IPC-TM-650

2018-May
IPC Test Method Manual
A standard developed by IPC

Association Connecting Electronics Industries

®
英文版是2018年刚刚整理发行的最新版本，全文共计700多页，升级
了较多的文件内容，同时，也取消并删除了很多章节。

中文版官方未正式发行，只是个别几个章节有翻译成中文。第三方发
行的也较早，也只有书本扫描件，很多和最新的英文版章节对不上，
只能做为参考资料。建议使用英文原版。

更多IPC文件参考： www.file123.top

Test Methods Approved

SECTION 1.0 - 1.0 Reporting and Measurement Analysis
Methods

TM 1.1C Introduction 1/03

TM 1.2A Calibration 1/03
TM 1.3A Ambient Conditions 1/03
TM 1.4A Reporting, General 1/03
TM 1.5A Reporting, Format 1/03

TM 1.6A
Numerical Reporting 1/03

TM 1.7A
Reporting, Invalid Test Results 1/03

TM 1.8A
Measurement Precision Estimation for Binary Data 1/03
Includes Calculator and User Guide

TM 1.9A
Measurement Precision Estimation for Variables Data 1/03
Includes Calculator and User Guide
 SECTION 2.1 - 2.1 Visual Test Methods
TM 2.1.1F
Microsectioning, Manual and Semi or Automatic 6/15

TM 2.1.2A
Pinhole Evaluation, Dye Penetration Method 3/76

TM 2.1.3A
Plated-Through Hole Structure Evaluation 8/76

TM 2.1.5A
Surface Examination, Unclad and Metal-Clad Material 12/82

TM 2.1.6B
Thickness of Glass Fabric 12/94

TM 2.1.6.1
Weight of Fabric Reinforcements 12/94
renumbered from 2.3.12

TM 2.1.7C
Thread Count of Glass Fabric 12/94

TM 2.1.7.1
Thread Count, Organic Fibers 12/87

TM 2.1.8B
Workmanship 12/94

TM 2.1.9
Surface Scratch Examination Metal-Clad Foil 5/86

TM 2.1.10A
Visual Inspection for Undissolved Dicyandiamide 12/94

TM 2.1.13B
Inspection for Voids in Flexible Printed Board Materials 5/12
 SECTION 2.2 - 2.2 Dimensional Test Methods
TM 2.2.1A
Mechanical Dimensional Verification 8/97

TM 2.2.2B
Optical Dimensional Verification 8/97

TM 2.2.4C
Dimensional Stability, Flexible Dielectric Materials 5/98

TM 2.2.5A
Dimensional Inspections Using Microsections 8/97

TM 2.2.6A
Hole Size Measurement, Drilled 8/97

TM 2.2.7A
Hole Size Measurement, Plated 5/86

TM 2.2.12A
Thickness of Copper by Weight 3/76

TM 2.2.12.1
Overall Thickness and Profile Factor of Copper Foils Treated and
Untreated 9/87

TM 2.2.12.2
Weight and Thickness of Copper Foils with Releasable Carriers 7/89

TM 2.2.12.3
Weight and Thickness Determination of Copper Foils With Etchable
Carriers 7/89

TM 2.2.13.1A
Thickness, Plating in Holes, Microhm Method 1/83

TM 2.2.14
Solder Powder Particle Size Distribution - Screen Method for Types 1-4
1/95

TM 2.2.14.1
Solder Powder Particle Size Distribution - Measuring Microscope
Method 1/95

TM 2.2.14.2
Solder Powder Particle Size Distribution - Optical Image Analyzer
Method 1/95

TM 2.2.14.3
Determination of Maximum Solder Powder Particle Size 1/95

TM 2.2.17A
Surface Roughness and Profile of Metallic Foils (Contacting Stylus
Technique) 2/01

TM 2.2.18
Determination of Thickness of Laminates by Mechanical Measurement
12/94

TM 2.2.18.1
Determination of Thickness of Metallic Clad Laminates, Cross-
sectional 12/94

TM 2.2.19.1
Length, Width and Perpendicularity of Laminate and Prepreg Panels
12/94

TM 2.2.20
Solder Paste Metal Content by Weight 1/95

TM 2.2.21
Planarity of Dielectrics for High Density Interconnection
(HDI)/Microvia Technology 11/98

SECTION 2.3 - 2.3 Chemical Test Methods

TM 2.3.1
Chemical Processing, Suitable Processing Material 4/73

TM 2.3.1.1B
Chemical Cleaning of Metal-Clad Laminate 5/86

TM 2.3.2G
Chemical Resistance of Flexible Printed Board Materials 12/07

TM 2.3.4B
Chemical Resistance, Marking Paints and Inks 8/87

TM 2.3.4.2A
Chemical Resistance of Laminates, Prepreg, and Coated Foil Products,
by Solvent Exposure 12/94

TM 2.3.4.3
Chemical Resistance of Core Materials to Methylene Chloride 5/86
TM 2.3.6A
Etching Ammonium Persulfate Method 7/75

TM 2.3.7A
Etching, Ferric Chloride Method 7/75

TM 2.3.7.1A
Cupric Chloride Etching Method 12/94

TM 2.3.7.2A
Alkaline Etching Method 12/94

TM 2.3.9D
Flammability of Prepreg and Thin Laminate 8/97

TM 2.3.10B
Flammability of Laminate 12/94

TM 2.3.10.1
Flammability of Soldermask on Printed Wiring Laminate 8/98

TM 2.3.11
Glass Fabric Construction 4/73

TM 2.3.13A
Determination of Acid Value of Liquid Solder Flux- Potentiometric and
Visual Titration Methods 6/04

TM 2.3.14
Print, Etch, and Plate Test 4/73

TM 2.3.15D
Purity, Copper Foil or Plating 5/04

TM 2.3.16B
Resin Content of Prepreg, by Burn-off 12/94

TM 2.3.16.1C
Resin Content of Prepreg, by Treated Weight 12/94

TM 2.3.16.2
Treated Weight of Prepreg 12/94

TM 2.3.17D
Resin Flow Percent of Prepreg 8/97

TM 2.3.17.2B
Resin Flow of "No Flow" Prepreg 8/97

TM 2.3.18A
Gel Time, Prepreg Materials 4/86

TM 2.3.19C
Volatile Content of Prepreg 12/94

TM 2.3.21A
Plating Quality Hull Cell Method 8/97
TM 2.3.22
Copper Protective Coating Quality 2/78

TM 2.3.24
Porosity of Gold Plating 2/78

TM 2.3.24.1
Porosity Testing of Gold Electrodeposited on a Nickel Plated Copper
Substrate Electrographic Method 10/85

TM 2.3.24.2A
Porosity of Metallic Coatings on Copper-Based Alloys and Nickel
(Nitric Acid Vapor Test) 8/97

TM 2.3.25D
Detection and Measurement of Ionizable Surface Contaminations by
Resistivity of Solvent Extract (ROSE) 11/12

TM 2.3.25.1
Ionic Cleanliness Testing of Bare PWBs 10/00

TM 2.3.28B
Ionic Analysis of Circuit Boards, Ion Chromatography Method 11/12

TM 2.3.28.1
Halide Content of Soldering Fluxes and Pastes 6/04

TM 2.3.28.2
Bare Printed Board Cleanliness by Ion Chromatography 12/09
TM 2.3.30A
Solvent pH Determination in Anhydrous Fluorocarbon Solvents 11/81

TM 2.3.32D
Flux Induced Corrosion (Copper Mirror Method) 6/04

TM 2.3.33D
Presence of Halides in Flux, Silver Chromate Method 6/04

TM 2.3.34C
Solids Content, Flux 6/04

TM 2.3.34.1B
Percentage of Flux on/in Flux-Coated and/or Flux-Cored Solder 1/95

TM 2.3.35C
Halide Content, Quantitative (Chloride and Bromide) 6/04

TM 2.3.35.1A
Fluorides by Spot Test, Fluxes - Qualitative 6/04

TM 2.3.35.2A
Fluoride Concentration, Fluxes - Quantitative 6/04

TM 2.3.36
Acid Acceptance of Chlorinated Solvents 10/85

TM 2.3.37B
Volatile Content of Adhesive Coated Dielectric Films 5/98
TM 2.3.40
Thermal Stability 7/95

TM 2.3.41
Test Method for Total Halogen Content in Base Materials 4/06

TM 2.3.42
Solder Mask - Resistance to Solvents and Cleaning Agents 3/07

TM 2.3.44
Determination of Thickness and Phosphorus Content in Electroless
Nickel (EN) Layers by X-Ray Fluorescence (XRF) Spectrometry 11/17

SECTION 2.4 - 2.4 Mechanical Test Methods

TM 2.4.1E
Adhesion, Tape Testing 5/04

TM 2.4.1.5A
Determination of Treatment Transfer 5/95

TM 2.4.1.6
Adhesion, Polymer Coating 7/95

TM 2.4.2A
Ductility of Copper Foil 3/76

TM 2.4.2.1D
Flexural Fatigue and Ductility, Foil 3/91
TM 2.4.3E
Flexural Endurance, Flexible Printed Wiring Materials 6/11

TM 2.4.3.1C
Flexural Fatigue and Ductility, Flexible Printed Wiring 3/91

TM 2.4.3.2C
Flexural Fatigue and Ductility, Flexible Metal-Clad Dielectrics 3/91

TM 2.4.4B
Flexural Strength of Laminates (at Ambient Temperature) 12/94

TM 2.4.4.1A
Flexural Strength of Laminates (at Elevated Temperature) 12/94

TM 2.4.5.1
Flexibility - Conformal Coating 7/00

TM 2.4.6
Hot Oil 4/73

TM 2.4.7A
Machinability, Printed Wiring Materials 7/75

TM 2.4.7.1
Solder Mask - Determination of Machineability 3/07

TM 2.4.8C
Peel Strength of Metallic Clad Laminates 12/94

TM 2.4.8.1
Peel Strength, Metal Foil (Keyhole Method for Thin Laminates) 1/86

TM 2.4.8.2A
Peel Strength of Metallic Clad Laminates at Elevated Temperature
(Hot Fluid Method) 12/94

TM 2.4.8.3A
Peel Strength of Metallic Clad Laminates at Elevated Temperature
(Hot Air Method) 12/94

TM 2.4.8.4
Carrier Release, Thin Copper 1/90

TM 2.4.9E
Peel Strength, Flexible Dielectric Materials 6/14

TM 2.4.9.1
Peel Strength of Flexible Circuits 11/98

TM 2.4.9.2
Bonding Process 11/98

TM 2.4.12A
Solderability, Edge Dip Method 6/91

TM 2.4.13F
Solder Float Resistance Flexible Printed Wiring Materials 5/98
TM 2.4.13.1
Thermal Stress of Laminates 12/94

TM 2.4.14.2A
Liquid Flux Activity, Wetting Balance Method 6/04

TM 2.4.15A
Surface Finish, Metal Foil 3/76

TM 2.4.16B
Initiation Tear Strength, Flexible Insulating Materials 3/14

TM 2.4.17
Tear Strength (Propagation) 4/73

TM 2.4.17.1B
Propagation Tear Strength, Flexible Insulating Material 2/13

TM 2.4.18B
Tensile Strength and Elongation, Copper Foil 8/80

TM 2.4.18.1A
Tensile Strength and Elongation, In-House Plating 5/04

TM 2.4.18.2
Hot Rupture Strength, Foil 7/89

TM 2.4.18.3
Tensile Strength, Elongation, and Modulus 7/95

TM 2.4.19C
Tensile Strength and Elongation, Flexible Printed Wiring Materials
5/98

TM 2.4.21F
Land Bond Strength, Unsupported Component Hole 1/07

TM 2.4.22C
Bow and Twist (Percentage) 6/99

TM 2.4.22.1C
Bow and Twist-Laminate 5/93

TM 2.4.22.2
Substrate Curvature: Silicon Wafers with Deposited Dielectrics 7/95

TM 2.4.23
Soldering Resistance of Laminate Materials 3/79

TM 2.4.24C
Glass Transition Temperature and Z-Axis Thermal Expansion by
TMA 12/94

TM 2.4.24.1
Time to Delamination (TMA Method) 12/94

TM 2.4.24.2
Glass Transition Temperature of Organic Films - DMA Method 7/95
TM 2.4.24.3
Glass Transition Temperature of Organic Films - TMA Method 7/95

TM 2.4.24.4
Glass Transition and Modulus of Materials Used in High Density
Interconnection (HDI) and Microvias -DMA Method 11/98

TM 2.4.24.5
Glass Transition Temperature and Thermal Expansion of Materials
Used In High Density Interconnection (HDI) and Microvias -TMA
Method 11/98

TM 2.4.24.6
Decomposition Temperature (Td) of Laminate Material Using TGA
4/06

TM 2.4.25D
Glass Transition Temperature and Cure Factor by DSC 11/17

TM 2.4.26
Tape Test for Additive Printed Boards 3/79

TM 2.4.27.1B
Abrasion (Taber Method) Solder Mask and Conformal Coating 1/95

TM 2.4.28.1F
Solder Mask Adhesion - Tape Test Method 3/07

TM 2.4.29C
Adhesion, Solder Mask, Flexible Circuit 3/07

TM 2.4.30
Impact Resistance, Polymer Film 10/86

TM 2.4.34
Solder Paste Viscosity - T-Bar Spin Spindle Method (Applicable for
300,000 to 1,600,000 Centipose) 1/95

TM 2.4.34.1
Solder Paste Viscosity - T-Bar Spindle Method (Applicable at Less
Than 300,000 Centipose) 1/95

TM 2.4.34.2
Solder Paste Viscosity - Spiral Pump Method (Applicable for 300,000 to
1,600,000 Centipose) 1/95

TM 2.4.34.3
Solder Paste Viscosity - Spiral Pump Method (Applicable at Less Than
300,000 Centipose) 1/95

TM 2.4.34.4
Paste Flux Viscosity - T-Bar Spindle Method 1/95

TM 2.4.35
Solder Paste - Slump Test 1/95

TM 2.4.36C
Rework Simulation, Plated-Through Holes for Leaded Components
5/04
TM 2.4.38A
Prepreg Scaled Flow Testing 6/91

TM 2.4.39A
Dimensional Stability, Glass Reinforced Thin Laminates 2/86

TM 2.4.40
Inner Layer Bond Strength of Multilayer Printed Circuit Boards 10/87

TM 2.4.41
Coefficient of Linear Thermal Expansion of Electrical Insulating
Boards 3/86

TM 2.4.41.1A
Coefficient of Thermal Expansion by the Vitreous Silica (Quartz)
Dilatometer Method 8/97

TM 2.4.41.2A
Coefficient of Thermal Expansion - Strain Gage Method 5/04

TM 2.4.41.3
In-Plane Coefficient of Thermal Expansion, Organic Films 7/95

TM 2.4.41.4
Volumetric Thermal Expansion Polymer Coatings on Inorganic
Substrates 7/95

TM 2.4.42
Torsional Strength of Chip Adhesives 2/88
TM 2.4.42.1
High Temperature Mechanical Strength Retention of Adhesives 3/88

TM 2.4.43
Solder Paste - Solder Ball Test 1/95

TM 2.4.44
Solder Paste - Tack Test 3/98

TM 2.4.45
Solder Paste - Wetting Test 1/95

TM 2.4.46A
Spread Test, Liquid or Extracted Solder Flux, Solder Paste and
Extracted Cored Wires or Preforms 6/04

TM 2.4.47
Flux Residue Dryness 1/95

TM 2.4.48
Spitting of Flux-Cored Wire Solder 1/95

TM 2.4.49
Solder Pool Test 1/95

TM 2.4.50
Thermal Conductivity, Polymer Films 7/95

TM 2.4.51
Self Shimming Thermally Conductive Adhesives 1/95

TM 2.4.52
Fracture Toughness of Resin Systems for Base Materials 10/13

TM 2.4.53
Dye and Pull Test Method (Formerly Known as Dye and Pull) 8/17

SECTION 2.5 - 2.5 Electrical Test Methods

TM 2.5.1B
Arc Resistance of Printed Wiring Material 5/86

TM 2.5.2A
Capacitance of Insulating Materials 7/75

TM 2.5.3B
Current Breakdown, Plated Through-Holes 8/97

TM 2.5.4.1A
Conductor Temperature Rise Due to Current Changes in Conductors
8/97

TM 2.5.5.2A
Dielectric Constant and Dissipation Factor of Printed Wiring Board
Material--Clip Method 12/87

TM 2.5.5.3C
Permittivity (Dielectric Constant) and Loss Tangent (Dissipation
Factor) of Materials (Two Fluid Cell Method) 12/87
TM 2.5.5.5C
Stripline Test for Permittivity and Loss Tangent (Dielectric Constant
and Dissipation Factor) at X-Band 3/98

TM 2.5.5.5.1
Stripline Test for Complex Relative Permittivity of Circuit Board
Materials to 14 GHZ 3/98

TM 2.5.5.7A
Characteristic Impedance Lines on Printed Boards by TDR 3/04

TM 2.5.5.9
Permittivity and Loss Tangent, Parallel Plate, 1MHz to 1.5 GHz 11/98

TM 2.5.5.10
High Frequency Testing to Determine Permittivity and Loss Tangent of
Embedded Passive Materials 7/05

TM 2.5.5.11
Propagation Delay of Lines on Printed Boards by TDR 4/09

TM 2.5.5.12A
Test Methods to Determine the Amount of Signal Loss on Printed
Boards 7/12

TM 2.5.5.13
Relative Permittivity and Loss Tangent Using a Split-Cylinder
Resonator 1/07
TM 2.5.6B
Dielectric Breakdown of Rigid Printed Wiring Material 5/86

TM 2.5.6.1B
Solder Mask - Dielectric Strength 3/07

TM 2.5.6.2A
Electric Strength of Printed Wiring Material 3/98

TM 2.5.6.3
Dielectric Breakdown Voltage and Dielectric Strength 10/86

TM 2.5.7D
Dielectric Withstanding Voltage, PWB 5/04

TM 2.5.7.1
Dielectric Withstanding Voltage - Polymeric Conformal Coating 7/00

TM 2.5.7.2A
Dielectric Withstanding Voltage (HiPot Method) - Thin Dielectric
Layers for Printed Boards 11/09

TM 2.5.10.1
Insulation Resistivity for Adhesive Interconnection Bonds 11/98

TM 2.5.12
Interconnection Resistance, Multilayer Printed Wiring 4/73

TM 2.5.13A
Resistance of Copper Foil 3/76
TM 2.5.14A
Resistivity of Copper Foil 8/76

TM 2.5.15A
Guidelines and Test Methods for RFI-EMI Shielding of Flat Cable
10/86

TM 2.5.17E
Volume Resistivity and Surface Resistance of Printed Wiring Materials
5/98

TM 2.5.17.1A
Volume and Surface Resistivity of Dielectric Materials 12/94

TM 2.5.17.2
Volume Resistivity of Conductive Materials Used in High Density
Interconnection (HDI) and Microvias, Two-Wire Method 11/98

TM 2.5.18B
Characteristic Impedance Flat Cables (Unbalanced) 7/84

TM 2.5.19A
Propagation Delay of Flat Cables Using Time Domain Reflectometer
7/84

TM 2.5.19.1A
Propagation Delay of Flat Cables Using Dual Trace Oscilloscope 7/84

TM 2.5.21A
Digital Unbalanced Crosstalk, Flat Cable 3/84

TM 2.5.27
Surface Insulation Resistance of Raw Printed Wiring Board Material
3/79

TM 2.5.30
Balanced and Unbalanced Cable Attenuation Measurements 12/87

TM 2.5.33
Measurement of Electrical Overstress from Soldering Hand Tools
11/98

TM 2.5.33.1
Measurement of Electrical Overstress from Soldering Hand Tools -
Ground Measurements 11/98

TM 2.5.33.2
Measurement of Electrical Overstress from Soldering Hand Tools -
Transient Measurements 11/98

TM 2.5.33.3
Measurement of Electrical Overstress from Soldering Hand Tools -
Current Leakage Measurements 11/98

TM 2.5.33.4
Measurement of Electrical Overstress from Soldering Hand Tools -
Shielded Enclosure 11/98

TM 2.5.34
Power Density Rating for Embedded Resistors 7/12
 SECTION 2.6 - 2.6 Environmental Test Methods
TM 2.6.1G
Fungus Resistance Printed Wiring Materials 3/07

TM 2.6.1.1
Fungus Resistance – Conformal Coating 7/00

TM 2.6.2D
Moisture Absorption, Flexible Printed Wiring 2/12

TM 2.6.2.1A
Water Absorption, Metal Clad Plastic Laminates 5/86

TM 2.6.3F
Moisture and Insulation Resistance, Printed Boards 5/04

TM 2.6.3.1E
Solder Mask - Moisture and Insulation Resistance 3/07

TM 2.6.3.2C
Surface Insulation and Moisture Resistance, Copper Clad Flexible
Dielectric Material 8/15

TM 2.6.3.3B
Surface Insulation Resistance, Fluxes 6/04

TM 2.6.3.4A
Moisture and Insulation Resistance – Conformal Coating 7/03
Supersedes 2.6.3.4 and 2.6.3.1C for Conformal Coating Test

TM 2.6.3.5
Bare Board Cleanliness by Surface Insulation Resistance 1/04

TM 2.6.3.6
Surface Insulation Resistance - Fluxes - Telecommunications 1/04

TM 2.6.3.7
Surface Insulation Resistance 3/07

TM 2.6.4B
Outgassing, Printed Boards 5/04

TM 2.6.5D
Physical Shock, Multilayer Printed Wiring 5/04

TM 2.6.6B
Temperature Cycling, Printed Wiring Board 12/87

TM 2.6.7A
Thermal Shock and Continuity, Printed Board 8/97

TM 2.6.7.1A
Thermal Shock - Conformal Coating 7/00
Supersedes 2.6.7.1 for Conformal Coating Tests

TM 2.6.7.2B
Thermal Shock, Continuity and Microsection, Printed Board 5/04
TM 2.6.7.3
Thermal Shock - Solder Mask 7/00
Supersedes 2.6.7.1 for Solder Mask Test

TM 2.6.8E
Thermal Stress, Plated-Through Holes 5/04

TM 2.6.8.1
Thermal Stress, Laminate 9/91

TM 2.6.9B
Vibration, Rigid Printed Wiring 5/04

TM 2.6.9.1
Test to Determine Sensitivity of Electronic Assemblies to Ultrasonic
Energy 1/95

TM 2.6.9.2
Test to Determine Sensitivity of Electronic Components to Ultrasonic
Energy 1/95

TM 2.6.10A
X-Ray (Radiography), Multilayer Printed Wiring Board Test Methods
8/97

TM 2.6.11D
Solder Mask - Hydrolytic Stability 3/07

TM 2.6.11.1
Hydrolytic Stability - Conformal Coating 7/00
Supersedes 2.6.11B for Conformal Coating Test
TM 2.6.13
Assessment of Susceptibility to Metallic Dendritic Growth: Uncoated
Printed Wiring 10/85

TM 2.6.14D
Solder Mask - Resistance to Electrochemical Migration 3/07

TM 2.6.14.1
Electrochemical Migration Resistance Test 9/00

TM 2.6.15C
Corrosion, Flux 6/04

TM 2.6.16
Pressure Vessel Method for Glass Epoxy Laminate Integrity 7/85

TM 2.6.16.1
Moisture Resistance of High Density Interconnection (HDI) Materials
Under High Temperature and Pressure (Pressure Vessel) 8/98

TM 2.6.18A
Low Temperature Flexibility, Flexible Printed Wiring Materials 7/85

TM 2.6.21B
Service Temperature of Metal-Clad Flexible Laminate, Cover Material
and Adhesive Bonding Films 6/11

TM 2.6.23
Test Procedure for Steam Ager Temperature Repeatability 7/93
TM 2.6.24
Junction Stability Under Environmental Conditions 11/98

TM 2.6.25B
Conductive Anodic Filament (CAF) Resistance Test: X-Y Axis 4/16

TM 2.6.26A
DC Current Induced Thermal Cycling Test 6/14

TM 2.6.27A
Thermal Stress, Convection Reflow Assembly Simulation 8/17

TM 2.6.28
Moisture Content and/or Moisture Absorption Rate, (Bulk) Printed
Board 8/10
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