Luxel 9000 S.M

Luxel F-9000 Recorder
Engineer’s Reference Guide

6700898004
IMPORTANT
FujifilmT products are so designed and constructed as to be safe and without risk to health
when properly used (in accordance with the supplied documentation) and when the safety
precautions contained in this document are fully observed.
This document was produced by the Technical Publications Department, FUJIFILM

Electronic Imaging Ltd.
 2002
FUJIFILM Electronic Imaging Ltd.
FUJIFILM House
Boundary Way
Hemel Hempstead Tel: 01442 213440
Hertfordshire HP2 7RH Fax: 01442 343432
England Registered Number: 3244452
Preliminaries
This document must not be copied without prior written authorization, and although correct at the time of
writing is subject to change without notice. For further information contact the Product Information
Manager, FUJIFILM Electronic Imaging Ltd, at the address given on the front page of this manual.
(ii) Luxel F-9000 Recorder

Preliminaries
WARNING
All precautions mentioned in this document must be strictly
observed at all times. Personnel MUST therefore read the
contents of the document BEFORE commencing any work on the
equipment described in the document.
Improper use of controls and switches, failure to comply with
warnings, and the performance of adjustments or procedures not
specified in this document, may expose personnel to danger.
WARNING
This equipment includes a recorder which uses a Class 3B lasers
(IIIb USA), and has the following potential hazards:
w Lasers that can blind or damage skin.
w Moving parts that can injure.
w Auxiliary equipment that can become hot and burn skin.
This equipment uses a Class 3B lasers (IIIb USA).
Engineer’s Reference Guide 6700898004 (iii)

Preliminaries
CAUTION
The attention of the engineer is particularly drawn to the
requirement for ensuring that the site for installation and
operation of the LuxelT F-9000 Recorder at the customers
premises shall accord in all respects and at all times with the
following environmental conditions.
Verify the environmental conditions. The temperature in the

work area must be within the range 18°C to 29°C. The humidity
shall be within the range 20% to 70% RH (non-condensing), with
a rate of change not exceeding 5% per hour. Low humidity causes
a build up of static electricity which, if discharged, can cause data
errors and also lead to film handling problems. High humidity
leads to condensation and corrosion problems.
Regularly inspect the recorder ventilation fans, to make sure they
are working and that their grills have not been accidentally
covered. If temperature limits are exceeded, the recorder switches
off.
(iv) Luxel F-9000 Recorder

Preliminaries
Note: This equipment has been tested and found to be compliant with the
limits for a Class A digital device, pursuant to part 15 of the FCC Rules.
These limits are designed to provide reasonable protection against harmful
interference when the equipment is operated in a commercial environment.
This equipment generates, uses and can radiate radio frequency energy and,
if not installed and used in accordance with the instruction manual, may
cause harmful interference to radio communications. Operation of this
equipment in a residential area is likely to cause harmful interference in
which case the user will be required to correct the interference at his own
expense.
Engineer’s Reference Guide 6700898004 (v)

Preliminaries
Electromagnetic Compatibility Information - Europe

This product has been found to satisfy the Class A limits for radio
interference of information technology equipment. Class A equipment is
intended for use in a light industrial or commercial environment for which
the 30 metre protection distance is used. Operation of this equipment in a
domestic or residential environment may result in interference to other
equipment, in which case the user will be required to correct the interference
at his own expense. In some countries this equipment may be subject to
restrictions on its use. Where applicable the user should inform the relevant
local authority that Class A Information Technology Equipment has been
taken into service.
This equipment may also be susceptible to strong electromagnetic fields and
should not be sited close to high power radio transmitters or radar
installations. If the intended site of operation is prone to electromagnetic
disturbances due to lightning strikes, additional precautions should be taken
to protect the equipment from the resulting electromagnetic disturbance.
Typical examples for the intended environment of this equipment would
include:
• business premises, for example, offices, banks, etc.
• retail outlets, for example, shops, supermarkets, etc.
• light industrial locations, for example, workshops,
service centres, etc.
Locations which are characterised by being supplied directly at low voltage
from the public mains are considered to be residential, commercial or light
industrial.
This equipment conforms to the requirements of EC directives:
73/23/EEC - Low Voltage Directive
89/336/EEC - EMC Directive.
(vi) Luxel F-9000 Recorder

Preliminaries
About this Document

The purpose of this Guide is to provide suitably qualified service personnel with sufficient
information to maintain a Luxel F-9000 recorder. The type and content of information provided is for
each chapter is summarised below. Service engineers working on a Luxel F-9000 will need to attend
an approved training course.
• Chapter 1 - System Overview. Describes the main features of the Luxel F-9000 imagesetter, shows its
configuration and construction, and how it connects to peripheral equipment.
• Chapter 2 - Safety Requirements. Explains the Fujifilm recommended safety guidelines for completing
an installation on-site, describes the interlock strategy and the antistatic precautions. This chapter must
be read before operating, installing or working on the equipment.
• Chapter 3 - Recorder Physical Description. Provides a brief physical description of the main assemblies
(PSU, PCBs, etc) on the recorder, giving general information on test points, fuses, connector ports and
switches with their default settings.
• Chapter 4 - Film Handling Replacements and Setups. Describes how to access, remove and re-install
the main replaceable parts used for media handling, and adjust the film setups.
• Chapter 5 - Expose System Replacements and Setups. Describes how to access, remove and re-install
the main replaceable parts used for the Optics module, and adjust the expose setups.
• Chapter 6 -Scan System Replacements and Setups. Describes how to access, remove and re-install the
main replaceable parts used for scanning.
• Chapter 7 - Electronic System Replacements and Setups. Describes how to access, remove and
re-install the main replaceable parts used for the electrical and electronics subsystems.
• Chapter 8 - Routine Maintenance. Describes the main cleaning procedures for a six monthly and twelve
monthly service visit. It includes information on how to access the main recorder assemblies, clean the
spinner mirror, traverse rail, etc and defeat the interlocks.
• Chapter 9 - Recorder Functional Description. Gives an overall system description, a more detailed
functional description of each PCB, and a summary of how each of the media sub-systems (film handling,
expose and scanning) operate.
• Chapter 10 - Recorder Diagnostics. Shows how to access the embedded diagnostics, describes the
diagnostic menu system and the useful commands for checking the system configuration.
• Appendix A - Cable Descriptions. Lists all the main cables and their connector pin descriptions.
Engineer’s Reference Guide 6700898004 (vii)

Preliminaries
Associated Documents
Luxel F-9000 Imagesetter Pre-Installation Manual . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67008960
Luxel F-9000 Recorder Installation Manual . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67008960
Luxel F-9000 Recorder Operator’s Manual . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67008950
Luxel F-9000 Recorder Safety Manual . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67009150
Luxel F-9000 Recorder Illustrated Parts Catalogue . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67008990
Celebrant RIP Installation Manual . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67000330
Celebrant RIP User’s Guide (V4.2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68000026
Luxel F–9000 with Celebrant RIP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68000059
Trademarks and Copyright

Fuji and Fujifilm are trademarks of Fuji Photo Film Co., Ltd that may be registered in certain
jurisdictions.
Luxel, Celebrant and HQ RIP is a trademark of FUJIFILM Electronic Imaging Ltd that may be
registered in certain jurisdictions.
Adobe, Accurate, PageMaker, Illustrator, PostScript, Photoshop and Type Manager are
trademarks of Adobe Systems Inc. that may be registered in certain jurisdictions.
Apple, AppleShare, AppleTalk, , System 7, Power Macintosh and Macintosh are trademarks of
Apple Computer Inc. that may be registered in certain jurisdictions.
Windows and Windows NT is a trademark of Microsoft Corporation that may be registered in
certain jurisdictions.
All other company names, products or brand names are trademarks of their respective holders.
(viii) Luxel F-9000 Recorder

Preliminaries
Contents
Chapter 1 System Overview

1.1 Introducing F-9000 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
1.1.1 Introducing the F-9000 Configuration . . . . . . . . . . . . . . . . . . . . 1-2
1.1.2 Recorder . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3
1.1.3 Media Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-4
Chapter 2 Safety Requirements

2.1 Health and Safety at Work . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
2.1.1 Warnings and Cautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
2.2 Clothing and Jewellery . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2
2.3 Equipment and Tools . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2
2.4 Site Safety . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2

2.4.1 Safety Signs, Labels and Indicators . . . . . . . . . . . . . . . . . . . . . . 2-2
2.4.2 Safety Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-7
2.4.3 Unattended Equipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-8
2.4.4 Dust Prevention . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-8
2.4.5 Electrical Safety . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-8
2.4.6 Mechanical Safety . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-8
2.4.7 Chemical Safety . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-9
2.4.8 Spinner Safety . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-9
2.4.8.1 Spinner Mirror Material . . . . . . . . . . . . . . . . . . . . . 2-9
2.4.8.2 Spinner Rotation Safety . . . . . . . . . . . . . . . . . . . . . 2-9
2.4.8.3 Spinner Acoustic Safety . . . . . . . . . . . . . . . . . . . . . 2-10
2.5 Safety Interlock Strategy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-10
2.6 Laser Safety . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-13

2.6.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-13
2.6.2 Safety Warnings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-13
2.6.2.1 A DLA Room . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-13
2.6.2.2 A DLA Curtain . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-14
2.6.3 General Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-14
2.6.4 Switching the Laser Shutter . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-15
2.6.5 Removing the Laser Power Cables . . . . . . . . . . . . . . . . . . . . . . . 2-15
Engineer’s Reference Guide 6700898004 (ix)

Preliminaries
Chapter 2 Continued
2.7 Antistatic Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-16
2.7.1 Field Service Antistatic Kit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-16
Chapter 3 Recorder Physical Description

3.1 Introducing the Main Assemblies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
3.2 Mechanical Assemblies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3

3.2.1 PSU Box . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3
3.2.1.1 Fuses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6
3.2.1.2 AC Mains Input . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6
3.2.1.3 PSU Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6
Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6
Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6
3.2.1.4 Cooling Fan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-7
3.2.1.5 Vacuum Pump Transformer . . . . . . . . . . . . . . . . . . 3-7
3.2.1.6 Relays . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-8
3.2.1.7 Mains Earth Stud . . . . . . . . . . . . . . . . . . . . . . . . . . 3-8
3.2.2 RFI Box . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-9
3.2.2.1 System Board (SSB) . . . . . . . . . . . . . . . . . . . . . . . . 3-10
3.2.2.2 SCSI Disk Drive (1 and 2) . . . . . . . . . . . . . . . . . . . 3-10
3.2.2.3 AODD Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-11
3.2.2.4 Signal Cabling and Interconnections . . . . . . . . . . . 3-11
3.2.2.5 Cooling Fan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-12
3.2.3 Man Machine Interface (MMI) . . . . . . . . . . . . . . . . . . . . . . . . . . 3-12
3.2.4 Optics Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-14
3.2.4.1 Laser Diode(s) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-16
3.2.4.2 AOD Module(s) . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-16
3.2.4.3 Position Detector (POD) . . . . . . . . . . . . . . . . . . . . 3-17
3.2.5 Film Handling Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-17
3.2.5.1 Input Cassette (Upper and Lower) . . . . . . . . . . . . . 3-17
Film Widths . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-18
Cassette IDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-18
Cassette Bay Locking . . . . . . . . . . . . . . . . . . . . . . . 3-18
Mandrel Release . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-18
3.2.5.2 Input Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-18
3.2.5.3 Horizontal Output Tray . . . . . . . . . . . . . . . . . . . . . 3-18
3.2.5.4 Vertical Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-18
3.2.5.5 Fume Flap Assembly . . . . . . . . . . . . . . . . . . . . . . . 3-19
3.2.5.6 Film Handling Rollers . . . . . . . . . . . . . . . . . . . . . . 3-19
(x) Luxel F-9000 Recorder

Preliminaries
Chapter 3 Continued
3.2.5.7 Vacuum Pump and Solenoids . . . . . . . . . . . . . . . . . 3-20
3.2.5.8 Drum . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-21
3.2.5.9 Punch and Guillotine . . . . . . . . . . . . . . . . . . . . . . . 3-21
Punch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-21
Guillotine (Cutter) . . . . . . . . . . . . . . . . . . . . . . . . . 3-24
3.2.6 Traverse Carriage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-24
3.3 Electronic Assemblies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-25

3.3.1 Acousto-Optic Deflector Driver (AODD) Module . . . . . . . . . . . 3-25
3.3.2 System Board (SSB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-27
3.3.2.1 SSB Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-27
3.3.2.2 Fuses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-29
3.3.2.3 ICs (Main Devices) . . . . . . . . . . . . . . . . . . . . . . . . 3-29
3.3.2.4 LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-29
3.3.2.5 Links . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-29
3.3.2.6 Test Points . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-30
3.3.2.7 Relays . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-30
3.3.2.8 Dongles . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-30
3.3.3 Film Handling Motor Board (1) - FHMB (1) . . . . . . . . . . . . . . . 3-31
3.3.3.1 Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-32
3.3.3.2 Fuses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-33
3.3.3.3 ICs (Main Devices) . . . . . . . . . . . . . . . . . . . . . . . . 3-34
3.3.3.4 LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-34
3.3.3.5 Links . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-34
3.3.3.6 Test Points . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-34
3.3.4 Film Handling Motor Board (2) - FHMB (2) . . . . . . . . . . . . . . . 3-36
3.3.4.1 Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-36
3.3.4.2 Fuses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-38
3.3.4.3 ICs (Main Devices) . . . . . . . . . . . . . . . . . . . . . . . . 3-38
3.3.4.4 LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-38
3.3.4.5 Links . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-38
3.3.4.6 Test Points . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-38
3.3.5 Traverse Board (STB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-39
3.3.5.1 STB Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-39
3.3.5.2 Test Points . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-40
3.3.6 Optics Motor Board (SOMB) . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-41
3.3.6.1 SOMB Connectors . . . . . . . . . . . . . . . . . . . . . . . . . 3-42
3.3.6.2 Fuses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-42
3.3.6.3 LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-42
3.3.6.4 Links . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-42
Engineer’s Reference Guide 6700898004 (xi)

Preliminaries
Chapter 3 Continued
3.3.6.5 Main Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-43
3.3.6.6 Presets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-43
3.3.6.7 SOMB Test Points . . . . . . . . . . . . . . . . . . . . . . . . . 3-43
3.3.7 Upgrade Laser Modulator Board (ULMB) . . . . . . . . . . . . . . . . . 3-44
3.3.7.1 ULMB Connectors . . . . . . . . . . . . . . . . . . . . . . . . . 3-45
3.3.7.2 Fuses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-45
3.3.7.3 LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-45
3.3.7.4 Links . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-45
3.3.7.5 Presets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-45
3.3.7.6 Test Points . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-45
3.3.8 Man Machine Interface (MMI) Board . . . . . . . . . . . . . . . . . . . . 3-46
3.3.8.1 MMI Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . 3-46
3.3.8.2 Fuses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-46
3.3.8.3 Test Points . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-46
3.3.9 Position Detector (POD) Board . . . . . . . . . . . . . . . . . . . . . . . . . 3-47
3.3.10 Cassette ID Sensor Board (Input) . . . . . . . . . . . . . . . . . . . . . . . . 3-47
3.3.11 Sensor Distribution Board (Output) . . . . . . . . . . . . . . . . . . . . . . 3-49
3.4 Film Handling Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-50

3.4.1 Sensors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-50
3.4.1.1 Sensor Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-50
Fast Photo Power Detector Sensor (FPD) . . . . . . . 3-50
Opto-Reflective Sensors . . . . . . . . . . . . . . . . . . . . . 3-51
Opto-Slotted Sensors . . . . . . . . . . . . . . . . . . . . . . . 3-52
Micro-switch Sensor . . . . . . . . . . . . . . . . . . . . . . . 3-53
3.4.1.2 Sensor Locations and Connections . . . . . . . . . . . . 3-53
Media Input Sensors . . . . . . . . . . . . . . . . . . . . . . . . 3-53
Media Exposing Sensors . . . . . . . . . . . . . . . . . . . . 3-56
Media Output Sensors . . . . . . . . . . . . . . . . . . . . . . 3-57
3.4.2 Motors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-58
3.4.2.1 DC Motors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-58
3.4.2.2 Stepper Motors . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-59
3.4.2.3 Motor Locations and Connections . . . . . . . . . . . . . 3-60
3.4.3 Solenoids and Fans . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-61
Solenoids . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-62
Fans . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-62
3.5 System Interlocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-64
3.6 Vacuum System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-65

3.6.1 Vacuum Distribution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-65
(xii) Luxel F-9000 Recorder

Preliminaries
Chapter 3 Continued
3.7 System Cabling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-66
3.7.1 AC and DC Distribution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-66
3.7.1.1 AC Distribution . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-66
3.7.1.2 DC Distribution . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-67
Chapter 4 Film Handling Replacements and Setups

4.1 Removing Film Handling Assemblies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1
4.1.1 How to Remove Opto-Reflective Sensor PCB . . . . . . . . . . . . . . 4-1
4.1.2 How to Remove Opto-Slotted Sensors . . . . . . . . . . . . . . . . . . . . 4-2
4.1.3 How to Remove Clip-on Sensors . . . . . . . . . . . . . . . . . . . . . . . . 4-3
4.1.4 How to Remove Input Assembly Panels . . . . . . . . . . . . . . . . . . . 4-4
4.1.5 How to Remove FHMB (1) Bracket . . . . . . . . . . . . . . . . . . . . . . 4-6
4.2 Replacing the Sensors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-7

4.2.1 S2 to S4 and S6 to S8 - Cassette ID . . . . . . . . . . . . . . . . . . . . . . 4-7
4.2.2 S47 and S48 - Cassette (Upper and Lower) Locked . . . . . . . . . . 4-7
4.2.3 S9 and S10 - Film at (Upper and Lower) Cassette . . . . . . . . . . . 4-8
4.2.4 S60 - Cassette Door Closed . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-8
4.2.5 S17 and S18 - Buffer Guide (Closed and Opened) . . . . . . . . . . . 4-8
4.2.6 S11 and S12 - Film at (Upper and Lower) Buffer Guide . . . . . . 4-9
4.2.7 S40 - Film at Drum Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-10
4.2.8 Fast-Photo Power Detector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-10
4.2.9 S16 and S58 - Punch (Up and Down) . . . . . . . . . . . . . . . . . . . . . 4-10
4.2.10 S19 and S20 - Cutter at (Right and Left) . . . . . . . . . . . . . . . . . . 4-11
4.2.11 S69 - Film in Punch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-11
4.2.12 S30 - Chad Tray In . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-12
4.2.13 S49 - Film in Horizontal Tray 1 . . . . . . . . . . . . . . . . . . . . . . . . . 4-13
4.2.16 S56 and S57 - Horizontal Nip (Open and Closed) . . . . . . . . . . . 4-13
4.2.17 S66/S53/S54/S22 - Film in Vertical Output (1 to 4) . . . . . . . . . . 4-13
4.3 Replacing the Motors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-15

4.3.1 M01 and M02 - Cassette (Upper and Lower) and Clutch . . . . . . 4-15
4.3.1.1 Cassette Clutch (Upper and Lower) . . . . . . . . . . . . 4-17
4.3.2 M04 - Drum Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-17
4.3.3 M03 - Buffer Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-18
4.3.4 M18 - Horizontal Nip Roller . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-19
4.3.5 M10 - Horizontal Film Output . . . . . . . . . . . . . . . . . . . . . . . . . . 4-21
Engineer’s Reference Guide 6700898004 (xiii)

Preliminaries
Chapter 4 Continued
4.3.6 M06 - Punch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-21
4.3.7 M08 - Guillotine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-21
4.3.8 M09 - Vertical Film Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-22
4.4 Replacing Cassette Assemblies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-23

4.4.1 Cassette ID Label . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-23
4.4.2 Nip Roller Wheel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-23
4.4.3 Nip Roller Spring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-23
4.4.4 Drive Dog Moulding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-24
4.4.5 Mandrel Drive Gear . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-24
4.4.6 Bearing Retainer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-25
4.4.7 Location Ring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-25
4.4.8 Rewind Spur Gear . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-25
4.4.9 Mandrel Latch Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-26
4.4.10 Spring Plate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-27
4.5 Replacing the Punch and Guillotine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-27

4.5.1 Punch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-28
4.5.2 Guillotine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-29
4.5.3 Replacing the Guillotine Only . . . . . . . . . . . . . . . . . . . . . . . . . . 4-29
4.6 Replacing the Fume Flap . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-31
Chapter 5 Optics Module Replacements and Setups

5.1 Replacing Module Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1
5.1.1 Sensors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-2
5.1.1.1 Sensor S6 (Slow Power Detector) . . . . . . . . . . . . . 5-3
5.1.2 Motors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-4
5.1.2.1 Motor SM1 (Neutral Density Filter) . . . . . . . . . . . 5-5
5.1.2.2 Motor SM2 (Focus) . . . . . . . . . . . . . . . . . . . . . . . . 5-6
5.1.2.3 Motor SM3 (Aperture) . . . . . . . . . . . . . . . . . . . . . . 5-7
5.1.2.4 Motor SM4 (Slow Power Detector) . . . . . . . . . . . . 5-8
5.1.3 Laser Diode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-9
5.1.4 Position Detector Board (POD) . . . . . . . . . . . . . . . . . . . . . . . . . 5-10
5.1.5 AOD Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-11
5.2 Setting Up the Optics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-13

5.2.1 Introducing the Test Macros . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-13
5.2.2 Selecting Options from a Main Entry Screen . . . . . . . . . . . . . . . 5-14
5.2.2.1 Accessing Main Entry . . . . . . . . . . . . . . . . . . . . . . 5-14
5.2.2.2 Navigating Main Entry . . . . . . . . . . . . . . . . . . . . . . 5-14
(xiv) Luxel F-9000 Recorder

Preliminaries
Chapter 5 Continued
5.2.2.3 Main Entry Screen . . . . . . . . . . . . . . . . . . . . . . . . . 5-15
5.2.2.4 Final Values Screen . . . . . . . . . . . . . . . . . . . . . . . . 5-15
5.2.2.5 Machine Setup Screen . . . . . . . . . . . . . . . . . . . . . . 5-16
5.2.2.6 Extra Options Screen . . . . . . . . . . . . . . . . . . . . . . . 5-17
5.2.2.7 Selecting Options from Main Entry . . . . . . . . . . . . 5-17
Test Macro . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-17
Set Defaults . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-17
Scan Start Position . . . . . . . . . . . . . . . . . . . . . . . . . 5-18
Strip Width . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-18
Start Value . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-18
Step Value . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-18
Number of Steps . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-18
Resolution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-19
Pattern Type . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-19
Lines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-19
Beam (1/2/3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-19
Traverse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-19
Use ND Threshold . . . . . . . . . . . . . . . . . . . . . . . . . 5-19
Start Scan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-19
Media Eject . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-19
Extra Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-19
Final Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-20
Machine Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-20
Run Beam-co(incidence) . . . . . . . . . . . . . . . . . . . . 5-20
Exit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-20
5.3 Optics Setup Procedures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-21

5.3.1 Setting Wedge Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-21
5.3.2 Check Focus Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-22
5.3.3 Setting Beam Balance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-23
5.3.4 Setting Coincidence Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-24
5.3.5 Setting Absolute Phase Values . . . . . . . . . . . . . . . . . . . . . . . . . . 5-25
5.3.6 Setting Deflection Amplitude Values . . . . . . . . . . . . . . . . . . . . . 5-26
5.3.7 Setting Deflection Amplitude All Values . . . . . . . . . . . . . . . . . . 5-28
5.3.8 Optics Setups: Supplementary Notes . . . . . . . . . . . . . . . . . . . . . 5-29
5.3.9 Coincidence 1 and 3 Tests - Static Coincidence . . . . . . . . . . . . . 5-30
5.3.10 Setting the AOD Amplitudes . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-32
Engineer’s Reference Guide 6700898004 (xv)

Preliminaries
Chapter 5 Continued
5.4 Film Registration Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-36
5.5 Fast and Slow Scan Registration Adjustment . . . . . . . . . . . . . . . . . . . . . . . 5-41

5.5.1 Procedure (A) Adjustment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-41
5.5.2 Procedure (B) Adjustment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-44
Chapter 6 Scan System Replacements and Setups

6.1 Traverse Replacements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-1
6.1.1 Traverse Carriage Removal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-3
6.1.2 Baffle Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-4
6.1.3 Baffle Fans . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-6
6.1.4 STB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-6
6.1.5 Traverse Motor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-6
6.1.6 Drive Rail Wiper . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-7
6.1.7 Umbilical Cable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-8
6.1.8 Spinner . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-8
6.1.9 Ball Cage Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-11
6.1.10 Readhead . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-12
6.1.11 Aligning the Carriage Rail and Ball Cage . . . . . . . . . . . . . . . . . 6-14
Chapter 7 Electrical Replacements and Set-ups

7.1 Removing Electrical Assemblies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-1
7.2 MMI Display Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-3
7.3 PSU Box Assemblies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-5

7.3.1 PSU Box . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-5
7.3.2 PSU Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-6
7.3.3 AC Mains On/Off Switch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-8
7.3.4 PSU Box Fan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-8
7.3.5 Relays (Interlock and Vacuum Pump) . . . . . . . . . . . . . . . . . . . . 7-8
7.4 Vacuum Assemblies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-10

7.4.1 Vacuum Pump Transformer . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-10
7.4.2 AC Mains Filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-10
7.4.3 Vacuum Pump Fuse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-10
7.4.4 Mounting Plate Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-11
7.4.5 Vacuum Pump . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-11
7.4.6 Solenoid Valves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-11
(xvi) Luxel F-9000 Recorder

Preliminaries
Chapter 7 Continued
7.5 RFI Box Assemblies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-12
7.5.1 Accessing the Box . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-12
7.5.2 Hard Disk Drives . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-12
7.5.3 AODD Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-13
7.5.4 System Board (SSB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-13
7.5.5 Interlock Fuse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-14
7.6 Fan Assemblies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-15

7.6.1 Pressure Fans . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-15
7.6.2 Exhaust Fan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-16
7.6.3 Baffle Fans . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-16
7.6.4 RFI Box Cooling Fan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-16
7.7 PCB Assemblies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-16

7.7.1 Film Handling Motor Board (FHMB 1 and 2) . . . . . . . . . . . . . . 7-16
7.7.2 Optics Motor Board (SOMB) . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-17
7.7.3 Upgrade Laser Modulator Board (ULMB) . . . . . . . . . . . . . . . . . 7-17
7.7.4 Traverse Board (STB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-17
7.7.5 Position Detector Board (POD) . . . . . . . . . . . . . . . . . . . . . . . . . 7-17
7.7.6 Cassette ID Sensor Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-18
7.7.7 Vertical Distribution Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-18
Chapter 8 Routine Maintenance

8.1 Tools and Procedures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-1
8.1.1 Field Service Tools . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-1
8.1.2 Overriding the Interlocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-2
8.1.3 Decoupling the Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-2
8.1.4 Removing the Vertical Output Assembly . . . . . . . . . . . . . . . . . . 8-3
8.1.5 Accessing Recorder Assemblies . . . . . . . . . . . . . . . . . . . . . . . . . 8-4
8.1.5.1 Lefthand Pod Door (Service) . . . . . . . . . . . . . . . . . 8-5
8.1.5.2 Righthand Pod Door . . . . . . . . . . . . . . . . . . . . . . . . 8-5
8.1.5.3 Cassette Door . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-5
8.1.5.4 Front Cover . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-6
8.1.5.5 Removing the Horizontal Tray . . . . . . . . . . . . . . . . 8-6
8.1.5.6 Righthand Top Cover and Optics Lid . . . . . . . . . . 8-7
8.1.5.7 Lefthand Top Cover and RFI Box Lid . . . . . . . . . . 8-7
8.1.5.8 Accessing the AODD Module . . . . . . . . . . . . . . . . 8-7
8.1.5.9 Accessing the Drum and Traverse Carriage . . . . . . 8-7
Engineer’s Reference Guide 6700898004 (xvii)

Preliminaries
Chapter 8 Continued
8.2 Maintenance Schedules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-9
8.2.1 Six Monthly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-9
8.2.2 Twelve Monthly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-9
8.3 Maintenance Procedures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-10

8.3.1 Cleaning the Spinner Mirror . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-10
8.3.2 Cleaning the Linear Scale, Drive Rail and Readhead . . . . . . . . . 8-11
8.3.2.1 Linear Scale and Drive Rail . . . . . . . . . . . . . . . . . . 8-11
8.3.2.2 Readhead . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-12
8.3.3 Cleaning the Cassette Input Rollers . . . . . . . . . . . . . . . . . . . . . . 8-12
8.3.4 Cleaning the Pressure Fan Filters . . . . . . . . . . . . . . . . . . . . . . . . 8-12
8.3.5 Cleaning the Focussing Lens (L6) . . . . . . . . . . . . . . . . . . . . . . . 8-12
8.3.6 Cleaning the MMI Touchpanel . . . . . . . . . . . . . . . . . . . . . . . . . . 8-13
8.3.7 Cleaning the Drum . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-13
8.3.8 Cleaning the Drive Rail Wiper . . . . . . . . . . . . . . . . . . . . . . . . . . 8-14
8.3.9 Cleaning the Film Fume Flap . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-14
8.3.10 Cleaning the Recorder . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-14
8.3.11 Checking for Vibration Transfer . . . . . . . . . . . . . . . . . . . . . . . . . 8-14
8.3.12 Checking the Recorder Level . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-15
8.3.13 Check the Image Horizontal and Vertical Offsets . . . . . . . . . . . . 8-16
8.3.13.1 Set the Vertical Offset . . . . . . . . . . . . . . . . . . . . . . . 8-16
8.3.13.2 Set Horizontal Offset . . . . . . . . . . . . . . . . . . . . . . . 8-16
8.3.13.3 Set New Position Values in NVRAM . . . . . . . . . . 8-17
Chapter 9 Recorder Functional Description

9.1 System Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-2
9.1.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-2
9.1.2 RIP Communications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-3
9.1.3 Image Data Reception and Transfer . . . . . . . . . . . . . . . . . . . . . . 9-5
9.1.4 Control Console (MMI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-5
9.1.5 Media Input Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-5
9.1.6 Media Exposure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-5
9.1.7 Traverse and Spinner Control . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-6
9.1.8 Multi-Laser and Optics Control . . . . . . . . . . . . . . . . . . . . . . . . . 9-6
9.1.9 AODD Control and Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-7
9.1.9.1 AODD Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-7
9.1.10 Media Handling Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-7
9.1.11 Media Punching and Cutting . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-8
9.1.12 Media Output Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-8
(xviii) Luxel F-9000 Recorder

Preliminaries
Chapter 9 Continued
9.1.13 Media Processing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-8
9.1.14 Software Organisation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-9
9.1.14.1 Master and Slave Flash Code . . . . . . . . . . . . . . . . . 9-9
9.1.14.2 Configuration Utilities . . . . . . . . . . . . . . . . . . . . . . 9-9
9.1.14.3 NVRAM Utilities . . . . . . . . . . . . . . . . . . . . . . . . . . 9-9
9.1.15 Luxel Main Diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-10
9.1.16 Safety Interlocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-10
9.1.17 System Initialisation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-11
9.1.18 CAN Network Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-11
9.1.18.1 Servicing CAN Nodes . . . . . . . . . . . . . . . . . . . . . . 9-13
9.2 System Board (SSB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-14

9.2.1 SSB System Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-14
9.2.1.1 System Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-14
9.2.1.2 MPU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-16
9.2.1.3 SSB Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-16
9.2.1.4 FCAN Controller . . . . . . . . . . . . . . . . . . . . . . . . . . 9-16
9.2.1.5 Flash and SRAM Memory . . . . . . . . . . . . . . . . . . . 9-16
9.2.1.6 Media Processor Interface . . . . . . . . . . . . . . . . . . . 9-17
9.2.1.7 MMI Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-17
9.2.1.8 SSB Temperature Monitoring . . . . . . . . . . . . . . . . 9-17
9.2.1.9 RS232 Serial Interface . . . . . . . . . . . . . . . . . . . . . . 9-17
9.2.1.10 PSU Sequencing . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-17
9.2.1.11 PCI Bus Interface . . . . . . . . . . . . . . . . . . . . . . . . . . 9-18
9.2.1.12 Pixel Clock Generation . . . . . . . . . . . . . . . . . . . . . 9-18
9.2.1.13 CPU and Memory Busses . . . . . . . . . . . . . . . . . . . 9-18
9.2.1.14 Voltages and Drives . . . . . . . . . . . . . . . . . . . . . . . . 9-18
9.2.1.15 SSB Diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-18
9.2.1.16 Real-Time Clock . . . . . . . . . . . . . . . . . . . . . . . . . . 9-18
9.2.1.17 NVRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-18
9.2.1.18 Interlock Interface . . . . . . . . . . . . . . . . . . . . . . . . . 9-19
9.2.2 SSB Data Path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-19
9.2.2.1 Data Path Operation . . . . . . . . . . . . . . . . . . . . . . . . 9-19
9.2.2.2 External PCI SCSI . . . . . . . . . . . . . . . . . . . . . . . . . 9-20
9.2.2.3 Data Compression/Decompression . . . . . . . . . . . . 9-22
9.2.2.4 Buffer Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-22
9.2.2.5 Internal SCSI Bus and Drives . . . . . . . . . . . . . . . . 9-22
9.2.2.6 Output Formatter . . . . . . . . . . . . . . . . . . . . . . . . . . 9-22
9.2.2.7 Serialiser . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-23
9.2.3 AODD Interface (on SSB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-23
Engineer’s Reference Guide 6700898004 (xix)

Preliminaries
Chapter 9 Continued
9.3 Film Handling Motor Boards (FHMB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-25
9.3.1 FHMB Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-25
9.3.1.1 MPU Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-27
9.3.1.2 Diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-27
9.3.1.3 Sensor Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-28
9.3.1.4 CAN Bus In/Out . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-29
9.3.1.5 Voltages, Filters and Interlocks . . . . . . . . . . . . . . . 9-29
9.3.1.6 Fast-Photo Power Detector (FPD) . . . . . . . . . . . . . 9-29
9.3.1.7 On-Board Fusing . . . . . . . . . . . . . . . . . . . . . . . . . . 9-29
9.3.1.8 Output Controls and Driving . . . . . . . . . . . . . . . . . 9-30
9.4 Traverse Board (STB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-31

9.4.1 STB Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-31
9.4.1.1 MPU Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-31
9.4.1.2 Precision Motion Controller . . . . . . . . . . . . . . . . . . 9-33
9.4.1.3 Spinner Controller . . . . . . . . . . . . . . . . . . . . . . . . . 9-34
9.4.1.4 Spinner Braking . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-35
9.4.1.5 Reference Clock Generation . . . . . . . . . . . . . . . . . 9-36
9.4.1.6 STB Diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-36
9.4.1.7 STB Voltages and Drives . . . . . . . . . . . . . . . . . . . . 9-36
9.4.1.8 Temperature Monitor . . . . . . . . . . . . . . . . . . . . . . . 9-36
9.5 Optics Motor Board Board (SOMB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-37

9.5.1 SOMB Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-37
9.5.1.1 CAN Control Interface . . . . . . . . . . . . . . . . . . . . . . 9-39
9.5.1.2 ULMB Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-39
9.5.1.3 Diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-39
9.5.1.4 MPU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-39
9.5.1.5 Flash Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-39
9.5.1.6 SOMB Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-39
9.5.1.7 Voltages and Drives . . . . . . . . . . . . . . . . . . . . . . . . 9-39
9.5.1.8 LD Image Data/Control I/F . . . . . . . . . . . . . . . . . . 9-39
9.5.1.9 Sensor Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-39
9.5.1.10 Motor Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-40
9.5.1.11 Laser Driver Control . . . . . . . . . . . . . . . . . . . . . . . 9-40
9.6 Upgrade Laser Modulator Board (ULMB) . . . . . . . . . . . . . . . . . . . . . . . . . 9-41

9.6.1 ULMB Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-41
9.6.1.1 Octal ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-42
9.6.1.2 ULMB Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-42
(xx) Luxel F-9000 Recorder

Preliminaries
Chapter 9 Continued
9.6.1.3 LD Image Data/Control I/F . . . . . . . . . . . . . . . . . . 9-42
9.6.1.4 ULMB Voltages and Drives . . . . . . . . . . . . . . . . . . 9-42
9.7 Acousto-Optic Deflector Driver (AODD) Module . . . . . . . . . . . . . . . . . . . 9-43

9.7.1 AODD Module Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-43
9.7.1.1 AODD Module Voltages . . . . . . . . . . . . . . . . . . . . 9-44
9.7.1.2 AODD Diagnostics and Servicing . . . . . . . . . . . . . 9-44
9.8 Miscellaneous Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-44

9.8.1 MMI Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-44
9.8.2 Film Handling Distribution Boards . . . . . . . . . . . . . . . . . . . . . . . 9-45
9.9 Interlock System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-46
9.10 Vacuum System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-48
9.11 Film Handling System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-50

9.11.1 Luxel Media . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-50
9.11.2 Film Climatisation and Input Buffer Guide . . . . . . . . . . . . . . . . 9-50
9.11.3 Film Handling Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-52
9.11.3.1 Film Path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-52
9.11.3.2 Film Load . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-53
9.11.3.3 Film Reload and Eject . . . . . . . . . . . . . . . . . . . . . . 9-55
9.11.3.4 Film Rewind . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-58
9.11.3.5 Film End-of-Roll . . . . . . . . . . . . . . . . . . . . . . . . . . 9-59
9.12 Media Expose System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-61

9.12.1 Image Data Path and Modules . . . . . . . . . . . . . . . . . . . . . . . . . . 9-61
9.12.2 Optics Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-62
9.12.2.1 Laser PCBs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-63
9.12.2.2 Laser Diode (LD) Modules . . . . . . . . . . . . . . . . . . 9-64
9.12.2.3 AOD Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-64
9.12.2.4 Beam Combiner (BC) . . . . . . . . . . . . . . . . . . . . . . . 9-65
9.12.2.5 Neutral Density (ND) Wedge (Illumination) . . . . . 9-65
9.12.2.6 Optics Lens . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-65
9.12.2.7 Aperture (Spot Size) . . . . . . . . . . . . . . . . . . . . . . . . 9-66
9.12.2.8 Position Detector (POD) . . . . . . . . . . . . . . . . . . . . 9-67
9.12.3 Periscope Assemblies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-67
9.12.3.1 Top Mirror (M1) Assembly . . . . . . . . . . . . . . . . . . 9-67
9.12.3.2 Slow Power Detector (SPD) . . . . . . . . . . . . . . . . . . 9-67
9.12.3.3 Bottom Mirror (M2) Assembly . . . . . . . . . . . . . . . 9-68
9.12.3.4 Optics Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . 9-68
Engineer’s Reference Guide 6700898004 (xxi)

Preliminaries
Chapter 9 Continued
9.12.4 Circularizing Correction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-68
9.12.5 Spinner Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-70
9.12.6 Laser Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-72
9.13 Media Scan System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-73

9.13.1 Scanning Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-73
9.13.1.1 Fans and Baffles . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-74
9.13.1.2 STB Imaging Control . . . . . . . . . . . . . . . . . . . . . . . 9-75
9.13.1.3 Scan Interlock Protection . . . . . . . . . . . . . . . . . . . . 9-75
9.13.1.4 Umbilical Interface . . . . . . . . . . . . . . . . . . . . . . . . . 9-75
9.13.2 Spinner Control Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-75
9.13.2.1 Spinner Encoder . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-75
9.13.2.2 Spinner Controller . . . . . . . . . . . . . . . . . . . . . . . . . 9-76
9.13.2.3 Spinner Diagnostics . . . . . . . . . . . . . . . . . . . . . . . . 9-76
9.13.2.4 Spinner Condition Sensing and Braking . . . . . . . . 9-76
Current Limit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-76
Braking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-76
Stalled Rotor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-76
Hall Effect Sensor Failure . . . . . . . . . . . . . . . . . . . 9-77
Overspeed/Underspeed Detection . . . . . . . . . . . . . 9-77
Over-temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 9-77
9.13.3 Traverse Control Description . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-77
9.13.3.1 Linear Encoder . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-78
Linear Scale . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-78
Readhead . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-78
9.13.3.2 Traverse Servo System . . . . . . . . . . . . . . . . . . . . . . 9-80
9.13.3.3 Traverse Amplifier . . . . . . . . . . . . . . . . . . . . . . . . . 9-80
9.13.3.4 Traverse Motor Assemblies . . . . . . . . . . . . . . . . . . 9-80
9.13.3.5 Traverse Sensors . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-80
Carriage Position Encoder . . . . . . . . . . . . . . . . . . . 9-80
Home Actuator . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-81
Index Actuator (Reference Mark) . . . . . . . . . . . . . 9-81
9.13.3.6 Overspeed and Braking . . . . . . . . . . . . . . . . . . . . . 9-82
9.13.3.7 Optical/Traverse Synchronisation . . . . . . . . . . . . . 9-82
9.13.3.8 Traverse Diagnostics . . . . . . . . . . . . . . . . . . . . . . . 9-83
9.13.4 Traverse Initialisation Sequence . . . . . . . . . . . . . . . . . . . . . . . . . 9-83
(xxii) Luxel F-9000 Recorder

Preliminaries
Chapter 10 Recorder Diagnostics

10.1 Introducing Luxel F-9000 Diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-1
10.1.1 Features of F-9000 Diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . 10-1
10.1.2 Downloading New Firmware . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-1
10.1.3 Booting up the Recorder . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-3
10.2 Describing Main Diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-4

10.2.1 Boot-up Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-5
10.2.2 MMI Self-Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-5
10.2.2.1 System Self-Tests . . . . . . . . . . . . . . . . . . . . . . . . . . 10-5
10.2.2.2 Media Self-Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-6
10.2.3 Description of System and Media Self-Tests . . . . . . . . . . . . . . . 10-6
10.2.3.1 ROM Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-7
10.2.3.2 RAM Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-7
10.2.3.3 Interrupt Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-7
10.2.3.4 Registry Check . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-7
10.2.3.5 PSU Voltage Supply Check . . . . . . . . . . . . . . . . . . 10-7
10.2.3.6 NVRAM Integrity Test . . . . . . . . . . . . . . . . . . . . . . 10-7
10.2.3.7 Stepper Motor Tests . . . . . . . . . . . . . . . . . . . . . . . . 10-7
10.2.3.8 DC Motor Assembly Tests . . . . . . . . . . . . . . . . . . . 10-8
10.2.3.9 Spinner Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-8
10.2.3.10 Optics Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-8
10.2.3.11 Output Data Path Checks . . . . . . . . . . . . . . . . . . . . 10-8
10.2.3.12 Processor Comms Checks . . . . . . . . . . . . . . . . . . . 10-9
10.2.3.13 Media Self-Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-9
10.2.4 MMI Test Image Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-9
10.2.5 Spinner Mirror Contamination Auto-Checks . . . . . . . . . . . . . . . 10-9
10.2.5.1 Setup Current NVRAM Contamination Level . . . . 10-10
10.2.5.2 Setting the Auto-Check Time Period . . . . . . . . . . . 10-10
10.2.5.3 Setup Auto Power Adjustment . . . . . . . . . . . . . . . . 10-10
10.2.6 Error Logging and Post-Failure Analysis . . . . . . . . . . . . . . . . . . 10-11
10.2.7 Running Test Images (Commissioning Pages) . . . . . . . . . . . . . . 10-11
10.2.8 MMI Error Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-11
10.2.9 Optics Errors (105-199) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-12
10.2.9.1 Traverse Errors (205 -299) . . . . . . . . . . . . . . . . . . . 10-13
10.2.9.2 Spinner Errors (305-399) . . . . . . . . . . . . . . . . . . . . 10-13
10.2.9.3 Environment Errors (505-599) . . . . . . . . . . . . . . . . 10-14
10.2.9.4 Input Data Path (605-699) . . . . . . . . . . . . . . . . . . . 10-15
10.2.9.5 Output Data Path (705-799) . . . . . . . . . . . . . . . . . . 10-15
10.2.9.6 Media Transport (805-899) . . . . . . . . . . . . . . . . . . 10-16
10.2.9.7 Media Processor (905-999) . . . . . . . . . . . . . . . . . . 10-18
Engineer’s Reference Guide 6700898004 (xxiii)

Preliminaries
Chapter 10 Continued
10.2.9.8 System Tests (1001-1028) . . . . . . . . . . . . . . . . . . . 10-18
10.3 Running Main Diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-23

10.3.1 Setting up a Terminal Window . . . . . . . . . . . . . . . . . . . . . . . . . . 10-23
10.3.2 Accessing Diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-23
10.3.2.1 Main Menus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-23
10.3.2.2 Diagnostics Menu . . . . . . . . . . . . . . . . . . . . . . . . . . 10-24
10.3.3 Entering Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-24
10.3.4 Global Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-25
10.3.5 Verbose . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-26
10.3.6 Soak Test Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-27
10.3.6.1 Using the Debug Utility . . . . . . . . . . . . . . . . . . . . . 10-28
ddbg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-28
edbg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-28
ddeb . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-28
10.3.6.2 Using Script Commands . . . . . . . . . . . . . . . . . . . . . 10-29
recordscript . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-29
showscript . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-30
runscript . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-30
deletescript . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-30
listscripts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-30
zeroscripts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-30
10.3.6.3 Using the Log Files . . . . . . . . . . . . . . . . . . . . . . . . 10-30
main/log . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-30
10.3.7 Using Main Diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-31
10.3.7.1 Log Utils Menus . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-31
diagnostics/log utils/ . . . . . . . . . . . . . . . . . . . . . . . . 10-31
diagnostics/log utils/configuration/ . . . . . . . . . . . . 10-33
diagnostics/log utils/nvram/ . . . . . . . . . . . . . . . . . . 10-35
10.3.7.2 Test Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-37
diagnostics/test/basic/ . . . . . . . . . . . . . . . . . . . . . . . 10-37
diagnostics/test/registry/ . . . . . . . . . . . . . . . . . . . . . 10-38
diagnostics/test/lasers/ . . . . . . . . . . . . . . . . . . . . . . 10-38
diagnostics/test/optics_motors/ . . . . . . . . . . . . . . . 10-39
diagnostics/test/DCmotors . . . . . . . . . . . . . . . . . . . 10-39
diagnostics/test/traverse/ . . . . . . . . . . . . . . . . . . . . 10-39
diagnostics/test/spinner/ . . . . . . . . . . . . . . . . . . . . . 10-39
diagnostics/test/optics/ . . . . . . . . . . . . . . . . . . . . . . 10-40
diagnostics/test/processor/ . . . . . . . . . . . . . . . . . . . 10-40
diagnostics/test/data_path/ . . . . . . . . . . . . . . . . . . . 10-40
(xxiv) Luxel F-9000 Recorder

Preliminaries
Chapter 10 Continued
10.3.7.3 Service Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-41
diagnostics/service/memory/ . . . . . . . . . . . . . . . . . 10-41
diagnostics/service/evt/ . . . . . . . . . . . . . . . . . . . . . 10-42
diagnostics/service/remote/ . . . . . . . . . . . . . . . . . . 10-42
diagnostics/service/optics . . . . . . . . . . . . . . . . . . . . 10-43
diagnostics/service/optics/aod/ . . . . . . . . . . . . . . . . 10-43
diagnostics/service/optics/lasers/ . . . . . . . . . . . . . . 10-46
diagnostics/service/optics/motors/ . . . . . . . . . . . . . 10-47
diagnostics/service/optics/optics_mmi/ . . . . . . . . . 10-49
optics_mmi . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-49
nvram_setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-49
diagnostics/service/motors/ . . . . . . . . . . . . . . . . . . 10-49
diagnostics/service/sensors/ . . . . . . . . . . . . . . . . . . 10-51
diagnostics/service/time/ . . . . . . . . . . . . . . . . . . . . 10-53
diagnostics/service/traverse/ . . . . . . . . . . . . . . . . . . 10-53
diagnostics/service/spinner/ . . . . . . . . . . . . . . . . . . 10-54
diagnostics/service/actuators/ . . . . . . . . . . . . . . . . . 10-54
diagnostics/service/disk/ . . . . . . . . . . . . . . . . . . . . . 10-54
diagnostics/service/disk/dfs/ . . . . . . . . . . . . . . . . . . 10-55
diagnostics/service/testpatns . . . . . . . . . . . . . . . . . 10-57
diagnostics/service/job_mgr/ . . . . . . . . . . . . . . . . . 10-59
diagnostics/service/image_mgr/ . . . . . . . . . . . . . . . 10-61
diagnostics/service/medproc/ . . . . . . . . . . . . . . . . . 10-62
diagnostics/service/medtran/ . . . . . . . . . . . . . . . . . 10-62
diagnostics/service/dbases/ . . . . . . . . . . . . . . . . . . . 10-63
10.4 Checking Configuration and NVRAM Data . . . . . . . . . . . . . . . . . . . . . . . . 10-65

10.4.1 Introducing Configuration Data Files . . . . . . . . . . . . . . . . . . . . . 10-65
10.4.2 Board Config Files . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-66
10.4.3 System Config Files . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-67
10.4.4 System Registry Files . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-68
10.4.5 HDD Data Files . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-68
10.4.6 NVRAM Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-69
10.4.7 Updating the System Registry . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-69
10.4.7.1 Using Display_Registry . . . . . . . . . . . . . . . . . . . . . 10-70
10.4.7.2 Using Update_Registry . . . . . . . . . . . . . . . . . . . . . 10-70
10.5 Running MMI Diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-71
Engineer’s Reference Guide 6700898004 (xxv)

Preliminaries
Appendix
Appendix A Cable Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-1
Index
Index . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Index-1
Figures
1.1 Typical F9000 equipment configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
1.2 Luxel F-9000 recorder . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-4
2.1 Mains rating label and laser danger labels - exterior . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3
2.2 Miscellaneous warning labels on the recorder - interior . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4
2.3 Pinch point warning labels in the input cassette . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-5
2.4 Vacuum pump hot surface warning label . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-5
2.5 Drum end cap and shutter laser warnings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-6
2.6 Laser warning labels - interior . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-7
2.7 Location of interlocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-11
2.8 Fitting the interlock override key . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-12
2.9 Typical laser warning signs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-14
2.10 Operating the laser shutter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-15
2.11 Antistatic handling station . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-17
3.1 Location of main mechanical assemblies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1

3.2 Location of main electronic assemblies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3
3.3 PSU Box (external layout) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4
3.4 PSU Box (internal layout) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5
3.5 PSU Box interconnections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6
3.6 Mains inlet to pump wiring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-8
3.7 RFI Box (internal layout) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-9
3.8 RFI Box layout (SSB signal cables) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-11
3.9 RFI box Interconnections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-12
3.10 MMI console assemblies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-13
3.11 Optics module components (3-laser version) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-15
3.12 Optics module interconnections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-16
3.13 Input cassette - internal view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-17
(xxvi) Luxel F-9000 Recorder

Preliminaries
3.14 Location of rollers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-20

3.15 Punch/guillotine assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-22
3.16 Punch size protocols . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-23
3.17 AODD I/O exterior connections (4-channel version) . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-25
3.18 System Board (SSB) layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-27
3.19 Film Handling Motor Board (FHMB1) layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-31
3.20 Film Handling Motor Board (FHMB2) layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-36
3.21 Traverse Board (STB) layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-39
3.22 Optics Motor board (SOMB) layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-41
3.23 Upgrade laser modulation (ULMB) board layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-44
3.24 MMI board layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-46
3.25 Cassette ID sensor connectors (SW1-3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-47
3.26 Cassette ID Sensor board layout (upper and lower) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-48
3.27 Vertical Distribution board layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-49
3.28 Photo-sensor board layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-51
3.29 Opto-reflective sensor board layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-52
3.30 Slotted-opto photo-interrupter sensor connectors (side view) . . . . . . . . . . . . . . . . . . . . . 3-52
3.31 Location of sensors (media input) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-56
3.32 Location of sensors (media exposing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-57
3.33 Location of sensors (Horizontal tray) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-57
3.34 Location of sensors (Vertical output) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-58
3.35 Location of motors (input, exposing and output) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-61
3.36 Location of fans . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-63
3.37 Vacuum pump, solenoid valves and pressure sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-66
3.38 System cable interconnections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-68
3.39 DC and Ground distribution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-69
4.1 Removing a button snap rivet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2

4.2 Removing a snap rivet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2
4.3 Removing an opto-slotted sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3
4.4 Removing a clip-on sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3
4.5 Input assembly panels - front view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-5
4.6 Detaching the FHMB (1) bracket . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-6
4.7 Removing the film at cassette sensors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-8
4.8 Removing the buffer guide sensors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-9
4.9 Removing the punch sensors and motor bracket . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-11
4.10 Removing the chad tray in sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-12
4.11 Removing the cassette motors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-15
4.12 Removing the cassette sensor/motor assemblies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-16
4.13 Removing the drum input motor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-17
4.14 Removing the input buffer motor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-19
4.15 Removing the horizontal nip and output motors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-20
4.16 Removing the vertical output motor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-22
4.17 Fitting the cassette ID label . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-23
4.18 Cassette base and lid . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-24
Engineer’s Reference Guide 6700898004 (xxvii)

Preliminaries
4.19 Mandrel assemblies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-25

4.20 Removing the mandrel latch assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-26
4.21 Punch and guillotine assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-27
4.22 Removing the punch-to-drum bolts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-28
4.23 Removing the guillotine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-30
4.24 Removing the fume flap . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-32
5.1 Location of Optics module sensors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-2

5.2 Opening the slow speed power detector enclosure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-3
5.3 Location of detector assembly securing screws . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-4
5.4 Location of Optics module motors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-5
5.5 Location of SM1 motor to bracket securing screws . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-6
5.6 Location of SM2 motor to bracket securing screws . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-7
5.7 Location of SM3 drive-belt pulley bracket securing screw . . . . . . . . . . . . . . . . . . . . . . . . 5-8
5.8 Positioning a laser diode module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-10
5.9 Positioning the POD module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-11
5.10 Positioning an AOD module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-12
5.11 Beam adjustments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-14
5.12 Main Entry screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-15
5.13 Final Values screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-16
5.14 Machine Setup screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-16
5.15 Extra Options screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-17
5.16 Explanation of test strip set-up terms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-18
5.17 Relationship between film characteristic and test strip density . . . . . . . . . . . . . . . . . . . . 5-22
5.18 Selecting best focus test strip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-23
5.19 Setting beam balance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-24
5.20 Absolute phase error on beam dots 1, 2 and 3 (3-laser version) . . . . . . . . . . . . . . . . . . . 5-25
5.21 Selecting correct absolute phase test strip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-26
5.22 Examples of absolute phase errors (3 beam system) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-26
5.23 Coincidence test outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-30
5.24 Coincidence 1 beam offset output (1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-31
5.25 Beam Coincidence 1 offset output (2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-32
5.26 Deflection amplitude AOD 0/2 and 1/3 outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-34
5.27 Finding the Odd/Even AOD amplitude values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-35
5.28 Two film outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-37
5.29 Two typical fringe patterns: Errors A and B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-37
5.30 Fringe type A expanded . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-38
5.31 Periscope Screw Adjustment chart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-39
5.32 M2 mirror settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-40
5.33 Machine Setup screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-41
5.34 Cutting and folding the auto ladder output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-42
5.35 Aligning exposed lines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-43
6.1 Traverse carriage assemblies - general view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-2

6.2 End of rail and extenders . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-3
6.3 Removing the baffle/pcb mounting screw . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-5
(xxviii) Luxel F-9000 Recorder

Preliminaries
6.4 Accessing the drive rail wiper . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-7

6.5 Re-fitting the spinner (stage A) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-9
6.6 Re-fitting the spinner (stage B) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-10
6.7 Locating the spring stopper . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-11
6.8 Replacing the ball cage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-12
6.9 Re-fitting the readhead . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-13
6.10 Aligning ball cage and carriage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-14
7.1 Location of main electrical assemblies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-2

7.2 Location of MMI masking pod screws . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-3
7.3 Location of MMI display module securing screws . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-4
7.4 PSU box - exterior . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-5
7.5 PSU module wire loom - connections and module voltages . . . . . . . . . . . . . . . . . . . . . . . 7-6
7.6 PSU box - interior layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-7
7.7 PSU Box - connections to connector block, relays and on/off switch . . . . . . . . . . . . . . . . 7-9
7.8 RFI box - internal layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-12
7.9 RFI box connector panel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-14
7.10 Location of fans . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-15
8.1 Overriding the interlocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-2

8.2 Jacking castors and anchor feet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-3
8.3 Accessing panels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-4
8.4 Unlocking the cassette door/left pod door . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-6
8.5 Removing/replacing the drum end caps . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-8
8.6 Spinner mirror wiping motion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-11
8.7 Cleaning L6 lens . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-13
8.8 Setting the image offsets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-16
9.1 Luxel system: image data and film paths . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-2

9.2 Luxel F-9000 system: top-level view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-4
9.3 CAN buss - system view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-12
9.4 SSB Control Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-15
9.5 SSB data path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-20
9.6 External SCSI - block view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-21
9.7 AODD interface functions - block view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-24
9.8 Film handling sensor inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-25
9.9 Film handling motor/solenoid/fan outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-26
9.10 FHMB - block view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-28
9.11 STB block view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-32
9.12 Traverse position control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-33
9.13 Spinner speed control circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-35
9.14 SOMB - block view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-38
9.15 ULMB - block view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-41
9.16 AODD module drivers - block view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-43
9.17 Interlock control interconnections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-46
9.18 Vacuum distribution (schematic) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-48
Engineer’s Reference Guide 6700898004 (xxix)

Preliminaries
9.19 Vacuum distribution - schematic view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-49

9.20 Input buffer guide operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-51
9.21 Media handling path (cut-out view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-52
9.22 Film handling path - Preloaded . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-53
9.23 Film handling path - loaded . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-54
9.24 Film handling path - film in acclimatisation buffer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-55
9.25 Film handling path - film in Horizontal buffer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-56
9.26 Film handling path - film is ejected . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-57
9.27 Film handling path - film detected at Rewind . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-59
9.28 Media expose system - overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-61
9.29 Optics module layout - schematic view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-63
9.30 Circularizing beams and correction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-69
9.31 Circularizing beams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-70
9.32 Spinner assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-71
9.33 F-9000 single-laser configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-72
9.34 F-9000 dual-laser configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-72
9.35 F-9000 triple-laser configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-73
9.36 Traverse positioning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-77
9.37 Readhead operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-79
9.38 Location of actuators and linear scale . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-81
9.39 Home and Index signal relationship . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-81
9.40 Traverse and optical differences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-83
10.1 System Bootup sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-3

10.2 Main Diagnostics - menu map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-4
10.3 Log Utils menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-31
10.4 Display statistics screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-32
10.5 Configuration menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-33
10.6 NVRAM menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-35
10.7 Test menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-37
10.8 Test outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-37
10.9 Update_registry screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-38
10.10 Service menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-41
10.11 Optics menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-43
10.12 Optics/aod menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-43
10.13 Optics/motors menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-48
10.14 Optics_mmi screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-49
10.15 Read_con screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-52
10.16 Read_con submenus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-52
10.17 Disk/dfs menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-56
10.18 Edit image parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-58
10.19 qstat screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-60
10.20 stat screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-60
10.21 misc screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-63
10.22 dumpc screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-64
(xxx) Luxel F-9000 Recorder

Preliminaries
10.23 dumpm screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-64

10.24 Configuration and Registry files - structured view . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-66
10.25 Recorder Self-Tests screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-71
10.26 Media Diagnostics in Progress screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-72
10.27 Recorder error module locations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-72
Tables
3.1 PSU DC output voltages, tolerances and where used . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-7
3.2 Film punch assemblies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-22
3.3 Film handling sensor descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-54
3.4 DC motor description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-59
3.5 DC motor and sensor control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-59
3.6 Stepper motor description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-59
3.7 Solenoid and fan outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-62
5.1 Auto Coincidence set of strips . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-25

5.2 Auto Amp beam 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-27
5.3 Auto Amp beam 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-28
9.1 Traverse scan rates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-78
10.1 Global commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-26

10.2 Debug task numbers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-29
10.3 Beam_co tolerance values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-44
10.4 Stepper motor names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-50
A.1 Pin Out for PL1: Cable Assy: PL2/PL1 (DISK_DATA1/2) 99700018 . . . . . . . . . . . . . . . A-1
A.2 Pin Out for PL4: Cable Assy: flying lead to RFI box cooling fan . . . . . . . . . . . . . . . . . . A-1
A.3 Pin Out for PL7: Cable Assy: (AODD_PWR) 99700020 . . . . . . . . . . . . . . . . . . . . . . . . . A-2
A.4 Pin Out for PL11/10: Cable Assy: (SSB_PWR2) 99700023 . . . . . . . . . . . . . . . . . . . . . . A-2
A.5 Pin Out for PL6/PL8: Cable Assy: (DISK_PWR) 99700017 . . . . . . . . . . . . . . . . . . . . . . A-2
A.6 Pin Out for SSB_PWR3: Cable Assy: (SSB_PWR3) 99700025 . . . . . . . . . . . . . . . . . . . A-3
A.7 Pin Out for SSB_PWR4: Cable Assy: (SSB_PWR4) 99700026 . . . . . . . . . . . . . . . . . . . A-3
A.8 Pin Out for PL13: Cable Assy: (SSB_PWR1) 99700022 . . . . . . . . . . . . . . . . . . . . . . . . . A-3
A.9 Pin Out for PL17 and PL18: Cable Assy: (SOMB) 99700024 . . . . . . . . . . . . . . . . . . . . . A-4
A.10 Pin Out for SK1: Cable Assy: (AODD_IF) 99700019 . . . . . . . . . . . . . . . . . . . . . . . . . . A-4
A.11 Pin Out for SK4: Cable Assy: (IMAGE_SOMB) 99700014 . . . . . . . . . . . . . . . . . . . . . A-5
A.12 Pin Out for SK5: Cable Assy: (INT_PSU) 99700027 . . . . . . . . . . . . . . . . . . . . . . . . . . A-6
A.13 Pin Out for SK7: Cable Assy: (CAN_SIG) 99700013 . . . . . . . . . . . . . . . . . . . . . . . . . . A-6
A.14 Pin Out for SK8: Cable Assy: (MMI) 99700033 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-7
A.15 Pin Out for PL1: Cable Assy: Cable Assy: (PFAN1) 99700092 . . . . . . . . . . . . . . . . . . . A-7
A.16 Pin Out for PL1: Cable Assy: (V6/V5 FANS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-8
A.17 Pin Out for PL3: Cable Assy: (flying lead to Vac plate) . . . . . . . . . . . . . . . . . . . . . . . . . A-8
A.18 Pin Out for PL4: Cable Assy: (FPD) 99700053 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-8
Engineer’s Reference Guide 6700898004 (xxxi)

Preliminaries
A.19 Pin Out for PL6: Cable Assy: (DC Power PWR1) 99700012 . . . . . . . . . . . . . . . . . . . . A-8
A.20 Pin Out for PL9:Cable Assy: (Punch) 99700069 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-9
A.21 Pin Out for PL10: Cable Assy: (LIDLK2) 99700083 . . . . . . . . . . . . . . . . . . . . . . . . . . . A-9
A.22 Pin Out for PL18: Cable Assy: (CASSA) 99700066 . . . . . . . . . . . . . . . . . . . . . . . . . . . A-9
A.23 Pin Out for PL19: Cable Assy: (CASSB) 99700067 . . . . . . . . . . . . . . . . . . . . . . . . . . . A-10
A.24 Pin Out for PL20: Cable Assy: (DC_Pun) 99700084 . . . . . . . . . . . . . . . . . . . . . . . . . . . A-10
A.25 Pin Out for PL21: Cable Assy: (S69) 99700090 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-11
A.26 Pin Out for PL23: Cable Assy: (S60) 99700068 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-11
A.27 Pin Out for PL22: Cable Assy: (S_DC2) 99700085 . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-11
A.28 Pin Out for PL25: Cable Assy: (S30) 99700021 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-11
A.29 Pin Out for PL29: Cable Assy: (MOT1) 99700047 . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-12
A.32 Pin Out for PL31: Cable Assy: (PWR1) 99700012 . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-13
A.33 Pin Out for SK1: Cable Assy: CAN_SIG) 99700013 . . . . . . . . . . . . . . . . . . . . . . . . . . . A-13
A.34 Pin Out for SK2: Cable Assy: (Umbilical cable) 99700050 . . . . . . . . . . . . . . . . . . . . . . A-13
A.35 Pin Out for PL8, PL10, Pl15: Cable Assy: Cable Assy: (VAC) 99700087 . . . . . . . . . . . A-14
A.36 Pin Out for PL1: Cable Assy: (SOL3) 99700028 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-14
A.37 Pin Out for PL20/PL9: Cable Assy: (GUILL) 99700086 . . . . . . . . . . . . . . . . . . . . . . . . A-15
A.38 Pin Out for Horizontal Tray connector to sensors: Cable Assy (TRAY2) 99700094 . . . A-15
A.39 Pin Out for PL18: Cable Assy: (VERT) 99700070 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-15
A.40 Pin Out for PL16, PL19, PL27 to tray: Cable Assy: (TRAY1) 99700093 . . . . . . . . . . . A-16
A.41 Pin Out for PL21: Cable Assy (S11) 97000059 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-17
A.42 Pin Out for PL31: Cable Assy: (PWR2) 99700081 . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-17
A.43 Pin Out for PL1: Cable Assy: (Traverse Motor) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-17
A.44 Pin Out for PL4: Cable Assy: (Spinner Encoder) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-17
A.45 Pin Out for PL5 Cable Assy: (Spinner Motor) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-18
A.46 Pin Out for PL2 Cable Assy: (Readhead) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-18
A.47 Pin Out for PL6, PL7: Cable Assy: (BFAN) 99700089 . . . . . . . . . . . . . . . . . . . . . . . . . A-19
A.48 Pin Out for PL13: Cable Assy: (CAB_UMBIL from STB) . . . . . . . . . . . . . . . . . . . . . . A-19
A.49 Pin Out for PL1: Cable Assy: (SOMB1 to POD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-19
A.50 Pin Out for PL2: Cable Assy: (SOMB2 to Slow Power Detector) . . . . . . . . . . . . . . . . . A-20
A.51 Pin Out for PL3: Cable Assy: (SOMB3 to ND Wedge Home Sensors) . . . . . . . . . . . . . A-20
A.52 Pin Out for PL4: Cable Assy: (Focus/Aperture) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-20
A.53 Pin Out for PL5: Cable Assy: (SOMB5 ND Filter/Focus Motor) . . . . . . . . . . . . . . . . . A-21
A.54 Pin Out for PL9: Cable Assy: (LD2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-21
A.55 Pin Out for PL6: Cable Assy: (SOMB6 to Slow Speed Motor) . . . . . . . . . . . . . . . . . . . A-22
A.56 Pin Out for PL11: Cable Assy: (SOMB_PWR) 99700015 . . . . . . . . . . . . . . . . . . . . . . . A-22
A.57 Pin Out for SK1: Cable Assy: (S_ULMB) 99700016 . . . . . . . . . . . . . . . . . . . . . . . . . . . A-22
A.59 Pin Out for SK4: Cable Assy: (MMI) 99700033 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-24
A.60 Pin Out for PL4: Cable Assy: (SOMB_PWR) 99700015 . . . . . . . . . . . . . . . . . . . . . . . . A-25
A.61 Pin Out for SK1: Cable Assy: (ULMB) 99700016 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-25
(xxxii) Luxel F-9000 Recorder

Preliminaries
Issue Records
Chap Pages Issue Date Comments/Changes
Prelim 34 04 04/02 Third Issue
1 4 02 10/99 Minor modifications
2 18 02 10/99 Includes new interlock
3 70 03 04/02 Includes latest training comments
4 34 03 04/02 Includes latest training comments
5 46 04 04/02 New optics setup procedures
7 18 03 04/02 Parts update
8 18 04 04/02 New levelling procedure
10 72 03 04/02 Update for Main Diagnostics
App A 26 03 04/02 Revised tables for production cables
Index 8 03 04/02 Revised index
Note: The ISSUE STATE of a document or chapter is indicated by the last two digits of its document number (e.g. the first
re-issue of document 6500123000 becomes 6500123001, and the second re-issue becomes 6500123002 etc.). A
change of issue state indicates that substantial changes have been made to the document or chapter, although this
does not necessarily mean that the contents of each page have changed.
Engineer’s Reference Guide 6700898004 (xxxiii)

Preliminaries
(xxxiv) Luxel F-9000 Recorder

System Overview 1
This section describes the main features of the Luxel F-9000 Imagesetter (Recorder
and RIP),the equipment configuration and the details of the recorder.
1.1 Introducing F-9000 Features
The 8 page Luxel F-9000 Recorder belongs to the Fujifilm family of Luxel
imagesetter systems. It houses a multi-laser expose system that automatically
scans to film a set of job images downloaded from a RIP server.
Image data is sent directly across a SCSI bus from the RIP and stored on a buffer
Hard disk. While scanning, the recorder can continue to receive and store images
from the RIP. Film feed and output is automatic: once the images start to
download, the operator only needs to attend the machine to reload cassettes. After
exposure, film sheets for each job are transferred directly into an online media
processor.
The recorder uses an internal drum with film vacuum, and a high-speed spinner
and mirror to scan film. It processes data for fast optical scanning, continuously
feeds film from dual cassettes, controls the handling of cut and punched film to
the processor, and runs the system software for managing all the main modules.
Overall control of the machine is always by the operator using a touchpanel
interface displaying sets of menu screens as icons and selectable button options.
The Luxel F-9000 imagesetter includes the following features:
· A separate and upgradeable Raster Image Processor (RIP) server and optional
client workstation.
· A SCSI bus link between the server and the recorder for passing RIP data.
· A choice of RIP software applications with a Graphics User Interface (GUI).
· Multi-laser beam system with the option of 1, 2 or 3 lasers operating
simultaneously.
· Laser and 144 resolution options enabled by dongles.
· Automated film reloading and exposure to an on-line film processor (supplied
separately).
· A range of punch options that includes a custom punch.
· A dual-cassette film loading system with daylight operation using Fuji High
Gamma film.
· Four different film widths available on a single cassette: 1130, 1067, 768 and
559 mm.
Engineer’s Reference Guide 6700898000 1-1

System Overview
· Cassette IDs that allow the recorder to hold a database on the type and width of
the installed film.
· Option of up to seven cassettes, each with different film types.
· Direct user control of the recorder from a set of displayed icons and buttons on
a touchpanel Man Machine Interface (MMI) console.
· Comprehensive diagnostic self-tests and error screens for the user and engineer.
· Direct output to an online media processor that communicates with the recorder
using a common protocol.
· Option of an external alert that can warn the user when the recorder requires a
new loaded cassette or an error has occurred.
The scanned imaging area on film covers 254 to 930 mm for four different film
widths. Resolutions for exposure range from 48 to 144 dots per millimetre.
Images in portrait or landscape are exposed up to a maximum of B1 size.
1.1.1 Introducing the F-9000 Configuration

A typical F-9000 imagesetter configuration is shown in Figure 1.1.
RIP CLIENT STATION

(OPTIONAL) *
RIP SOFTWARE
ETHERNET
RIP SERVER *
IMAGE
DIAGNOSTIC DATA IMAGES FROM
DATA
DESKTOP SYSTEMS
MEDIA
PROCESSOR
RECORDER NOTE: * SEE YOUR

RIP USERS GUIDE
Figure 1.1 Typical F-9000 equipment configuration
1-2 Luxel F-9000 Recorder

System Overview
A typical site configuration would normally allow the RIP server to operate in the
local area of the recorder and accept image jobs from a number of desktop sources
that may be networked to the server. There is a Differential SCSI connection for
sending image data to the recorder, and an RS232 connection for receiving
diagnostic data for review by the service engineer.
Depending on customer preferences, it is possible to have an external alert fitted
to the recorder with an alarm (audible or flashing light) connected to a remote
location where the operator normally works. This alert sounds when the recorder
has run out of media or an error has been detected. Details of the alert connection
is supplied in the Luxel F-9000 Pre-Installation Manual.
1.1.2 Recorder
The drum assembly is mounted on a fabricated base frame, using anti-vibration
mounts. A light metal framework fixed to the base serves as an attachment for the
covers and doors, and provides mounting facilities for the electronic modules and
the two media transport assemblies, horizontal and vertical. All the main
mechanical and electronic assemblies for the recorder are described in
Section 3.1.
Two end pod doors allow access to the electronic and traverse assemblies
(left-hand side) and the media, in case of a film jam, on the right-hand side. A
lower front cover accesses the Horizontal Output tray which diverts the exposed
film from the drum to the Vertical Output assembly. Users are not allowed to open
the left-hand pod door. Another external top lid protects the optics system.
Removing any of these doors or covers operates a safety interlock relay which
controls the voltage supply to the lasers, film handling mechanisms and the
traverse. Section 2.5 explains the interlocking system.
Opening the Cassette door accesses the input assembly for installing the cassettes.
This door is locked while the system is powered up or down, and is lifted after
selecting the Change Media option on the MMI. Details of how to load and install
a cassette is in the Luxel F-9000 Recorder Operator’s Manual.
Input cassettes are installed on a light-tight Input assembly at the front of the unit.
Once the cassettes are located on the recorder, media is automatically loaded,
reloaded, ejected or rewound, depending on the job requirements.
Exposed and cut film is fed out of the of the machine through a film flap
mechanism into an on-line film processor for immediate processing.
A power on/off switch is located at the rear of the machine on the left-hand side
(viewed from the front). Power is filtered at the inlet with switching provided by a
circuit breaker.
A mains distribution power switch and fuse is located near the recorder to isolate
the system. Over its daily working period, the recorder always needs to be in the
stable environment (temperature and humidity) recommended by Fujifilm. Details
on power supply requirements, fusing and the environment is available in the
Luxel F-9000 Imagesetter Pre-Installation Manual.

System Overview
OPTICS COVER
RFI BOX COVER
RIGHT-HAND POD
MMI CONSOLE
OUTPUT TO
PROCESSOR
FRONT COVER
CASSETTE DOOR
LEFT-HAND
POD DOOR
Figure 1.2 Luxel F-9000 recorder
1.1.3 Media Processor

A media processor (not supplied with the imagesetter) is closely-coupled to the
recorder, avoiding the need for locating the recorder in a safelight area. Both
machines share the same communication (comms) protocol: as cut film sheets are
sent to the processor, the two machines pass messages to check whether the path
is clear, or indicate if a problem if, for instance, a film jam has occurred.
Communications can be easily enabled or disabled: in a disabled state, the
processor can continue to function alongside the recorder.

Safety Requirements 2
This chapter explains the Fujifilm recommended safety guidelines for completing
an upgrade on-site, describes the Luxel F-9000 interlock strategy and the
antistatic precautions. This chapter must be read before operating, installing or
working on the equipment.
2.1 Health and Safety at Work
All personnel are advised to familiarize themselves with any local or national
legislation relating to health and safety at work. Particular attention should be
given to those sections covering personal responsibility regarding safe working
practices which must be strictly observed at all times.
This chapter explains the safety conventions used in this manual and highlights
safety practices specific to the Luxel F-9000 product.
2.1.1 Warnings and Cautions

There are two safety categories:
· WARNINGS are given for conditions which may endanger life.
WARNING
The instructions given in warnings must be followed precisely.
They are given to avoid injury or death.
· CAUTIONS are given for conditions which may cause damage to equipment or
materials.
CAUTION
The instructions given in cautions must be followed to avoid
damage to equipment or materials.

Safety Requirements
2.2 Clothing and Jewellery
Do not wear clothing or jewellery which could be hazardous when in contact with
any part of the equipment, or which could reflect laser light into an eye.
2.3 Equipment and Tools
Use the approved service tools, listed in Section 8.1.1, and wear the protective
garments which are specified in this Guide.
2.4 Site Safety
Most accidents can be avoided if you follow these simple rules.

· Familiarize yourself with the location of main On/Off switch on the recorder
and all equipment On/Off switches.
· Always obey the warnings, cautions, and any other instructions included in this
guide, and in other relevant equipment manuals associated to the equipment.
· Never attempt to perform procedures that are not included in this Guide.
2.4.1 Safety Signs, Labels and Indicators

Safety labels are fitted to the equipment to warn you of potential hazards. These
labels must not be defaced or removed.
The serial number and model type appear on a mains rating label fitted to the rear
panel. This is shown in Figure 2.1.
Typical warning labels, fitted within the recorder, are shown in Figure 2.2 to
Figure 2.5.

Safety Requirements
DANGER - Laser radiation when open

and interlock defeated
AVOID EXPOSURE TO BEAM
92206
CONFORMS
TO
UL STD 1950
Product: LUXEL
Model No: F-9000
Serial No:
Volts 110/230 50/60Hz ~
Max Current: 8/4 A
Manufactured:
POWER ON/OFF
This device complies with Part 15 of the FCC rules

and is subject to the following two conditions:
1. This device may not cause any harmful
interference.
and
2. This device must accept any interference
received including interference that may
cause undesired operation.
This Class A digital apparatus meets all the
requirements of the Canadian Interference-Causing
Equipment Regulations.
Cet appareil numérique de la classe A respecte
toutes les exigences du Règlement sur le matériel
brouilleur du Canada.
This laser conforms to the applicable requirements of
21 CFR Sub chapter J.
FUJIFILM ELECTRONIC IMAGING LTD.

PETERBOROUGH
ENGLAND CLASS 1 LASER
LASER KLASSE 1
LASER DE CLASSE 1
7550 854D 01
Figure 2.1 Mains rating label and laser danger labels - exterior

Safety Requirements
LASER RADIATION WHEN OPEN

LASER RADIATION AVOID DIRECT EXPOSURE TO
AVOID DIRECT EXPOSURE BEAM
TO BEAM
635 nm/20mW
CLASS 111b LASER PRODUCT
VAC PUMP
FUSE
T 800mA, H 250V
WARNING
CAUTION: HIGH SPEED SPINNER ROTATION
FOR CONTINUED PROTECTION AGAINST KEEP CLEAR
THE RISK OF FIRE, REPLACE ONLY
WITH SAME TYPE AND RATING OF FUSE.
ATTENTION:
POUR NE PAS COMPROMETTRE LA PROTECTION Attention!
CONTRE LES RISQUES D’INCENDIE, REMPLACER high tension
PAR UN FUSIBLE DE MÊME TYPE ET DE MÊMES
CARACTÉRISTIQUES NOMINALES. Vorsicht!
Hochspannung
Précaution!
haute tension
Precaución!
alta tensión
Figure 2.2 Miscellaneous warning labels on the recorder - interior

Safety Requirements
Figure 2.3 Pinch point warning labels in the input cassette
Figure 2.4 Vacuum pump hot surface warning label

Safety Requirements

LASER SHUTTER
(OPEN)

WARNING
HIGH SPEED SPINNER ROTATION
KEEP CLEAR
Figure 2.5 Drum end cap and shutter laser warnings

Safety Requirements

OPTICS
LID
RIGHT-HAND
DOOR POD
Figure 2.6 Laser warning labels - interior
2.4.2 Safety Devices

Read all warning labels. Make sure that all safety controls, such as those listed
below, are present and working correctly:
· Circuit breakers.
· Covers.
· Guards.
· Panel indicators.

Safety Requirements
· Safety interlocks.
Unless essential for commissioning or servicing, and under prescribed conditions,
never override, negate, or bypass any of the above safety devices.
2.4.3 Unattended Equipment

Never leave equipment unattended unless in a safe condition with respect to the
following hazards:
· Electrical.
· Mechanical.
· Laser Radiation.
· Chemical.
· Spinner.
· Pneumatics.
2.4.4 Dust Prevention

To avoid dust contamination of the machine, it is important to restrict to a
minimum any operation with covers, lids or doors removed or open.
2.4.5 Electrical Safety
WARNING
Do not remove panels, unless instructed to do so by this or
other related manuals. Hazardous mains voltages are present
behind panels.
· Regularly verify that mains cables are not worn or damaged.

· Make sure that water and other liquids do not come into contact with the
equipment.
· Do not attempt to operate the equipment when flammable or volatile substances
are present in the atmosphere.
· Make sure that electrical servicing is undertaken only by authorized personnel.
2.4.6 Mechanical Safety

The following basic precautions apply to the system, and also to the equipment
with which it is applied.

Safety Requirements
WARNING
Do not attempt to lift heavy equipment by yourself.
· Always close equipment access panels to prevent internal access.

· Avoid leaving electrical cables trailing where anyone may trip over them.
· Make sure that mechanical servicing is undertaken only by authorized
personnel (i.e. trained by Fujifilm).
2.4.7 Chemical Safety

The guidelines below must be followed when storing or handling highly
flammable liquids.
· Store bulk supplies in a metal cabinet marked with a ‘flammable liquid’ label of
an approved design.
· For use in the work area, decant the liquid to a container with a maximum
capacity of 250 mL. The use of a safety dispenser is recommended.
· Do not use the liquid near to non-flameproofed electrical equipment.
· Do not use the liquid near to a naked flame. DO NOT SMOKE.
2.4.8 Spinner Safety
2.4.8.1 Spinner Mirror Material

Some versions of the spinner mirror used on Luxel F-9000 may contain Beryllium
which must not be accessed, handled or removed from its protective spinner
casing. Note that Beryllium is highly toxic.
Make sure that a replaced spinner is ALWAYS returned to the Fujifilm (UK)
factory for disposal, and NOT disposed locally.
2.4.8.2 Spinner Rotation Safety

Do not access the internal drum area and traverse carriage while the recorder is
switched on.
WARNING
The spinner rotates at very high speeds and can cause serious
injury if accidently touched.

Safety Requirements
2.4.8.3 Spinner Acoustic Safety

If the end doors are opened, and the recorder is running in a contained area, there
is a risk of high (up to 90 dB) noise levels generated by a rotating spinner. Always
wear ear protection to avoid long-term ill effects.
2.5 Safety Interlock Strategy
The two end pod doors on the recorder, the lid above the Optics module and the
lower front cover are interlocked to prevent machine motors, traverse carriage and
lasers from operating while the doors/cover are opened.
The locations of the safety interlocks are illustrated in Figure 2.7. Section 9.9
describes how the interlock system functions.
With the doors in their closed position, the interlock switches are enabled and the
two relays (A and B) are activated. Opening a door, lid or cover switches the
associated interlock and removes the 12 V supply to de-energize the two isolating
relays inline with the following supply voltages:
· +24 V and +36 V to the FHMBs (1 and 2) and the STB. (Removing the +36 V
also disables the CAN bus to both PCBs).
· +/-- 15 V to the SOMB and the ULMB.
To override an interlock a special magnetic key is fitted on the frame interlock
switch. See Figure 2.8. The pod door cannot be shut with the override key in
place.
If, during servicing, the recorder has to be run with the interlocks overridden,
extreme care must be taken to avoid contact with live electrical components.
Closing the door, lid or cover (after the override has been removed) causes the
recorder to reboot.
WARNING
All unqualified personnel must be prohibited from the area,
while the machine is in the overridden state,
The Laser Safety Officer must be informed when the machine

is in this state.
The status of the interlocks (opened or closed) is passed to the SSB which
controls the inhibit lines to the PSU for power up sequencing when the
doors/cover are replaced. Power and drive voltages do not reappear until the +5 V
supply for the logic circuits is activated.

Safety Requirements
INTERLOCK INTERLOCK
LEFT-HAND RIGHT-HAND
(LID FIXING)
DOOR TOP COVER
RIGHT-HAND
DOOR
INTERLOCK
INTERLOCK
(DOOR FIXING)
LOWER FRONT
PANEL
INTERLOCK &
BRACKET
(DOOR FIXING)
INTERLOCK
INTERLOCK INTERLOCK
(COVER FIXING)
Figure 2.7 Location of interlocks

Safety Requirements
INTERLOCK SWITCH
OVERRIDE KEY SECURING

SCREW
Figure 2.8 Fitting the interlock override key

Safety Requirements
2.6 Laser Safety
2.6.1 General
Note the following laser radiation warnings:
WARNING
Never look directly into a laser beam.When working on a
Class 3B laser source, always wear goggles capable of
attenuating the beam to a Class 2 level if there is the slightest
risk of direct reflection.
The voltages used in the laser circuits, and power supplies, are
potentially hazardous. Exercise extreme caution while
servicing the recorder with its interlock panels removed.
The protective cover of the laser must always be in place

during normal operation.
2.6.2 Safety Warnings

Laser safety warnings must at all times comply with local and national
regulations.
While the laser is being serviced, it may be necessary to operate the recorder with
certain panels removed and the safety interlocks over-ridden with the approved
key. Under these circumstances, only the service engineer shall be in the
Designated Laser Area (DLA). The DLA may be a room, a curtained area, or a
purpose-built DLA tent.
2.6.2.1 A DLA Room

All other personnel should be warned of the hazard by:
· A laser warning notice attached to the door(s) leading to the room. An example
is shown in Figure 2.9.
· A red warning light, positioned above the door(s) leading to the room,
illuminated whenever there is a laser radiation hazard.

Safety Requirements
LASER CLASS 3B OPERATIONS

WHEN WARNING LIGHT IS ON
LASER CLASS IIIb OPERATIONS NO ENTRY TO UNAUTHORISED
PERSONNEL
WHEN WARNING LIGHT IS ON
EUROPEAN
NO ENTRY TO UNAUTHORISED
PERSONNEL
U.S.A.
Figure 2.9 Typical laser warning signs
2.6.2.2 A DLA Curtain

Local legislation may permit the following alternative:
· Isolation of the recorder by means of a curtain. The curtain must be opaque to
red light (635 nm) and must extend from floor to a height of at least 2.1 m
(82.7 in).
· Warnings placed, where required, to ensure that personnel are aware of the laser
radiation hazard inside the curtained area. The signs shown in Figure 2.9 are
recommended.
2.6.3 General Precautions

Laser current and light intensities are always set at the factory from the optics
NVRAM parameters supplied with each laser diode. If a diode needs replacing,
only the recommended parameters are entered.
· Always close the laser shutter before inserting or removing any optical
component or sub-assembly with the system powered up.
· Do not power up the recorder with a laser disconnected.
· Never place a mirror in the laser beam. This action can reflect hazardous light
to others working in the general area.
· Remove the protective cover of the laser only in accordance with the
instructions given in the service manual
· Attenuating laser safety goggles must be used where there is a risk of direct
reflection from a laser beam. Where there is no such danger, and when
observing diffused reflected spots from screens and targets, it is permissible to
work without attenuating laser safety goggles. Extreme care must be taken
when working with lasers.
· The protective cover of the laser diode, shall be in place always during normal
operation.

Safety Requirements
During a service visit, engineers have two additional methods of ensuring

maximum safety against the risk of laser beam damage to themselves or local
personnel.
2.6.4 Switching the Laser Shutter

The laser path from the Optics module to the spinner is physically blocked by
manually sliding the shutter mechanism as shown in Figure 2.10.

SHUTTER
OPEN
SHUTTER
CLOSED
Figure 2.10 Operating the laser shutter
2.6.5 Removing the Laser Power Cables

If you need to leave the recorder unattended while the interlocks are defeated,
ensure that the voltage supply to the lasers are fully disabled by temporally
removing the following cables from the RFI box:
See Figure 3.19.
1. Access the interior of the RFI box, see Section 8.1.5.7.
2. Remove the SSB_SOMB cable (99700024) from the SSB (PL18) to the RFI
box connector.
3. Remove the SSB_SOMB cable (99700024) from the SSB (PL17) to the RFI
box connector.

Safety Requirements
2.7 Antistatic Precautions
CAUTION
Do not handle exposed electronics. The components may be
electrostatically damaged leading to equipment errors.
The Luxel F--9000 recorder contains electronic components which are susceptible
to static damage. Therefore when clearing jams, cleaning, or performing routine
maintenance care should be taken not to touch any exposed electronics.
Before handling a board, all antistatic precautions must be followed.
CAUTION
Do not place a board on an unearthed surface after removing
it from its protective wrapper. Do not place it on the wrapper,
the outside of which could be electrostatically charged.
When removing the board from its antistatic wrapper, take care not to touch any
of the board components or connector pins.
Preferably, use a Fujifilm field service antistatic kit or, if this is not available, a
disposable antistatic wrist-strap as detailed in this section.
2.7.1 Field Service Antistatic Kit

The following figure shows the recommended on-site service station using the
field service antistatic kit, (99987920). See Figure 2.11.
CAUTION
Use the disposable antistatic wrist-strap. Failure to do so may
result in damage to the board.

Safety Requirements
CONDUCTIVE MAT
EARTH STRAP
CLIPPED TO
EXPOSED
CHASSIS CHASSIS
ANTISTATIC
POWER FIELD SERVICE KIT
OFF (9998-7920)
MAINS
PLUG
EARTH WRIST STRAP
Figure 2.11 Antistatic handling station
A disposable wrist strap is used to connect the engineer to an earthed (ground)

point on the equipment (usually the chassis).
The equipment must be plugged into an earthed socket (but not switched on)
to ensure a path to ground.
The main antistatic recommendations are as follows:
· Use documentation referred to in this section.
· Always ensure a wrist-strap is connected to earth.
· Only personnel that are static-protected should touch boards or exposed internal
components.
· Any board to be fitted should be kept within its antistatic enclosure until
needed.
· If a board is removed, always pack it in an approved static-safe bag and seal the
opening to provide a Faraday enclosure. Never place it on a surface that is not
static-safe.

Safety Requirements

Recorder Physical 3
Description
This chapter provides a brief physical description of the main assemblies (PSU,
PCBs, etc) on the recorder, giving general information on board layouts, sensors,
motors, etc, and AC/DC distribution. A detailed description of how these assemblies
function is given in Chapter 9.
3.1 Introducing the Main Assemblies
Figure 3.1 illustrates the location of all the main mechanical assemblies on a
Luxel F-9000 Recorder:
OPTICS
VERTICAL MODULE
ASSEMBLY
RFI BOX
MMI
INPUT
CASSETTE
PSU BOX
DRUM
INPUT
ASSEMBLY
HORIZONTAL
OUTPUT TRAY
VACUUM PUMP
AND SOLENOIDS
PUNCH AND
GUILLOTINE
Figure 3.1 Location of main mechanical assemblies

Recorder Physical Description
· PSU box
· RFI box
· Man Machine Interface (MMI) console
· Optics nodule
· Input cassette (dual system)
· Input assembly
· Horizontal output (tray)
· Vacuum pump and solenoids
· Drum
· Punch and Guillotine
· Vertical output
· Fume shutter.
Figure 3.2 illustrates the location all the main electronic assemblies (PCBs).
Note: A prefix of ‘S’ on an assembly name indicates it belongs to the ‘Sumo’
product.
· Acousto-Optic Deflector Driver module (two versions)
· System board (SSB)
· Traverse board (STB)
· Optics Motor board (SOMB)
· Upgrade Laser Modulator board (ULMB)
· Film Handling Motor Boards 1 and 2 (FHMB 1 and 2)
· MMI Board
· Position Detector Board (POD)
· Cassette ID Board (Upper and Lower)
· Vertical Distribution Board
· Traverse Carriage Assembly - includes STB, linear motor, spinner, readhead
and linear scale.
The sections below briefly describe the main features of each assembly, allowing
the service engineer to recognize modules and their sub-assemblies.

POSITION DETECTOR
BOARD
OPTICS MOTOR UPGRADE LASER

BOARD MODULATOR BOARD
AODD MODULE
SYSTEM BOARD
MMI BOARD
PSU MODULE
TRAVERSE
FILM HANDLING
CARRIAGE
MOTOR BOARD (2)
TRAVERSE BOARD
CASSETTE ID BOARD
VERTICAL DISTRIBUTION (UPPER)
BOARD
CASSETTE ID BOARD
(LOWER)
VACUUM
ASSEMBLIES FILM HANDLING
MOTOR BOARD (1)
Figure 3.2 Location of main electronic assemblies
3.2 Mechanical Assemblies
3.2.1 PSU Box

See Figure 3.3, Figure 3.4 and Figure 3.5; also Section 3.7.1 which describes the
AC/DC distribution.

This box includes a removable cover (front and far side) that allows access to the
following items:
· AC mains inlet and filter - 10 A.
· 2-pole circuit breaker - 2 pole, 2 A (Mains on/off switch).
SSB--PWR3
SSB--PWR4
EARTH
S--INT--PSU
S--PWR2
FAN S--PWR1
ALERT CONNECTION (OPTIONAL)

FUSE
SWITCH
POWER IN VAC PUMP

OUTLET
Figure 3.3 PSU Box (external layout)
· Power Supply Unit (PSU) - module supplying DC outputs.

· PSU cooling fan - 24 V.
· Interlock relay (A) - 16 A (Disconnects +24 V and +36 V supply rails when the
left- or righthand doors, optics cover and lower front panel are opened).
· Load resistor - 33 ohm, 25 W (for +15 V DC rail).
· Vacuum pump relay (switches off vacuum pump when film is not being
exposed).
· Vacuum pump transformer (autoranging 350 VA).
· Vacuum pump outlet (230 VAC to vacuum pump).
· Alert relay - (switches on/off to alert the operator on the need to change media).

· Fuse - 0.8 A, 250 VAC, high rupture (for protecting the vacuum pump and
transformer).
FAN
INTERLOCK
RELAY
LOAD
RESISTOR
ON/OFF
SWITCH
ALERT
RELAY
POWER
INLET
VACUUM
PUMP
RELAY EARTH
STUD
FUSE
CONNECTOR
BLOCK
POWER
OUTLET
TRANSFORMER
PSU MODULE
Figure 3.4 PSU Box (internal layout)

SOL3 PUMP TERMINATOR BLOCK VACUUM

99700029 99701088 PUMP
OUTLET PSU BOX

FUSE (10A)
(0.8A)
‘ALERT’ PSU_SOL MAINS(2)
V11 99700054
MAINS(3)
ALERT MAINS(4)
RELAY
TRANSFORMER INTERLOCK PWR2
(350VA) RELAYS
99700081
PSU_SUPP2 PWR1
TERMINATOR BLOCK 99700031 99700012
PWR1
99700012
VACUUM
FAN (F2)
PUMP RELAY
MAINS(7) PSU_CRTL INT_PSU

ON/OFF CRTL
99700029 99700027
(10A)
MAINS(5) SSB_PWR3
99700025
INLET/ PSU_SUPP1 SSB_PWR4
FILTER VOLTS
99700030 99700026
(10A)
PSU
MAINS(1) MODULE +15V LOAD
RESISTOR
Figure 3.5 PSU Box interconnections
3.2.1.1 Fuses
· Vacuum pump - 0.8 A fuse - 6.3x32 mm - H250V
3.2.1.2 AC Mains Input

· Inlet - IEC 320 inlet rated at 10 A.
· On/Off switch - circuit breaker rated at 12 A.
3.2.1.3 PSU Module

The PSU module is a 400 to 800 W configurable modular supply with two
integral cooling fans.
Inputs
Input voltage is 85 - 264 V AC.
Outputs
See also Figure 7.5.

The PSU module supplies the following output voltages which are auto-sensed,
regulated and power factor corrected:
· +5 V (load current of approx. 15 A)
· +15 V (load current of approx. 5.7 A)
· -15 V (load current of approx. 2.5 A)
· +24 V (load current of approx. 5.0 A)
· +24 V - AODD (load current of approx. 2.5 A)
· +36 V (load current of approx. 9.5 A).
Note: These load currents are only typical.
The location of each DC rail output is identified by the manufacturer’s label on
the PSU module. The output voltage of each supply rail can be adjusted but this
should not be necessary.
DC voltage tolerances are regulated at between ±4 to 6% which approximates to
the values given in Table 3.1 below.
Table 3.1 PSU DC output voltages, tolerances and where used
Voltages Tolerances (5%) Where Used

+5 V +4.75 to +5.25 V PCB devices and sensors
+15 V +14.25 to +15.75 V SSB, SOMB, ULMB
-15 V -14.25 V to -15.75 V SSB, SOMB, ULMB
+24 V +22.8 V to +25.2 V FHMB two drum baffle fans and interlock relay coils
+24 V AODD +22.8 V to +25.2 V AODD only
+36 V +34.2 V to +37.8 V STB, FHMB
3.2.1.4 Cooling Fan

A 24 V fan cools the PSU Box.
3.2.1.5 Vacuum Pump Transformer

An autoranging transformer (TX) supplies 230 VAC to the vacuum pump. The
factory-set default for the TX input is set for a 230 VAC supply but includes
terminal block settings for a 120 or 100 VAC input supply, depending on the site.
See Figure 3.6 for a schematic view of the vacuum pump wiring.

PSU MODULE
MAINS CCT
INLET/FILTER BREAKER
L BR
MAINS 5 MAINS 7
N BL
E SEE
FIGURE 7.5
GR/YL
MAINS 1
EARTH
STUD
PUMP
TRANSFORMER OUTLET
TERMINAL
VAC PUMP RELAY BLOCK
BR FUSE BR
BR MAINS 4 BR RED MAINS 3
230V 230V
BL OR GRY
BL 120V 0V
YL
100V
0V GR/YL
MAINS 2
EARTH
ALERT ALERT OUTLET STUD
PLUG RELAY (CUSTOMER OPTION)
PSU_SOL PSU_SOL
Figure 3.6 Mains inlet to pump wiring
3.2.1.6 Relays
· Interlock relay A - 12 VDC, 16 A (isolates +24 V and +36 V supplies to the
STB and FHMB when an interlock is activated).
· Vacuum pump - 24 VDC, 25 A, DPDT (isolates supply to the vacuum pump).
3.2.1.7 Mains Earth Stud

The PSU Box has a mains earth stud at the rear well which serves as the system
earth. Ensure all earth connections are fitted after a replacement procedure.

The SSB is a local star-point ground for the +15, -15, +5 and +24 (AODD)
voltages; a ground link with the +24 V supply to SOMB, ULMB and the cooling
fans is separate.
3.2.2 RFI Box

See Figure 3.7.
The RFI Box contains:
· Cooling fan.
· Fuse (panel mounted for interlock circuit) -- 1 A.
· System board (SSB).
· SCSI Disk drives (1) and (2) - with (2) only fitted for 2 or 3-laser versions.
· Acousto-Optic Deflector Driver (AODD) module - for 2 or 3-laser versions, see
Section 3.3.1. This is fitted to a slider for convenient removal from a side panel.
· Interconnecting cables.
DISK DRIVE (CHAN 2)

DISK DRIVE (CHAN 1) SSB
(ON MOUNTING
BRACKET)
COOLING FAN
EXIT FOR
AODD CHAN
SIGNALS
INTERLOCK
FUSE
AODD MODULE
(ON SLIDING RAIL)
SSB
CONNECTORS
PSU
CONNECTORS
AODD
REMOVAL PANEL
Figure 3.7 RFI Box (internal layout)

3.2.2.1 System Board (SSB)

See Figure 3.8, Figure 3.8 and Section 3.3.2.
The SSB manages the main image data path and image buffering before laser
modulation. It interfaces screened image and control data from the RIP over
SCSI, and provides high-level system control of film handling, optics and
scanning systems across a CAN bus. In addition, it provides a control interface for
the AODD laser beam deflection circuitry and a dongle facility for the system
laser and 144 Resolution upgrades.
The board is mounted on the box tray with the following direct DC voltage
connections to external modules:
· +5 V
· +24 V
· +24 V (AODD)
· ±15 V.
The SSB is a local star-point ground for the above voltages; a ground link with the
+24 V to the SOMB, ULMB and the cooling fans is separate.
3.2.2.2 SCSI Disk Drive (1 and 2)

The SCSI disk drive buffers single image compressed data before it is
decompressed and sent to the optics system for laser modulation. Two drives are
fitted. Each disk drive has a data capacity of at least 4 Gbyte.
The disk drive(s) are supported by a shelf above the System board in the RFI box.
SCSI Standard
The disk drive(s) are Narrow (8-bit) Ultra SCSI.
Disk Drive Settings
Except for the SCSI IDs, the disk drives should be correctly configured by the
manufacturer. Details of the configuration are labelled on the drive. The working
SCSI ID can be any number from 0 to 6 (but not 7); usually the factory default
setting is sufficient.
DC Supplies
+ 12V 5% (regulated from the SSB).
Operating Temperature
5_ to 55_ C.
Terminating Drives
Recorders with two disk drives requires disk drive (2) need to be separately
terminated for erach bus. If you replace a drive which is NOT at the end of the
SCSI bus, disable the terminator on the drive. If the drive is installed at the end of
the bus, enable the termination. For instructions on how to enable or disable
terminations, refer to the literature supplied with the disk drive.

3.2.2.3 AODD Module

The AODD module generates amplitude modulated radio frequency control
signals for Acousto-Optic Deflectors (AODs) in the Optics module. AODD
signals correct for the angular displacement of a second or a third laser beam
when deflected by a rotating spinner mirror.
3.2.2.4 Signal Cabling and Interconnections

SSB signal connections to the rest of the system is directly from the SSB.
Figure 3.8 and Figure 3.9 show the cabling interconnections.
INTERLOCK
FUSE FILM
IMAGE_SOMB INT_PSU PROCESSOR
CAN_SIG
DIAGS (FHMB)
CAN_SIG
(SOMB)
PL18
MMI SOMB_PWR
SCSI
(RIP)
PL11
SSB_PWR
PL17
SOMB_PWR
PL13
SSB_PWR
Figure 3.8 RFI Box layout (SSB signal cables)

S_ULMB
SOMB SK1 SK1 ULMB
SK3 SK2 PL11 99700016 SK2 PL4
SOMB_PWR
SOMB_PWR
99700015
CAN_SIG 99700013
S_IMAGE_SOMB
FHMB(1) (IMAGE DATA) 99700014
99700015
99700024
CAN_SIG SK4
SK6 SSB_SOMB
PL17
CAN_SIG SSB_SOMB
FHMB(2) SK7 PL18
99700013 DISK_PWR 99700017
PL6
DISK_DATA1 99700018 DISK
LCD MMI MMI PL2
LCD SK8
99700051 BOARD 99700033 DISK_PWR 99700017
PL8 DISK
DISK_DATA2 99700018
DOOR INTERLOCKS PL1 UPGRADE
AODD_PWR 99700020
CONNECTOR PL7
AODD_IF 99700019 AODD
INT_PSU SK1
SK5
PSU BOX 99700027
FAN COOLING
PL4
FAN
SYSTEM BOARD
(SSB) FUSE 99700056
FILM_PROC FUSE
PL21
SERIAL_DIAGS (RIP) PL10
PL20
PL11
SCSI
SK9 PL13
PROCESSOR 99700049
SSB_PWR3 SSB_PWR1
99700025 99700022
RIP
SERVER SSB_PWR4 SSB_PWR2
99700026 99700023
MULTI-
SUPPLY
RFI BOX
+5V VOLTS
PSU BOX
Figure 3.9 RFI box Interconnections
3.2.2.5 Cooling Fan

The RFI Box cooling fan is powered by +24 V DC routed from the SSB.
3.2.3 Man Machine Interface (MMI)

See Figure 3.10 and also Section 3.3.8.
The MMI is the user console that operates as a recorder control display with an
iconic menu system. The console consists of an LCD, an analogue touchpanel,

Invertor PCB and MMI PCB. These devices are assembled as a single FRU fitted
inside a plastic console. A clear window with the display and touchpanel is
presented to the user.
TO LCD
SK1 SK2 WHITE
U1
PL1
INVERTER
PCB
WD1
(BUZZER) CAUTION
HIGH
VOLTAGE
SK4
SK3
FS1 CN1
MMI PCB
LCD AND TOUCHPANEL

TO PL1 (MMI PCB)
Figure 3.10 MMI console assemblies
The MMI includes:

· LCD display: with monochrome (emulating grey levels) for the MMI buttons
and icons. The screen is specially adapted for daylight viewing, with a facility
for the user to adjust the contrast.
· Invertor board: located next to the MMI board, powers a single fluorescent
lamp for the LCD backlight. The LCD backlight is also used as the machine
power-on indicator. CAUTION ON VOLTAGE: the invertor generates high
voltage (300 VDC).
· Touchpanel: allows the operator to select soft menus buttons. This panel may
require periodic calibration by the user.
· MMI board: includes the I/O connectors to the SSB and an audible buzzer to
alert the user. Adjustments for frequency and loudness is possible from the
panel.
A full description of how the recorder operates from the MMI console is given in
the Luxel F-9000 Recorder User’s Guide.
MMI control and drive voltages are managed from the SSB to include:
· dedicated LCD display controller

· display memory (128 K DRAM)

· contrast control (negative voltage generator) for varying the LCD backlight
· buffer for LCD data/control signals
· +5V for the Invertor board and MMI PCB devices
· touchpanel supply voltage (+5 V) to X and Y touch panel axes
· A-to-D signals for X and Y positions
· beeper ON signal.
A Main Diagnostics (mmi) submenu is available to the service engineer, and a
touchpanel cleaning procedure is given in Section 8.3.6.
3.2.4 Optics Module

See Figure 3.1 and Section 9.12.
Depending on the laser configuration, the Optics module generates one, two or
three laser beams that are modulated by image data controlled from the SOMB
and ULMB. Once fitted, the module is not removed or replaced; any failed parts
are replaced in-situ using the procedures in Section 5.1. Laser upgrades (from 1-
to 2-lasers, 2 to 3 and 1 to 3) are fitted using information supplied with the
upgrade kit, see Section 9.12.6.
The main module assemblies are:
· Laser diode: with additional diodes fitted as part of a laser upgrade kit.
· Acousto-optic deflector (AOD) module: one for a 2-laser version, two for
3-laser version. None are fitted for 1-laser version.
· Position Detector board (POD): this is fitted as part of the laser upgrade kit and
is used to align beams.
· Slow power detector: a motorized detector board that reads laser power. This
assembly (with a periscope mirror) also acts as laser shutter.
· Mirrors and lenses: the beam(s) are focussed and directed within the module
before reaching the spinner.
· Motors and sensors: these are fitted to operate the ND filter, aperture, focus and
slow power detector.
An SOMB, mounted on the module outer case, controls the stepper motors from
sensor data detecting Home and step positions, and the operation of laser LD2
which is the reference beam. For 2- and 3-laser versions, a ULMB is also
mounted to the outer case.

6 7
5 8 9
10 11
4
12 13
14 15
16
2
17
1 18
Figure 3.11 Optics module components (3-laser version)
The components shown in Figure 3.11 are identified below:

1 - Laser diode L3 (fitted on 3-laser version).
2 - AOD 3 (fitted on 3-laser version).
3 - Optics Motor Board (SOMB).
4 - Mirror M3.
5 - Lens L8.
6 - Laser Diode L2.
7 - Position Detector board (POD) (fitted on 2 or 3-laser versions).
8 - Beam Combiner.
9 - Neutral Density Filter and motor SM1
10 - Lens L9.
11 - AOD 1 (fitted on 2 or 3-laser versions).
12 - Focus lens L10, motor SM2 and lens movement assembly.
13 - Beam Converter lens L7.
14 - Lens L4, aperture motor SM3, aperture and aperture movement assembly.
15 - Collimating lens L5.
16 - Mirror M1.

17 - Slow Power Detector board, motor SM4 and lens.

18 - Upgrade Laser Modulator board (ULMB) (fitted on 2 or 3-laser version).
Figure 3.12 shows the cable layout of the Optics module for a single-, dual- and
triple-laser version.
SMB H9 1A
AOD1
SMB H10 1B (2-channel)
AODD
SMB H11 3A
AOD3
(2-channel)
SMB H12 3B
SENSORS ND FILTER
SOMB3 HOME SENSORS
APERTURE
FOCUS SLOW POWER
ND FILTER
MOTOR
SOMB5
FOCUS
MOTOR
PL4 PL3 PL5
POSITION
ULMB SK1 SK1 SOMB PL1 DETECTOR
S_ULMB SOMB1 (POD)
PL2 PL1 PL6 PL9 PL2
SOMB6 SLOW SPEED
SOMB2 MOTOR
APERTURE
LD2 MOTOR
LASER MODULE CABLES SLOW SPEED

LD1 POWER
DETECTOR
MOTOR
LD3
Figure 3.12 Optics module interconnections
3.2.4.1 Laser Diode(s)

The laser diode header board has potentiometers which must never be adjusted
by a service engineer. The header board is preset at the factory.
3.2.4.2 AOD Module(s)

One AOD module is required for each additional laser. Two laser versions have
one AOD module fitted; three laser versions have two AOD modules fitted.
The AOD module deflects the second or third laser beam in the two or three laser
version of the recorder. RF amplitude modulated signals from the AODD connect
to the X and Y deflector channels of each AOD. Amplitude modulation is

required to compensate for variations in the power of the laser beam which occurs
when the beam is deflected.
3.2.4.3 Position Detector (POD)

The main function of the POD board is to ensure that the three laser beams are
co-incidental and aligned within a margin of tolerance.
3.2.5 Film Handling Modules
3.2.5.1 Input Cassette (Upper and Lower)

See Figure 3.1. See also Figure 4.18 and Figure 4.19.
Two input cassettes can be loaded on the recorder simultaneously, allowing a
range of different film types, thicknesses and widths. Each cassette has an
IDentity number (from 1 to 7) on a barcode label which the recorder detects when
the unit is installed. Details of the current contents of the cassette is held in
memory by the recorder.
Two cassette bays on the Input assembly house an upper and lower cassette. Both
bays operate with an identical set of sensors, lever mechanisms, motors and gears.
See also the Luxel F-9000 Recorder Operator’s Manual on how the cassettes are
loaded with film and installed on the recorder.
NIP
ROLLER
LOCKING
PIN
MANDREL
RELEASE
CATCH
LID
CLASP
REWIND
WHEEL
Figure 3.13 Input cassette - internal view

Film Widths
Two mandrels lock together to form a film spool, each with drive dog moulding
that slides along the drive shaft to adjust for the following film spool widths:
1130, 1067, 761 and 559 mm.
Cassette IDs
An ID label, fixed to the cassette moulding, is read by photo-detect sensors after
the cassette is installed. Because each cassette has its own ID, the recorder is able
to retain and display details of the film type, width and current length set from the
MMI Change Media screen. See the Luxel F-9000 Recorder Operator’s Manual.
Cassette Bay Locking
A locking mechanism operates automatically as soon as the cassette is ‘dropped’
into its bay. Locking is detected by an opto-slotted sensor.
Mandrel Release
A mandrel release sub-assembly locks the film spool mandrel to the cassette base.
3.2.5.2 Input Assembly

See Figure 3.1.
A film handling Input assembly at the front of the recorder houses the input
cassettes ready for loading film into the drum. The assembly is a complete unit
that consists of two end plates for locating the cassette rollers, buffer guide, feed
guides, light shields, film handling sensors, motors and Cassette ID sensor PCBs.
This assembly does not need to be removed from the recorder.
3.2.5.3 Horizontal Output Tray

See Figure 3.1.
This assembly transports cut, punched and exposed film from the drum to the
Vertical output. The tray is located on slider rails that allows it to be removed
from the recorder for servicing, access to the punch motor and sensors, and
removal to jammed film. A rear docking mechanism provides power and signals
connection for the tray. Note that lifting the tray assembly is a two-man
operation.
The tray has a buffer area at the front that spools each film sheet directly from the
drum before it is deflected in the reverse direction to the Vertical output. A
horizontal nip roller (spur) closes to deflect the trailing edge into a tray assembly
guide. An output stepper motor drives rollers via a timing pulley system to move
the sheet through the film path. Sensors on the path detect film edges and pass
data to FHMB (2) for controlling the motors and rollers. See also Section 3.4.
3.2.5.4 Vertical Output

See Figure 3.1.
The assembly consists of an output motor that drives pinch rollers, via a timing
pulley system, and a set of sensors on the film path that detect the position of the
cut sheet. These are used to move film sheets from the tray to the processor.

Cut-outs along the film guide and a vertical output lid at the top of the assembly
provide access to jammed media. The complete assembly can be removed from
the recorder once the processor has been decoupled.
3.2.5.5 Fume Flap Assembly

See Figure 3.1.
A fume flap, consisting of a flexible film-type material, is fitted at the film exit to
prevent chemical fumes from the processor leaking back into the recorder and
causing corrosion. The flap is pushed open by the film leading edge and then
springs back to block fumes. Periodic cleaning of the flap is a service task.
A film jam access flap with a magnetic lock on the lefthand side is opened to pull
out film from the vertical assembly.
3.2.5.6 Film Handling Rollers

See Figure 3.14.
A set of motor-driven rollers transport media through a film handling path from
the cassettes towards the processor, or back into the cassette during a rewind. The
rollers operate by nipping film with a smaller spur roller and stepping a set
distance in either direction, depending on which film edges are detected by the
local sensors and the length of film sheet recorder by the RIP.
Rollers are driven directly from a stepper motor or/and a timing belt-driven pulley
that is tensioned on the horizontal output tray. Rollers have pin bearings that are
normally considered long-lasting and not liable to failure.
Note that the transport of media within the recorder is assisted by the natural
‘curl’ of film from the cassette spool to ensure that leading edges pass smoothly
through the recorder with a minimum risk of jamming. For instance, when film is
coiled inside the horizontal buffer storage, or switches from the horizontal to the
vertical output assemblies.

CASSETTE FILM SPOOL

DRUM INPUT FEED
TENSIONER
HORIZONTAL
NIP
= NIP ROLLER
VERTICAL TENSIONER HORIZONTAL
OUTPUT MOTOR OUTPUT MOTOR
= SPUR ROLLER
Figure 3.14 Location of rollers
3.2.5.7 Vacuum Pump and Solenoids

See Figure 3.1.
A vacuum pump generates the vacuum required to hold the film against the drum
wall before scanning commences. Control of vacuum outputs to the 3 drum
chambers and 23 grooves, selected for each film width, operates from three
vacuum solenoids (V1, V2 and V3). Vacuum pressure from the pump is
constantly monitored by inline sensor.

3.2.5.8 Drum
See Figure 3.1. See also Figure 4.18.
Film is conformed around the drum by the action of a vacuum system (spread
across 23 grooves) and two fan blowers on the traverse baffle that push film
against the drum before scanning. Conformance needs to be within the
specification of 0.010 mm to ensure correct registration.
The drum is cast in aluminium which overcomes the problem of rusting, but also
presents risk of damage if the interior surface is accidently knocked by the punch
or guillotine during a replacement procedure. Plastic end caps are fitted either side
of the drum to prevent the entry of light and dust.
Attachment to the base is via A-V mounts that help to prevent vibration. Isolating
the drum from any foreign sources of vibration (for instance, the vacuum pump)
and ensuring the spinner is aligned correctly to the drum, are important
registration requirements.
Exposure area for an image around the drum is set at a maximum of 1130 mm
width and 930 mm height. The width (along the drum axis) is termed the ‘slow
scan’ direction; the height is the ‘fast scan’ direction.
CAUTION
The drum casting is made from aluminium and is easily
damaged.
3.2.5.9 Punch and Guillotine

See Figure 3.1 and Figure 3.15.
The punch/guillotine assembly, located above the chad tray, are normally removed
and replaced a single assembly using screw fixing points that allow self-location
to the drum lip. It is possible, however, to remove the guillotine as a separate unit.
Punch
See Table 3.2 and Figure 3.17.
A punch assembly (with integral pins and dies) is supplied as one of the protocol
options illustrated in Figure 3.17, or as a custom unit to suit a particular need once
a template is supplied of the punch protocol. A dummy punch can also be fitted.
Attached to the assembly is a motor bracket that includes a cam for rotating the
pin actuator arm and punch shaft, and two sensors for detecting whether the pins
are IN or OUT of the die. Another sensor detects the leading edge of a film sheet
to indicate that the media has entered the punch.

CAUTION
Withdrawing the punch from the drum is normally a two man
operation, but can be performed by one engineer, if necessary.
PUNCH ASSEMBLY
PUNCH SHAFT
SENSOR (S19)
SENSOR MOUNTING
(S69)
PUNCH MOTOR (MO6)
SENSOR (S58)
ACTUATOR
ARM BRACKET
GUILLOTINE CAM SENSOR (S16)
MOTOR (MO8)
GUILLOTINE ASSEMBLY
WIRE
PULLEY
CUTTER
SENSOR (S20)
Figure 3.15 Punch/guillotine assembly
Film is punched at the end of the LOAD operation. From the diagnostics facility
(see Chapter 10) it is possible to enable and disable the punch operation.
Table 3.2 Film punch assemblies
Punch Type Punch Assembly

Stoesser (Luxel) 7553302
Bacher (Luxel) 7553303
USA Bacher (Luxel) 7553304
Kamata KPF25 7553305
Dummy 7553306
Billows Protocol Combi 7553307
Custom 7553344
Note: Additional punch specifications include DS and DS+BACHER protocols.

BILLOWS COMBI
18” (Centred on 508)

25.4 mm
12” (Centred on 355)
190.5 mm 29” (Centred on 1117)
101.4 mm 18” (Centred on 660)
A A A B B B B
PUNCH A 5/16 ” A/F X ⊘13

PUNCH B ⊘5/16 ”
STOESSER
34.0”
25.0”
17.0”
8.5”
A A A A B A A A A
PUNCH A 1/4” A/F X ⊘3/8

PUNCH B ⊘1/4”
KAMATA KFP20
519.1 mm
164.3 mm 164.3 mm 63. 5mm 63.5 mm
63.5 mm
31.7mm
A B B A A A
PUNCH A 4.76 mm A/F X ⊘12.7 mm
PUNCH B 4.76 mm A/F X ⊘6.35 mm
KAMATA KPF25
634.2 mm
227.6 mm 134.9 mm 134.9mm 136.6 mm
45.6mm
A B A A A
PUNCH A 4.76 mm A/F X ⊘12.7 mm

PUNCH B 4.76 mm A/F X ⊘6.35 mm
BACHER
748 mm
393 mm
A A A A A
PUNCH A ⊘6.25 mm A/F X 9.5 mm
Figure 3.16 Punch size protocols (1)

BILLOWS PROTOCOL
736 mm
457 mm
ORIENTATION:
BOTH WAYS
A A B B
PUNCH A ⊘7.94 mm
PUNCH B ⊘12.7 mm
Figure 3.17 Punch size protocols (2)
Guillotine (Cutter)
The guillotine is located as a separate sub-assembly fixed to the punch and
operates after the software has determined that the sheet is the correct length for
the job. A solenoid motor drives a thin wire to move a cutting blade along a metal
bar, cutting in both directions.
Micro-switch sensors at each end indicate the position of the cutter to the system
software. The guillotine assembly (with cutter and sensors) are replaced as a
single FRU.
3.2.6 Traverse Carriage

See also Section 9.13, Figure 3.2 and Figure 6.1.
The traverse carriage moves on a ball cage located on the traverse beam V-groove.
Motion is supplied by a motor and rotating shaft that runs along a drive rail (note
that the shaft is a precision mechanism that needs to be protected from dust or
damage). Positional data (to ±1 mm) on the traverse is sent directly to the STB
from a readhead on the carriage and a linear scale attached to the rail.
The carriage assembly consists of:
· baffle and two 24 VDC baffle fans
· spinner (with mirror, encoder and motor)
· readhead and scale
· motor and flywheel
· Traverse board (STB)
· umbilical cable that runs along a duct.
Service engineers are able to remove the carriage assembly from the recorder after
fitting two service extenders to the beam.

CAUTION
The main scanning assemblies (spinner, readhead, motor and
shaft, etc) are aligned very precisely and should NOT be
handled or gripped when lifting the carriage.

3.3 Electronic Assemblies
3.3.1 Acousto-Optic Deflector Driver (AODD) Module

Location: RFI box, on a tray at the base of the box. See Figure 3.18
CN111 CN110 FAN FAN
CN41
to AOD 3B in
Optics Module
CN31
to AOD 3A in
Optics Module
CN21
to AOD 1B in
Optics Module
CN1
to AOD 1A in
Optics Module
LINK
FRONT
CABLE ASSEMBLY: 24-WAY CABLE ASSY: 99700019

99700020 TO PL7 TO SK1 ON SYSTEM BOARD
ON SYSTEM BOARD
Figure 3.18 AODD I/O exterior connections (4-channel version)

The AODD module generates amplitude modulated radio frequency control

signals for Acousto-Optic Deflector(s) (AODs) in the Optics module. AODD
signal(s) correct for the angular displacement of a second or a third laser beam
when deflected by a rotating mirror on the spinner assembly.
An AODD module is only fitted for 2 and 3-laser versions: the 2-laser version
uses a 2-channel unit (ADD820), the 3-laser version uses a 4-channel unit
(ADD840) with one channel as spare. It is supplied as an OEM (other Equipment
Manufacturer) and, in case of failure, is replaced as a complete unit after
diagnostic checks have been made.
The module is located on a slider rail on the base of the RFI box, with an access
panel on the side of the RFI box (recorder front end after removal of the light
shield panel).

3.3.2 System Board (SSB)

Location: RFI box, mounted on a shelf. See Figure 3.2 and Figure 3.19.
PL10 PL4 REAR

PL15 LK5 LK4 LK3 LK1
TP10 PL5
SK4
TP16 TP8 TP6
LK2
U69
TP9 TP7
SK5 PL8 PL6
U113
PL1
U70
TP2
TP18
PL20 PL16
PL19
PL21
U76
LK7
LK6 PL2
SK6
TP14
SK7
TP12
TP3
TP15 PL3
SK8 (DONGLE)
TP5 PL12
FS1 PL7
TP4
U65 U51
D19 TP13
SK9 U66 U52 SK1
SK2
U67 U53
PL17 PL13 PL11

RL1
PL18
FRONT
Figure 3.19 System Board (SSB) layout
3.3.2.1 SSB Connectors

· PL1: 50-way male R/A header. Data to/from local SCSI disk drive 2.

· PL2: 50-way male vertical header. Data to/from local SCSI disk drive 1.
· PL3: 40-way male header. Used for dongle(s).
· PL4: 4-way SIL male vertical header. +24 V DC supply to RFI Box fan.
· PL5: Not used.4-way SIL male header. +24 V DC supply for another RFI
Box fan.
· PL6: 4-way male vertical header. +12 V and +5 V DC DC supplies to
SCSI disk drive 1.
· PL7: 6-way DIL male vertical header. +24 V and +5 V DC supplies to
the AODD module.
· PL8: 4-way male vertical header. +12 V and +5 V DC DC supplies to
SCSI disk drive 2.
· PL10: 6-way DIL male header. +15 V DC supply to on-board regulators
supplying +12 V to disk drive(s) and -15 V DC to RFI box fan.
· PL11: 12-way DIL male PCB header. -15 V, +15 V, +24 V for AODD, and
+24 V DC supplies for STB from the PSU.
· PL12: Not used. 10-way male header.
· PL13: 14-way DIL male PCB header. +5 V and +3.3 V DC supplies from
the PSU. Note that the 3.3 V DC supply is not used.
· PL15: 2-way SIL male header. Connection to interlock fuse.
· PL17: 10-way DIL male header. +5 V, +15 V, +24 V and -15 V DC
supplies to the RFI Box panel and from the RFI Box panel
connector to the SOMB.
· PL18: 10-way DIL male header. +5 V, +15 V, +24 V and - 15 V DC
supplies to the RFI Box panel and from the RFI Box panel
connector to the ULMB.
· PL20: 9-way male D-type. RIP serial diagnostics.
· PL21: 9-way male D-type. Processor serial connection to film processor.
· SK1: 37-way female D-type.
· SK2: 60-way female type. Connection to on-board PCI bus.
· SK4: 26-way female D-type. Image data to the SOMB and ULMB.
· SK5: 15-way female D-type. +24 V DC to/from interlocks. Status lines
from interlocks. +24 V and +36 V inhibit lines to the PSU.
· SK6: 15-way female D-type. CAN Bus to SOMB.
· SK7: 15-way female D-type. CAN Bus (to FHMB2).
· SK8: 26-way female D-type. +5 V and Data to/from MMI.

· SK9: 68-way female connector. SCSI bus.
3.3.2.2 Fuses
· FS1: (5V, 2A) - Anti-surge. SCSI Power Termination.
3.3.2.3 ICs (Main Devices)

· U31 NVRAM. Real-time clock.
· U36: 512k x 8 bit SRAM. SRAM temporary data store for main program.
· U39: 512k x 8 bit SRAM. SRAM temporary data store for main program.
· U51: 512k x 8 bit Flash memory.
· U51 to U53 and U65 to U67 are Flash memory which contain the System code
(Boot, Diagnostics and Application). Any change of code required is
downloadable.
· U69: Temperature Sensor. Monitors ambient temperature of System
board.
· U70: 512k x 8 bit Flash memory - plug-in. Contains program code for
SRAM U76 and U113. Any change of code requires U70 to be
exchanged.
· U76: XC4020XL - 2. Static RAM.
· U113: XC4013XL - 1. Static RAM.
3.3.2.4 LEDs
· D2: Red LED. Illuminated = System board in Reset.
· D3: Green LED. For S/W purposes.
· D4: Green LED. For S/W purposes.
3.3.2.5 Links
· LK1: Not used.
· LK2: Pins 1 and 2 connected (on-board program enabled).
· LK3: Not used.

· LK4: Not used.

· LK5: Not used.
· LK6: Not used.
· LK7: RS232 Comms. interface to film processor. Link in if film processor
has no Flow Control.
3.3.2.6 Test Points

· TP1: Digital Ground.
· TP5: Reset.
· TP8: Not used.
· TP9: Not used.
· TP11: Digital Gnd
· TP12: Digital Gnd.
· TP13: Not used.PCI_User.
· TP14: PLL_LOCKED
· TP15: Not used. L_ERROR.
· TP18: TTL pixel clock (fast clock for image data output to SOMB/ULMB.
· TP19: ECL Ground.
3.3.2.7 Relays
· RL1: ± 15 V Interlock Relay B to SOMB and ULMB (if fitted).
3.3.2.8 Dongles
Dongle PCBs are stacked on the SSB PL3 header (see Figure 3.19) to enable the
software for the Luxel laser/144 resolution upgrades. The dongle combinations
available are:
· No dongle: 1 beam at 48, 72 and 96 resolutions.
· Bronze dongle: 1 beam at 48, 72, 96 and 144 resolutions.

· Bronze and silver dongles: 2 beams at 48, 72, 96 and 144 resolutions.
· Bronze, silver and gold dongles: 3 beams at 48, 72, 96 and 144 resolutions.

3.3.3 Film Handling Motor Board (1) - FHMB (1)

Location: lower lefthand side at the front, on a bracket assembly, see Figure 3.2.
PL19
PL7 PL9 PL12 PL14 PL21 PL23 PL24 PL25 PL26
FS14
SK3 PL18
PL30
PL6
SK2
FS13
PL11
PL29
PL5
FS12
SK1
PL28
FS15
PL4 FS11
PL3 PL17
PL13
PL27
PL2
PL1
FS1 PL31
NOTE: ON EARLY RECORDERS
PL3, 4, 10 AND 15 MAY
NOT BE FITTED
FS2 PL8 PL10 FS4 FS5 FS8

PL15 PL16 FS7 PL20 PL22 FS10
FS3 FS6 FS9
Figure 3.20 Film Handling Motor Board (FHMB1) layout

3.3.3.1 Connectors
· PL1: 8-way male Molex header type STR 6410. +24 V DC to Exhaust
Fan solenoid (V6) or pressure fans (1 and 2).
· PL2: Not used. 2-way male Molex 6410 straight header.
· PL3: Not used. 4-way male AMP CT straight header.
· PL4: 3-way male AMP CT straight header. Signal from Fast Photo
detector via Cassette ID A and S_CASSA.
· PL5: Not used. 6-way male Molex straight header. Umbilical cable test
pins.
· PL6: 8-way male Molex minifit Jr. +24 V and +36 V DC supplies from
the PSU box routed via FHMB1 to the STB via umbilical
cable.
· PL9: 8-way male AMP CT straight header. Supply to and signal from
Punch up sensors (S16) and Punch down (S58).
· PL10: 3-way male AMP CT straight header. Drive to Lid Lock 2 solenoid
(V10).
· PL11: Not used. 10-way male boxed header.
· PL15: 3-way male AMP CT straight header. Drive to Lid Lock 1 solenoid
(V8).
· PL18: 26-way male header. +5 V DC supplies to and signals from film
handling sensors routed for Cassette ID A board.
· PL19: 26-way male straight header. +5 V DC supplies to and signals from
film handling sensors for Cassette ID B board.
· PL20: 3-way male AMP CT straight header. DC to Punch DC motor
(M06).
· PL21: 4-way male AMP CT straight shrouded header. Supply to and signal
from Film at Punch sensor (S69).
· PL22: 3-way male AMP CT straight header. DC to input buffer guide DC
motor (M03).
Cassette Door Closed sensor (S60).


· PL25: 4-way male AMP CT straight header. Supply to and
signal from Sensor 30 (Chad Tray).
· PL26: Not used. 4-way male AMP CT straight header. Supply to and
signal from TUC Present Right sensor (S27) - not currently fitted.
· PL27: 6-way male single in-line shrouded header top entry, type JST B
6B-EH-A. +24 V DC to and signal from Cassette B Rewind stepper
motor (M02).
· PL28: Not used. 6-way male single in-line shrouded header side entry,
type JST S 6B-EH.
6B-EH-A. +24 V DC to and signal from Cassette A Rewind stepper
motor (M01).
6B-EH-A. +24 V DC to and signal from Drum Input stepper motor
(M04).
· PL31: 8-way Molex minifit Jr. +24 V DC supply from the PSU.
· SK1: 15-way female D-type. CAN bus input.
· SK2: 45-way female R/A boxed header. Connects +36 V DC, and CAN
signals from FHMB1 to the STB.
3.3.3.2 Fuses
· FS1: 2 A for +24 V DC to Exhaust Fan via PL1.
· FS2: 2 A. Spare.
· FS3: 2 A. Spare.
· FS4: 2 A for drive to Lid Lock 2 solenoid via PL10.
· FS5: 2 A for drive to Lid Lock 1 solenoid via PL15.
· FS7: 2 A. Spare
· FS6: 2 A. Spare.
· FS8: 2 A for DC to Punch DC motor (M06) via PL20.
· FS9: 2 A. Spare.
· FS10: 2 A for DC to Input Buffer Guide DC motor (M03) via PL22.
· FS11: 2 A for +24 V DC to Cassette B stepper motor (M02) via PL27.
· FS12: 2 A. Spare.
· FS13: 2 A for +24 V DC to Cassette A stepper motor (M01) via PL29.
· FS14: 2 A for +24 V DC to Drum Input stepper motor (M04) via PL30.


· U33: Electronic Programmable Logic Device. Controls and reads sensors.
· U39: Electronic Programmable Logic Device. Solenoids and DC motors.
· U42: Electronic Programmable Logic Device. Stepper motors.
· U43: Electronic Programmable Logic Device. Controls and reads sensors.
3.3.3.4 LEDs
None.
3.3.3.5 Links
None.
3.3.3.6 Test Points

· TP1: CAN Ground.
· TP2: Pulsed drive to opto-reflective sensors.
· TP3: CAN +5 V.
· TP4: Fast photo detector operational amplifier output.
· TP5: A-D Converter Ground.
· TP6: A-D Converter +5 V.
· TP7: Vacuum sensor signal voltage.
· TP9: System Reset. Out of Reset = virtually zero volts when measured
from TP23.
· TP10: Lid Lock 1 solenoid input 1.
· TP11: Lid Lock 1 solenoid input 2.
· TP12: Lid Lock 1 DAC 1.
· TP13: +24 V Ground.
· TP15: Lid Lock 1 DAC 2.
· TP17: Pulsed drive to opto-reflective sensors.
· TP18: +5 V supply to DC motor drivers.
· TP22: Sensor Latch 2.


· TP24: +5 V Digital supply rail.
· TP30: Unprotected 5 V.
· TP31: +24 V.

3.3.4 Film Handling Motor Board (2) - FHMB (2)

Location: below the PSU box. See Figure 3.2.
PL19
PL7 PL9 PL12 PL14 PL21 PL23 PL24 PL25 PL26
FS14
SK3 PL18
PL30
PL6
SK2
FS13
PL11
PL29
PL5
FS12
SK1
PL28
FS15
PL4 FS11
PL3 PL17
PL13
PL27
PL2
PL1
FS1 PL31
FS2 PL8 FS4 FS5

PL10 PL15 PL16 FS7 FS8 PL20 PL22 FS10
FS3 FS6 FS9
Figure 3.21 Film Handling Motor Board (FHMB2) layout
3.3.4.1 Connectors
· PL1: 8-way male Molex header type STR 6410. +24 V DC to Vac Pump
relay and Flashing Lamp (not used) solenoids.

· PL2: Not used. 2-way male Molex 6410 straight header.

· PL5: Not used. 6-way male Molex straight header.
· PL8: 3-way male AMP CT straight header. Drive to Vacuum (V3)
solenoid.
Cutter at Right sensor (S19) and Cutter at Left (S20)
solenoid.
· PL13: Not used.10-way male boxed header.
· PL14: 8-way male.
solenoid.
· PL16: 3-way male AMP CT straight header. DC to Horizontal Nip
DC motor (M18).
· PL18: 26-way male header. +5 V DC supplies to and signals from film
handling sensors for the Vertical Distribution board.
· PL19: 26-way male header. +5 V DC supplies to and signals from the
Horizontal tray film handling sensors.
· PL20: 3-way male AMP CT straight header. DC to Guillotine DC
motor (M08).
· PL21: Not used. 4-way male AMP CT straight shrouded header.
· PL23: Not required. 4-way male AMP CT straight header. Supply to and
signal from TUC Present Left sensor (S26) - not currently fitted.
6B-EH-A. +24 V DC to and signal from Horizontal Film Output
stepper motor (M10).
· PL28: Not used. 6-way male single in-line shrouded header side entry,
type JST S 6B-EH.
6B-EH-A. +24 V DC to and signal from Vertical Film Output
Stepper motor (M09).

· PL30: Not used on first machines. 6-way male single in-line shrouded
header top entry, type JST B 6B-EH-A.
· PL31: 8-way Molex minifit Jr. +24 V DC supply from the PSU.
· SK1: 15-way female D-type. CAN bus input.
· SK3: 15-way female D-type. CAN bus output.
3.3.4.2 Fuses
· FS1: 2 A for +24 V DC to Pump relay and Flashing Lamp via PL1.
· FS2: 2 A for drive to Vacuum (V3) solenoid via PL8.
· FS3: 2 A. Spare.
· FS6: 2 A. Spare.
· FS7: 2 A for DC to Horizontal Nip DC motor (M18) via PL16.
· FS8: 2 A for DC to Guillotine DC motor (M08) via PL20.
· FS9: 2 A. Spare.
· FS10: Not used.
· FS11: 2 A for +24 V DC to Horizontal Nip motor (M18) via PL27.
· FS13: 2 A for +24 V DC to Vertical Film Output Stepper motor (M09) via
PL29.
· FS14: Not used.

See Section 3.3.3.3.
3.3.4.4 LEDs
None.
3.3.4.5 Links
None.
3.3.4.6 Test Points


3.3.5 Traverse Board (STB)

Location: mounted on the traverse carriage. See Figure 3.2.
PL11 PL12
TP26
PROCESSOR
PL9
PL10
TP11
TP9
PL6 PL7
PL1 PL5
PL2
PL4
Figure 3.22 Traverse Board (STB) layout
3.3.5.1 STB Connectors

· PL1: Molex 4-pin to Traverse motor.
· PL2: Molex 16-pin header to Traverse encoder (readhead).
· PL4: Molex 8-pin header to Spinner encoder.
· PL5: Molex 12-pin header to Spinner motor.
· PL6: Molex 3-pin header for baffle fan.

· PL7: Molex 3-pin header for baffle fan.

· PL9: Not used.
· PL10: 45-way header for CAN umbilical flexible cable.
· PL11: Not used.
· PL12: Not used.
3.3.5.2 Test Points

Note: Only the useful field servicing test points are described.
· TP9: Sawtooth waveform. When compared with a ‘Demand’ signal (see
TP11), produces a pulse-width modulated signal controlling
Spinner speed. The sawtooth waveform is seen when ‘Spinner
Reset’ command is entered. See Figure 9.13.
· TP10: Demand signal. Produces a level saturated voltage on startup which
then degrades to a lower noise level in a running condition. If the
signal remains saturated, the STB needs to be replaced.
· TP26: Data A. Spinner encoder signal.

3.3.6 Optics Motor Board (SOMB)

Location: mounted on the front lefthand side of the Optics module with a
detachable cover plate. See Figure 3.2.
SK1
PL12
TP14 TP30
PL7 TP23 TP26
PL6
PL10
TP1
PL11
PL5 TP5
TP4
PL8
PL4 TP7 TP15
SK3
TP6 TP13 TP22
TP9
LK1
TP8 TP21
TP33
TP11 TP19 TP24
TP3
PL3 TP16 TP35
TP29
TP18
TP31
TP10 TP17 TP27
VR1 TP25 LK2
PL2
TP32
TP2 TP20
TP28
PL13
PL1
PL9 TP12 SK2
TP34
Figure 3.23 Optics Motor board (SOMB) layout
This board modulates the single reference laser beam (LD2) with image data and
controls the optics motors required for positioning and focusing of up to three
laser beams.

3.3.6.1 SOMB Connectors

· PL1: 13-way. Quadrant detector signal from PL1 on Position Detector
Board in the Optics module.
· PL2: 9-way. Signal from Slow Speed Power detector in the Optics
module.
· PL3: 10-way. From Slow Power Power detector and Neutral Density
Filter sensors in the Optics module.
· PL4: 12-way. From Aperture Limit, Aperture Home and Focus lens
Home sensors in the Optics module.
· PL5: 12-way. To stepper motors M1 (Neutral Density Filter) and M2
(Focus Lens) in the Optics module.
· PL6: 13-way. To stepper motors SM3 (Aperture lens) and SM4 (Slow
Speed Power detector) in the Optics module.
· PL7: Not used. 6-way. For a spare stepper motor.
· PL8: For future use. 8-way.
· PL9: 15-way. To Laser Diode 2 header board in the Optics module.
· PL10: Not used. 10-way. Serial test connector.
supplies from the System board via the RFI Box panel.
· PL12: Not used. 40-way. For downloading ISP code to U27 and other
programmable devices on the SOMB.
· PL13: Not used. 10-way. RS232.
· SK1: 39-way. Control signals to ULMB.
· SK2: 9-way female D-type. Image data from the System board. Also
connects to the ULMB.
· SK3: 15-way female D-type. CAN Bus from System board.
3.3.6.2 Fuses
None.
3.3.6.3 LEDs
None.
3.3.6.4 Links
· LK1: Link to defeat external Reset to board.
· LK2: Signal generation source. Not used by system.

3.3.6.5 Main Devices

· CB1: Circuit breaker. Protects +24 V line to stepper motors from current
overload. Rated at 3.15 A.
· U55: 512k x 8 bit Flash memory. Contains the software coding for the
CPU and CAN microcontroller U48. Any change of code required
is downloadable.
3.3.6.6 Presets
· VR1: Adjusts the offset to laser diode 2. Factory calibration. Do not
touch.
3.3.6.7 SOMB Test Points

· TP2: Laser Data
· TP5: Ground
· TP6: +15 V
· TP12: -15 V
· TP14: Ground
· TP34: Ground.

3.3.7 Upgrade Laser Modulator Board (ULMB)

Location: mounted on the front righthand side of the Optics module with a
detachable cover plate. See Figure 3.2.
SK1 PL2
PL1
PL4 SK2
Figure 3.24 Upgrade laser modulation (ULMB) board layout
This board is only fitted for 2- or 3-laser versions. It modulates the second and
third laser beams with image data.

3.3.7.1 ULMB Connectors

· PL1: 15-way to Laser Diode 1 header board.
· PL2: 15-way to Laser Diode 3 header board.
· PL3: Not used.
supplies from the System board via the RFI Box panel.
· SK1: 39-way. Control signals from SOMB SK1.
· SK2: 11-way female D-type. Image data from the System board. Also
connects to the ULMB.
3.3.7.2 Fuses
None.
3.3.7.3 LEDs
None.
3.3.7.4 Links
· LK1: Not used.
3.3.7.5 Presets
· VR1: Input channel offset voltage for laser channel 3. Do not touch.
· VR2: Input channel offset voltage for laser channel 1. Do not touch.
3.3.7.6 Test Points

· TP1: Laser data.
· TP31: Ground.
· TP33: Ground.
· TP36: +5 V.
· TP37: +15 V.
· TP38: -15 V.

3.3.8 Man Machine Interface (MMI) Board

Location: rear of MMI console and located on a mounting plate fixed to the
console. The LCD and touchpanel are fixed underneath. See Figure 3.2.
SK1 SK2
U1
PL1
WD1
(BUZZER)
SK4
SK3
FS1
MMI PCB
Figure 3.25 MMI board layout
The console (including MMI board, LCD, Inverter and touchpanel) is supplied
and fitted as a complete FRU assembly.
3.3.8.1 MMI Connectors

· PL1: 3-way. Supplies +5 V, Ground and on/off control signal to Inverter
board.
· SK1: 4-way. Signals from touchpanel.
· SK2: Not used.
· SK3: 14-way. Routes drive signals to the LCD.
· SK4: 26-way D-type. +22 V, +5 V and data lines from System board.
3.3.8.2 Fuses
· 1A Fast-acting (97280008). Protects 5 V DC supply to the LCD.
3.3.8.3 Test Points

None

3.3.9 Position Detector (POD) Board

Location: inside the Optics module mounted on a removable base.
This board has potentiometers which are preset at the factory. These should not be
adjusted for any reason.
In non-scan mode, prior to circularizing of the second and third beams, all three
beams are corrected to obtain co-incident alignment. The POD board detects the
position of the first and third lasers, relative to the second (centre) laser, and
outputs an error/control signal proportional to the AOD controlling the beam’s
position.
3.3.10 Cassette ID Sensor Board (Input)

Location: Input assembly, lefthand side attached to the input cover (upper and
lower) and accessible from a cavity on the end panel.
These PCBs are used to optimise distribution of the sensor cabling from the Input
assembly to FHMB(1), and serve as a mechanical base for the cassette ID sensors.
The two PCBs (upper and lower) are mechanically and electrically similar. On the
interior side are three opto-reflective sensors that read the cassette ID barcode; on
the exterior side there is a header connection to FHMB(1) which routes the sensor
data. The layout of the sensor connectors is shown in Figure 3.27.
A Cassette ID Sensor PCB allows up to seven input film cassettes to be uniquely
identified, with each cassette indicated by a 3-bit binary code represented as black
and white dots.
Figure 3.26 shows the pin arrangement of the photo-detect sensor fitted to the
PCB.
3 4
VCC +5V CATHODE
(PL8 OUTPUT 2
PINS 21/23/25) SENSOR SW1
1 5
GND ANODE +5V
Figure 3.26 Cassette ID sensor connectors (SW1-3)

S17
S9
S11 PL1
S40
PL2
FHMB(1)
(CASSA)
FPD PL3 PL4 PL5 PL6 TO PL18
PL7
CASSETTE
ID SENSORS
(S2 - S4)
PL8
S18
a) UPPER
S12 PL1 PL2

S47
S10
S48
FHMB(1)
(CASSB)
PL3 PL4 PL5 PL6 TO PL19
PL7
CASSETTE
ID SENSORS
(S6 - S8)
PL8
b) LOWER
Figure 3.27 Cassette ID Sensor board layout (upper and lower)

3.3.11 Sensor Distribution Board (Output)

Location: Vertical output assembly, lefthand side, next to the vertical output
motor.
There is one distribution board for sensors on the Vertical and Horizontal output
assemblies with the connector layout shown in Figure 3.28. See also Section
9.3.1.
VERT (FHMB1)
PL5
S22
PL4 PL8 PL11

PL1
PL3 PL7 PL10

S49/S66
S54/S68
PL2 PL6 PL9
S51/S53
Figure 3.28 Vertical Distribution board layout

3.4 Film Handling Devices
This section describes the main film handling devices (sensors, motors, solenoids
and fans) controlled from FHMB (1 and 2) I/O ports.
Service engineers are able to identify each sensor, motor and solenoid device on
the recorder by its unique ID number. The numbering convention used on the
Luxel machine (and in this manual) follows the pattern:
· Sensors: S1, S2, ... (Note that the ‘S’ sensor number sequence includes gaps for
future product development).
· Motors: M1, M2, ...
· Solenoids: V3, V2, ...
· Fans: F1, F2, ...
3.4.1 Sensors
Sensors positioned around the film handling path feed data to the local FHMB
(via local distributor boards) which directly controls the transport motors. Overall
film handling control is determined by the SSB, allowing the FHMB (1 and 2) to
run a software handling routine for driving the appropriate device.
Film handling sensors are used to flag the exact position of a film leading/trailing
edge on the recorder media path and initiate switching for a film handling motor
or a film jam indication on the MMI. There are four types of sensors used on the
recorder:
· photo-diode (FPD)
· opto-reflective switch (pulsed and non-pulsed)
· slotted opto-switch photo-interrupter
· micro-switch.
3.4.1.1 Sensor Types
Fast Photo Power Detector Sensor (FPD)

The fast photo power detector sensor is a 10 x 10 mm chip mounted on a small
PCB called the Photo-sensor board. Only one of these sensors is used on the
recorder. It is mounted in the Input assembly (left-hand side). Its output is directly
proportional to the intensity of laser light from the spinner in the drum. Any
detected decrease in laser intensity is attributed to contamination of the spinner.

The photo-sensor board houses one surface-mounted photo-diode chip.
2 1
CATHODE ANODE
PL1
1 6
CATHODE ANODE
5 10
Figure 3.29 Photo-sensor board layout
The location of this board is shown in Figure 3.32.
Opto-Reflective Sensors
These are opto switches which emit light and detect the same light from a
reflective surface. The sensor output is +5 V when light is reflected back to the
detector (when reflective object/film is present). The sensor output is 0 V when
light is not reflected (when reflective object/film is not present). Not that these
levels are inverted for software purposes at the sensor registers.
Light emitted from reflective-opto sensors used in the film handling paths are
switched on and off by a train of pulses to reduce any fogging of the film. They
are typically switched on for 200 microseconds and off for 3 ms. Reflective-opto
sensors not used for detecting film are not pulsed. Reflective-opto sensors are
mounted on a small PCB called the Reflective-opto Sensor board.
Opto-reflective sensors are specifically employed to detect a change of reflected
light from a surface or a passing edge. They are especially useful for determining
film presence and lengths along a path, and are generally very sensitive to film
angle and distance.
These sensors are positioned close to a film surface and are typically switched on
(for 200 ms) and off (for 3.2 ms) from an FHMB pulsing function. While film is
stationary, the sensors are turned off to reduce the risk of ‘fogging’. See
Table 3.31 for a list of the pulsed sensors.
Fixings and mountings for these sensors (see Section 4.1) are mechanically set on
the recorder, and service engineers need to ensure that any replacements are fitted
in exactly the same position as the old device. On replacement, reflective sensors
may require calibration to find the minimum level of LED drive to allow
detection. Normally, a replacement setup is not required.
Voltage supply to the sensor is set at 5 V and the type of switching is:

· Film Not Detected = LOW output

· Film Detected = HIGH output.
· Fault Condition = OFF
Opto-reflective sensors are fitted to two types of boards:
· Cassette ID sensor PCB: fitted to the Input assembly these two PCBs are used
to read the cassette ID codes (0-7) and route the local sensor inputs to the
FHMB. See Figure 3.27.
· Reflective-opto sensor PCB: these mechanically house the sensor device and
are located to detect the arrival of film at set points on the media path. See
Figure 3.30.
The Opto-reflective sensor PCB houses a single sensor and includes a cathode
with two parallel resistors in series.
R1
33R
R2
33R SW1
EE--SY313
PL1
1
2 5 3
ANODE VCC
3 C1 2
4 OUT
4 1
CATHODE GND
0.1u
25V
Figure 3.30 Opto-reflective sensor board layout
Section 3.4.1.2 describes the location and operation of each sensor board.
Opto-Slotted Sensors
These are opto switches which emit and detect light between two integral posts.
The sensor output is +5 V when light is detected (when object is not interrupting
light beam). The sensor output is 0 V when light is not detected (when object is
interrupting light beam).

SUPPLY
VOLTAGE
GND
SLOT FOR FLAG

OUT
Figure 3.31 Slotted-opto photo-interrupter sensor connectors (side view)
The locations of all the slotted-opto and photo-interrupter sensors are shown in
Figure 3.33, Figure 3.34 and Figure 3.35.
These sensors are used by the software to detect the position of a mechanism - for
instance, the location of the punch pins or the buffer guide. A small tab, fixed to
the moving mechanism, interrupts the slot light, indicating to the software the
current position of the mechanism.
Voltage supply to the sensor is set at 5 V and the type of switching used is:
· Light not detected = LOW output
· Light detected = HIGH output.
Micro-switch Sensor
Micro-switches are used to detect the presence of a moving assembly - for
instance, to detect if the chad tray is in position. Some of these sensors operate as
limit switches to switch off a motor when the sensor is activated, see Table
Table 3.31. Voltage supply to the sensor is set at 5 V.
3.4.1.2 Sensor Locations and Connections

Table 3.3 below lists all the sensors in the general order of operation along the
film handling path. It also indicates if there is an distribution board connection
between the sensor and its local FHMB.
Sensors operate in the three main functioning areas of the recorder:
· Media Input: devices in this area are responsible for delivering film from the
cassette into the drum via the climatizing buffer.
· Media Exposing: devices used for exposing, punching and guillotining film.
· Media Output: devices responsible for passing film through the Horizontal Tray
and Vertical Output assemblies.
Media Input Sensors
See Table 3.3 and Figure 4.5.

Table 3.3 Film handling sensor descriptions
Sens ID Function Type Connection Type FHMB

S2 Cassette Upper ID1 Opto-Reflect Cassette ID A Board 1
S6 Cassette Lower ID1 Opto-Reflect Cassette ID B Board 1
S47 Cassette Upper Locked Opto-Slot (P) Cassette ID B Board 1
S48 Cassette Lower Locked Opto-Slot (P) Cassette ID B Board 1
S60 Cassette Door Closed Opto-Slot (P) Direct to FHMB 1
S9 Film at Upper Cassette Opto-Reflect (P) Cassette ID A Board 1
S10 Film at Lower Cassette Opto-Reflect (P) Cassette ID B Board 1
S17 Buffer Guide Closed Opto-Slot (L) Cassette ID A Board 1
S18 Buffer Guide Open Opto-Slot (L) Cassette ID B Board 1
S11 Film at Upper Buffer Guide Opto-Reflect (P) Cassette ID A Board 1
S12 Film at Lower Buffer Guide Opto-Reflect (P) Cassette ID B Board 1
S40 Film at Drum Input Opto-Reflect (P) Cassette ID A Board 1
S16 Punch Up Opto-Slot (L) Direct to FHMB 1
S19 Cutter at Right Micro-Switch (L) Direct to FHMB 2
S20 Cutter at Left Micro-Switch (L) Direct to FHMB 2
S69 Film in Punch Opto-Reflect (P) Direct to FHMB 1
S30 Chad Tray In Micro-Switch Direct to FHMB 1
S58 Punch Down Opto-Slot (L) Direct to FHMB 1
S49 Film in Horizontal Tray 1 Opto-Reflect (P) Horizontal Tray Docking 2
S68 Film in Horizontal Tray 2 Opto-Reflect (P) Horizontal Tray Docking 2
S56 Horizontal Nip Open Opto-Slot (L) Horizontal Tray Docking 2
S57 Horizontal Nip Closed Opto-Slot (L) Horizontal Tray Docking 2
S51 Film at Horizontal Tray 3 Opto-Reflect (P) Horizontal Tray Docking 2
S66 Film in Vertical Output 1 Opto-Reflect (P) Vertical Distribution Board 2
FPD Fast Photo Power Detector Opto-Reflect Cassette ID A Board 1
Note: (P) indicates the sensor is pulsed.

(L)indicates the motor stops when the sensor detects.
S2/S3/S4 (Upper) and S6/S7/S8 (Lower) - Cassette ID (1-3)
Location: left-hand side of the Input assembly, on the Cassette ID Sensor PCB
mounted inside the input cover.
Operation: cassette IDs are recognized by the system from a reflective barcode
(code locations for 1 to 7) fixed to the cassette.
S47 and S48 - Cassette (Upper and Lower) Locked

Location: left-hand side of the Input assembly, protected by the left input cover.
Operation: the cassette latch lever includes a mechanical tab that blocks light on
the sensor until the cassette is locked and latched.
S60 - Cassette Door Closed
Location: upper righthand side of door entry.
Operation: detects whether the door is closed.
S9 and S10 - Film at (Upper and Lower) Cassette
Location: entry point of cassette film feed rollers, housed under sensor covers on
the feed guides A and D.
Operation: two identical sensors detect the leading and trailing (end-of-roll) edge
of film fed from the cassette.
S17 and S18 - Buffer Guide (Closed and Open)
Location: left-hand side of the Input assembly, behind the drum casting and
accessed from pod door.
Operation: two mechanical tabs operate as the limit flags to indicate a closed
position (where the climatization buffer is closed and film loads directly into the
drum) and open (the buffer starts to load with film).
S11 and S12 - Film at (Upper and Lower) Buffer Guide
Location: S11 is underneath feed guide A; S12 is underneath feed guide C
(accessed from the Horizontal Output tray well).
Operation: detects film going into the buffer guide.
S40 - Film at Drum Input
Location: behind film feed guide A on the left-hand side.
Operation: detects film pushed into the drum by the drum roller.
FPD - Fast Photo Power Detector
Location: behind feed guide A on the left-hand side.
Operation: detects laser power emitted from the spinner mirror.

S60
FPPDET S40
S11
S9
S17
S12
S18
S10
Figure 3.32 Location of sensors (media input)
Media Exposing Sensors

See Figure 3.33.
S16 and S58 - Punch (Up and Down)
Location: punch motor bracket, behind the Horizontal tray on the left-hand side.
Operation: an eccentric cam with a light-blocking tab rotates to indicate the
following punch pin states: punch pin IN - detected by sensor S58; punch pin
OUT - detected by sensor S16.
S19 and 20 - Cutter at Right and Left
Location: each side of the guillotine assembly on the drum. These sensors are
replaced by fitting a new guillotine assembly.
Operation: two sensors, one at each end, detect the positions of the guillotine
cutter.
S69 - Film in Punch
Location: on the punch assembly (behind the Horizontal tray).
Operation: detects whether film is in position ready for punching.
S30 - Chad Tray In
Location: located at the left-hand side of the recorder and fitted on the tray slider
rail. It is accessible when the rail is removed from the righthand side.
Operation: detects that a tray is present.

DRUM
S20 S19 PUNCH AND

GUILLOTINE
S69
S58
PUNCH
MOTOR
S16 HORIZONTAL TRAY WELL
S30 CHAD TRAY

RAIL
Figure 3.33 Location of sensors (media exposing)
Media Output Sensors

S49/68/51 - Film at Horizontal Tray (1 to 3)
Location: mounted along the film path on the Horizontal tray and activated in
order 1 to 3.
Operation: detects film location in the Horizontal tray film path; S68 alerts the
system for a jammed film sheet in the tray if the machine is powered up.
S51
S49
S56 S68
S57
Figure 3.34 Location of sensors (Horizontal tray)

S22
S54
S53
S66
Figure 3.35 Location of sensors (Vertical output)
S66/S53/S54/S22 - Film in Vertical Output (1 to 4)

Location: mounted as a line of sensors along the Vertical output path and activated
in order from 1 to 4.
Operation: detects the location of a film strip in the Vertical output assembly as it
moves towards the processor and alerts the system for jammed film strips.
3.4.2 Motors
3.4.2.1 DC Motors
These motors are enabled and have their directions set under local FHMB control.
The drive connection is directly between the board and the motor, without passing
through an intermediate distribution board. All DC motors have separate driver
outputs on the FHMB and include current limit control. Drive voltage is +24 V
for two motor types:
· Low Power (LP) at 250 mA
· High Power (HP) at 800 mA.
Fuses located on the FHMB protect all the DC motors. A diagnostic facility is
available for checking the status of each fuse.

Table 3.4 DC motor description
Motor ID Motor Motor Type FHMB

M03 Buffer Guide LP 1
M06 Punch HP 1
M08 Guillotine LP 2
M18 Horizontal Nip LP 2
Several DC motors are controlled by opto-slotted sensor limit sensors listed in

Table 3.5 below. The table describes the direction of the motor mechanisms and
their sensor clockwise (C/W) and (Anti-C/W) limits.
Table 3.5 DC motor and sensor control
Motor ID C/W Limit Sens ID Anti-C/W Limit Sensor ID

M03 Buffer Guide Open S18 Buffer Guide Closed S17
M06 Punch Up S16 Punch Down S58
M08 Guillotine at Right S19 Guillotine at Left S20
M18 Horizontal Nip Up S56 Horizontal Nip Down S57
3.4.2.2 Stepper Motors

Each motor is unipolar and is capable of half- and full-stepping in a clockwise or
anti-clockwise direction, or keeping a holding torque. Driving current from the
FHMB is pulse-width modulated up to 2 A at 24 V.
Fuses located on the FHMB protect all the stepper motors.
Table 3.6 Stepper motor description
Motor ID Motor Motor Amps (A) FHMB

M01 Cassette Upper 1 1
M02 Cassette Lower 1 1
M04 Drum Input 1 1
M09 Vertical Output 1 2
M10 Horizontal Output 1 2

3.4.2.3 Motor Locations and Connections

See Figure 3.36.
Note: Motor designations M05, M07 and M11--M17 are not used.
M01 and M02 - Cassette (Upper and Lower)
Location: front lefthand side of the Input assembly.
Operation: these motors drive the cassette input rollers that feed film into the
drum and the cassette spool rewind. A slipping clutch between the cassette motor
and the roller operates whenever there is a rewind jam.
M04 - Drum Input
Location: front lefthand side of the Input assembly.
Operation: drum input motor feeds film into the drive and operates in sequence
with M01 and M02. This is the primary roller for loading precise lengths of film
into the drum.
M03 - Buffer Guide
Location: front, lefthand side attached to the Input assembly end plate, behind the
drum casting.
Operation: a DC motor drives the Input buffer guide. The buffer guide is a flap
that directs film into the climatization buffer, see Section 9.11.2.
M06 - Punch
Location: front, lefthand side, fitted to a motor bracket behind the Horizontal tray.
Operation: this motor operates the punch bar and pivot operating the pin dies.
M08 - Guillotine
Location: lefthand side of the guillotine assembly.
Operation: uses a wire pulley system to drive a knife across film.
M18 - Horizontal Nip
Location: lefthand side of the Horizontal tray, on the interior side of the end plate.
Operation: a DC motor that opens or closes the nip roller on the Horizontal tray.
M10 - Horizontal Output
Location: inside the Horizontal Output tray, on the lefthand side.
Operation: a stepper motor that drives all the tray rollers from a pulley and chain.
M09 - Vertical Output
Location: lower lefthand side of the Vertical Output assembly.
Operation: this stepper motor drives all three sets of rollers in series to lift film
sheets towards the processor.

DRUM INPUT
CASSETTE M4
(UPPER)
M1
VERTICAL BUFFER
OUTPUT GUIDE M3
M9
CASSETTE
GUILLOTINE (LOWER)
M8 M2
HORIZONTAL STEPPER
NIP ROLLER MOTOR
PUNCH HORIZONTAL M18
M6 OUTPUT
M10 DC MOTOR
Figure 3.36 Location of motors (input, exposing and output)
3.4.3 Solenoids and Fans

Solenoid and fan drives are at 24 V (1 A max) for the currents shown in Table 3.7.
The pressure fans are driven by a steady 24 V output from the FHMBs. All the
solenoids are fused with the fuse status read from a diagnostics window.
Note that the following fans are supplied from separate outlets:
· RFI Box cooling fan: 24 V from the SSB.
· Baffle fans: 24 V from the STB.

Table 3.7 Solenoid and fan outputs
Solenoid ID Function Type FHMB

V1 Vacuum 1 500 mA 2
V4 Vac Pump on/off 10 mA 2
V6 Exhaust fan 100 mA 1
V10 Lid Lock 2 400 mA (Const) 1
V11 Flashing Lamp 100 mA 2
F1 Pressure Fans 100 mA 1 and 2
3.4.3.1 Solenoid/Fan Locations and Connections
Solenoids
V10 - Cassette (Lid) Door Locked
Location: door lock mechanism fitted to the frame on the righthand side of the
Cassette door.
Operation: indicates to the system software that the door is shut.
V1, V2 and V3 - Vacuum 1, 2 and 3
Location: solenoids on the vacuum pump mounting plate, see Figure 3.38.
Operation: solenoids that switch the vacuum inlets and drum blow to the three
drum chambers.
V4 - Vacuum Pump On/Off
Location: vacuum pump relay located inside the PSU box, see Figure 3.4.
Operation: a relay that switches on the pump when film needs to be conformed to
the drum. The pump is switched off during a scanning operation.
V11 - Flashing Lamp
Location: drives a flashing lamp relay which provides a remote external alert for
the user. See Figure 3.5.
Operation: alert switches on when there is an error or the recorder is out of film.
External alarms are fitted by the customer.
Fans
See Figure 3.37.
V6 - Mixer Fan
Location: lefthand side drum end cap.

Operation: removes warm air from around the spinner mirror to prevent
misregistration. A Drum extractor fan prevents the build-up of thermal gradients
which can cause interference to the scanned image.
PRESSURE
FANS
RFI BOX FAN

PSU BOX FAN
BAFFLE
MIXER FANS
FAN
Figure 3.37 Location of fans
F1 - Pressure Fans (1 and 2)

Location: between the Optics module and the RFI box. Pressure fans are driven
by a constant 24 V from FHMB1 (Fan 2) and FHMB 2 (Fan 1)
Operation: to maintain internal air pressure and help prevent dust entering the
recorder.
Baffle Fans
Location: two fans fitted to the baffle on the traverse carriage, see Figure 6.1 and
Figure 3.37.
Operation: pushes film against the drum before scanning commences. These fans
are driven from +24 V outlets on the STB.
RFI Box Cooling Fan
Location: a single fan with an outlet at the rear of the recorder.
Operation: extracts warm air from the RFI box.

PSU Box Cooling Fan

Location: a single fan with an outlet at the rear of the recorder.
Operation: extracts warm air from the PSU box.
3.5 System Interlocks
The interlock assemblies comprise the following (See also Section 9.9.):
· Four interlock switches: for the lefthand pod door, righthand pod door, top
righthand side cover above the Optics module and lower front panel.
· One interlock relay (A): connecting the +24 V and +36 V supply to FHMB
(1/2) and STB located in the PSU RFI box.
· One interlock relay (B): connecting the +15 V and -15 V supply to the SOMB
and ULMB located in the RFI box.
· 1 A fuse: the +12 V line used to energize the interlock relays. This is located on
the RFI box panel.
· Transistor: a +5 V input controls a transistor switch for grounding interlock
relay (B) which connects the +15 V and -15 V supply to the SOMB and ULMB.
· Inhibit lines: when the SSB detects that a door or cover is open (via the Status
line), an Inhibit signal switches off the +36 V, +24 V to AODD and +24 V lines
from the PSU. The Inhibits are used for start up power sequencing.
When the recorder is powered on and an interlocked cover is removed, two relays
are de-energized to prevent distribution of the following DC supplies from the
PSU:
· Interlock Relay A: this is in the PSU box and controls the +36 V and +24 V to
the STB and both FHM boards which powers the spinner, the traverse and all
film handling motors. The +36 V line line is also used to supply the CAN nodes
on these boards.
· Interlock Relay B: this is on the SSB and controls the +15 V and -15 V supplies
to the SOMB and ULMB which power the laser.
On replacing an open cover or door, the power on sequence is controlled to allow
the +5 V switch on before the ±15 V lines. Also, the +24 V, +36 V and +24 V
(AODD) lines are switched off by Inhibit signal to the PSU until the +5 V supply
has stabilized.
Other panels and doors on the recorder are mechanically locked:
· Cassette door (Lid Lock): the Cassette door to the Input assembly is locked
when the operator releases the door latch on the handle.
· Lower front cover: this interlocked cover is released from a righthand side push
button, see Figure 8.3.
· Lefthand pod door: the service door is locked by a manually-turned screw lock
accessed when the cassette door is opened, see Figure 8.4.

3.6 Vacuum System
See Figure 3.38.

A vacuum pump and solenoid assembly is mounted on a plate located on the
recorder base (lefthand side). The system consists of:
· Vacuum pump: this pump is held by four A-V rubber mounts that prevent
mechanical vibration transferring indirectly to the drum and causing
misregistration errors. The pump does not need to be serviced or maintained; in
the event of a failure, it is replaced as an FRU. Make sure the A-V mounts are
in good working order. The pump is powered by a fuse-protected linear 230 V
motor.
CAUTION
After running continuously for an hour or more, the vacuum
pump becomes hot. Avoid touching the outer surface.
· Solenoid valves (1-3): these regulate the air flow to the vacuum chamber
arrangement on the drum. See also Section 9.10.
· Terminal block connection: the electrical connection to the pump assembly is
from a covered terminal block.
· Vacuum pump relay: housed in the PSU box, this relay switches the vacuum
on/off when film needs to be conformed to the drum during a load/reload
sequence.
3.6.1 Vacuum Distribution
See also Figure 9.18

A flexible pipe connects the vacuum created by the vacuum pump to two outer
vacuum chambers and to a middle vacuum chamber in the drum. A solenoid
operated valve regulates the amount of vacuum in the middle chamber and a
second for the two outer chambers. A third solenoid operated valve allows
exhaust air to be routed out of the vacuum pump as drum blow.
The two outer and middle vacuum chambers duct to a total of 23 grooves in the
drum, using vacuum to force the film against the inside wall of the drum. Two
fans, one on each baffle either side of the traverse carriage, also blow air
downwards to help hold the film flat.

OUTLET
VACUUM
PUMP
ELECTRICAL
CONNECTOR
EXHAUST TO FHMB (2)

AV
MOUNT
FIXING SCREW
VALVE 3
VALVE 2
VALVE 1
Figure 3.38 Vacuum pump and solenoid valves
3.7 System Cabling

Figure 3.39 shows the main cable interconnections (signal and power) between
the main assemblies. Note the following:
· All cables are identified by a part number on a white label.
· The diagnostics serial cable to the RIP server or engineering terminal is an
RS232 interface.
· The media processor cable is supplied by the processor manufacturer.
3.7.1 AC and DC Distribution
3.7.1.1 AC Distribution
See Figure 3.40.

The AC mains supply to the recorder PSU should be connected to an outlet

controlled by a switched isolator box (clearly marked ON and OFF). The isolator
box must be protected by circuit breakers (according to local regulations) and
must be located not more than two metres from the recorder (refer to the Luxel
F-9000 Imagesetter Pre-installation Manual).
In the PSU Box, the AC Mains supply is filtered, to eliminate spurious voltage
spikes, and is routed via a mains switch to the PSU module and also via a relay
and fuse to a transformer which provides 110 - 240 V AC to the vacuum pump.
The AC supply to the recorder should be on the same phase as other Luxel F-9000
imagesetter equipment in order to improve transfer of data and also avoid voltage
spikes between phases. The type of isolating fuse depends on local conditions and
regulations.
The mains switch, is normally left permanently ON and is only switched OFF in
emergency or during a service procedure. This is to prolong the ‘working life’ of
the laser(s) and spinner motor, and provides a more stable operating environment.
The SSB is a local star-point ground for the +15, -15, +5 and +24 (AODD)
voltages; a ground link (with the +24 V supply to SOMB, ULMB and the cooling
fans) is separate.
3.7.1.2 DC Distribution
The following DC voltages are routed from the PSU module:
· +5 V - for PCB devices and sensors.
· +15 V - to the SSB, SOMB and ULMB.
· -15 V - to the SSB, SOMB and ULMB.
· +24 V - to the STB, FHMB, two drum baffle fans and interlock relay coils.
· +24 V (AODD) - to the AODD module only.
· +36 V - to the FHMB and STB (to drive traverse and spinner motors).
When the recorder powers on, the spinner, traverse and film handling motors are
programmed not to switch on at the same time. The PSU voltage lines are
sequenced (inhibited) by the System board to ensure that the +5 V rail is
operational before the +36 V, +24 V and the ±15 V rails.
The SSB supplies a regulated +12 V to the SCSI disk drives derived from the
+15 V DC rail. This board also routes:
· +24 V -- to the AODD.
· +5 V, ±15 V and +24 V - to the SOMB and ULMB.
· +24 V - to the RFI box fan.
Use Figure 3.39 and Appendix A to reference cables and their DC voltage pin
outs.

M18 OUTPUT NIP S9

TRAY2 M10 FILM OUTPUT CASSETTE
S11
S49 ID SENS
FLEXING CASSA UPPER S17
CABLE S51 HORIZONTAL TRAY S2/3/4 S40
S56
S57
S68 FPD
S19/20 GUILLOTINE
M3 INPUT BUFFER
M4 FILM IN DRUM
M9 F/OP TO PROC
S16/S58 PUNCH
M8 GUILLOTINE
M2 REWIND B
M1 REWIND A
S47
TRAY1
M6 PUNCH
S30 CHAD
CASSETTE S10
S22
S60 LID
ID SENS
S66 LOWER S12
S69
VERT.
V1
V2
V3
DIST. S53 S6/7/8 S18
CASSB
BOARD S54 S48
DC_PUN
PUNCH
GUILL
GUILL
MOT1
BAFFLE BFAN
VERT
MOT1
MOT1
MOT1
VAC
DC2 FAN
S69
S60
S30
FILM HANDLING MOTOR BD 2 FILM HANDLING MOTOR BD 1 TRAVERSE
CAN_SIG CAB_UMBIL
FHMB2 (OUTPUT) FHMB1 (INPUT) BOARD
(STB)
F1 FAN
V6 V5 (FANS)
SOL3
PFAN1
CAN_SIG_IN
PWR2
PFAN1
PRESS PRESSURE PRESSURE PRESS BAFFLE
FAN BFAN
FAN 1 FAN 2
V6 (EXHAUST)
PWR2 LIDLK2, V10 (LID LOCK RIGHT)
PWR1
PWR1
PSU BOX
OPTICS UPGRADE
SEE FIGURE 3.3 INT_PSU MOTOR LASER
BOARD MODULE
SSB_PWR3 (SOMB) ULMB (ULMB)
SSB_PWR4
SOMB_PWR
SOMB_PWR
IMAGE_SOMB
IMAGE_SOMB
CAN_SIG
SYSTEM BOARD SSB_SOMB

(SSB)
SSB_SOMB
CAN_SIG
DISK_PWR
LCD MMI MMI DISK_DATA1 DISK
LCD
BOARD
SSB_FUSE DISK_PWR
POD DOORS LOWER COVER OPTICS DISK
DISK_DATA2
UPGRADE
INT AODD_PWR
INT_PSU
AODD_IF AODD
FILM_PROC
FAN
EXTERNAL SERIAL_DIAGS (RIP) FAN
CONNECTIONS
SCSI
SSB_PWR1 RFI BOX

SSB_PWR2 SEE FIGURE 3.6
Figure 3.39 System cable interconnections

+24V AODD
PSU NOTE: RELAY B IS ON THE SSB
+5V
MMI
5V SEN
+5V DISK INTERLOCKS
+12V
DRIVE
GND
5V SEN
+12V DISK
DRIVE
FUSE +12V
+15V
GND
FANS
+5V/GND LOCAL (CAN)
Engineer’s Reference Guide 6700898003

SOMB
+5V
--15V
GND
+24V +24V
(AODD)
GND RELAY B
+15V
ULMB
--15V
+5V/GND LOCAL (CAN)

OPTICS MODULE
SSB RFI BOX

FHMB2 FHMB1
CAN CAN
STB
RELAY A
Figure 3.40 DC and Ground distribution

+24V +24V
GND
+36V
+36V
GND
UMBILICAL
PSU BOX
3-71

Film Handling 4
Replacements and
Setups
This chapter describes how to remove and replace the main film handling FRUs
(sensors, motors, cassette sub-assemblies, punch, guillotine and fume flap), and
adjust any setups (where required).
Make sure any modifications and replacements are entered in the Log Book.
Ensure that the recorder is powered off but still connected to the AC mains source
to maintain Earth/Ground continuity.
All screw fixings must be replaced with their captive washers (spring and flat), if
they are initially fitted.
Make sure all cables are properly clamped and tie-wrapped with adequate slack for
removing connectors. Check that they are not trapped or mechanically pinched.
4.1 Removing Film Handling Assemblies
This section describes how to remove and replace the most commonly-found set
of sensor devices, panels, etc, fitted on the recorder:
· opto-reflective sensor (and PCB) with two different types of snap rivets
· slotted-photo sensor
· clip-on mounting PCB used to fix the opto-reflective sensor to an assembly
· panels, plates, shields, mouldings, etc to access devices on the Input assembly
· FHMB (1) bracket assembly.
4.1.1 How to Remove Opto-Reflective Sensor PCB

These sensors are very sensitive to the angle and distance of film, so it is
important that they are refitted in exactly the same location on the correct side of
the mounting bracket.
Opto-reflective PCBs have two types of rivet fixings: button and snap. Use the
following remove and replace method:

Film Handling Replacements and Setups
1. Release the PCB from its mounting plate by pulling out the button rivet stud
from its insert (see Figure 4.1) or pushing the rivet insert (Figure 4.2) out with
the flat end of a screwdriver.
2. Carefully disconnect the cable lead to the header connector (you may need to
use a small screwdriver).
3. Reconnect the lead to the new PCB.
4. Replace the new PCB by refitting the insert into the PCB, locating the PCB on
its mounting position and gently pushing in the stud. The insert splays to
secure the PCB to its mounting.
BUTTON RIVET
CONNECTOR
PCB
INSERT
SENSOR MOUNTING
Figure 4.1 Removing a button snap rivet
SNAP RIVET
CONNECTOR
PCB
INSERT
PUSH OUT
SCREWDRIVER SENSOR MOUNTING
Figure 4.2 Removing a snap rivet
4.1.2 How to Remove Opto-Slotted Sensors

See Figure 4.3.
These sensors are positioned on their mounting by a locating pin.
1. Pull off the lead connector.
2. Remove the 1-off, M4 fixing screw with a Philips screwdriver.

3. Replace the sensor in the same location, and reconnect the lead.
SENSOR
MOUNTING
BRACKET
LOCATING
DIMPLE
SCREW METAL TAB

FIXING
CONNECTOR
Figure 4.3 Removing an opto-slotted sensor
4.1.3 How to Remove Clip-on Sensors

See Figure 4.4.
These sensors mountings are easily removed and replaced from their assembly
mountings:
1. Push in the two wings on the sensor clip-on mounting and pull out the device.
2. Remove the sensor PCB from the clip-on mounting, see Section 4.1.1.
3. Replacing the sensor and mounting is the reverse of removal.
Figure 4.4 Removing a clip-on sensor

4.1.4 How to Remove Input Assembly Panels
CAUTION
The Input assembly may have sharp edges that can easily cut
or damage cables.
At the end of a replacement procedure make sure that the film

guide path does not have any obstructions capable of
scratching film.
To help locate each sensor on the recorder, refer to Section 3.4. Refer to
Figure 4.5 showing the main covers, panels, etc on the Input assembly that need to
be removed before accessing the appropriate device. Before starting these access
procedures, open the two side pod doors and the cassette door.
A. Light Seal Panel (Upper)
1. Remove the front 3-off M4 screws, and the 6-off side screws (accessed from
the open pod door), holding the panel to the assembly.
2. Replacement is the reverse of removal.
B. Input Covers (Left- and right-hand)
Only the lefthand side cover needs to be removed if there is a problem accessing
the drum input motor on an early production machine, see Section 4.3.2, or the
Cassette ID PCB.
1. Remove the top shelf (2-off bolts).
2. Remove the 5-off screws that secure the moulding.
C. Light Seal Panel (Front)
1. Remove the lefthand and righthand input covers.
2. Remove the 5-off M4 screws to detach the panel.
D. Feed Guide (1)
1. Remove the Film at Cassette (upper) sensor PCB (S9), see Section 4.2.3.
2. Remove the 3-off M4 screws at the top of the panel and the 5-off M4 screws
underneath the rollers. (There is no need to remove the trim strips). You may
need to loosen the front leaf spring screws.
3. Detach the S9 cable from its fixings on the lefthand side.
4. Carefully pull the guide plate away from the rollers.
H. Light Seal Plates (Left- and Righthand)

Access to the two end plates is from the pod doors. The lefthand plate includes
cavities that allow service access to input motors and sensors; it may need to be
removed for better access during some of the procedures.
Lefthand Plate
1. Remove the FHMB (1) bracket assembly using information from Section
4.1.5.
2. Detach the ribbon cables to the upper and lower Cassette ID PCBs, see Section
3.3.11 for a view of the PCB connections.
3. Cut the tie-wraps holding any cables to the panel.
4. Detach the cables to the cassette drive and drum input motors.
5. Remove the 7-off M4 screws holding the panel to the Input assembly and
frame.
B C B
TRIM
D
TRIM
F
G
H H
A= LIGHT SEAL PANEL (UPPER) NOTE: TRIM IS NOT REMOVED
B= INPUT COVER (LEFT & RIGHT)
C= LIGHT SEAL PANEL (FRONT)
D= FEED GUIDE (1)
E= FEED GUIDE (2) -- NOT REMOVED
F= FEED GUIDE (3) -- NOT REMOVED
G= FEED GUIDE (4) -- NOT REMOVED
H= LIGHT SEAL PLATE (LEFT & RIGHT) - ACCESSED FROM POD DOOR
Figure 4.5 Input assembly panels - front view

4.1.5 How to Remove FHMB (1) Bracket

The FHMB (1) bracket assembly needs to be removed before obtaining access to
the lower cassette drive assemblies. You do not need to remove the PCB cover or
the PCB connectors to access the lower cassette assemblies.
See Figure 4.6.
1. Detach any the cable connections to FHMB (1) - see Figure 3.20. Note all the
connectors.
2. Cut the tie-wraps to the board connectors.
3. Detach the FHMB bracket from the frame by removing the 3-off M4 screws.
4. Carefully pull away the board and bracket from the frame. There are also
tie-wraps behind the board.
FHMB (1)
COVER
BRACKET
FRAME
(LEFT)
Figure 4.6 Detaching the FHMB (1) bracket

4.2 Replacing the Sensors
When replacing brackets or sensor devices, check for small locating lugs (i.e.
mechanical ‘pimples’) and make sure that they fit into their correct locating
inserts before securing any screw fixings.
4.2.1 S2 to S4 and S6 to S8 - Cassette ID

These devices (upper and lower) are located on two cassette ID sensor PCBs that
also function as local sensor distribution boards for FHMB (1). The PCBs are
attached to the input cover on the lefthand side of the Input assembly, but are
accessed from the lefthand pod door.
Method 1
See Figure 4.12 to locate the PCB.
1. Locate the PCB access cavity on the end panel.
2. Upper PCB: Disconnect the 5-off sensor connectors and the CASSA ribbon
cable connection to FHMB (1). See Figure 3.27.
3. Lower PCB: Remove the FHMB (1) bracket, see Section 4.1.5. Disconnect the
3-off sensor connectors and the CASSB ribbon cable connection to FHMB (1).
See Figure 3.27.
Method 2
4. Remove the lefthand end panel and FHMB (1) bracket, see Sections 4.1.4 and
4.1.5.
5. Remove and replace the Cassette ID sensor PCB from the cover fixing, see
Section 4.1.1.
6. Check for correct sensor operation by installing a cassette with a known ID
and noting the MMI display showing Media Information details.
4.2.2 S47 and S48 - Cassette (Upper and Lower) Locked

These sensors are fitted on the lefthand side of the Input assembly next to the
cassette rollers.
1. Access the sensor by removing the lefthand side input cover, see Section 4.1.4.
2. Use a stubby Philips screwdriver to remove the M3 screw holding the sensor
bracket, see Section 4.1.2.
3. Check the sensor operation by installing a cassette and visually noting the
position of the photo access hole on the metal tab - it should be ‘in’ when the
cassette is locked.
4. Check that a locked cassette is recognised on the MMI display.

4.2.3 S9 and S10 - Film at (Upper and Lower) Cassette

These sensors are fitted underneath a sensor cover located on feed guides (1 and
3), see Figure 4.5 (shown as D and F).
1. Remove the sensor cover, 1-off M3 screws.
2. Replace the opto-reflective PCB, see Section 4.1.1. Make sure the PCB is
mounted in exactly the same location.
3. Replace the sensor cover.
4. Check that a film strip loads into the drum from a cassette.
SENSOR
COVER
Figure 4.7 Removing the film at cassette sensors
4.2.4 S60 - Cassette Door Closed

1. Open the Cassette door.
2. Remove the sensor using the procedure in Section 4.1.2.
4.2.5 S17 and S18 - Buffer Guide (Closed and Opened)

These opto-slotted sensors are fitted on the lefthand side of the Input assembly,
behind the drum casting.
1. Remove the drum end cap.
2. Disconnect the lead from the sensor.
3. Remove 1-off M3 screw holding the sensor to the bracket and replace the
sensor. See Section 4.1.2.

4. Check that the detect tab moves between the two sensor slots when film is
loading into the drum. (Film from the upper cassette should circulate around
the drum before the guide opens and film drops into the climatising buffer).
SENSOR (S17)
AND BRACKET
SENSOR (S18)
AND BRACKET
DETECT TAB
Figure 4.8 Removing the buffer guide sensors
4.2.6 S11 and S12 - Film at (Upper and Lower) Buffer

Guide
These sensors are fitted underneath feed guides (1 and 3), see Figure 4.5 (shown
as D and F).
S11 Replacement (Upper)
1. Remove feed guide (1) - see Section 4.1.4.
2. Remove and replace the sensor PCB using the method in Section 4.1.1.
3. Check that a film sheet loads into the drum from a cassette.

S12 Replacement (Lower)

1. Slide out the Horizontal tray to access the interior of the recorder. The sensor
is underneath feed guide (3) -a small hole on the guide indicates the location
of the sensor.
3. Check that a film strip loads into the drum from a cassette.
4.2.7 S40 - Film at Drum Input

This sensor is fitted underneath feed guide (A) on the lefthand side, see Figure 4.5
3. Check that a film sheet loads into the drum from a cassette.
4.2.8 Fast-Photo Power Detector

This is located underneath feed guide (1) on the lefthand side, see Figure 4.5.
(The FPD sensor is not a film handling sensor).
3. Check that the new sensor operates correctly using a DVM.
4.2.9 S16 and S58 - Punch (Up and Down)

These sensors are removed as part of the punch motor bracket assembly that
includes the motor/gear, cam and punch sensors. For this replacement procedure,
two people will make the task easier.
1. Pull out the Horizontal tray from the recorder and move it to one side.
2. From the lefthand side, detach the punch motor bracket by removing the 2-off
screw fixings (Allen key No 4) holding the bracket to the punch, and the 1-off
actuator fixing screw. See Figure 4.9.
3. Remove the complete bracket assembly from the front.
4. Replace the sensors.
5. Refit the entire assembly by first locating the bracket from the front, and
securing it to the punch from the side. Use long Allen keys, where necessary.

SCREW FIXING
PUNCH (2 OFF)
SHAFT
PUNCH MOTOR
BRACKET
ACTUATOR FIXING
ACTUATOR ARM
CUTTER
MOTOR
GUILLOTINE-TO-PUNCH
FIXING SCREW
Figure 4.9 Removing the punch sensors and motor bracket
4.2.10 S19 and S20 - Cutter at (Right and Left)

The cutter and sensors are removed and replaced as part of a new guillotine
assembly. To remove the guillotine, see Section 4.3.7.
4.2.11 S69 - Film in Punch

This sensor is fitted to the punch assembly at the rear of the well holding the
Horizontal Output tray.
1. Pull out the Horizontal Output tray from the recorder and move it to one side.

2. Reach inside the tray cavity and remove the sensor mounting bracket, 2-off
screws.
3. Replace the sensor PCB from its mounting bracket, see Section 4.1.1.
4.2.12 S30 - Chad Tray In

This micro-switch is fitted on the chad tray rail (lefthand side, front end).
1. Remove the tray and the 2-off Allen screws at each end holding the rail to the
drum.
2. Disconnect the lead from the sensor. The lead connector is located is
underneath the drum on the lefthand side. Remove the Horizontal tray.
3. Slide out the rail assembly from the righthand side.
4. Replace the sensor assembly and refit the rail.
5. Replace the tray.
CHAD TRAY
ALLEN BOLTS
Figure 4.10 Removing the chad tray in sensor

4.2.13 S49 - Film in Horizontal Tray 1

This sensor is located on the top input guide fitted to the Horizontal Output tray.
1. Pull out the Horizontal Output tray.
3. Load film and check that a sheet runs through the tray to the processor.

This sensor is located in front of the nip roller on Horizontal tray.

This sensor is located between the middle and the final roller on the Horizontal
tray.
1. Pull out the Horizontal Output tray and remove it from the slide rail.
2. Remove the sensor clip-on mounting from the tray, see Section 4.1.3.
4.2.16 S56 and S57 - Horizontal Nip (Open and Closed)

These sensors are located on the lefthand side of the Horizontal Output tray.
4.2.17 S66/S53/S54/S22 - Film in Vertical Output (1 to 4)

These sensors are fitted on the Vertical Output assembly using removeable clip-on
mountings, see Section 4.1.3. They are accessed from the lefthand side.
1. Remove the lefthand side drum end cap.

Sensors (1 to 2)
2. Remove the front cover on the PSU box and reach behind the drum casting. If
access proves impossible, then remove the Vertical Output assembly, see
Section 8.1.4.
Sensors (3 and 4)
3. Sensor 4 is accessed from the vertical output jam access lid. Sensor 3 can be
reached from above the drum casting,
5. Load film and check that a sheet runs through the Vertical Output to the
processor.

4.3 Replacing the Motors
When replacing brackets or motor devices, check for small locating lugs (i.e.
mechanical ‘pimples’) and make sure that they fit correctly into their inserts
before tightening any screw fixings.
Wire connectors on DC motors may not be marked +VE and -VE. Make sure
that the wire orientations are noted before disconnecting.
4.3.1 M01 and M02 - Cassette (Upper and Lower) and

Clutch
Cassette motors and clutches are fitted on the lefthand side of the Input assembly,
in line with the cassette feed rollers.
Upper Cassette
1. Remove the cover fom FHMB1 and disconnect the motor lead cable from
PL29.
2. Remove the 3-off M4 screws (shown in Figure 4.11 as 1 to 3) holding the
motor body to the motor mounting bracket.
1
A
B
CASSETTE
2 MOTOR
Figure 4.11 Removing the cassette motors

UPPER CASSETTE
ID SENSOR PCB
END PANEL
LOCATING
DIMPLE
REWIND WHEEL
GEAR CLUTCH
MOTOR MOUNTING
BRACKET
Figure 4.12 Removing the cassette sensor/motor assemblies
3. Withdraw the motor.

4. Remove the 15T gear from the motor shaft by loosening the 2-off M4
grubscrews with a 1.5 mm Allen key. Refit the gear to the new motor, taking
care to avoid slippage by applying a torque greater than 14 kg/cm.
5. Refit the motor and gear.
6. Install a cassette and load film into the drum. Make sure the motor can load
and rewind.

Lower Cassette
7. Remove FHMB (1) to access the motor, see Section 4.1.5.
8. Carry out Steps 1. to 6. above for replacing the motor.
4.3.1.1 Cassette Clutch (Upper and Lower)

See Figure 4.12.
9. Lower clutch only: Remove the FHMB (1) bracket, see Section 4.1.5.
10. Remove the 3-off M4 screws (shown as A to C on Figure 4.12) holding the
mounting bracket to the Input assembly and pull out the clutch.
11. When reinstalling the new clutch, ensure that the assembly is orientated the
correct way round and the spindle end locates into the plate recess. See
Figure 4.12.
4.3.2 M04 - Drum Input

This motor is located on the Input assembly, behind the lower cassette motor.
See Figure 4.13 and check the serial number of the machine.
1. Remove the lefthand drum end cap.
2. Early production machines (ML8-- - 190): access the motor by removing the
lefthand input cover, see Section 4.1.4.
DRUM INPUT
MOTOR
Figure 4.13 Removing the drum input motor

Later production machines (ML8-- - 190 onwards): access the motor by

removing the buffer guide sensor bracket, see Section 4.2.5, and extracting the
motor from between the drum casting and the Input assembly.
3. Disconnect the motor lead.
4. Access the lefthand side of the motor by removing the FHMB (1) bracket (see
Section 4.1.5) and the end panel (see Section 4.1.4).
5. Using a magnetic Philips screwdriver, remove the 3-off M3 screws holding the
motor to the Input assembly. Two holes in the casting allow easy access. See
Figure 4.13.
6. Withdraw the motor from the front.
7. Remove the 15T gear from the motor shaft by loosening the 2-off M4
grubscrews with a 1.5 mm Allen key. Refit the gear to the new motor, taking
care to avoid slippage by applying a torque greater than 14 kg/cm.
8. Refit the motor and gear.
9. Install a cassette and load film into the drum. Make sure film can load, reload
and rewind.
4.3.3 M03 - Buffer Guide

This motor is located on the lefthand side of the Input assembly, behind the drum
casting. See Figure 4.14.
1. Remove the lefthand drum end cap.
2. Remove the lower buffer guide sensor (see Section 4.2.6) bracket.
3. Remove the 2-off M3 screws holding the motor to the bracket (two holes in
the drum casting allow access to these screws).
4. Mark the location of the worm screw fitting on the motor shaft.
5. Remove the worm screw from the motor shaft by loosening the 2-off M4
grubscrews with a 1.5 mm Allen key. Refit the worm screw to the new motor,
taking care to avoid slippage by applying a torque greater than 14 kg/cm.
6. Install the upper cassette and load film into the drum and check that the buffer
guide operates correctly when film starts to reload.

WORM
SCREW
MOTOR AND
BRACKET
LOWER
SENSOR
Figure 4.14 Removing the input buffer motor
4.3.4 M18 - Horizontal Nip Roller

This motor is fitted to the lefthand end plate on the inside of the Horizontal
Output tray (see Figure 4.15).
1. Pull out the Horizontal Output tray and, if necessary, move it to a convenient
work surface. Note that lifting is a two-man operation.
2. Remove the sensor (S56 and S57) bracket by removing the 2-off M4 Philips
screws.
3. Disconnect the +ve and -ve leads to the motor (note the orientation).
4. Remove the 3-off M4 exterior screws holding the interior motor bracket to the
end plate.

NOTE: Cabling omitted for clarity

CAM AND TAB
(S56/S57)
(HORIZONTAL NIP ROLLER)

MOTOR BRACKET
NIP SPUR
ROLLER
(HORIZONTAL OUTPUT)
MOTOR BRACKET
SENSOR
BRACKET
SENSOR S57
SENSOR S56
GEAR
Figure 4.15 Removing the horizontal nip and output motors
5. Carefully turn the motor and bracket assembly anti-clockwise and push it back
through the hole to extract it from the end plate.
6. Detach the motor from the bracket by removing the 2-off M3 screws.

7. Replacement is the reverse of the removal. Note the location of the lug inserts
when replacing the bracket.
4.3.5 M10 - Horizontal Film Output

This motor is located on the interior of the Horizontal Output tray end plate (see
Figure 4.15).
1. Pull out the Horizontal Output tray and, if necessary, move it to a convenient
work surface. Note that lifting is a two-man operation.
2. Remove the 2-off M4 exterior screws holding the motor bracket to the end
plate.
3. Pull out the bracket with the motor and gear.
4. Remove the 4-off M4 screws holding the motor to the bracket.
5. Remove the gear from the motor shaft by loosening the 2-off grubscrews with
a M2 Allen key. Refit the gear to the new motor, taking care to avoid slippage
by applying a torque greater than 14 kg/cm.
4.3.6 M06 - Punch

This motor is located on the lefthand side of the recorder, underneath the drum.
See Figure 4.9.
1. Pull out the Horizontal Output tray from the recorder.
2. From the lefthand side, detach the punch motor bracket assembly by
removing:
a) 2-off bracket screw fixings (Allen key No 4)
b) 1-off screw fixing holding the actuator arm to the punch pivot bar (Allen
key).
3. Detach the connector lead to the punch motor from the front. Note the wire
orientation.
4. Remove the complete punch motor bracket assembly from the front (tray
well).
5. Replace the motor.
6. Refit the entire assembly by locating the assembly and actuator arm from the
front, and securing the bracket and arm from the side. Use long Allen keys to
attach the bracket.
4.3.7 M08 - Guillotine

The M08 motor is replaced as part of a new guillotine assembly, see Section 4.5.2.

4.3.8 M09 - Vertical Film Output

This motor is on the lefthand side of the recorder, behind the PSU box.
1. Remove the Vertical Distributor board connections and unclip any cables to
release the bracket/motor assembly. See Figure 3.28.
2. Remove the 2-off M4 bracket screws shown in Figure 4.16 and pull out the
bracket/motor assembly (including two spur gears).
3. Detach the motor from the bracket (4-off screws) and remove the gear. Fit the
old gear to the new motor shaft. Refit the gear to the new motor, taking care to
avoid slippage by applying a torque greater than 14 kg/cm.
BRACKET
FIXING
SCREW
SPUR GEAR
MOTOR
FIXING
SCREW
MOTOR
GEAR
MOTOR
BRACKET
VERTICAL
DISTRIBUTION
BOARD
BRACKET
FIXING
SCREW
Figure 4.16 Removing the vertical output motor

4.4 Replacing Cassette Assemblies
4.4.1 Cassette ID Label

1. Remove the old label and clean the recessed label area thoroughly with IPA.
2. Fit the new label, as shown in Figure 4.17
3
Figure 4.17 Fitting the cassette ID label
4.4.2 Nip Roller Wheel

See Figure 4.18.
1. Remove the two screw fixings either side of the white roller wheel and remove
the roller from its spring fixing.
4.4.3 Nip Roller Spring

See Figure 4.18.
1. Remove the 2-off M4 side screws at each end holding the shutter to the lid.
2. Remove the shutter from the lid.
3. Detach the spring plate by removing the 1-off M4 screw.

MANDREL
LATCHING SPRING
MECHANISM PLATE
NIP ROLLER
AND SPRING
SHUTTER
SHUTTER
FIXING
SCREWS
SPUR
GEAR
Figure 4.18 Cassette base and lid
4.4.4 Drive Dog Moulding

See Figure 4.19.
Lefthand Side Mandrel
1. Remove the M3 grubscrew at the mandrel stub end (with bearing, location
ring and mandrel drive gear). Remove the stub assemblies.
2. Remove the circlip, M 2.3 M grubscrew and the second circlip near the
location ring.
3. Slide out the complete drive dog moulding and replace.
Right-hand Side Mandrel
4. Remove the small 3M grubscrew at the mandrel stub end (with bearing and
location ring). Remove the stub assemblies.
5. Slide out the complete drive dog moulding and replace.
4.4.5 Mandrel Drive Gear

See Figure 4.19.

1. Carry out Section 4.4.4 (Step 1.).

2. Remove and replace the drive wheel as part of the stub assemblies.
4.4.6 Bearing Retainer

See Figure 4.19.
2. Remove and replace the retainer as part of the stub assemblies. Remove the
circlip
4.4.7 Location Ring

See Figure 4.19.
2. Remove the location ring.
4.4.8 Rewind Spur Gear

See Figure 4.18.
1. Remove the 2-off screws that attach the bracket to the base moulding, and
remove the bracket assembly.
2. The gear is detached by removing the circlip.
LOCATION
RING
MANDREL
DRIVE
GEAR
BEARING DRIVE
RETAINER SHAFT
METAL
COLLAR
DRIVE
DOG
MOULDING
STUB
GRUBSCREW
Figure 4.19 Mandrel assemblies

4.4.9 Mandrel Latch Assembly

See Figure 4.20.
For the purposes of removal, the mandrel latch assembly consists of a plunger, a
button, and a latch assembly.
1. Remove the top Allen screw attaching the latch to the cassette handle.
2. Pull off the latch button.
3. Remove the 2-off M4 screws underneath the latch assembly and pull the
assembly through the moulding cavity.
4. Replacing the assembly is the reverse of removal. Note that the M4 screw
fixing locations differ for the left- and righthand sides.
HANDLE
LATCH SUPPORT
BUTTON
LATCH
PLUNGER
RHS SCREW
FIXING
LHS VIEW
LHS SCREW
FIXING
RHS SCREW
FIXING
LHS SCREW
FIXING
Figure 4.20 Removing the mandrel latch assembly

4.4.10 Spring Plate

See Figure 4.18.
1. Remove the 2-off M4 screws holding the spring plate to the inside of the
cassette lid.
2. Replacing the assembly is the reverse of removal.
4.5 Replacing the Punch and Guillotine
The punch/guillotine assembly is removed as a single unit before they are

separated into sub-assemblies. See Section 4.5.3 for replacing the guillotine
without removing the punch.
PUNCH ASSEMBLY
PUNCH SHAFT
SENSOR (S19)
PUNCH MOTOR (MO6)
SENSOR (S58)
ACTUATOR
ARM BRACKET
GUILLOTINE CAM SENSOR (S16)
MOTOR (MO8)
GUILLOTINE ASSEMBLY
WIRE
PULLEY
CUTTER
SENSOR (S20)
Figure 4.21 Punch and guillotine assembly

4.5.1 Punch
The punch (with pins and dies) is replaced as an FRU after the motor bracket and
sensors S16, S58 and S69 have been removed. Note that two people are normally
required for this procedure, but it can be performed by one person with extra care.
Removing the Punch
1. Before powering off the recorder ensure the punch pins are engaged using
Main Diagnostics:
service/actuators/set M6 off
2. Completely remove the Horizontal tray from the recorder.
3. Remove the chad tray from the recorder.
4. Support the base of the punch/guillotine assembly with strong foam packing
material.
DRUM
GUILLOTINE
ALLEN BOLTS
PUNCH RIGHT-HAND END SHOWN
LEFT-HAND END SIMILAR
Figure 4.22 Removing the punch-to-drum bolts
5. Disconnect the Film in Punch sensor (S69) cable from FHMB (1), PL21 - see
Figure 3.20 for the location of PL21.

6. Disconnect the punch sensors (S16 and S58) cables from FHMB(1), PL9 -- see
Figure 3.20.
7. Disconnect the cable to the guillotine motor, which is a direct connection to
FHMB (2), PL20 - see Figure 3.21.
8. Check that the punch pins are IN. Manually turn the punch shaft, if necessary.
9. Remove the punch motor bracket using the procedure in Section 4.3.6.
10. From inside the tray cavity, remove the 2-off Allen bolts at each end that hold
the punch assembly to the drum, see Figure 4.22.
CAUTION
The drum is made of aluminium and is easily scratched.
11. Carefully lift up the punch/guillotine assembly and withdraw the assembly
from the service side.
Replacing the Punch
12. Locate the new punch in the drum.
13. Align the punch by locating the lipped ends of the punch to the drum edges.
There should be a gap between the punch and drum edge for the film to pass
through.
If this is a one-man operation, position some foam between the punch and
drum surface before inserting the 4-off drum fixing bolts.
14. Tighten the drum fixing bolts.
15. Continue the replacement procedure as the reverse of the removal procedure.
4.5.2 Guillotine
The guillotine is removed as a complete assembly that includes the motor, cutters
and sensors.
1. Remove the complete punch/guillotine assembly using the procedure 4.5.1.
2. Alternatively, disconnect the guillotine sensor (S19 and S20) connection to
FHMB (2) - see Section 4.5.1.
3. Disconnect the guillotine from the punch by removing the 1-off M4 screws at
each end, see Figure 4.9.
4. Slide out the guillotine from the lefthand side.

4.5.3 Replacing the Guillotine Only

This section is only to be used when the punch and guillotine assemblies are in
position within the recorder. The guillotine is removed as a complete assembly
that includes the motor, cutter and sensors.
See Figure 4.24.
1. Completely remove the Horizontal tray from the recorder.
2. From the punch, disconnect sensor (S69) connection to FHMB (1) and remove
sensor brackets and guillotine clamps.

GUILLOTINE
CLAMPS
SENSOR
BRACKETS
PUNCH
GUILLOTINE
SENSOR (S69)
MOTOR
MOTOR
CAM BRACKET
ACTUATOR
ARM
Figure 4.23 Removing the guillotine
3. Disconnect cables to guillotine sensors (S19 and S20) and guillotine motor
(MO8) at FHMB (2) from PL9 and PL20 respectively.

4. From the punch motor bracket, remove the rear lower M4 screw and tilt the
complete bracket assembly (including motor, cam and actuator arm) upwards
towards the rear of the machine.
5. Open the left-hand door fully. If this is not possible, remove it.
6. Remove the 1-off M4 screws at each end of the guillotine assembly to free it
from the punch assembly
7. Push right-hand end of guillotine in towards the centre of the machine, so that
the right-hand bracket is clear of casting.
8. Pull right-hand end of guillotine out towards the front of the machine.
9. Slide out the guillotine through the left-hand end of the casting. The left-hand
end of the guillotine may need to be raised slightly to clear the right-hand
bracket.
10. Replacement is the reverse of the removal.
4.6 Replacing the Fume Flap
When performing this procedure, note for any signs of chemical corrosion; if it
seems excessive, check that the recorder pressure fans and processor extraction
fans are operating correctly.
See Figure 4.24
The plastic fume flap inside the fume shutter assembly is replaced as follows:
1. Decouple the processor from the recorder, see Section 8.1.3.
2. Remove the rear vertical panel by removing the 6-off M4 screws on the
outside.
3. Remove the 3-off M4 screws at the top of the fume flap assembly to release
the assembly.
4. Using a posidrive, remove the 3-off screws that secure the two halves of the
fume flap assembly. This gives access to the plastic flap.
5. Make sure the new flap is clean before fitting.

FUME FLAP
FRAME
EM GUIDE
EXHAUST
FUME FLAP
FILM
TO PROCESSOR
BC GUIDE
EXHAUST
VIEW ON
ARROW A
REAR PANEL
OF RECORDER
Figure 4.24 Removing the fume flap


Optics Module 5
Replacements and
Setups
This chapter describes how to access and replace devices (sensors, motors, etc) for
the optics system and run the appropriate set of tests. Ensure any modifications and
replacements are entered in the Log Book.
Make sure the recorder is powered off but still connected to the AC mains source to
maintain Earth/Ground continuity.
5.1 Replacing Module Devices
CAUTION
Some of the components in the Optics module are marked with
red paint. Do NOT interfere with them, otherwise critical
optical components will become misaligned.
Do not touch any optical surfaces such as mirrors and lenses.
When the lid of the Optics module is removed, take great care
not to drop anything (including screws) inside the module.
The Optics module assembly is optically aligned with other optical mechanisms
on the recorder at manufacture and should not be removed or adjusted as part of a
service procedure. If the Optics module has to be replaced, specialist knowledge
and tools are required to align the module with external mechanisms, such as the
spinner.

Optics Module Replacements and Setups
5.1.1 Sensors
There are six sensors on the module S1 to S6:
• S1 - Neutral Density Filter position.
• S2 - Focus lens position #1.
• S3 - Focus lens position #2.
• S4 - Not fitted.
• S5 - Aperture position.
• S6 - Slow Power Detector position.
Except for sensor S1, an optical setup is not normally required for the module
sensors; in the case of S1 you need to ensure that the beam coincidence is within
the specified limit.
Figure 5.1 shows the location of each sensor in the Optics module.
S1
S2,S3
S5
S6 (INSIDE)
Figure 5.1 Location of Optics module sensors
All sensors in the Optics module are opto-reflective and are identical. Except for
sensor S6, the procedure for the removal of each sensor is identical.
1. Disconnect the 3-wire connector to the sensor.
2. Using a 3 mm Allen key, unscrew and remove the Allen screw securing the
sensor to its mounting point.

Note: Note that the allen screw for sensor S3 is difficult to access and requires a
right-angled allen key to unscrew it.
3. Fitting the new sensor is the reverse of the above.
4. If S1 has been replaced, then run the beam_coincidence check from the
test/optics menu in Main Diagnostics.
5.1.1.1 Sensor S6 (Slow Power Detector)

The slow speed power detector assembly comprises a PCB, motor and lens
housed within a protective enclosure mounted externally to the Optics module.
For this procedure, the PCB, motor and lens assembly is called the detector
assembly.
1. Disconnect the intermediate 3-wire connector to the sensor. Do not attempt to
disconnect the connector at the sensor.
2. Unscrew and remove the 4-off screws securing the cover to the enclosure, see
Figure 5.2.
ENCLOSURE COVER
CROSS-HEAD
SCREWS
Figure 5.2 Opening the slow speed power detector enclosure
3. Remove the cover.

4. Remove the 3-off Allen screws securing the detector assembly mounting
bracket to the inside of the enclosure, see Figure 5.3.

ALLEN SCREWS
(3-OFF)
Figure 5.3 Location of detector assembly securing screws
5. Carefully remove the detector assembly, taking care to avoid touching the
mirror (M1) in the enclosure.
6. Using a 3 mm Allen key, unscrew and remove the Allen screw securing the
sensor to its mounting point.
7. Fitting the new sensor and refitting the Detector assembly is the reverse of the
above.
8. Run flin_pow from the Service menu in Main Diagnostics, see Section
10.3.7.3, to check if the sensor is operating.
9. Visually check that the detector PCB and lens assembly moves into the light
path so that the detector on the PCB is approximately in the centre of the light
path.
5.1.2 Motors
There are four stepper motors, SM1 to SM4 (see Figure 5.4):
• SM1 - Neutral Density Filter motor.
• SM2 - Focus lens motor.
• SM3 - Aperture lens motor.
• SM4 - Slow speed power detector motor.
Each motor is secured to a mounting bracket. The mounting bracket must be
removed with the motor attached.

After replacing an optics motor, run the appropriate motor tests described in
Section 10.3.7.2.
SM1
SM2
SM3
SM4
(INSIDE)
Figure 5.4 Location of Optics module motors
5.1.2.1 Motor SM1 (Neutral Density Filter)

1. Disconnect the cable connector to the motor.
2. Using a 3 mm Allen key, unscrew and remove the 3-off Allen screws securing
the motor bracket to its mounting point: two screws at the top and one screw at
the bottom, accessed through a hole in the bracket, (see Figure 5.5).
Note: The motor shaft is fixed to a gear wheel.
3. Remove the bracket and attached motor, taking care to allow the gear wheel to
pass through the hole provided in the metal work.
4. Remove the 4-off screws securing the motor to the bracket and remove the
motor.
5. Fit the new motor to the original bracket.
6. Fitting the new motor is the reverse of the above procedure.
A set-up or calibration procedure is not required for this motor change.

SM1 MOTOR
Figure 5.5 Location of SM1 motor to bracket securing screws
5.1.2.2 Motor SM2 (Focus)

1. Remove the 3-off screws securing the cover of the focus assembly, and
remove the cover.
2. Remove the 2-off screws securing the cover of the focus motor SM2 and
remove the cover.
3. Disconnect the cable connector to the motor.
4. Using a 3 mm Allen key, unscrew and remove the 3-off Allen keys securing
the motor bracket, see Figure 5.6.
Note: The motor shaft is fixed to a gear wheel.
5. Remove the bracket and attached motor, taking care to allow the gear wheel to
pass through the hole provided in the metal work.
6. Unscrew and remove the four round cross-head screws securing the motor to
the bracket and remove the motor with its gear attached.
9. Run a focus test to confirm that the focus positions are correct, see Section
10.2.3.7.

SM2
MOTOR
ENTRY LIGHT
PATH COVER
Figure 5.6 Location of SM2 motor to bracket securing screws
5.1.2.3 Motor SM3 (Aperture)

1. Disconnect the cable connector to the motor and feed it through the plastic
cable clip.
2. Disconnect the connector to the aperture position sensor, S5.
3. Using a cross-head screwdriver, unscrew and remove the 4-off screws
securing the Aperture assembly base plate.
4. Remove the Aperture base plate from the Optics module.
5. Remove the single screw securing the drive-belt pulley bracket located at the
opposite end from the motor, shown in Figure 5.7.
6. Slacken and remove the drive-belt from the motor pulley.
7. Remove the spring from the motor bracket.
8. Remove the 4-off screws securing the bottom of the motor bracket to the base
plate.
9. Remove the bracket and motor attached.
10. Remove the 2-off screws securing the SM3 motor to the bracket and lift out
the motor.

SPRING
SM3 MOTOR
WIRE
BELT
SENSOR
S2
BASEPLATE
SCREWS (4-OFF)
A
Figure 5.7 Location of SM3 drive-belt pulley bracket securing screw
5.1.2.4 Motor SM4 (Slow Power Detector)

1. Use the procedure in Section 5.1.1.1 to remove the slow speed power detector
assembly.
2. Using a 3 mm Allen key, remove the 3-off Allen screws securing the motor to
its bracket.
4. Fitting the new motor and refitting the detector assembly is the reverse of the
above.
5. Visually check that the detector PCB and lens assembly moves into the light
path so that the detector on the PCB is approximately in the centre of the light
path.
6. Run flin_pow from the Service menu in Main Diagnostics, or use a power
meter and check that the level is approximately 300 µW (1024 on the meter) at
the detector.

5.1.3 Laser Diode

1. Before switching off the recorder, enter the NVRAM set-up values supplied
with the new laser diode module using the following command in the Service
menu, see Section 10.3.7.3.
main>diagnostics/service/optics/laser/lcpd_params <LD> change
where <LD> represents the laser number being changed (1, 2 or 3)
Make sure the values from the data sheet are correctly entered into
NVRAM as either Hex or decimal figures. Do not read a Hex value and
enter it as decimal.
CAUTION
Laser diodes are static-sensitive. Wear an Earth strap
connected to the Optics module casing before disconnecting
their connectors on the SOMB or ULMB. See Section 2.7.1.
2. If replacing LD2, disconnect connector PL9 from the SOMB. If replacing

LD1, disconnect PL1 from the ULMB. If replacing LD3, disconnect PL2 from
the ULMB.
3. Insert a terminator into the disconnected ribbon cable connector to prevent
static damage to the diode.
4. Using a 3 mm Allen key, unscrew the 3-off captive Allen screws securing the
laser diode module to the mount castings on the base of the Optics module. Do
not touch the screws marked with red paint.
5. Remove the laser diode module.
6. Place the new laser diode module onto the mounts and position the module as
shown in Figure 5.8.
7. Insert the Allen screws but do not tighten them.
8. Using your finger, push on the base of the laser diode module at the corner
(furthest from the three alignment posts) to ensure the two sides of the laser
diode module are hard against the three alignment posts, then tighten the three
Allen screws.
9. Remove the terminator from its connector and connect the laser diode module
header cable to the SOMB or ULMB as appropriate. Note that the header
cables for laser diodes LD2 and LD3 route through slots in the side of the
Optics module casing.
10. Switch on the new laser beam and check for generated light using the
following command (see Section 10.3.7.3):
main>diagnostics/service/optics/lasers/lenable

3mm ALLEN
KEY
LASER DIODE
ASSEMBLY
1
CONNECT
RIBBON CABLE
AT ULMB
3
2
ALIGNMENT
POSTS (3-OFF)
Figure 5.8 Positioning a laser diode module
11. Check/measure the laser diode bias and set/check the NVRAM maximum
power parameters.
12. Run flin_pow and beam_co, see Section 10.3.7.3.
If the machine has a single laser then run LD2_power_set.
13. If replacing LD2, generate a focus strip.
14. Output a Test image using the Tools menu on the recorder MMI. Examine the
quality of the dots in the tint areas.
5.1.4 Position Detector Board (POD)

Always make sure that the POD needs replacing before starting this
procedure. Once the POD has been removed, all the beam alignment
references are lost.
The Position Detector board FRU is supplied as a module mounted to a metal
plate by four stand-offs to maintain optical alignment set at the factory. Do not
separate the Position Detector board from its mounting plate otherwise its
optical alignment will be destroyed.
1. Disconnect the cable connector from the Position Detector board.

2. Using a 3 mm Allen key, unscrew and remove the 2-off captive Allen screws
securing the Position Detector module to two mount castings on the base of
the Optics module.
3. Remove the old POD module.
4. Place the new POD module onto the two mount castings and position the
module as shown in Figure 5.9.
POSITION DETECTOR
BOARD ASSEMBLY
POSITION
DETECTOR
CABLE
CONNECTOR
ALIGNMENT
POSTS (2-OFF)
Figure 5.9 Positioning the POD module
5. Insert the screws but do not tighten them.

6. Using your finger, push at the base of the POD module at the corner furthest
from the two alignment posts to ensure the three sides of the POD module are
hard against the three alignment posts, then tighten the three Allen screws.
7. Check the position of LD2 beam on the POD.
8. Run the test, beam_co, described Section 10.3.7.2; if there is still a problem
then consult Customer Services.
5.1.5 AOD Module

1. Disconnect the two SMB cables from the AOD module to be replaced.
2. Using a 3 mm Allen key, unscrew the three captive Allen screws securing the
AOD module to the optics module mount castings. Note that one of these
screws is accessed through a hole in the AOD module cover.
3. Remove the AOD module.

4. Place the new AOD module onto the mounts and position the module as
SMB
CABLE
SMB
CABLE
AOD
MODULE
ALIGNMENT 2
POSTS (3-OFF)
Figure 5.10 Positioning an AOD module
5. Insert the screws but do not tighten them.

6. Using your finger, push on the base of the AOD module at the corner furthest
from the three posts to ensure the two sides of the AOD module are hard
against the three alignment posts, then tighten the three Allen screws.
7. Connect the SMB cables to the new AOD module.
8. Run the test, flin_pow.
9. Run the test, beam_co.
10. Complete the optics set_up tests in Section 5.3.

5.2 Setting Up the Optics
5.2.1 Introducing the Test Macros

From the Main Diagnostics menu (mmi_optics) you can generate and expose a
range of stepped test strip patterns to verify the alignments and operational
settings of the various optical devices. Test strips, generated as macros from a
Main Entry screen (see Figure 5.12), are divided into two types:
• Manual: These produce and eject a single set of test strips on a single sheet
using default values that can be overridden.
• Automatic: These have test names prefixed with the term ‘auto’. Each auto test
produces and ejects sets of test strips on one or more sheets without control
from the operator. The default values for auto tests cannot be overridden.
The results of measurements on each test strip pattern determine optimum settings
from where you can enter new NVRAM data values.
Strip patterns are run from the following Test macros selected on the Main Entry
screen:
Wedge Density (Manual and Auto)
You can step through all the ND wedge settings for each resolution to find a
threshold level. Note that this facility is only used for test strip jobs.
Focus ((Manual and Auto)
Allows you to step through all the Focus lens settings for each resolution.
Aperture
You can step through all the Aperture settings for each resolution.
Deflect Absolute Phase (Manual and Auto)
Allows you to verify the NVRAM setting which controls the positions of beams 1
and 3 in relation to the rotational position of the spinner mirror - see NO TAG.
The aim is to make sure each laser beam lines up by synchronising each beam to
the spinner index.
Deflection Amplitude All (Manual and Auto)
For this test all four AODs (0, 1, 2 and 3) are adjusted by the same amount. The
Start Value is taken from the existing NVRAM value and the Step Value is taken
from the Main Entry screen. See Figure 5.11.
Auto Ladder
This test output allows you to measure and adjust the vertical scan registration
errors. Section NO TAG explains the adjustment procedure in more detail.
Co-incidence Beam 1/3 (Manual and Auto)
Beam Co-incidence is an attempt to align beams 1 and 3 so that they are parallel.
Deflection is turned off while AODs 0 and 1 increment for beam1 and AODs 2

and 3 increment for beam 3. The default Pattern Type and Lines setting should not
be adjusted.
Beam Balance
Produces strips at current NVRAM settings that allow you to check if the
densities are equal. If they are not then you can change the beam/power ratio from
the Final Values screen. You can select the number of beams; Start Values and
Step Values are ignored. Enter the Start Value as 200 and step down to 160.
Deflection Amp AOD 02/13 (Manual and Auto)
This test allows you to adjust deflection for AODs 0 and 2, and 1 and 3. For
instance, entering a Start Value and Step Value increments the strips for AODs 0
and 1 while keeping 1 and 3 at zero. See Figure 5.11.
AOD
0
LD1 BEAM 1
1
AMPLITUDE
LD2 BEAM 2 (REF)
AOD
2
LD3 BEAM 3
Figure 5.11 Beam adjustments
Full Film
Outputs the NVRAM value of the wedge, allowing you to select a pattern,
resolution. number of beams, etc, for the entire film area. The number of steps
gives the number of films exposed. This test is used for registration checks.
5.2.2 Selecting Options from a Main Entry Screen
5.2.2.1 Accessing Main Entry

There are four setup screens available: Main Entry, Final Values, Extra Options
and Machine Setup which are opened from an Engineering terminal window when
the following option is entered from the prompt (Main>):
main> diagnostics/service/optics/optics_mmi
5.2.2.2 Navigating Main Entry

Use the following keyboard strokes to select options from any one of the setup
screens:

• Up and Down-Arrow keys to move to each item field in a screen in a set order
left to right, top to bottom.
• Left and Right-Arrow to select from a list of options within a field.
• Return,Tab,Up or Down to exit from a field.
Note that the Final Values screen wraps around for ease of use.
All the operator controls for creating and exposing the strips are from the Main
Entry menu; there is no need to use the MMI display panel.
5.2.2.3 Main Entry Screen

This screen is used for generating sets of test strips, with each strip differing from
the previous one by an amount equal to the Step Value entered. See Figure 5.12.
From the Main Entry menu you can access three screens: Final Values, Extra
Options and Machine Setups by selecting Y and Return
Figure 5.12 Main Entry screen
5.2.2.4 Final Values Screen

This screen is used for for entering optimum values into NVRAM, see
Figure 5.13. On entering the program, the screen values shown are the current
values held on NVRAM.

Figure 5.13 Final Values screen
When the values have been modified and checked, select Y Return for Save and
Exit to write all the values on the screen to NVRAM and return to the Main Entry
screen. Selecting Y Return for Cancel will return you to the Main Entry screen
and leave the NVRAM parameters unchanged.
5.2.2.5 Machine Setup Screen

This shows the NVRAM parameters that are normally changed by the service
engineer.
Figure 5.14 Machine Setup screen

When the values have been modified and checked, select Y for ‘Save and Exit’ to
write all the values on the screen to NVRAM and return to the Main Entry screen.
Selecting Y for ‘Cancel’ will return you to the Main Entry screen and leave the
NVRAM parameters unchanged.
5.2.2.6 Extra Options Screen

This screen is used for accessing parameters not normally required to be changed
in the field, see Figure 5.15. It includes the options:
• Line Length: the height of the test strip in mm.
• Image Y Offset: the Y offset from the Base Offset in mm.
• Strip Gap: distance between test strips in mm.
• Eject Length: the amount of media ejected
• Scan Start X Pos: the default position for the Start Scan. It has nor effect on the
first expose.
Figure 5.15 Extra Options screen
5.2.2.7 Selecting Options from Main Entry
Test Macro
This allows you to select the test program from the list in Section 5.2.1.
Set Defaults
Initially sets all the menu options to their default test values. For manual patterns
you can override any of these values from the keyboard; for automatic patterns,
the value cannot be overridden.

Scan Start Position

Sets the distance in millimetres from the edge of the film to the start of the first
test strip along the slow scan axis (see Figure 5.16).
Strip Width
Sets the width of each test strip in millimetres.
Start Value
The start number for any optical device (stepper motor, deflector, etc) which
determines the physical position of the neutral density wedge or focus lens from
the home position. The home position is designated as 0, (see Figure 5.16).
Step Value
The number which determines the incremental change in the position from the
Start value for a motor, deflection, etc (see Figure 5.16).
Number of Steps
This is the number of positions that the neutral density wedge or focus lens is
moved. A test strip is exposed at each position (see Figure 5.16).
START
STEP NUMBER*
VALUE*
(NOT EXPOSED)
100 105 110 115 120 125 130 135 140 145 150 155
SCAN
START 2 mm 8 mm
POSITION* (mm)
0 1 2 3 4 5 6 7 8 9 10 11
STEP VALUE = 5
NUMBER OF STEPS = 12
Figure 5.16 Explanation of test strip set-up terms
Note: * These values are not intended to be typical values. They are for example
purposes only.

Resolution
Select a resolution: 48, 72, 96 and 144 l/mm.
Pattern Type
Select a pattern type: Vertical, Horizontal, Grid, Dots, Static Align and Black.
Lines
The line pattern generated can be from 17 different selections (including
BLACK):
1 ON to 15 OFF
15 ON to 1 OFF.
Beam (1/2/3)
Decide which laser beams are ON or OFF for the test.
Traverse
Set the speed of the traverse: Full, 2/3, 1/3 and Slow.
Use ND Threshold
Selecting Y to this option forces the exposure to use the Threshold ND Wedge
positions specified in the Final Values screen. This is useful where the expose
density would obscure the information being examined.
Use the threshold wedge to set up a Black output on film that shows as a fine trace
Start Scan
Selecting Y starts the scan.
Media Eject
Choose whether to eject film to the processor after the scan. Eject operations are
normally completed from this menu to ensure the Scan Start position is
maintained. Note that the Full Film macro automatically ejects test film om
completion.
Extra Options
Selecting Y opens the Extra Options screen, see Figure 5.15.

Final Values
Selecting Y opens the Final Values screen, see Figure 5.13.
Machine Setup
Selecting Y opens the Machine Setup screen, see Figure 5.14.
Run Beam-co(incidence)
Runs an automatic procedure which aligns the beam. Normally, this feature is not
required while using the setup program, and automatically turned on after exiting
from the program.
Exit
Choose this option to exit from the program after the scan.

5.3 Optics Setup Procedures
These procedures are based on the optics setups completed during manufacture.
Tests are run from the ‘optics_mmi’ menu using fully-automatic or manual mode
macros.
These tests should be completed when replacing a laser diode or an AOD, or
when upgrading the machine. Setting wedge values and focus tests should be
completed during the installation of the Luxel F-9000 machine.
5.3.1 Setting Wedge Values

This procedure allows you to verify the NVRAM setting for the ND Wedge
density to ensure that it moves to the optimum position to give the correct Dmax
and threshold value appropriate to the film type. These NVRAM values for
neutral density are used to expose all engineering test patterns.
1. Select the Auto Wedge Density routine from Test Macro.
2. Select Set Defaults.
3. The test starts running from 48 resolution. Start values are as follows:
a) 90 for 48 resolution
b) 95 for 72 resolution
c) 75 for 96 resolution
d) 60 for 144 resolution.
4. These tests use the following settings: Step Value 5, Number of Steps 12,
Vertical Lines, Black, Beam 2 and 1 Beam Speed.
5. Set Start Scan to Yes.
6. When imaging has finished the image will automatically eject.
7. From each set of strips choose the wedge values for full density and threshold
appropriate to the media used. Approximately 5.1 ND for high gamma film
and 4.2 for rapid access film. Threshold is generally 20 steps below ND
values. Enter these values into their relevant positions in the MMI Final
Values screen.

DMAX POINT
LASER POWER
DENSITY
THRESHOLD
POINT
WEDGE
POSITION
TEST STRIPS
FIRST TEST
STRIP 0
Figure 5.17 Relationship between film characteristic and test strip density
5.3.2 Check Focus Values

This allows you to verify the NVRAM setting for the focus lens L10 so that it
moves to the optimum focus position for each resolution.
Note: The MMI will add 30 steps to all the full density wedge positions for both
auto and manual tests. This helps when choosing the correct focus
position. The value is then returned to the normal figure when the Auto
Focus macro is complete.
1. Select the Auto Focus routine from the test macros.
2. Select Set Default.
3. This will change the Start Value to 0, Step Value to 200, Number of Steps
to 11 and Resolution to 48.
4. These tests use the following settings: Vertical Lines, 1 ON/ 1 OFF, Beam 2
and 1 Beam Speed.


6. The macro will run first for 48 resolution and repeat for 72 and 96 resolutions.
8. From each set of strips choose focus values for each resolution, see
Figure 5.18. Enter these values into their relevant positions in the MMI Final
Values screen.
If focus is obtained using 0.004 inch film, add 200 for 0.007 inch.
If focus is obtained using 0.007 inch film, subtract 200 for 0.004 inch.
ËËË
ËËË
ËËË
ËËË
ËËË
TEST STRIPS
FIRST TEST
STRIP 0
BEST FOCUS
Figure 5.18 Selecting best focus test strip
5.3.3 Setting Beam Balance

Beam balance setting is only carried out to assist visual film checks by the service
engineer. They do not affect customer’s expose jobs.
A beam balance macro allows you to check if the densities for each beam are
equal. Where they are unequal by more than ±1% then change the beam/power
ratio from the Final Values screen.
1. Output a set of three test strips representing each beam with the beam balance
macro, see Figure 5.19.
2. Using a densitometer, measure the dot% value of each test strip.

3. Select a beam strip with the lowest reference dot% and enter its value in the
Final Values screen as 200 (where the software power ratio of 200 is the
equivalent of 100% of available power).
4. Enter the other two beam dot% results as corresponding 200–(Difference x 2)
values; for instance in Figure 5.19, Beam 2 is 65% so enter 180 and Beam 3 is
60% so enter 190.
BEAM 1 BEAM 2 BEAM 3

EXAMPLE
55% 65% 60% DOT % READINGS
BEAM 1=200 BEAM 2= BEAM 3=

200–(10x2)=180 200–(5x2)=190
Figure 5.19 Setting beam balance
5.3.4 Setting Coincidence Values

Note: This procedure is only required for a multi-beam machine.
1. Select Auto Coincidence routine from Test Macro.
3. This will change the Start Value to –0.1, Step Value to 0.02, Number of
Steps to 11 and Resolution to 48.
4. Select and run Run Beam-co.
5. These tests use the following settings: Vertical Lines, 1 ON/1 OFF, Beams 1
and 2 followed by Beams 2 and 3 (for a 3-beam machine), 1 Beam Speed
and Threshold Density.
7. The macro will run first for 48 resolution and repeat for 72 and 96 resolutions.
9. From each set of strips choose the coincidence values for each AOD at each
resolution as follows:
a) Measure 860 mm from the image start position (punch end) and draw a
line across all the strips, then draw another line at 370 mm.
b) Using a microscope, choose the strips with the most evenly spaced lines at
370 and 860 mm. See also Table 5.1.
c) See Section 5.3.8 for supplementary notes on film coincidence.

10. Enter these values into their relevant positions in the MMI Final Values
screen.
Table 5.1 Auto Coincidence set of strips
Set Resolution 370 mm Line 860 mm Line

1 48 AOD0 AOD1
2 48 AOD2 AOD3
3 72 AOD0 AOD1
4 72 AOD2 AOD3
5 96 AOD0 AOD1
6 96 AOD2 AOD3
5.3.5 Setting Absolute Phase Values

It allows you to verify the NVRAM setting which controls the positions of beams
1 and 3 in relation to the rotational position of the spinner mirror as shown in
Figure 5.20. The aim is to make sure each laser beam lines up with each other by
synchronising each beam to the spinner index.
Angle 3
3 2 1 2
of error
1
Correct Phase Incorrect Phase
Figure 5.20 Absolute phase error on beam dots 1, 2 and 3 (3-laser version)
For a single beam machine the Absolute Value is set to the default of 0.
1. Select the Auto Abs Phase routine from Test Macro.
3. This will change the Start Value to 1820, Step Value to 10, Number of
Steps to 20 (this will step from 1820 to 90, where 1920 = 90) and Resolution
to 72.
4. These tests use the following settings: Horizontal Lines, 1 ON/ 15 OFF, All
Beams, 2 or 3 Beam Speed as appropriate.
7. Choose the best Absolute phase value. This is when the horizontal line viewed
through a microscope is straight and not “saw-toothed”, see Figure 5.21.
8. Enter this value into its relevant position in the Final Values screen.

TOP TOP TOP
BOTTOM BOTTOM BOTTOM
FIRST TEST STRIP CORRECT PHASE
Figure 5.21 Selecting correct absolute phase test strip
The absolute phase will change between the first and last test strips. Examples
of how the phase can change are shown in Figure 5.22.
1 1
3 2 3 2
3
2 2 3
1 1
Figure 5.22 Examples of absolute phase errors (3 beam system)
It is theoretically possible for beams to have the correct absolute phase but are
180° out of phase so that they are positioned as 2 and 1 (2-laser version) or 3, 2, 1
(3-laser version) instead of 1 and 2 or 1, 2, 3. This is very unlikely to happen.
However, you can check for this by repeating the above procedure with Pattern
Type set to Vertical Lines and Lines set to 8 ON 8 OFF. If the beams are 180° out
of phase, a single white line will appear in each set of 8 on black lines.
5.3.6 Setting Deflection Amplitude Values

1. Select Auto Amp Beam 1 routine from the test macros.

3. This will change the Start Value to 0.94, Step Value to 0.02, Number of
4. Select and run Run Beam_co.
5. These tests use the following settings: Vertical Lines, Black, Beams 1 and 2,
2 Beam Speed and Threshold Density.
7. The tests will automatically run for 48 resolution and repeat for 72 and 96
resolutions.
9. For a 3-beam machine, select Auto Amp Beam 3 routine from the test macro.
11. Select and run Run Beam–co.
12. These tests use the following settings: Vertical Lines, Black, Beams 2 and 3,
14. The tests will automatically run for 48 resolution and repeat for 72 and 96
resolutions.
16. To choose the best Deflection Amplitude value on film, complete the
following:
line across all the strips.
b) Draw another line at 815 mm.
c) Using a microscope, choose the strips with the most evenly spaced lines at
415 mm and 815 mm. See also Table 5.2 and Table 5.3.
d) See Section 5.3.8 for supplementary notes on film deflection amplitude.
17. Enter these values into their relevant positions in the Final Values screen.
Table 5.2 Auto Amp beam 1

1 48 AOD0 N/A
2 48 N/A AOD1
3 72 AOD0 N/A
4 72 N/A AOD1
5 96 AOD0 N/A
6 96 N/A AOD1

Table 5.3 Auto Amp beam 3

1 48 AOD2 N/A
2 48 N/A AOD3
3 72 AOD2 N/A
4 72 N/A AOD3
5 96 AOD2 N/A
6 96 N/A AOD3
5.3.7 Setting Deflection Amplitude All Values

Note: This test verifies the 3-beam setup. Further adjustments is not normally
necessary.
1. Select Auto Amp All as the Test Macros.
3. This will change the Start Value to 0.0, Step Value to 0.01, Number of
4. Select and run Run Beam-co.
5. These tests use the following settings: Vertical Lines, Black, All Beams, 2 or
7. The tests automatically run for 48 resolution and repeat for 72 and 96
resolutions.
8. When imaging has finished the image automatically ejects.
9. This test pattern increments the amplitude values for each AOD by the same
amount. To choose the value on film:
line across all the strips.
b) Draw another line at 815 mm.
c) Using a microscope, choose the strips with the most evenly spaced lines
ate 415 mm and 815 mm. This should occur at the first or second strip.
d) Add the chosen value to all AOD Amplitude fields on the Final Values
screen.
e) If the evenness is different around the drum by more than two strips then
the coincidence should be rechecked and Deflection Amplitude run again.
f) See Section 5.3.8 for supplementary notes on film deflection amplitude.

5.3.8 Optics Setups: Supplementary Notes

Note: These notes provide further descriptions about the optics set-up
procedures.
In order to see coincidence on film, first use the MMI to set the values for offset
and deflection amplitude at 0 for all AODs. Coincidence tests are done using
threshold density:
Lines at 1 on and 1 off; Pattern Type at Vertical Lines; Beam 2 and either Beam
1 or 3 at 1/3 Traverse Speed.
Refer to Figure 5.23 where:
• Diagram A shows a normal deflected scan with beams 1 and 3 taking up their
normal positions.
• Diagram B shows that with the deflection set to zero beams 1 and 3 should
occupy the same position as beam 2, if these beams are coincident.
• Diagram C shows that with the traverse set at 1/3 speed, and using the
coincidence test, beams 1 (or 3) and 2 appear to be next to each other on film,
although optically they are on top of each other.

A 1 ON 1 OFF VERTICAL LINES DEFLECTED B 1 ON 1 OFF VERTICAL LINES UN-DEFLECTED.

NOTE BEAM 1 TAKES UP THE SAME POSITION
1321321321321321321321 AS BEAM 2.
1321321321321321321321
C RUN AS B BUT AT 1/3 SPEED. D AS ACTUALLY SEEN ON FILM

SHOWN WITH DIFFERENT
LINE LENGTHS FOR CLARITY. 2 1 2 1 2 1
21212121
Figure 5.23 Coincidence test outputs
5.3.9 Coincidence 1 and 3 Tests - Static Coincidence

If the coincidence is not correct, the following offset procedure for adjusting the
centre frequencies of the AODs should be used.
1. There are 12 NVRAM locations for centre frequency offset corrections - 4 for
each AOD at each of the 3 resolutions (lo, mid and hi). These offsets are
initially set at zero. The NVRAM parameters can be accessed via the Final
Values screen.

2. Coincidence is run and the nominal centre frequencies are found and entered
into NVRAM. Test macros in the MMI allow you to step through all AODs
automatically. Steps will increment in 20 kHz values. The macros are:
• Coincidence 1 – Static coincidence AOD0 and AOD1 using Beams 1
and 2.
• Coincidence 3 – Static coincidence AOD2 and AOD3 using Beams 3
and 2.
3. Look at the defect on beam 1 or 3, and compare the defect with those shown in
Figure 5.24 (this example is for coincidence 1):
COINCIDENT BEAMS
212121
PERISCOPE END
860 mm
370 mm
EVEN AOD ODD AOD PUNCH END

ERRORS ERRORS
Figure 5.24 Coincidence 1 beam offset output (1)
4. Note that the defects are always symmetrical about the nominal position. Even
AODs 0 and 2 always produce a bow in the ideal line and Odd AODs 1 and 3
always produce a diagonal line about the nominal position. Defects in both
AODs will cause a combination of both to occur.
5. Lines should be drawn on the film at 370 mm and 860 mm up from the start of
image at the punch end.
6. To find the correct offset step for the Odd AOD, look at the 860 mm points.
Look for equal spacing between the lines. Note the offset value at the point
where the lines are equal.
7. Repeat for the Even AOD, but this time you should look at the 370 mm point.
An example is shown in Figure 5.25.

8. Enter the offset values into the following NVRAM parameters for each
resolution:
• Beam Offs : AOD 0 (x1)
• Beam Offs : AOD 1 (y1)
• Bean Offs : AOD 2 (x3)
• Beam Offs : AOD 3 (y3).
+0.02 0.0 –0.02 –0.04 MHz
860 mm
370 mm
START OF
IMAGE
REQUIRED OFFSET ODD AOD = –20 kHz

REQUIRED OFFSET EVEN AOD = 0.0 kHz
LINES AT 860 AND 370 mm
FOR COINCIDENCE
Figure 5.25 Beam Coincidence 1 offset output (2)
5.3.10 Setting the AOD Amplitudes

The gain of the AOD amplitudes is not exactly the same, therefore a setting
procedure is required. This will give 32 NVRAM locations for amplitude
corrections – 4 for each AOD at each of the 8 resolutions 48, 72, 96, 100 and 144,
1200, 1800 and 2400 dpi. These amplitudes are set to be initially at 1.1. The
NVRAM parameters can be accessed via the Final Values screen.
1. The MMI has 6 different Deflection Amplitude macros:
• Deflection Amp 0/2 for the Even AODs.

• Deflection Amp 1/3 for the Odd AODs.

• Deflection Amp ALL for all Odd and Even AODs.
• Auto Amp Beam 1 to set up Beam 1 even AOD and then odd AOD.
• Auto Amp Beam 3 to set up Beam 3 even and then odd AOD.
• Auto Amp All for Beam 1 even/odd then Beam 3 even/odd.
2. Run Deflection Amplitude AOD 0 and 2 as the first test This sets AODs 1
and 3 to an amplitude of 0.8 and adjusts AODs 0 and 2 only. The test runs at 2
beam speed, with either beam 1 and 2, or beam 3 and 2. It is run at each
resolution. Note that:
• When running with beam 1 and 2 this shows AOD 0 being incremented.
• When running with beam 2 and 3 this shows AOD 2 being incremented.
3. The next test is Deflection Amplitude AOD 1 and 3. This sets AODs 0 and 2
to an amplitude of 0.8 and adjusts AODs 1 and 3 only. The test runs at 2 beam
speed, with either beam 1 and 2 or beam 3 and 2. It is run at each resolution.
• When running with beam 1 and 2 this will show AOD 1 being
incremented
• When running with beam 2 and 3 this will show AOD 3 being
incremented
4. When the amplitude values for all four AODs are found on the four exposed
films, these values should be entered in the Final Values screen. Note that
these values are not yet final and are slightly too small, but they do include the
differentials of the amplitude gains.
5. An example of what the films should look like is shown in Figure 5.26 for
Deflection Amplitude 0 and 2 and 1 and 3. The films outputs will be similar to
the previous coincidence offset films. Odd AODs will affect the ends of the
scan lines, and Even AODs will affect the middle of the scan lines.
6. Lines should be drawn on the film at 415 mm for the Even AODs, and at 815
mm for the Odd AODs up from the start of image at the punch end.
7. To find the correct amplitude step for the Odd AOD, look at the 815 mm
points. Look for equal spacing between the lines. Note the amplitude value at
the point where the lines are equal. Repeat the Even AOD, but this time you
should look at the 415 mm points.
8. In Figure 5.26, the Odd AOD needs 0.92 Amplitude and the Even AOD needs
0.94 Amplitude. Note that these are microscope views of the lines produced.
9. Enter the offset values into the Final Values screen for the following NVRAM
parameters at each resolution:
• Beam Ampl : AOD 0 (X1)
• Beam Ampl : AOD 1 (Y1)
• Beam Ampl : AOD 2 (X3)
• Beam Ampl : AOD 3 (Y3).

1.02 0.98 0.94 0.9 MHz 1.02 0.98 0.94 0.9

1.04 1.0 0.96 0.92 1.04 1.0 0.96 0.92
815 mm
415 mm
15 mm
PUNCH END
EVEN ODD
AODs AODs
NOTE LINES AT 415 AND 815 mm FOR AMPLITUDE
Figure 5.26 Deflection amplitude AOD 0/2 and 1/3 outputs
10. Run the test Deflection Amplitude ALL. This runs with all available beams
at the appropriate traverse speed. The start value need not be entered, as the
value for each AOD is taken from the different values entered in the final
values NVRAM location. The increment value is very small, for example,
0.01MHz.
11. If all previous setups have been completed correctly, there should be no
further adjustment necessary. That is, the scan lines should be parallel and
evenly spaced at a the zero step.
12. Lines should be drawn on the film at 415 mm and at 815 mm up from the start
of image at the punch end.
13. To find the correct step, look at both the 415 mm and 815 mm points. Look for
equal spacing between the lines. Note the value at the point where the lines are
equal at both positions.
14. This time the correct step value should be added to all AOD amplitudes.
15. If the result is not the same for both Odd and Even AODs, the coincidence
should be checked again.
16. In the next example, see Figure 5.27, 0.01 should added to all NVRAM AOD
amplitude values for that resolution.

0.02 0 MHz
0.03 0.01
815 mm
415 mm
15 mm
PUNCH END
NOTE LINES AT 415 AND 815 mm FOR AMPLITUDE
Figure 5.27 Finding the Odd/Even AOD amplitude values

5.4 Film Registration Checks
Film registration errors can come from various sources, for instance, poor film
conformance to the drum, environmental instability, incorrect spinner mirror
angle or periscope misalignment. The possible mechanical causes are numerous,
but most of them should have been eliminated by accurate factory fabrication and
optical setups. Other problems can develop over time, and these may cause
misregistration errors that need to be periodically checked on a working machine
during a service visit.
This check is designed as a quick and reliable first-pass method for determining if
film registration is within the Luxel specification. If the check shows a
registration failure, caused by spinner-periscope axis misalignments, the test
procedure is continued so that a new setting for the periscope M2 mirror is
obtained.
Tools and equipment required:
• large light table - at least 1140 mm (45 in) x 1000 mm (39.5 in)
• x50 microscope (note that the view of lines seen under a microscope is a
reversed image)
• ruler
• sheet of rolled film used to smooth and flatten down film on the light table.
Follow the procedure below after ensuring that the machine has valid optics setup
NVRAM data:
1. Expose and process two films using the Full Film macro described in
Section 5.2.1 above. Set the following parameters:
• Test Macro: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Full Film
• Scan Start Posn: . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 mm
• Strip Width: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1122 mm
• Start Value: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0
• Stop Value: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0
• Number of Steps: . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
• Resolution: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
• Pattern Type: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Vertical Lines
• Lines: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 ON/1 OFF
• Beam 1: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . OFF
• Beam 2: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ON
• Beam 3: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . OFF
• Traverse: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

The image must be longer than 600 mm and exposed on maximum width film
(768 mm).
2. The film automatically ejects when completed. A second film is then exposed
and ejected.
3. The two exposed film strips are shown in Figure 5.28 below:
CORNER TOP TO
SCAN POINT TOP
CASSETTE CASSETTE
TOP FILM BOTTOM FILM

(EMULSION UP) (EMULSION UP)
PUNCH EMULSION TO EMULSION PUNCH
LEFT TO RIGHT
Figure 5.28 Two film outputs
4. Place one film on a light table with the emulsion side upwards. Flatten the
sheet with the film roll so that it is firmly fixed to the table.
5. Place the second sheet emulsion downwards, left over right, as shown in
Figure 5.28. Use the microscope to line up the two top corner scan points
exactly (cassette end of image).
6. Lightly smooth over the top sheet while still checking the corner point
alignments. Resulting from the interferometry effect are two typical error
fringe patterns (A and B) shown Figure 5.29. You need to check whether the
number of fringes indicate that the optics system is within the Luxel
specification by using the procedure in step 7.
800 mm 800 mm
ERROR FRINGE PATTERN A ERROR FRINGE PATTERN B
Figure 5.29 Two typical fringe patterns: Errors A and B

7. Count the horizontal fringes inside the 800 mm range: in Figure 5.29 it should
be 11 for Pattern A and 18 for Pattern B. Multiply the number of fringes by
10.4 microns to measure the registration error: For Error Pattern A it will be 11
x 10.4 microns = 114.4 microns, which is outside the specification of 50
microns.
8. If the check in step 7. reveals that the optics system is outside the
specification, then apply the procedure from step 9. to step 16.
9. Mark a line at a distance of 800 mm from the cassette (reference) end of the
image. The distances shown in Figure 5.30, for reference, from the clear line
at the top of the film are based on the maximum registration effect for each
M2 mirror screw adjustment, vertical and horizontal:
a) Vertical adjust: effects 260 mm (from the cassette end of the film).
b) Horizontal adjust: effects 660 mm (from the cassette end of the film).
Note: Note which side of the two films are from the periscope end.
10. Count the number of whole fringes inside the 800 mm distance. In the
example of a Pattern A type, shown in Figure 5.30, this is 13 and not 14. Now
use the method in step 11. to step 15. to determine the level of M2 mirror
adjustment.
CASSETTE END
REF LINE
VERTICAL
260 mm SCREW POSITION
FURTHER FROM
450 mm PERISCOPE
NULL LOOP
NEARER TO
PERISCOPE
660 mm HORIZONTAL
SCREW POSITION
800 mm
FULL WIDTH
FILM
PUNCH END
EMULSION UP LINES EMULSION DOWN

(SCRATCHED) LINES
Figure 5.30 Fringe type A expanded
11. Measure the distance of the null loop from the reference point. In Figure 5.30
this is revealed as 450 mm (which is the phase of the error). The fringe count
of 13 is the amplitude of the error.
12. Plot this position on the Periscope Screw Adjustment chart, see Figure 5.31,
showing the amount of the two M2 screw movements (vertical and horizontal)
required, but not the direction of turn.

13. Scratch the emulsion away from the bottom film at the null loop reference
point nearest the periscope end. See Figure 5.30. Try to avoid moving the two
film sheets.
14. Using a microscope, determine if the lines on the emulsion up film are nearer
or further from the periscope end (user side). In the example shown in
Figure 5.30, the lines are further from the periscope.
15. Follow the directions in Figure 5.31 for turning the appropriate screw.
1
QUADRANT B 300 mm 250 mm QUADRANT C
SEE NOTE B 350 mm 200 mm SEE NOTE C
400 mm 150 mm
0.8
100 mm
450 mm
0.6 50 mm
500 mm
0.0 mm
0.4 550 mm DISTANCE OF
NULL LOOP
FROM
600 mm CASSETTE
END
0.2
V ADJUST SETTING
V (turns)
650 mm
0
5
700 mm 10
0.2 15
20
750 mm
25
0.4 30
800 mm 35
40
0.6 45
850 mm
50
No. OF
900 mm FRINGES
0.8
950 mm
QUADRANT A
SEE NOTE A
1
H ADJUST
1.5 1 0.5 SETTING 0.5 1 1.5
0
H (turns)
NOTE A: EMULSION UP LINE NEARER TO PERISCOPE END - ADJUST V & H ANTI-CLOCKWISE

EMULSION UP LINE FURTHER FROM PERISCOPE END - ADJUST V & H CLOCKWISE
NOTE B: EMULSION UP LINE NEARER TO PERISCOPE END - ADJUST V CLOCKWISE AND H ANTI-CLOCKWISE
EMULSION UP LINE FURTHER FROM PERISCOPE END - ADJUST V ANTI-CLOCKWISE AND H CLOCKWISE
NOTE C: EMULSION UP LINE NEARER TO PERISCOPE END - ADJUST V & H CLOCKWISE

EMULSION UP LINE FURTHER FROM PERISCOPE END - ADJUST V & H ANTI-CLOCKWISE
Figure 5.31 Periscope Screw Adjustment chart

16. Adjust the M2 mirror settings shown in Figure 5.32. Mark the current screw
location with a pencil line to give a datum. Adjust the screw 1/5 of a turn to
equal 0.2 V or H on the Periscope Screw Adjustment chart.
17. Check whether the optics system is in within specification again by repeating
the registration check from step 1.
DATUM LINE DATUM LINE

(MARK IN PENCIL) (MARK IN PENCIL)
1
5 TURN
1
5 TURN ANTI
CLOCKWISE CLOCKWISE
HORIZ. = 0.2 ON CHART VERT . = 0.2 ON CHART
M2 SCREW ADJUSTMENT (2 OFF)
NOTE: THE M2 ADJUSTMENT SCREWS ARE

MARKED SO THAT 20 DIVISIONS = 1 TURN;
THEREFORE 1 DIVISION =0.05 OF A TURN
VERTICAL ADJUST
HORIZ ADJUST SCREW
SCREW
M2 MIRROR
ASSEMBLY
Figure 5.32 M2 mirror settings

5.5 Fast and Slow Scan Registration Adjustment
Note: These procedures are not normally used.
5.5.1 Vertical Registration Adjustment

Note: This procedure requires (1) a hardware modification before it can be run
and (2) an installed SSB at Issue 02 or later. It should not be relied upon to
improve machine specification. Refer to Fujifilm (UK) Customer Services.
Vertical Registration Adjustment for fast scan direction is two procedures (A) and
(B) normally carried out after one of the following units has been serviced:
• spinner
• traverse motor
• traverse carriage
• periscope mirror.
This procedure is only used for obtaining extra registration accuracy greater than
the specification of 60 µm.
5.5.1.1 Procedure (A) Adjustment

The procedure measures and averages three exposed auto ladder test strips to
determine the adjustment distance (in µm) for vertical registration. A new value is
then entered into the Vertical Adjustment tables for recalculation without the need
to reboot the machine.
1. From Main Diagnostics, open the Main Entry window (see Section 5.2.2):
Main> diagnostics/service/optics/optics_mmi
and make sure that the default cassette on the MMI is loaded with 1130 mm
full width film.
2. Select Yes for Machine Setup and Exit to obtain the Machine Setup screen (see
Figure 5.33):

Figure 5.33 Machine Setup screen
Note: The Test Results screen above only shows a set of typical values. These
values will differ for every machine.
3. Set the Enable Vertical Adjustment Registration Adjustment to No and Save
and Exit.
4. Select the Auto Ladder option from Main Entry, toggle Set Defaults to Yes,
and Start Scan to Yes. A test pattern is now imaged and processed
automatically.
5. Guillotine the film in two halves, and overlay strip X and Y,
(emulsion-to-emulsion) on a light table, see Figure 5.34.
CASSETTE END
CUT
PUNCH END
1 ON 1 OFF HORIZONTAL LINE (21 MICRON PITCH)

EMULSION
TO
EMULSION
Figure 5.34 Cutting and folding the auto ladder output
6. Using a microscope, adjust the two halves at one end of a test strip so that the
exposed lines (1 ON/1 OFF) overlap exactly, see Figure 5.35 (A).
7. At the other end of the strip, count the number of line spaces that extend from
the top or bottom half, see Figure 5.35 (B) and multiply this count by the pitch
of the exposed lines in microns (ie 21). In this example, the measurement is:
21 x 2.5 lines = 53 microns
8. Determine which half of the exposed sheet is longer, the punched side or the
cassette side using the formula:
Punch side is longer: registration error is plus
Punch side is shorter: registration error is minus
and prefix a positive or negative to the error measurement, for example, +53
microns.
9. Repeat steps 6 to 8 for the next two strips to obtain the average error
measurement which in this example is, for instance:
(+63 +84 +53)/3 = +67
Note that the range is +240 to –240 µm.

1
2 2.5 LINE SPACES x 21 = 53
MICRONS
B
A
LINE UP
CORNER
+ 63 + 84 + 53
Figure 5.35 Aligning exposed lines
10. Return to the Main Entry screen, open the Machine Setup screen and toggle
Enable Vertical Registration Adjustment to Yes.
11. Enter the new Vertical Registration Adjustment value for A, for instance,
67 µm in this example, toggle Recalculate Vertical Adjustment Tables to Yes,
and Save and Exit.
5.5.2 Procedure (B) Adjustment

Note: Procedure (B) requires application software levels V1.24 (or later) to be
installed.
This procedure measures and averages four separate Auto Ladder Comp strips to
determine the adjustment distance (in µm) for vertical registration. A new value
that includes phase is entered into the Vertical Adjustment tables for recalculation
without the need to reboot the machine.
1. Open the Main Entry menu screen.
2. Select Auto Ladder Comp from the main Entry menu, toggle the Set Defaults
to Yes and Start Scan to Yes. A test pattern is now imaged and processed
automatically.
3. Guillotine the film into three sections and, using a light table, overlay strips A
and D onto strips B and C respectively (emulsion–to–emulsion), see
Figure 5.36.

CASSETTE END
CUT
CUT
D
PUNCH END
1 ON 1 OFF HORIZONTAL LINE (21 MICRON PITCH)
Figure 5.36 Cut and fold the Auto ladder Comp output (Procedure B)
4. Using a microscope, adjust the two tests strips (A and B) so that the exposed
lines (1 ON/1OFF) overlap exactly, see Figure 5.37 (1).
5. At the other end of the strip, count the number of line spaces that extend from
the top or bottom half of strips A and B, see Figure 5.37 (2).
6. Multiply this count by the pitch of the exposed lines in microns (ie 21). In this
example, the measurement is:
21 x 2.5 lines = 53 microns
7. Repeat steps 4. and 6. above for the other two strips (D and C).

8. Determine which test strip is longer (A compared to B and D compared to C)

using the formula:
Strips A or D is longer: registration error is plus
Strips A or D is shorter: registration error is minus
and prefix a positive or negative to the error measurement, for example, +53
microns.
9. Obtain the average error measurement, which in this example is:
(+83 +53)/2 = +68
Note that the range is +60 to –60 µm
1
2 2.5 LINE SPACES x 21 = 53 MICRONS
(2)
LINE UP (1)
CORNER
A+B
+ 53
D+C
+ 83
LINE UP
CORNER
Figure 5.37 Aligning exposed lines (Procedure B)
10. Enter the new Vertical Registration Adjustment value for B, for instance,
68 µm, toggle Recalculate Vertical Adjustment Tables to Yes, and save and
exit.

Scan System 6
Replacements and
Setups
This chapter describes how to access, remove and re-install the field replaceable
units used for traverse scanning, and how to adjust the scan system setups. Removal
procedures are for the: traverse carriage assembly, baffle, fans, STB, traverse motor,
drive rail wiper, umbilical cable, spinner, ball cage and readhead.Setup procedures
include the ball cage and carriage alignment. Make sure any modifications and
replacements are entered in the Log Book.
6.1 Traverse Replacements
See Figure 6.1.

The traverse mechanisms are manufactured and assembled to a high level of
precision to ensure correct exposure registration over the long term. While
replacing a traverse part there is a risk that important mechanisms can be knocked
or dropped, and also of dust entering the recorder. Service engineers need to
handle traverse assemblies carefully and gently, while making sure that the
carriage and rails are kept clean. Complete all the cleaning procedures that are
included in this chapter.
CAUTION
Failure to follow the correct replacement procedures can
cause exposure errors.
As a final task, at the end of each one of these procedures, return the carriage to
the rail and make sure that the ball cage and carriage are aligned correctly at each
end, see Section 6.1.11.

6-2
BAFFLE
ASSEMBLY FAN
BAFFLE AND STB

Scan System Replacements and Setups
MOUNTING BRACKET
STB READHEAD
FELT
PAD
FLYWHEEL
CLAMP
SPINNER
BALL
FAN CAGE
FLYWHEEL
MOTOR
ASSEMBLY
Figure 6.1 Traverse carriage assemblies - general view

CARRIAGE UMBILICAL
CASTING HANGER
UMBILICAL

6.1.1 Traverse Carriage Removal

Depending on the assembly to be removed, you can either:
· Move the carriage to the end of the service extenders (to replace the spinner and
wipers only).
· Remove the complete carriage from the service extenders (to replace the
traverse motor, STB, baffle, readhead, fans and ball cage).
Use the following method to remove the carriage:
1. Open the lefthand side pod door to access the traverse carriage. The carriage
can be gently pulled by hand along the rail towards the left-hand side.
2. Slacken the single M6 cheesehead screw holding the end stop and remove the
stop bracket, see Figure 6.2
3. Fit the two extenders (V-groove and flat) to the end of the rail. The extenders
are normally stored on the outside of the PSU box. See Figure 6.2.
4. Hold the carriage by its casting and pull it very carefully, with reasonable
force, to the end of the extender. The ball cage will stop at the end of the
V-groove rail.
At this point, you can start to remove the carriage assemblies listed above.
INDEX ACTUATOR
DRIVE RAIL
FLAT EXTENDER
HOME
ACTUATOR
END STOP
(REMOVE)
BEAM
BALL CAGE
STOPPER V-GROOVE
EXTENDER
Figure 6.2 End of rail and extenders
Removing the Carriage from the Recorder

To replace some assemblies, such as the motor, you will need to remove the entire
carriage assembly.

5. Remove the umbilical connector with its umbilical hanger from the STB, see
Section 6.1.7.
6. Remove the baffle, see Section 6.1.2.
CAUTION
Do not hold the traverse carriage by its flywheel, spinner, L6
lens or readhead.
Make sure the motor drive shaft and beam actuators are not
knocked or damaged while removing the carriage.
7. Grip the carriage by its casting or the baffle and lift away in a clockwise
motion from the recorder.
8. Place the carriage on a table or chair that has a soft protective cover (thick
cardboard or a cloth). The baffle can be positioned to hangover the side of the
surface holding the traverse casting. Ensure that the L6 lens at the front of the
spinner mirror is not damaged.
At this point, you can start to remove the assemblies listed above.
Replacing the Carriage in the Recorder
9. Make sure all the connectors are fitted, including the umbilical, see
Section 6.1.7.
10. Replace the carriage on the extenders and start pushing it onto the rail by first
rotating the flywheel by hand.
11. Complete the ball cage and carriage alignment procedure in Section 6.1.11.
12. If other adjustments have been made to the periscope mirror as part of the
traverse service procedure, complete the vertical adjustment procedure
described in Section 10.9.
6.1.2 Baffle Assembly

This procedure is completed while the carriage is removed from the extender.
Position the carriage casting on a suitable surface where the baffle can hang over
the edge.
1. Disconnect the two fan cables (PL6 and PL7) from the STB.
2. Remove the single baffle M6 caphead screw on the L6 lens side of the baffle
(see Figure 6.3), and the top 4-off M4 panhead screws connecting the baffle to
the bracket.
3. Lift off the baffle assembly.
4. Replacement is the reverse of the removal procedure. Make sure the fans are
operating correctly.

VELCRO STRIP
(3 POSITIONS)
L6 COVER
BAFFLE
ASSEMBLY
L6 LENS
M6 SCREW
LOWER
MOUNTING
BRACKET
Figure 6.3 Removing the baffle/pcb mounting screw

6.1.3 Baffle Fans

Note: Any fan failures are normally detected during the POST checks.
You do not need to remove the baffle from the carriage for this procedure.
1. Disconnect the baffle fan supply leads (PL6 and PL7) from the STB.
2. Remove the 4-off M4 panhead screws holding the fan to the baffle.
3. Replacement is the reverse of the removal procedure. Make sure the fans are
operating correctly and a warning does not appear on power up.
6.1.4 STB
The STB, which is located on dowels, can be removed from its mounting plate
while the carriage is located on extenders. Make sure that the replaced board
software version is correct for the machine configuration.
2. Disconnect the umbilical cable (PL10), see Section 6.1.7.
3. Disconnect all other cable connectors on the board. See Section 3.3.5.
4. Remove the 5-off panhead screws holding the PCB to the mounting plate.
5. Alternatively, to detach the mounting plate from the casting, remove the 4-off
posidrive screws.
6. Replacement is the reverse of the removal procedure. Make sure the traverse
initialises correctly on power up and expose a test film.
6.1.5 Traverse Motor

For this procedure you need to remove the carriage from its extenders, see Section
6.1.1. Place the carriage on a table.
CAUTION
Make sure the motor shaft is not damaged.

2. Disconnect the motor cables (PL1) from the STB and remove the cable clamp.
See Section 3.3.5.
3. Detach the flywheel from the motor assembly by removing the 2-off M3
caphead screws and pulling away the wheel.
4. Detach the bracket holding the umbilical cable.
5. Remove the motor and support casting as a single assembly by removing the
3-off M6 screws holding the assembly to the casting.

6. Replacement is the reverse of the removal procedure. Make sure the traverse
initialises correctly on power up and then expose a test film.
6.1.6 Drive Rail Wiper

The wiper forms a housing over the motor shaft and is detached from the traverse
casting while the carriage is on the extenders. See Figure 6.4.
REAR VIEW OF MOTOR

SUPPORT CASTING
FLYWHEEL
WIPER
SHAFT
Figure 6.4 Accessing the drive rail wiper
1. Move the carriage onto the extenders, see Section 6.1.1.

2. The wiper is fixed by 2-off M4 caphead screws. Loosen (but do not remove)
the screws from the underneath, and lift out the wiper assembly.
3. Clean the wiper felt.
4. Replacement is the reverse of the removal procedure:

a) clip the wiper to the Allen screws

b) while pushing on the wiper with a finger, tighten the two screws.
6.1.7 Umbilical Cable

This cable can be replaced while the carriage is located on the extenders.
1. Disconnect the cable end from SK2 on FHMB (1) by pressing down on the
connector clip with the thumb and pulling out the cable.
2. Disconnect the cable end from PL10 on STB using the same method.
3. Detach the cable from the umbilical hanger by removing the 3-off clips, and
the velcro on the mounting tray.
4. Replacement is the reverse of the removal procedure. Check that the carriage
moves up and down the drum correctly. Make sure the traverse initialises
correctly on power up.
6.1.8 Spinner
This assembly can be removed while the carriage is located on service extenders.
To obtain the exact location of the replaced spinner on the casting, follow this
replacement procedure carefully. Not completing the procedure correctly could
result in scan misalignments.
CAUTION
Read the spinner disposal notices in Section 2.4.8 before
starting this procedure.
1. Detach the two connectors (PL4 and PL5) from the STB to the spinner.
2. Loosen the two screws holding the spinner spring clamping plate and remove
the stopper plate, see Figure 6.5 (B).
3. Lift back the clamping plate from its hinge and remove the spinner.
4. See Figure 6.5 (Stage A). Replace the new spinner by inserting the assembly
and rotating it clockwise to engage the lug into the locating groove (1).
5. Slide the spinner to the left and push downwards so that the lug is against the
left-hand shoulder of the groove (2).
6. See Figure 6.6 (Stage B). Locate the righthand thumb against the end of the
spinner body in approximately the 1 o’clock position (in line with the lug),
and grip the traverse casting with the other four fingers.

DETAIL
PUSH
DOWN
AND....SLIDE TO
THE LEFT
PAD
LUG 1. LOCATE ON THE

FOUR PADS
SPINNER
2. ROTATE TO ENGAGE
LUG (SEE DETAIL)
Figure 6.5 Re-fitting the spinner (stage A)
7. Gently start to apply pressure to locate the lug while tightening the spring
plate as follows:
Lift up the spinner spring plate and hold between the lug and the righthand
side of the casting. Position the spring stopper over the spring plate lip and
tighten the two screws (3) in the following order:
furthest screw (A) first, then nearest screw (B) - while applying pressure
from the righthand thumb against the spinner body, see Figure 6.6.
Make sure the bottom edge of the spring stopper is firmly butted against the
corner crease of the spring plate, see Figure 6.7.
8. After replacing the new spinner, make sure that it is aligned exactly as the old
spinner. It should fit accurately onto the four pads, as the spring plate is
closed, and then secured without the need for further checks. Push the spinner
very gently against the four pads and check that there is no movement.
9. Reconnect the cable connectors to the STB.
10. Run the optical setups for Focus and Beam Deflection Absolute Phase (see
Section 5.2), and check film registration (see Section 5.4).
11. Complete the vertical film registration adjustment if the periscope mirror has
been adjusted, see Section 10.9.

12. Check the image vertical offset, see Section 8.3.13.1.

3. POSITION THE SPRING STOPPER
OVER THE SCREWS -- AND
TIGHTEN A THEN B
SPRING
STOPPER
SPINNER SPRING
PUSH IN
CLAMPING PLATE
Figure 6.6 Re-fitting the spinner (stage B)

Figure 6.7 Locating the spring stopper
6.1.9 Ball Cage Assembly
CAUTION
This assembly is very accurately assembled. Always make sure
that it is supported at each end and is not flexed.
1. Remove the carriage from the recorder, see Section 6.1.1.

2. Lift out the ball cage strip and replace, making sure that the cage is fitted as
3. Setup the ball cage and carriage alignment, see Section 6.1.11.

CARRIAGE
RAIL
BALL CAGE
TRAVERSE
RAIL
Figure 6.8 Replacing the ball cage
6.1.10 Readhead
CAUTION
When touching or handling the readhead, make sure all
antistatic precautions are followed. Avoid touching the
spinner mirror and L6 lens.
The following items are required:

· Plastic feeler (Renishaw part no. M-9517-0122) supplied with the readhead part
or as a service tool. Do not use any other type of feeler.
· Renishaw readhead Installation Guide for information on the final setup.
Follow the procedure below:
1. Slide the carriage to the left-hand side and disconnect the readhead cable
(PL2) from the STB. Thread the cable through to the readhead end of the
carriage.
2. Slide the carriage to the righthand side until it reaches the cage stopper.
3. Remove the 2-off M3 sockethead screws holding the readhead to the casting.
Retain the screws and washers. See Figure 6.9.

READHEAD
SPACER
SLIDING KIT
RETAINING
SCREW
SCALE
Figure 6.9 Re-fitting the readhead
4. Refit the new readhead with a maximum clearance between the head and the
scale. Do not tighten the two screws.
5. Insert the feeler between the scale and the readhead, then gently press the head
down to give a sliding fit.
6. Tighten each screw in turn, a little at a time, to avoid moving the readhead.
Check again for a sliding fit with the feeler.
7. Re-connect the readhead cable to the STB.
8. Power up the machine.
9. Remove the felt cover over the readhead LED.
10. Check that the readhead LED is green over the full length of travel. (The LED
should be visible along the drum from the left end). If not, repeat Steps 5. to 7.
until this condition is reached.
Note: When the carriage arrives at the Index actuator, the LED will blink red or
orange and off. These indications are correct and show that the head has
‘recognised’ the actuator.
11. Perform the LED registration procedure using information from the Renishaw
Installation Guide.
12. Replace the felt cover on the LED.

6.1.11 Aligning the Carriage Rail and Ball Cage

See Figure 6.10.
1. The ball cage strip and carriage need to re-aligned correctly after each
procedure to ensure that the end of the carriage and the end of the cage strip
always coincide exactly when the two reach the cage stopper. Aligning both
assemblies on one side should ensure correct alignment on the other side.
CARRIAGE
RAIL
BALL
CAGE
ALIGN BALL CAGE AND

CARRIAGE RAIL HERE
Figure 6.10 Aligning ball cage and carriage
2. Move the carriage from the service extenders onto the V-groove rail. Carefully
slide the carriage back into the drum until the ball cage appears in the
V-groove underneath the carriage.
3. Hold the the ball cage and push the carriage back into the drum to reveal a free
length of cage.
4. Now pull the carriage forward (without holding the ball cage) until the two
assemblies are aligned at the screw fixing point shown in Figure 6.10. You
may have to complete steps 3. and 4. several times to align properly.
5. Check that the assemblies coincide at the other end of the rail.
6. Use the levelling utility in Section 8.3.12 to confirm that ball cage creep is
within specification.

Electrical Replacements 7
and Set-ups
This chapter describes how to replace and set up the main electrical field replaceable
units (FRUs) that include assemblies, such as PCBs, etc. Note that replacement and
set-up of electrical film handling devices (motors and sensors) are described in
Chapter 4.
7.1 Removing Electrical Assemblies
See Figure 7.1.

The Luxel F-9000 recorder is based on a modular design that allows easy access
for servicing electrical assemblies.
· MMI display unit
· PSU box assemblies
· RFI box assemblies
· AODD module
· Fans
· PCBs.
CAUTION
Make sure antistatic precautions are observed for an
electronics replacement procedure.

Electrical Replacements and Setups
POSITION DETECTOR
BOARD
OPTICS MOTOR UPGRADE LASER

BOARD MODULATOR BOARD
AODD MODULE
SYSTEM BOARD
MMI BOARD
PSU MODULE
TRAVERSE
FILM HANDLING
CARRIAGE
MOTOR BOARD (2)
TRAVERSE BOARD
CASSETTE ID BOARD
VERTICAL DISTRIBUTION (UPPER)
BOARD
CASSETTE ID BOARD
(LOWER)
VACUUM
ASSEMBLIES FILM HANDLING
MOTOR BOARD (1)
Figure 7.1 Location of main electrical assemblies

7.2 MMI Display Module
If any item in the MMI Display module is faulty, the complete MMI Display
module must be replaced.
1. Open the lefthand pod door of the recorder.
2. Remove the 2-off M4 screws securing the metal backlight masking pod
assembly (and earth strap) and remove the box.
MASKING POD
Figure 7.2 Location of MMI masking pod screws
3. Loosen the SK4 connector to the socket on the MMI module. Do not attempt
to remove the connector yet.
4. Remove the 2-off upper M5 screws securing the MMI Display module to the
door.
5. Supporting the module with one hand, remove the 2--off lower M5 screws.
6. Using one hand, lift the module clear of the door just enough to allow the
cable to SK4 to be disconnected with the other hand.
7. Refitting is the reversal of removal. Ensure that the three locating lugs in the
module plastic moulding fit into their respective holes in the door before
attempting to secure the new module with its screws.

SK4
CONNECTOR
Figure 7.3 Location of MMI display module securing screws

7.3 PSU Box Assemblies
Figure 7.4 shows the PSU box separated from the recorder.
SSB--PWR3
SSB--PWR4
EARTH
INT_PSU
S--PWR2
FAN S--PWR1
ALERT CONNECTION (OPTIONAL)

FUSE
SWITCH
POWER IN VAC PUMP

OUTLET
Figure 7.4 PSU box - exterior
7.3.1 PSU Box

See Figure 7.4.
The PSU box is not normally removed from the recorder, but if this operation is
necessary then:
1. Disconnect the mains cable and all other cables from the box.
2. Remove the 2-off nuts below the box and the 1-off nut above.
3. Detach the box assembly from the recorder frame.

7.3.2 PSU Module

See Figure 7.4 to Figure 7.7.
The power supply module is fitted with its own wire loom. For reference
purposes, all connections to the PSU module are shown in Figure 7.5.
1. Remove the 4-off M4 screws securing the cover to the PSU box and remove
the cover.
2. Disconnect all the exterior box cables.
PSU MODULE
WHITE
YELLOW BLACK WHITE RED RED WHITE/BROWN
FAN
VAC IN V5 V4 V3 V2 V1
BLUE
BROWN ADJ
G/Y
KEY V6 BLACK BLACK

S--INT--PSU
V1 = 36 V 10 A RED AND WHITE WHITE
BLACK
V2 = 5V 35 A S--INT--PSU
V3 = 24 V 8.5 A BLACK PURPLE BLACK BLACK BLACK BLACK BLACK
SSB--PWR4 FAN S--PWR S--PWR
V4 = 24 V 8.5 A
V5 = 15 V 8A BLACK BLACK
V6 = 15 V 4A S--PWR
Figure 7.5 PSU module wire loom - connections and module voltages
3. Push the five plastic push-fit, 8-pin cable connectors into the PSU box. Do this
by using your thumb and first finger to squeeze the two plastic snap-fit lugs on
each connector together to allow the connector to pass through its slot.
4. Disconnect the wires to the interlock relay located below the load resistor.
5. Remove the 2-off M4 screws holding the load resistor to the side of the PSU
box.
6. Remove the 2-off 4-20 UNC screws securing the D-type shell connectors to
the front of the PSU box.
7. Remove the black and red wires to the PSU box fan from the ring terminals on
V3 output of the PSU module. See Figure 7.5.

FAN
INTERLOCK
RELAY
LOAD
RESISTOR
ON/OFF
SWITCH
ALERT
RELAY
POWER
INLET
VACUUM
PUMP
RELAY EARTH
STUD
FUSE
CONNECTOR
BLOCK
POWER
OUTLET
TRANSFORMER
PSU MODULE
Figure 7.6 PSU box - interior layout
8. Remove the plastic cover over the AC mains input terminals to the PSU
module and disconnect the three AC mains input wires to the PSU module.
9. Unscrew and remove the nuts securing earth wires to the three earthing points
on the sides of the PSU box.
10. Unscrew and remove the 2-off screws securing the mounting plate to the PSU
box.
11. Lift the PSU module, plate and attached wire loom away from the PSU box.
12. Detach the PSU module from the mounting plate (4-off screws).
13. Detach the wiring loom.
14. Fitting the new PSU module is the reverse of the above procedure.

7.3.3 AC Mains On/Off Switch

the cover.
2. Disconnect the wires from the AC Mains on/off switch.
3. Push the two snap-fit lugs together and push the switch through its locating
slot to the rear of the recorder.
4. Fitting the new switch is the reverse of the above procedure.
7.3.4 PSU Box Fan

the cover.
2. Remove the black and red wire to the PSU box fan from the ring terminals on
the V3 output of the PSU module. See Figure 7.5.
3. Remove the 4-off M4 screws securing the fan to the PSU box and remove the
fan.
4. Fitting the new fan is the reverse of the above procedure.
7.3.5 Relays (Interlock and Vacuum Pump)

See Figure 3.6, Figure 7.6 and Figure 7.7.
The procedure for replacing the interlock and vacuum pump relays are identical.
the cover.
2. Disconnect the 6-off Faston spade connectors to the relay.

BK WH/BR
WH/BR
x2
BL BR
BK WH WH x 3
OUT
IN
BL BR
R BR BR
BR
BK = BLACK
BL = BLUE
BK BL BK
BR = BROWN
OR = ORANGE
R = RED
BR OR YL WH = WHITE
YL = YELLOW
Figure 7.7 PSU Box - connections to connector block, relays and on/off switch
3. Remove one of the 2-off M4 screws securing the relay to the PSU box.
4. Fitting the new relay is the reverse of the above procedure.

7.4 Vacuum Assemblies
See Figure 3.38.

The vacuum pump and solenoid valves are mounted on a plate. To replace the
pump and valves requires the plate to be removed first.
7.4.1 Vacuum Pump Transformer

the cover.
2. Remove the PSU module as described in Section 7.3.2.
3. Unscrew the terminal block screws and disconnect all of the wires from the
transformer.
4. Remove the 4-off M4 screws securing the transformer to the PSU box and lift
out the transformer.
5. Fitting the new transformer is the reverse of the above procedure, see
Figure 3.6.
7.4.2 AC Mains Filter

Note: A separate filter is only fitted on early machines. Later production
machines are filtered at the inlet.
See Figure 7.6.
the cover.
2. Disconnect the two Faston wire connectors from the AC mains filter box.
3. Unscrew and remove the 4-off M4 screws securing the AC mains filter to the
PSU box.
4. Fitting the new AC mains filter is the reverse of the above procedure.
7.4.3 Vacuum Pump Fuse

A 800 mA fuse that protects the vacuum circuit is located on the PSU box panel
shown in Figure 7.4. See Section 3.2.1.1 for the fuse part number and rating.

7.4.4 Mounting Plate Assembly

1. Disconnect the vacuum pump IEC connector from the PSU box. Alternatively,
you can disconnect the pump from the terminal block on the plate.
2. Disconnect the vacuum pipes to the three solenoid valves by pressing the pipe
connector sides and pulling them away from their connections.
3. Unscrew and remove the top plastic screw securing the rubber boot and
connector of each wire from FHMB (2).
4. Remove the rubber boot connectors from each solenoid valve.
5. Unscrew and remove the 2-off screws securing the vacuum mounting plate to
the base of the recorder.
6. Remove the mounting plate assembly.
7. Remove the vacuum pump as described below.
7.4.5 Vacuum Pump

1. Remove the mounting plate, see Section 7.4.4.
2. Remove the 2--off M4 screws securing the cover to the terminal block, remove
the cover, and detach the pump wires from the block.
3. Disconnect the exhaust and inlet vacuum pipes to the vacuum pump by
pressing the pipe connector sides and pulling them away from their
connectors.
4. Prise the rubber AVMs away from the pump mounting plate.
5. Fitting the new pump is the reverse of the above procedure.
7.4.6 Solenoid Valves

See Figure 3.38.
1. Remove the mounting plate, see Section 7.4.4.
2. Unscrew the 2-off M4 screws securing the solenoid valve to the plate. These
are accessed from under the plate.
3. Fitting the new solenoid valve is the reverse of the above procedure.

7.5 RFI Box Assemblies
7.5.1 Accessing the Box

See Figure 7.8.
To access the box assemblies, see Section 8.1.5.7.
DISK DRIVE(S)
SSB
(ON MOUNTING
BRACKET)
COOLING FAN
EXIT FOR
AODD CHAN
SIGNALS
INTERLOCK
FUSE
AODD MODULE
(ON SLIDING RAIL)
SSB
CONNECTORS
PSU
CONNECTORS
AODD
REMOVAL PANEL
Figure 7.8 RFI box - internal layout
7.5.2 Hard Disk Drives

1. Remove the RFI box lid, see Section 8.1.5.7.
2. Disconnect the power and SCSI cables from each hard disk drive. (Only one
hard disk is fitted on single-beam versions).
3. Unscrew and remove the 2-off M4 screws fixing the shelf supporting the hard
disk drive(s) shelf and remove the shelf with the drives attached.

4. Unscrew and remove the 4-off 4-20 UNC screws securing the drives to the
shelf.
5. Fitting a new hard disk drive is the reverse of the above procedure.
6. Details on how configure the drive for a Luxel F-9000 is supplied by the
manufacturer. See Section 3.2.2.2 for information on the SCSI IDs.
7.5.3 AODD Module

This module is not field serviceable and is replaced as a complete unit.
1. Remove the upper cassette from the front of the recorder.
2. Remove the upper light seal panel behind the film cassette loading bay, see
Section 4.1.4.
4. Remove the 6-off M6 screws securing the front AODD removal panel to the
RFI box and remove the panel.
5. Disconnect the two cables to the AODD module from the panel gap.
6. Disconnect all the SMB cables from the AODD module to the Optics module.
7. Looking down from the top, unscrew and remove the 2-off M4 screws located
on the front of the slider brackets which secure the AODD module to the RFI
box. These brackets form part of the module.
8. Slide out the AODD module from the front of the RFI box.
9. Fitting the new AODD module is the reverse of the above procedure.
7.5.4 System Board (SSB)
CAUTION
Make sure the antistatic precautions are applied before
removing the SSB assembly.
1. Access the interior of the RFI box, see Section 8.1.5.7.

2. Disconnect all eight cable connectors from the lefthand side of the RFI box
coonector panel.
Note: The two CAN SIG connectors are identical and easily switched. Make a
note of which one is SOMB or FHMB.
3. Looking down from the top, remove the hard disk drive shelf as described in
Section 7.5.2.
4. Disconnect all cable connectors from the System board. See Figure 3.19.

5. Remove the 5-off M4 screws securing the SSB to the RFI box.
6. Remove the screws from the connectors on the lefthand side of the box.
7. Lift the SSB out of the RFI box.
8. Fitting the new SSB is the reverse of the above procedure.
INTERLOCK
FUSE FILM
IMAGE_SOMB INT_PSU PROCESSOR
CAN_SIG
DIAGS (FHMB)
CAN_SIG
(SOMB)
PL18
MMI SOMB_PWR
SCSI
(RIP)
PL11
SSB_PWR2
PL17
SOMB_PWR
PL13
SSB_PWR1
Figure 7.9 RFI box connector panel
7.5.5 Interlock Fuse

A 1 A fuse that protects the interlock circuit is located on the RFI box connector
panel shown in Figure 7.9. See Section 3.2.2 for the fuse part number and rating.

7.6 Fan Assemblies
When a fan is replaced, ensure that it is positioned correctly with part items, such
as, finger-guards (if fitted) and any anti-vibration mounts (if required). Always
check that the new fans are rotating smoothly without causing excess vibration
that may effect registration.
PRESSURE
FANS
RFI BOX FAN

PSU BOX FAN
BAFFLE
MIXER FANS
FAN
Figure 7.10 Location of fans
7.6.1 Pressure Fans

1. Remove the top cover on the recorder.
2. Pull off the filter cover and filter.
3. Unscrew and remove the 4-off nuts securing the fan to the tray.
4. Lift the fan assembly up and away from the recorder.

7.6.2 Mixer Fan

Remove and replace from the lefthand side drum end cap.
7.6.3 Baffle Fans

The procedure for replacing the Baffle fans is described in Section 6.1.3.
7.6.4 RFI Box Cooling Fan

2. Disconnect the cable connector to the RFI box cooling fan from the SSB, see
Figure 3.19.
3. Remove the 2-off top nuts securing the fan to the RFI box.
4. Remove the AODD module as described in Section 7.5.3.
5. Remove the 2-off lower nuts securing the fan to the RFI box and remove the
fan.
7.7 PCB Assemblies
The main signal and power cables, with routing details, are described in
Section 3.7. All cables are labelled with part numbers with routes shown in
Figure 3.39.
When removing cables with tie-wraps, take special care that they are replaced and
secured in exactly the same position.
While removing a PCB, count and note the number of connectors fitted and
make sure that the same number is reconnected. Some of the cable
connectors are small and are easily mislaid.
7.7.1 Film Handling Motor Board (FHMB 1 and 2)

The procedure for replacing both Film Handling Motor boards are identical.
1. Remove cable connectors PL6, PL31, PL18, PL19, SK1, SK2 and SK3 (see
Figure 3.21).
2. Remove the FHMB cover, 2-off M4 screws above and below.
3. Disconnect all other cable connectors.
4. Remove the 6-off screws securing the PCB to the stand-offs.

5. Fitting the new board is the reverse of the above procedure. Make sure the
cable connectors in Step 1. are fitted before fixing the cover.
7.7.2 Optics Motor Board (SOMB)

1. Loosen the 2--off screws securing the cover of the SOMB to the top of the
Optics module and remove the cover by pulling the board away horizontally.
2. Disconnect all cables connected to the SOMB.
3. Remove the 2-off top and 2-off lower screws securing the SOMB to the six
stand-offs.
4. While supporting the board with one hand, unscrew and remove the two
remaining screws, one securing each end of the board.
5. Remove the board.
6. Fitting the new board is the reverse of the above procedure.
7.7.3 Upgrade Laser Modulator Board (ULMB)

1. Remove the 4-off screws securing the cover to the ULMB and remove the
cover.
2. Disconnect all cables connected to the ULMB.
3. Remove the 2--off lower screws securing the ULMB to the six stand-offs.
4. While supporting the board with one hand, unscrew and remove the 2--off top
screws.
5. Remove the board.
7.7.4 Traverse Board (STB)

See Figure 7.1.
The replacement of the STB is described in Section 6.1.4.
7.7.5 Position Detector Board (POD)

See Figure 7.1.
The replacement of the POD board on the Optics module is described in
Section 5.1.4.

7.7.6 Cassette ID Sensor Boards

See Figure 7.1.
The replacement of the Cassette ID Sensor board is described in Section 4.2.1.
7.7.7 Vertical Distribution Board

See Figure 7.1 and Section 3.3.11.
1. Remove the ribbon cable connector and all the sensor plugs from the Vertical
Distribution board.
2. Pull off the four black plastic studs which secure the board to its mounting
posts and remove the board.

Routine Maintenance 8
This chapter describes the main maintenance procedures for a six-monthly and
twelve-monthly service visit.
WARNING
Beware of the hazardous voltages which exist within the
recorder.
8.1 Tools and Procedures
8.1.1 Field Service Tools

Useful tools for a Luxel F-9000 service visit include:
• Metric Allen key set (1.5 mm to 10 mm). Keys required are 3, 4, 5, 6 and 8
mm; sizes 1.5, 2, 2.5 and 10 mm will also be useful as spares.
• Adjustable spanners 0-13 mm (100 mm length) and 0-25 mm (200 mm length).
• Digital voltmeter (DVM).
• Laptop PC (Pentium 32 Mbyte RAM, 800x600 (Min) screen resolution with
Windows NT4, Lotus Notes (V4.6) and modem. This tool is optional.
• Pliers (medium and small).
• Side-cutters.
• Soldering iron (transportable, gas type) and solder.
• Flat-blade screwdriver (medium and small).
• Philips screwdriver (medium and small) - magnetic.
• 6 in/150 mm steel ruler.
• x50 microscope.
• Stanley knife.
• Antistatic mat.
• Torch.
• Interlock override key (75539340) – up to 4 required.

Routine Maintenance
8.1.2 Overriding the Interlocks

See Figure 8.1.
The interlocks on each door are temporarily overridden by fitting the key over the
interlock switch and securing.
INTERLOCK SWITCH
OVERRIDE KEY SECURING

SCREW
Figure 8.1 Overriding the interlocks
8.1.3 Decoupling the Processor

If you need to decouple the processor from the recorder, to clean the input/output
guides or check for film handling, use the procedure below:
1. Retract the two front anchor feet on the recorder, see Figure 8.2. Do not adjust
the jacking castors and do not move or adjust the level of the processor and
recorder.
2. Pull the recorder away from the processor at each side, ensuring that the two
units are squarely aligned for easier coupling.

Routine Maintenance
3. Use the procedure in the Luxel F-9000 Recorder Installation Manual to couple
the units together again.
JACKING
SCREW
LOCKNUT ADJUSTMENT
NUT
JACKING ANCHOR
CASTOR FOOT
Figure 8.2 Jacking castors and anchor feet
8.1.4 Removing the Vertical Output Assembly

This assembly only needs to be removed if there is a failure with the roller
bearing or the fume flap needs replacing.
1. Detach the processor from the recorder, see Section 8.1.3.
2. Remove the 6-off vertical rear panel screws and remove the panel.
4. Disconnect all the Vertical output leads from the vertical distribution board
and FHMB(2).
5. Remove the 3-off screws either side of the assembly and lift out the assembly.

Routine Maintenance
8.1.5 Accessing Recorder Assemblies

See Figure 8.3
Access to the recorder internal assemblies for servicing and maintenance purposes
is from two pod doors and covers shown in Figure 8.31.
Make sure all covers, lids, doors and panels are promptly replaced after a service
procedure. Also make sure that all the safety labels are in place, see Section 2.4.1.
TOP COVER
TOP COVER
(RIGHT-HAND)
(LEFTHAND)
RFI BOX LID

OPTICS LID
END POD
(ELECTRONICS)
END POD
(MEDIA)
FRONT
COVER
PRESS TO
RELEASE
Figure 8.3 Accessing panels

Routine Maintenance
8.1.5.1 Lefthand Pod Door (Service)

See Figure 8.3
This provides access to the PSU box, vacuum pump and piping, film handling
PCBs, distribution boards, traverse carriage and system cabling. If necessary, the
door can be removed from the frame after disconnecting the MMI cable.
The lefthand door is normally locked from inside the cassette door with a
manually-turned screw lock. To access this lock:
1. Open the cassette door, see Section 8.1.5.3.
2. With the cassette door released, unlock the pod door by turning the spindle
knob anticlockwise. See Figure 8.4.
8.1.5.2 Righthand Pod Door

This provides access to the drum interior, L6 lens, spinner mirror, vertical output
assembly, periscope mirrors and slow power detector on the periscope. See
Figure 8.3
Pull the door away from its magnetic lock and open it fully. This door can also be
removed from the frame, see Section 8.1.5.1.
8.1.5.3 Cassette Door

This provides access to the Input assembly, cassettes, lefthand pod door lock,
sensors and the AODD module. Keeping this door closed during the service visit
helps to maintain internal pressure (with the system switched on) and prevent
contamination from processor fumes and external dust.
This door is locked by a handle latch, indicated in Figure 8.4, while the machine
is scanning. Operator’s should only open the door when the Open Cassette Door
icon is displayed after Change Media has been selected. Open the door as follows:
1. Grip the door handle and gently squeeze the handle latch until the door
unlocks, then lift the door upwards.
2. Close by pulling the door downwards until it locks into position.

Routine Maintenance
HANDLE
LATCH
UNLOCK
POD DOOR LOCK
Figure 8.4 Unlocking the cassette door/left pod door
8.1.5.4 Front Cover

This provides access to the horizontal tray and punch assemblies.
1. Open the righthand side pod door and press the cover release button, see
Figure 8.3.
2. Pull the cover away from the frame.
8.1.5.5 Removing the Horizontal Tray

The tray has a set of rollers that moves along a guide rail. Power supply and
signals are provided from a rear docking mechanism which allows the tray to be
removed from the recorder. See also the Luxel F-9000 Recorder Operator’s
Manual.
1. Remove the lower front cover, see Figure 8.3.
2. Pull the tray fully forward, lift over the slide rail, and completely remove from
the recorder.

Routine Maintenance
8.1.5.6 Righthand Top Cover and Optics Lid

This provides access to the pressure fans, Optics module and the top periscope
mirror.
1. Lift off the cover and temporally store in a safe area where it cannot be
damaged. See Figure 8.3.
2. Remove the 6-off M4 screws holding the optics lid and remove the lid to
access the Optics module (covered with a module lid).
3. Refit the lid and cover, making sure the cover inserts fit correctly into their
frame holes.
8.1.5.7 Lefthand Top Cover and RFI Box Lid

This provides access to the RFI box that includes the System Board (SSB), disk
drives and the AODD module connections.
1. Lift off the cover and temporally store in a safe area where it cannot be
damaged. See Figure 8.3.
2. Remove the 12-off M4 screws holding the RFI box lid, move the lid sideways
and lift off.
3. Refit the lid and cover, making sure the cover inserts fit correctly into their
frame holes.
Note: When refitting the RFI lid, ensure that the vent is at the front of the
recorder.
8.1.5.8 Accessing the AODD Module

Use the procedure in Section 7.5.3 to access the AODD module.
8.1.5.9 Accessing the Drum and Traverse Carriage

See Figure 8.5.
Open the left- and righthand doors and remove the drum end caps. See Section
6.1.1 on how to handle the traverse carriage for a servicing. Disconnect the
Exhaust fan connection on the lefthand end cap before removing the cap.

Routine Maintenance
DRUM
LATCH END CAP
(3 POSN’S)
FIXING DETAIL 2
Figure 8.5 Removing/replacing the drum end caps

Routine Maintenance
8.2 Maintenance Schedules
8.2.1 Six Monthly

Complete the following for a six month service visit:
1. Clean the spinner mirror. See Section 8.3.1.
2. Clean the readhead, drive rail and scale. See Section 8.3.2.
3. Clean the pressure fan filters. See Section 8.3.4.
4. Clean the focussing lens. See Section 8.3.5.
5. Clean the drum. See Section 8.3.7.
6. Clean the wiper on the traverse carriage. See Section 8.3.8.
7. Clean the recorder interior and the cassettes (if required). See Section 8.3.10.
8. Check for vibration transfers. See Section 8.3.11.
9. Run the levelling utility to check that ball cage creep is within the specified
distance. See Section 8.3.12.
10. Check optics Focus and Registration. See Sections 5.2 and 5.4.
8.2.2 Twelve Monthly

Complete the following for a twelve month service visit:
1. Complete all the procedures in Section 8.2.1.
2. Clean the cassette input rollers. See Section 8.3.3
3. Clean the fume flap. See Section 8.3.9.
4. Clean the touchpanel. See Section 8.3.6.

Routine Maintenance
8.3 Maintenance Procedures
8.3.1 Cleaning the Spinner Mirror
CAUTION
Avoid touching or marking the lens (L6) in front of the spinner
mirror.
This procedure is a recommended method for cleaning metal mirrors. Where

possible, use the recommended tissues/wipes called Surface Cleaner, VHB
supplied by 3M. These are impregnated with isopropanol (IPA). Alternatively, use
tissues or cotton buds dipped in IPA.
1. Access the spinner mirror from the right- or lefthand side (whichever is the
most convenient).
CAUTION
Only use light pressure when applying a wet wipe. Never rub a
coated mirror surface with a dry wipe. Only use the supplied
tissues or wipes.
2. Clean other surface contaminants using a wet, solvent-soaked tissue, turning

the tissue and replacing it frequently while lightly rubbing the entire surface.
3. Finally, clean with a solvent-soaked tissue or wipe by using it as a squeegee.
Starting from one side of the mirror, gently wipe from top to bottom, left to
right as a continuous motion that takes the wipe beyond the edge of the mirror
surface. Repeat this so that each subsequent pass overlaps the previous one.
To prevent streaking, the wiping motion from top to bottom must be at a rate
where the solvent evaporates as the wipe is brought across the surface.
The tissue must be kept damp and changed frequently throughout this
procedure.
4. Reset the spinner contamination NVRAM parameters using the procedure in
Section 10.2.5.1.

Routine Maintenance
LEFT OR RIGHT
HAND
COTTON BUD
ISOPROPANOL (ON LONG STICK)
ALCOHOL (IPA) ONLY
Figure 8.6 Spinner mirror wiping motion
8.3.2 Cleaning the Linear Scale, Drive Rail and

Readhead
Cleaning the linear scale, rail and readhead is only carried out as necessary to
maintain reliable operation. Cleaning periods vary depending on the amount of
contamination collecting on the scale or readhead.
8.3.2.1 Linear Scale and Drive Rail

A lacquer coating is applied to protect the scale and render it easy to clean. Use
the following procedure:
1. Clean the rail and scale with a clean dry cloth after removing any abrasive
particles.
2. Wet a clean cloth (lintless) with IPA and gently wipe along the scale. Do not
use aggressive solvents, such as, Acetone, Benzine, Methylated spirits,
chlorinated solvents or any lubricants - since these are likely to damage the
lacquer. Preferably, avoid all solvents for cleaning the scale, or only use
IPA very sparingly.

Routine Maintenance
8.3.2.2 Readhead
This procedure can be completed when the traverse carriage has been removed
from the recorder, or when the carriage is moved to the righthand side.
1. Remove the readhead from the carriage using the procedure in Section 6.1.10.
2. Clean the readhead window with a cotton bud soaked in IPA.
3. Replace the readhead.
4. Run the setup procedure in Section 6.1.10.
8.3.3 Cleaning the Cassette Input Rollers

The two cassette nip rollers at the front of the input assembly should prove
trouble-free without regular cleaning. However, if a problem occurs on film
handling, clean the rollers with a lint-free cloth dipped in IPA.
8.3.4 Cleaning the Pressure Fan Filters

The two pressure fans house a filter element that is cleaned with the following
procedure:
1. Lift off the external top cover on the righthand side to reveal the fans.
2. Unclip the top plastic vent cover and remove the filter element.
3. Clean the element with a vacuum cleaner or replace, depending on its state.
4. Refit the filter.
8.3.5 Cleaning the Focussing Lens (L6)

Use a cotton bud, wrapped with a wet wipe, and gently clean the lens on both
sides. Check that there are no fibres remaining on the lens. See Figure 6.3.
The lens is held by an assembly of two metal plates, adjusted by two screw
fixings and two springs. These are accurately set at the factory and are not field
adjustable.

Routine Maintenance
BAFFLE
ASSEMBLY
L6 LENS
CLEAN
REAR
CLEAN
FRONT
Figure 8.7 Cleaning L6 lens
8.3.6 Cleaning the MMI Touchpanel

The panel is cleaned by gently wiping with a soft cloth, tissue or absorbent cotton
in order to remove surface dust. Use a proprietary glass cleaner if further cleaning
is required. Make sure the surface is not rubbed with any hard material.
8.3.7 Cleaning the Drum

Access the drum and rail from both sides using information in Section 8.1.5.9.
Clean the drum and rail as follows:
1. Use a small hand-held vacuum cleaner to remove dust from the inside of the
drum and around the traverse rail and beam.

Routine Maintenance
2. Polish the drum with a lint-free cloth, making sure the vacuum holes are clear
of any dust and debris.
8.3.8 Cleaning the Drive Rail Wiper

This procedure is completed when the traverse carriage has been moved to
extenders and detached from the rail.
1. Use the procedure in Section 6.1.6 to remove the drive rail wiper.
2. Clean the wiper by brushing any dust particles from the felt pad. If the pad is
too dirty or damaged, then remove and replace the wiper assembly.
8.3.9 Cleaning the Film Fume Flap

The fume flap on the fume shutter assembly is cleaned using the procedure below.
1. Decouple the media processor, see Section 8.1.3.
2. Remove the Vertical Output Assembly, if necessary, see Section 8.1.4.
3. Access the flap using the procedure in Section 4.6 to remove the flap from the
shutter assembly.
4. Clean the flexible plastic flap with IPA or replace the flap.
5. Replace the fume flap assembly and the Vertical output.
6. Clean the input guide plate on the processor (if accessible).
8.3.10 Cleaning the Recorder

Use a small hand-held vacuum cleaner to remove dust from the following areas:
• drum (make sure the drum is not scratched)
• drive rail and linear scale
• base plate floor
• doors, lids and covers
• all recesses inside the machine
• input assembly
• cassette interior.
8.3.11 Checking for Vibration Transfer

Although the drum is attached to the base by a set of A-V mounts, there is still a
risk that mechanical vibrations from fans, vacuum pump, etc, on the recorder can
be transferred to the drum and the traverse carriage. These vibrations could
eventually appear as periodic scan errors on exposed film.

Routine Maintenance
a) vacuum pump
b) RFI cooling fan
c) exhaust fan
d) baffle fans
e) PSU cooling fan.
7. Check for possible cable and loom bridging points between vibrating
mechanisms, such as the vacuum pump and the drum.
8.3.12 Checking for Ball Cage Creep (Trav_Test)

Use this procedure to run a utility that checks if the recorder is level end-to-end.
The aim is too minimise the amount of ball cage creep as the carriage continually
traverses the rail. Tools required: small steel ruler and torch.
1. Obtain the (main>) prompt and switch on verbose.
2. Check that the spinner and traverse are disabled. (They are enabled if the
application has been running). Select the following from Main Diagnostics:
diagnostics/service/spinner/stop
diagnostics/service/traverse/halt
3. Align the carriage and the ball cage, see Section 6.1.11.
4. Set the traverse system to its datum position by entering:
diagnostics/service/traverse/datum
5. Run the trav_test to move the carriage six times up and down the beam length
from the service end (note that the test check number can be set from Main
Diagnostics):
diagnostics/test/traverse/trav_test
6. Halt the traverse system by entering:
diagnostics/test/traverse/halt
7. Move the carriage to the alignment point as in step 3. and check if the ball
cage has started to creep out of alignment with the carriage on the selected
side. The gap should not be greater than +/– 0.5 mm for 5 to 7 traverses.
8. If creep is greater than the specified distance, then an adjustment is required:
Adjust the feet to minimise creep and obtain an improved level; a small
adjustment of 1 or 3 mm is usually sufficient.
For instance, if the new reading is a plus value above the old reading then the
lefthand side is too high.
Loosen the anchor feet and lower the lefthand castors.
9. Repeat steps 3. and 8. until creep is within the specification.

Routine Maintenance
10. Re-tighten the anchor feet locking screws, making sure that the recorder level
is not re-altered.
8.3.13 Check and Set Image Vertical and Horizontal

Offsets
A vertical and horizontal offset check is required to accurately position an image
on film. If the position is incorrect it can be adjusted in NVRAM using the two
procedures below.
8.3.13.1 Set the Vertical Offset

1. Obtain the (Main>) prompt on the terminal and enter the menu:
main>diagnostics/service/spinner
2. Find the current base offset position in NVRAM with the command:
rd_image_offset
The nominal value is 80.
3. Load film into the drum using the Media Tools. Choose the widest film
available.
4. Ensure that the film is punched. Enter the following menu:
main>diagnostics/service/actuators
Use the commands set m6 off and set m6 on to punch film.
5. Output an image from the Main Diagnostics optics_mmi menu. Use the Full
Film Test macro.
6. Measure the distance from the centre of the punch pin to the start of the image,
see Figure 8.8.
The value should be 15 mm minimum.
7. If necessary, adjust the the base offset position in NVRAM with the command:
wr_image_offset <new value>
The value can be adjusted in mm units. Adding to the value will move the
image away from the punch; subtracing will move the image towards the
punch.

Routine Maintenance
15 mm (min)
NEW CENTRE POSITION
OLD CENTRE POSITION
A B
IMAGE
FILM
Figure 8.8 Setting the image offsets
8.3.13.2 Set the Horizontal Offset

1. Obtain the (Main>) prompt on the terminal and enter the menu:
main>diagnostics/service/traverse
2. Find the current base offset position in NVRAM with the command:
rd_centre_posn
The nominal value is 580,000 µm
1. Using the same image as exposed for the determining the vertical offset,
measure the distance from the centre punch hole to the left and right edges of
the image. These distances A and B should be equal, see Figure 8.8.
2. If necessary, adjust the the base offset position in NVRAM with the command:
wr_centre_posn <new value>
The value can be adjusted in microns. Adding the value will move the image
to the right (user side); subtracing will move the image to the left (service
side).

Routine Maintenance

Recorder Functional 9
Description
This chapter gives an overall system description, a more detailed functional
description of each PCB, and a summary of how each of the media sub-systems
(media handling, expose and scanning) operate.
System Introduction
This section gives a brief system overview of how the main system modules
function. See Section 9.1.
How the PCBs Function
· System Board (SSB)
· Field Handling Motor Boards (FHMB 1 and 2)
· Traverse Board (STB)
· Optics Motor Board (SOMB)
· Upgrade Laser Modulation Board (ULMB)
· Acousto-Optic Device Driver (AODD) Unit
· Miscellaneous Boards - MMI.
Sub-system Operation
The operation of the three main sub-systems are described in more detail as
background information for starting to fault-find and replace parts. Sub-systems
include:
· Media Handling.
· Media Expose.
· Media Scanning.
Field repair philosophy for the Luxel recorder is based on the use of embedded
diagnostic software and online error logging to rapidly determine the area at
fault. Modules and sub-assemblies are accessed and replaced using the
procedures in Chapter 4 to 7.
Success in troubleshooting the system will require the engineer to have an
adequate technical background on how the laser optics, film handling and
traverse operate. A detailed functional description of the PCBs and the
mechanisms they control in this chapter is useful as an aid to effective
troubleshooting.
Where appropriate, functional diagrams are supplied to support the text.

Recorder Functional Description
9.1 System Overview
9.1.1 Introduction
See Figure 9.1 shows the main image data routes for the processing and exposed
routes.
This introduction provides a high-level description of the main functions of the
system. It shows how image data is ‘pushed’ to the recorder, stored and processed
into a modulated laser streams (1 to 3, depending on the laser configuration), then
exposed on film. Control of the film path mechanisms, traverse and optics
systems is from local ‘intelligent’ nodes that run from on-board micropressors
(MPU) with their own control software routines.
RIP SERVER
DTP
NETWORK
JOB IMAGES
ACROSS ETHERNET
RIPPED
JOB IMAGES
ACROSS SCSI
CASSETTE
INPUT COMPRESSED IMAGES
HELD ON DISK
EXPOSED/CUT/ PROCESSED
PUNCHED JOBS JOBS
SPINNER &
TRAVERSE
TRANSPORT FROM
RECORDER DRUM TO PROCESSOR PROCESSOR
Figure 9.1 Luxel system: image data and film paths
All the recorder functions, described in this chapter, are grouped into three main
subsystems:
· Media Handling - How film is transported from the input cassette to the
processor.
· Media Exposing - How laser data is generated and manipulated from the
Optics module to the spinner.
· Media Scanning - How the traverse carriage and spinner reflects light across
the drum.
Figure 9.2 gives an overall system view of the Luxel F-9000 recorder interfaced
to a RIP server. Design is largely based on the principle of distributing local

Recorder Functioal Description
control functions so that they are in close proximity to their target mechanisms.
This approach broadly sub-divides the system into two functioning areas:
1. Overall system control managed by the SSB which initiates operations as a
master, sending commands over the CAN bus to slave PCBs - depending on
the sensor signals received (traverse, film position, spinner position, etc).
2. Local module control for film handling, optics and scanning from four local
node PCBs (FHMB1 and 2, SOMB and STB) that include an on-board MPU
and local program firmware.
Luxel system control is based on a peer-to-peer distributed model where functions
are managed by the following node PCBs:
· SSB - System Board (overall system manager and interface to external
devices).
· FHMB(1) - Film Handling Motor Board 1 (handling the majority of input
sensors and motors).
· FHMB(2) - Film Handling Motor Board 2 (handling the majority of output
sensors and motors).
· SOMB - Optical Motor Board (controls optical motors and laser modulation).
An extension Upgrade Laser Modulation Board (ULMB) is added for laser
upgrades.
· STB -- Traverse Board (controls movement of the spinner and traverse
carriage).
Each of the node PCBs are responsible for initializing control routines on their
subordinate modules (motors, etc). They accept local responses (sensors, etc) and
transmit/receive messages to the SSB over a CAN bus. The SSB occasionally
assumes mastery of the system by arbitrating between system tasks. For instance,
motors and lasers are not moved until they are enabled by the SSB.
9.1.2 RIP Communications

Two-way communication between the RIP server and the Luxel recorder is
achieved via a differential SCSI link to the SSB board.
The SSB receives control and image data from the RIP and returns status data to
the RIP server across a Differential SCSI 3 (Ultra SCSI) link with data burst rates
up to 40 MBits per second.

9-4
FILM HANDLING
DISK
DRIVES SENSORS MOTORS SENSORS MOTORS
RIP
SERVER
CAN CAN
FHMB2 FHMB1
SCSI
+24V SOMB UMBILICAL
± 15V & (CAN)
ULMB
+5V
TOUCHPAD/
LED SPINNER
AOD DATA AODD FREQ (1--3) STB

CONTROL (1--3) MODULE
READHEAD
TRAVERSE CARRIAGE
MMI
CAN
LASER
SSB SENSORS BEAMS (1--3)
FILM RFI BOX SOMB MOTORS PERISCOPE

PROCESSOR
LD2
INTERLOCK PANELS IMAGE
RELAYS PCBS
DATA
Figure 9.2 Luxel F-9000 system: top-level view

+24V LOCAL
+24V +5V ± 15V VAC DRUM LD1 CONTROL
PUMP PCB
(AODD) ULMB
LD3
+24V FHMB
PSU (1 & 2)
+36V
OPTICS MODULE

PSU BOX
9.1.3 Image Data Reception and Transfer

Apart from acting as a RIP interface, the SSB performs the following functions:
· Compresses received image data.
· Stores image data to a buffer memory.
· Stores image data on one or two SCSI disk drives, depending on the system
configuration.
· After storing a complete image on disk, the data is:
a) returned to a buffer memory store then decompressed
b) formatted and serialised for output
c) passed as a stream of image data to the laser modulator.
See Section 9.2 for a full description of the System board.
9.1.4 Control Console (MMI)

The control console displays the Man-Machine Interface (MMI) for all the menu
buttons that control the operation of the recorder (for example, pausing the scan to
change cassettes, etc). A set of iconic displays give the user an indication of the
current recorder and media status (film type and length in each cassette).
The console comprises an MMI board connected to a display controller device on
the SSB, a touchpanel for returning the axis (X/Y) location of the user selection,
and an LCD displaying buttons and status icons.
See Section 9.8.1 for a full description of the MMI PCB.
9.1.5 Media Input Control

An Input assembly houses a dual-cassette system allowing the RIP/recorder
software to select the appropriate cassette for the job type. Each cassette has its
own ID (from 1 to7) which is recognised by the recorder that is able to store
current information on the loaded film type and length. Sets of motors and
associated sensors control the continuous loading and rewinding of film into the
drum. This media control system is fully described in Section 9.11.3.
A climatising buffer below the Input assembly allows film to adjust from cold
storage to the warmer drum temperature. A buffer guide opens to divert film
(from the upper cassette) into the climatising area during a reload.
9.1.6 Media Exposure

Once Luxel has received a complete image (at least one separation) from the RIP,
media exposure starts. Image data is synchronized and routed to the laser
modulator function on the SOMB and/or ULMB. An optics system, housed from
a separate Optics module, controls the multiple lasers (1 to 3) from beam

position/power feedback signals. The AOD circuitry manages the laser deflections
required for a dual- or triple-laser system.
Laser beams are focussed, adjusted for density and checked (while the system is
not scanning) for correct alignment and power settings between beams. The
beams are shaped and collimated by mirrors through a periscope to a spinner
mirror rotating at a maximum speed of 30,000 rpm.
Section 9.12 explains the principles of media exposure in more detail.
9.1.7 Traverse and Spinner Control

The traverse motor that moves the carriage is controlled directly from the STB
mounted on the carriage. Using data provided by a readhead detector and a linear
scale on the traverse rail, the current traverse position for imaging is calculated by
the STB. See also Section 9.4.
Spinner speed is also controlled from the STB to avoid speed fluctuations. The
spinner (Speedring type) includes an encoder that returns an Index signal for each
revolution.
High-level commands (for instance, to Stop/Start the spinner) are issued from the
SSB to the STB node, with system decisions based on sensor data messages sent
from the STB and other modules. Traverse and spinner system data is transferred
to the SSB across a CAN network, see Section 9.1.18.
Section 9.13 explains the principles of traverse and spinner control in more detail.
9.1.8 Multi-Laser and Optics Control

Control for a multi-laser deflection system is from the SSB that houses the AODD
interface circuitry to the AODD module (see Section 9.1.9). Local drive and
control of the optics stepper motors, neutral density (illumination), focus,
aperture, slow power detection, and beam conversion is managed by the SOMB.
Besides controlling the optics mechanisms, the SOMB provides all the
modulating functions for a single-laser system.
Calibration of the wheel and focus to determine their useful working ranges and
positions is carried out from a neutral density (laser wedge) procedure run on the
RIP server. A registration check is available for the engineer to ensure the optics
mechanisms, spinner and drum are fully aligned within the Luxel specification.
Engineers are able to generate test strips from a setup menu for various beam,
lines and density options.
There are three possible laser system configurations (single, dual and triple-laser
options) available. Depending on the option installed, the Optics module will
include up to three laser diodes and two acousto-optical deflection (AOD)
modules. Lasers supplied for the three configurations are labelled LD1, LD2 and
LD3, with LD2 set as the reference beam. AOD modules associated with LD1 and
3 are referred to as AOD1 and AOD3.

Control and driver circuitry on the SOMB receive image data from the SSB for a
single-laser (LD2) scanning; laser modulation for LD1 and LD3 is controlled
from the ULMB.
Modifying the optics configuration from a single-laser system to a multi-laser
system is completed as an option upgrade.
See Section 9.12 for a full description of the optics control and Section 9.12.6 for
a description of the optics upgrade configurations.
9.1.9 AODD Control and Interface

See Sections 9.2.3 for a full description of the AODD interface on the SSB and
Section and 9.2.3 on the AODD module.
To apply multi-laser scanning, Luxel makes use of beam circularizing correction
circuitry on the SSB and acousto-optic deflection drivers on the AODD module.
An interface on the SSB provides the signals to compensate for the ‘twist’ that
occurs naturally between the multi-laser beams as the spinner mirror rotates
around the drum. With AOD control, the two external beams are deflected so that
they appear as a parallel scan swathe with LD2 as the single undeflected reference
beam (see also Figure 9.40 and Section 9.12.4). The shape of the required
deflection is sinuisodal, with the same frequency as the spinner.
Lookup tables (LUTs) on the SSB compensate for the power output variation
from the AODs by modifying the input frequency. Some compensation is required
for the non-linearity of the AOD drive circuitry. Also, to avoid film patterning a
small amount of noise is introduced.
9.1.9.1 AODD Module

The AODD (Acousto-optic Device Driver) module is a separate and sealed unit
operating alongside the SSB. It accepts the corrected deflection signals from an
SSB control function and generates the RF frequency signals (at 80 MHz) that
correspond to the circularizing beam changes for spinner rotation. See also
Section 9.7.
Testing the AODD module, to verify for correct operation, is carried out from
Luxel diagnostics. This unit is not opened or adjusted by the service engineer.
9.1.10 Media Handling Control

Opto-switching sensors located on the media path feed detect signals into two
identical film handling PCBs (FHMB 1 and 2) that control the local motors, fans
and solenoids. These boards pass sensor data to the SSB and receive SSB system
commands.
The two FHMBs are located in close proximity to the motors they control, and
receive sensor data via local distribution boards that form a collection point for
the sensor leads. Their main function is to receive and re-transmit sensor signals
(as CAN messages to the SSB), run local motor control software routines used to
transport film, open/close mechanisms, etc, provide motor, fan and solenoid drive

currents, and serve as an interface between the SSB and the STB (across an
umbilical cable).
Some of the main modules they control include:
· vacuum system
· punch and guillotine cutter
· input cassettes
· input buffer guide (climatising)
· film transport motors.
See Sections 9.3 for a full description of the FHMB functions and Section 9.11 for
the film handling mechanisms.
9.1.11 Media Punching and Cutting

After a scan exposure, punched and cut film is ejected from the drum into the
output system (Horizontal tray). A punch mechanism operates from an electric
motor with two sensors detecting the presence of film and the current position of
the pins (in or out of the die).
The guillotine is integrated with the punch and cuts in one direction only with
sensors at each end detecting the position of the cutter.
Both the punch (with pins) and the guillotine (with cutter and sensors) are
replaced as single assemblies.
9.1.12 Media Output Control

A set of motorised rollers, controlled by film detecting sensors, move the cut film
towards the processor. This conveyance system consists of two main assemblies:
the Horizontal tray and the Vertical output. The Horizontal tray is pulled out on a
slider rail mechanism, allowing the user to access the strip whenever there is a
film jam; the Vertical output is accessible from the righthand pod door. A spool
buffer and deflection roller mechanism ‘turns’ each film strip round from the
drum outlet to the horizontal and vertical conveyor path.
9.1.13 Media Processing

Film processing is carried out by a separate unit coupled to the recorder. For
Luxel F-9000, the specified processors include a communications interface with a
common set of commands that allow the two machines to synchronise as film is
ejected. This interface needs to be enabled before the link can operate.
A fume shutter assembly, fitted on film outlet of the recorder, automatically
prevents chemical fumes from the processor leaking back into the recorder.

9.1.14 Software Organisation

Instead of running a supervising monitor programme, system control is based on a
set of top-level software modules, activated as required. These modules are
responsible for managing the following tasks:
· Datapath: data files from the RIP through the SSB to the expose system.
· Expose: operation of the optics, traverse and spinner systems when converting
image files to film.
· Media: film handling from the input to the output.
· Machine environment: The ambient temperature on the SSB is tested for a
threshold level and indicated as a warning on the MMI.
9.1.14.1 Master and Slave Flash Code

Each one of the main control PCBs operate with Flash devices holding application
code (the real-time distributed program) and boot code (which allows application
code to be downloaded). Note that:
· Application code is distributed across the SSB, serving as the master, and the
slave nodes; the variant of code only changes for each type of Luxel machine
(film or plate handling).
· Boot code has different variants for each board type: master or slave. The
master variant allows code to be downloaded to the SSB from the RIP server;
the slave variant allows code to be downloaded from the RIP server to the slave
nodes via the SSB and the CAN bus.
New versions of software and software patches are loaded on the recorder from
either the RIP server, a local engineering terminal or a remote terminal.
9.1.14.2 Configuration Utilities

A protected area on each device holds local configuration data on the serial
number, build data, etc, of each intelligent PCB that can be viewed and stored by
the service engineer. From the SSB, the engineer is able to interrogate and modify
the board configuration details and system details held on the System Registry.
Any replacements of the hardware, software or firmware requires the registry to
be updated; a facility under Main Diagnostics checks for Revision level
compatibilities. A backup of the system and board configuration data is held on
the Hard disk.
Section 10.4 explains how to use the Configuration utility.
9.1.14.3 NVRAM Utilities

An NVRAM utility program operates in the same way as the Configuration
program above by allowing the engineer to save and restore all board NVRAM
parameters between the Hard disk and the SSB.
Section 10.4 explains how to use the NVRAM utility.

9.1.15 Luxel Main Diagnostics

Diagnostic software, which is embedded as monitor programs on all the local
control PCBs, checks the surrounding electronic circuits, mechanical and optical
modules for satisfactory operation. These checks are either run as System
self-tests (POST) on bootup, or as discrete checks (plus other utilities) from Main
Diagnostics menu, see Section 10.3.
9.1.16 Safety Interlocks

A safety interlock system detects if the two pod doors, optics lid and lower front
cover is open. An interlock circuitry with two isolating relays (A and B) operates
from the SSB and PSU box.
A safety interlock system detects if the two pod doors and the optics lid is open.
An interlock circuitry with two isolating relays (A and B) operates from the SSB
and PSU box.
The SSB monitors the safety interlocks and switches the two isolating relays
inline with the following voltages:
· +24 V and +36 V to the FHMBs and STB. Removing the +36 V also disables
the CAN bus to both PCBs.
· ± 15 V to the SOMB and the ULMB.
A fuse is in series with the 12 V Interlock relay line.
To override an interlock, a special key is fitted on the frame’s switch. The pod
cannot be shut with the override key in place. See Section 8.1.2. As an extra
precaution, service engineers can disable laser power while the interlocks are
defeated by removing the SSB_PWR1 cable.
To override an interlock, a special key is fitted on the frame’s switch. The pod
cannot be shut with the override key in place. See Section 8.1.2. As an extra
precaution, service engineers can disable laser power while the interlocks are
defeated.
The status of the interlocks (opened or closed) is passed to the SSB which
controls the inhibit lines to the PSU for power up sequencing. Power and drive
voltages do not reappear until the +5 V supply for the logic circuits is activated.
Extra functions on the PSU module are responsible for inhibiting the +24 V,
+36 V and +24 (AODD) V during the power up sequence.
While the doors/lid are open, power to all the boards (except the SSB) is removed.
With the interlocks closed (and the overrides removed), power is restored
allowing each board to proceed with its startup initialisation sequence.
See Section 9.9 for a full description of the interlocks.

9.1.17 System Initialisation

When power is switched on, the start-up code on each PCB provides the system
with a minimum level of operating functionality for the application to run. Some
of these start-up operations include:
1. Running initial board self tests.
2. Starting the MMI.
3. Check for the presence of a diagnostic terminal monitor.
4. Initialise hardware without switching on the lasers or motors.
5. Intilialise the CAN bus.
Startup code on the SSB continues to:
6. Establish CAN communications with with all the main boards.
7. Build configuration records and log differences.
8. Initialise the top level software modules.
On power-up, each of the main PCBs initialises its subordinate modules
independently of the SSB. Because all the hardware and mechanical dependencies
vary with type of machine configuration, the order of module start-up is resolved
locally.
During initialisation, the SSB builds a record of the machine’s configuration
(board IDs, serial numbers, etc) and checks whether this matches the previous
configuration. Configuration data is held in NVRAM.
If the recorder doors or covers are opened, power to all the PCBs is lost except on
the SSB, so only a partial initialisation is completed.
Each of the intelligent boards executes a self test on power-up to check whether
the application code is able run.
9.1.18 CAN Network Control

See Figure 9.3.
Luxel operates with an industry-standard CAN (Controller Area Network) bus
distributed between the five local control boards: SSB, FHMB (1 and 2), STB and
SOMB. Each board is linked to the recorder network as a node that is able to
transmit or receive messages to any other node. The CAN standard is a serial data
interface used for real-time control signals where the machine environment calls
for robust and reliable internal communications. On Luxel, raw CAN data rates
are at 250 Kbits/sec with
The CAN network model for imagesetter data transfer is especially useful in that
nodes can be easily added, swapped or removed after the network mapping tables
have been modified. Also, it provides a system with extra network management
features and extensive real-time error checking and recovery procedures.
On a CAN network, system data (sensor data, motor commands, etc) is passed
between nodes as a frame messaging system where the signal content is labelled

by an identifier that is unique throughout the network. All nodes receive the
message and perform an acceptance test to detect whether the message is relevant.
Bus arbitration is based on two priority schemes:
· The CAN scheme where the lowest-level message ID has the highest priority.
· An overriding scheme determined by priority bits for critical tasks - for
example, start of data transfer when the traverse reaches the scan start position.
The message frame typically consists of fields denoting Start/End of Frame, Data,
Control, Acknowledgements and CRC Error Bits. Other frames, controlling the
network for bus errors and overloads, are also transmitted between nodes.
CAN BUS
SSB SOMB
CAN BUS = BUS TERMINATOR
FHMB(2)
CAN BUS
CAN/UMBILICAL
FHMB(1) STB
Figure 9.3 CAN buss - system view
Error handling routines, built into the CAN software, automatically attempt a
recovery procedure depending on the type of error reported. All messages on the
bus are checked by each node and acknowledged if they are correct. Bus errors
will cause the frame to be retransmitted, or (in the case of persistent failures) for
error reporting to the system user via the diagnostics.
Luxel CAN controllers are tightly coupled to board MPUs which also manage
local board processes, and include their own CAN interface.
The CAN protocol is based on a reduced protocol stack of three layers. It operates
as peer-to-peer, but for certain tasks also operates as master-slave when, for
instance, the SSB constantly receives and transmits frames. Local data is sent
from a node to the SSB. The SSB returns high-level control signals to the PCB
nodes for synchronising the optics, scanning and film handling sub-systems.
Luxel employs the high-speed CAN version (CAN-H) where signal levels are set
at 2.75-4.5 V (HIGH) and 0.5-2.25 V (LOW). Terminations (at 120 ohms) are
provided.

CAN network bussing on Luxel is based on interlinking cables, daisy-chained

between modules. This is shown in Figure 9.3.
9.1.18.1 Servicing CAN Nodes

Service engineers need to be aware of the various problems that can occur when
node PCBs are replaced, swapped or removed. For a working system, the CAN
bus always assumes that all nodes are:
· installed (and fully-populated)
· the mapping tables (with all node IDs) are correct for the installed boards
· the system software levels for each node are identical.
· and the NVRAM parameters held by each board are set for the same machine.
Points to note during a service routine, when removing and replacing the local
control PCBs, are:
· FHMB 1 and 2, although identical hardware assemblies, cannot be swapped
because of embedded software differences.
· Optics parameters for a specific recorder held on the SSB and the SOMB must
match.
· Firmware versions (boot and application) for each PCB node must match. The
current method for managing this is from the configuration details that the
engineer can access with a separate utility program.

9.2 System Board (SSB)

The SSB acts as the ‘overall manager’ of the system and performs the top-level
control and processing tasks using resident firmware that is down-loadable. Some
of the main functions and features of the SSB are:
· an interface to image data from the RIP server
· motherboard control for system dongle facility
· I/O connection to external modules (processor, MMI, CAN bus boards and RIP
server)
· image data store and processing before exposure
· control of multi-laser circularizing correction resulting from spinner mirror
rotation
· master system control for film handling motors and sensors.
9.2.1 SSB System Control

This section contains a description of the control, software and interface logic
necessary for the operation of the SSB. Figure 9.4 shows the main SSB control
functions.
9.2.1.1 System Control

See Figure 9.4.
System control, based on the MPU (Motorola 68376), acts as an intelligent
‘supervisor’ for the Luxel system to receive high level commands from the CAN
network and transmit commands for driving the other electronic sub-systems.
Overall control is based on the following functions:
MPU
· CAN controller
· CPU bus data/address decoding
· RS232 diagnostic interface
· software watchdog
Memory
· Flash memory
· SRAM memory

DATA CONTROL
LBUS
I/F
RTC
CAN BUS (TO SOMB/FHMB)
MBUS
I/F
DATA CONTROL
MEMORY
TEMP
FLASH/
SRAM
IC
(BRIDGE)
PCI
I/F
MPU
TO AODD MODULE
CPU BUS
AODD
I/F
TO CONTROL
CONSOLE
MMI
I/F
CONTROLLER
SERIAL
RS232
TO INTERLOCKS
INTERLOCKS
I/F
DIAGNOSTICS
PROCESSOR
S/W DEBUG
Figure 9.4 SSB Control Functions
Interfaces
· MMI
· PCI bus interface
· Interlocks
· Data manager
· Mbus interface
· Media processor
· PSU sequencing.
Local Input/Output

· RS232 software debug

· interrupts control and masking
· control and status registers.
9.2.1.2 MPU
Note: MPUs fitted on future production machines are likely to be upgraded to
include new enhancements.
The MPU device has a 32-bit data bus core and is currently clocked at 20 MHz. It
executes the software instructions resident in Flash memory. On power-up, the
MPU carries out the following functions:
· Performs a reset.
· Initializes on-board devices, such as, the SCSI controller.
· Initiates a boot sequence which loads the system software from Flash memory.
· Initiates a Power on Self-Test (POST) routine to determine correct operation of
the board’s components.
9.2.1.3 SSB Reset

The MPU generates a reset signal for the entire system. Resets are activated if, for
instance, the 5 V power rail is below the 1.5 V range.
A software watchdog asserts a system reset (or interrupt) if the software fails to
service the watchdog for a designated period of time (a selectable timeout period).
9.2.1.4 FCAN Controller

An FCAN bus operates as a distributed network for the SSB to provide overall
control for all the local control PCBs. This controller operates as a function on the
SSB MPU. See Section 9.1.18.
9.2.1.5 Flash and SRAM Memory

Application, boot and diagnostic code files for the MPU are stored in
(non-volatile) Flash memory before transfer to the MPU on power-up or user
request. Two MBytes of Flash PROM (512 Kbyte devices) are fitted as standard,
with provision for a further 1 MByte at a later stage.
The contents of the Flash memory can be updated at any time from a utility
running on the RIP server. This facility is used for on-site software and
configuration updates.
One MByte of SRAM (512 Kbytes devices) is used (alongside Flash memory) to
provide writable storage for the MPU.

9.2.1.6 Media Processor Interface

This is an RS232 communications interface used to transfer status information
from a specified media processor to the recorder. The link is based on a protocol
that allows the exchange of status data and commands (for instance, to start/stop
the processor) so that the unit can be controlled from the recorder. All specified
processors have their communications link enabled from the MMI.
Other types of processors, not specified for use on Luxel, do not have an RS232
interface, and operate by sensing each strip of film as it arrives from the recorder.
9.2.1.7 MMI Interface

This provides an interface to the MMI console for transfer of touch panel data to
the display controller located on the SSB. The display controller generates the
LCD display screens that appear on the MMI in response to commands from the
MPU.
9.2.1.8 SSB Temperature Monitoring

The SSB monitors its own temperature and generates an in-range or out-of-range
signal from a dedicated thermostat on-board device. Temperature status signals
are periodically read by the SSB which stops scanning and reports a failure to the
MMI as an error code if the reading is out-of-range.
9.2.1.9 RS232 Serial Interface

Provision is available for a number of serial interfaces to external modules and
peripherals.
· diagnostics
· media processor
· source level debugging (development testing only).
9.2.1.10 PSU Sequencing

On power up, or during an active interlock, a number of voltage lines are inhibited
by the SSB to ensure the correct startup/shutdown sequence is obeyed for safe and
reliable operation. This ensures that the PSU power sequence is started after the
+5 V logic control supply switches on. The following voltages are delayed:
· +24 V (AODD).
· ±15 V - these rails are on after the +5V line and within 5 msec of each other.
· +24 V - this is inhibited when the interlock is active and switched on when the
door/cover is replaced. It is activated after the ±15 V.
· +36 V - this is inhibited when the interlock is active and switched on when the
door/cover is replaced. It is activated after the ±15 V.

9.2.1.11 PCI Bus Interface

A PCI bus is used to interface the external SCSI devices (RIP server) to the
compressor via a PCI bridge device. Future provision is made for a spare PCI
socket that can connect a PCI card. See Figure 9.6.
9.2.1.12 Pixel Clock Generation

A Phase Lock Loop (PLL) generates an accurate clock for the serialiser (see
Figure 9.5) that is an integer multiple of the spinner encoder (DATA_A signal) so
that the data clock always occurs at the same place around the drum. This multiple
is the function of the drum circumference, output resolution and the number of
lines on the spinner encoder.
9.2.1.13 CPU and Memory Busses

The MPU accesses the memory devices and other various interfaces - PCI, MBus,
MMI and serial connections - via a CPU bus which provides for 24-bit addressing
and 16-bit data transfers.
The memory bus (M-bus) interconnects the image data processing functions,
shown in Figure 9.5. Bus devices - the internal SCSI controllers, C-FIFO/D-FIFO
DMAs and the MPU subsystem - run as M-bus masters. The buffer memory,
however, acts as a bus slave. The bus, which is clocked at at 20 MHz, also
includes a priority arbitration scheme.
9.2.1.14 Voltages and Drives

The SSB operates with the following voltages supplied from the PSU:
· +5 V - used by digital and analogue devices.
· +15 V - used by the PLL and regulated down to +12 V for use by the disk
drives.
9.2.1.15 SSB Diagnostics

The MPU is able to run a set of on-board checks for the memory and registers
from commands and on power up. Checks extend to the full data path.
9.2.1.16 Real-Time Clock

An embedded R-T clock is used by the system for date and time stamping. The
clock is set from an engineering utility.
9.2.1.17 NVRAM
NVRAM stores the machine-specific setup parameters.

9.2.1.18 Interlock Interface

Interlocks operate as a switch that opens a circuit when a cover is opened. This
circuit, which is supplied by a fuse protected +12 V line, trips two relays: one (B)
on the SSB to cut 15 V to the SOMB and ULMB, the other (A) on the PSU box to
cut +24 V and +36 V to the FHMBs and the STB. The result is to disable all film
handling and laser while still allowing the optics motors to run (since these do not
represent a risk to the operator). At the same time, the SSB digitally disables the
PSU and turns off power.
When the doors are closed, the interlock relay is energised but the PSU does not
supply voltage until the SSB performs a power up sequence which ensures that
the correct voltage levels are reached in a pre-determined order. The system then
boots up.
9.2.2 SSB Data Path

Figure 9.5 shows the image data route and functions on the SSB from the RIP
image data input to the laser modulator.
9.2.2.1 Data Path Operation

See Figure 9.5.
The basic sequence for processing image data by the SSB is as follows:
1. An image file (page/picture) is sent from the RIP via the PCI SCSI link.
2. Data is transferred, via the PCI bus, to a compression circuit in consecutive
16-bit wide words. Direct memory access (DMA) and a first-in first-out
(FIFO) buffer provide optimum transfer rates.
3. Compressed data is transferred to a buffer memory in consecutive words using
DMA/FIFO. From here, image data is stored to the SCSI disk.
4. Steps 2. to 3. are repeated until a the complete image is received.
5. When an image is to be exposed, the SCSI bandwidth is allocated on a priority
basis to the output process.
6. Steps 2. to 3. are reversed. Data is taken off the image storage disk,
decompressed, and transferred to the output formatter/serializer by the DMA
and FIFO buffer.
7. The serializer synchronises data to an absolute position on the drum, and
passes data to the laser modulation cicuits (on the SOMB and ULMB) which
control beam modulation onto film.
The data path is capable of receiving image data from the RIP while transferring
data to the optics system.

TO LASER MOD
SERIAL-
(FROM
INDEX
ISER
SPIN
STB)
FORMAT-
OUTPUT
TER
PIXEL
GEN
CLK
COMPRES-
GENERATOR
PATTERN
SION
DE--
DATA A
(FROM STB)
DMA/
FIFO
SYSTEM CONTROL
MBUS
MBUS
MBUS
MEMORY
BUFFER
TO SSB
MBUS
I/F
MBUS
LBUS
DMA/
FIFO
INTERNAL
SYSTEM CONTROL
SCSI
I/F
TO SSB
LBUS
COMPRES-
I/F
DATA
SION
SCSI
DRIVES
DISK
DMA/FIFO
BRIDGE
PCI
SCSI
PCI/
RIP IMAGE DATA
Figure 9.5 SSB data path
9.2.2.2 External PCI SCSI

See Figure 9.6.
An external 16-bit differential SCSI bus (Ultra SCSI specification) links the RIP
server to the SSB.
All on-board SCSI functions are managed by a SCSI controller connected to an
internal PCI bus. In normal operation, image data is DMAed by the controller to
the compressor, with the data path across the PCI bus and a bridging device.

Control commands from the SSB MPU are sent to the controller via the PCI
bridge.
The SCSI controller and PCI bridge device are configured by the SSB MPU. A
spare PCI expansion slot allows the use of a PCI card to download data to the data
compression function as an alternative interface.
MEMORY
BUFFER
COMPRESSOR
SRAM
FIFO
CONTROL
CONTROL
BUFFER
MPU
IMAGE
DATA
CONNECTION
EXPANSION
BRIDGE
PCI
PCI
PCI BUS
CONTROLLER
IMAGE
DATA
SCSI
IMAGE
DATA
SERVER
RIP
Figure 9.6 External SCSI - block view

9.2.2.3 Data Compression/Decompression

See Figure 9.5.
Data interfaces for compression/decompresssion devices are set at 16 bits for
maximum performance. A separate DMA controller manages the transfer of data
from the compressor to the FIFO and from there to the buffer memory on the
Mbus. Up to 16 transfers can be completed before the bus is released. The
compression technique applied is LZW. Compression/decompression data
transfers are increased in speed by DMA control of the bus and I/O FIFO buffers.
1. A compression (C-FIFO) input on the DMA controller interfaces to the
compressor and accepts data at its the maximum rate while space exists in the
FIFO. The input data pat is 32-bits wide.
2. A compression (C-FIFO) output on the DMA controller provides a master
interface to the Mbus and the buffer memory. The output data path is 16-bits
wide.
3. The D-FIFO function for the decompression DMA controller operates in the
same way as the compression DMA controller explained in steps 1. and 2.
The length of the compressed record depends on a calculated setting for multiples
of input data lines. This calculation is also used by the decompressing process.
A dual decompressor system strips alternate records from the buffer for transfer to
the output formatter.
9.2.2.4 Buffer Memory

This function provides intermediate DRAM storage between the data
compression/decompression devices and the disk drives. The size of the buffer is
8 MBytes and the data burst rate is 80 Mbytes/sec. Buffer management is based
on four data streams:
· odd/even compression records from the compressor are written to disk
· odd/even records from the disk are written to the decompressors.
9.2.2.5 Internal SCSI Bus and Drives

A complete image is loaded into two disk drives that operate with separate SCSI
busses in order to improve performance. Each bus conforms to the single-ended
narrow standard that is also SCSI 3 (Ultra SCSI) compliant.
For information on the disk drive configuration, see Section 3.2.2.2.
9.2.2.6 Output Formatter

The formatter receives decompressed data and stores it into three line-oriented
buffers (one buffer per beam) before transfer to the serialiser. Each decompressor
has its own set of line buffers to cater for a minimum of 90 lines of the output
image. The actual number of scan lines that the buffer holds is calculated by a
formula at the compression stage.

Data is passed to the serialiser by alternating the output from the buffer of each
decompressor. Once the requested number of lines have been written to the buffer,
and the output buffer is empty, the buffers are flipped for the next set of
decompressed lines.
9.2.2.7 Serialiser
The serialiser takes the three beam streams from the output decompression buffers
and serialises them into data streams for the laser diode drivers. It uses all the data
from the output buffers on the first decompressor before switching to the alternate
output buffer on the second compressor. To avoid positional errors, and determine
the start of image, a clock feeding the serialiser is synchronised to the INDEX
signal from the spinner encoder.
Under software control it is possible to output diagnostic signals instead of an
image stream. Also, additional CRC encoded data is included for full speed
diagnostics checks.
Alternative data is also provided by a pattern generator that sends grids, dots and
dedicated registration patterns used for setting up and aligning the optics. An
interface for the engineer to generate test strips is explained in Section 5.2.
9.2.3 AODD Interface (on SSB)

See Figure 9.7.
The Acoustic-Opto Device Driver (AODD) interface on the SSB provides the
controls used by the drivers to modulate signals that deflect (ie correct) the two
laser beams )LD1 and LD3). Section 9.12.4 explains this laser circularizing
correction technique in more detail.
The number of spinner encoder pulses are counted at the start of the index pulse
to calculate the exact angle of the mirror. The count is then used as the address for
a Frequency/Linearise LUT to supply correcting data that generates an RF signal
for the AOD module on the optics base. This data approximates closely to an
exact digital representation of a sine wave to compensate for the twist in the outer
beams of a multi-laser optics system. Note that both X and Y deflection is
necessary to keep the deflected beam exactly parallel to a reference non-deflected
beam.
Depending on the position of the mirror, a data word is passed to a D-to-A
converter (on the AODD module) that provides a linearised signal modulated at
80 MHz. This signal is used to deflect the two laser beams when they are passed
through an AOD module. The LUT also supplies extra words that compensates
for the optical beam power modulated by the deflection system.
To avoid the risk of patterning across multiple lines from this deflection system, a
small amount of noise is introduced into the deflection signals by a second
Random/Linearise LUT addressed to cover the range of multiple lines.
Both LUTs (Frequency/Linearise and Random/Linearise) have their addresses
‘locked’ to the spinner encoder signal.

A frequency monitor signal is returned from the AODD for use during the
calibration process.
The AODD interface is able to support two identical control ports for separate
types of AODD modules - 2-channel and 4-channel, depending on the laser
configuration. Output to the AODD is from a data line where the frequency and
data is multiplexed.
CORRECTING
TO OPTICS
MODULE)
SIGNAL
BASE
(AOD
DRIVER
AOD
AODD MODULE
DRIVER
I/F
DIFF
LINEARISE
RANDOM/
LUT
FREQUENCY
MONITOR
FREQUENCY/
GENERATOR
LINEARISE
AODR
LUT
GENERATOR
ENCODER
SPINNER
AODR
I/F
SSB
(FROM
INDEX
STB)
SPIN
Figure 9.7 AODD interface functions - block view

9.3 Film Handling Motor Boards (FHMB)
9.3.1 FHMB Description

See Figure 9.8 to Figure 9.10 and Section 3.3.4.
Two Film Handling Motor Boards operate as intelligent local nodes under the
system management of an SSB that sends high-level media handling commands to
each board and also receives sensor status messages. Film handling control is
distributed across the CAN bus and effectively operates in ‘real-time’. This allows
devices (sensors, motors, solenoids, relays and fans) to switch on/off in the
appropriate sequence for moving film from the cassette to the fume shutter exit.
CASSETTE IDS
FILM AT CASSETTE/BUFFER/DRUM
CASSETTE LOCKED
BUFFER GUIDE CLOSED/OPEN
CASSETTE DOOR CLOSED
CHAD TRAY IN FHMB (1)
PUNCH UP/DOWN
FILM FLAP OPEN/CLOSED
FAST OPTICAL POWER DETECER
FILM IN PUNCH
FUME FLAP OPEN/CLOSED
HORIZONTAL NIP OPEN/CLOSED
FILM IN VERTICAL OUTPUT FHMB (2)
FILM IN HORIZONTAL OUTPUT
CUTTER AT RIGHT/LEFT
Figure 9.8 Film handling sensor inputs
FHMB functions are:

· An interface for sensors connected directly or indirectly (via distribution
boards) to the nearest FHMB.
· Control of motor drives associated with each sensor.
· Control of local solenoids and fans.
Two FHMBs, designated (1) and (2), share the film handling tasks as follows:
· FHMB (1): devices in and around the Input assembly and drum (punch and
chad tray).

· FHMB (2): devices in and around the output assemblies (Vertical output and
Horizontal tray and guillotine).
Both boards are identical in build, but the tasks they perform depends on the
devices they control. Because the handling software routines are configured for
each device, it is not possible to interchange the two FHMBs. Service engineers
can check the configuration (software issue levels, etc) from a separate utility, or
dump and restore configuration parameters to a local hard disk. NVRAM values
for local film handling can also be accessed and stored to disk.
Each board manages the sensor inputs and motor drives to the devices shown in
Figure 9.8 and Figure 9.9.
INPUT BUFFER GUIDE (DC)
PUNCH (DC)
FHMB (1)
CASSETTE UPPER/LOWER (STEP)
DRUM INPUT (STEP)
a) Motors -- FHMB (1)
GUILLOTINE (DC)
HORIZONTAL NIP ROLLER (DC)

FHMB (2)
VERTICAL FILM OUTPUT (STEP)
HORIZONTAL FILM OUTPUT (STEP)
b) Motors -- FHMB (2)
CASSETTE DOOR LOCK 1--2
FHMB (1) PRESSURE FAN (2)
EXHAUST FAN
c) Solenoids/Fans -- FHMB(1)
VAC PUMP ON/OFF
FHMB (2) VACUUM 1 -- 3
PRESSURE FAN (1)
d) Solenoids/Fans -- FHMB (2)
Figure 9.9 Film handling motor/solenoid/fan outputs

9.3.1.1 MPU Controller

See Figure 9.10.
The CMOS MPU controller, running at 10 MHz, executes the local software
routines for transferring sensor data messages to the SSB and driving motors,
after receiving SSB high-level commands. Software drive routines, resident on the
board, are invoked by the SSB to run a specific motor depending on the CAN
sensor messages received.
Stepper Motor Drive Control
Stepper motors are driven from timer processor (TPU) channels on the MPU and
by associated control registers.
Watchdog Timer
Resident on the FHMB is a watchdog circuit which monitors the board for a
software failure. If a software ‘crash’ occurs, the watchdog times out and the
current motor outputs are disabled. The board is reset after a watchdog failure by
powering the system up again.
MPU Memory
The board memory consists of two types of memory: 512K x 8 FLASH and 512K
x 8 SRAM. Programmable Flash program memory can be modified by
downloading new firmware from a utility. Temporary data for the MPU is held on
SRAM.
MPU Reset and FHMB Initialisation
A reset signal from the SSB is opto-isolated on the FHMB. Local initialisation of
devices is controlled by the MPU.
CAN interface
The MPU includes an integral CAN controller that interfaces to the CAN bus. A
separate Tx/Rx device operates as the driver.
Sensor interface
An A-to-D circuit on the MPU allows the system to monitor signals from the
vacuum pressure level sensor and from the fast photo power detector.
RS232
An RS232 serial port accesses the MPU for background diagnostics. This outlet is
only used for development purposes.
9.3.1.2 Diagnostics
Diagnostic facilities are included to test the functionality and status of the FHMB.
These monitor the power supply voltages and the status of the fuses, carry out
RAM and EPROM checks, and allow the service engineer to manually control I/O
devices in the following ways:
a) motors on/off and move a set distance
b) sensors on/off

c) solenoids on/off.
Details of the FHMB on-board diagnostics is provided in Chapter 10.
FILM HANDLING MOTOR BOARD

SOL 0
SOL 5
SM 0
SM 3
DC 0
DC 2
to
to
to
SOLENOID
DRIVERS
DRIVERS
STEPPER
DRIVERS
MOTOR
MOTOR
DC
SOLENOID
CONTROL
CONTROL
CONTROL
STEPPER
MOTOR
MOTOR
STB POWER)
DC
UMBILICAL
(CAN OUT
AND
MEMORY
MPU
CAN BUS
TX/RX
CAN
MPU
REGISTER
A to D
& SYNCH.
PULSING
SENSOR
SENSOR
RS232
S27
S0
to
SENSOR
SENSOR
DETECT
PHOTO
FAST
VAC
I/F
CAN IN
(1 & 2)
DETECTOR
SENSORS
S27
PHOTO
S0
FAST
VAC
O
N
R
S
E
S
Figure 9.10 FHMB - block view
9.3.1.3 Sensor Interface

This interface consists of 1032 PALs that can handle up to 16 inputs. Sensor
inputs are read via PAL status registers which are configured to initiate an
interrupt to the local MPU.

9.3.1.4 CAN Bus In/Out

The CAN bus interconnections for the two FHMBs and the STB is based on the
daisy-chain arrangement shown in Figure 9.3. CAN bus data and power to the
STB is conveyed through an umbilical cable attached to FHMB (1).
A fuller description of the CAN bus system is given in Section 9.1.18.
9.3.1.5 Voltages, Filters and Interlocks

Voltages generated by the FHMB from an external +24 V source are:
· +5 V - digital/analogue circuits and CAN (supplied by on-board switched
mode, 150 KHz, regulated from +24 V)
· +18 V - fast optical power detect (regulated from +24 V)
Two inductors on the FHMB filter the 24 V supply.
Interlock relays in the PSU box, controlled from the SSB, switch off the +24 V
and +36 V supply to the FHMBs. Note that the +36 V is routed through FHMB
(1) to the STB but is not used by FHMB (1).
9.3.1.6 Fast-Photo Power Detector (FPD)

A fast-photo power sensor, located above the Input assembly, detects the level of
laser power (film exposure) from the spinner mirror reflections revolving around
the drum. This data is continuously passed to FHMB (1) which monitors the
power level to determine the extent of contamination (mostly from fine dust and
debris) that gradually accumulates on the mirror. Once a threshold level is
reached, the MMI is sent an alert for cleaning the spinner mirror.
Once a threshold level is reached, the MMI displays an error code for cleaning the
spinner mirror. Low levels of contamination are automatically compensated for by
an offset added to the NVRAM ND wedge value before a job exposure; upper
levels require the mirror to be cleaned and the contamination NVRAM parameters
to be reset. See also Section 10.2.5.
The sensor intercepts the beam once per spinner revolution. Measurements of
relative power are made while the spinner runs at maximum speed, with detector
pulses sent directly to the the MPU for digitising and monitoring.
9.3.1.7 On-Board Fusing

The board has built-in fuse protection for the output and switching circuits, plus
spare fuses available for the service engineer. Fuses are deployed as follows:
a) one fuse for each stepper and dc motor
b) one fuse for each high-power solenoid
c) one fuse to cover all the low-power solenoids
d) four spare fuses held in holders distributed around the board.
The status of each fuse is read from a diagnostic check.

9.3.1.8 Output Controls and Driving

Film handling motors and solenoids are controlled and driven from the FHMB.
Solenoids, Relays and Fans
The FHMB ia able to drive up to:
· Three high-power solenoids or relays at 24 V (1 A peak) while under the
control of two registers.
· Three low power solenoids or relays at 24 V (500 A peak).
· A constant +24 V to the pressure fans.
DC Motors
DC motor controller/drivers can deliver up to 1 A at 24 V to motors via a control
register.
Stepper Motors
Stepper motor control is provided for a set of film handling stepper motors. Two
TPU (Timer Processor Unit) channels from the MPU provide the step clocking
edges to each motor controller: the even channel steps the motor while the odd
channel serves as a feedback path to the TPU for pulse counting. The stepper
control circuitry provides the correct stepping sequence for each motor. Control
registers, selected by the MPU, determine the type of holding current, motor
enable and motor direction.

9.4 Traverse Board (STB)
9.4.1 STB Description

See Figure 9.11.
The STB controls the spinner and traverse mechanisms, and also provides the
drive currents for the spinner and traverse motors.
The main functions located on this PCB are described below. Refer to
Section 9.13 for more information on how the STB operates as part of the media
scanning subsystem.
9.4.1.1 MPU Controller

The main functions of the MPU (Motorola 68376) are:
· To control the STB locally by receiving and interpreting high-level commands
sent from the SSB over the CAN bus. These commands typically include, for
example, Spinner Start/Stop, Perform Spinner BITE, Fans On/Off.
· Initialises the Precision Motor Controller that operates the closed-loop
positional feedback system from the spinner encoder.
· Pass control and positional data to the Precision Motor controller.
· Control the flow of diagnostic data to a local VDU.
The controller is a CMOS device, clocked at 20 MHz, that also includes a CAN
interface to the SSB system MPU.
Local Memory
Program memory for the MPU is available from a 512 Kbyte Flash device and an
additional 128 Kbyte RAM.
Spinner and Traverse Diagnostics
Current is measured whenever the brake is applied using a sample fed to the
A-to-D function on the MPU.
CAN Interface
The MPU has a built-in CAN controller and an interface to the RFI opto-isolated
transceiver that buffers the CAN network. Data rates are approximately 250 K
bits/sec.
Serial Port
An RS232 serial port provides a connection for transferring background
diagnostics information to a local VDU. This port is only used for development
work.

9-32
DATA A
TO SSB SPIN INDEX

(VIA
FHMB 1)
STB Reset
HALL SENSE
CONTROL
(BRAKE, ETC.)
Section 9.1.17.
ENABLE OUTPUT 3-PH DRIVE
MEMORY SPINNER DRIVE
CONTROLLER (AND
COMMUTATION)
SPINNER
480 KHz
LOCK/
FAULT
CAN BUS
TO SSB 19.2 MHz REF
(VIA FHMB 1) MPU
CLK
RS232 13.6 MHz

TRAV
INDEX/ TRAVERSE
Figure 9.11 STB block view

HOME MOTOR
PRECISION DC
MOTOR DAC OUTPUT
CONTROLLER DRIVE
+36 V DC--DC +5 V
READHEAD
+24V POSITION SIGNALS/TRAV INDEX/HOME

STB
ENCODER
described in Section 9.13.4. The overall system initialisation is described in

SCALE
Power up and system resets for a distributed network also applies to the STB.
This board has its own traverse and spinner initialisation procedures which are
FANS

9.4.1.2 Precision Motion Controller

See Figure 9.12.
An LM628 Precision Motion (PM) Controller, operating in position mode, is
dedicated to controlling the traverse servo mechanism. The device provides
multiplexed 6-bit positiona data to a 12-bit D-to-A controller that drives the DC
traverse motor.
TRAVERSE
MOTOR
COMPENSATION
CIRCUIT
DC
AMP
READHEAD
DAC
+DIFF
PM CONTROLLER
--
CALCULATED
LINEAR POSITION ENCODED SIGNALS

POSITIONS
POSITIONS
CURRENT
GENERATOR
REGISTER
SUM
6.8MHz REF
4.5/
TRAVERSE MONITOR
FREQ SEL
DIVIDER
MHz
13.6
19.2MHz
REF
CLK
MPU
PLL
Figure 9.12 Traverse position control
The PM controller is programmed with position, velocity and acceleration

parameters appropriate for the image size, number of optical beams and

resolution. Two inputs to the PM controller are compared to give a digital error
signal that is converted to a drive voltage.
1. PLL reference frequency at 13.62 MHz divided down into two different clock
frequencies (4.55 and 6.82 MHz), depending on the resolution and number of
beams.
2. Digital encoded signals from the readhead.
The required trajectory is produced by comparing two sets of numerical trajectory
values:
· The desired trajectory positions (in microns depending on the optical speed)
calculated by the PM controller.
· Feedback of current position pulses from the linear encoder to a summarising
register on the PM controller.
A digital error signal is then developed as a numerical value that is passed to the
DAC for driving the motor.
When error or limit conditions are detected, the PM controller is also able to
interrupt the MPU.
9.4.1.3 Spinner Controller

See Figure 9.13.
The spinner circuitry is designed to drive the spinner motor at a constant speed
with the minimum amount of fluctuation. This control is assisted by an optical
encoder, mounted on the spinner shaft, that provides the instantaneous spinner
speed.
How the spinner controller operates with the carriage modules is explained in
more detail in Section 9.13.2.
Spinner controller circuitry on the STB is composed of five separate functions
detailed below.
1. Phase Detector
The phase detector compares the phase and frequency of DATA A (960 pulses per
revolution) from the encoder with a reference frequency of 480 KHz (or 160 KHz
when the spinner is idling at 10, 000 rpm). This allows any deviations of spinner
speed to be determined.
2. Analogue Servo
An analogue servo, consisting of an integrator and a phase advance circuit,
ensures that the spinner is phase-locked to the reference signal (that is, edges are
co-incident). A filter sets the overall bandwidth of the control loop.
3. Pulse Width Modulator
This function turns the analogue servo signal into a 60 KHz digital pulse train
with a duty cycle proportional to the analogue signal level. This signal has an
offset, so 5 V represents 0% and 10 V represents 100%.

4. PAL
A PAL logic stage uses the PWM signal to drive the spinner motor with a power
level proportional to the level demanded by the analogue servo stage. It also
sequences the power stage outputs (3-phase) so that the spinner motor is driven
correctly. The logic stage handles control functions, for example, checking that
the spinner speed is within normal limits.
5. Power Output
The power stage takes the six signals from the previous stage and uses these to
control the six MOSFET transistors which switch to energise the motor windings.
See Figure 9.13. Hall sensors around the rotor indicate the position of the rotor,
and their outputs are decoded for switching MOSFETS in the correct sequence to
start the motor.
REF FREQ
(480 Khz) TP11 TP9
PULSE
PHASE ANALOGUE PAL
WIDTH
DETECTOR SERVO LOGIC
MODULATOR
DATA A SENSE
960 PULSES/REV
+36 V
POWER
TP9 OUTPUT SPINNER OUTPUT
3-PHASE
166 microseconds
+36 V
TP11 OUTPUT
DEMAND ON MOTOR
STARTUP WINDINGS
RUNNING
DEMAND
SWITCH
OPENS FOR
BRAKE ON
Figure 9.13 Spinner speed control circuit
9.4.1.4 Spinner Braking

When a ‘Stop’ command is sent, or the PSU is interrupted, the top winding
switches are opened and the bottom switches are closed. This type of braking is

regenerative and effectively short-circuits the motor windings. Braking time for
the spinner is less than 20 secs.
9.4.1.5 Reference Clock Generation

A single 19.2 MHz crystal generates all the reference frequencies for the spinner
and traverse. Dividers and a PLL provide the clocking signals used by the spinner
controller and the PM controller respectively. Synchronised clocking between the
spinner and traverse subsystems is important for obtaining correct media
exposures.
9.4.1.6 STB Diagnostics

The MPU manages the local traverse diagnostic/utility routines for checking the
presence of the linear encoder, traverse motor and amplifier. These diagnostics are
available from the (Main>) prompt and from the remote login (STB>)
9.4.1.7 STB Voltages and Drives

The STB is supplied with a single +36 V and +24 V:
· +5 V - digital/analogue circuits and traverse motor drive (supplied by on-board
DC-DC device converting +36 V).
· -5 V - analogue circuits (on-board charge pump also supplies -5 V).
· +15 V - for analogue circuits.
· +36 V - spinner motor drive
· +24 V -- media support fans on the baffle.
Analogue signal from the traverse DAC is converted to current by a linear
push-pull amplifier that can be disabled by an SSB braking command. The
traverse current is also available for diagnostic checks.
Supply to the baffle-mounted fans is +24 V, switched via 0 V from the STB by
software control from the SSB.
9.4.1.8 Temperature Monitor

A temperature device on the STB is monitored and, if the reading is above a set
limit, triggers an error code.

9.5 Optics Motor Board Board (SOMB)
9.5.1 SOMB Description

See Figure 9.14.
The SOMB is located on the frontside of the Optics module and includes the
electronics for controlling a single beam system. As an ‘intelligent’ node it
operates, via the CAN bus, under the supervision of the SSB. When combined
with the ULMB, the SOMB is able to drive and control up to three lasers. SOMB
functions are summarised as:
· Receives and interprets commands from the SSB, and transmits status
information to the SSB across the CAN bus.
· Provides processor ‘intelligence’ for controlling the ULMB.
· Drives four low-power stepper motors for the following:
a) ND Wedge wheel
b) focus
c) aperture (beam converter)
d) slow power detection.
· Monitors sensor inputs for accurate positioning control of the optics.
· Provides memory storage for local optics operation and set-up information.
· Provides laser information and power inputs.
· Includes on-board diagnostics.
A single laser diode modulator circuit is provided. This laser diode driver receives
image data from the SSB and controls the modulation of a single laser pen for
automatic power and laser switch-off conditions (to avoid overscanning).
Control also means that the laser expose levels need to be adjustable to cope with
films of different sensitivity and thickness. The drive circuitry is based on a laser
diode set at a wavelength of 635 nm.
Each of the optics mechanisms (ND, focus, aperture and SPD) are moved by the
stepper motors to their Home position and a number of steps in either direction
from Home. Two sensors control focus and aperture; one sensor is used for the
ND wheel and SPD. Three photodetectors are controlled from the SOMB:
1. Laser diode internal detector: housed inside the diodes and used to check the
diodes drive output level - low and high output levels are read and calibrated
by internal photo-diodes which set the internal levels. The diode detectors are
also used for automatic power compensation to adjust for environment
changes.
2. Position detector (POD): a two dimensional position detector that is used to
measure the relative alignment of the laser beams. This detector is calibrated
in conjunction with the ND wheel to obtain the optimum level of light power.

3. Slow power detector (SPD): used as a reference for setting the output drive
level, it does not require calibration.
The SOMB also controls laser power output during scanning. As the laser warms
up the drive output level characteristics change subtly, especially when outputting
a black line. These characteristics are compensated with a feedback (once-per-rev
calibration) and feedforward (droop compensation) circuit. Shading to
compensate for variation of light power around the drum is managed by the
SOMB which holds the shading data on LUTs. Currently, the shading facility is
not used.
LASER DRIVER CONTROL

LASER
MOD
2
ULMB
LD GATING
APC/SOFT
REGISTERS
COMPEN--
START
DROOP
SATION
STATIC
DACs/
ULMB
ADCs
I/F
ENVIRONMENT
FLASH
SHADING
TABLES
MPU
CONTROL I/F
LD IMAGE
VOLTAGES
CONTROL
DATA/
DRIVERS
SENSOR
DRIVES
MOTOR
CAN
AND
I/F
I/F
IMAGE
DATA
CAN
APERTURE
+15 V
+24 V
SENSORS
+5 V
POS DET
WEDGE
FOCUS
SSB
HOME
LIMIT/
SSB
C
P
B
A
S
E
T
I
Figure 9.14 SOMB - block view

9.5.1.1 CAN Control Interface

Real-time CAN signals are received and transmitted from a transceiver. CAN
power (+5 V) is supplied to the SOMB from the CAN connector.
9.5.1.2 ULMB Interface

With a ULMB fitted, the SOMB MPU controls the laser diode drive circuitry for
LD1 and 3 across a data/address bus.
9.5.1.3 Diagnostics
Routines run on the SOMB generate error messages which are read by the
diagnostic software on the SSB.
9.5.1.4 MPU
An MPU, clocked at 10 MHz, runs the local drive and control routines for the
optics sensors, motors and laser controls. High-level commands are received
across the CAN bus and SOMB status messages are sent back to the SSB. SSB
commands move the motors to a certain position; SOMB reports to the SSB on
whether the motors can be moved or not.
9.5.1.5 Flash Memory

A 512 K x 8 Flash EEPROM holds the optics control code and board diagnostics.
New code is downloaded from the RIP server via the SSB.
9.5.1.6 SOMB Reset

Power on reset for running local initialisation routines is controlled from the CAN
RESET signal.
9.5.1.7 Voltages and Drives

The supplied voltages, +24 V (drives stepper motors), +5 V (digital devices) and
±15 V (drives lasers), are monitored by the MPU for providing environment
information.
9.5.1.8 LD Image Data/Control I/F

This is the interface for the image data from the SSB.
9.5.1.9 Sensor Interface

The set of limit and home sensors on the Optics module supply data to the SOMB
for controlling the optics motors.

Motor Position Sensors

Sensor interfaces are available for each of the motors:
· ND wedge (S1)
· Focus (S2 and S3)
· Beam Converter/Aperture (S4 and S5)
· Slow Power detector (S6)
These sensors also generate data that is converted to digital format for use on the
CAN bus by the SSB. A description of their separate functions is explained in
Section 9.12.2.
Slow Power Detector
Power levels for each beam are measured from the SPD and compensated for by
the SOMB to obtain equal levels.
Position Detector
All three beams are aligned by the SOMB from POD data to be co-incidental
during the non-scanning stage.
9.5.1.10 Motor Drivers

Low power (unipolar) stepper motors for the ND wedge filter, focus, aperture and
slow power detector are driven from the Timer Processor Unit (TPU) channel
levels generated by the MPU.
9.5.1.11 Laser Driver Control

Laser diode modulation (for LD2) is controlled from a block of circuitry on the
SOMB that is also duplicated on the ULMB. Functions include:
· Droop Compensation: as the laser diode warms up during an active scan line,
its characteristics change slightly to cause the power output to drop during the
initial time of, for instance, exposing a black line. Extra current is injected to
compensate for this change.
· DACs/ADCs: laser diode (LD2) power (to include bias, droop, position
detection, slow laser power and compensation currents, etc) are converted to
modulated analogue levels. These analogue signals are converted to digital and
read dynamically for monitoring and correction by the MPU.
· Static Registers: Control bits for motor drivers, droop, shading, etc, is held on
local registers.
· LD Gating/APC/Soft Start: this function controls the laser on/off switching for
scanning and non-scanning, and the timing of control signals/image data into
the SOMB and ULMB. Timing for Auto Power Control (APC) is also
controlled.

9.6 Upgrade Laser Modulator Board (ULMB)
9.6.1 ULMB Description

See Figure 9.15 and Section 2.5.
The ULMB contains all the circuitry for controlling two laser diode modulators
(LD1 and 3). It operates as a ‘non-intelligent’ PCB (ie without an MPU) and is
fitted as an upgrade to convert the optics system from one beam to two or three
beams.
PHOTO DIODE
START/MON
LD GATING
APC/SOFT
LASER MOD 3
REG BITS
DACs
OCTAL ADC
REG BITS
DACs
LASER MOD 1
PHOTO DIODE
START/MON
LD GATING
APC/SOFT
CONTROL
IMAGE
DATA/
ULMB
I/F
I/F
SOMB
SSB
Figure 9.15 ULMB - block view

9.6.1.1 Octal ADC

Analogue signals for LD1 and 3 are converted to digital and read for monitoring
and correction on the SOMB. This circuitry performs the same function as the
ADCs on the SOMB laser driver control.
9.6.1.2 ULMB Interface

A data and address bus connects the SOMB to the ULMB for the transfer of
control signals.
9.6.1.3 LD Image Data/Control I/F

This is the interface for the image data from the SSB.
9.6.1.4 ULMB Voltages and Drives

Voltages supplied to the ULMB are +5V (digital devices) and ±15 V (drives
lasers).

9.7 Acousto-Optic Deflector Driver (AODD) Module
9.7.1 AODD Module Description

See Figure 9.16.
Acousto-optic deflectors, located on the Optics base, provide multi-beam
circularising correction from control data supplied by the SSB to the AODD
module. Drivers on the AODD module generate the RF frequency (nominally at
80 MHz) and amplitude signals for the AODs.
DEVICES
(OPTICS
BASE)
AOD
CN 1
FREQ
4
VCO
AOD MODULE
DAC
CLK 1 - 4
FREQ/POWER DATA 1
+24V, +15V,
+5V
FREQ MON
CONTROL
AOD
SSB
SSB
Figure 9.16 AODD module drivers - block view

The SSB interface supplies the correcting frequency and power values as
simultaneous data. At the same time, a clock signal (synchronised with the
spinner encoder) provides control information for the time slots that allows these
values to be consistently positioned within encoder periods.
Figure 9.16 shows the main functions that converts the digital word to analogue
for generating the frequency oscillations. Other functions in the module provide
frequency muting, drive amplification, signal filtering and monitoring outlets.
9.7.1.1 AODD Module Voltages

Voltages supplied to the module, via the SSB, includes:
· +24 V
· +15 V
· +5 V.
9.7.1.2 AODD Diagnostics and Servicing

Diagnostic tests, using generated linearisation data from the SSB, determine if the
module has failed. If this is the case, then the entire module is replaced.
9.8 Miscellaneous Boards
9.8.1 MMI Board

The Man Machine Interface (MMI) board is located underneath the console and
near to the LCD and touchpanel. It provides mechanical support for the
connectors from the SSB, a beeper for alerts, the LCD and touchpanel, see also
Section 3.3.8.
The board includes buffers for the touchpanel data sent to the SSB, and receivers
for the returned LCD control data. A cable link to the SSB supplies voltages and
control signals for operating the touchpanel soft buttons and LCD displays. An
LCD controller device, on the SSB, initialises the display and controls the output
of pixel bitmaps.
Voltages supplied to the MMI include:
· +5 V: converts +5 V to 300 V for the cold fluorescent lamps used by the LCD
as a backlight. The +5 V voltage is also used for the on-board electronic
devices and the LCD.
· +22 V: a nominal voltage for the LCD contrast which is adjusted by the user
and is typically set at +17 V by the SSB.
The MMI board is a non-serviceable unit replaced as part of a ‘sandwich’
assembly that includes the console, LCD, Inverter board and touchpanel.

9.8.2 Film Handling Distribution Boards

See Section 9.3.1 and Table 3.3.
Where sensor devices are grouped together on the input and output assemblies,
the sensor leads are routed to an intermediate distribution board which has a direct
connection to the local FHMB.
· Cassette IDs Upper (A)/Lower (B) PCBs: input sensor wires for the upper and
lower cassettes are routed to the front FHMB (1) via two distribution PCBs.
These boards also house the cassette ID opto sensors.
· Vertical Distribution PCB: vertical output sensor wires are routed to FHMB (2)
via a a single distribution PCB.
Distribution boards are without active electronic components and only serve to
optimise cabling distribution. Other sensors and all motors have a direct
connection to their local FHMB.

9.9 Interlock System
See Figure 9.17.

Opening a pod door (left and righthand side), removing the optics lid above the
Optics module or opening the lower front cover, switches off the +12 V supply to
Interlock relays A and B, which disconnect the voltages shown in Figure 9.17.
NOTES
+24V_AODD A: Contacts closed when covers in place
+5V B: Switches closed when covers in place
C: Present when covers in place
See Note A
+24V +24V
SUPPLY TO FHMB 1/2
+36V +36V AND STB
SUPPLY
GROUND
INTERLOCK TO SOMB
RELAY A +24V AND ULMB
SUPPLY
+12V 1A
+15V REG
I_LOCK
GROUND
LH DOOR
+5V CONTROL
See Note C
OPTICS
COVER
INTERLOCKS x 4
See Note B
INTERLOCK
FRONT
RELAY B
I_LOCK_RTN
+15V +15V
-15V -15V
RH DOOR
TO SOMB
See Note A AND ULMB
+24V_AODD INHIBIT
CRTL +24V CRTL
INHIBIT
+36V CRTL +36V CRTL
+24V I_LOCK_STAT2
I_LOCK_STAT1
I_LOCK_STAT3
PSU
SSB
PSU BOX
RFI BOX
Figure 9.17 Interlock control interconnections

The ground connection from the relay A (switching the +15 V and --15 V supplies
to the SOMB and ULMB) is connected to ground through a transistor controlled
by a +5 V control line from the SSB. This ensures that the relay is only energized
after the +5 V supply is present, so that the logic control circuits are powered
correctly before the laser diodes are switched on. Once the 15 V lines are
activated, the SSB and slave board circuits are powered. At this stage the +24 V
and +36 V are still inhibited.
The four interlock switches are all the same, containing two normally closed (NC)
and one normally open (NO) switches, see Figure 9.17.
Each interlock switch provides a status signal to the SSB: I_LOCK1/2 gives the
status of the pod doors and I_LOCK3 the lower front cover. The status signal from
the front panel uses the N/C switch, which is different from the LH and RH door
status signals.
When a pod door is opened, the status lines are connected to ground (logic 0) by a
twin contacts within each interlock switch. Removing the lower front cover
connects its status line to a floating logic high.
The SSB provides three Inhibit signal lines to the PSU control system: these are
for switching off the +24 V and +36 V supply to the FHMBs and STB, and the
24 V AODD supply. SSB software uses these lines to enable these voltages when
the +5 V supply has stabilized. For the +24 V (AODD) supply, this delay is
required to allow the correct power sequencing for the AODD. For the +24 V and
+36 V supply, this delay is required to reduce a power surge.
Note: Note that because the +5 V on the STB and FHMBs is derived from the
+36 V line, communication with these boards over the CAN is not possible
when the +36 V line is open.

9.10 Vacuum System

A vacuum distribution system is essential for conforming film to the drum and
ensuring that exposure registration is within specification. Vacuum is only applied
during the load/reload sequence which is described in Section 9.11.3.
VALVE V3
P
A
DRUM BLOW (EXHAUST) TO DRUM BLOW
VACUUM PUMP R
VALVE V2
P
A
TO MIDDLE VACUUM
CHAMBER OF DRUM
VACUUM OUTLET
R
VALVE V1
P
A
TO OUTER TWO VACUUM

CHAMBERS OF DRUM
R
Figure 9.18 Vacuum distribution (schematic)
Vacuum is supplied by a pump, with valve regulation controlled from two

solenoids (V1 and V2) that switch vacuum to the three chambers shown in
Figure 9.19 -- two outer (B) and one inner (A). Each chamber has a set of grooves,
(totalling 23 for the drum) which are selected according to the film width installed
on the currently active cassette. Solenoid V3 operates as drum blow for the
vacuum exhaust and provides a quick release of the vacuum seal by blowing air
into the chambers.

X (VALVE 2) Y (VALVE 1)
560, 768 mm 1067, 1130 mm
DRUM
VACUUM
CHAMBERS
B A B
KEY
FILM
CHAMBER GROOVES COVERED
WIDTHS (mm)
A 560 2 OUTER GROOVES NOT COVERED IN CHAMBER A
768 ALL GROOVES COVERED IN CHAMBER A
B 1067 1 OUTER GROOVE NOT COVERED IN CHAMBERS B

1130 ALL GROOVES COVERED IN CHAMBERS B
Figure 9.19 Vacuum distribution - schematic view

9.11 Film Handling System
The main film handling features of the Luxel F-9000 Recorder are listed below:
· Automatic film feeding, exposing, punching, cutting and conveyance to the
media processor.
· Operator recovery from film jams indicated on the MMI.
· Dual-cassette operation.
· Selectable media widths.
This section describes the types of media used by the system and how it is
handled through the media path. For procedures on replacing film handling
assemblies, see Chapter 4.
9.11.1 Luxel Media

Luxel operates with photo-sensitive roll-fed film in the range of a red laser diode
with a 635 nm wavelength. Supply to the recorder should be for daylight loading,
operation and processing. A full specification of the type and manufacture of film
required is given in Luxel F-9000 Recorder Operator’s Manual.
Media sizes supported are:
· Thickness: range from 0.004 in (0.1016 mm) to 0.007 in (0.1778 mm).
· Width: 1130 mm, 1067 mm, 914 mm, 761 mm, 670 mm and 559 mm.
· Length: 60 m (200 ft) max for 0.004 in and 36 m (118 ft) for 0.007 in film.
Media types supported are:
· High Gamma (Fuji HSR-4 and HSR-7).
9.11.2 Film Climatisation and Input Buffer Guide

See Figure 9.20.
Film climatising from the cold storage environment to the warmer drum
temperature is required before an exposure cycle. The system is based on an input
buffer guide (or film deflector), that switches in two directions to open and close a
climatising buffer area above the horizontal tray. During a LOAD sequence (for
the upper cassette), the buffer guide is closed and film is loaded directly into the
drum. During a RELOAD sequence (for both cassettes), the guide opens to divert
film into the buffer area where it hangs to allow air to circulate around both film
surfaces. Film is continually fed by the cassette rollers into the buffer area before
it is pulled into the drum.

UPPER
DRUM CASSETTE
INPUT
DRUM ROLLER
SWITCH
DIRECTION
LOWER
CASSETTE
BAFFLE
BUFFER
GUIDE
FILM FILM HANGS IN
NOTE FILM REACHES GUIDE CLIMATISING BUFFER
: S40
AND GUIDE OPENS
1 UPPER CASSETTE: BUFFER CLOSED ON LOAD 2 UPPER CASSETTE: BUFFER OPENED ON RELOAD
3 LOWER CASSETTE: BUFFER CLOSED ON LOAD 4 LOWER CASSETTE: BUFFER CLOSED ON RELOAD
Figure 9.20 Input buffer guide operation
The buffer guide positions for the two cassettes (upper and lower) during a film
LOAD and RELOAD (including eject and rewind) are:
1. Upper cassette loads, buffer closed: film feeds from the cassette directly into
the drum during a LOAD. Sensor S17 is engaged. See Figure 9.20 (A).
2. Upper cassette reloads, buffer opened: the guide turns 180° to allow film to
drop into the climatising buffer area during a RELOAD. Sensor S18 is
engaged. See Figure 9.20 (B).
3. Lower cassette loads, buffer opened: film feeds from the cassette along a
covered guide into the drum during a LOAD. Sensor S18 is engaged. See
Figure 9.20 (C).
4. Lower cassette reloads, buffer opened: the guide turns 180° to allow film to
drop into the climatising buffer area during a RELOAD. Sensor S18 is
engaged. See Figure 9.20 (D).
See also Section 9.11.3 on media handling.

9.11.3 Film Handling Sequence
9.11.3.1 Film Path

Figure 9.21 shows the film path through the recorder with the main mechanisms
and devices used for handling media. The route from cassette to processor is
determined by the software application which manages the system as four
separate sequences:
1. Load - the first sheet of film is loaded from the cassette into the drum.
2. Reload and Eject - film is continously loaded and ejected from the recorder.
3. Rewind - the recorder rewinds film back from the drum to the cassette.
4. End-of-Roll - recorder detects that film sheet is the last on the spool.
S22 DRUM CASTING
CASSETTE
AND FILM
S40
S54 S9
S11
S17
S18
BUFFER
SPINNER GUIDE S12
S10
BAFFLE
S53
ACCLIMATISATION
BUFFER
PUNCH/ S49
GUILLOTINE S68 HORIZONTAL
S69 BUFFER
S66 S56
S51
S57
VERTICAL HORIZONTAL
OUTPUT ASSY OUTPUT TRAY
Figure 9.21 Media handling path (cut-out view)

9.11.3.2 Film Load

A film Load sequence starts the transfer of film fom the cassette into the drum,
ensuring that the film is not skewed and is able to feed into the punch. Note that
first Load sequence is the same for the upper and lower cassettes (except for the
operation of the buffer guide), but is different from a Reload sequence.
1. Film is fed by the Upper/Lower Cassette motor (M01 or M02) and detected by
Film at Upper/Lower Cassette sensor (S9 or S10). Film is only fed if it is
detected by S9 or S10 prior to a load.
2. The buffer guide closes for the upper cassette, detected by the Buffer Guide
Closed sensor (S17), or opens for the lower cassette, detected by Buffer Guide
Open sensor (S18).
3. Traverse carriage starts to move to the centre of the drum.
4. Baffle fans switch on.
5. Drum Input motor (M04) starts to drive when film is received.
6. Film is detected by Film at Drum Input sensor (S40) and M01/2 motors stop.
S22
S40
S54 S9
S11
S17
S18
S12
S10
S53
S49 S68
S69
S66 S56
S51
S57
Figure 9.22 Film handling path - Preloaded

7. If film is from upper cassette, buffer guide opens which is detected by sensor
(S18).
8. Check is made on whether the carriage is in the middle of the drum.
9. Motor (M04) and motor (M01/2) restart to feed film into the drum.
10. Film is loaded 3/4 way around the drum for approximately 800 mm. See
Figure 9.22.
11. Film rewinds back past sensor (S40) using motor (M01/2) but stays inside
drum input roller.
12. Step 10. and Step 11. are repeated to reduce skew.
13. Motor (M04) feeds film into the punch which is detected by Film in Punch
sensor (S69).
S22
S40
S54 S9
S11
S17
S18
S12
S10
S53
S49 S68
S69
S66 S56
S51
S57
Figure 9.23 Film handling path - loaded
14. Fog leader is removed for a new roll or if a door has been left open. The
defined length of the leader is set up on the MMI and held in NVRAM. The
maximum length is 300 mm; the machine sequence depends on the set length.
15. Drum vacuum is turned on.

16. Film is held in the drum and a 850 mm loop length is pushed out by the
motors (M01/2) into the acclimatisation buffer.
17. Film is punched (if required). See Figure 9.23.
18. Film is exposed.
9.11.3.3 Film Reload and Eject

During this sequence film is continously loaded and ejected from the recorder.
1. Traverse carriage moves to middle of drum.
2. Horizontal nip roller rises using the Horizontal Nip motor (M18), which is
detected by Horizontal Nip Open sensor (S56).
3. Baffle fans are turned on.
4. Drum vacuum is tuned off and drum blow turned on for 4 secs.
S22
S40
S54 S9
S11
S17
S18
S12
S10
S53
S49 S68
S69
S66 S56
S51
S57
Figure 9.24 Film handling path - film in acclimatisation buffer
5. A fixed amount of film in acclimatisation buffer is rewound into cassette.

6. Motor (M04) motor drives film into Horizontal Output tray.

7. Horizontal Output motor (M10) motor starts to drive.

8. Exact image length (set by RIP) plus 51 mm (for the punch area) is fed out.
9. Film is detected by Film in Horizontal Tray 1 (S49). If not detected after a set
number of motor steps, then there is a film jam.
10. Drum vacuum is turned on.
11. Horizontal nip roller lowers, which is detected by Horizontal Nip Closed
sensor (S57).
12. Acclimatisation buffer fills with 850 mm of film. See Figure 9.24.
13. Film is cut by guillotine.
14. Film in drum ready for exposure.
15. A command to processor checks if the processor is ready.
16. Horizontal Output motor (M10) drives film past S49 into horizontal buffer
area.
S22
S40
S54 S9
S11
S17
S18
S12
S10
S53
S49 S68
S69
S66 S56
S51
S57
Figure 9.25 Film handling path - film in Horizontal buffer
17. Trailing edge is detected by S49.

18. Motor (M10) motor stops.

19. Motor (M10) motor drives a set 47 mm.

20. Trailing edge of film passes S49 but not past horizontal nip roller. See
Figure 9.25.
21. Film in Horizontal Tray 2 (S68) detects film if power is lost.
22. Motor (M10) motor reverses direction and starts to feed film through the
Horizontal Output tray.
23. Leading edge of film detected by Film at Horizontal Tray 3 sensor (S51).
S22
S40
S54 S9
S11
S17
S18
S12
S10
S53
S49 S68
S69
S66 S56
S51
S57
Figure 9.26 Film handling path - film is ejected
24. Vertical Output motor (M09) switches on.

25. Depending on film length, trailing edge is detected by Film in Vertical
Output 1 sensor (S66) at bottom of Vertical output.
26. Motor (M10) motor switches off.
27. Leading edge detected by Film in Vertical Output 4 sensor (S22) at top of
Vertical output and motor M09 (and possibly M10) switch off.
28. Motor M09 (and possibly M10) switch on and advance film a further 180 mm
to the processor.

29. Trailing edge clears sensor S66 and motor M10 switches off.
30. Processor is checked for readiness.
31. Motor (M09) drives film at slow speed - just slower than the processor - so
that a slipping clutch/gear allows the processor to pull in film.
32. If sensor S66 still detects film (ie a longer length), motor M10 drives at a
slower speed.
33. Motor (M09) keeps turning until film trailing edge passes sensor S22.
34. Next film sheet cannot be ejected into the Horizontal Output tray until sensor
S66 is cleared. See Figure 9.26.
9.11.3.4 Film Rewind

A film Rewind normally occurs at power shutdown or when the operator selects
Change Media option on the MMI. On power up (initialisation), the system
performs a Rewind if film is detected in the drum, or an Eject if a sheet of film is
detected in the Horizontal output.
1. Traverse carriage moves to the middle of the drum if the drum is clear of film.
2. Baffle fans switch on.
3. Horizontal nip opens which is detected by Horizontal Nip Open sensor (S56).
4. Drum vacuum switches off and drum blow turns on for approximately 4 secs.
5. Motors (M01/2) switch on and rewinds film from drum and acclimatisation
buffer.
6. Trailing edge detected by Film at Upper/Lower Buffer Guide (S11 or S12) and
Motors M01/2 switch off.
7. Motors M01/2 driven at slower speed for a set distance: 10 mm (upper) and
130 mm (lower).
8. Sensors S9 and S10 still detect film at final rewind stage.

S22
S40
S54 S9
S11
S17
S18
S12
S10
S53
S49 S68
S69
S66 S56
S51
S57
Figure 9.27 Film handling path - film detected at Rewind
9.11.3.5 Film End-of-Roll

The software calculates when to perform an End-of-Roll sequence based on the
length of remaining film that is able to be safely exposed, cut and conveyed.
1. Trailing edge detected by Film at Upper/Lower Cassette (S9 or S10) sensors.
2. Decides if it is safe to guillotine film, depending on whether the film sheet is
long enough to be conveyed successfully.
3. If it is safe to guillotine:
a) Film is loaded and the previous job is cut and ejected, as normal.
b) The job is exposed.
c) Leading edge is detected by Film in Horizontal Tray 2 (S68).
d) Motor M10 switches off.
e) Horizontal nip roller closes.
f) Eject sequence is completed.

4. If it is not safe to guillotine:

a) Film is loaded (up to approximately 2.5 m).
b) The job is exposed.
c) Drum Input motor (M04) and Horizontal Output motor (M10) drives film
into the horizontal buffer.
d) Trailing edge of film is detected by Film in Punch (S69).
e) Output motor drives switches off and the Eject sequence takes over.

9.12 Media Expose System
9.12.1 Image Data Path and Modules

The optics system is installed or upgraded as one of three multi-laser
configurations: single, dual and triple-laser. From the viewpoint of operating
Luxel, the number of lasers fitted is not significant -- the only difference being the
speed of exposure and the level of productivity. For servicing the system,
however, the engineer needs to be aware of different configurations. See Section
9.12.6 for a description of each laser system and their upgrade paths.
Image data enters the recorder from a differential SCSI link to the RIP server.
Data for each image is compressed, stored, decompressed and converted to a
serial stream on the SSB before being passed to the Optics module as laser
modulating signals.
Each optic assembly is accurately aligned during manufacture to eliminate the
need for further field setup procedures during a service visit. However, if an
optics assembly is replaced, it may be necessary to run a field alignment
procedure. Replacing modules, such as the laser diode, AOD and position sensing
detector, means that engineers must follow recommended procedures and methods
to ensure that the overall expose calibration is maintained after an FRU
replacement.
There are three main assemblies used on the media expose system: Optics
module, periscope and spinner. These are shown in Figure 9.28.
DATA IN
TOP MIRROR
OPTICS MODULE
SLOW SPEED
POWER DETECTOR
COLLIMATING
LENS PERISCOPE
SPINNER
L6 COLLIMATED LASER BEAM

ALONG DRUM AXIS BOTTOM MIRROR
(ADJUSTABLE)
LASER BEAM
FOCUSSED AT DRUM
SURFACE
Figure 9.28 Media expose system - overview
Optics Module
This module, which is located on the the drum gantry, generates and modulates
the three multi-laser beams. It also houses the acousto-optic devices that control
the circularizing deflections for the two outer beams (1 and 3).

Three laser diodes (LD1 to3) source the three laser beams. Beam 2 is undeflected
and serves as the reference; beams 1 and 3 are deflected using separate AODs,
with overall deflection control managed from the SSB and the AOD Driver
(AODD) module. A number of mechanisms/PCBs, with associated lens, mirrors,
sensors and motors, operate as:
· Neutral Density illumination control
· Focus setting
· Beam Converter (aperture)
· Slow Power Detector (to adjust laser power)
· Position Sensing Detector.
The function of each optics module device, in approximate sequence on the laser
path, is described in Section 9.12.2 below. Chapter 5 explains how to remove,
replace and setup the main module assemblies.
Two boards, SOMB and ULMB, are also attached to the exterior of the optics
module:
· ULMB: controls laser modulation for LD 1 and LD3.
· SOMB: controls LD2 modulation, and the optics sensors and motors.
Periscope
Two slanted mirrors, M1 (top) and M2 (bottom), redirect the laser beams from the
optics module to the spinner. Laser light is sensed from an inline slow power
detector that moves across the beam path to read power and operate as a shutter to
break the path. Note that the ‘periscope’ is a set of mirrors and a covered path
inside the drum cap. It is not a separate assembly.
Spinner
Beams are scanned around the drum by a revolving mirror that includes encoder
circuitry to indicate the position of the mirror to the SSB.
9.12.2 Optics Module

See Figure 9.29.
This module is accurately mounted on the drum gantry at the factory and held by
three screws fixings to ensure that laser beams exit the assembly at a
pre-determined position. It is not designed to be field replaceable - so it is
important not to remove or adjust the location of the base.
Before the system starts active scanning, a number of diagnostic self-checks run
as a background task to report on:
· correct beam power levels
· beam alignments along the reference axis of beam 2
· film widths.

TO DRUM
CARRIAGE
M2
SPINNER L6
POWER DETECTOR
OPTICS MODULE
SM1 SM2 SM3
BEAM BEAM
SLOW SPEED
COMBINER ND CONVERTOR
LD2
L9 L7 L4 APERTURE M1
L1 L10 L5
L3
AOD
LD1
L8 L2 (LASER
DIODE)
AOD
M3 POSITION
DETECTOR
ULMB
SOMB LD3
L1
Note: Lenses L2 and L3 are fitted inside AOD’s. L = LENS

Lens L1 is fitted inside Laser Diodes. M = MIRROR
SM = STEPPER MOTOR
AOD = ACOUSTO-OPTIC DEFLECTOR
ND = NEUTRAL DENSITY WHEEL
Figure 9.29 Optics module layout - schematic view
Laser beam adjustments and error compensations required for a multi-beam

system are continuously made while the system is running in a non-scanning state.
The remainder of this section describes in principle how laser beams are
‘processed’ by various active and passive mechanisms before they are collimated
and diverted to the spinner.
9.12.2.1 Laser PCBs

Two dedicated laser PCBs perform the following functions:
· ULMB: operates the laser driver control circuitry for LDs 1 and 3 modulation.
Control is supplied from an interface to the SOMB.
· SOMB: all the optics motors (for aperture, focus, ND wheel and position
sensing detector), home/limit sensors and laser position sensing signals are
managed from the SOMB. In addition, LD2 modulation is determined from this
board using driver circuitry similar to the ULMB.

9.12.2.2 Laser Diode (LD) Modules

Three identical Laser Diode modules (or pens) generate beams 1, 2 and 3 at a
wavelength of 635 nm. Beam 2 forms the undeflected reference beam and is
positioned ‘inline’ with the main optical axis of the system. The other beams are
normally operating within a margin of position tolerance from laser 2.
NVRAM parameters (bias voltage, max power, etc) for each LD are created at the
manufacturing stage and are entered from the engineering terminal as part of the
replacement procedure. Power level readings are checked by software routines
which the engineer can initialize. Note the caution below.
CAUTION
LD modules are easily damaged beyond repair if the NVRAM
maximum power level is exceeded or the bias level is
incorrectly set.
With a complete system in operation, LD 2 is connected to the SOMB, and LD 1

and 3 are connected to the ULMB.
Each LD module consists of:
· a circularized laser diode
· a collimating lens
· an aperture.
The LD module is a replaceable unit. If a fault develops on any one module, the
other LDs still operate to produce a job exposure. Diagnostic software is able to
detect missing power from a single beam and inform the engineer. The cause
could be either an LD module failure or a problem with the AOD unit.
CAUTION
With the lid removed from the Optics Module, radiated laser
beams are classified as Class 3b (III).
9.12.2.3 AOD Module

Two identical AOD modules for deflecting beams 1 and 3 are located between
their LD modules and beam combiners. The purpose of these modules is to deflect
beams 1 and 3 in a circular manner around the undeflected beam 2 while the
expose system is in scanning mode. Beam 3, if present, rotates around beam 2
with the same radius of deflection as beam 1 but diametrically opposite. The
magnitude of deflection from the reference beam is very small and depends on the
required spot size. Circular deflection is synchronised with spinner rotation and
compensates for errors introduced by the effects of rotation.

Section 9.12.4 below explains this circulating compensation technique in more

detail.
Each AOD module has two SMB cable inputs from the AODD module that feed
RF drive signals (nominally 80 MHz) to the two crystals housed on the AOD.
NEVER remove the co-axial cable connections to/from the AOD module
while power is applied. This may cause damage to the driver unit.
The AOD is a field replaceable unit.
9.12.2.4 Beam Combiner (BC)

The main purpose of the Beam Combiner is to merge deflected beams 1 and 3
onto the same optical axis as beam 2. It consists of two glass plates, each
appropriately positioned and angled so that the deflected beams are reflected onto
the correct axis. Beam 2 is transmitted through both of the two BC plates, while
beam 3 passes through the plate used to direct beam 1. Special optical coatings on
each plate ensure that the nominal optical power emerging from the module is the
same for each beam.
This module is specially adjusted at the factory and is not field replaceable. Beam
combiners are also fitted on Optics modules that only operate a single laser.
9.12.2.5 Neutral Density (ND) Wedge (Illumination)

An ND Wedge, attached to a wheel, filters the intensity (illumination) of the three
light beams to ensure that the correct Dmax can be obtained. The positions of the
wheel, in steps from a Home reference point, are derived during the expose
calibration. This wheel changes position when the resolution is altered so as to
maintain the same Dmax on film as the spot size on film is altered.
Note that the wedge is located at an angle to the input beams, allowing a
proportion of light reflected from each beam to be diverted to the POD. See
Section Position Detector (POD) below.
The ND wedge includes a sensor (S1) and stepper motor (SM1) that drives the
wheel in ‘n’ number of steps from the Home position detected by the sensor.
Software for driving the wedge includes a variable that indicates the maximum
travel distance from the S1 activation point in one direction only.
The SM1 motor is fitted on all optic module configurations and is a field
replaceable unit. A calibration routine is run if the motor is replaced. Initial
positioning of the motor is normally a factory procedure. The wheel is not field
replaceable.
9.12.2.6 Optics Lens

A set of optics lenses described below modify the beams before they reach the
periscope.
Module Internal Lens (L1, L2 and L3)
Lens L1 is built inside the laser diode; lens L2 and L3 are inside the AOD. These
lens are integrated within their modules and are not serviceable.

Beam Expander (L9)

Lens L9 acts in combination with L10 as the first fixed component in the expose
fine focus mechanism.
Focus Adjust (L10)
This lens moves backwards and forwards to give a fine focus adjustment for
correcting small tolerance errors on the drum and different film thicknesses.
The lens is driven from a stepper motor (SM2) that moves in ‘n’ steps from Home
for certain types of films.
SM2 drives a wheel that rotates 360_ and also moves lens (L10) laterally along a
pivotal axis in a corkscrew-type movement. One limit sensor (S3) is activated
when the wheel approaches one end of the axis (Home), and another rotational
sensor (S2) activates for a period during each 360_ rotation.
Beam Converter (L7)
This mechanism reduces the beam size and maintains beam power by locating
lens (L7) into the beam path when the aperture moves back to select the 48 l/mm
resolution. While not in place, the lens is held loosely by a spring; once pushed
into the beam path it is held in a V-groove.
Beam Expander (L4)
A fixed lens that expands the beam for reception by lens L5. It also allows the
aperture to intersect the expanding beams diameter as an aid for changing the
resolutions between 96 l/mm and 72 l/mm.
Collimating Lens (L5)
Mounted at the entrance of the periscope is a collimating lens to ensure that the
light travelling through the periscope and along the drum axis does not diverge or
converge. Lens L5 is not a field replaceable unit.
Focussing Lens (L6)
This lens is located on the traverse carriage and focuses the beams onto the drum
surface via the spinner mirror. Lens L6 is only cleaned by the service engineer
and not the customer. Once fitted on an installed machine it must not be adjusted.
9.12.2.7 Aperture (Spot Size)

Positioned between lenses L4 and L5, an aperture (driven by a stepper motor
SM3) changes position according to the resolution (144, 96, 72, 48 l/mm) selected
and thereby changes the spot size on film. At the highest resolution, near to lens
(L4), the beams provide the smallest spot size for the drum; as the mechanism
moves towards lens L5, the beams expand in size to provide 72 l/mm. At 48
l/mm, the aperture mechanism moves back to lens L4 (past the 96 l/mm position)
and mechanically pushes the Beam Converter lens (L7) into position.
Stepper motor (SM3) controls the position of the resolution changing aperture. A
limit sensor (S5) prevents the motor being driven beyond a certain point; software
variables for this sensor also include a value to indicate the maximum distance the
motor can be driven away from the limit point (48 l/mm position).

9.12.2.8 Position Detector (POD)

The main function of the POD board is to ensure that the three beams are
co-incidental and aligned within a margin of tolerance. This is done by measuring
the relative position of each beam and providing compensatory offsets (change of
frequencies) for the AOD modules. Periodically, beam checks and adjustments are
made via the POD when the system is in non-scanning mode.
The ND wedge is tilted from the main beam axis to give a partial reflection via L8
and a mirror to a 4-channel POD located on a separate board. The beam is
focussed onto the POD by lens L8 and the optical path is folded by reflecting the
beams from mirror (M3). Both M3 and L8 are factory set and are not field
adjustable.
During the automatic beam coincidence routine, beam 2 provides a reference X/Y
position on the POD. Beams 1 and 3 are switched on, in turn, and compared to
beam 2. Any misalignments of beam position is compensated for by an offset
change of frequency to the AOD module crystals. To ensure correct
measurements, the POD must always be positioned accurately in relation to
beam 2. This setting is only controlled by the mounting points on the base.
The detector, which is mounted on a PCB and mechanical holder, is a field
replaceble unit (POD).
9.12.3 Periscope Assemblies

A periscope arrangement redirects beams from the Optics module to the spinner.
It is not a single assembly but functions as three sub-assemblies: top mirror (that
includes the Slow Power Detector assembly) and the bottom mirror assembly.
The periscope operates as two separate mirror assemblies with a covered path
inbetween. This cover (which is not directly connected to the mirrors) prevents
small changes of air temperature from affecting the beam path.
9.12.3.1 Top Mirror (M1) Assembly

This mirror directs the beams downwards to the lower mirror (M2). It is setup at
the factory and is not field adjustable or replaceable.
A manually-operated laser safety shutter below the SPD assembly ensures that
light does not exits from the optics module during a service routine.
9.12.3.2 Slow Power Detector (SPD)

A Slow Power Detector assembly located just below mirror (M1), and driven by
SM4, rotates a concentrating lens to focus the beams onto a large area detector.
While the system is in non-scanning mode, each laser in turn can be switched on
and its power measured. The purpose of these measurements is threefold:
· Any power differences between the beams is compensated for adjusting the LD
drive current.
· As a diagnostic procedure, each beam is checked for correct operation.

· To automatically determine scan dependent LD bias levels.

The limit sensor (S6) detects when the SPD mechanism has reached end of travel.
The SPD is a field replaceable unit.
9.12.3.3 Bottom Mirror (M2) Assembly

This mirror assembly is set at the factory for coarse and fine optical alignments.
Coarse settings are never field-adjustable; fine settings may be adjusted to correct
for registration errors if the registration checks indicate a problem. See Section
5.4 for information about the registration check procedure.
9.12.3.4 Optics Parameters

A set of optics parameters, generated during factory configuration and testing of
each machine, are held in NVRAM. Typical optics parameters are for beam
converter positions, nominal focus positions, and LD power, frequency and bias
values. They can be viewed and modified from Main Diagnostics (nvram/).
9.12.4 Circularizing Correction

See Section 9.2.3 which explains the AOD module and SSB interface control
circuitry in more detail.
When a 1-laser beam is directed along the drum and spinner mirror axis, the laser
writes an exact diametrical line around the drum as the spinner rotates. See
Figure 9.30 (A).
However, a problem arises when a 2- or 3-laser beam system is deployed. As the
spinner mirror rotates, the angle between the second beam and the spinner mirror
changes, causing the second beam to cross over the first beam. For a 3-beam
system, where one beam (LD 2) is used as a central reference, the other two
deflected beams (LD 1 and 3) will continuously trace a path across and around the
central axis of beam LD 2 unless correction is applied. See Figure 9.30 (B).
To obtain two (or three) parallel scan lines on the drum surface, an electro-optical
correction technique is used by the AODs, the AODD module and SSB interface
circuitry. It operates by making LD1 and LD3 beams rotate in a circular fashion at
the same speed and phase as the spinner, so that the angle between the mirror and
the beam is always constant. This displacement is maintained as the mirror’s axis
rotates. See Figure 9.30 (C). The result is a scanned line where the beams are
corrected and overlap continuously; non-corrected beams will appear as a
disconnected pattern -- for instance, the sawtooth arrangement shown in
Figure 9.31.

A) NORMAL SINGLE BEAM
ROTATING
MIRROR
DRUM
SINGLE
BEAM
B) ADDING A SECOND BEAM
SECOND BEAM
CROSSES OVER
FIRST BEAM
SECOND OFFSET
SCAN LINE
SECOND BEAM
FIRST BEAM
C) CORRECTED BEAM CROSSING
SECOND BEAM
REMAINS PARALLEL
TO FIRST BEAM
ANGLE BETWEEN THE MIRROR AND
SECOND BEAM IS NOW CONSTANT SECOND BEAM
ROTATES
Figure 9.30 Circularizing beams and correction

SPINNER MIRROR
SCAN LINES
CIRCULARIZING DIRECTION OF SCAN
BEAM (1) EXAMPLE OF
NON--CORRECTED
LINES
REFERENCE 3 2 1
BEAM (2)
CORRECTED
LINES
CIRCULARIZING 3 2 1
BEAM (3)
Figure 9.31 Circularizing beams
Circularizing is controlled by varying the deflection angle from each respective

AOD module. This is achieved by modulating the RF frequency to each of the
two AOD crystals located inside the module. The phase and amplitude of the
modulated signals are determined through a film calibration procedure completed
at the factory.
9.12.5 Spinner Assembly
WARNING
If the interlocks are overridden when the end panels are
removed, make sure the spinner is not rotating during a
service procedure.
The Speedring spinner currently specified comprises a mirror, shaft, body, motor,
encoder and cables.
Note: The spinner mirror is metal-based with a special reflection-enhancing
coating. Always use the cleaning procedure (with recommended wipes and
solvents).
A single facet mirror, slanted at approximately 47.5°, rotates at a maximum
scanning speed of 30, 000 rpm (or 10, 000 rpm idling) to reflect laser light to the
film surface from the periscope. Acceleration from rest to full speed is less than
20 seconds, and from idle speed to full speed approximately 10 seconds. The
carriage only traverses when the spinner is stationary or at full speed.

ENCODER
SIGNALS
MOTOR DRIVE
SIGNALS
MIRROR
SURFACE
LASER
BEAM
DEFLECTED
LASER
BEAM SPINNER ENCODER
MOTOR
Figure 9.32 Spinner assembly
The assembly consists of a shaft supported on air bearings and rotated by an

8-pole, 3-phase brushless DC motor. The bearing air supply is internally
generated by the motor. Spin speed is at all rates with drive current supplied from
36 V. Spin direction is always anti-clockwise (looking from the mirror end).
At one end of the shaft an incremental encoder, operating from a 5 V supply,
generates the following signals for SSB image data control:
· rotational frequency (SPIN INDEX) at one per revolution
· angular position data (DATA A) with a resolution of 960 lines per revolution.
Three Hall effect sensors are located in the spinner. When the spinner accelerates,
these sensor signals (with 120° timing) indicate the rotor position; they are
decoded by the spinner controller to commutate the drive currents to the correct
switching sequence. In a steady state, commutation operates internally without the
need for sensor signals.
The spinner has two cable interface connections:
· spinner motor signals (12-pin Molex)
· spinner encoder signals (8-pin Molex).
This assembly is a field replaceable unit and includes a cleaning procedure for the
mirror.
Section 9.13.2 describes spinner control in more detail.
Any replaced spinner assemblies must be returned to Fujifilm (UK).

9.12.6 Laser Configurations

The Luxel F-9000 Recorder is a multi-laser system shipped (or upgraded) as one
of three configurations:
1. Single-laser: this is a basic system that includes an SOMB, a single disk drive
and a laser diode (LD2). An AODD module and a ULMB are not required.
See Figure 9.33.
Upgrade kits extend these machines to a dual- or triple-laser system.
BEAM ND
COMBINER
LD2
L9 L10 L7 L4 L5
L8
M3
POD SOMB OPTICS MODULE
DISK DRIVE #1 DISK DRIVE #2 RFI BOX
Figure 9.33 F-9000 single-laser configuration
BEAM ND
COMBINER
LD2
L9 L10 L7 L4 L5
L8
M3 AOD1 LD1
POD SOMB ULMB OPTICS MODULE
DISK DRIVE #1 DISK DRIVE #2 AODD 2CHAN RFI BOX
Figure 9.34 F-9000 dual-laser configuration
2. Dual-laser: a two-laser system includes a 2-channel AODD module, AOD

module (1), ULMB, position detector, laser diode (LD1), POD and the
interface cabling between the SOMB and the ULMB. See Figure 9.34.
An upgrade kit is available for a triple-laser system.
3. Triple-laser: this is the full-speed system that includes the three laser diodes
(LD1 and LD3), two AODs (1 and 3) a 4-channel AODD, two disk drives,
ULMB, POD and associated cabling. See Figure 9.35.

BEAM ND
COMBINER
LD2
L9 L10 L7 L4 L5
L8
M3 AOD3 AOD1
LD3 LD1
POD SOMB ULMB OPTICS MODULE
DISK DRIVE #1 DISK DRIVE #2 AODD 4-CHAN RFI BOX
Figure 9.35 F-9000 triple-laser configuration
In the case of a shipped recorder, all the required laser modules for each
configuration are installed and setup at the factory. Information on the upgrade
kits is supplied by Fujifilm (UK) Customer Services. A system of stacked dongles
on the SSB are used to enable the various laser and resolution options.
9.13 Media Scan System
9.13.1 Scanning Overview

This section describes the controls and assemblies that operate position and speed
for media scanning. Refer to Section 9.4 for information on how the STB
functions and Section 6.1 on scan system assembly replacements.
The media scan control system is broadly divided into two areas:
· Spinner control: a high-speed air-bearing spinner driven by a brushless dc
motor. The spinner includes a mirror and an enclosed rotary encoder.
· Traverse control: a spinner carriage mounted on beam that runs the length of
the drum. Position feedback is taken from a readhead mounted on the carriage
and a linear scale fixed to the drive rail. Spinner and traverse operations are
managed locally by a STB attached to the carriage.
Carriage motion is from a friction drive shaft turned by a dc motor. Note that
the shaft has a precise diameter and any dirt or damage on or around the shaft
will give a mis-registration pattern.
Baffles and fans, fitted to the carriage, assist film conformance to the drum.
The scanning system controls the traverse mechanisms and consists of the
following features:
· dedicated precision motion controller
· traverse closed-loop servo compensation system

· traverse motor amplifier

· sensors to detect:
coarse Home position
exact Index position (reference)
· linear encoder supplying positional data.
Expose scanning to film is from a spinner that has the following features:
· discrete STB circuitry that controls the drive current
· spinner feedsback encoder signals to regulate speed and avoid fluctuations
· 3-phase supply with transistor switching to energise the motor windings
· braking from an SSB command.
A scanning traverse carriage is supported on a linear bearing and a plain drive
rail, see Figure 9.38. Both bearing and drive rail are parallel to a beam which runs
the length of the drum. The linear bearing consists of a long V-groove section
fixed to the beam, and a short section mounted on the carriage. An open ball cage
assembly separates the two sections. A traverse motor shaft, supports and drives
the carriage along a plain drive rail that holds the linear scale and the traverse
reference actuators.
The ball cage and traverse rail are aligned to ensure that the cage is always under
the rail for the entire travel of the carriage. Figure 6.10 shows the alignment
procedure.
9.13.1.1 Fans and Baffles

Two +24 V DC blower fans are mounted on the baffle. They operate during the
LOAD sequence to ensure that film is vacuumed tightly (conformed) to the drum
surface. The sequence is as follows:
1. fans switch on
2. carriage moves to the centre of the drum
3. film is loaded into the drum
4. fans are switched off during the expose.
Switching is controlled from an opto-isolated MOSFET on the STB. Pulses from
the fan are detected by the software to check that they are working at the correct
speed.
An exhaust fan mixes (equalises) the drum air thermals around the spinner to
prevent error patterning.
Baffles are fitted on the carriage to prevent light scattering from the film surface
and exposing other areas of film.

9.13.1.2 STB Imaging Control

When the system is ready to output an image, the STB receives information from
the SSB on:
1. horizontal start of image (right-hand edge when the machine is viewed from
the front)
2. vertical start of image (first part of image exposed after the Index pulse)
3. image resolution (48/72/96/144 l/mm)
4. number of laser beams (1 to 3)
5. direction of imaging (which is always right to left away from the periscope).
The STB then moves the carriage to the correct position. After image data has
finished downloading from the RIP, the SSB then instructs the STB to start
scanning.
9.13.1.3 Scan Interlock Protection

The machine is interlocked using the system fully described in Section 9.1.16. If
the interlocks are opened, and not overridden, power to the scanning system is
removed with the spinner ceasing to rotate after approximately 20 seconds.
9.13.1.4 Umbilical Interface

Electrical and power connection to the scanning system is from a 45-way flexible
ribbon cable. This conveys power and CAN command signals to the STB, and
returns status signals to the SSB. With the exception of the CAN bus, all other
differential signals are RS422 interface standard.
9.13.2 Spinner Control Description

Spinner control is a closed-loop system with a common clock source to the
spinner control circuit and traverse controller. All the main spinner control
functions are located on the STB. Commands for the spinner (for instance,
Start/Stop and Full/Idle Speed) are transmitted to the controller via the CAN bus
from the SSB.
9.13.2.1 Spinner Encoder

The spinner is fitted with a rotary encoder that provides two differential signals:
· DATA A with a resolution of 960 lines/rev. This signal is used locally for the
spinner closed-loop control, and is transmitted back to the SSB where it is
multiplied for use by the pixel data clock. It is compared (on the STB) to a
crystal-derived reference clock to give an error signal, via a compensation
circuit, that varies the current to the spinner motor windings.

· SPIN INDEX occurs once per spinner revolution. This signal is transmitted
directly to the SSB where it is used to synchronise the carriage and spinner
mirror positions.
9.13.2.2 Spinner Controller

This function operates from the STB and is responsible for driving the spinner
motor based on feedback information derived from the encoder. The controller
regulates motor current by varying the duty cycle of the switching waveforms
applied to the power stage. At 30, 000 rpm, the pulse width modulation signal and
the Hall effect signals are synchronised.
Also, the traverse and spinner speeds are synchronised from the same reference
clock signal to ensure correctly aligned raster imaging. See Section 9.13.3
(Optical/Traverse Synchronisation) below.
9.13.2.3 Spinner Diagnostics

STB on-board diagnostics check all the hardware devices used by the controller
loop and also motor switching. If the CAN bus is not operating, a direct RS232
connection to the MPU, with its own set of menus and commands, is available.
9.13.2.4 Spinner Condition Sensing and Braking

Besides the servo loop, spinner control is also determined by a number of external
conditions and detector signals that are monitored for diagnostic use.
Current Limit
Maximum current to the spinner from the controller output is set not to exceed
15 A (for 1.5 secs) on spinner startup, with maximum current for each phase is
limited to 8 A thereafter.
Braking
When braking is switched on, the spinner comes to rest at approximately 20 secs
from full speed. Braking is applied by shorting out the three windings and using
regenerative braking to decelerate the spinner. It is active when:
a) the spinner controller initialises
b) power is removed from the STB (for instance, an interlock is opened)
c) on-demand signals via the software.
Braking also occurs for the following conditions listed below:
Stalled Rotor
If the rotor fails to move following a Start command.

Hall Effect Sensor Failure

The controller monitors the validity of the Hall effect sensor codes when the
spinner starts to turn. There are six valid (and two invalid) codes depending on the
initial rotor positions. On detection of an invalid code, power is removed from the
motor.
Overspeed/Underspeed Detection
Power is removed from the motor if the spinner is stalled or is rotating too slowly.
Speed is calculated from the spinner shaft encoder.
Over-temperature
Local ambient temperature around the spinner output terminals on the STB is
monitored by an on-board detecting device. If the temperature exceeds 100 _C,
the controller removes power to the motor.
9.13.3 Traverse Control Description

See Figure 9.36.
Precision motor control for the traverse servo mechanism is provided by the STB,
see Section 9.4.1.2.
Direction of traverse travel can be both ways depending on system software
decisions, although normal scanning direction for imaging is from right to left.
Datum is determined from two sensors in the readhead which are actuated by two
magnets at the lefthand side of the drive rail. These are:
a) Home (HOME) - coarse detection
b) Index (TRAV INDEX) - fine reference detection.
Units of measurement on the traverse system are in microns with the Index
actuator defined as position 0. The valid range of the beam is approximately 0
mm to +1160 mm in steps of 1mm.
DRUM
--VE
+VE
+ 1160mm
HOME INDEX
ACTUATOR
CARRIAGE RAIL
Figure 9.36 Traverse positioning

9.13.3.1 Linear Encoder

Position and servo control for the traverse is derived from signals fed to the PM
controller by a readhead digital encoder system (Renishaw RGH22).
Scanning speeds vary with resolution and the number of beams operating. Speeds
shown in Table 9.1 below indicate the scanning rates in mm per second when the
spinner is rotating at 30, 000 rpm. Traverse speed is directly proportional to the
number of beams (ie a triple-laser beam at 96 l/mm speed equals three times a
single-laser beam at 96 l/mm).
Table 9.1 Traverse scan rates (mm/second)
48 l/mm 72 l/mm 96 l/mm 144 l/mm

1 Beam 10.4 6.9 5.2 3.5
2 Beam 20.8 13.8 10.4 6.9
3 Beam 31.2 20.8 15.6 10.4
Linear Scale
The linear scale is a 6 mm wide, self-adhesive steel strip that is gold-plated and
lacquer coated. It is pressed with small corrugated pitches (facets) set at 20
microns. Gold plating on the scale assists optical reflection/defraction from the
readhead, while laquer coating protects the strip from minor surface damage. It is
attached to the drive rail and covers the length required for an end-to-end carriage
movement.
The design of the readhead and scale ensures it is tolerant of small amounts of
contamination or damage. It is cleaned by wiping with a cloth dipped in an
approved cleaning agent described in Section 8.3.2. If the scale is badly damaged,
it is possible to replace the complete strip in-situ; but this is not a standard
replacement procedure and requires advice from Fujifilm Customer Support.
CAUTION
Avoid damaging the scale with any hard metal objects.
Readhead
See Figure 9.37.
This is a position feedback transducer that supplies digital signals directly to the
PM controller. The current device is a Renishaw RGH22X that runs from a supply
of 5 VDC, has a resolution of 1 mm, and operates an infra-red diode as a source of
illumination.
Infra-red light obliquely illuminates the scale facets which then reflect and scatter
light towards the readhead window. An index grating inside the device redirects
the light to form fringes identical to the scale pitches. Each fringe point is the
summation of light from 100 scale facets to give an averaging effect that helps to

overcome the problem of scale contamination. Photo-sensitive diodes then

generate phased currents from these fringes.
Interpolation hardware in the readhead sub-divide the composite signals to
produce two quadrature square waves with a resolution of 1 mm.
The readhead is a field replaceable unit that includes a plastic spacer to check the
recommended 0.8 mm distance between the head and the scale. Note that there is
a registration procedure to setup the readhead with the index actuator.
READHEAD
READHEAD
WINDOW
OBLIQUE LIGHT
FROM
INFRA-RED LED
CLEARANCE
0.8 mm
CONTAMINANTS
COATING SCALE SCATTERS
GOLD PLATED LIGHT > 100
SCALE FACETS ACTIVE FACETS
RAIL
PITCH 20 mM
Figure 9.37 Readhead operation
To ensure accurate encoding, the gap between the scale and the readhead must be
set using the 0.8 mm spacer supplied with the head. When the head is replaced,
the setting should be checked over the entire length of the scale track by
observing the readhead LED as the carriage is pushed from one end to the other.
Optical signal generated from the scale is read by a built-in monitoring circuit that
measures relative alignment and set-up conditions. Any indication of error is
shown by a bi-colour LED. As a servicing check on Luxel, the diagnostic LED is
visible from the left-hand end while the carriage travels along the complete scan
distance. LED colour indications are as follows:
· Green: conditions are acceptable.
· Orange: conditions are acceptable but small adjustments are required for
obtaining an improvement. The manufacturer’s Installation Guide explains how
to set-up the alignment.
· Red: conditions are unacceptable. The manufacturer’s Installation Guide
explains how to set-up the alignment.
Note: A correctly setup readhead is essential for accurate encoding.

9.13.3.2 Traverse Servo System

The principle of traverse servo is effectively summarised in Figure 9.12. A
desired reference trajectory is generated on the PM controller as a sequence of
positions and this is compared to a register that holds data on the current carriage
position received from the linear encoder (readhead). The resulting digital error
signal is processed as a new numerical value by the controller and sent as an
update to the DAC. Dynamic response (speed of response, etc) of this servo loop
is determined by an external compensation circuit to give an output that drives the
traverse motor from a linear power amplifier.
9.13.3.3 Traverse Amplifier

Analogue signals from the servo is converted to current by a linear push-pull
amplifier, with local feedback to ensure that current through the motor is
proportional to to the input. Output current from the amplifier is fed back to an
MPU A-to-D channel for diagnostic measurement.
9.13.3.4 Traverse Motor Assemblies

This is fitted to the carriage casting as an assembly of:
· Motor: a brush DC motor.
· Motor shaft: a friction shaft that consists of a hardened silver steel with a
central crown that moves along the drive rail. Avoid damaging or knocking this
item. The diameter of the shaft is 9 mm.
· Flywheel: smooths the movement of the carriage along the rail.
· Drive rail wiper: forms a housing over the motor shaft and includes an
arrangement of felt pads that keeps the motor shaft clean as the carriage moves.
Both the rail and shaft must be free of contaminants to avoid
mis-registration.
9.13.3.5 Traverse Sensors

Figure 9.38 shows the position of the two actuators and linear scale detected by
the three internal readhead sensors. The end stop is fitted as a mechanical stop.
Carriage Position Encoder

This consists of a linear scale fixed to the drive rail, and a readhead attached to the
carriage which passes over the scale as the carriage moves. Position data is passed
directly to the STB for use by the servo control. Resolution for position
movement is set at 1 mm.
The readhead also includes two sensing circuits (Index and Home) triggered by
passive actuators (magnets) fitted to the rail on the left-hand side of the beam.

INDEX
MARK DRIVE
RAIL
LINEAR
SCALE
HOME
ACTUATOR
END
V--GROOVE STOP
BEAM
CAGE
STOPPER
Figure 9.38 Location of actuators and linear scale
Home Actuator
This sensor actuator is positioned on the left-hand side of the beam and generates
a signal at the left end mechanical stop to define one end of the beam.
The Home signal is active for the final 20 mm of carriage movement until the
carriage reaches its mechanical end stop. It is used as a coarse position sensor,
determining which way to move the carriage at power up. It is also used as a
software warning flag to indicate that the Index sensor in close proximity. Note
that it is not possible to move the carriage beyond the active region of the Home
signal while it is traversing from right to left.
COARSE HOME POSITION SIGNAL
CARRIAGE CARRIAGE TRAVEL

STOP
ACCURATE INDEX SIGNAL
RAIL
Figure 9.39 Home and Index signal relationship
Index Actuator (Reference Mark)

This sensor actuator is positioned approximately 15 mm to the right of the
mechanical end stop and provides a precise reference point for linear movement.

All absolute positions are measured from the point where the TRAV INDEX
signal is asserted.
The index signal (TRAV INDEX) is active for the same distance as the main scale
(1 mm). It is repeatable, short and accurate, and is asserted approximately 5 mm
‘inside’ the Home sensor region.
This sensor is always approached by the carriage from the same direction during
the datuum operation to ensure the highest repeatability. The method is as follows:
a) a valid Home signal is detected
b) carriage moves left slightly beyond the Index sensor
c) moves right and halts on the left-hand edge of the Index sensor.
Because the position of the reference mark pulse is set for very high precision
repeatability, some form of registration is necessary. Using the readhead LED
indicators, the optimum phasing of the reference mark trigger signal, relative to
the incremental signal from the scale, is determined. A screw fixing on the
actuator sets the correct registration.
If the readhead mounting is disturbed, or the readhead is replaced, the reference
mark will need to be re-registered using the procedure supplied by the
manufacturer’s Installation Guide. Make sure the retaining screws for the
readhead are not disturbed.
9.13.3.6 Overspeed and Braking

To prevent traverse control from driving the carriage too fast, the rate of encoder
pulses are measured and, if excessive, a signal is sent to brake the traverse motor.
Braking occurs if:
· the readhead detects a poor setup/alignment along the linear encoder track, see
the Readhead section above.
· the STB detects that the encoder is missing or not connected. A position error is
generated if the carriage does not align with a reference point.
· a power failure is detected.
The normal maximum speed of the carriage is 100 mm/sec which is measured
from the carriage encoder signals. If the speed exceeds 110 mm/sec the brake is
operated. A braking status message is available to the SSB.
Local ambient temperature around the STB output devices is measured by an
on-board sensor. If the temperature exceeds approximately 100 _C, power to the
motor is removed and a message is available to the SSB.
9.13.3.7 Optical/Traverse Synchronisation

The PM controller requires a system clock that is scaled by a phase lock loop
(PLL) and derived from the same crystal reference used for the spinner. This locks
the spinner and traverse rates together, giving the exact resolution required.

x DRUM
y
SCAN
SWATHE SCAN
B SWATHE
A
Figure 9.40 Traverse and optical differences
Synchronisation of this kind is important for a multi-laser system where beam

separation within a scan swathe of three beams is determined optically by the
spinner, but swathe separation (between sets of two or three beams) is determined
by traverse velocity. Any differences between optical and traverse scanning will
affect expose density and may give a raster defect. Synchronising should ensure
that the distance at ‘X’ matches the distance at ‘Y’. See Figure 9.40.
9.13.3.8 Traverse Diagnostics

Traverse diagnostics, controlled from the STB MPU, check that the motor, power
drive and linear encoder are connected and operating. There are also diagnostic
commands to move the traverse in small incremental steps.
Traverse encoding is constantly monitored by the STB MPU while the motor is
enabled. To avoid the possibility of damage to the system, the traverse registers in
the PM controller are checked as a background task to ensure that:
· the scanning speed is within a specified range
· a new traverse position count has not deviated
· the linear encoder is sending valid codes and is working within its
specifications.
Other periodic and initialisation traverse checks are for:
· Home and Index sensor operation
· obstructions along the length of the track.
9.13.4 Traverse Initialisation Sequence

The MPU runs a sequence of check routines to initialise the traverse system, after
a reset or power up, in the following way:

1. Checks that an linear encoder is connected to the STB.

2. If connected, then runs the on-board diagnostics.
a) Checks for encoder alignment errors.
b) Checks for the type of digital encoder and initialises the controller device
accordingly.
3. Checks the status of the HOME signal to determine if the carriage is in the
Home region.
4. Sets up the PM controller to move in the appropriate direction.
5. Start the carriage movement in the direction set at step 4. above.
6. Stops carriage movement when a HOME signal is received; also, guards
against the signal being stuck at ‘0’.
7. Resets the traverse position counter to ‘0’.
8. Checks the INDEX signal is set to the correct value; also, guards against the
signal being stuck at ‘0’.
9. Loads the traverse position counter with an offset to complete the traverse
initialisation.
10. Starts the spinner.
11. Checks that the spinner is rotating correctly and starts film handling.

Recorder Diagnostics 10
This chapter describes how to use and interpret embedded diagnostics specifically
designed for the service engineer (as terminal tests/utilities) and the operator (as
MMI checks/error codes).
Recorder diagnostics may be modified and expanded as new firmware for the SSB is
released. Information in this chapter covers diagnostics up to and including V1.22.
Check the Release Notes for engineering data on any new firmware releases after
this version.
10.1 Introducing Luxel F-9000 Diagnostics
10.1.1 Features of F-9000 Diagnostics

The main features of the Luxel F-9000 diagnostic system are:
· Runs as embedded firmware on the SSB with an RS232 link to a VT 100
terminal or PC HyperTerminal.
· Uses a set of log utilities, test and service menus that present selectable
commands for R&D development (protected) or for field service diagnostics
(password-protected).
· Runs a set of POST checks on application start up.
· Detects system and media handling errors which are reported on the recorder
MMI console.
· Allows the engineer or operator to run a set of automated self-tests for the
system (electronics, traverse, etc) and for media handling devices (sensors,
motors, etc).
· Includes a persistent (ie permanent) set of test images held on the Hard disk and
selectable from the MMI.
· Allows the engineer to access board/system configuration files, and edit system
configuration data in a registry file whenever there is a hardware or software
change.
· Allows access to the error log files.
10.1.2 Downloading New Firmware

Firmware updates for the application, boot and diagnostics files are supplied on a
CD disk and installed from the RIP server. Use the procedure below:

Recorder Diagnostics
1. Insert the supplied CD disk and read the appropriate firmware Release Notes.
This is accessed from the directory ‘SW/docs/’.
2. Shut down the system from the MMI and reboot from the rear mains switch.
3. Press firmly the MMI screen immediately the following message appears:
Touch panel to abort
A successful abort gives the message:
Aborted
Remaining in Boot Mode
4. Close down the RIP application on the RIP server, if it already running.
5. Open the Recorder Utilities window as a PC desktop application:
ProgramÞFUJIFILM Electronic Imaging LtdÞRecorder UtilitiesÞStart
6. Select Recorder SCSI Devices... from the Recorder menu to open the
Recorder Select window.
7. Highlight the recorder name and press OK.
8. Select Download Firmware... from the View menu to open the [Recorder
Name] Firmware window. This gives you two options for loading new
(V1_xx) .HEX files from the ‘SW/New Release’ folder on the CD disk:
· Full: opens a Select Folder window allowing you to access and
automatically load all the new release files, as a group, from the
selected CD disk folder. Note that the files are not displayed in this
window when the directory is opened.
· Custom: opens the Select File to Download window allowing you to
select (highlight) specific release files from the CD disk folder. Do not
download any new Boot files unless this is requested in the Release
Notes.
9. Press Select Folder or OK to close the selection window, confirm the
selections when asked, and follow the set of messages that appear as files
download to completion.
10. Restart the recorder to launch the application.

10.1.3 Booting up the Recorder

Figure 10.1 shows the system software sequence for booting up and starting the
application.
BOOT SYSTEM
POWER UP
FAIL BOARD SHUTS

CPU DIAGNOSTICS
DOWN
CHECK FLASH
CODE
IF FLASH
REMAIN IN
CODE CORRUPTS
BOOT MODE
OR CONTROL-C PRESSED
(READY TO
OR TOUCHSCREEN
DOWNLOAD F/W)
PRESSED
APPLICATION SYSTEM
RUN POST CHECKS

(SYSTEM)
DISPLAY ERROR
START APPLICATION
READY TO SCAN
Figure 10.1 System Bootup sequence
To remain in Boot mode, press the display touchscreen or [Ctrl-C] immediately

after the ‘Touch panel to abort...’ message appears on the display or terminal
while the system is booting.

10.2 Describing Main Diagnostics
Main Diagnostics consists of a suite of tests and utilities that are run from a menu
system shown in Figure 10.2 below:
MAIN
DEVELOPMENT DIAGNOSTICS LOG
SEE SECTION
10.3.7.1
LOG UTILS MENU TEST MENU SERVICE MENU
SEE SECTION SEE SECTION SEE SECTION

10.3.7.1 10.3.7.2 10.3.7.3
Figure 10.2 Main Diagnostics - menu map
The following menus are opened by from set of commands:

· Development menu: this is only available to R&D and is password-protected to
prevent access.
· Diagnostics menu: this is available to the engineer and contains all the
commands considered as useful for field servicing. Service commands are
further divided into three submenus:
a) Log Utils: these are commands for editing/displaying files, and
saving/restoring files to the Hard disk (see Section 10.3.7.1).
b) Test: these are test commands that can be selected individually from the
Main menu or run automatically as:
· Boot-up tests (see Section 10.2.1 for a description).
· MMI Self-tests (see Section 10.2.2 for a description).
c) Service: these are utility commands that can be selected individually from
the Main menu (see Section 10.3).

· Start command: enter start to resume the application when the system is in
boot mode.
A number of the tests available from the menus above also run automatically as:
· Boot-up POST: see Section 10.2.1.
· MMI Self-checks: System and Media handling tests, see Section 10.2.3.
10.2.1 Boot-up Tests

The recorder performs the following POST tests automatically whenever the
recorder boots up:
1. operation of ROM, RAM and Processor Interrupts
2. communication to the intelligent boards: SSB, FHMB (1 and 2), STB and
SOMB.
3. power supply line voltages
4. integrity of NVRAM configuration files
5. integrity of System Registry
If no errors are found during the power on tests, the system starts to initialise
motors, optics, etc, and enters Run mode ready for scanning.
If an error is found during boot up, an error symbol appears in the Error Handling
screen showing:
· the location of the module at fault (Optics module, spinner, etc)
· an error group icon and error code.
Errors are either fatal or non-fatal: a fatal error indicates a problem where the
recorder cannot continue to scan; a non-fatal error allows the recorder to scan and
indicates, for instance, a maintenance procedure is required.
See the Luxel F-9000 Recorder Operator’s Manual for details on MMI errors,
error types, and how to recover from them.
10.2.2 MMI Self-Tests

The recorder performs a set of System and Media Handling self-tests when the
Run Diagnostics button on the MMI Tools menu is pressed. Both of these
extended tests include all of the boot-up tests.
Extended Tests can also be run from the Diagnostics menu in the Terminal
window.
10.2.2.1 System Self-Tests

System tests are run in the following sequence with the following error codes (see
also Section 10.2.9.8):

1. Check processor core: ROM, RAM, Interrupts, NVRAM storage and slave
boards. Error Code: 1001, 1002, 1003.
2. PSU rails. Error Code: 1006.
3. Hard disk drive operation. Error Code: 1027.
4. NVRAM integrity on the SSB. Error Code: 1004.
5. System Registry. Error Code: 1005.
6. CAN network checks between the SSB and slave boards. Error Code: 1028
7. All optics stepper motors can operate from a datum. Error Code: 1008.
8. All optics stepper motors are able to fully travel and limit detectors are
checked. Error Code: 1009, 1010, 1011, 1012, 1013.
9. All DC motor assemblies. Error Code: 1007.
10. Spinner runs up to speed and is able to maintain lock. Error Code: 1018.
11. Optical recalibration check on all optical sensors.
Note that the system application will not automatically start when the extended
test sequence has completed. To start the system application, reboot the recorder.
A description of each test is given in Section 10.2.3.
System self-tests can be run from the MMI, see Section 10.5.
10.2.2.2 Media Self-Tests

These film handling tests require film to be loaded into the drum. The test runs as
follows:
· loads film into drum
· conforms the film
· rewinds to test input drive motors and sensors
· punches and guillotines the film
· ejects and rewinds remaining film to test output drive motors and sensors.
Media self-tests can be run from the MMI, see Section 10.5. The progress of the
test as sensors operate along the film path is shown diagrammatically by an icon.
10.2.3 Description of System and Media Self-Tests

This section describes the following self-tests that run from the MMI and from
Main Diagnostics:
· System self-tests
· Media Self-tests (or film handling).

10.2.3.1 ROM Test

This addresses Flash memory and checks data over the data bus. A CRC is
performed in two areas of Flash: the boot system and the application system.
10.2.3.2 RAM Test

This checks RAM and data over the data bus. If an error is found a fatal error is
flagged.
10.2.3.3 Interrupt Tests

This checks that the interrupt lines to the processor are not held active. If an error
is found a fatal error is flagged.
10.2.3.4 Registry Check

This checks if the system configuration has been modified.
10.2.3.5 PSU Voltage Supply Check

The Film Handling board checks that the +24 V, +5 and 15 V lines are within
tolerance.
10.2.3.6 NVRAM Integrity Test

This checks that the configuration files contain data that is specific to the system.
The data is compared to a checksum. If the data is corrupt, the data is restored to
its default. The engineer can load backup data from the hard disk if default data is
not possible.
10.2.3.7 Stepper Motor Tests

Datum Tests
This checks that the following motors datum correctly by driving each motor to
its datum position:
· Focus motor
· Low power detector motor
· Beam converter motor
· ND filter motor.
The above motors are driven from the SOMB. A fatal error is flagged if a motor
does not turn or a detector does not respond.

Full Travel Tests

This checks that the following motors can be stepped freely over the length of the
drive rail by driving each motor to its end stop and returning to zero position. The
zero position is compared to the datum sensor to check that no steps are missing:
· Focus motor
· Low power detector motor
· Beam converter motor
· ND filter motor.
Film Handling
The film handling motors - cassette (upper and lower), drum input, horizontal and
vertical outputs - for the FHMBs are checked as part of the media handling
self-tests.
10.2.3.8 DC Motor Assembly Tests

This checks that the following motors move to an initial position, one other
position and return again:
· input buffer guide and punch (controlled by FHMB1)
· guillotine and output nip roller (controlled by FHMB2)
A fatal error is flagged if no output is detected from the limit sensor after a set
period of time. The check cannot determine if the sensor or the motor is at fault.
The DC motor assembly test will only run if the NVRAM parameter,
PUNCH_FITTED, is set to 1.
10.2.3.9 Spinner Checks

This checks that the spinner can run at 30,000 rpm (full) and at 10,000 rpm (idle).
It is run at each speed for 30 seconds to check that phase lock is maintained.
10.2.3.10 Optics Checks

Calibration Test
The optics within the Optics module self-calibrate themselves except for the Fast
Photo Power Detector (FPD).
10.2.3.11 Output Data Path Checks

This checks the digital data path from the Hard disk to the serialiser. The serialiser
CRC circuit is initialised. A test image is loaded from the disk and the CRC value
of its data read at a point just before the Optics module is compared with its
known value.

10.2.3.12 Processor Comms Checks

If the processor operates with the same protocol interface as the recorder (smart
processor), the check ensures there is a comms connection.
A loopback test to verify data output requires a loopback connector to be fitted.
10.2.3.13 Media Self-Tests

These checks require film to be loaded in cassettes upper (A) and lower (B). The
following film handling checks are performed:
· film feed and rewind in cassette A and B, and Drum input motors (controlled
by FHMB1)
· film output to processor and film transport motors (controlled by FHMB2)
The film is loaded and conformed onto the drum and then cut and ejected. Any
remaining film is rewound.
10.2.4 MMI Test Image Output

When the Run Test Image option is selected from the MMI Maintenance menu, a
set of persistent test images on the Hard disk can be selected for output. When
selected, the recorder exposes a test image on film and ejects it. The test image
comprises a test strip and/or a persistent image. The image will adjust to fit
whatever film width is loaded. Exposure levels are set from the most recent
calibration settings on the RIP.
10.2.5 Spinner Mirror Contamination Auto-Checks

An automatic software mechanism periodically checks the FPD laser readings for
signs of spinner mirror contamination. If a degree of contamination is detected,
the NVRAM value for ND wedge is automatically adjusted as compensation.
While the check is in progress any jobs queued for exposure are held until the
check completes. Details of how the check runs from the MMI and the
appropriate operator action are available in the Luxel F4080 Recorder Operator’s
Manual. As a general rule, the mirror does not need to be physically cleaned by
the service engineer unless the quality of the output is noticeable - which is
usually the case for Error Code 180 (indicating the contamination level is 30%
above the clean reference level). Note that the recorder will continue to operate
normally even when the check fails.
The check will pass, fail or indicate that it cannot run. A fail is when it detects
that contamination has exceeded one of the two set thresholds. Section 10.2.8
provides more details of the error codes for a spinner contamination reading. The
RIP application Recorder Log will also describe the type of failure.
Three separate procedures used to setup the NVRAM parameters and software are
described below.

10.2.5.1 Setup Current NVRAM Contamination Level

Complete this procedure after the mirror has been cleaned.
1. Enter Main Diagnostics and enter verbose on to enable verbose (global
commmand).
2. Enable Debug with edbg 23 to obtain more information.
3. Obtain the spinner prompt in Main Diagnostics and enter:
spinner> locate_FPD
to move the carriage and locate the FPD. Enter:
spinner> reset_cont_lvl
to measure and set the clean reference level in NVRAM. Next, enter:
spinner> contamination
to set the current contamination level in NVRAM and the ND offset value that
adjusts the wedge position supplied by the RIP for each expose job. While
verbose and edbg 23 are set, the current percentage contamination level, with
respect to the clean reference level, is displayed.
4. Disable Debug with edbg 23 and set verbose to off.
10.2.5.2 Setting the Auto-Check Time Period

The time period for the spinner contamination auto-check is set as follows:
Once the auto-rewind timeout expires (set at 60 minutes), film is rewound into the
cassette. After the rewind is complete, the software reads the current time and
subtracts it from the last check. This time value is compared to the NVRAM
parameter, SPIN_CONT_CORR_TIME; if the difference is greater, then the
check is automatically started.
SPIN_CONT_CORR_TIME periods are set in hours, ranging from 1 to 672 (four
weeks) with the default at 168 (one week). To set a new default period, obtain the
Nvram prompt from Main Diagnostics in Log_Utils (see Section 10.3.7.1) and
enter:
Nvram> contam_chk_interval 168
If you set contam_chk_interval to 32000 then the SPIN_CONT_TIMEOUT is
updated with this value and the contamination auto-check disabled.
10.2.5.3 Setup Auto Power Adjustment

An NVRAM parameter, CORR_OFFSET, is updated automatically at each
auto-check, with the value added to the ND wedge value prior to exposure. This
offset addition is enabled/disabled from the NVRAM parameter,
SPIN_CONT_CORR, using the following command from log_utils/nvram:
nvram> nd_correction 1
to enable (or 0 to disable). Make sure it is enabled for normal operation.

10.2.6 Error Logging and Post-Failure Analysis

Whenever the system reports a fatal error, an analysis log is automatically
generated and sent to the RIP server for use by service engineer. Error data in the
log file is available from a separate SaveLog utility that runs on the RIP server
PC. Operator’s can access the log and an answer a telephone service query if a
fata error has halted production. The RIP User’s Guide explains how to install and
access SaveLog to check for more information on the error type.
10.2.7 Running Test Images (Commissioning Pages)

Service engineers or operators can run a test image (ie commissioning page) from
the Tools menu on the MMI by selecting one of the persistent images downloaded
during the RIP installation. Standard pages include:
· S&T_POS: a positive screen and tint page.
· S&T_NEG: a negative screen and tint page.
These pages (at 96/175 resolution) are used to check dot, raster and moiré quality.
See the Luxel F4048 Recorder Operator’s Manual for details on how to access
Test images.
10.2.8 MMI Error Codes

Fatal and non-fatal error codes on the MMI are grouped for the main recorder
modules, with each group having its own icon. The icon and the code are
displayed on an Error Handling screen that automatically appears when an error is
detected. The Luxel F-9000 Recorder Operator’s Manual explains the codes and
their operating recovery procedures in more detail. If the operator is unable to
restart scanning using these procedures, then a service visit may be required.
The following sections describes the groups and their codes. Errors are classified
as being one of the following:
· Fatal: these prevent the recorder from operating. When a fatal error occurs, you
are still able to reboot the machine or run diagnostics. If the machine does not
recover, the same Error Handling screen will reappear.
· Non-Fatal: these are temporary faults that should not prevent the machine from
operating but may have caused the current image to fail. The system will
continue to scan other images on the queue.
Note: Error group 405-499 is reserved.

10.2.9 Optics Errors (105-199)

Errors traced to the Optics module.
105: OPTICS_FAILED_TO_HOME_OPTICS_MOTORS
One of the optic mechanisms (beam converter, focus, low speed detector or ND
filter) has failed to move to its Home position during a boot up sequence. Run
diagnostics to obtain an error trace. (Fatal).
110: OPTICS_LASER_BEAM_DROPPED
One of the laser diodes is defective but scanning can continue with the other
lasers. (Fatal).
115: OPTICS_AOD_INITIALISATION_FAILED
Unable to initialise the AODs. (Fatal).
120: OPTICS_SPINNER_CONTAMINATION_CHECK_FAILED
The test for spinner mirror contamination has failed. This only means that the test
has failed; it does not mean that the mirror is contaminated. (Non-Fatal).
125: OPTICS_HEAD_CALIBRATION_CHECK_FAILED
Calibration of optics has failed and image quality may deteriorate. The current
image output will be aborted. (Non-Fatal).
130: OPTICS_LASER_SETUP_FAILED
The setup for the laser diodes prior to a scan has failed. The current image output
is aborted. (Non-Fatal).
135: OPTICS_FETCH_RES_AND_LOAD_LUT_FAILURE
The AOD controlling LUT has failed. (Non-Fatal).
140: OPTICS_POSITION_MOTORS_FAILURE
Movement of a motor to a required position has failed and the current image has
aborted. (Non-Fatal).
145: OPTICS_SETUP_SERIALISER_FAILED
The electronics setup for the image has failed and the current output is aborted.
(Non-Fatal).
150: OPTICS_LPD_SHUTTER_FAILED
Movement of the low speed detector mechanism (which also acts as a laser safety
shutter) has failed. (Non-Fatal).
155: OPTICS_INVALID_STATUS
Not used.
160: OPTICS_BEAM_CO_RETRY_FAILED
After 10 attempts at obtaining beam coincidence for LD1 or LD3 (using LD2 as a
reference), the values are still not within a specified tolerance. The current job
will fail and the next job will be sequenced for scanning. (Non-Fatal).

165: OPTICS_BEAM_CO_FAILED
A problem has occurred with the beam coincidence utility itself causing a run
failure. The current job will fail but the next job will be sequenced for scanning.
(Non-Fatal).
170: OPTICS_LUT_CALC_FAILED
The LUT calculations have exceeded the time expected. The current job will fail
but the next job will be sequenced for scanning. (Non-Fatal).
175: SPINNER_CONTAMINATION_LEVEL_1
The automatic spinner contamination check has detected laser power degradation
exceeding the threshold 1 level of 20%. The operator or service engineer should
clean the spinner mirror at a convenient time. (Non-Fatal).
180: SPINNER_CONTAMINATION_LEVEL_2
The automatic spinner contamination check has detected laser power degradation
exceeding the threshold 2 level of 30%. This level of degradation will also show
in the quality of film output. The operator or service engineer should clean the
spinner mirror as soon as possible. (Non-Fatal).
10.2.9.1 Traverse Errors (205 -299)

Traverse errors are usually position detection errors.
205: TRAVERSE_NON_FATAL_ERROR
The traverse has detected a position error when moving to a required position
(usually start expose, but it could be anywhere). The software will attempt to
recover on the next traverse move request. (Non-Fatal)
210: TRAVERSE_FATAL_ERROR
The traverse has detected a position error during a load/unload film sequence.
This error is not software recoverable and requires a reboot. (Fatal).
215: TRAVERSE_INVALID_STATUS
The system software is unable to obtain a valid status for the traverse subsystem.
(Status).
10.2.9.2 Spinner Errors (305-399)

These are errors caused directly by the spinner or the STB software.
305: SPINNER_ERROR
The spinner has failed to lock (STB lock only). This error is not software
recoverable and requires a reboot. (Fatal).
310: SPINNER_INVALID_STATUS
The system software is unable to obtain a valid status for the spinner subsystem.
(Status).

10.2.9.3 Environment Errors (505-599)

These errors are listed in order of severity. Note that the temperature reading is
monitored once per minute.
505: ENVIRONMENT_TEMPERATURE_LIMIT_THREE
One of the three temperature limits (60°C) on the SSB has been exceeded. This is
the highest limit and appears as an MMI warning before fatal error number 560.
Check for broken or covered fans, or whether the local ambient temperature is too
high. If the temperature continues to rise to 80°C the system will shutdown.
(Non-Fatal).
510: ENVIRONMENT_COVER_OPENED
One of the interlocked doors, or the Optics dust lid, is open and the system will
not scan. Closing the door reboots the system. (Fatal).
515: ENVIRONMENT_STB_OVER_TEMPERATURE
The STB has exceeded the temperature level. Check for broken or covered fans,
or whether the local ambient temperature is too high. (Non-Fatal).
520: ENVIRONMENT_TEMPERATURE_LIMIT_TWO
One of the three temperature limits (50°C) on the SSB has been exceeded. New
jobs cannot be scanned. Check for broken or covered fans, or whether the local
ambient temperature is too high. (Non-Fatal).
525: ENVIRONMENT_FAN_FAILURE
The RFI box cooling fan has failed and the SSB has exceeded a temperature limit.
(Non-fatal).
530: ENVIRONMENT_TEMPERATURE_LIMIT_ONE
One of the three temperature limits (40°C) on the SSB has been exceeded. This is
the lowest limit and gives a warning. Check for broken or covered fans, or
whether the local ambient temperature is too high. (Non-Fatal).
535: ENVIRONMENT_INITIALISATION_ERROR
There has been an environment monitor software initialisation failure.
(Non-Fatal)
540: ENVIRONMENT_TEMPERATURE_CHIP_FAILURE
The temperature IC on the SSB has returned an invalid temperature, indicating a
fault with the device or its monitoring. (Non-Fatal).
545: ENVIRONMENT_EVER_HAD_TEMPERATURE_CHIP_FAILURE
The temperature IC on the STB has returned an invalid temperature since the
machine was reset. (Non-Fatal).
550: ENVIRONMENT_CHAD_TRAY_NEEDS_EMPTYING
The software punch count indicates the tray is full but does not need to be
emptied until the end of the scan session. (Non-Fatal).

555: ENVIRONMENT_CHAD_TRAY_FULL
The software punch count indicates the tray is full and needs to be emptied
immediately. (Fatal).
560: ENVIRONMENT_TEMPERATURE_LIMIT_FATAL
The SSB temperature IC indicates a limit (80°C) causing the system to shutdown.
Power down the machine; a board component may be at fault. (Fatal).
565: ENVIRONMENT_CHAD_TRAY_MISSING
The chad tray is not installed. (Fatal).
10.2.9.4 Input Data Path (605-699)

These errors are detected between the RIP server and the Hard disk.
605: IDC_DISABLED
The input data path from the RIP to the disk drive has been disabled because of a
shutdown or an open interlock. The job currently downloading will finish.
(Status).
610: IDC_FAILED_TO_QUEUE_DOWNLOAD_JOB
A failure that could appear if there are more than 32 images queued on the
recorder. Normally, it will not occur because the RIP monitors the job queue.
(Non-fatal).
615: IDC_FAILED
A general input data path failure. (Non-fatal).
10.2.9.5 Output Data Path (705-799)

These errors are between the Hard disk and the image serialiser.
705: ODP_ABORT
The output data path (ODP) from the Hard disk to the Optics module has found an
internal error that may have been caused by a problem reading the image off the
disk, a problem with the serialiser/formatter, or the requested image may not have
been able to be processed because, for instance, it requests 3 lasers but only one
laser is operating.
An error on the system while processing a scan will cause the ODP to abort and
stop the current job scan. The cause of the error could be another module, such as,
the optics, traverse or spinner. (Non-Fatal).
710: ODP_HALTED
The ODP has been halted from the MMI (Pause button), stopping any new jobs
being processed once the current job has finished. (Status).

10.2.9.6 Media Transport (805-899)

Media transport jams from the cassette to the processor.
803: MEDIA_WRONG_MEDIA
Insufficient media supply of the correct type to complete a media operation.
Change or install a cassette with the correct type for the job on the queue.
(Non-Fatal).
805: MEDIA_NO_SUPPLY_ERROR/FATAL
Insufficient media supply to complete a media operation. This could mean that the
correct media type is not available for the current job or the cassette has been
incorrectly loaded. The operator should check that there is small amount of film
projecting from the cassette. (Non-Fatal or Fatal).
810: MEDIA_CASSETTE_EMPTY_ERROR
Media cassette is empty but the media operation can still complete. (Non-Fatal).
815: MEDIA_JAM_INPUT_ERROR
Media jam at the input stage (cassette and drum input). (Fatal).
The following reasons can cause this error:
· A legitimate media jam at the input stage.
· The cassette is about to run out of film and the recorder has been unable to
rewind the remaining amount of film into the cassette. It is not possible to eject
film under these circumstances.
Remove the film manually for this error.
820: MEDIA_JAM_DRUM_ENTRANCE_ERROR
Media jam at the entrance of the drum. (Fatal).
825: MEDIA_JAM_PUNCH_ERROR
Media jam at the punch, that is, a media jam and not a punch jam. (Fatal).
830: MEDIA_JAM_OUTPUT_STAGE1_ERROR
Media jam at the entrance of the Horizontal tray. Note that this error can
sometimes occur before the film is cut. (Fatal).
At this stage the film has been cut and entered the Horizontal output tray
conveyor. (Fatal).
Media jam detected at the vertical output stage. (Fatal).
A media strip has reached the processor and needs to be recovered from the
vertical output stage before rebooting. (Fatal).

850: MEDIA_PUNCH_JAM_ERROR
This is a punch jam and not a media jam. (Fatal).
855: MEDIA_GUILLOTINE_JAM_ERROR
This is a guillotine jam and not a media jam. (Fatal).
860: MEDIA_CONFORMANCE_FAILURE_ERROR
The sensors have not detected that film is adhering to the drum. Pull the film out
of the drum from the input assembly and try again, or use a different roll and look
for dust and dirt in the drum. (Fatal).
865: MEDIA_UNDEFINED_JAM_ERROR
The software is unable to find a specific media jam error. Check the machine for
any possible signs of media jamming and reboot. (Non-Fatal).
870: CASSETTE_ID_ERROR
The recorder has failed to read the cassette ID label. Check that the cassette is
seated correctly and the ID label is in place. Also, check that the cassette ID
sensor is switching correctly. (Fatal).
875: MEDIA_SYSTEM_FAILURE_ERROR
There has been an unsuspected system error during the media handling. This
could mean that a film handling motor has failed to start, a software routine has
not started, or there is a failed actuator. (Fatal).
880: CASSETTE_DOOR_ERROR
The cassette door has been detected as open on power up. (Fatal).
885: HORIZ_TRAY_POSITION_ERROR
The Horizontal tray has not been pushed into its docking mechanism correctly.
(Fatal).
Recovering from Media Transport Errors

As a general rule, the operator should be advised to open the appropriate cover or
door and remove the film rather than attempt a reboot if a media transport error is
reported. For some jams, the system software may already have tried (up to three
times) to recover from the problem; if this has failed, then a manual recovery by
removing the jammed film is the only possible solution. Film that has jammed is
normally damaged and cannot be used for imaging.
Note: For all media errors it should be possible to attempt a reboot without the
risk of damage to the machine or film strip.
A full set of recovery procedures for media transport errors is described in the
Luxel F-9000 Recorder Operator’s Manual.

10.2.9.7 Media Processor (905-999)

Errors related to the media processor/recorder comms interface.
905: PROCESSOR_NOT_ATTACHED_ERROR
Processor is not connected to the recorder, possibly caused by removing the cable.
(Fatal).
Errors related to the media processor.

Note: The processor may not be operating because it is low on chemicals or the
temperature is too high. This is indicated on the recorder MMI as a
Processor Not Ready icon (see the Operator’s Manual) and not as an error
code. Check the processor LCD.
910: PROCESSOR_FEED_JAM_ERROR
Media jam as film is transferred to the recorder. The fault could be on the
processor or the recorder. (Fatal).
915: PROCESSOR_REQUIRE_SERVICE_ERROR
The processor has indicated a fault. Refer to the unit User’s Guide and check for
diagnostic information about the machine. (Fatal).
10.2.9.8 System Tests (1001-1028)

See Chapter 10.2.2.1 for a description of the tests.
These errors are normally activated during the POST checks on system
initialisation, or when Run Diagnostics is selected from the MMI.
1001: ROM_TEST
This addresses Flash memory and checks data over the data bus. A CRC is
performed in two areas of Flash: the boot system and the application system. It
indicates a problem with the SSB.
1002: RAM_TEST
This checks RAM and data over the data bus. If an error is found a fatal error is
flagged. It indicates a problem with the SSB.
1003: INTERRUPT_TEST
This checks that the interrupt lines to the processor are not held active. If an error
is found a fatal error is flagged. It indicates a problem with the SSB.
1004: NVRAM_TEST
This checks that the configuration files contain data that is specific to the system.
The data is compared to a checksum. If the data is corrupt, the it is restored to its

default. The engineer can load backup data from the Hard disk if default data is
not possible.
1005: SYSTEM_REGISTRY_TEST
This checks if the system configuration has been modified. If this tests fails, then
update the system registry.
See Section 10.2.3.4. If this tests fails, then update the system registry using the
information in Section 10.4.7.
1006: PSU_TEST
The FHMB checks that the +24 V, +5 and 15 V lines are within tolerance.
1007: DC_MOTOR_TEST
This checks that the following motors move to an initial position, one other
position, and return again:
· input buffer guide and punch (controlled by FHMB1)
· guillotine and output nip roller (controlled by FHMB2)
A fatal error is flagged if no output is detected from the limit sensor after a set
period of time. The check cannot determine if the sensor or the motor is at fault.
1008: OPTICS_DATUM_TEST
This checks that the following motors operate correctly by driving each motor to
its datum position:
· focus motor
· low power detector motor
· beam converter motor
· ND filter motor.
The above motors are driven from the SOMB. A fatal error is flagged if a motor
does not turn or a detector does not respond.
1009: LPD_MOTOR_ASSY_TEST
This checks that the low power detector motor can be stepped freely over its full
working length by driving each motor to the end stop and returning to zero
position. The zero position is compared to the datum sensor as a check that no
steps are missing.

1010: ND_MOTOR_ASSY_TEST
This checks that the neutral density filter motor can be stepped freely over its full
steps are missing.
1011: BEAM_CONV_MOTOR_TEST
This checks that the beam converter motor can be stepped freely over its full
steps are missing.
1012: FOCUS_MOTOR_ASSY_TEST
This checks that the focus motor can be stepped freely over its full working length
by driving each motor to the end stop and returning to zero position. The zero
position is compared to the datum sensor as a check that no steps are missing.
1013: FOCUS_END_SENSOR_TEST
This checks the focus limit sensor by driving the focus motor to its end position
and then single stepping it until the limit sensor activates.
1014: LASER_PRELIM_TEST
This checks whether the internal opto detector of each laser diode in the system is
indicating that the diode is providing an adequate level of output power.
1015: PFLIN_POWER_TEST_NO
This is an auto command that runs freq_lin and power_comp for all the available
channels. When run with the beam_co utility it performs the equivalent of an
MMI optics calibration. Run the test separately to obtain a more detailed trace
report.
1016: BEAM_COINCIDENCE_TEST
Aligns a laser beams LD1 and LD3 with reference to LD2 so that it is within the
specification of 2.4 mm. Run the test separately to obtain a more detailed trace
report. Enable the debugger option (19) to obtain more information on the test
results.
1017: TRAVERSE_TEST
This utility checks that the traverse carriage can be positioned to within 5% of its
datum point and that it can travel over its full length without any position errors
usually caused by poor recorder levelling. The accuracy of traverse speed is
determined by measuring the time taken for the traverse to travel the full length at
each of the available traverse speeds. The calculated speed must be within 5%.
Note that running traverse_test does not give a pass or fail result.

1018: SPINNER_TEST
This checks that the spinner can run at 30,000 rpm and at 8,000 rpm. It is run at
each speed for 30 seconds to check that phase lock is maintained.
1019: DATA_PATH_TEST
This checks the digital data path from the Hard disk to the serialiser. The serialiser
CRC circuit is initialised. A test image is loaded from the disk and the CRC value
of its data read at a point just before the Optics module is compared with its
known value. There may be a possible problem with the Hard disk or the SSB;
check the disk for bad sectors and reformat.
1020: PROCESSOR _COMMS_TEST
If the processor operates with the same protocol interface as the recorder (smart
processor), the check ensures there is a comms connection.
1021: PROCESSOR_LOOPBACK_TEST
A loopback test to verify data output that requires a loopback connector to be
fitted to obtain a valid result.
1022: SLOT_0_INPUT_FILM_TEST
1023: SLOT_1_INPUT_FILM_TEST
1024: SLOT_0_OUTPUT_FILM_TEST
1025: SLOT_1_OUTPUT_FILM_TEST
These checks require film to be loaded in cassettes upper (0) and lower (1). The
following film handling checks are performed:
· Input: film feed and rewind in cassette A and B, and Drum input motors
(controlled by FHMB1).
· Output: film output to processor and film transport motors (controlled by
FHMB2).
The film is loaded and conformed onto the drum and then rewound from the
drum. This is repeated ‘n’ times. The film is then punched, cut and ejected. Any
remaining film is rewound.
1026: REALTIME_CLOCK_TEST
Checks the real-time clock on the SSB.
1027: DISK_TEST
This runs a disk Inquiry check for the odd (CHAN 1) and even (2) drives.
See Section 10.3.7.3 on the disk/ tests.

1028: SLAVE_BOOT_FAILURE
Unable to communicate with a slave board possibly indicating that:
· the slave is disconnected
· a problem with the interlocks
· a PSU problem
· an application software failure requiring a firmware reload.
1029: TRAVERSE_DATUM_TEST
Checks that the traverse datum can be read.
1030: READ_FAST_PHOTO_DETECTOR_FAILED
The FPD for use on the spinner contamination check has failed.
1031: SRAM_MEMORY_TEST_FAILED
SRAM test on the SSB has failed.

10.3 Running Main Diagnostics
Main Diagnostics is designed to provide a set of checks (go/no go) and utilities
for rapid confirmation of the system’s operation. If you encounter any problems
while running diagnostics, call Fujifilm (UK) Customer Services.
10.3.1 Setting up a Terminal Window

Main Diagnostics are run from any terminal (PC, laptop, RIP server etc) that is
able to present a HyperTerminal or VT100 type emulation window. They are a set
of utilities and tests embedded on the SSB allowing the service engineer to
manage to enter diagnostic commands and read return data from the slave boards,
motors, sensors etc, to the terminal.
Before commencing Main Diagnostics, check that:
· a physical RS232 connection from the terminal to the RFI box (DIAGS port) is
fitted, see Figure 3.8.
· the recorder is switched on.
Use the following method, for instance, to set up the comms link between the
recorder and a HyperTerminal on the RIP server.
1. Open a terminal window from the desktop Start button:
ProgramsÞFUJIFILMÞRecorderUtilitiesÞDiagnostic Terminal
2. Set the Properties options for the recorder comms link to the terminal as
follows:
· Connect: COM1 or 2
· Settings: Autodetect
· Configuration: 9600 bits per sec; 8 data bits; None parity; 1 Stop bit;
None flow control.
3. If you need to transfer scrolled text to a selected file from the HyperTerminal
window, switch on the Capture Text from the Transfer menu.
10.3.2 Accessing Diagnostics
10.3.2.1 Main Menus

To enter Main diagnostics carry out the following:
1. Power up the recorder from the Mains switch.
2. Open a terminal window, for instance, HyperTerminal on a PC (see Section
10.3.1).

3. Once the Application system has loaded, the main> prompt appears (press
Return if it is not displayed). Enter the following to view the available screen
commands:
main> mode 1
This creates a frame around the current diagnostic commands available.
Mode 0 leaves the screen as unboxed.
10.3.2.2 Diagnostics Menu

Diagnostic tests and utilities for the service engineer are available from the main>
prompt by entering:
main>diagnostics
Enter password: **** (example ’uk28’)
TIME ....
DATE ....
Date & Time Correct? (y/n) : y
diagnostics>
Valid passwords are issued for each service engineer and are obtainable from
Fujifilm (UK) Customer Services.
10.3.3 Entering Commands

There are two types of command:
· those which directly select tests or utilities
· those which select another group (or sub-menu) of commands and have the
suffix /.. When a command is entered, the screen is redrawn with the new
submenu displayed.
To navigate between menus, enter the command name and press Return to move
down a menu level, or .. Return to move up a menu level.
After entering the first two or three letters of a command from any prompt and
pressing the Tab key, the remainder of the command name is displayed.
Where a boxed list shows ‘More - >’, press the Tab key twice to display the
additional commands.
Other commands require extra parameters to be entered in the form of numbers or
letters. Spaces between commands and parameters are shown in this chapter as
(Y).
If a command is not entered without the required parameter(s), a ‘USAGE’
message appears showing a list of valid parameters for the command.
Commands can be invoked using its pathname; for instance, Diagnostics>
service/optics/laser.

10.3.4 Global Commands

Global commands do not appear in the menu structure and are not displayed.
They can be entered regardless of the current menu position. All the global
commands, along with the menu items available for the current menu level, are
displayed as a list by typing help [Return] or [?].
To select a command, type its name, followed by [Return] or [Enter]. The global
commands and their functions are shown in Table 10.1. Note the following:
· All diagnostics commands are case independent. For example, HELP, help or
HeLp, all select the same command.
· Diagnostics commands can be abbreviated. For example, to select the Help
command you can enter h, he, hel or help.
· You can enter the first few letters of a command and press Tab to finish the
entry.
· If several commands begin with the same letters, then sufficient letters must be
typed to make the selection unique.
For example, if there are two commands, help and hello and he is entered, the
system responds with a command entry error.
For example, to enter the ‘recordscript’ command you must enter at least ‘rec’.
· Some commands can be modified by adding subsidiary commands. For
example, if soakYsoe is entered, the soak command is modified so that it
Stops On an Error.
· Certain commands require responses to questions.

Table 10.1 Global commands

Global Command Description
break A forced breakpoint for debugging
ddeb Display debug files
edbg <num> enables debug
ddbg <num> Disables a specific debug
repeat Executes the command string count times
showscript <name> Displays the contents of a specified script
runscript <name> Runs name script
star Enables/disables the rotating star activity
indicator
deletescript <name> Deletes named script
zeroscripts Erases all script files
record <name> Records the command lines into a script file
verbose Selects the level of messages for display
run <name> Run executable file
help Lists all menu items currently available and
displays details about tests
? Lists all menu items currently available and
displays details about tests
soak <test> <num> Soak a test or a submenu of tests
sys_status Displays machine status problems
enable <command name> Enables individual tests or submenus for soak
testing
disable <command name> Disables individual tests or submenus for soak
testing
find <command name> Locates a command within the menu structure
path Displays the current menu path
mode <1/0> Enter Monitor mode (boxed/unboxed)
evt/ Enters the evt menu
../ Returns cursor to parent menu
quit/ Returns cursor to parent menu
zeroscripts Erases all scripts
hreset Hard reset
sreset Soft reset
10.3.5 Verbose
The verbose command controls the messages which appear on the Log file
during soak tests.
On its own, this command reports the status of the Verbose function (on or off).
Use verboseYon and verboseYoff to switch the function on and off respectively.
· When Verbose is on, all messages are displayed and messages beginning with
**, --, ++ and ^^ are logged to RAM (if RAM logging is enabled).

Note: Only error messages (indicated with **) are logged to Flash memory.
· When Verbose is off, only error messages are displayed and logged to
application, RAM or Flash.
Note: For troubleshooting, always select the Verbose ON option.
10.3.6 Soak Test Operation

The soak command runs all tests that are soak enabled in all sub-menus below
the current level.
Tests and sub-menus that are soakable are indicated by an S suffix to the
command name.
If the S is emboldened, the test is enabled. If the S not emboldened, the test is not
enabled.
To soak all soakable tests and sub-menus, use the soak command.
By selecting soakYsoe the diagnostics will run each soakable test once and will
stop when an error occurs.
To soak more than once, use soak x where x is the required number of repetitions.
To soak an individual test or sub-menu, enter soakYxYname, where name is the
name of the test or sub-menu and x is the number of repeats.
To select the stop-on-error code use the suffix soe. For example, soakY10Ysoe
initiates a soak on all enabled tests 10 times and the tests will stop on any error.
To stop a soak test press [Ctrl-c].
If a soak test fails and the stop-on-error (SOE) flag has been set, then a message is
displayed on the monitor:
** An error stopped the soak test! [Test name]
where [test name] is the name of the test which failed.

To select the loop-on-error code use the suffix loe. For example; soakY10Yloe
initiates a soak on all enabled tests 10 times and the tests will loop indefinitely on
any error.
The enable command enables soak tests.
Individual tests can be enabled. For example; enableYtest3 enables command
Test3 for soak testing. If enableYall is entered then every command in all
sub-menus will be enabled.
The disable command disables soak tests.
Individual tests can be disabled. For example, disableYtest3 disables command
Test3 for soak testing. If disableYall is entered then every command in all
sub-menus will be disabled.
Test results can be logged to application, RAM, or Flash memory for subsequent
examination.

Time information can be optionally added to the error log using the command
time_stamp.
Temperature information may be also added to the error log using the command
temp_stamp.
10.3.6.1 Using the Debug Utility

The debug utility allow you to switch diagnostic information on/off for each of
the machine software tasks and display the sequence of events as they occur on
the system.
Always make sure that the debug facility is disabled before the system is
returned to normal production scanning. The system will operate at a slower
speed with debug enabled.
ddbg
Disables the diagnostic output from a machine software task. The parameter is
<software task number (see Table 10.2)>. For example, ddbgY8 disables output
from the AODs.
edbg
Enables the diagnostic output from a machine software task. The parameter is
<software task number (see Table 10.2)>. For example, edbgY8 enables
information output from the AODs.
ddeb
Enter ddeb to display all the debug task numbers, see Table 10.2.

Table 10.2 Debug task numbers
Number Debug Check

0 Event logging
1 Std processing
2 Std exits
3 Event timers
4 CAN driver
5 Input data controller
6 Output data controller
7 Local disk debug switch
8 AOD info
9 MMI GUI
10 Exposer
11 Spinner running to idle speed
12 Power compensation
13 SCSI
14 NVRAM
15 Media management
16 Optics power control
17 Traverse
18 AOD circling
19 Beam coincidence
20 Media processor
21 Calibration info
22 Test pattern generator
23 Spinner contamination
24 Laser diode info
25 Temperature monitoring
10.3.6.2 Using Script Commands

A script allows you to create a sequence of Main commands and parameters and
run them as an executable file. This facility means that you can generate useful
repetitive routines without having to constantly re-enter keystrokes. All scripts are
held in a separate script file.
recordscript
Use recordscript to create a new script, for example, ‘sol’:
recordscript sol
actuators/set v10 on
time/sleep 150
actuators/set v10 off
time/sleep 100
script end (ctrl-x enters this line)

You can use any of the commands and parameters detailed in this chapter. Type
Ctrl-x to terminate the script and the line ‘script end’ appears.
showscript
Displays the text of a specified or the currently loaded script, for example,
showscriptYsol
runscript
Executes the currently loaded script or a specified script, for example, runscript
sol. To run a script more than once, enter, for instance repeatY<n>YrunscriptY
<name> where n = number of repeats, name = name of script.
deletescript
Deletes the latest copy of a script name from the script file, for example,
deletescriptYsol.
listscripts
Lists all the scripts available in the script file.
zeroscripts
Erases all scripts in the scripts file.
10.3.6.3 Using the Log Files

The Application, RAM and Flash log files are enabled/disabled and accessed from
main/log.
When Verbose is on, all messages are displayed and messages beginning with **,
--, ++ and ^^ are logged to RAM (if RAM logging is enabled).
main/log
The Error Log file records all software errors that occur on the board. These
include application and self-test errors. Most errors are number coded. The Error
Log file on each intelligent board is stored in 8K flash. At boot-up, the size of the
error log is monitored; if it is full, its contents are copied to hard disk oldest first.
The Error Log is then cleared of all errors.
Switch on verbose before starting the log commands.
alog/rlog/errlog
Enables, disables or clears the application, RAM and Flash Log files for system
errors, for example:
· rlogYon - tests logged to RAM enabled

· rlogYoff - tests logged to RAM disabled.

time_stamp
Adds time and file information to the diagnostic output.
showlog
Displays the error log file after the service engineer has recreated the problem;
enter, for example, showlogYsyslog.
test
Tests the logging functions.
10.3.7 Using Main Diagnostics

Main Diagnostics are divided into three submenus: Log Utils, Test and Service.
To access these menus from /Diagnostics use the password method explained in
Section 10.3.2.2.
10.3.7.1 Log Utils Menus

Log utils provides a set of commands selected from the menu shown in
Figure 10.3.
Figure 10.3 Log Utils menu
diagnostics/log utils/
disp_stats
Displays the machine statistics in a number of fields shown, for example, in
Figure 10.4:

Figure 10.4 Display statistics screen
edit_stats
Allows you to edit the machine statistics fields using the cursor keys to move
down each field.
save_stats
Writes the Statistics file to HDD.
updateSysLogs
Writes the System Configuration log files for each slave board to the Hard disk
(HDD).
save_nvram
Saves the System NVRAM paramters to the HDD, see Section 10.4
disp_nvram
Displays the current NVRAM parameters and their values (equivalent to ‘dnv’).
· disp_nvramY<parameter name> -- displays a specific parameter.
· disp_nvram -- lists all the parameters.
· disp_nvram *TRAV* -- allows you to enter wild cards for displaying all the
parameters related to a shortened syntax word.
Note: The ‘dnv’ and ‘snv’ commands are no longer available to the service
engineer. To enter new laser NVRAM parameters, use the
‘service/optics/lasers/lcd_params’ command.

restore_nvram
Writes the NVRAM parameters from the Hard disk (HDD) to each target board.
The updated parameters only take effect after the system has been rebooted.
Make sure that the correct NVRAM configuration is currently stored on
disk.
init_nvram
Use this command to set the NVRAM values to their default settings.
disp_conf
Displays the System Configuration file, see Section 10.4.
configuration/
Opens the Configuration menu below.
display_registry
Displays the system, slave board or HDD details held on the System Registry, see
Section 10.4.7.1. The parameter is <board/system/hdd>; for example, enter
display_registryYboard.
init_nvram
Use this command to set the NVRAM values to their default settings.
diagnostics/log utils/configuration/
Use the Configuration menu in Figure 10.5 to save and restore configuration files
to the HDD to avoid the loss of data.
Figure 10.5 Configuration menu
save
Saves a copy of board NVRAM data to the HDD, see Section 10.4.6. The
parameter is <nvram>; enter, for example, saveYnvram
dump
Displays all the NVRAM details on the monitor. The parameters are <nvram>;
enter, for example, dumpYnvram.

restore
Restores the board NVRAM data from the HDD to the SSB, see Section 10.4.6.
The parameter is <nvram>; enter, for example, restoreYnvram.
writeData
This facility allows you to display and edit board Configuration files before they
are saved to the registry. The circumstances where you may need to modify these
files are exceptional; normally, the files on a site machine are updated
automatically on startup. Use the following parameters for each board:
a) <ssb_config> <REGISTRY_SSB_ID>
b) <stb_config> <REGISTRY_STB_ID>
c) <somb_config> <REGISTRY_SOMB_ID>
d) <fhmb1_config> <REGISTRY_FHMB1_ID>
e) <fhmb2_config> <REGISTRY_FHMB2_ID>
Use the Up/Down Arrow to move between fields.
readData
Not used by service engineers, unless requested by Fujifilm (UK) Customer
Services.
wrDataArray
Services.
rdDataArray
Services.
wrCircArray
Services.
rdCircArray
Services.
init_registry
Services.
diagnostics/log utils/set_punch
Use this command to indicate to the machine that a punch is fitted. The
parameters are <0 (not fitted)/1 (fitted)>.

diagnostics/log utils/nvram/
This submenu displays all the commands required for viewing and editing
NVRAM values.
Figure 10.6 NVRAM menu
lcpd_params
Allows you to display and/or edit the NVRAM laser parameters for lasers 1, 2 and
3. Enter, for example: lcpd_paramsY2 to display the current parameter values for
LD 2. Alternatively, enter the optional <change> parameter as
lcpd_paramsY2Ychange to display the parameters for editing before being written
to NVRAM. Use the cursor Arrow-Down key to move down each field.
Use this menu to enter the new scan values for a laser upgrade. Note that this
utility automatically updates the PD (Photo Diode) and the scan drive values.
set_laser_no
Use this command to set the NVRAM parameter LASERS_USED to a value for
the number of lasers operating. The parameter is <1/2/3>; for instance,
set_laser_noY3
set_punch
Use this command to indicate to the machine that a punch is fitted. The
parameters are <0 (not fitted)/1 (fitted)>.
rd_centre_posn
Reads the traverse centre position (in microns) from NVRAM. See
Section 8.3.13.2.

wr_centre_posn
Writes the traverse centre position (in microns) to NVRAM. See Section 8.3.13.2.
rd_image_offset
Displays the current image base offset value from the centre of the punch hole.
wr_image_offset
Writes a new image base offset position to NVRAM. See Section 8.3.13.1.
power_control
Allows you to view/edit the automatic power control parameters.
cage_creep
Use this command to view/edit the cage creep checking interval. The default
number of scan is 24.
bearing_hold
Use to view/edit the spinner bearing hold time (in seconds).
nd_correction
Allows the addition of the ND correction values to the ND wedge position passed
from the RIP jobfile <1 to enable; 0 to disable>. See Section 10.2.5.3.
spin_clean_level
Allows you to view/edit the spinner mirror cleaning reference level.
auto_rewind_time
Allows you to view/edit the idle period (in minutes) before an automatic rewind
of the media occurs.
punch_bar_width
Allows you to view/edit the nominal punch bar width (in mm). This is used for
advancing media following the expose under punch of negative-plate ready
images.
punch_scan_margin
Allows you to view/edit the punch scan margin (in mm). This is added to the
punch bar width to give an image overlap for plate-ready images.
leak_pie
Enables/disables the flag that converts a transient image into a persistent image
when there is an image expose error. Transient images are deleted once scanned;
persistent image remain on disk until explicitly deleted. For normal operation, the
parameter is always set to 0.
pfa_disklog
Enables/disables the post-failure analysis disk logging to the RIP, see
Section 10.2.6.

contam_ck_interval
Allows you to view/edit the spinner mirror contamination timeout value (in hours)
for auto-checking, see Section 10.2.5.2. The default parameter is 168 hours.
nd_correction_val
The ND correction value is updated after a spinner contamination check and
added to the job ND wedge position values passed from the RIP. See Section
10.2.5.3. Note that test outputs from the optics_mmi utility will not add a
correction value unless specifically enabled in the machine Setup screen.
10.3.7.2 Test Menu

Test menus allow you to select and run tests for the devices and data paths listed
in Figure 10.7.
Figure 10.7 Test menu
Typical test outputs are shown in Figure 10.8. Test outputs also show Error Code
numbers, if the tests are applicable to the System tests, and the time and date.
Figure 10.8 Test outputs
diagnostics/test/basic/
psu
nvram

clock
Tests for the correct date and clock output for the set time zone.
diagnostics/test/registry/
reg_powerup
Use this utility to check if the hard/soft/firmware revisions made on the system
are compatible with the existing configuration. This command also runs as part of
the POST checks on startup.
display_registry
Displays the system, slave board or HDD details held on the System Registry, see
Section 10.4.7.1. The parameter is <board/system/hdd>; for example, enter
display_registryYboard.
update_registry
Used to modify data in the System Registry after a hard/soft/firmware
modification, see Section 10.4.7.2. The parameter is <system>; enter, for
example, update_registryYsystem.
Figure 10.9 Update_registry screen
Toggle the ‘N’ default to ‘Y’ with the [Left/Right Arrow] keys and press [Return]
to exit, then enter Y to confirm.
If you have changed the SSB and the HDD, then the following appears:
sysSerialNum
sysBuildDate
finalTestDate
Enter revised details (using the Cursor keys to navigate) if you have changed both
the SSB and the HDD. Enter the system serial number for production machines as
PXXX. Press [Return] to exit and Y to confirm.
Now check that the revised details are valid by running the Reg_power test:
registry> reg_powerup
diagnostics/test/lasers/

lasers
Checks whether the internal opto-detector of each laser diode indicates an
adequate level of power.
diagnostics/test/optics_motors/
all_home
Checks that each optics stepper motor (focus, low power detector, beam converter
and ND filter) reach their datum position, see Section 10.2.3.7.
LPD_motor
beam_conv_motor
ND_motor
focus_motor
diagnostics/test/DCmotors
Runs a DC punch motor test if the NVRAM parameter, PUNCH_FITTED, is set
to 1.
diagnostics/test/traverse/
datum
Moves the carriage to the traverse datum position.
trav_test
To confirm the level of the recorder, run trav_test which moves the carriage along
the left-hand side end of the traverse for <n = number of scans>. To check the
right-hand side, enter the command as trav_testYr. See Section 8.3.12 for an
explanation of the levelling procedure.
This test takes several minutes to execute.
diagnostics/test/spinner/
spin_test

contamination
Measures the light reaching the drum. On running this test, the result will indicate
a failure without completing the initial setup first.
Setup contamination measure:
1. Run locate_FPD to set the position of the fast photo detector.
2. Run reset_cont_lvl to initialise the contamination level as a reference.
3. Run contamination to indicate the percentage of degradation (spinner mirror
dirt) from the reference level. There are no real percentage thresholds for
when the mirror needs to be cleaned; if there has been a large decline (over
30%) the customer should notice the difference from the quality of the film
output. Make sure the customer follows the internal cleaning procedure given
in the Operator’s Manual.
reset_cont_lvl
Sets the reference level for the contamination.
locate_FPD
Finds and sets the position of the Fast Photo Detector (FPD).
chart_FPD_resp
Obtains the FPD and LPD response data. This information is only useful for
Fujifilm (UK) Customer Services.
diagnostics/test/optics/
pflin
A combined laser power and frequency linearisation test.
beam_coincidence
This test checks if beams from LD 1 and LD 3 are aligned with the reference
beam LD 2. Any failures, where beam_co is unable to align the beams, results in
an optical error code. See Section 10.3.7.3.
diagnostics/test/processor/
status
Checks the comms link with the media processor. See Section 10.2.3.12.
loopback
Requires a loopback connector to be fitted before running. See Section 10.2.3.12.
diagnostics/test/data_path/
init_disk
Initialises the HDD. The command is also run on startup.

init_JM__ODP
Initialises the Job Manager and the Output Data Path. This is not normally used
on a site machine, unless requested by Fujifilm (UK) Customer Services.
serialiser_crc
The machine transfers image data along the SSB data path to the optics system,
and completes a CRC check for data errors.
delete_queue
Deletes any jobs (RIP and persistent images) from the queue. Used to tidy up the
queue.
10.3.7.3 Service Menu

Commands useful for running service utilities are available from the menu shown
in Figure 10.10.
Figure 10.10 Service menu
diagnostics/service/memory/
dmem
Displays the contents of SSB logical memory addresses for the application
firmware.
verify
Displays the firmware application release details, including working directory.
smem
Sets the memory contents. Use the parameters: <add (hex)> <pattern [field
width]> <[number of values]>.
sverify
Sets the memory to a pattern and then verify. Use the parameters: <add (hex)>
<pattern [field width]> <[number of values] [soe/loe (stop/loop on error)]>.
cmem
Copies memory from one address to another. Use the parameters: <from addr
(hex)> <to addr (hex)> <number of bytes>.

compare
Displays the differences between the 1st and 2nd blocks of memory. Use the
paramters: <1st Addr (hex)> <2nd addr (hex)> [field width] [no of values].
search
Displays occurrences of a specified value within a defined area of memory. Use
the parameters: <start--addr (hex)> <end--addr (hex)> <value (field width)>.
diagnostics/service/evt/
The software process system runs about fifty multiple system tasks called STDs
(State Transition Diagrams) which cooperate with each other by passing messages
(or Events) along channels. EVT commands are normally used by R&D to display
and manage these communications as a method of determining the cause of
failure if the machine ‘hangs up’. Service engineers are advised not to use the
EVT commands, except for those listed below.
ini
Event processing is normally initialised on machine startup.
getstate
Displays the current state of each STD task on the System board. These messages
are numerous and will only make sense to R&D. Capture the full display of text
output and consult Fujifilm Customer Services (UK).
sequence
This shows how the system reached its current state. Use the following command:
seqY --1Y1000 to get the last 1000 state changes. Save the full display to a floppy
disk as a text file and email the results to Fujifilm Customer Services (UK).
diagnostics/service/remote/
tip
Connects a local tty device to the board output for monitoring. Not used on site
machines, unless requested by Fujifilm (UK) Customer Services.
rlogin
This allows you to login and display data directly from an intelligent slave board
without routing via the SSB. For instance, to check the position of the FPD on the
SOMB, enter:
remote> rloginYsomb
somb main> photo_det
photo_det> photo_det
Use Help to check the list of commands available on each board. When starting
rlogin, make a note of the messages to obtain information for exiting from the
board main> prompt. Enter [CTRL+E] to exit from rlogin and return to service
diagnostics.

diagnostics/service/optics
Opening the optics submenu reveals the options shown in Figure 10.11.
Figure 10.11 Optics menu
diagnostics/service/optics/aod/
Opening the optics/aod menu reveals the options in Figure 10.12.
Figure 10.12 Optics/aod menu
freq_lin
Linearises a specified AOD frequency channel. Enter the command as:
freq_linY<chan no>Y<power> where the channel numbers are 0, 1, 2 or 3. Note
that LED 1 uses 0 and 1; LED 3 uses 2 and 3.
setfreq
Sets the AOD channel to a linearised frequency value and the supplied power
value. To display the linearised frequency value, set the debug edbg command to
8. The parameters are <AOD channel number (0--3)> <requested AOD linearised
frequency in MHz> <AOD power value (Hex)>
disp_lin
Displays the linear table for a specified channel showing the frequency, linear and
power values. The parameter is <AOD channel number (0--3)>; enter, for
instance: disp_linY3.
power_comp
Compensates power for a specified AOD channel where the command is entered
as: power_compY<chan No>.

flin_pow
This command runs freq_lin and power_comp for all the available channels.
When run with beam_co it performs the equivalent of an MMI optics calibration.
The resulting table is written to NVRAM.
It checks the frequency linearisation of the AOD (from 76 to 83 MHz) and power
compensation as frequency is switched from the lower to upper range. The aim is
to ensure that the optical efficiency of the laser and AOD pairing is constant over
the AOD frequency range. A typical report displayed after the test would be:
freq AOD0 AOD1 AOD2 AOD3
76 0x8 0x8 0x8 0x8
77 0xa 0xe 0xd 0xf
78 0xd 0x15 0x12 0x15
79 0xe 0x16 0x14 0x18
80 0xe 0x18 0x15 0x19
81 0xe 0x19 0x15 0x18
82 0xa 0x18 0x16 0x16
83 0x7 0x17 0x15 0x711
PASSED TEST
main> Serialiser Status = 105
A Serialiser Status of 105 reports a successful ‘flin_pwr’ operation in this

example.
read_beam
Reads the beam position when the laser is switched on and the ND position is set
up. The parameters are <number of samples>; for instance, read_beamY5.Enter
the debug command, edbgY19, beforehand to display the data.
beam_co
Aligns a beam with reference to LD2 so that it is within the default specification
of 2 mm; the NVRAM parameter can be set from between 0 and 10 mm. Enter, for
instance: beam_coY3.
When running ‘beam_co’ note that there are different NVRAM tolerance setup
values for a 2-beam and 3-beam system.
Table 10.3 Beam_co tolerance values
Beam_co parameters for: 2-Beam 3-Beam

beam_co_check_pow_tol 5 5
beam_co_check_pos_tol 3.0 2.0
beam_co_pow_tol 4 4
beam_co_pos_tol 2.4 1.6
1. Run the utility, beam_co, with the debug ouput option for Beam Coincidence
(19) enabled:
main> edbgY19

2. Start the utility:

optics/aod> beam_co
3. As the utility runs you will be able to scroll through the debug results to check
whether average laser power and position (X and Y) tolerances for LD1 (or
LD3) are within the following specified range differences to LD2:
beam co check power tol = 5 (microwatts)

beam co check pos tolerance = 2.000000 (microns)
beam co power tol = 4
beam co pos tolerance = 1.600000/
Note: If the displayed tolerances are different from those above then they
should not be adjusted. Refer to Customer Services where there is a
problem in obtaining beam coincidence before attempting to expand
the range.
4. If the difference values are within range then the utility will write the AOD
nominal frequency (FNOM) values into NVRAM. Where the differences are
greater, then the utility adjusts the AOD channel frequencies, resamples
average power and X:Y positions on LD1 (or LD3), and recalculates the
FNOM values. This process is repeated until the differences are within the
tolerance range. The example below shows how ‘beam_co’ operates.
5. If the power or X:Y positional values are constantly outside the tolerance
range (after 10 iterations) then two possible Error Codes could appear:
· 160: The beam_co utility cannot obtain a difference result that is within
tolerance range.
· 165: The beam_co utility itself has failed to run properly for some
reason.
6. Fault messages, such as ‘Insufficient power for LD1’ usually means that the
laser or AOD modules are slightly misaligned, in this case, between LD1 and
AOM1. Make sure that the modules are flush to the mountings.
7. Disable the diagnostic debug output with the following command:
main> ddbgY19
Make sure the debug is disabled after this procedure. If the debugger is not
disabled, the production scan rates will be slower.
beamco_pos_tol and beamco_chkpos_tol
These commands set and check the position tolerance values for testing beam
coincidence. Use them when upgrading a machine to a dual- or triple-laser
system. The parameter is a floating point <value>; enter the command as, for
instance (see Table 10.3):
· A dual-beam machine is set as:
beamco_pos_tolY2.4
beamco_chkpos_tolY3.0
· A triple-beam machine is set as:

beamco_pos_tolY1.6
beamco_chkpos_tolY2.0
If a parameter is not entered, the current tolerance value is displayed.
LD2_power_set
Sets the power level for LD2 when the machine is running in single-laser mode.
diagnostics/service/optics/lasers/
The range of values (in Hex) to enter for a laser diode are as follows:
· IVCGA (gain): 2F to FF
· Bias: 41 to 70
· Drive: D7 default for range 00 to F0.
These laser commands operate directly on the laser NVRAM parameters. They
need to be used with care.
lenable
Switches on a specified laser and its bias or drive. Parameters are entered as
<laser (1 to 3)> <bias (b); drive (d)> for instance: lenableY2Yd. Switch on bias
first to check for generated light whenever a new laser diode is fitted.
ldisable
Switches off a laser and sets the bias/drive to 0. Parameters are <laser (1 to 3); for
instance, ldsableY1
lset_params
Writes the laser parameters in Hex as <laser number> <gain> <bias> <drive> to
NVRAM. For instance: lset_paramY2Y55Y60Y62.
Check that the parameters are correct with lread_params. The gain and bias values
are not modified unless a new diode is being installed; note that the drive value
controls the power level within NVRAM parameter limits set to prevent excess
power from damaging the diode.
lread_params
Displays in Hex the specified laser parameters (laser number, gain or IVCGA,
bias and drive in parameter order); for instance, lread_paramsY2.
lcpd_params
See the menu (diagnostics/log_utils/nvram) in Section 10.3.7.1.
lset_params
Writes the laser parameters in Hex as <laser number> <gain> <bias> <drive> to
NVRAM. For instance: lset_paramY2Y55Y60Y62.
Check that the parameters are correct with lread_params. The gain and bias values
are not modified unless a new diode is being installed; note that the drive value
controls the power level within NVRAM parameter limits set to prevent excess
power from damaging the diode.

lread_params
Displays in Hex the specified laser parameters (laser number, gain or IVCGA,
bias and drive in parameter order); for instance, lread_paramsY2.
lcpd_params
Allows you to display and/or edit the NVRAM laser parameters for lasers 1, 2 and
3. Enter, for example: lcpd_paramsY2 to display the current parameter values for
LD 2. Alternatively, enter the optional <change> parameter as
lcpd_paramsY2Ychange to display the parameters for editing before being
written to NVRAM. Use the cursor Arrow-Down key to move down each field.
Use this menu to enter the new scan values for a laser upgrade. Remember to
update the PD (Photo Diode) as well as the scan drive values.
See also the menu (diagnostics/log_utils/nvram) in Section 10.3.7.1.
set_laser_no
Use this command to set the NVRAM parameter LASERS_USED to a value for
the number of lasers operating. The parameter is <1/2/3>; for instance,
set_laser_noY3
read_LPD
Allows the continuous read of the low power detector for each selected resolution
and laser beam.
read_powers
Allows the continuous read of the low power detector for each selected resolution
and laser beam.
diagnostics/service/optics/motors/
Opening the optics/motors menu reveals the options in Figure 10.13.

Figure 10.13 Optics/motors menu
2d_pos_nd
Moves the ND filter wedge so that the beam path falls on the clearest part of the
filter. This position is taken from the NVRAM location parameter, NV_2DPOS,
which is used by the POD to improve detection. There are no parameters.
nd_res_pos
Moves the ND filter wedge to a set position for the resolution entered as a
parameter <48/72/96/144>. If no parameters are entered the default is 96 l/mm.
Resolution positions are stored in NVRAM as, for example, NV_ND_48_RES.
clr_nd_pos
Moves the ND filter wedge so that the beam path is not filtered or blocked. There
are no parameters.
max_nd_pos
Moves the ND filter wedge to the maximum transmission position.
min_nd_pos
Moves the ND filter wedge to the minimum transmission position.
beam_res_pos
Moves the beam converter lens to a set position for the resolution entered as a
parameter <48/72/96/144>. If no parameters are entered the default is 96 l/mm.
Resolution positions are stored in NVRAM as, for example, NV_APP_48_RES.
focus_res_pos
Moves the focus lens to a set position for the resolution and film thickness entered
as parameters <resolution (48/72/96/144)> <thickness (4/7)>.
close_pos_lpd
Moves the low power detector lens into the beam path. There are no parameters.
open_pos_lpd
Moves the low power detector lens out of the beam path. There are no parameters.
home_optics_motors
Moves all the optic stepper motors to their Home position.

diagnostics/service/optics/optics_mmi/
optics_mmi
Use this command to open a test strip setup screen for automatically generating
and exposing strips from a set of editable default values. Each strip differs from
the previous one by a ‘step value’, enabling the operator to determine the
optimum step position and record the ’final value’ into NVRAM.
Note that if the Machine Setup option is opened for vertical registration
adjustment, the adjustment value (in microns) is remembered after the tables have
been recalculated.
Section 5.2.2.3 describes how to use this facility in more detail.
Figure 10.14 Optics_mmi screen
nvram_setup
Use this command to update all the NVRAM parameters for a specific software
version. Enter the parameters as, for instance, nvram_setupYV1.22.ABYV1.22.AC.
diagnostics/service/motors/
Enter motors/ to open a set of utilities for operating the stepper motors for the
optics and film handling. You can only operate one motor at a time with these
commands.
setmotor
Enter motor name to set the current motor for the other commands, for example,
setmotorYnd. See Table 10.4 for a list of motor names.
show_motors
Displays the list of motor names, see Table 10.4.

Table 10.4 Stepper motor names
Setmotor Name Description of Motor

focus Focus
beam_converter Beam Converter
nd ND Wedge
slow_speed Slow Speed Detector
a_cass Cassette Feed (upper)
b_cass Cassette Feed (lower)
drum_feed Drum Input
a_pair Cassette Feed A and Drum Feed
b_pair Cassette Feed B and Drum Feed
transport Horizontal Output
output Vertical Output
out_pair Horizontal and Vertical Output
getmotor
Displays the currently selected motor name
move
Use this command to move a motor a number of steps at an optional speed
(frequency); parameters are <num of steps> <f or b> [frequency]; for instance,
moveYfY80Y600.
stop
Use this command to stop the current motor.
movemore
Moves the motor a further number of steps after the ‘move’ command has been
invoked. Enter, for example, as movemoreY20.
offstation
Moves a motor to a specific position relative to its Home sensor. Enter, for
example, offstationY60Y400.
movetillsen
Moves the motor towards a sensor until an edge (rising or falling) is reached.
shpos
Shows the position of the current motor.
shcond
Shows the status of the current motor.
wait
Wait for the current motor to stop.

diagnostics/service/sensors/
rewindTest
Rewinds the drum feed with the cassette motor using a set number of steps. Enter,
for example, as rewindtestY20.
read_sensor
Use to read the condition of an individual sensor, for example, read_sensorYs9.
en_trans
Enables a sensor rising/falling transition edge for a defined sensor. The
parameters are: <b (both); r (rising); f (falling)> and <sensor name>. For instance,
enter: en_transYrYs11.
en_limits
Enables the limits detection on analogue sensor. The parameters are: <sensor
name> <lower limit> <upper limit>.
dis_evt
Disables the event generation for sensors. A single parameters is: <sensor name>.
ena_grp
Use to enable/disable all the photo diode sensors on the two film handling boards.
The parameters are: <e (enable); d (disable)> <FHMB name (1, 2)>. Enter, for
example, ena_grpYeY1 for FMB1 and ena_grpYeY2 for FHMB2.
show
Lists all the sensor names (including unused sensor names), see Section 3.4.
environ
Displays the temperature sensor reading on the SSB in units of 0.1°C. There are
three thresholds defined by the software, see Section 10.2.9.3.
read_con
Opens a screen showing the continuous condition of all the film handling sensors,
see Figure 10.15. The media sensor conditions are:
· Opto-reflective sensor detecting media (PRESENT) and not detecting
(ABSENT).
· Opto-slotted sensor detecting the presence of a mechanical tab (YES) and not
detecting (NO).
· Cassette ID sensor detecting silver (WHT) and black (BLK) codes.
· ’XXX’ are indeterminate states.

Figure 10.15 Read_con screen
Press Ctrl-c to EXIT from a submenu or select the following options (see
Figure 10.16):
· All ERR: select All ERR to switch off (remove) the displayed sensors with
error reports; reselect the option to redisplay the sensors.
· Specific Sensor: select a specific sensor to switch off (remove) the displayed
sensor output; reselect the option to redisplay the sensor output.
· All XXX: select All XXX to switch off (remove) the displayed sensors with
indeterminate reports; reselect the option to redisplay the sensors.
Figure 10.16 Read_con submenus

diagnostics/service/time/
set_time
Allows you to set the time on the machine.
now
Displays the current time.
sleep
Use to add a machine pause in milliseconds, for example, sleepY100.
diagnostics/service/traverse/
init
Initialises the traverse servo motor.
datum
Moves the traverse carriage to the datum position on the left-hand side.
wait_datum
Use after entering the datum command to prevent any other diagnostic command
from running while the carriage is reaching datum.
goto
Moves the carriage to a position on the traverse set in microns. Enter the
parameter as <position (in microns)>; for example, gotoY580400 for approximate
centre position or gotoYpos=1130.000 to move to a specified position (ie 1.3 m).
wait_stop
Use after entering the stop command to prevent any other diagnostic command
from running while the carriage is stopping.
stop
Stops the carriage traversing as a smooth brake.
halt
Stops the carriage traversing as an abrupt brake.
pos
Reports the position of the traverse.
status
Reports if the traverse is moving or stationary.
rd_centre_posn
Reads the current NVRAM centre (horizontal) position of the image on film with
respect to the left film edge, see Section 8.3.13.2.

wr_centre_posn
Writes into NVRAM the new centre (horizontal) position of the image on film,
diagnostics/service/spinner/
reset
Initialises the spinner control circuitry.
start
Starts the spinner and runs it up to full speed.
idle
Runs the spinner at idle speed.
stop
Stops the spinner - braking takes approximately 20 seconds (max).
index
Displays the number of spinner index counts before start.
rd_image_offset
Reads the current NVRAM base offset (vertical) position of the image on film
with respect to the punch hole centre, see Section 8.3.13.1.
wr_image_offset
Writes into NVRAM the new base offset (vertical) position of the image on film,
diagnostics/service/actuators/
set
Sets the solenoids (V1, 2, 3, 4, 6 or 10) and the motors (M3, etc) to on, off,
disabled and no change state. Use the parameter <on/off/dis/no>. Enter, for
example, setYm16Yon. Use show to list the solenoid names.
cond
Reads the actuator state. Enter, for example, condYv1. Use show to list the
solenoid names.
show
Displays all the actuator (solenoid and motor) names, including some unused
names.
diagnostics/service/disk/
If there are two Hard disk drives, they are selected as SCSI unit numbers 0 and 1.
Unit 0 matches CHAN 1 drive; Unit 1 matches CHAN 2 (see Figure 3.7).

unit_no
Returns the SCSI number of the drive unit as (odd = 1; even = 0) if a parameter is
not entered. Enter a parameter <0> <1> to set the default unit for operating the
commands below; for instance, unit_noY1.
scsi_id
Displays the device SCSI ID and default unit number. Alternatively, enter the unit
number as a parameter, for instance, scsi_idY0.
test_unit_rdy
Returns the state of the default unit and checks whether the unit is ready to run.
Enter as test_unit_rdy after setting the unit number (unit_no). The test report
indicates unit ready (++), unit, unit number and SCSI ID.
capacity
Indicates the status and size (in bytes) of the disk drive memory blocks of a
default unit without a parameter. Alternatively, enter the unit number as a
parameter, for instance, capacityY0. Also displays the blocks of logical addresses
and block banks in byte decimals for free and used memory.
inquiry
Without a parameter, displays all the drive details (SCSI ID, vendor ID, product
ID etc) and completes checks on the default drive status. Alternatively, enter the
unit number as a parameter, for instance, inquiryY0.
start_stop
Enter parameter <1 (stop)/0 (start)> to start and stop the default disk rotating.
Enter a second parameter to select the unit. A report indicates whether the
stop/stop operation is successful.
reset
Installs the SCSI driver for the default unit. Set the unit number as a parameter,
for example, resetY1
dfs/
Opens the disk file system utility below.
diagnostics/service/disk/dfs/
Opening the disk/dfs menu reveals the options in Figure 10.17.

Figure 10.17 Disk/dfs menu
mountall
Mounts a new file system. If the system is already mounted, it is unmounted first.
Make sure the dfs is initialised as part of the startup.
un_mountall
Unmounts the file system.
format_low
Scans the disk drive and checks all sectors for damage. Note that the complete
check takes about 55 minutes.
sys_format
This reformats (ie repartitions) the drive and removes all unwanted files and
images. Make sure that the Media/Cassette databases, NVRAM and Config data
are regenerated on the new disk space. Record the exiting database details on
paper from dbase/dump and restore from Change Options on the MMI; use the
Configuration options to save/restore NVRAM data; use the Registry options to
display/update config data.
ls
List files in the current HDD directory; for instance, ls /general/*.
cd
Changes the file system default partitions to be either odd or even.
mv
Renames a file on a partition; enter parameters as <old filename> <new
filename>.
rm
Deletes matching files on one or more partitions; enter the parameter as
<filename>.
od
Displays the contents of a file; enter the parameter as <filename>.

partition_info
Displays information on the disk partitions as odd, even and general; enter the
parameters as <odd/even/general> to display the disk number, partition address
and size; section size; section cluster numbers; FAT size; sectors FAT.
Disk information is shown as disk name, address, partition size, sector size and
sector cluster.
diskspace
Displays the partition usage on the odd, even, general disk partitions. Displays the
total area (in Mbytes) for the area used and area free.
cmp
Compares two files on the disk; enter parameters as <filename 1> <filename 2>.
cp
Copies a file to a directory; enter parameters as <filename> <directory>.
diagnostics/service/testpatns
Note: Testpatns commands are entered using hyphens (--) and not underscores
(_).
Test pattern outputs generated by /testpatns are from direct calls to the machine
hardware and not to the application exposer/film handling software modules.
Use the optics>mmi facility described in Section 5.2.2.3 to create and output a test
pattern. Test strip generation from this facility include an automatic and manual
set of tests followed by a media eject.
test--patn--edit
Opens a set of fields that allow you to select a beams, resolution, grid pattern and
lines on/off. Use the cursor keys and press [Return] to exit.
image--params
Opens a set of fields that allow you to edit the following values:

Figure 10.18 Edit image parameters
border--type
Use to display or edit border types for editing negative or positive images.
power--con
Use to display and switch the laser on/off for an expose.
beam--buffer--select
Allows you to select a beam and a buffer.
spinner--on--off
The spinner returns a ‘1 per rev’ signal which is used for the image output when
the parameter is set to <on>; when set to <off>, a separate clock supplies a
substitute signal not related to the spinner.
image--bias--posns
Allows you to display and adjust the bias positions of the lasers. Do not modify
the NVRAM bias positions.
apc--setup
Allows you to display and edit the APC setup of fixed values. Do not modify the
NVRAM APC setups.
run
Outputs a test image.
dump--buffers
Not used for field servicing unless requested by Fujifilm (UK) Customer Services.
fill--buffers
Not used for field servicing unless requested by Fujifilm (UK) Customer Services.

diagnostics/service/job_mgr/
The Job Manager facility allows you to create, delete or display the status of a
media job on the Hard disk. As an alternative method, the service engineer can
create jobs from the RIP and delete jobs from the Manage Job Queue option on
the MMI Maintenance menu.
There are two types of jobs: Expose and Media. Expose jobs are linked to
transient or persistent images. Transient (ie RIP) images are deleted once scanned;
persistent image remain on disk until explicitly deleted.
init
Initialises the Job and Image Manager software.
piejob
Use this command to create a persistent image expose job (ie a job linked to a
specified persistent image name is created and added to the Expose queue. The
optional [e] parameter allows you to edit the job parameters. Enter parameters as
<image name> [e].
delete
Remove a job from the expose queue. Enter parameter as <job ID>.
expose
Simulates expose of all jobs on the queue. Jobs need to be queued before starting.
qhold
Holds the expose queue.
qrelease
Releases the expose queue.
jhold
Holds a job from the expose queue; enter the parameter <job id>.
jrelease
Releases a job from the expose queue; enter the parameter <job id>.
media
Displays the current media type for cassettes 0 or 1.
qstat
Dumps the job queue status that includes the progress, parent and sub job IDs.
Includes a history list of jobs.

Figure 10.19 qstat screen
stat
Enter stat to display the status of queued jobs as a test for the Job Manager
function on the MMI.
· download job id: job IDs of any expose jobs
· expose job id: job IDs of any downloading jobs
· queued jobs: total of jobs on the Expose queue
· media held jobs: number of jobs held for media
· job held: held job at head of queue
· queue held: job queue is held.
Figure 10.20 stat screen
dumpjob
Dumps the job description if it has not been processed; enter as dumpjobY<job
ID>.

diagnostics/service/image_mgr/
init
Initialises the Job Manager and Image Manager.
rm
Deletes an image, and entered as: rmY<image name>.
dumpimage
Displays the image descriptor settings. Enter the parameter <image name>.
dir
Lists all the images (persistent and RIP transient) held on Hard disk.
editjob
Opens a screen from where you can edit the default job parameters for a persistent
image. Enter the parameter <image name>.
This facility allows you to select an expose image and edit parameters. For
instance, a set of commissioning pages (persistent), installed on the recorder Hard
disk for scanning as test jobs, but parameters (such as the ND Wedge) used for
local exposures may need to be set up.
1. To run a test page, select Run Test Page from the Tools menu.
2. Select an image, for instance, a Screen and Tint (S&T) page at 96 l/mm
resolution. Expose, eject and process the image to check for quality.
3. Check for the correct density and select a Dmax for the type of film.
4. Use the Image Manager utility to enter the new value onto the Hard disk.
Obtain the (main>) prompt and enter:
main> image_mgr
to enter the utility, and:
image_mgr> dir
to list all the persistent images on Hard disk. Now enter:
image_mgr> editjobY<image name>
which lists the following image parameters:
· eject len(gth): post eject length
· punch: punch on/off
· x pos(ition): horizontal image offset on film
· y pos(ition): vertical image offset on film
· wedge pos(ition): wedge position
· laser power: not available
· repeats: not available

· media name: target media name.

5. Scroll down to the required field and edit the settings as required with the
cursor keys.
6. Press [Return] to confirm and enter y to save the new value to the default job
file on Hard disk.
Note: In some cases, image names can be entered as (*) wildcards; they have a
maximum length of 17 alpha-numeric characters.
editimage
Translates any job to a plate-ready job, and entered as: editimageY<image
name>.
diagnostics/service/medproc/
status
Obtains the status (busy, etc) of the processor.
takefilm
Sets the processor to expect film.
stop
Stops the processor rollers.
restart
Restarts the processor after a stop.
diagnostics/service/medtran/
load
Loads media from a cassette into the drum.
rewind
Rewinds media from the drum into the cassette.
eject
Ejects media from the drum into the Horizontal tray.
output
Outputs a cut film to the processor.
status
Shows the status of the film path if, for instance, there is a media transport jam.
MMdisted
Allows the normal film handling length parameters to be edited.

misc
Figure 10.21 misc screen
Opens a screen displaying the following media transport parameters:

· (A) GOOD STB PRESENT: indicates if a working STB is present.
· (B) SKEW RELOAD COUNT: No of times film is fed and returned from the
drum to prevent skew. The default is 2
· (C) CASSETTE SELECTED: A (upper) or B (lower) selected for media
handling.
· (D) MEDIUM WIDTH: defines the medium width for film handling.
· (E) DRUM BLOW FITTED: Indicates if drum blow is enabled. The default is
‘Y’
· (F) VACUUM CONFORMANCE VALUE: defines the lowest threshold
reading to ensure correct drum conformance. This facility is not currently
enabled.
· (G) SENSOR IN OUTPUT TRAY: defines whether the software uses the
horizontal output tray sensor.
· (H) RELEASE VACUUM AFTER CUT: defines whether the vacuum is
temporarily released after a film cut. The default is ‘N’.
· (I) MEDIA PROCESSOR PRESENT: defines whether the processor is
physically attached, with or without smart comms. The default is ‘Y’.
diagnostics/service/dbases/
These are the media and cassette databases held on the Hard disk. Details on the
databases can be modified from the Change Media option on the MMI.
dumpc
Displays the entire contents of the cassette database, showing the cassette ID in
each bay.

Figure 10.22 dumpc screen
update
Updates the media and cassette databases with the current values found for each
bay. Enter parameters as <cassette ID> <film name> <length> <used length>
where (cassette ID 1 to 7; film name = string; length = integer).
reduce
Reduces the length of film in a cassette by a set amount in millimetres. Enter
parameters as <cassette ID> <length> where (cassette ID 1 to 7; length in
millimetres).
dumpm
Displays the entire contents of the media database, showing the type of film and
the remaining film lengths.
Figure 10.23 dumpm screen

10.4 Checking Configuration and NVRAM Data
10.4.1 Introducing Configuration Data Files

Configuration (Config) data for all the intelligent boards (SSB, SOMB, STB and
FHMBs), the overall system and the NVRAM for each board are held on the
recorder as four types of files:
1. Board Configs: data files (board serial number, etc) for each of the intelligent
board.
2. System Configs: System data (System ID, etc).
3. System Registry: board configuration data that needs to be updated if a
hardware or software change is made.
4. NVRAM: current parameters copied from the board files to the Hard disk via
the SSB.
The recorder stores copies of the configuration data files on the SSB, and on the
Hard Disk (HDD) as backup data. Useful data for board IDs, revision and history
are copied from the Config files and held on a System Registry file that allows
service engineers to check and record changes of system configuration.
Figure 10.24 outlines the organisation of the data files and the type of data they
store.
Service engineers are able to replace intelligent boards with new boards that have
different revision levels, download new versions of firmware, update the system
registry and run registry checks to ensure that the various versions of hardware
and software installed on the system are compatible.
NVRAM parameter values held on each intelligent board can also be copied onto
Hard disk, via the SSB, if a board is being replaced, and restored to the new board
from the disk. See Section 10.4.6.

BOARD CONFIG
SERIAL NUMBER
BUILD DATE
PCB PART No. ID DETAILS
MACHINE BUILD
PCB MANUFACTURER
FINAL TEST DATE
CHANGES MADE
(SYS, F/W, S/W)
MULTIPLE HISTORY
RECORDS DETAILS
DATE (NOTE) DETAILS NOTE: INCLUDES SYSTEM
(20)
ENGINEER ID SERIAL NUMBER OR
F/W, S/W USER No.
HDD SSB
FHMB2
GENERAL\ FHMB1
CONFIG
TMPREG.TXT
SOMB
GENERAL\ STB
NVRAM
REGISTRY.TXT
CONFIG
GENERAL\ SYSTEM
SYSCONFIG.TXT REGISTRY NVRAM
GENERAL\
SYSNVRAM.BIN SYS CONFIG
SYSTEM CONFIG
SYSTEM ID
BUILD DATE ID DETAILS
TEST DATE
SSB SERIAL No.

MULTIPLE STB SERIAL No.
SOMB SERIAL No. REVISION
RECORDS DETAILS
(6) FHMB1 SERIAL No.
FHMB2 SERIAL No.
H/W CHANGED
MULTIPLE DETAILS (NOTE) HISTORY NOTE: DETAILS OF H/W
RECORDS DATE DETAILS CHANGED -- INCLUDING
(10) ENGINEER ID HDD. DETAILS INCLUDE
FILE UPDATES SERIAL No.
Figure 10.24 Configuration and Registry files - structured view
10.4.2 Board Config Files

Each intelligent board (SSB, SOMB, STB, FHMB1 and 2) stores the following
board data (as a maximum number of characters) in a local Board Config file:

ID Data
· serial number (16 chars)
· build date (5)
· PCB part number (16)
· machine build (1)
· PCB manufacturer (2)
· final test date (8).
History Data
· software, firmware and system changes (5)
· installation dates (8 -- taken from the machine Time/Date)
· installer names. (8 - the password of the installer, for example, ’uk1’)
From each board, Config data is passed to the SSB for storage as sets of multiple
records that are displayable as ASCII data. In the case of History records, the last
entry is shown first for up to 20 entries. This data can be accessed by the service
engineer either for information purposes or to be updated whenever the
configuration of the board is changed.
The current Config data for each board is displayed on a terminal from Main
diagnostics after obtaining the Registry menu as follows:
diagnostics> tests
sysdiag> registry
registry> display_registryYboard
10.4.3 System Config Files

In addition to the multiple board Config data files, the SSB also holds a similar set
of system data files:
System config data shows which boards make up the system, allowing the
engineer to track board changes.
System config data is held separately on the SSB and HDD as the following
items:
ID Data
· system ID (16 chars)
· build date (8)
· tests date (8).
Revision Data
· board serial numbers (SSB, STB, FHMB1, FHMB2, SOMB)

History Data
· H/W changed
· details of change
· date of change
· ID of engineer that made the change.
For revision data the last 10 system changes are tracked and the last 6 system
configurations are stored.
10.4.4 System Registry Files

The System Registry is a set of Config data files for all the intelligent boards in
the recorder and is held on SSB Flash memory, with a copy automatically
generated on the HDD. It’s purpose is to provide a quick view to the current
software, firmware and hardware status of each board, and also the history of any
changes made to the software and hardware in the system.
Each intelligent board has a set of board data files comprising an ID file, a
Revision file and a History file, see Section 10.4.2 for details of the ID Data,
Revision data and History Data.
The History file is automatically updated when the Revision file is changed.
Whenever software, firmware or hardware is changed on the system, the engineer
must update the System Registry. The next time the system is booted up, the ID,
Revision and History files in all of the intelligent boards are compared with the
same files in the System Registry by a utility called ’Reg_Powerup’ held in the
Registry directory.
If a difference between any two files is detected, a System warning symbol
appears (Error Code 1005) on the MMI. This is a non-fatal error allowing the
system to continue scanning, but will keep appearing until the registry has been
updated using the utility ’Update_Registry’. See Section 10.4.7.
The current System Registry on the SSB is displayed from Main diagnostics after
obtaining the registry menu (see Section 10.3 for information on how to navigate
the diagnostic menus):
diagnostics> tests
sysdiag> registry
registry> display_registryYsystem
10.4.5 HDD Data Files

Hard Disk Drive (HDD) configuration data, held as backup files, is
interchangeable with the data on the SSB. Configuration data is held on the HDD
in four file areas:
1. ‘general\tmp.txt’: temporary data from System Registry on the SSB used for
checking compatibility levels after a board or software change.

2. ‘general\regsyslog.txt’: a copy of the System Registry on the SSB.

3. ‘general\sysconfig.txt’: system configuration data from the SSB.
4. ‘general\sysnvram.bin’: all the NVRAM values from each board are stored via
the SSB.
Note: The registry data held on the HDD will only be different to that stored on
the SSB if either one has been replaced.
The current registry data held on HDD is displayed on Main diagnostics after
obtaining the registry menu as follows:
diagnostics> tests
sysdiag> registry
registry> display_registryYHDD
10.4.6 NVRAM Data

NVRAM values, held by the SSB and slave boards, are stored on the Hard disk.
Engineers can save and restore NVRAM values between the boards and the HDD.
The Save and Restore functions are available after obtaining the Log_utils menu
by entering:
diagnostics> log_utils
The Save command takes the NVRAM data and copies it to HDD.
log_utils> save_nvram
The Restore command copies the NVRAM data backup file (sysnvram.bin) from
the HDD to the SSB.
log_utils> restore_nvram
10.4.7 Updating the System Registry

If an intelligent board is replaced, or new software is downloaded, then the
System Registry data on the SSB board and HDD must be updated and checked
for hardware/software incompatibilities, see Section 10.4.7.2. This is
automatically carried out by the utility, Reg_powerup, that automatically runs
when the system is booted up after the change. The Reg_powerup test can also be
run as an explicit command from:
registry>reg_powerup
The result from this test is either:
· An compatibility failure shown as an Error Handling screen on the MMI with
an Error code of 1005.
· A pass allowing the MMI scan mode screen to appear.
If a software change is made, the registry test is completed and (if successful)
allows the system to enter scan mode Where there are non-software changes, then

the test will automatically fail requiring the engineer to update the registry using
the Update_registry utility, see Section 10.4.7.2.
If the SSB or HDD are replaced, data from one device is automatically copied to
the new device. However, a problem occurs when both the HDD and SSB are
changed. In this case, note the system configuration details and update the registry
with the new serial, build and final test data. See Section 10.4.7.2.
10.4.7.1 Using Display_Registry

1. Obtain the prompt (registry>) from:
diagnostics/tests/registry
and enter:
registry> display_registryYsystem
for the System Registry
registry> display_registryYboard
for all the boards.
10.4.7.2 Using Update_Registry

1. Obtain the prompt (registry>) from:
diagnostics/tests/registry
and enter:
registry> update_registryYsystem
2. Start to reply to the following set of questions:
3. If you have changed the SSB and the HDD, then the following appears:
sysSerialNum
sysBuildDate
finalTestDate
Enter revised details (using the Arrow keys to navigate) if you have changed
both the SSB and the HDD. Enter the system serial number for production
machines as PXXX. Press Return to exit and Y to confirm.
4. Now check that the revised details are valid by running the Reg_power test:
registry> reg_powerup

10.5 Running MMI Diagnostics

From the MMI Tools screen it is possible to run the System self-tests and the
Media self--tests. Use the following procedure:
1. Once the Image Not Downloading icon appears on the Tools screen, select
Run Diagnostics from the Tools menu to reveal:
RUN SYSTEM RUN MEDIA

SELF-TESTS SELF-TEST
Figure 10.25 Recorder Self-Tests screen
2. You can select one of the following options, depending on the type of error:
Run System Self-Tests and Run Media Self-Tests.
Run System Self-Tests
3. This function runs all the recorder System diagnostics, see Section 10.2.3. If
all the tests pass, then the display shows a Tick icon:
4. Press Return to reboot and commence scanning. If a self-test fails, the Error
Handling screen for the Error Group appears.
Run Media Self-Tests
5. Selecting this option runs a set of tests on all the media handling devices from
the cassette to the processor. The screen shows a Location icon and a Wait
Timer as the tests progress:

Figure 10.26 Media Diagnostics in Progress screen
6. As the tests run through each module, the film path on the Error Location icon
turns from grey to black. To check that all the sensors are operating correctly,
a sheet of film, from each cassette, is passed through the media path and
ejected. See Section 10.2.3.13.
7. If all the tests pass, then the display remains unchanged. If a test fails, the
screen for a media transport error appears. See Section 10.2.9.6.
Most of the main errors on the recorder are located as a single flashing module
highlighted on a cross-cut view of the recorder, shown in Figure 10.27.
OPTICS
CASSETTES
(UPPER & LOWER) MEDIA
OUTPUT
DRUM
INPUT VERTICAL
(UPPER & LOWER) OUTPUT
TRAVERSE
SPINNER
GUILLOTINE PUNCH HORIZONTAL

HORIZONTAL OUTPUT
BUFFER
Figure 10.27 Recorder error module locations

Cable Descriptions A
This appendix lists the main cables and a description of the signals and voltages
on the connector pins. Refer to Section 3.7 for further details on the DC and AC
distribution.
Table A.1 Pin Out for PL1: Cable Assy: PL2/PL1 (DISK_DATA1/2) 99700018
Pin Number at Signal Pin Number at SBB Signal

SBB and Disk Function and Disk Drive (1) Function
Drive (1) Drive (1)
1 Ground -- --
2 SDO (0) 26 Spare
3 Ground 27 Ground
4 SDO (1) 28 Ground
5 Ground 29 Ground
6 SDO (2) 30 Ground
7 Ground 31 Ground
8 SDO (3) 33 Ground
9 Ground 34 Ground
10 SDO (4) 35 Ground
11 Ground 36 BSY1
13 Ground 38 ACK1
15 Ground 40 RST1
17 Ground 42 MSG1
18 SDPO (0) 43 Ground
19 Ground 44 SEL1
20 Ground 45 Ground
21 Ground 46 C/D1
22 Ground 47 Ground
23 Ground 48 REQ1
24 Ground 49 Ground
25 Spare 50 I/O1
Table A.2 Pin Out for PL4: Cable Assy: flying lead to RFI box cooling fan
Pin Number at Signal

SSB Function
1 Ground
2 Fail
Engineer’s Reference Guide 6700898003 A-1

Cable Descriptions
3 Ground
4 +24 V
Table A.3 Pin Out for PL7: Cable Assy: (AODD_PWR) 99700020
Pin Num- Signal Pin Wire Colour

ber at SSB Function Num- Code
ber at
AODD
1 Chassis 1
Ground
2 +24 V 2 White/Black
3 +5 V 3 Red/Black
4 Spare 4
5 +24 V Ground 5 Black/White
6 +5 V Ground 6 Black/Red
Table A.4 Pin Out for PL11/10: Cable Assy: (SSB_PWR2) 99700023
Pin Signal Pin Num- Wire Colour Signal Pin Num-

Number Function ber at Code Function ber at
at RFI SSB SSB
Box PL11 PL10
1 Screen link 1 Black 1
2 --15 V 2 Violet/Black +15 V 2 (Yellow)
3 +15 V 3 Yellow/Black --15 V_FAN 3
4 +24 V_1 4 White/Orange 4
(AODD)
5 --15 V (FAN) Gnd_15 V 5 (Black)
6 +24 V_2 (oth- 6 White/Brown --15 V_Gnd_FAN 6
ers)
7 Spare
8 --15 V Ground 8 Black
9 +15 V Ground 9 Black
10 +24 V_1 10 Black
(AODD) Gnd.
11 +15 V Ground 6 Black
12 +24 V_2 12 Black
Ground
Table A.5 Pin Out for PL6/PL8:

Cable Assy: (DISK_PWR) 99700017
Pin Signal Pin Wire

Number Function Number Colour
at at Disk Code
SSB Drive
1 +12 V 1 White
2 +12 V Ground 2 Green
3 Disk Ground 3 Black
4 +5 V 4 Red
A-2 Luxel F-9000 Recorder

Cable Descriptions
Table A.6 Pin Out for SSB_PWR3: Cable Assy: (SSB_PWR3) 99700025
Pin Number at Signal Wire Colour

RFI/PSU Box Function Code
1 Chassis Gnd
2 +5 V Sense Red/White
3 +5 V Red
4 +5 V Red
5 +5 V Red
6 +5 V Red
7 +5 V Red
8 Spare
9 Gnd Sense Black/White
10 Gnd Black
11 Gnd Black
12 Gnd Black
13 Gnd Black
14 Gnd Black
Table A.7 Pin Out for SSB_PWR4: Cable Assy: (SSB_PWR4) 99700026
Pin Number at Signal Wire Colour

RFI/PSU Box Function Code
1 Screen
2 --15 V Violet
3 +15 V Yellow
4 +24 V_1 White/Orange
5 +15 V FAN Violet
6 +24 V_2 White/Brown
7 Spare Black
8 Gnd_15 V Black
9 Gnd_+15 V Black
10 Gnd_+24 V_1 Black
11 Gnd_15 V Black
FAN
12 Gnd_+24 V_2 Black
Table A.8 Pin Out for PL13: Cable Assy: (SSB_PWR1) 99700022
Pin Signal Pin Pin Number at

Number Function Number Flying Lead
at RFI at SSB (PL16)
Box
1 Chassis 1
Ground
2 +5 V Sense 2 4
3 +5 V 3
4 +5 V 4
5 +5 V 5

Cable Descriptions
6 +5 V 6
7 +5 V 7
8 Spare 8
9 Ground Sense 9 1
10 Ground 10
11 Ground 11
12 Ground 12
13 Ground 13
14 Ground 14
Table A.9 Pin Out for PL17 and PL18:

Cable Assy: (SOMB) 99700024
Pin Signal Pin Wire

Number Function Number Colour
at at Code
SSB ULMB
1 Chassis 1 Screen
Ground
2 --15 V 2 Violet/Black
3 +5V 3 Red/Black
4 +15 V 4 Yellow/
Black
5 +24 V 5 White/
Orange-
Black
6 Spare 6
7 --15 V 7 Black/Violet
Ground
8 +5 V 8 Black/Red
Ground
9 +15 V 9 Black/Yel-
Ground low
10 +24 V 10 Black/
Ground White-
Orange
Table A.10 Pin Out for SK1:

Cable Assy: (AODD_IF) 99700019
Pin Signal Pin Ribbon
Numberat Function Number Wire
SSB at AODD Number
1 CHASSIS GND 1 1
2 GROUND 2 3
3 DATA 1 3 5
4 DATA 3 4 7
5 DATA 4 5 9
6 DATA 6 6 11
7 GROUND 7 13
8 DATA 9 8 15
9 DATA 11 9 17
10 FUNCTION 0 10 19
11 CSEL 0 11 21

Cable Descriptions
12 GROUND 12 23
13 CLK -- 13 25
14 CHPRSEL 14 27
15 FON ~ 15 29
16 FREQMON + 16 31
17 GROUND 17 33
18 GROUND 18 35
19 GROUND 19 37
20 GROUND 20 2
21 DATA 0 21 4
22 DATA 2 22 6
23 GROUND 23 8
24 DATA 5 24 10
25 DATA 7 25 12
26 DATA 8 26 14
27 DATA 10 27 16
28 GROUND 28 18
29 FUNCTION 1 29 20
30 CSEL 1 30 22
31 CLK + 31 24
32 GROUND 32 26
33 GROUND 33 28
34 GROUND 34 30
35 FRQMON -- 35 32
36 MUTE 2 ~ 36 34
37 OK 37 36
Table A.11 Pin Out for SK4: Cable Assy: (IMAGE_SOMB) 99700014
Pin Number Signal Function Pin Number at Pin

at SSB Optics Motor Number
Board at
ULMB
1 Chassis Ground 1 1
2 Image Data Beam 2-- (SOMB) 2
3 Image Data Beam 2+ (SOMB) 6
4 Beam Balance -- (SOMB) 3
5 Beam Balance + (SOMB) 7
6 POW CTRL SOMB+ 8
7 POW CTRL SOMB-- 4
8 Not used
9 BIAS CRTL SOMB-- 5
10 BIAS CRTL SOMB+ 2
11 Not used
12 Not used
13 Not used
14 Not used
15 Not used
16 Not used
17 Not used
18 Image Data Beam 1-- (ULMB) 9
19 Image Data Beam 1+ (ULMB) 6
20 Image Data Beam 3-- (ULMB) 3

Cable Descriptions
21 Image Data Beam 3+ (ULMB) 7

22 POW CRTL ULMB+ 8
23 POW CRTL ULMB-- 4
24 BIAS CRTL ULMB-- 5
25 BIAS CRTL ULMB+ 9
26 Not used
Table A.12 Pin Out for SK5: Cable Assy: (INT_PSU) 99700027
Pin Number Signal Function Pin Number at Pin Number at

at SSB PSU Box Connector to
Interlocks
1 Chassis Ground 1
2 I_LOCK_RTN 2
3 I_LOCK 6
4 S_INT_DET_RET 3
5 S_INT_DET 7
6 +24 V_CRTL (AODD) 4
7 Ground 8
8 +36 V_CRTL 5
9 Ground 9
10 I_LOCK_STAT2 4
11 I_LOCK 6
12 INT_SUPP INDUCTOR
INDUCTOR INT_SUPP 2
13 I_LOCK_STAT1 3
14 Ground 7
15 Ground 8
Table A.13 Pin Out for SK7: Cable Assy: (CAN_SIG) 99700013
Pin Number at Signal Function Pin Number at SOMB Wire Colour Code
SSB
1 Chassis Ground 1 Braid to casing
2 CAN GND 2 Black/Red
3 5V 3 Red/Black
4 CAN-- 4 Black/Green
5 CAN+ 5 Green/Black
6 Reset-- 6 Black/Yellow
7 Reset+ 7 Yellow/Black
8 Index-- 8 Black/Orange
9 Index+ 9 Orange/Black
10 Spare 10 Black/White
11 ECLK-- 11 Black/Blue
12 ECLK+ 12 Blue/Black
13 0V 13 Black/Brown

Cable Descriptions
14 CAN_SIG_DET_RTN 14 Brown/Black
15 Spare 15 White/Black
Table A.14 Pin Out for SK8: Cable Assy: (MMI) 99700033
Pin Number at Signal Function Pin Number at MMI Wire Colour Code
SSB
1 Screen 1
2 Data_0 2 Blue/White
3 Data_1 3 Green/White
4 Data_2 4 Grey/White
5 Data_3 5 Brown/White
6 +5 V 6 Orange/White
7 XL 7 Blue/Red
8 XR 8 Red/Blue
9 CP+ 9 Green/Red
10 Ground 10 White/Blue
11 Ground 11 White/Green
12 Ground 12 White/Grey
13 Ground 13 White/Brown
14 LAMP_ON 14 Grey/Red
15 +5 V 15 White/Orange
16 YU 16 Brown/Red
17 YD 17 Red/Brown
18 CP-- 18 Red/Green
19 Load 19 Orange/Red
20 Ground 20 Red/Orange
21 FRAME_START 21 Blue/Black
22 DISPLAY_ON 22 Black/Blue
23 Buzzer 23 Red/Grey
24 +5 V 24 Orange/Black
25 VADJ 25 Green/Black
26 VEE 26 Black/Green
Table A.15 Pin Out for PL1:

Cable Assy: Cable Assy: (PFAN1) 99700092
Pin Signal Function Pin Num- Fans

Number ber at
at Fans
FHMB1
1 Not Used
2 Not Used
3 +24 V 2 Pressure 1
4 SOL0 3
5 +24 V 2 Exhaust
6 SOL1 3
7 +24 V 2 Pressure 2
8 SOL2 3

Cable Descriptions

Cable Assy: (V6/V5 FANS)
Pin Signal Function Solenoid

Number ID
at
FHMB1
1 Chassis ground
5 Exhaust Fan solenoid +24 V V6
6 Exhaust Fan solenoid return V6

Cable Assy: (flying lead to Vac plate)
Pin Signal Function Sensor

Number ID
at
FHMB1
1 Vac Pressure sensor S21
+15 V
2 Vacuum conformance S21
signal N/C
3 Pressure sensor S21
reference
4 Pressure sensor input S21
signal

Cable Assy: (FPD) 99700053
Pin Num- Signal Function

ber at
FHMB1
1 Fast Photo Detector Anode
2 Fast Photo Detector Cathode

Cable Assy: (DC Power PWR1) 99700012
Pin Signal
Number Function
at FHMB1
1 Chassis Grnd
2 +24 V
3 +36 V
4 +36 V
5 Spare
6 Ground
7 Ground
8 Ground

Cable Descriptions
Table A.20 Pin Out for PL9:Cable Assy: (Punch) 99700069
Pin Signal Function Sensor

Number ID
at
FHMB1
1 Not Used
2 Punch up supply S16 (1)
3 Punch up digital S16 (2)
ground
4 Punch up signal S16 (3)
5 Not used S58
6 Punch down sup- S58 (1)
ply
7 Punch down digital S58 (2)
ground
8 Punch down signal S58 (3)
Table A.21 Pin Out for PL10: Cable Assy: (LIDLK2) 99700083
Pin Number at Signal Function Solenoid ID Wire Colour Code

FHMB1
1 Reserved
2 Lid Lock 2 Supply +24 V V10 Blue/White
3 Lid Lock 2 Return V10 White/Blue
Table A.22 Pin Out for PL18: Cable Assy: (CASSA) 99700066
Pin Number at Signal Function

FHMB1
1 Anode
2 Cathode
3 Ground
4 S8
5 Ground
6 S9
7 +5 V DC supply
8 S10
9 Ground
10 S11
11 +5 V DC supply
12 Pulse S8
13 Pulse S9
14 Pulse S10
15 Pulse S11
16 +5 V DC supply
17 S16
18 Digital Ground
19 S0

Cable Descriptions
20 +5 V DC supply
21 S1
22 Ground
23 S2
24 +5 V DC supply
25 S3
26 BRD_ID0
Table A.23 Pin Out for PL19: Cable Assy: (CASSB) 99700067

FHMB1
1 Anode
2 Cathode
3 Ground
4 S8
5 Ground
6 S9
7 +5 V DC supply
8 S10
9 Ground
10 S11
11 +5 V DC supply
12 Pulse S12
13 Pulse S13
14 Pulse S14
15 Pulse S15
16 +5 V DC supply
17 S16
18 Ground
19 S0 (Spare)
20 +5 V DC supply
21 S1
22 Ground
23 S2
24 +5 V DC supply
25 S3
26 Brd_ID1

Cable Assy: (DC_Pun) 99700084
Pin Number at FHMB1 Signal Function Motor ID Wire Colour

Code
1 Reserved
2 Punch motor A (DC) M6 Red
3 Punch motor B (DC) M6 Black

Cable Descriptions

Cable Assy: (S69) 99700090
Pin Number at Signal Function Sensor ID Wire Colour Code

FHMB1
1 Pulse Gnd S69 (1) Blue/White
2 Supply S69 (2) White/Blue
3 Ground S69 (3) Green/White
4 Signal S69 (4) White/Green

Cable Assy: (S60) 99700068
Pin Signal Function Sensor Wire

Number ID Colour
at Code
FHMB1
1
2 Lid (Cassette Door) S60 (1)
closed supply
3 Lid closed digital S60 (2) Blue/White
ground
4 Lid closed signal S60 (3) White/Blue

Cable Assy: (S_DC2) 99700085
Pin Signal Function Motor Wire

Number ID Colour
at Code
FHMB1
1 Reserved (1)
2 Input Buffer Guide motor A M3 (2) Red
3 Input Buffer Guide motor B M3 (3) Black

Cable Assy: (S30) 99700021
Pin Number at Signal Function Sensor

FHMB1 ID
1
2
3 Chad Tray S30
4 Chad Tray S30

Cable Descriptions

Cable Assy: (MOT1) 99700047
Pin Signal Motor

Number Function ID
at
FHMB1
1 Cassette A M1 (6)
output A
2 Cassette A M1 (5)
output C
3 Cassette A M1 (4)
+24 V
4 Cassette A M1 (3)
+24 V
5 Cassette A M1 (2)
output B
6 Cassette A M1 (1)
output D

Pin Signal Motor ID

Number
u be Function
u ct o
at
FHMB1
1 Cassette B M2 (6)
output A
2 Cassette B M2 (5)
output C
3 Cassette B M2 (4)
+24 V
4 Cassette B M2 (3)
+24 V
5 Cassette B M2 (2)
output B
6 Cassette B M2 (1)
output D

Pin Number at Signal Function Motor ID

FHMB1
1 Drum motor output A M4 (6)
2 Drum motor output C M4 (5)
3 Drum motor +24 V M4 (4)
4 Drum motor +24 V M4 (3)
5 Drum motor output B M4 (2)
6 Drum motor output D M4 (1)

Cable Descriptions
Table A.32 Pin Out for PL31

Cable Assy: (PWR1) 99700012
Pin Signal Wire Colour

Number Function Code
at
FHMB1
1 Chassis Screen
Ground
2 +24 V White/Orang
3 +36 V White/Brown
4 +36 V White/Brown
5 Spare
6 Ground Black
7 Ground Black
8 Ground Black
Table A.33 Pin Out for SK1

Cable Assy: CAN_SIG) 99700013
Pin Number at Signal Function Wire Colour Code

FHMB1
1 Chassis Ground Braid to casing
2 CAN 0 V Black/Red
3 CAN +5 V Red/Black
4 CAN-- Black/Green
5 CAN+ Green/Black
6 RESET-- Black/Yellow
7 RESET+ Yellow/Black
8 INDEX-- Black/Orange
9 INDEX+ Orange/Black
10 SPARE-- Black/White
11 E_CLK-- Black/Blue
12 E_CLK+ Blue/Black
13 0V Black/Brown
14 CAN_SIG_DET_RTN Brown/Black
15 SPARE+ White/Black

Cable Assy: (Umbilical cable) 99700050
Pin Number Signal Function Pin Number Signal Function

at FHMB1 at FHMB1
1 GND (36 V) 24 DATA_A--
2 36 V 25 GND (36 V)
3 GND (36 V) 26 GND (36 V)
4 36 V 27 CAN+
5 GND (36 V) 28 CAN--
6 36 V 29 GND (36 V)

Cable Descriptions
7 GND (36 V) 30 GND (36 V)

8 36 V 31 CAN_5 V
9 GND (36 V) 32 CAN_0 V
10 GND (36 V) 33 GND (36 V)
11 RFU+ 34 GND (36 V)
12 RFU-- 35 24 V
13 GND (36 V) 36 24 V_RTN
14 GND (36 V) 37 GND (36 V)
15 RESET+ 38 36 V
16 RESET-- 39 GND (36 V)
17 GND (36 V) 40 36 V
18 GND (36 V) 41 GND (36 V)
19 INDEX+ 42 36 V
20 INDEX-- 43 GND (36 V)
21 GND (36 V) 44 36 V
22 GND (36 V) 45 GND (36 V)
23 DATA_A+
Table A.35 Pin Out for PL8, PL10, Pl15:

Cable Assy: Cable Assy: (VAC) 99700087
Pin Number at Signal Function Vac

FHMB2
1
2 Vacuum 1 Supply V1, V2
and V3
3 Vacuum 1 Return V1, V2
and V3

Cable Assy: (SOL3) 99700028
Pin Number Signal Function PSU

at FHMB2 Box
1 Chassis ground
2
3 Pump on/off V4 (2)
(+24 V)
4 Pump on/off (re- V4 (7)
turn)
5 Flashing lamp V11 (3)
Alert (+24 V)
6 Flashing lamp V11 (8)
Alert (return)
7 Spare
8 Spare

Cable Descriptions
Table A.37 Pin Out for PL20/PL9:

Cable Assy: (GUILL) 99700086
Pin Num- Signal Pin Num-

ber at Function ber at
Guillotine FHMB2
5 Guill Mot 1 PL20 (2)
4 Guill Mot 2 PL20 (3)
3 Guill Right Ground PL9 (3/7)
2 Guill Left Signal PL9 (8)
1 Guill Right Signal PL9 (4)
Table A.38 Pin Out for Horizontal Tray connector to sensors: Cable Assy (TRAY2) 99700094
Pin Signal Function Sensor and Pin

Number number
at Dock
1 Spare Sig
2 S49 Sig S49 (4)
3 S68 Sig S68 (4)
4 S56 Sig S56 (3)
5 S56 +5 V/S57 +5 V S56 (1), S57 (1)
6 Spare
7 S68 +5 V/S51 +5 V S68 (2)
8 S68 PUL GND S68 (1)
9 DC Motor + M18 DC+
10 Stepper Out A M10 (6)
11 Stepper +24 V M10 (4)
12 Stepper Out C M10 (5)
13 S49 Gnd S49 (3)
14 S51 Sig S51 (4)
15 S51 Gnd/S68 Gnd S51 (3), S68 (3)
16 S57 Sig S57 (3)
17 S56 Gnd/S57 Gnd S56 (2), S57 (2)
18 S49 +5V S49 (2)
19 S49 Pul Gnd S49 (1)
20 S51 Pul Gnd S51 (1)
21 DC Motor -- M18 (2)
22 Stepper Out B M10 (2)
23 Stepper Out +24 V M10 (3)
24 Stepper Out D M10 (1)
Table A.39 Pin Out for PL18: Cable Assy: (VERT) 99700070
Pin Signal Function

Number
at
FHMB2
1 Anode

Cable Descriptions
2 Cathode
3 Ground
4 S8
5 Ground
6 S9
7 +5 V DC supply
8 S10
9 Ground
10 S11
11 +5 V DC supply
12 Pulse S8
13 Pulse S9
14 Pulse S10
15 Pulse S11
16 +5 V DC supply
17 S16
18 Ground
19 S0 Spare
20 +5 V DC supply
21 S1
22 Ground
23 S2
24 +5 V DC supply
25 S3
26 Brd ID0
Table A.40 Pin Out for PL16, PL19, PL27 to tray: Cable Assy: (TRAY1) 99700093
Pin Num- Signal Function Pin Number at cable

ber at connector end
FHMB2
1 Spare Sig 19 (4)
2 S49 Sig 19 (3)
3 S68 Sig 19 (10)
4 S56 Sig 19 (19)
5 S56 +5 V/S57 +5 V 19 (20,24)
6 Spare 19 (12)
7 S68 +5 V/S51 +5 V 19 (11,16)
8 S68 PUL GND 19 (15)
9 DC Motor + 16 (2)
10 Stepper Out A 27 (1)
11 Stepper +24 V 27 (3)
12 Stepper Out C 27 (2)
13 S49 Gnd 19 (3)
14 S51 Sig 19 (8)
15 S51 Gnd/S68 Gnd 19 (5,9)

Cable Descriptions
16 S57 Sig 19 (21)

17 S56 Gnd/S57 Gnd 19 (18,22)
18 S49 +5V 19 (7)
19 S49 Pul Gnd 19 (13)
20 S51 Pul Gnd 19 (14)
21 DC Motor -- 16(3)
22 Stepper Out B 27 (5)
23 Stepper Out +24 V 27 (4)
24 Stepper Out D 27 (6)
Table A.41 Pin Out for PL21: Cable Assy (S11) 97000059
Pin Number at Signal Function Sensor ID

FHMB2
1 Pulse GND S11 (1)
2 Supply S11 (2)
3 Digital Ground S11 (3)
4 Signal S11 (4)

Cable Assy: (PWR2) 99700081
Pin Number at Signal Function PSU Box Pin Con-

FHMB2 nector
1 Chassis Ground 1
2 +24 V 2
3 +36 3
4 +36 4
5 Spare 5
6 Ground 6
7 Ground 7
8 Ground 8
Table A.43 Pin Out for PL1: Cable Assy: (Traverse Motor)
Pin Number Signal Function
1 TRAV MTR --
2 TRAV MTR +
3 CHASSIS GND
4 NC
Table A.44 Pin Out for PL4: Cable Assy: (Spinner Encoder)
1 ENCODER 0V
2 INDEX--

Cable Descriptions
3 INDEX+
4 CHASSIS GND
5 Spare
6 ENCODER +5V
7 DATA A--
8 DATA A+
Table A.45 Pin Out for PL5 Cable Assy: (Spinner Motor)
1 CHASSIS GND
2 HALL 2
3 HALL 3
4 HALL 1
5 PHASE C
6 SPIN TYPE A
7 PHASE A
8 PHASE B
9 NC
10 ENCODER +5V
11 ENCODER 0V
12 SPIN TYPE B
Table A.46 Pin Out for PL2 Cable Assy: (Readhead)

1 SETUP ERROR
2 HOME SENSOR
3 ENCODER +5V
4 CHASSIS GND
5 ENCODER 0V
6 DATA A+
7 DATA A--
8 ENCODER MISSING
9 DATA B+
10 DATA B--
11 ENCODER 0V
12 INDEX+
13 INDEX--
14 ENCODER +5V
15 NOT USED
16 NOT USED

Cable Descriptions
Table A.47 Pin Out for PL6, PL7:

Cable Assy: (BFAN) 99700089
Pin Signal Function Wire Colour Code
Number
1 +24V Black
2 ROTATION SENSOR Black
3 0V (SWITCHED) Black

Cable Assy: (CAB_UMBIL from STB)
1,3,5,7,9,10,13,14,17,18,21,22 36V RTN
25,26,29,30,33,34,37,39,41,43,45 36V RTN
2,4,6,8,38,40,42,44 +36V
11 UTSTSIG+
12 UTSTSIG--
15 URESET~+
16 URESET~--
19 USPIN_INDEX+
20 USPIN_INDEX--
23 DATA A+
24 DATA A--
27 UCANH
28 UCANL
31 UFCAN5V
32 UFCANGND
35 24V
36 24V RTN
Table A.49 Pin Out for PL1: Cable Assy: (SOMB1 to POD)
Pin Number at SOMB Signal Function

1 Shield
2 PosDet1
3 Ground
4 PosDet2
5 Ground
6 PosDet3
7 Ground
8 PosDet4
9 Ground
10 +15 V
11 Ground
12 --15 V
13 Ground
14 No connection

Cable Descriptions
Table A.50 Pin Out for PL2: Cable Assy: (SOMB2 to Slow Power Detector)

SOMB
1 Shield
2 Power Detector
3 Ground
4 +15 V
5 Ground
6 --15 V
7 No connection
8 No connection
9 No connection
10 No connection
Table A.51 Pin Out for PL3: Cable Assy: (SOMB3 to ND Wedge Home Sensors)

1 +5 V
2 Ground
3 ND Filter Home Sen-
sor
4 +5 V
5 Ground
6 PDP Sensor
7 +5 V
8 Ground
9 Slow Power Detector
10 No connection
Table A.52 Pin Out for PL4: Cable Assy: (Focus/Aperture)

1 +5 V
2 Ground
3 Focus Home Sensor
4 +5 V
5 Ground
6 Focus M
7 +5 V
8 Ground
9 Aperture Home
10 +5 V
11 Ground
12 Aperture Limit

Cable Descriptions
Table A.53 Pin Out for PL5: Cable Assy: (SOMB5 ND Filter/Focus Motor)

SOMB
1 Out
2 Out
3 +24 V
4 +24 V
5 Out
6 Out
7 Out
8 Out
9 +24 V
10 +24 V
11 Out
12 Out
Table A.54 Pin Out for PL9: Cable Assy: (LD2)

1 Ground
2 Laser On Negative
3 Laser On Positive
4 Ground
5 Drive Current Level
6 Ground
7 Negative Supply
8 Ground
9 Ground
10 Ground
11 Ground
12 Bias Current Level
13 Ground
14 Photodiode
15 Ground

Cable Descriptions
Table A.55 Pin Out for PL6: Cable Assy: (SOMB6 to Slow Speed Motor)

1 Out
2 Out
3 +24 V
4 +24 V
5 Out
6 Out
7 Out
8 Out
9 +24 V
10 +24 V
11 Out
12 Out
13 Chassis Ground
Table A.56 Pin Out for PL11: Cable Assy: (SOMB_PWR) 99700015
Pin Num- Signal Pin Wire Colour

ber at Number Code
SOMB at SSB
1 Chassis Ground 1 Screen
2 --15 V 2 Blue/Black
3 +5 V 3 Red/Black
4 +15 V 4 Green/Black
5 +24 V 5 White/Black
6 Spare 6
7 --15 V Ground 7 Black/Blue
8 +5 V Ground 8 Black/Red
9 +15 V Ground 9 Black/Green
10 +24 V Ground 10 Black/White

Cable Assy: (S_ULMB) 99700016

1 Chassis Ground
2 Digital Ground
3 ULMB STROBE+
4 ULMBSEL+
5 Digital Ground
6 ADD 0
7 ADD 2
8 ADD 4
9 DATA 0
10 DATA 2

Cable Descriptions
11 Digital Ground
12 DATA 5
13 DATA 7
14 SHADDING
15 OK SIGNAL
16 STROBE+
17 Digital Ground
18 ADC START--
19 Digital Ground
20 Digital Ground
21 ULMB STROBE--
22 Digital Ground
23 ULMBSEL--
24 READ
25 ADD 1
26 ADD 3
27 Digital Ground
28 DATA 1
29 DATA 3
30 UDATA (4)
31 UDATA (6)
32 Digital Ground
33 Digital Ground
34 Digital Ground
35 SHSTRB--
36 USTCONV+
37 Digital Ground
38 Chassis Ground
39 Chassis Ground
Pin Number Signal Pin Number Pin Wire Colour Code

at SSB at SOMB Number
at ULMB
1 Chassis Ground 1 1 Braid
2 Image Data Beam 1-- (SOMB) 2 Blue/White
3 Image Data Beam 1+ (SOMB) 6 White/Blue
4 Beam Balance -- (SOMB) 3 Green/White
5 Beam Balance + (SOMB) 7 White/Green
6 POW CTRL SOMB+ 8 Orange/White
7 POW CTRL SOMB-- 4 White/Orange
8 Not used
9 BIAS CRTL SOMB-- 5 Brown/White
10 BIAS CRTL SOMB+ 9 White/Brown
11 Not used

Cable Descriptions
12 Not used
13 Not used
14 Not used
15 Not used
16 Not used
17 Not used
18 Image Data Beam 2-- (ULMB) 2 Blue/White
19 Image Data Beam 2+ (ULMB) 6 White/Blue
20 Image Data Beam 3-- (ULMB) 3 Green/White
21 Image Data Beam 3+ (ULMB) 7 White/Green
22 POW CRTL ULMB+ 8 Orange/White
23 POW CRTL ULMB-- 4 White/Orange
24 BIAS CRTL ULMB-- 5 Brown/White
25 BIAS CRTL ULMB+ 9 White/Brown
26 Not used
Table A.59 Pin Out for SK4: Cable Assy: (MMI) 99700033
Pin Number at MMI Board Signal Name

1 Screen
2 Data 0
3 Data 1
4 Data 2
5 Data 3
6 +5 V
7 XL
8 XR
9 CP+
10 Ground
11 Ground
12 Ground
13 Ground
14 Lamp On
15 +5 V
16 YU
17 YD
18 CP+
19 Load
20 Ground
21 Frame start
22 Display On
23 Buzzer
24 +5V
25 VADJ
26 VEE

Cable Descriptions
Table A.60 Pin Out for PL4: Cable Assy: (SOMB_PWR) 99700015
Pin Signal Pin

Number Number
at at System
ULMB Board
1 Chassis Ground 1
2 --15 V 2
3 +5 V 3
4 +15 V 4
5 +24 V 5
6 Spare 6
7 --15 V Ground 7
8 +5 V Ground 8
9 +15 V Ground 9
10 +24 V Ground 10

Cable Assy: (ULMB) 99700016

at SOMB
1 Chassis Ground
2 Digital Ground
3 ULMB STROBE+
4 ULMBSEL+
5 Digital Ground
6 ADD 0
7 ADD 2
8 ADD 4
9 DATA 0
10 DATA 2
11 Digital Ground
12 DATA 5
13 DATA 7
14 SHADDING
15 OK SIGNAL
16 STROBE+
17 Digital Ground
18 ADC START--
19 Digital Ground
20 Digital Ground
21 ULMB STROBE--
22 Digital Ground
23 ULMBSEL--
24 READ
25 ADD 1
26 ADD 3

Cable Descriptions
27 Digital Ground
28 DATA 1
29 DATA 3
30 DATA 4
31 DATA 6
32 Digital Ground
33 Digital Ground
34 Digital Ground
35 STROBE--
36 ADC START+
37 Digital Ground
Pin Number Signal Pin Number at Pin

at SSB SOMB Number
at
ULMB
1 Chassis Ground 1 1
2 Image Data Beam 2-- 2
(SOMB)
3 Image Data Beam 2+ 6
(SOMB)
4 Beam Balance -- (SOMB) 3
5 Beam Balance + (SOMB) 7
6 POW CTRL SOMB+ 8
7 POW CTRL SOMB-- 4
8 Not used
9 BIAS CRTL SOMB-- 5
18 BIAS CRTL SOMB+ 9
11 Not used
12 Not used
13 Not used
14 Not used
15 Not used
16 Not used
17 Not used
(ULMB)
(ULMB)
(ULMB)
(ULMB)
22 POW CRTL ULMB+ 8
23 POW CRTL ULMB-- 4
24 BIAS CRTL ULMB-- 5
25 BIAS CRTL ULMB+ 9
26 Not used

Index
A C
Actuators, diagnostic commands, 10-54 Cabling, distribution, 3-68
Antistatic kit, 2-16 AC, 3-68
DC, 3-69
earthing (grounding), 2-17
enclosures, 2-17 Cage Creep, 8-15
field handling station, 2-16 CAN
AOD network control, 9-11
description, 3-16 servicing nodes, 9-13
diagnostic commands, 10-43 signal connector pins, A-6, A-13
functional description, 9-64 STB UMB connector pins, A-19
principle of operation, 9-68
Cassette
replacement, 5-11 CASSA connector pins, A-9
AODD module CASSB connector pins, A-10
accessing, 8-7 description, 3-17
connections, 3-26 ID label, attaching, 4-23
connector power pins, A-2 input rollers cleaning, 8-12
control, 9-7 motor connector pins, A-12
description, 3-11 motor location, 3-62
functional description, 9-43 replacements, 4-23
IF connector pins, A-4
Cassette door
location, 3-9 Lid connector pins, A-11
replacement, 7-13 lid lock connector pins, A-9
SSB interface, 9-23 lid lock solenoid, 3-64
Aperture opening, 8-5
functional description, 9-66
Cassette ID Sensor Board, replacement, 7-18
motor, replacement, 5-7
Cassette ID Sensor board, board description, 3-49
Assemblies
accessing, 8-4 CAUTIONS
board/module descriptions, 3-26 disposable wrist strap, 2-16
main electrical, 3-2 exposed components, 2-16
main mechanical, 3-1 Health and Safety at Work, 2-1
PCB replacements, 7-16 unearthed surface, 2-16
Chad tray, S30 connector pins, A-11
B Climatising Buffer, 9-50

Configuration Data , service utilities, 9-9
Baffle
Configuration Data Files, using the utilities, 10-65
operation, 9-74
replacement, 6-4 Cutter, see Guillotine, 3-24
Baffle fans, 3-65
replacement, 6-6
Ball Cage
D
aligning to carriage, 6-14 Databases, diagnostic commands, 10-63
replacement, 6-11
Debug, using, 10-28
Beam Combiner, functional description, 9-65
Devices, Safety, 2-7
Booting up, sequence of loading, 10-3
Engineer’s Reference Guide 6700898003 Index-1

Index
Diagnostics EVT, diagnostic commands, 10-42

Boot-- up tests, description, 10-5
Commands
debug, 10-28
log, 10-30
F
log utils, 10-31 Fans
scripts, 10-29 baffle connector pins, A-19
Service Menu, 10-41 description, 3-63
Test Menu, 10-37 location, 3-64
debug, 10-28 pressure connector pins, A-7
Error Codes, 10-11 Pressure fans cleaning, 8-12
Global Commands, 10-25 PSU box, replacement, 7-8
Soak Test Operation, 10-27 replacements, 7-15
introducing, 10-1 RFI cooling, 3-9
Main, introducing, 10-23 V5/V6 connector pins, A-8
Main Diagnostics, 9-10
Fast Photo Power Detector, See FPD, 3-52
mmi test strips, 10-49
running scripts, 10-29 FHMB(1)
Service/Media test description, 10-6 board description, 3-33
connectors, 3-34
Disk Drives
removal, 4-6
connector pins, A-1
replacement, 7-16
connector power pins, A-2
description, 3-10 FHMB(2)
diagnostic commands, 10-54 board description, 3-38
location, 3-9 connectors, 3-38
replacement, 7-12 replacement, 7-16
storing config data, 10-68 Film, see Media, 3-17
DLA Curtain, 2-14 Film Handling
laser radiation hazard, 2-14 control, 9-7
opacity to blue light, 2-14 devices, 3-52
Warnings, 2-14 FHMB(1) layout, 3-33
DLA Room, 2-13 modules, 3-17
laser warning notice, 2-13 operation, 9-50
red warning light, 2-13 output control, 9-8
rollers, 3-19
Dongles, description, 3-31
sequence of operations, 9-52
Drive Rail Wiper
Film Handling Motor Board, see FHMB, 3-33
cleaning, 8-14
replacement, 6-7 Flashing Lamp, external flashing alert, 3-64
Drum Focus, motor, replacement, 5-6
cleaning, 8-13 Focussing Lens, cleaning, 8-12
description, 3-21
input motor, 3-62 FPD
removing end cap, 8-7 connector pins, A-8
description, 3-52
Dust contamination, 2-8 operation, 9-29
replacement, 4-10
E Front cover, removing, 8-6

Fume Flap assembly
Earthing, system earth, 3-8 cleaning the flap, 8-14
Environment description, 3-19
error codes, 10-14 replacement, 4-32
SSB monitoring, 9-17 Functional Description
Equipment, Unattended, 2-8 image data reception, 9-5
Overview, RIP Communications, 9-3
Error Codes, listing, 10-11 overview od system, 9-1
Error Logging, post-- failure, 10-11
Index-2 Luxel F-9000 Recorder

Index
Fuses overriding, 8-2

FHMB(1), 3-35 Strategy, 2-10
FHMB(2), 3-40
SSB, 3-30
J
G Job Manager, diagnostic commands, 10-59
General Precautions, 2-14

Guillotine L
description, 3-24
motor location, 3-62 Labels, 2-2
replacement with punch, 4-29 Mains Rating, 2-2
replacement without punch, 4-30 Warning, 2-2
signal connector pins, A-15 Laser, 2-13
alignment, 2-14
attenuation, 2-14
H beam, 2-13, 2-14
configurations, 9-72
Hazards, 2-8 diagnostic commands, 10-38
Chemical, 2-8 diode, replacement, 5-9
Laser Radiation, 2-8 diode header board, 3-16
Pneumatics, 2-8 driver control, 9-40
Spinner, 2-8 modules, functional description, 9-64
Health and Safety at Work, 2-1 PCBs, 9-63
Cautions, 2-1 protective cover, 2-13, 2-14
Clothing and Jewellery, 2-2 radiation, 2-8, 2-13
Equipment and Tools, 2-2 Safety, 2-13
site safety, 2-2 safety goggles, 2-14
Warnings, 2-1 shutter, 2-14
using test strips, 5-13
Horizontal Output tray
description, 3-18 Lasers, diagnostic utilities, 10-46
motor location, 3-62 Linear scale, functional description, 9-78
removing, 8-6
Logging Fatal Errors, 10-11
tray connector pins, A-16
Luxel F9000
antistatic precautions, 2-16
I configuration data files, 10-65
Functional Description, System Overview, 9-2
Image Manager, diagnostic commands, 10-61 introducing
configuration, 1-2
Indicators, safety signs and labels, 2-2 features, 1-1
Input assembly processor, 1-4
description, 3-18 recorder, 1-3
sub-- assemblies, removal, 4-4
Input Buffer Guide
motor location, 3-62 M
operation, 9-50
Macros for optics testing, 5-13
Input Cassettes, see Cassettes, 3-17
Main Diagnostics
Input Data Path, error codes, 10-15 introducing, 10-23
Interlocks useful service commands, 10-31
description, 3-66 Main Entry screen, description, 5-14
fuse, 7-14
Maintenance
locations, 2-10
checking vibration, 8-14
opening pod doors, 8-5
operation, 9-10, 9-46 Procedures, 8-10
schedules, 8-9
Optics lid, 8-7
override, 2-10 spinner mirror, 8-10

Index
useful tools, 8-1 SOMB2 connector pins, A-20

Man Machine Interface, see MMI, 3-12 NVRAM
Mandrel diagnostic commands menu, 10-35
latch assembly, replacement, 4-26 saving/restoring, 10-69
replacements, 4-24 service utilities, 9-9
Media
diagnostic commands, 10-62
expose control, 9-5
O
expose system, functional description, 9-61 Optics
film handling devices, 3-52 diagnostic commands, 10-40
input control, 9-5 diagnostic utilities, 10-43
Media Tests on MMI, 10-71 error codes, 10-12
Periscope Screw Adjustment chart, 5-39 Extra Options screen, 5-17
processor, error codes, 10-18 Final Values screen, 5-15
punch and cutting, 9-8 lens, functional description, 9-65
registration check, 5-36 Machine setup screen, 5-16
self-- tests, description, 10-6 macros, 5-13
transport, error codes, 10-16 Main Entry screen, 5-14
types, 9-50 mmi menu, 10-49
Media Scan System, Functional Description multi-- laser control, 9-6
Overview, 9-73 selecting macros, 5-17
Spinner Control, 9-75 setting up, 5-13
Traverse Initialisation, 9-83 setups, 5-21
absolute phase values, 5-25
Mirror (M2), operation, 9-68 AOD amplitude, 5-32
Mixer fan, 3-64 coincidence values, 5-24
deflection amplitude all values, 5-28
MMI
deflection amplitude values, 5-26
board description, 3-48
focus values, 5-22
connector pins, A-7, A-24
static coincidence tests, 5-30
connectors, 3-48
wedge values, 5-21
description, 3-12
Error Codes, description, 10-11 Optics module
replacement, 7-3 description, 3-14
running diagnostics, 10-71 functional description, 9-62
test image output, 10-9 replacements, 5-1
touchpanel cleaning, 8-12 sub-- assemblies, 3-15
MMI Self Tests, description, 10-5 Optics Motor Board, see SOMB, 3-43
Motors Output Data Path, error codes, 10-15
connections, 3-62
DC, tests, 10-8
DC description, 3-60
description, 3-60
P
diagnostic commands, 10-47 Periscope, functional description, 9-67
diagnostic commands (step), 10-49
POD
I/P buffer connector pins, A-11
location, 3-62
description, 3-17
optical, replacements, 5-4
replacments, 4-15
replacement, 5-10, 7-17
stepper, tests, 10-7
SOMB connector pins, A-19
stepper description, 3-61
Pod door, opening, 8-5
Position Detector, 3-49
N Precautions
Neutral Density Wedge antistatic, 2-16
functional description, 9-65 exposed components, 2-17
motor, replacement, 5-5 Pressure fans, 3-65

Index
Processor M03, 4-18

decoupling from recorder, 8-2 M04, 4-17
diagnostic commands, 10-40, 10-62 M06, 4-21
error codes, 10-18 M08, 4-21
PSU, interlock connector pins, A-6 M09, 4-22
M10, 4-21
PSU box M18, 4-19
circuit, 3-6 S11/S12, 4-9
cooling fan, 3-66 S16/S58, 4-10
DC power 1 connector pins, A-8 S17/S18, 4-8
sub-- assemblies, 3-3 S19/S20, 4-11
mains input, 3-6 S30, 4-12
PWR2 connector pins, A-17 S40, 4-10
replacements, 7-5 S47/S48, 4-7
PSU module S49, 4-13
DC outputs, 3-7 S51, 4-13
Inputs/Outputs, 3-6 S56/S57, 4-13
location, 3-4 S60, 4-8
PSU sequencing, 9-17 S66/S53/S54/S22, 4-13
PWR1 connector pins, A-13 S68, 4-13
replacement, 7-6 S69, 4-11
S9/S10, 4-8
Punch spinner, 6-8
DC connector pins, A-10 SSB, 7-13
description, 3-21 STB, 6-6
motor location, 3-62 traverse carriage, 6-1
replacement, 4-28 traverse motor, 6-6
S69 connector pins, A-11 umbilical cable, 6-8
specifications, 3-22
RFI box
accessing sub-- assemblies, 7-12
R cooling fan, 3-65
sub-- assemblies, 3-9
Readhead Rollers, description, 3-19
cleaning, 8-11
connector pins, A-18
replacement, 6-12
S
Registration Safety
film check procedure, 5-36 Chemical, 2-9
vertical adjustment procedure, 5-41 Electrical, 2-8
Laser, 2-13
Remote Login, diagnostic commands, 10-42 Mechanical, 2-8
Replacements override key, 2-13
AODD module, 7-13 signs, 2-2
baffle, 6-4 Spinner, 2-9
baffle fans, 6-6 warnings, 2-13
ball cage assembly, 6-11 Safety Warnings, designated laser area, 2-13
board assemblies, 7-16
disk drive, 7-12 Scripts, using, 10-29
drive rail wiper, 6-7 SCSI drives, see Disk Drives, 3-10
electrical assemblies, 7-1
film handling, 4-1 SDM Board, Control Functions, MMI Interface, 9-17
fume flap, 4-32 Sensor Distribution board, board description, 3-51
MMI, 7-3 Sensors
Optics module, 5-1 connections, 3-55
PSU box assemblies, 7-5 description, 3-52
punch and guillotine, 4-27 diagnostic commands, 10-51
readhead, 6-12 location, 3-55
FPPDET, 4-10 micro-- switch, 3-55
M01/M02, 4-15

Index
optical, replacements, 5-2 connector power pins, A-2

opto-- reflective, 3-53 connector power pins 1, A-3
opto-- slotted, 3-54 connector power pins 3, A-3
clip-- on, removal, 4-3 connectors, 3-28
opto-- reflective, removal, 4-1 description, 3-10
opto-- slotted, removal, 4-2 functional description, 9-14
replacing, 4-7 location, 3-9
S16/S58 connector pins, A-9 replacement, 7-13
Servicing, 2-9 signal cables, 3-11
authorised personnel, 2-9 STB
Signs, laser warning, 2-14 board description, 3-41
CAN-- UMB connector pins, A-19
Slow Power Detector connectors, 3-41
functional description, 9-67 functional description, 9-31
motor, replacement, 5-8 replacement, 6-6, 7-17
replacement, 5-3
SOMB2 connector pins, A-20 System board, see SSB, 3-10
Software System Registry

initialising, 9-11 displaying, 10-70
organisation, 9-9 updating, 10-70
traverse initialisation, 9-83 using the utilities, 10-67
Solenoids System Tests

description, 3-20, 3-63 error codes, 10-18
location, 3-64 from MMI, 10-71
SOL3 connector pins, A-14
SOMB
T
connectors, 3-44 Terminal Diagnostics User Interface, VT100 Emulation
functional description, 9-37 Operation, Entering Commands, 10-24
image connector pins, A-5, A-23
POD connector pins, A-19 Test Patterns, diagnostic commands, 10-57
PWR connector pins, A-22, A-25 Test Strips, generation, 5-13
replacement, 7-17
Tools, 2-2
ssb connector pins, A-4
approved, 2-2
Spinner
Traverse
braking, 9-35
carriage
circularizing correction, principle of operation, 9-68
aligning to ball cage, 6-14
cleaning mirror, 8-10
removal, 6-3
control, 9-34
sub-- assemblies, 3-24
description of assembly, 9-70
cleaning scale and readhead, 8-11
diagnostic commands, 10-39, 10-54
control, 9-6
disposal, 2-9
diagnostic commands, 10-39, 10-53
encoder connector pins, A-17
error codes, 10-13
error codes, 10-13
mirror contamination auto-- check, 10-9
motor, replacement, 6-6
motor connector pins, A-18
motor connector pins, A-17
replacement, 6-8
servo control, 9-80
FHMB umbilical connector pins, A-13
cable distributions, 9-45
Traverse board, see STB, 3-41
MMI
system control, 9-5
U
SSB ULMB
AODD control, 9-7 board description, 3-46
AODD interface, 9-23 connector pins, A-22, A-25
board description, 3-28 connectors, 3-47

Index
functional description, 9-41 solenoid locations, 3-64

replacement, 7-17 sub-- assemblies, 3-67
Umbilical cable, replacement, 6-8 Verbose switching, 10-26
Upgrade Laser Modulation Board, see ULMB, 3-46 Vertical Distribution Board, replacement, 7-18
Vertical Output
description, 3-18
V dist brd connector pins, A-15
motor location, 3-62
Vacuum pump removal, 8-3
connector pins, A-8
description, 3-20 Vertical Registration Adjustment, 5-41
location of fuse, 3-5
location of relay, 3-4
location of transformer, 3-4 W
relay, 3-8
replacement, 7-8 Warning Notices, 2-13
replacement, 7-11 WARNINGS
sensor location, 3-64 hazardous voltages, 2-8, 2-13
supply connector pins, A-14 Health and Safety at Work, 2-1
transformer, 3-7 heavy lift, 2-9
replacement, 7-10 laser beam, 2-13
Vacuum System laser radiation, 2-13
distribution, 3-67 Laser Safety Officer, 2-10
operation, 9-48 protective cover, 2-13
replacements, 7-10 unqualified personnel, 2-10

Index

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Luxel F-9000 Recorder

Engineer’s Reference Guide

This document was produced by the Technical Publications Department, FUJIFILM

(ii) Luxel F-9000 Recorder

This equipment uses a Class 3B lasers (IIIb USA).

Engineer’s Reference Guide 6700898004 (iii)

Verify the environmental conditions. The temperature in the

(iv) Luxel F-9000 Recorder

Engineer’s Reference Guide 6700898004 (v)

Electromagnetic Compatibility Information - Europe

(vi) Luxel F-9000 Recorder

About this Document

Engineer’s Reference Guide 6700898004 (vii)

Trademarks and Copyright

(viii) Luxel F-9000 Recorder

Chapter 1 System Overview

Chapter 2 Safety Requirements

2.2 Clothing and Jewellery . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2

2.3 Equipment and Tools . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2

2.4 Site Safety . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2

2.5 Safety Interlock Strategy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-10

2.6 Laser Safety . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-13

Engineer’s Reference Guide 6700898004 (ix)

Chapter 3 Recorder Physical Description

3.2 Mechanical Assemblies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3

(x) Luxel F-9000 Recorder

3.3 Electronic Assemblies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-25

Engineer’s Reference Guide 6700898004 (xi)

3.4 Film Handling Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-50

3.5 System Interlocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-64

3.6 Vacuum System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-65

(xii) Luxel F-9000 Recorder

Chapter 4 Film Handling Replacements and Setups

4.2 Replacing the Sensors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-7

4.3 Replacing the Motors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-15

Engineer’s Reference Guide 6700898004 (xiii)

4.4 Replacing Cassette Assemblies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-23

4.5 Replacing the Punch and Guillotine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-27

4.6 Replacing the Fume Flap . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-31

Chapter 5 Optics Module Replacements and Setups

5.2 Setting Up the Optics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-13

(xiv) Luxel F-9000 Recorder

5.3 Optics Setup Procedures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-21

Engineer’s Reference Guide 6700898004 (xv)

5.5 Fast and Slow Scan Registration Adjustment . . . . . . . . . . . . . . . . . . . . . . . 5-41

Chapter 6 Scan System Replacements and Setups

Chapter 7 Electrical Replacements and Set-ups

7.2 MMI Display Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-3

7.3 PSU Box Assemblies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-5

7.4 Vacuum Assemblies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-10

(xvi) Luxel F-9000 Recorder

7.6 Fan Assemblies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-15

7.7 PCB Assemblies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-16

Chapter 8 Routine Maintenance

Engineer’s Reference Guide 6700898004 (xvii)

8.3 Maintenance Procedures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-10

Chapter 9 Recorder Functional Description

(xviii) Luxel F-9000 Recorder

9.2 System Board (SSB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-14

Engineer’s Reference Guide 6700898004 (xix)

9.4 Traverse Board (STB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-31

9.5 Optics Motor Board Board (SOMB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-37

9.6 Upgrade Laser Modulator Board (ULMB) . . . . . . . . . . . . . . . . . . . . . . . . . 9-41

(xx) Luxel F-9000 Recorder