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Moc21 23
Moc21 23
" ! !
(400 Volts Peak)
The MOC3020 Series consists of gallium arsenide infrared emitting diodes,
optically coupled to a silicon bilateral switch.
• To order devices that are tested and marked per VDE 0884 requirements, the
suffix ”V” must be included at end of part number. VDE 0884 is a test option.
They are designed for applications requiring isolated triac triggering.
Recommended for 115/240 Vac(rms) Applications:
6
• Solenoid/Valve Controls • Static ac Power Switch 1
• Lamp Ballasts • Solid State Relays STANDARD THRU HOLE
• Interfacing Microprocessors to 115 Vac Peripherals • Incandescent Lamp Dimmers
• Motor Controls
SCHEMATIC
MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
1 6
Rating Symbol Value Unit
INFRARED EMITTING DIODE
2 5
Reverse Voltage VR 3 Volts
Forward Current — Continuous IF 60 mA 3 4
Total Power Dissipation @ TA = 25°C PD 100 mW
Negligible Power in Triac Driver 1. ANODE
Derate above 25°C 1.33 mW/°C 2. CATHODE
3. NC
OUTPUT DRIVER 4. MAIN TERMINAL
Off–State Output Terminal Voltage VDRM 400 Volts 5. SUBSTRATE
5. DO NOT CONNECT
Peak Repetitive Surge Current ITSM 1 A 6. MAIN TERMINAL
(PW = 1 ms, 120 pps)
Total Power Dissipation @ TA = 25°C PD 300 mW
Derate above 25°C 4 mW/°C
TOTAL DEVICE
Isolation Surge Voltage(1) VISO 7500 Vac(pk)
(Peak ac Voltage, 60 Hz, 1 Second Duration)
Total Power Dissipation @ TA = 25°C PD 330 mW
Derate above 25°C 4.4 mW/°C
Junction Temperature Range TJ – 40 to +100 °C
Ambient Operating Temperature Range TA – 40 to +85 °C
Storage Temperature Range Tstg – 40 to +150 °C
Soldering Temperature (10 s) TL 260 °C
1. Isolation surge voltage, VISO, is an internal device dielectric breakdown rating.
1. For this test, Pins 1 and 2 are common, and Pins 4, 5 and 6 are common.
1
MOC3021, MOC3022, MOC3023
TA = 25°C
2 +800
VF, FORWARD VOLTAGE (VOLTS)
1.8
PULSE ONLY +400
PULSE OR DC
1.6
0
1.4
TA = –40°C –400
1.2
25°C
1 85°C –800
1 10 100 1000 –3 –2 –1 0 1 2 3
IF, LED FORWARD CURRENT (mA) VTM, ON–STATE VOLTAGE (VOLTS)
Figure 1. LED Forward Voltage versus Forward Current Figure 2. On–State Characteristics
MOC3021, MOC3022, MOC3023
1.4 25
1.3
NORMALIZED TO:
1.2
20
q
PWin 100 µs
1.1
15
1
0.9 10
0.8
5
0.7
0.6 0
–40 –20 0 20 40 60 80 100 1 2 5 10 20 50 100
TA, AMBIENT TEMPERATURE (°C) PWin, LED TRIGGER WIDTH (µs)
Figure 3. Trigger Current versus Temperature Figure 4. LED Current Required to Trigger
versus LED Pulse Width
12 100
STATIC dv/dt
I DRM, LEAKAGE CURRENT (nA)
10
CIRCUIT IN FIGURE 7
dv/dt, STATIC (V/ µs)
6 10
0
25 30 40 50 60 70 80 90 100 1
– 40 – 30 – 20 –10 0 10 20 30 40 50 60 70 80
TA, AMBIENT TEMPERATURE (°C) TA, AMBIENT TEMPERATURE (°C)
Figure 5. dv/dt versus Temperature Figure 6. Leakage Current, IDRM
versus Temperature
+400
Vdc RTEST 1. The mercury wetted relay provides a high speed repeated
R = 10 kΩ pulse to the D.U.T.
2. 100x scope probes are used, to allow high speeds and
voltages.
PULSE CTEST 3. The worst–case condition for static dv/dt is established by
INPUT MERCURY triggering the D.U.T. with a normal LED input current, then
X100
WETTED removing the current. The variable RTEST allows the dv/dt to be
SCOPE
RELAY D.U.T. gradually increased until the D.U.T. continues to trigger in
PROBE
response to the applied voltage pulse, even after the LED
current has been removed. The dv/dt is then decreased until
the D.U.T. stops triggering. tRC is measured at this point and
recorded.
Vmax = 400 V
APPLIED VOLTAGE
WAVEFORM 252 V
LOAD GROUND
* This optoisolator should not be used to drive a load directly. It is in- In this circuit the “hot” side of the line is switched and the
tended to be a trigger device only. load connected to the cold or ground side.
Additional information on the use of optically coupled triac The 39 ohm resistor and 0.01 µF capacitor are for snub-
drivers is available in Application Note AN–780A. bing of the triac, and the 470 ohm resistor and 0.05 µF ca-
pacitor are for snubbing the coupler. These components
may or may not be necessary depending upon the particu-
lar triac and load used.
PACKAGE DIMENSIONS
–A–
NOTES:
6 4 1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
–B– 2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
1 3 FORMED PARALLEL.
INCHES MILLIMETERS
DIM MIN MAX MIN MAX
F 4 PL C L A 0.320 0.350 8.13 8.89
N B 0.240 0.260 6.10 6.60
C 0.115 0.200 2.93 5.08
D 0.016 0.020 0.41 0.50
E 0.040 0.070 1.02 1.77
F 0.010 0.014 0.25 0.36
–T– K G 0.100 BSC 2.54 BSC
SEATING J 0.008 0.012 0.21 0.30
PLANE
G J 6 PL K 0.100 0.150 2.54 3.81
L 0.300 BSC 7.62 BSC
M 0.13 (0.005) M T B M A M
M 0_ 15 _ 0_ 15 _
E 6 PL
N 0.015 0.100 0.38 2.54
D 6 PL
0.13 (0.005) M T A M B M STYLE 6:
PIN 1. ANODE
2. CATHODE
3. NC
4. MAIN TERMINAL
5. SUBSTRATE
6. MAIN TERMINAL
THRU HOLE
–A–
6 4
–B– S NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
1 3
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
INCHES MILLIMETERS
L DIM MIN MAX MIN MAX
F 4 PL
H A 0.320 0.350 8.13 8.89
B 0.240 0.260 6.10 6.60
C 0.115 0.200 2.93 5.08
C D 0.016 0.020 0.41 0.50
E 0.040 0.070 1.02 1.77
–T– F 0.010 0.014 0.25 0.36
G G 0.100 BSC 2.54 BSC
J SEATING
H 0.020 0.025 0.51 0.63
PLANE
E 6 PL K 6 PL J 0.008 0.012 0.20 0.30
K 0.006 0.035 0.16 0.88
D 6 PL 0.13 (0.005) M T B M A M
L 0.320 BSC 8.13 BSC
S 0.332 0.390 8.43 9.90
0.13 (0.005) M T A M B M
SURFACE MOUNT
MOC3021, MOC3022, MOC3023
–A– NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
6 4 3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
–B–
1 3 INCHES MILLIMETERS
DIM MIN MAX MIN MAX
A 0.320 0.350 8.13 8.89
B 0.240 0.260 6.10 6.60
L C 0.115 0.200 2.93 5.08
F 4 PL N D 0.016 0.020 0.41 0.50
E 0.040 0.070 1.02 1.77
F 0.010 0.014 0.25 0.36
C G 0.100 BSC 2.54 BSC
J 0.008 0.012 0.21 0.30
–T– K 0.100 0.150 2.54 3.81
SEATING L 0.400 0.425 10.16 10.80
PLANE G N 0.015 0.040 0.38 1.02
K J
D 6 PL
E 6 PL 0.13 (0.005) M T A M B M