal interface material than should be applied and the PCB with
module mounted onto the heatsink.
Figure 12: Assembling “module+PCB” to the heatsink
Mounting screw
Heatsink
Module+PCB
Thermal grease

It is recommended to tighten the screws with the corresponding mounting torque:
Table 6: Mounting specifications for SEMITOP® Press-Fit

Saw tooth
Module Screw washer Flat washer Mounting torque
(optional)
SEMITOP®2 Press-Fit DIN 912-M-4x16 DIN 6798 Form A DIN 125 2,0 Nm +0/-10%
SEMITOP®3 Press-Fit DIN 912-M-4x16 DIN 6798 Form A DIN 125 2,5 Nm +0/-10%
SEMITOP®4 Press-Fit DIN 912-M-4x16 DIN 6798 Form A DIN 7349 2,6 Nm +/-5%
SEMIKRON recommends:
a torque wrench with automatic control. Electric power screwdriver is recommended over a pneumatic
tool. The specified screw parameters are better adjustable and especially the final torque will be
reached more smoothly. A limitation to the mounting torque screw velocity is recommended to allow
the thermal paste to flow and distribute equally. If tightened with higher velocity the ceramic may
develop cracks due to the inability of the paste to flow as fast as necessary and therefore causing an
uneven surface. The maximum screw velocity should not exceed 250rpm if recommended Wacker P12
paste is used. A soft level out (no torque overshoot) will reduce the stress even further and is
preferable
the above recommended screws and washers
tighten the screws only once. After the mounting do not re-tighten the screws to the nominal mounting
torque value. Due to relaxation of the housing and flow of thermal paste, the loosening torque is lower
than the mounting torque. However, the construction of the housing, the washers and the adhesion of
the thermal paste still ensure sufficient thermal coupling of the module to the heat sink
Do not exceed the mounting torque because a further increase of the maximum mounting torque will
not improve the thermal contact but could damage the module
6. ESD Protection
SEMITOP® Press-Fit IGBT and MOSFET modules are sensitive to electrostatic discharge, because discharge
of this kind can damage or destroy the sensitive MOS structure of the gate. All SEMITOP® Press-Fit
modules are ESD protected during transport, storage and mounting process with an ESD cover.
When handling and assembling the modules it is recommended that a conductive grounded wristlet is worn
and a conductive grounded workplace is used. All staff should be trained suitably for correct ESD handling.

7. Caption of figures
Figure 1: Minimum distance between components and hole center of PTH ..............................................4
Figure 2: Schematic view of the press-in setup....................................................................................5
Figure 3: Press-in depth in PCB .........................................................................................................6
Figure 4: Typical press-in diagram for a 26 pins module .......................................................................7
Figure 5: Schematic view of the press-out setup..................................................................................7
Figure 6: Press-out process...............................................................................................................8
Figure 7: Typical press-out diagram for a module with 26 pins ..............................................................8
Figure 8: Heat sink surface specifications............................................................................................9
Figure 9: Scratch specification for SEMITOP modules ......................................................................... 10
Figure 10: Discoloration of SEMITOP on bottom side .......................................................................... 10
Figure 11: Example of gauge to measure the thermal grease thickness ................................................ 11
Figure 12: Assembling “module+PCB” to the heatsink ........................................................................ 11
8. Caption of tables
Table 1: Specification of PTH for the press-in process ...........................................................................3

Table 2: Specification of PTH for soldering of Press-Fit pins to the PCB ...................................................3
Table 3: Specification of PCB hole diameter for the mounting post .........................................................4
Table 4: Specification of press-type ...................................................................................................5
Table 5: Recommended thermal grease thickness for SEMITOP® modules ............................................. 11
Table 6: Mounting specifications for SEMITOP® Press-Fit..................................................................... 12
9. References
[1] www.SEMIKRON.com
[2] SEMITOP® Technical Explanations

10. Disclaimer
The data given in this document shall be for information purposes only. It may not reflect the product in its
latest status. For a valid product specification please refer to the relevant product data sheet in its actual
version.
SEMIKRON reserves the right to make changes without further notice herein to improve reliability, function
or design. Information furnished in this document is believed to be accurate and reliable. However, no
representation or warranty is given and no liability is assumed with respect to the accuracy or use of such
information, including without limitation, warranties of non-infringement of intellectual property rights of
any third party. SEMIKRON does not assume any liability arising out of the application or use of any
product or circuit described herein. Furthermore, this technical information may not be considered as an
assurance of component characteristics. No warranty or guarantee expressed or implied is made regarding
delivery, performance or suitability. This document supersedes and replaces all information previously
supplied and may be superseded by updates without further notice.
SEMIKRON products are not authorized for use in life support appliances and systems without the express
written approval by SEMIKRON.
SEMIKRON INTERNATIONAL GmbH

P.O. Box 820251 • 90253 Nuremberg • Germany
Tel: +49 911-65 59-234 • Fax: +49 911-65 59-262
sales.skd@SEMIKRON.com • www.SEMIKRON.com

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SEMIKRON Mounting Instruction SEMITOP Press-Fit en 2017-08-28 Rev-03

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Mounting Instruction Revision: 03

SEMITOP2,3,4 Issue date:

Keyword: SEMITOP, mounting instructions, one screw mounting,

Revision history ...............................................................................................................................2

© by SEMIKRON / Mounting Instruction / SEMITOP2,3,4 Press-Fit / 2017-08-28 Page 1/14

06.06.2014 01 Improvement of contents 13

08.05.2017 02 New template and general review 14

- Update of Mounting specifications for SEMITOP® (Table 6);

© by SEMIKRON / Mounting Instruction / SEMITOP2,3,4 Press-Fit / 2017-08-28 Page 2/14

1.1 PCB specifications

The following table shows the specification of the PTH:

Table 1: Specification of PTH for the press-in process

Min. Typ. Max.

Recommended size of drill 1.6mm

Drilled hole diameter 1.575mm 1.6mm 1.625mm

Copper thickness in via 25µm

Tin plating in via 0.5µm

Final hole diameter 1.39mm 1.45mm 1.54mm

Cu width of the Annular ring 100µm

Thickness of PCB 1.6mm

Table 2: Specification of PTH for soldering of Press-Fit pins to the PCB

Min. Typ. Max.

Drilled hole diameter 2.10mm 2.15mm 2.25mm

Copper thickness in via 25µm

Tin plating in via 10µm

Final hole diameter 2.00mm

Cu width of the Annular ring 100µm

Thickness of PCB 0.8mm 1.6mm

© by SEMIKRON / Mounting Instruction / SEMITOP2,3,4 Press-Fit / 2017-08-28 Page 3/14

Table 3: Specification of PCB hole diameter for the mounting post

Module type Diameter [mm]

SEMITOP4® Press-Fit 3.6

1.2 Specification for components close to module pins

Figure 1: Minimum distance between components and hole center of PTH

© by SEMIKRON / Mounting Instruction / SEMITOP2,3,4 Press-Fit / 2017-08-28 Page 4/14

Table 4: Specification of press-type

Additional visual inspection is

Accurate control of speed and

2.1 Press-in setup

Figure 2: Schematic view of the press-in setup

Press-in tool top

SEMITOP® press-fit module

Space for press-fit pins

PCB holes for module

Press-in tool base

Support part for PCB

© by SEMIKRON / Mounting Instruction / SEMITOP2,3,4 Press-Fit / 2017-08-28 Page 5/14

2.2 Press-in process

2.2.1 Basic requirements

Figure 3: Press-in depth in PCB

Center of press-fit pin head

2.2.2 Press-in tool parameters

2.2.3 Press-in control parameters

© by SEMIKRON / Mounting Instruction / SEMITOP2,3,4 Press-Fit / 2017-08-28 Page 6/14

2.3 Press-out setup

Figure 5: Schematic view of the press-out setup

Press-out tool top

Support part for PCB

Base of support part for PCB

© by SEMIKRON / Mounting Instruction / SEMITOP2,3,4 Press-Fit / 2017-08-28 Page 7/14

Figure 6: Press-out process

2.3.1 Press-out tool parameters

2.3.2 Press-out control parameters

Figure 7: Typical press-out diagram for a module with 26 pins