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2-4 Cell Li+ Battery SMBus Charge Controller with N-Channel Power MOSFET Selector
and Advanced Circuit Protection
Check for Samples: bq24725
1FEATURES
2• SMBus Host-Controlled NMOS-NMOS DESCRIPTION
Synchronous Buck Converter with The bq24725 is a high-efficiency, synchronous
Programmable 615kHz, 750kHz, and 885kHz battery charger, offering low component count for
Switching Frequencies space-constraint, multi-chemistry battery charging
• Automatic N-channel MOSFET Selection of applications.
System Power Source from Adapter or Battery The bq24725 uses two charge pumps to separately
Driven by Internal Charge Pumps drive n-channel MOSFETs (ACFET, RBFET and
• Enhanced Safety Features for Over Voltage BATFET) for automatic system power source
Protection, Over Current Protection, Battery, selection.
Inductor and MOSFET Short Circuit Protection SMBus controlled input current, charge current, and
• Programmable Input Current, Charge Voltage, charge voltage DACs allow for high regulation
Charge Current Limits accuracies that can be programmed by the system
power management micro-controller.
– ±0.5% Charge Voltage Accuracy up to 19.2V
– ±3% Charge Current Accuracy up to 8.128A The bq24725 uses internal input current register or
external ILIM pin to throttle down PWM modulation to
– ±3% Input Current Accuracy up to 8.064A reduce the charge current.
– ±2% 20x Adapter Current or Charge Current
The bq24725 charges two, three or four series Li+
Amplifier Output Accuracy
cells, and is available in a 20-pin, 3.5 x 3.5 mm2 QFN
• Programmable Battery Depletion Threshold, package.
and Battery LERAN Function
PHASE
HIDRV
REGN
• Programmable Adapter Detection and
BTST
VCC
Indicator
20 19 18 17 16
• Integrated Soft Start
• Integrated Loop Compensation ACN 1 15 LODRV
• Real Time System Control on ILIM pin to Limit
Charge Current ACP 2 14 GND
APPLICATIONS
6 7 8 9 10
• Portable Notebook Computers, UMPC,
ACDET
IOUT
SDA
ILIM
SCL
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2 PowerPAD is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date. Copyright © 2010, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
bq24725
SLUS702 – JULY 2010 www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
DEVICE INFORMATION
Q6
Reverse
R12 BSS138W U2
Input
1M EN IMD2A
Protection
R13
3.01M D2
BAT54C
Q1 (ACFET) Q2 (RBFET)
FDS6680A FDS6680A RAC 10m?
Adapter + SYSTEM
Ri C17 C16 Total
2? 2200pF 0.1µF R9
C1 C3 Csys
Ci 10Ω
220µF
Adapter - 2.2µF
0.1µF 0.1µF C5
1µF
C2 ACN VCC
0.1µF R6
R10 R11 4.02k
4.02k ACP BATDRV Q5 (BATFET)
4.02k
C15 FDS6680A
C6
0.01µF
CMSRC 1µF
REGN
ACDRV D1
R1 BAT54 C9
BTST C8
430k 10uF
10uF
ACDET
R2 Q3
R8 HIDRV
66.5k Sis412DN RSR
100k ILIM C7
R7 U1 0.047µF 10m?
316k bq24725 PHASE Pack +
L1
+3.3V C10 C11
R3 R4 R5 4.7µH 10µF 10µF
10k 10k 10k LODRV Q4
Sis412DN
SDA Pack -
HOST SMBus GND
SCL
SRP
Dig I/O ACOK C13 C12
0.1µF 0.1µF
PowerPad SRN
ADC IOUT
C14
C4 0.1µF
100p
Dig I/O EN
Fs = 750kHz, IADPT = 4.096A, ICHRG = 2.944A, ILIM = 4A, VCHRG = 12.592V, 90W adapter and 3S2P battery pack
D3
PDS1040 Q1 (ACFET)
FDS6680A RAC 10m?
Adapter + SYSTEM
Ri C17 C16 Total
2? 2200pF 0.1µF R9
C1 C3 Csys
Ci 10Ω
220µF
Adapter - 2.2µF
0.1µF 0.1µF C5
1µF
C2 ACN VCC
0.1µF R6
R10 4.02k
4.02k ACP BATDRV Q5 (BATFET)
R11
C15 FDS6680A
4.02k C6
0.01µF
CMSRC 1µF
REGN
ACDRV D1
R1 BAT54 C9
BTST C8
430k 10uF
10uF
ACDET
R2 Q3
R8 HIDRV
66.5k Sis412DN RSR
100k ILIM C7
R7 U1 0.047µF 10m?
549k bq24725 PHASE Pack +
L1
+3.3V C10 C11
R3 R4 R5 4.7µH 10µF 10µF
10k 10k 10k LODRV Q4
Sis412DN
SDA Pack -
HOST SMBus GND
SCL
SRP
Dig I/O ACOK C13 C12
0.1µF 0.1µF
PowerPad SRN
ADC IOUT
C14
C4 0.1µF
100p
Fs = 750kHz, IADPT = 2.688A, ICHRG = 1.984A, ILIM = 2.54A, VCHRG = 12.592V, 65W adapter and 3S2P battery pack
Figure 2. Typical System Schematic with One NMOS Selector and Schottky Diode
ORDERING INFORMATION
ORDERING NUMBER
PART NUMBER IC MARKING PACKAGE QUANTITY
(Tape and Reel)
bq24725RGRR 3000
bq24725 BQ725 20-PIN 3.5 x 3.5mm2 QFN
bq24725RGRT 250
THERMAL INFORMATION
bq24725
THERMAL METRIC (1) UNITS
RGR (20 PIN)
qJA Junction-to-ambient thermal resistance (2) 46.8
yJT Junction-to-top characterization parameter (3) 0.6 °C/W
yJB Junction-to-board characterization parameter (4) 15.3
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
(3) The junction-to-top characterization parameter, yJT, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining qJA, using a procedure described in JESD51-2a (sections 6 and 7).
(4) The junction-to-board characterization parameter, yJB, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining qJA , using a procedure described in JESD51-2a (sections 6 and 7).
VALUE UNIT
SRN, SRP, ACN, ACP, CMSRC, VCC –0.3 to 30
PHASE –2 to 30
Voltage range
ACDET, SDA, SCL, LODRV, REGN, IOUT, ILIM, ACOK –0.3 to 7 V
BTST, HIDRV, ACDRV, BATDRV –0.3 to 36
Maximum difference voltage SRP–SRN, ACP–ACN –0.5 to 0.5
Junction temperature range, TJ –40 to 155 °C
Storage temperature range, Tstg –55 to 155 °C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to GND if not specified. Currents are positive into, negative out of the specified terminal. Consult Packaging
Section of the data book for thermal limitations and considerations of packages.
ELECTRICAL CHARACTERISTICS
4.5 V ≤ VVCC ≤ 24 V, 0°C ≤ TJ ≤ 125°C, typical values are at TA = 25°C, with respect to GND (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
OPERATING CONDITIONS
VVCC_OP VCC Input voltage operating range 4.5 24 V
CHARGE VOLTAGE REGULATION
VBAT_REG_RNG BAT voltage regulation range 1.024 19.2 V
16.716 16.8 16.884 V
ChargeVoltage() = 0x41A0H
-0.5% 0.5%
12.529 12.592 12.655 V
VBAT_REG_ACC Charge Voltage Regulation Accuracy ChargeVoltage() = 0x3130H
–0.5% 0.5%
8.35 8.4 8.45 V
ChargeVoltage() = 0x20D0H
–0.6% 0.6%
Battery Depletion Rising Hysteresis, VSRN ChargeOption() bit [12:11] = 01 240 325 410 mV
VBATDEPL_RHYST
rising ChargeOption() bit [12:11] = 10 255 345 435 mV
ChargeOption() bit [12:11] = 11 (Default) 280 370 460 mV
Battery Depletion Rising Deglitch Delay to turn off ACFET and turn on BATFET during
tBATDEPL_RDEG 600 ms
(Specified by design) LEARN cycle
BATTERY LOWV COMPARATOR (BAT_LOWV)
VBATLV_FALL Battery LOWV falling threshold VSRN falling 2.4 2.5 2.6 V
VBATLV_RHYST Battery LOWV rising hysteresis VSRN rising 200 mV
IBATLV Battery LOWV charge current limit 10 mΩ current sensing resistor 0.5 A
THERMAL SHUTDOWN COMPARATOR (TSHUT)
TSHUT Thermal shutdown rising temperature Temperature rising 155 °C
TSHUT_HYS Thermal shutdown hysteresis, falling Temperature falling 20 °C
ILIM COMPARATOR
VILIM_FALL ILIM as CE falling threshold VILIM falling 60 75 90 mV
VILIM_RISE ILIM as CE rising threshold VILIM rising 90 105 120 mV
LOGIC INPUT (SDA, SCL)
VIN_ LO Input low threshold 0.8 V
VIN_ HI Input high threshold 2.1 V
IIN_ LEAK Input bias current V=7V –1 1 mA
LOGIC OUTPUT OPEN DRAIN (ACOK, SDA)
VOUT_ LO Output saturation voltage 5 mA drain current 500 mV
IOUT_ LEAK Leakage current V=7V –1 1 mA
ANALOG INPUT (ACDET, ILIM)
IIN_ LEAK Input bias current V=7V –1 1 mA
PWM OSCILLATOR
FSW PWM switching frequency ChargeOption () bit [9] = 0 (Default) 600 750 900 kHz
FSW+ PWM increase frequency ChargeOption() bit [10:9] = 11 665 885 1100 kHz
FSW– PWM decrease frequency ChargeOption() bit [10:9] = 01 465 615 765 kHz
BATFET GATE DRIVER (BATDRV)
IBATFET BATDRV charge pump current limit 40 60 µA
VBATFET Gate drive voltage on BATFET VBATDRV - VSRN when VSRN > UVLO 5.5 6.1 6.5 V
Minimum load resistance between
RBATDRV_LOAD 500 kΩ
BATDRV and SRN
RBATDRV_OFF BATDRV turn-off resistance I = 30µA 5 6.2 7.4 kΩ
(2) Devices participating in a transfer will timeout when any clock low exceeds the 25ms minimum timeout period. Devices that have
detected a timeout condition must reset the communication no later than the 35ms maximum timeout period. Both a master and a slave
must adhere to the maximum value specified as it incorporates the cumulative stretch limit for both a master (10ms) and a slave (25ms).
(3) User can adjust threshold via SMBus ChargeOption() REG0x12.
TYPICAL CHARACTERISTICS
SPACER
SPACER
CH1: PHASE, 10V/div, CH2: LODRV, 5V/div, CH4: inductor current, CH2: battery current, 2A/div, CH3: adapter current, 2A/div, CH4:
2A/div, 4us/div system load current, 2A/div, 100us/div
Figure 10. 100% Duty and Refresh Pulse Figure 11. System Load Transient (Input DPM)
CH1: PHASE, 20V/div, CH2: battery voltage, 5V/div, CH3: LODRV, CH1: PHASE, 20V/div, CH2: LODRV, 10V/div, CH3: battery voltage,
10V/div, CH4: inductor current, 2A/div, 400us/div 5V/div, CH4: inductor current, 2A/div, 2ms/div
Figure 12. Battery Insertion Figure 13. Battery to Ground Short Protection
98
97 4-cell 16.8 V
96
95
3-cell 12.6 V
Efficiency - % 94
93
2-cell 8.4 V
92
91
90 VI = 20 V,
f = 750 kHz,
89 L = 4.7 mH
88
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5
Charge Current
ACOK 5
2.4V 71%** of LEARN
11 BATDRV
VREF_VREG
ACOK_DRV BATDEPL
SRN SRN
150ms rising deglitch**
VREF_IAC WATCHDOG
TIMER
ACP 2
20X WATCHDOG 175s **
ACN 1 TIMEOUT EN_CHRG
ACP-PH IFAULT_HI
700mV **
PH-GND IFAULT_LO
110mV
ACP-ACN
ACOC
1.66xVREF_IAC **
ACP-ACN FAST_DPM
1.08xVREF_IAC
4.3V REFRESH
BTST-PH
VFB
BATOVP
104%VREF_VREG
2.5V BAT_LOWV
SRN
VCC
VCC-SRN
SRN+275mV
DETAILED DESCRIPTION
SMBus Interface
The bq24725 operates as a slave, receiving control inputs from the embedded controller host through the SMBus
interface. The bq24725 uses a simplified subset of the commands documented in System Management Bus
Specification V1.1, which can be downloaded from www.smbus.org. The bq24725 uses the SMBus Read-Word
and Write-Word protocols (see Figure 17) to communicate with the smart battery. The bq24725 performs only as
a SMBus slave device with address 0b00010010 (0x12H) and does not initiate communication on the bus. In
addition, the bq24725 has two identification registers a 16-bit device ID register (0xFFH) and a 16-bit
manufacturer ID register (0xFEH).
SMBus communication is enabled with the following conditions:
• VVCC is above UVLO;
• VACDET is above 0.6V;
The data (SDA) and clock (SCL) pins have Schmitt-trigger inputs that can accommodate slow edges. Choose
pull-up resistors (10kΩ) for SDA and SCL to achieve rise times according to the SMBus specifications.
Communication starts when the master signals a START condition, which is a high-to-low transition on SDA,
while SCL is high. When the master has finished communicating, the master issues a STOP condition, which is a
low-to-high transition on SDA, while SCL is high. The bus is then free for another transmission. Figure 18 and
Figure 19 show the timing diagram for signals on the SMBus interface. The address byte, command byte, and
data bytes are transmitted between the START and STOP conditions. The SDA state changes only while SCL is
low, except for the START and STOP conditions. Data is transmitted in 8-bit bytes and is sampled on the rising
edge of SCL. Nine clock cycles are required to transfer each byte in or out of the bq24725 because either the
master or the slave acknowledges the receipt of the correct byte during the ninth clock cycle. The bq24725
supports the charger commands as described in Table 2.
a) Write-Word Format
SLAVE COMMAND LOW DATA HIGH DATA
S W ACK ACK ACK ACK P
ADDRESS BYTE BYTE BYTE
7 BITS 1b 1b 8 BITS 1b 8 BITS 1b 8 BITS 1b
MASTER TO SLAVE
SLAVE TO MASTER
A B C D E F G H I J K
tLOW t HIGH
SMBCLK
SMBDATA
A = START CONDITION E = SLAVE PULLS SMBDATA LINE LOW I = ACKNOWLEDGE CLOCK PULSE
B = MSB OF ADDRESS CLOCKED INTO SLAVE F = ACKNOWLEDGE BIT CLOCKED INTO MASTER J = STOP CONDITION
C = LSB OF ADDRESS CLOCKED INTO SLA VE G = MSB OF DATA CLOCKED INTO MASTER K = NEW START CONDITION
D = R/W BIT CLOCKED INTO SLAVE H = LSB OF DATA CLOCKED INTO MASTER
Battery-Charger Commands
The bq24725 supports six battery-charger commands that use either Write-Word or Read-Word protocols, as
summarized in Table 2. ManufacturerID() and DeviceID() can be used to identify the bq24725. The
ManufacturerID() command always returns 0x0040H and the DeviceID() command always returns 0x0008H.
terminates charging. Upon POR, charge current is 0A. A 0.1µF capacitor between SRP and SRN for differential
mode filtering is recommended, 0.1µF capacitor between SRN and ground for common mode filtering, and an
optional 0.1µF capacitor between SRP and ground for common mode filtering. Meanwhile, the capacitance on
SRP should not be higher than 0.1µF in order to properly sense the voltage across SRP and SRN for
cycle-by-cycle under-current and over current detection.
The SRP and SRN pins are used to sense RSR with default value of 10mΩ. However, resistors of other values
can also be used. For a larger sense resistor, a larger sense voltage is given, and a higher regulation accuracy;
but, at the expense of higher conduction loss. If the current sensing resistor value is too high, it may trigger an
over current protection threshold because the current ripple voltage is too high. In such a case, either a higher
inductance value or a lower current sensing resistor value should be used to limit the current ripple voltage level.
A current sensing resistor value no more than 20mΩ is suggested.
To provide secondary protection, the bq24725 has an ILIM pin with which the user can program the maximum
allowed charge current. Internal charge current limit is the lower one between the voltage set by
ChargeCurrent(), and voltage on ILIM pin. To disable this function, the user can pull ILIM above 1.6V, which is
the maximum charge current regulation limit. Equation 1 shows the voltage set on ILIM pin with respect to the
preferred charge current limit:
VILIM = 20 × (VSRP - VSRN ) = 20 ´ ICHG ´ RSR (1)
If input current rises above 108% of input current limit set point, the charger will shut down immediately to allow
the input current drop. After charging stops, the charger will soft restart to charge the battery if the adapter still
has power left to charge the battery. This prevents a crash if the adapter is overloaded when the system has a
high and fast loading transient. The waiting time between shut down and restart charging is a natural response
time of the input current limit loop.
Charge Timeout
The bq24725 includes a watchdog timer to terminate charging if the charger does not receive a write
ChargeVoltage() or write ChargeCurrent() command within 175s (adjustable via ChargeOption() command). If a
watchdog timeout occurs all register values keep unchanged but charge is suspended. Write ChargeVoltage() or
write ChargeCurrent() commands must be re-sent to reset watchdog timer and resume charging. The watchdog
timer can be disabled, or set to 44s, 88s or 175s via SMBus command (ChargeOption() bit[14:13]). After
watchdog timeout write ChargeOption() bit[14:13] to disable watchdog timer also resume charging.
Converter Operation
The synchronous buck PWM converter uses a fixed frequency voltage mode control scheme and internal type III
compensation network. The LC output filter gives a characteristic resonant frequency
1
¦o =
2p Lo Co (3)
The resonant frequency fo is used to determine the compensation to ensure there is sufficient phase margin and
gain margin for the target bandwidth. The LC output filter should be selected to give a resonant frequency of
10–20 kHz nominal for the best performance. Suggest component value as charge current of 750kHz default
switching frequency is shown in Table 7.
Ceramic capacitors show a dc-bias effect. This effect reduces the effective capacitance when a dc-bias voltage is
applied across a ceramic capacitor, as on the output capacitor of a charger. The effect may lead to a significant
capacitance drop, especially for high output voltages and small capacitor packages. See the manufacturer's data
sheet about the performance with a dc bias voltage applied. It may be necessary to choose a higher voltage
rating or nominal capacitance value in order to get the required value at the operating point.
The bq24725 has three loops of regulation: input current, charge current and charge voltage. The three loops are
brought together internally at the error amplifier. The maximum voltage of the three loops appears at the output
of the error amplifier EAO. An internal saw-tooth ramp is compared to the internal error control signal EAO (see
Figure 16) to vary the duty-cycle of the converter. The ramp has offset of 200mV in order to allow 0% duty-cycle.
When the battery charge voltage approaches the input voltage, EAO signal is allowed to exceed the saw-tooth
ramp peak in order to get a 100% duty-cycle. If voltage across BTST and PHASE pins falls below 4.3V, a refresh
cycle starts and low-side n-channel power MOSFET is turned on to recharge the BTST capacitor. It can achieve
duty cycle of up to 99.5%.
APPLICATION INFORMATION
Inductor Selection
The bq24725 has three selectable fixed switching frequency. Higher switching frequency allows the use of
smaller inductor and capacitor values. Inductor saturation current should be higher than the charging current
(ICHG) plus half the ripple current (IRIPPLE):
ISAT ³ ICHG + (1/2) IRIPPLE (4)
The inductor ripple current depends on input voltage (VIN), duty cycle (D = VOUT/VIN), switching frequency (fS) and
inductance (L):
V ´ D ´ (1 - D)
IRIPPLE = IN
fS ´ L (5)
The maximum inductor ripple current happens with D = 0.5 or close to 0.5. For example, the battery charging
voltage range is from 9V to 12.6V for 3-cell battery pack. For 20V adapter voltage, 10V battery voltage gives the
maximum inductor ripple current. Another example is 4-cell battery, the battery voltage range is from 12V to
16.8V, and 12V battery voltage gives the maximum inductor ripple current.
Usually inductor ripple is designed in the range of (20-40%) maximum charging current as a trade-off between
inductor size and efficiency for a practical design.
The bq24725 has charge under current protection (UCP) by monitoring charging current sensing resistor
cycle-by-cycle. The typical cycle-by-cycle UCP threshold is 5mV falling edge corresponding to 0.5A falling edge
for a 10mΩ charging current sensing resistor. When the average charging current is less than 125mA for a 10mΩ
charging current sensing resistor, the low side MOSFET is off until BTST capacitor voltage needs to refresh the
charge. As a result, the converter relies on low side MOSFET body diode for the inductor freewheeling current.
Input Capacitor
Input capacitor should have enough ripple current rating to absorb input switching ripple current. The worst case
RMS ripple current is half of the charging current when duty cycle is 0.5. If the converter does not operate at
50% duty cycle, then the worst case capacitor RMS current occurs where the duty cycle is closest to 50% and
can be estimated by Equation 6:
ICIN = ICHG ´ D × (1 - D) (6)
Low ESR ceramic capacitor such as X7R or X5R is preferred for input decoupling capacitor and should be
placed to the drain of the high side MOSFET and source of the low side MOSFET as close as possible. Voltage
rating of the capacitor must be higher than normal input voltage level. 25V rating or higher capacitor is preferred
for 19-20V input voltage. 10-20mF capacitance is suggested for typical of 3-4A charging current.
Ceramic capacitors show a dc-bias effect. This effect reduces the effective capacitance when a dc-bias voltage is
applied across a ceramic capacitor, as on the input capacitor of a charger. The effect may lead to a significant
capacitance drop, especially for high input voltages and small capacitor packages. See the manufacturer's data
sheet about the performance with a dc bias voltage applied. It may be necessary to choose a higher voltage
rating or nominal capacitance value in order to get the required value at the operating point.
Output Capacitor
Output capacitor also should have enough ripple current rating to absorb output switching ripple current. The
output capacitor RMS current is given:
I
ICOUT = RIPPLE » 0.29 ´ IRIPPLE
2 ´ 3 (7)
The bq24725 has internal loop compensator. To get good loop stability, the resonant frequency of the output
inductor and output capacitor should be designed between 10 kHz and 20 kHz. The preferred ceramic capacitor
is 25V X7R or X5R for output capacitor. 10-20mF capacitance is suggested for a typical of 3-4A charging current.
Place the capacitors after charging current sensing resistor to get the best charge current regulation accuracy.
Ceramic capacitors show a dc-bias effect. This effect reduces the effective capacitance when a dc-bias voltage is
applied across a ceramic capacitor, as on the output capacitor of a charger. The effect may lead to a significant
capacitance drop, especially for high output voltages and small capacitor packages. See the manufacturer's data
sheet about the performance with a dc bias voltage applied. It may be necessary to choose a higher voltage
rating or nominal capacitance value in order to get the required value at the operating point.
The lower the FOM value, the lower the total power loss. Usually lower RDS(ON) has higher cost with the same
package size.
The top-side MOSFET loss includes conduction loss and switching loss. It is a function of duty cycle
(D=VOUT/VIN), charging current (ICHG), MOSFET's on-resistance (RDS(ON)), input voltage (VIN), switching frequency
(fS), turn on time (ton) and turn off time (toff):
1
Ptop = D ´ ICHG2 ´ RDS(on) + ´ VIN ´ ICHG ´ (t on + t off ) ´ f s
2 (9)
The first item represents the conduction loss. Usually MOSFET RDS(ON) increases by 50% with 100°C junction
temperature rise. The second term represents the switching loss. The MOSFET turn-on and turn-off times are
given by:
Q Q
t on = SW , t off = SW
Ion Ioff (10)
where Qsw is the switching charge, Ion is the turn-on gate driving current and Ioff is the turn-off gate driving
current. If the switching charge is not given in MOSFET datasheet, it can be estimated by gate-to-drain charge
(QGD) and gate-to-source charge (QGS):
1
QSW = QGD + ´ QGS
2 (11)
Gate driving current can be estimated by REGN voltage (VREGN), MOSFET plateau voltage (Vplt), total turn-on
gate resistance (Ron) and turn-off gate resistance (Roff) of the gate driver:
VREGN - Vplt Vplt
Ion = , Ioff =
Ron Roff (12)
The conduction loss of the bottom-side MOSFET is calculated with the following equation when it operates in
synchronous continuous conduction mode:
Pbottom = (1 - D) x ICHG 2 x RDS(on) (13)
When charger operates in non-synchronous mode, the bottom-side MOSFET is off. As a result all the
freewheeling current goes through the body-diode of the bottom-side MOSFET. The body diode power loss
depends on its forward voltage drop (VF), non-synchronous mode charging current (INONSYNC), and duty cycle (D).
PD = VF x INONSYNC x (1 - D) (14)
The maximum charging current in non-synchronous mode can be up to 0.25A for a 10mΩ charging current
sensing resistor or 0.5A if battery voltage is below 2.5V. The minimum duty cycle happens at lowest battery
voltage. Choose the bottom-side MOSFET with either an internal Schottky or body diode capable of carrying the
maximum non-synchronous mode charging current.
D1
R2(1206)
R1(2010) 10-20 Ω
Adapter 2Ω
connector VCC pin
C1
2.2μF C2
0.47-1μF
In normal operation, the low side MOSFET current is from source to drain which generates a negative voltage
drop when it turns on, as a result the over current comparator can not be triggered. When the high side switch
short circuit or inductor short circuit happens, the large current of low side MOSFET is from drain to source and
can trig low side switch over current comparator. bq24725 senses the low side switch voltage drop through the
PHASE pin and GND pin.
The high-side FET short is detected by monitoring the voltage drop between ACP and PHASE. As a result, it not
only monitors the high side switch voltage drop, but also the adapter sensing resistor voltage drop and PCB trace
voltage drop from ACN terminal of RAC to charger high side switch drain. Usually, there is a long trance between
input sensing resistor and charger converting input, a careful layout will minimize the trace effect.
To prevent unintentional charger shut down in normal operation, MOSFET RDS(on) selection and PCB layout is
very important. Figure 22 shows a improvement PCB layout example and its equivalent circuit. In this layout, the
system current path and charger input current path is not separated, as a result, the system current causes
voltage drop in the PCB copper and is sensed by the IC. The worst layout is when a system current pull point is
after charger input; as a result all system current voltage drops are counted into over current protection
comparator. The worst case for IC is when the total system current and charger input current sum equals the
DPM current. When the system pulls more current, the charger IC tries to regulate the RAC current as a constant
current by reducing the charging current.
I DPM
R AC System Path PCB Trace
System current I SYS
R AC R PCB
I CHRGIN
Charger input current
Charger Input PCB Trace
ACP ACN Charger I BAT
To ACP To ACN
Figure 23 shows the optimized PCB layout example. The system current path and charge input current path is
separated, as a result the IC only senses charger input current caused PCB voltage drop and minimized the
possibility of unintentional charger shut down in normal operation. This also makes PCB layout easier for high
system current application.
R AC System Path PCB Trace I DPM
System current I SYS
The total voltage drop sensed by IC can be express as the following equation.
Vtop = RAC x IDPM + RPCB x (ICHRGIN + (IDPM - ICHRGIN) x k) + RDS(on) x IPEAK (15)
where the RAC is the AC adapter current sensing resistance, IDPM is the DPM current set point, RPCB is the PCB
trace equivalent resistance, ICHRGIN is the charger input current, k is the PCB factor, RDS(on) is the high side
MOSFET turn on resistance and IPEAK is the peak current of inductor. Here the PCB factor k equals 0 means the
best layout shown in Figure 23 where the PCB trace only goes through charger input current while k equals 1
means the worst layout shown in Figure 22 where the PCB trace goes through all the DPM current. The total
voltage drop must below the high side short circuit protection threshold to prevent unintentional charger shut
down in normal operation.
The low side MOSFET short circuit voltage drop threshold is fixed to typical 110mV. The high side MOSFET
short circuit voltage drop threshold can be adjusted via the SMBus command. ChargeOption() bit[8:7] = 00, 01,
10, 11 sets the threshold at 300mV, 500mV, 700mV and 900mV respectively. For a fixed PCB layout, the host
should set the proper short circuit protection threshold level to prevent unintentional charger shut down in normal
operation.
PCB Layout
The switching node rise and fall times should be minimized for minimum switching loss. Proper layout of the
components to minimize high frequency current path loop (see Figure 24) is important to prevent electrical and
magnetic field radiation and high frequency resonant problems. Here is a PCB layout priority list for proper
layout. Layout PCB according to this specific order is essential.
1. Place input capacitor as close as possible to switching MOSFET’s supply and ground connections and use
shortest copper trace connection. These parts should be placed on the same layer of PCB instead of on
different layers and using vias to make this connection.
2. The IC should be placed close to the switching MOSFET’s gate terminals and keep the gate drive signal
traces short for a clean MOSFET drive. The IC can be placed on the other side of the PCB of switching
MOSFETs.
3. Place inductor input terminal to switching MOSFET’s output terminal as close as possible. Minimize the
copper area of this trace to lower electrical and magnetic field radiation but make the trace wide enough to
carry the charging current. Do not use multiple layers in parallel for this connection. Minimize parasitic
capacitance from this area to any other trace or plane.
4. The charging current sensing resistor should be placed right next to the inductor output. Route the sense
leads connected across the sensing resistor back to the IC in same layer, close to each other (minimize loop
area) and do not route the sense leads through a high-current path (see Figure 25 for Kelvin connection for
best current accuracy). Place decoupling capacitor on these traces next to the IC
5. Place output capacitor next to the sensing resistor output and ground
6. Output capacitor ground connections need to be tied to the same copper that connects to the input capacitor
ground before connecting to system ground.
7. Use single ground connection to tie charger power ground to charger analog ground. Just beneath the IC
use analog ground copper pour but avoid power pins to reduce inductive and capacitive noise coupling
8. Route analog ground separately from power ground. Connect analog ground and connect power ground
separately. Connect analog ground and power ground together using power pad as the single ground
connection point. Or using a 0Ω resistor to tie analog ground to power ground (power pad should tie to
analog ground in this case if possible).
9. Decoupling capacitors should be placed next to the IC pins and make trace connection as short as possible
10. It is critical that the exposed power pad on the backside of the IC package be soldered to the PCB ground.
Ensure that there are sufficient thermal vias directly under the IC, connecting to the ground plane on the
other layers.
11. The via size and number should be enough for a given current path.
See the EVM design for the recommended component placement with trace and via locations. For the QFN
information, See SCBA017 and SLUA271.
PHASE L1 R1 VBAT
High
VIN Frequency BAT
Current
Path GND C2
C1
www.ti.com 29-Jul-2010
PACKAGING INFORMATION
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
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TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 27-Jul-2010
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 27-Jul-2010
Pack Materials-Page 2
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