ACE

Service Manual
DOC-00084777

HTC Proprietary
U

Confidential Treatment Requested

Rev. A09

HTC Corporation.
Engineering Mobility
HTC CONFIDENTIAL 1
IS-5344-01-R1
REVISION CONTROL TABLE

REV. DATE CONTENTS DEPT. REVISED STAGE

A01 2010/10/7 Fist Draft PSE Steven Liu PVT

1. Update the disassembly procedure in P23 and 28
A02 2010/10/15 2. Update the assembly procedure in P34, 39, 40 and 42 PSE Steven Liu MV
3. Update ESPL list in chapter 7.1
1. Add the assembly procedure in P32, 35, 38, 39 and 41
A03 2010/11/2 2. Update ESPL list in P80 and 81 PSE Steven Liu MV
3. Add the notice for FRU M/B additional parts in P85
1. Modify the inspection criteria in P74 and 75
2. Add the sponge for P sensor malfunction issue in P31
A04 2010/11/19 3. Add light sensor and P sensor calibration procedures PSE Steven Liu MV
in P67 to P72
4. Modify idle and sleep current value in P76
1. Add the Mylar of light guide on the chassis in P31
2. Add the assembly notice of vibrator and LCM EMI
A05 2010/11/25 PSE Steven Liu MV
gasket in P38 and P39
3. Update ESPL in P88
1. Add the sponge on the coaxial cables in P40
A06 2010/11/29 PSE Steven Liu MV
2. Update ESPL in P88
1. Update the assembly procedure for LCM BTB
connector and SIM FPC board in P36
A07 2010/12/6 2. Update the LCM and bezel disassembly procedures in PSE Steven Liu MV
P30 and P31
3. Add chapter 2.4 for repair or assembly tips in P45
1. Add the battery Mylar onto the chassis in P42
A08 2010/12/14 PSE Steven Liu MP
2. Update ESPL in P86 and P90
1. Update the assembly procedure for BT coaxial cable
connector adding sponge in P39
A09 2011/1/25 2. Update RTV part for 74H01815-02M from No to Yes in PSE Steven Liu MP
P88
3. Update ESPL in P90

Service Manual files and updates are available on the hTc RMAIII Web site. For more information, go to
https://rma.htc.com.tw/rmaiii/home/index.asp

PROPRIETARY NOTE
THIS DOCUMENT CONTAINS INFORMATION CONFIDENTIAL AND PROPRIETARY TO hTc CORPORATION AND SHALL NOT BE

REPRODUCED OR TRANSFERRED TO OTHER DOCUMENTS OR DISCLOSED TO OTHERS OR USED FOR ANY PURPOSE OTHER THAN THAT

FOR WHICH IT WAS OBTAINED WITHOUT THE EXPRESSED WRITTEN CONSENT OF hTc CORPORATION.

HTC CONFIDENTIAL 2
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1. INTRODUCTION ....................................................................................................................................................................4

1.1 PRODUCT FEATURES .........................................................................................................................................................4

1.2 PRODUCT FEATURES .......................................................................................................................................................10
1.3 PRODUCT TIPS ..................................................................................................................................................................12

2. DEVICE DISASSEMBLING AND ASSEMBLING PROCEDURE ................................................................................18

2.1 TOOL LIST .........................................................................................................................................................................18

2.2 DISASSEMBLING PROCEDURE ..........................................................................................................................................19
2.3 ASSEMBLING PROCEDURE ...............................................................................................................................................32
2.4 REPAIR OR ASSEMBLY TIPS...............................................................................................................................................45
2.5 UNIT LABEL LOCATION EXPLANATION ...............................................................................................................................46

3. ROM RE-FLASH PROCEDURE ........................................................................................................................................47

3.1 LATEST ROM VERSION INQUIRY ......................................................................................................................................47

3.2 ROM UPGRADE THRU RUU (RE-FLASH UPGRADE UTILITY) ..........................................................................................49
3.3 ROM IMAGE UPGRADE THRU SD CARD ............................................................................................................................53

4. DIAGNOSTIC PROGRAM ..................................................................................................................................................55

4.1 REWRITE UNIT S/N TO DEVICE VIA ASP_PC_AGENT ....................................................................................................67

4.2 PERFORM HW CALIBRATION ...........................................................................................................................................70

5. POWER MEASUREMENT TEST ......................................................................................................................................76

5.1 MAIN BOARD LEAKAGE CURRENT TEST PROCEDURE ......................................................................................................76

6. COSMETIC INSPECTION CRITERIA...............................................................................................................................80

6.1 CLASSES DEFINITION OF INSPECTIVE AREA .....................................................................................................................80

6.2 DISPLAY INSPECTION ........................................................................................................................................................82
6.3 MAIN UNIT INSPECTION.....................................................................................................................................................83

7. GENERIC SPARE PART LIST AND PHOTOS................................................................................................................86

7.1 SPL FOR REPAIR ..............................................................................................................................................................86

7.2 BOARD LEVEL 2.5 REPAIRS .............................................................................................................................................91
7.3 FRU M/B ADDITIONAL PARTS LOCATION ..........................................................................................................................94

8. RF ANTENNA SPECIFICATION........................................................................................................................................95

HTC CONFIDENTIAL 3
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1. Introduction

1.1 Product Features

Target ‹ 5.76Mbps
z On Shelf Schedule: September, 2010 z HSPA+: CPC (Continuous Packet Connectivity),
z Market: Europe and Asia enhanced F-DPCH, L2 enhancement (Option)
Platform z Global roaming
z Ultra slim PDA phone z Auto band switching
z Android OS z Handover and cell selection between GSM/EDGE
Dimension and UMTS
z 123 x 68 x 11.8 mm z DTM
Processor/Chipset z DARP
z Qualcomm QSD 8255-1, 1GHz z Audio codec: AMR-NB, AMR-WB (option), EFR, FR,
Memory HR
z 4G eMMC z SMS (MO, MT), concatenated SMS (640 characters)
z RAM: 768 MB, LPDDR1 z Generic services:
LCD Module ‹ Call holding/waiting/forwarding
z 4.3” inch WVGA resolution ‹ Call barring
z 16M-color LCD ‹ CLI (Calling Line Identity)
z Capacitive touch screen with multi-touch capability ‹ Display own number
HSUPA/HSDPA/UMTS/EDGE/GPRS/GSM Function ‹ Network selection
z Dual mode UMTS/HSPA 2100/900 for EU/Asia and ‹ Cell broadcast
quad-band GSM/GPRS/EDGE (850/900/1800/1900 ‹ Multi-party conference call
MHz) ‹ Spool icon
‹ UMTS/HSDPA/HSUPA ‹ Phase 2+ unstructured supplementary service
‹ 900: 880-915MHz, 925-960MHz data
‹ 2100:1920-1980MHz, 2110-2170MHz ‹ Network Lock
‹ GSM/GPRS/EDGE ‹ CPHS (partial support)
9 850: 824-849, 869-894 MHz ‹ Support Google indoor positioning technology
9 900: 880-915, 925-960 MHz 9 Support MCC-MNC-UC-ID, as stated in
9 1800: 1710-1785, 1805-1880 MHz 3GPP TS 25.401 R99, Section 6, for both
9 1900: 1850-1910, 1930-1990 MHz RIL and radio
‹ HSDPA / UMTS z EGPRS Functionality
‹ 3GPP Release 5 compliant ‹ EGPRS class B
‹ 7.2Mbps peak rate (14.4Mbps option) ‹ Multi-slot standard class 12 (Class 10- carrier
‹ HSUPA [Options, depends on carrier engagement] dependent)

HTC CONFIDENTIAL 4
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 ‹ PBCCH
‹ Link Adaptation and Incremental Redundancy
z USIM/SIM
‹ 1.8/3V of UICC
‹ USIM Application at least according to 3GPP TS
31.102
‹ SIM Application Tool Kit release 96 complete, 98
class 3, and 99 partial
‹ Over the Air (OTA) programming
‹ FDN
‹ AND
‹ Security Pin 1 & 2 control
Standalone GPS (Qualcomm based solution)
z Internal GPS antenna
z Support NMEA 0183 version 3.0 or above
z Dynamically allocate parallel channel GPS receiver
z Acquisition time
‹ Hot start: 8 seconds, average TTFF (open sky &
static condition)
‹ Warm start: 60 seconds, average TTFF (open sky &
static condition)
‹ Cold start: 75 seconds, average TTFF (open sky &
static condition)
z Update rate: once/1sec (default)
z GPS Accuracy
‹ Position: < 15 meters, 95% successful rate
‹ Velocity: 0.05 meter/sec steady state
A-GPS (Qualcomm Based solution)
z Support UE-Based & UE-Assisted A-GPS
z E911 Location Information (for device shipped to US)
z OMA SUPL v1.0 compliance (v2.0 if available)
‹ SUPL-RRLP
‹ WAP push initiated SUPL
z Standard 3GPP A-GPS compliance
‹ 3GPP TS 44.031 (RRLP 5.12)
‹ 3GPP TS 25.305 (GSM & UMTS)
z Performance requirement
HTC CONFIDENTIAL
‹ TTFF (95% successful rate): < 20 seconds
‹ 2D Location Error (95% successful rate): < 100 m
‹ Sensitivity requirement
9 GPS for one satellite: up to -142dBm
9 GPS for remaining satellite: up to -147dBm
‹ 3GPP TS 25.171 compliance (Requirement for
support of Assisted Global Positioning System)
‹ 3GPP 34.171 (Terminal conformance specification,
Assisted Global Positioning System)
‹ 3GPP TS 34.108 (Common test environments for
User Equipment conformance testing)
Motion G-sensor
z Tri-Axis Accelerometer
z Resolution: 3.9 milli-g
z Assist user interface to perform automatic screen
rotation when users rotate the display in browser and
album applications.
z Support camera application to record the orientation
of photos
z Together with the light sensor to support auto screen
on/off when user move device leave/close to ear
Digital Compass
z Compass resolution: ± 1 degree (displays degrees
and cardinal points)
z 2D/3D (2/3 channel) sensor
z Within ± 5 degrees accuracy
z ± 1200 μT Magnetic flux measuring range
z Support auto map orientation alignment
Proximity sensor
Ambient Light Sensor
FM Radio
z Tuning range: 87.5-108 MHz
z FM sensitivity: 8uV @ (S+N)/N=26 dB
z Auto channel search
z Support 3.5mm in antenna usage
Digital Camera
z 8 MP Color CMOS with auto focus
5
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z 2x LED flash Light 9 GOEP (generic object exchange profile)

Key/Button 9 SDAP (Service Discovery Application

z Volume up/down button Profile)

z Power button 9 HSP (headset profile)

z Search key (virtual) 9 HFP 1.5 (handsfree profile)

z Home key (virtual) 9 A2DP (Advanced Audio Distribution profile)

z Back key (virtual) 9 AVRCP (Audio/Video Remote control

z Menu key (virtual) Profile)

Notification 9 OPP (object push profile)

z One bi-colors (Green & Amber) LED for notifications 9 PBAP (Phone Book Access Profile)

and charging status 9 FTP (File transfer profile)

z Notification by sound, vibration, LEDs or status ‹ Co-exist with WiFi

shown on the display z Wi-Fi

Audio ‹ IEEE 802.11b/g/n compliant

z Built-in dual microphones for noise reduction ‹ Internal WLAN antenna

z Receiver ‹ Data rate auto fallback for extended range

z Loud speaker for Hands-Free supported ‹ ELP mode

z Full duplex ‹ Security 802.11i and AES

z DSP Codec Chip ‹ However, OS doesn’t support 802.11i and AES

‹ Surround sound effect of Dolby and SRS (for 9 WPA authentication – WEP, WPA, PSK,

headphone) EAPTLS, PEAP, LEAP

‹ Sound enhancements 9 Signaling interfaces between the terminal

z Audio sampling rate device and the servers: mutually

‹ 16-bits with 8KHz, 11KHz, 22KHz, 44.1KHz authenticated and encrypted utilizing TLS

z AMR/AAC/WAV/WMA/MP3 codec (RFC 2246) with RC4

z Audio Path Routing encryption with SGA1 used as the

‹ Bluetooth message integrity check

‹ Receiver ‹ QoS

‹ Speaker 9 802.11 WME QoS

‹ Headset 9 802.11e

Connectivity & Interface z 5-pin micro-USB

z Bluetooth
‹ Compliant with v2.1 with EDR
‹ Class 2 transmit power
‹ Supported profiles:
9 GAP (generic access profile)
9 SPP (serial port profile)
‹ USB 2.0 with high speed client
‹ Support USB charging and synchronization
‹ Mass storage support
z 3.5 mm audio jack
‹ Support audio and microphone
z 1.8/3V USIM/SIM card slot

HTC CONFIDENTIAL 6
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z MicroSD Card Slot on PDM
‹ Support SD2.0/ SDHC GMS Applications (subject to Google's approval)
z RF Connector for testing z Gmail
Power z Google Maps
z Battery z Google Talk
‹ Removable battery, 1,230 mAh z Market
z Battery life z Search
‹ GSM talk time: 200~430 minutes z Setup Wizard
‹ GSM standby time: 150~390hours z Street View
‹ WCDMA talk time: 100~280 minutes z Sync
‹ WCDMA standby time: 200~500hours z Voice Search (US only)
z AC adaptors z YouTube
‹ AC input: 100 ~ 240V AC, 50/60 Hz Value-added Applications & Enhancement
‹ The device shall be able to detect the AC z Calculator
adapter complied with China adapter z Calendar
standard. z Call History
z DC output: 5V and 1A z Camcorder
Liquid Indicator z Camera
Accessories z Clock
z Quick start guide [Inbox] z Desk Clock
z Standard battery [Inbox] z Reader
z Accessory leaflet [Inbox] (Own Brand only) z Gallery
z AC adapter, TC X250[Inbox] z Facebook
z Micro-USB cable, DC M410[Inbox] z Flash Light
z Audio adapter cable (3.5mm, with pickup button and z FM Radio
mic), HS U350 z FriendStream
z Mono Bluetooth Headset, BH M300 z Home
z Mono Bluetooth Headset, BH M400 z Mail
z Internet z Messages
z Locations z Music
z Micro-SD card z News
z Car charger, CC C200 z PDF Viewer
z Screen protector z Peep
z 8G MicroSD card (Inbox) z People
z Generic car kit (TBD) z Phone
Customer requirements & Compatibility Test: z Power Saver application (In Settings)
Please refer to the accessory compatibility list document z Quick office

HTC CONFIDENTIAL 7
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z Quick Lookup ‹ Twitter
z HTC Recommends ‹ Tip widget
z Search People ‹ Weather
z Settings ‹ Wi-Fi Hotspot
z Setup Android Module & Enhancement
z SIM Toolkit z Android System
z Stocks z Accessibility
z Teeter z Accounts & sync
z Transfer Data (Data Move In) z AGPS (Default by Google server)
z Videos z Bluetooth Profile - A2DP, AVRCP, FTP, HFP, HSP,
z Voice Recorder OPP, PBAP
z Weather z Codec:
Home – HTC Sense ‹ Image encode & decode: JPG
z Navigation Framework ‹ Image decode: BMP, GIF, PNG
z Google Widget ‹ Audio encode & decode: AMR-NB
z HTC Widget Manager ‹ Audio decode: AAC, AAC+, eAAC+, AMR-WB,
‹ Bookmarks MID, MP3, OGG, WAV
‹ Calendar ‹  Video encode & decode: H.263, MPEG-4

‹ Clock ‹ Video decode: H.264"

‹ FM Radio z Codec
‹ FriendStream ‹ Video decode: WMV
‹ HTC Recommends ‹ Audio decode: WMA"
‹ Mail z CS client
‹ Messages z DLNA
‹ Music z Codec – xvid
‹ News z DRM 1.0 (CD, FL, SD)
‹ Nearby z File Browser
‹ People z Flash 10.1
‹ Photo Album z Gesture
‹ Photo Frame z Hardware Accelerator
‹ Power and data widgets ‹ Video decode: H.264
‹ Profile (Mute/Vibrate/Sound) ‹ Video encode: H.263, MPEG-4
‹ Ringtone ‹ Audio decode: AAC"
‹ Search z HTC Flash Player
‹ Settings z HTC Common Sense
‹ Stocks z HTC Common Control
‹ Sync All z HTC Sync

HTC CONFIDENTIAL 8
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z HTC Media Uploader z JRF
z IMF z JPA
z Location Picker
z Lock Screen
z Live Wallpaper
z Media Uploader
z Microsoft Exchange ActiveSync
z USB tethering
z Multi Touch
z Multimedia Framework
z Ringtone Trimmer
z RSS Reader
z Streaming Media Player
z Smart Data Roaming
z Text Selection
z Text-to-speech
z Touch Input Chinese (PinYin, Cangjie, Stroke,
Handwriting)
z Touch Input
z Quick Search Box
z Connect to PC
z VPN
z Wi-Fi Hotspot
z Wi-Fi Settings
Regulatory
z GCF certification [Operator dependent]
z R&TTE: EMC / EMI, Safety SAR
z WiFi Certification
z PTCRB Approval
z BQB (Bluetooth Qualification Body) certification
z USB Certification
z CB certificate / report
z UAELAB
z ICASA
z NAT Test
z FCC approval
z FCC Hearing Aid Compatibility

HTC CONFIDENTIAL 9
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 1.2 Product Features
Front panel

Proximity Sensor

Back panel

HTC CONFIDENTIAL 10
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Left Panel

Bottom Panel

HTC CONFIDENTIAL 11
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 1.3 Product Tips
To remove the bottom cover

HTC CONFIDENTIAL 12
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To install the SIM card

Storage card

HTC CONFIDENTIAL 13
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HTC CONFIDENTIAL 14
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Performing a hard reset
If a normal reset does not solve a system problem, you can perform a hard (full) reset. After a hard reset, the phone is
restored to its default settings—the way it was when you first purchased it and turned it on. You will lose any programs
you installed, data you entered, and settings you customized on your phone, and only Windows Mobile® software
and other pre-installed programs will remain.

Warning! Your phone will be set back to factory default settings. Make sure that any additional installed programs
and important data on your phone have been backed up before you perform a hard reset.
Important! If Encrypt files when placed on a storage card is enabled, back up all files from the storage card before
using Clear Storage, hard reset, or updating the operating system. Otherwise, you will no longer be able to access the
encrypted files on the storage card. Use HTC Sync to transfer files between your storage card and computer. After the
procedure, copy your files back to the storage card.

1. With the phone turned off, press and hold the Volume down key, then press Power key shortly and release
it. You will then see this message on the screen.
2. Release the Volume down key to FACTORY RESET.
3. Press the Power key to select FACTORY RESET.
4. Press Volume up to perform hard reset.

HTC CONFIDENTIAL 15
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Enter bootloader mode
With the phone turned off, press and hold Volume down key, then press Power key, the device will enter
bootloader mode.

HTC CONFIDENTIAL 16
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Image CRC Checksum verification
1. With the phone turned off, press and hold the Volume Down button, and then briefly press the Power
button to enter the bootloader mode.
2. Follow the instruction on the screen to select Image CRC.

3. Compare the Image CRC checksum result with ImageCRC.txt file from RMA III website
https://rma.htc.com.tw/rmaiii/home/index.asp to check whether the device has been hacked or not.

Note: The checksum of photo is for reference only. Please download the text file with Image
CRC.txt from SDO for the checksum comparison between device and file

HTC CONFIDENTIAL 17
IS-5344-01-R1
2. Device Disassembling and Assembling Procedure

2.1 Tool list

Level No. Item Vendor P/N
1 Micro USB DATA interface Cable
2 Earphone Headset
3 AC Adapter
4 WLAN AP
L1 Level 2 Micro Memory Card with Diag.
5 HTC design DCT-000111
test program (need be encoded by HTC)
6 Unit current consumption test fixture HTC design MLT-00001
7 Generic Product Battery Holder HTC design MLT-00017
8 Mobile tester
1 Opening tool HTC special tools RTT-00006
2 GPS antenna cover disassembly tool HTC special tools RTT-00104
3 0.15 mm steel strip HTC special tools RTT-00094
4 Camera module disassembly tool HTC special tools RTT-00090
L2 5 Hand tools (Torx, philips screw drivers)
6 Air gun
7 Oven
8 Label printer (400Dpi resolution and
above)
1 Lead-free Soldering station
L 2.5
2 Air heater

HTC CONFIDENTIAL 18
IS-5344-01-R1
 2.2 Disassembling procedure
Tools needed for Assembling and
Disassembling the device:

1. Torx screw-driver T5
2. Phillips screw-driver# 00
3. Opening tool (P/N: RTT-00006)
4. Cleaning cloth
5. Plastic tweezers
6. ESD wrist strap.

7. Oven for rework purpose

8. Camera dissemble fixture

(P/N: RTT-00090)

9. GPS antenna cover disassembly tool

(P/N: RTT-00104)

Take out the battery cover by following

direction of the arrow.

HTC CONFIDENTIAL 19
IS-5344-01-R1
 Remove the battery.

Remove the phone cover from the

device.

1. Insert the disassembly tool into the

device that indicated as photo shown
and push up the GPS cover first.
2. Use the opening tool to remove the
GPS cover from the housing carefully.

HTC CONFIDENTIAL 20
IS-5344-01-R1
 Insert the disassembly tool of GPS
cover by following the direction.

Please be careful and prevent to

damage the RF springs of the
Note upper board and Bluetooth
coaxial cable

Loosen 5 screws from the housing at

the location indicated with Torx
screw-driver T5.

Remove the LCD FPC frame from the

housing.

Remove the agency label from the

device.

HTC CONFIDENTIAL 21
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 Remove the volume key from the
housing carefully.

Remove the housing.

Loosen 3 screws from the main board at

the location indicated with Torx
screw-driver T5.

Remove the PCB cover from the main

board.

HTC CONFIDENTIAL 22
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 Remove the Mylar from the SIM FPC
board.

Remove the LCD FPC sponge from the

main board.

Remove the LCD FPC Mylar from the

main board.

Disconnect the LCD FPC cable from the

main board.

HTC CONFIDENTIAL 23
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 Remove the coaxial cable frame from
the chassis.

Disconnect the cable from the main

board then remove the vibrator from the
chassis.

Remove the speaker from the upper

board carefully.

Remove the Mylar from the upper

board.

HTC CONFIDENTIAL 24
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 Disconnect the receiver cable from the
upper board.

Remove the receiver from the chassis

carefully.

Disconnect Bluetooth coaxial cable from

the upper board carefully.

Loosen 1 screw from the main board at

the location indicated with Phillips
screw-driver 00x40 then detach the
PCB cover from the upper board.

HTC CONFIDENTIAL 25
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 Remove the PCB cover from the upper
board.

Remove the camera cover by using

opening tool carefully.

Disassemble the main camera from the

upper board.

1. Hold the upper board by 
left hand and use the 
right hand to hold the 
camera disassembly 
fixture 
2. Insert the disassembly 
fixture into the camera 
Note socket and press down 
fully 
3. Disassemble the camera 
by using thumb and 
medius and must hold the 
bottom side of the fixture 
4. Remove the camera with 
vertical direction 

HTC CONFIDENTIAL 26
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 Disconnect the flash light cable from the
upper board.

Disconnect GPS coaxial cable from the

upper board.

Remove the SIM FPC Mylar from the

main board.

Disconnect the SIM FPC connector then

remove the SIM FPC from the main
board.

Do not damage the LCU2 IC

Note on MB as the location.

HTC CONFIDENTIAL 27
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 Remove the black Mylar from the upper
board.

Remove the coaxial cable tape from the

main board.

Loosen 2 screws from the housing at

the location indicated with Torx
screw-driver T5.

Remove the main board and upper

board from the chassis carefully.

HTC CONFIDENTIAL 28
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 Disconnect Bluetooth and GPS coaxial
cable from the main board.

Remove the Mylar from the main board.

Disconnect the upper board from the

main board.

Disconnect the flash light cable from the

main board.

HTC CONFIDENTIAL 29
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 Put the LCM+TW with bezel into an
oven for 10 minutes at 60 degree
Celsius.
Temperature and time:
Note 60℃ for 10 minutes

Use the steel strip of 0.15 mm to cut the

left and right sides of adhesive double
tape as photo shown.

Please be careful and slow to cut

Note the double side tape

Use the pliers to cut the right side of the

chassis.

Please be careful when cutting the

Note chassis and do not damage the
touch window

Cut the left side of the chassis.

Please be careful when cutting the

Note chassis and do not damage the
touch window

Use the opening tool to cut the adhesive

double side tape by following direction.

HTC CONFIDENTIAL 30
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 Use the opening tool to cut the adhesive
double side tape by following direction.

Please be careful when cutting the

Note adhesive double side tape and do
not damage the LCM FPC

Separate the LCM+TW module from the

chassis

Push out the LCM FPC from the chassis

and remove the LCM carefully.

To inspect the lamination tape, FPC

cables and light guide after disassembly
process.

Clean the adhesive double side tapes

as remark after disassembled the LCD
from the bezel.

The disassembly process is done

HTC CONFIDENTIAL 31
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 2.3 Assembling procedure
1. Remove the films of adhesive
tape from the chassis first.
2. Stick the Mylar onto the LCD FPC
cable.

P/N: 76H05683-00M

Stick the sponge onto the chassis

P/N: 76H06187-00M

Insert the LCM and touch window FPC

cables through the chassis first.

Press the LCM module and make sure it

is firmly to assemble into the chassis.

HTC CONFIDENTIAL 32
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 Stick the 2 Mylar tapes on the left and
right sides of chassis.

P/N: 76H06226-00M
76H06227-00M

Connect the flash light cable from the

main board.

P/N: 73H00363-00M

Stick the conductive tape onto the upper

board.

P/N: 76H06067-00M

Stick the Mylar on the upper board

P/N: 76H06186-00M

HTC CONFIDENTIAL 33
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 Connect the upper board into the main
board.

Stick the Mylar onto the main board.

P/N: 76H06046-00M

Put the main board and upper board

onto the chassis.

Wrap Bluetooth and GPS coaxial cables

together by using the Mylar tape.

P/N: 76H06045-00M

HTC CONFIDENTIAL 34
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 Connect Bluetooth and GPS coaxial
cables onto the main board.

P/N: 73H00364-00M (GPS)

P/N: 73H00365-00M
(Bluetooth)

Fasten 2 screws into the cassis at the

location indicated with Torx screw-driver
T5.

P/N: 72H03746-00M*2
Torque: 0.8+/-0.1kgf-cm2

Stick the coaxial cable tape onto the

main board.

Stick the black Mylar from the upper

board.

P/N: 76H05599-00M

HTC CONFIDENTIAL 35
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 Connect the LCD FPC cable into the
main board.

Make sure the LCM board to

Note board connector is securely
connected with main board

Connect the SIM FPC connector then

remove the SIM FPC from the main
board.

P/N: 83H00348-00

Stick the SIM FPC Mylar onto the main

board.

P/N: 76H06048-00M

Connect GPS coaxial cable into the

upper board.

HTC CONFIDENTIAL 36
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 Connect the flash light cable into the
upper board.

P/N: 73H00363-00M

Assemble the main camera from the

upper board.

The camera’s hook need to

Note meet the gap of socket

P/N: 54H00365-00M
Stick the Mylar onto the camera module.

P/N: 76H06204-00M

Attach the camera cover by using

opening tool carefully.

P/N: 72H03737-00M

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 Attach the PCB cover onto the upper
board.

P/N: 71H03477-00M

Fasten 1 screw from the main board at

the location indicated with Phillips
screw-driver 00x40.

P/N: 72H04182-00M
Torque: 1.0+/-0.1kgf-cm2

Connect Bluetooth coaxial cable into the

upper board.

Attach the receiver into the chassis.

P/N: 36H00838-00M

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 Connect the receiver cable into the
upper board.

Stick the Mylar onto the upper board.

P/N: 76H06052-00M

Attach the speaker into the upper board.

P/N: 36H00848-00M

Stick the sponge onto the BT coaxial

cable connector

P/N: 76H06577-00M

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 Put the vibrator into the chassis by
following the sequence

Make sure the BT/WLAN

Note coaxial cable does not interfere
with the vibrator

Connect the vibrator cable into the main

board.

P/N: 36H00840-00M

Attach the coaxial cable frame onto the

chassis.

P/N: 72H04695-00M

Stick the Mylar onto the SIM FPC board.

P/N: 76H06180-00M

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 Stick the LCD FPC Mylar onto the main
board.

P/N: 76H06053-00M

Use the tweezers to stick the extra

gasket inward (adhesive against
adhesive).

Stick the sponge onto the coaxial

cables.

P/N: 76H06366-00M

Stick the LCD FPC sponge onto the

LCD FPC Mylar.

P/N: 76H06143-00M

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 Attach the PCB cover onto the main
board.

P/N: 74H01967-00M

Fasten 3 screws from the housing at the

location indicated with Torx screw-driver
T5.

P/N: 72H04777-00M*3
Torque: 1.0+/-0.1kgf-cm2

Inspect the lens of IR emitter and

P-sensor before assemble the housing.

Please do not scratch the

Note surface of lens.

1. Insert the device into the housing

carefully as the photo shown.
2. Do not damage the area of lens
when you assemble the chassis and
housing.
If you found the function of
P-sensor failed please follow
the actions to inspect:
Note 1. Clean the contamination
or dust on the lens
2. Inspect any stick material
around P-sensor

HTC CONFIDENTIAL 42
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 Attach the housing.

P/N: 74H01815-00M

Insert the volume key into the chassis

carefully.

Stick the battery Mylar onto the chassis.

P/N: 76H06146-00M

Stick the agency label into the chassis.

P/N: 77H00988-00M

Attach the LCD FPC frame onto the

housing.

P/N: 72H04864-00M

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 Fasten 5 screws onto the housing at the
location indicated with Torx screw-driver
T5.

P/N: 72H04712-00M *4

P/N: 72H02986-01M *1
Torque: 1.2+/-0.1kgf-cm2

Attach GPS cover into the housing

Attach the phone cover into the device.

P/N: 37H00364-00M

Attach the battery into the device.

P/N: 35H00141-xxM

Attach the battery cover into the

housing.

P/N: 37H00341-00M

Assembly procedures completed

The assembly procedure is done. You may perform the function test or the
following process.
HTC CONFIDENTIAL 44
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 2.4 Repair or assembly tips
„ Disassembly notice for LCM+TW module:

Once disassemble LCM+TW module, need to follow the direction to separate the LCM from
Tip the chassis. Prevent to damage the LCM FPC during disassembly process.

„ LCM FPC assembly sequence:

Then connect the SIM FPC board

Connect the LCM FPC
to prevent the LCM connector
into the main board first
loose due to interference

Tip Notice the assembly sequence of LCM FPC and SIM FPC board.

HTC CONFIDENTIAL 45
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 2.5 Unit label location explanation

HTC CONFIDENTIAL 46
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3. ROM Re-flash Procedure

3.1 Latest ROM version inquiry

Enter RMAIII system

I. Enter HTC RMAIII system:

https://rma.htc.com.tw/rmaiii/home/index.
asp
II. Select the “ROM Version Inquiry” from
left column.

Select model & P/N

III. From ROM Version Inquiry to select

the model and part number.

Check the latest OS version

IV. Check the latest OS and GSM version

from Rec. column.

HTC CONFIDENTIAL 47
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 Compare with the device version

V. Check the device ROM version.

(Settings > About phone > Software
information.)

VI. Compare with the device ROM and

GSM version to RMAIII.
VII. Only needs to perform ROM code
re-flash when there is newer ROM
version on SDO
VIII. If the device ROM version is older than
RMAIII, need to follow the next chapter
to upgrade ROM code.

HTC CONFIDENTIAL 48
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 3.2 ROM upgrade thru RUU (Re-flash Upgrade Utility)
Connect device to PC

IX. Install the correct PC driver for your

Android phone.
X. Connect your device to your PC or
laptop via USB cable.

XI. Make sure the Windows device

manager recognizes the Android phone
when the device is connected.

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 Download ROM Image from SDO

I. Download OS image from SDO.

http://htcscm10.htc.com.tw/SDO
II. Un-zip the file and execute the RUU
program.

Do not interact with your Android

Note phone unless the RUU wizard
instructs you to do so.

RUU - 1

III. On the Welcome screen, select the “I

understand…” checkbox.
IV. Click “Next” to begin the RUU installation.

RUU - 2

V. Read the pop-up message form ROM

update utility to follow and perform the
instructions and select the “I completed…”
checkbox.
VI. Click “Next” to proceed.

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 RUU - 3

VII. Current image version confirmation.

VIII. Click “Update” to proceed.

RUU - 4

IX. Double confirm the ROM version which

you want to update before the re-flash
procedure.
X. Click “Next” to proceed.

RUU - 5

XI. Read the information from pop-up

message and the ROM update
procedure will takes about 10 minutes
long.
XII. Click “Next” to proceed.

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 RUU - 6

XIII. You can see the update progress from

your PC and in your device.

RUU - 7

XIV. The ROM update has been completed,

click “Finish” to close the utility.

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 3.3 Rom Image upgrade thru SD card
Download ROM Image from SDO

I. Download the latest version of ROM image

from SDO.
https://rma.htc.com.tw/rmaiii/home/index.asp
II. Unzip the file into the folder.

Format SD card and copy image file to SD card

III. Select file system and format the SD card to

FAT32 mode.
IV. Copy image file XXX.zip to the micro SD
card and rename to PD98IMG.zip.

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 SD Upgrade – 1

V. Turn the device power off and insert

Diagnostic SD card.
VI. Press and hold Volume down + Power
button and then release the power button
to enter to the Boot loader mode.
VII. Press Volume up button to start the
update procedure.

SD Upgrade – 2

VIII. Reading source code from SD card.

[Note]: This process will takes about 10
minutes, please don’t power off the device.
IX. After finish, press Volume up button to
reboot.

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4. DIAGNOSTIC PROGRAM
Test item list
# Feature Name Bootloader Diag. OS mode test Option
1 Display V
2 Touch Panel V
3 Button V
4 Backlight V
5 LED V
6 Speaker Play V
7 Receiver Play V
8 Headset Play V
9 Int-Rec Int-Play V
10 Ext-Rec Ext-Play V
11 Vibrator V
12 Storage Card V
13 WIFI V
14 Bluetooth V
15 GPS V
16 G-Sensor V
17 Compass V
18 FM Radio V
19 Stylus Sensor NA NA NA
20 Main Camera V
21 2nd Camera NA NA NA
22 Auto Focus V
23 Charger V
24 ActiveSync NA NA NA
25 HTC Sync V
26 Cap-Sensor NA NA NA
27 Noise suppression NA NA NA
28 Proximity Sensor V
29 WiMAX NA NA NA
30 RF(2G/3G/CDMA..) V
31 Draw Line NA NA NA
32 QWERTY Keyboard NA NA NA
33 Headset Button V
34 Mega SIM NA NA NA
35 Zoom Bar NA NA NA
36 Slide NA NA NA
37 Checksum V

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 38 Battery rundown V
39 Light sensor V
40 RAM V
41 Flash light V
42 Optical Joystick NA NA NA

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Test Procedure
How to select test item: Using navigation button -"Up" or "Down" to select the test items
How to execute the test program: Press “Action” button to start each of test items.

Diagnostic
Download the latest Diagnostic from RMAIII system

I. Enter HTC RMAIII system:

https://rma.htc.com.tw/rmaiii/home/index
.asp
II. Select the “Model” to download the latest
version of Diagnostic.

Main Menu/Function Test Menu

I. Turn the device power off and insert
Diagnostic SD card.
II. Press and hold Volume Down button,
including Power button, and then enter
Diagnostic mode.
III. Using to select the test item and move to
next page as well.
IV. Select item “Function Test” to find the
Function test menu.

LCD Test -1 (RED/ GREEN/BLUE pattern)

I. Press volume key to select LCD Test on
Function test menu.
II. After the test pattern is show up, please
check the pattern if any un-uniform color
or chromatist.
III. Press menu key to continue the next test
pattern.

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 LCD Test -2 (WHITE/BLACK pattern)

IV. Press menu key to continue the next test

pattern.

LCD Test -3 (Character/Gray Scale/Color Bar )

V. Press menu key to continue the next test

pattern.

TP Test

I. Press volume key to select TP Test on

Function test menu.
II. Use your finger to touch on the screen to
perform the touch panel test.

Flashlight Test

I. Press volume key to select Flashlight

Test on Function test menu.
II. Press power key to exit and return to
Function test menu.

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 SD Test

I. Press volume key to select SD Test on

Function test menu.
II. Press power key to exit and return to
Function test menu.

Vibrator Test

I. Press volume key to select Vibrator Test

on Function test menu.
II. Press power key to exit and return to
Function test menu.

Backlight Test

I. Press volume key to select Backlight Test

on Function test menu.
II. Press power key to switch the LCD
brightness level from Level 10, Level 50,.
III. Press power key to exit and return to
Function test menu.

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 Key Test

I. Press volume key to select Key Test on

Function test menu.
II. Follow the instruction on screen to
perform the Key test
(Power, Volume up, Volume down, home,
menu, back, search).
III. The screen will return to Function test
menu after the test is finished

LED Test

III. Press volume key to select LED Test

IV. If success, press power key to exit and
return to Function test menu.

ROMCHKSUM Test
I. Press volume key to select ROM
checksum Test on Function test menu.
II. The Rom Checksum will be displayed on
the screen.
III. Press power key to exit and return to
Function test menu.

Battery Run Down Test

I. Select Battery Run-down Test on
Function test menu and press Action
button to start.
II. Press action key to perform the Battery
Run-down test.
III. Check the battery percentage capacity
after one hour, if lower or equals than
62% it means the battery is NG.

You must charge the battery till full

Note
(100%) before perform this test.
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 Light Sensor Test

I. Press volume key to select Light Sensor

Test on Function test menu and follow the
display.
II. Press power key to exit and return to
Function test menu.

G Sensor Test

I. Put the unit on a horizontal and flat

table when perform this test.
II. Press volume key to select G-Sensor Test
on Function test menu.

Compass Test

I. Press volume key to select Compass Test

on Function test menu.

Proximity Test

I. Select Proximity Test on Function test

menu and press Action button to start.
II. Prepare a stack (to make sure it is
non-transparent) of white printing paper.
III. Cover the proximity sensor on the
top-right hand corner of the device.
IV. The proximity sensor must be active
when the stack of paper is ≤3 cm from the
touch window.
V. The proximity sensor must be inactive
when the stack of paper is >15 cm from
the touch window.
VI. Uncover the proximity sensor.
VII. Press power key to exit and return to
Function test menu.

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 MPVER Test

I. Press volume key to select MPVER Test

on Function test menu.
II. Press power key to exit and return to
Function test menu.

Headset Audio Loopback Test

I. Press Volume key to select Headset

Audio LB status on Function test menu.
And then plug-in headset for audio
loopback test
II. Press power key to exit, return test menu.

Speaker Audio Loopback Test

I. Press Volume key to select Speaker

Audio LB on Function test menu. And then
talk through the unit microphone, you
should hear the sound from the speaker.
II. Press power key to exit and return to
Function test menu.

Receiver Audio Loopback Test

III. Press Volume key to select Receiver

Audio LB on Function test menu. And then
talk through the unit microphone and you
should hear the sound from the receiver.
IV. Press power key to exit and return to
Function test menu.

SDRAM Test

I. It will perform the SDRAM test after

entering diagnostic mode automatically,
and then it will return to main menu once
finish the testing without any failure as
picture.

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OS Mode Test
USB Test

I. Insert USB cable and connect your

device to computer then choose
Notifications from the Menu. Select
mount if you want to copy and manage
the SD card storage from your computer.
(Press Menu > Notifications >
USB connected > Mount)

Camera and auto focus Test

I. Before camera testing, please insert the
SD card into device in advance.
II. Tap the application tab and press
Camera icon to turn on the Camera.
III. Make sure the device will present and
enter the preview display.
IV. Check camera pre-view and image
quality.
V. Photo Test:
(1). Press the trackball button to enable
the auto focus function and take the
photo.
(2). Check camera pre-view and image
quality is clear after camera shot.

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 (3) Download and print the HTC Camera
Test Chart for testing. (DOC-00087536)
https://rma.htc.com.tw/rmaiii/home/index.asp

Bluetooth Test- BT Headset

I. Press Menu button.
II. Tap the icon “Settings”.
III. Select Wireless controls, and then
select the Bluetooth check box to
turn on Bluetooth services.
IV. Select Bluetooth settings and then
tap Scan for devices. To pair with a
device in the list, select it.
V. Once the other Bluetooth device
shows “connected” status, you can
start using it to make and receive
phone calls.
Charger Test
I. Turn on the device and insert the AC
adaptor into the USB connector.
II. The Charging sign will be appear on
the turn on mode. If you see the
Charging sign, the charger is Charging is indicated by a solid amber light in the
functional. Notification LED. As the battery is being charged while the
phone is on, the charging battery icon ( ) is displayed in
the status bar of the Home screen.

After the battery has been fully charged, the Notification

LED shows a solid green light and a full battery icon ( )
displays in the status bar of the Home screen.

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 FM Radio Test

I. Insert the headset into the audio

jack connector before doing the
testing.
II. Tap icon FM Radio in the
programs of the menu.
III. Select the different channels for
testing.

WLAN Test
I. Press HOME > MENU, and
then touch Settings > Wireless
controls.
II. Select the Wi-Fi check box to
turn Wi-Fi on. The phone will
scan for available wireless
networks.
III. Touch Wi-Fi settings. The
network names and security
settings (Open network or
Secured with WEP) of
detected Wi-Fi networks are
displayed in the Wi-Fi
networks section.

IV. Touch a Wi-Fi network to

connect.
V. When you selected an open
network, you will be
automatically connected to the
network. If you selected a
network that is secured with
WEP, enter the key and then
touch Connect.
VI. Connect to the internet via
Wi-Fi network.

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 GPS Test

I. Disable “Airplane mode”

II. Press Menu button and tap the icon “Settings”.
III. Select “Location”.
IV. Enable GPS satellites (“Use wireless
networks” option must be disable)

V. Tap the application tab and press the Maps

icon to enter to the Google Map.

Note: The GPS test should be performed in the

out-door with open sky & static condition or in-door
with extended GPS Antenna.

VI. Your location should be shown on the map

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 4.1 Rewrite Unit S/N to Device via ASP_PC_Agent
The below is procedure guide you how to rewrite unit S/N into the device after changed
the MB for unit repair via ASP_PC_Agent.

PC Environment Requirement:
-. ActiveSync 4.5 or above
- .NET framework 2.0
Download and Install Software from SDO

I. Download “ASP_PC_Agent” from

SDO (GSD-00004089).
http://htcscm10.htc.com.tw/SDO
II. Un-zip the file and execute the
program to install.
III. Reboot the PC after installed.

Disable USB connection in Microsoft ActiveSync

IV. Disable USB connections in

Microsoft ActiveSync.

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 Execute ASP_PC_Agent

V. Execute ASP_PC_Agent and login

by specific FT/1 account and
password or use “test” to skip.

Account: test
Password: test

Enter Diagnostic Mode

I. Insert Diagnostic SD card.

II. Press and hold Volume Down
button, including Power button, and
then enter Diagnostic mode.

Execute “Write Unit SN” in Diagnostic Mode

III. Press Volume Down to scroll to

“Write-UUTSN” and execute.

Connect the USB cable

IV. Connect the PC and Device by USB

Cable and Press “Action” Key to
write the Unit S/N.

HTC CONFIDENTIAL 68
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 Write Unit S/N

V. Write Unit SN to device.

VI. System auto exit and return to
Function test menu.

Check ASP_PC_Agent Status

VII. Check ASP_PC_Agent Status.

Note It should appear “Pass”.

Check Device Info

VIII. Using Volume Down button to

select the test item and execute
“Device Info” to check the UUT S/N
is matched with the regulation label.

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 4.2 Perform HW Calibration
The below is the procedure to calibrate light sensor with a pre-calibrated device treated
as golden sample. Please make sure to re-calibrate a device whenever it has been
disassembled.
Prepare golden sample

I. Prepare a ACE unit that had not

been disassembled before and use Golden
as golden sample.

Enter Diagnostic Mode

II. Insert Diagnostic card.

III. Hold Volume Down and press
Power button once to enter
Diagnostic mode.

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 Execute “Get Golden LS ADC” in Diagnostic Mode

I. Press Volume Down to scroll to

“Get Golden LS ADC” and execute.

II. Mark the position of the golden unit.

III. Make sure the lighting condition is
consistent.
IV. Follow the instruction on the screen
to reset the device.
V. Press Action button to begin.

VI. This Golden ADC value will be

stored onto the microSD card.
VII. Press Action to exit.

If the process shows Golden

ADC Value out of range, please
Note
use another device as the
golden sample unit.

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 Prepare repaired unit

I. Prepare a Vision unit that had been Repaired

repaired.

Enter Diagnostic Mode

II. Insert Diagnostic SD card.

III. Press and hold Volume Down
button, including Power button, and
then enter Diagnostic mode.

Execute “LSensor-Set LS ADC” in Diagnostic Mode

IV. Press Volume Down to scroll to “Set

LS ADC” and execute.

HTC CONFIDENTIAL 72
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 V. Follow the instruction on the screen
to reset the device.
VI. Place the repair unit where the
golden sample was in step V
VII. Make sure the lighting condition is
consistent with the golden unit in
step VI.
VIII. Press Power to begin.
IX. Do not move the device.

X. This device will be calibrated based

on the Golden ADC value stored on
the microSD card and the current
readings from the sensor.
XI. Press Power to exit.

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 P sensor calibration-1

I. Press volume key to select HW Calibration

on Function test menu.

P sensor calibration-2

II. Press volume key to select Write P sensor

to enter P sensor calibration.

P sensor calibration-3

III. Put the device into the bottom holder of

the fixture.
IV. Lock the top holder to secure the device
with the horizontal position.

P sensor calibration-4

V. Put the covering with 3cm height on the

fixture then performs the 1st calibration.

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 P sensor calibration-5

VI. Change the covering with 1.5 cm

height on the fixture then perform the
2nd calibration.

P sensor calibration-6

VII. Take out the covering from the fixture

then perform the 3rd calibration.

P sensor calibration-7

VIII. This device will be calibrated

automatically.
IX. Press Power to exit.
Do not touch or move the phone
during the calibration process.
Note
Perform the calibration again
once it shows error message.

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5. Power measurement test

5.1 Main board leakage current Test Procedure

This is a quick method to measure if any abnormal leakage current on main board which
caused high power consumption compare to GOOD main board.
Equipment list

1. Universal Leakage Current Tester

2. Four colors cable

Cable A: Red
Cable B: Yellow
Cable C: Green
Cable D: Black

3. Type I Jig (P/N: MLT-00017)

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 Equipment set up

1. Connect Universal Leakage Current

Tester and jig via four colors cable.

A 2. Set up each button by row A~D according

to product’s specification.

B Button set up matrix

MADEL JIG TYPE
A B C D

ACE Type I 0 8 1 0
C
It means, press button A0,B8,C1,D0
D

3. Install the jig to device

1. Base on the battery length to

adjust the extend bolster length.
Note 2. Adjusts the fixed pin to prevent
the device sway

HTC CONFIDENTIAL 77
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 Extend bolster

Start testing

1. Turn on control box power button.

2. Press Power button to turn on the Device.
(The picture is for example)

HTC CONFIDENTIAL 78
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 3. Check phone status, turn on “Airplane
mode”
Set the unit to :
* Airplane mode
* Make sure all RF function is off (phone, BT,
Wi-Fi…)

Idle current test 4. Measure idle mode current. The Idle

current value must under 85mA.
5. If over the criteria, it means M/B failed,
please replace M/B for repair.

Sleep current test 6. After idle current checked, switch OFF

the unit. Unit is turn off and no display.
Sleep current value must under 1 mA.
7. If over the criteria, it means M/B failed,
please replace M/B for repair.

Conclusion:

If current consumption is passed at both of idle and sleep mode, it means M/B is GOOD.
If there is any item FAILED at idle or sleep mode, it means M/B is failed, please replace
M/B for repair.

Button set up matrix Testing Criteria

Model Jig Type
A B C D Idle Current <= Sleep Current <=
ACE MLT-00017 0 8 1 0 85 mA 1 mA
It means, press button A0, B8, C1, D0

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6. Cosmetic Inspection Criteria

6.1 Classes definition of inspective area

¾ Class A area => The front side of main unit involve all buttons, Wheel, and LED Lens, except LCD.

¾ Class C area => 4 sides and back views of main unit include volume key, SD door and stylus.

¾ Class D area => Socket of battery, inner side of battery cover, Antenna, and battery connector.

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 Description
¾ D: Diameter / L: Length / W: Width / N: Number of defects/ S: Distance from dot to dot
¾ Inspecting distance: 30 ± 5cm / Mechanical inspection angle：90 degrees /
¾ LCM inspection angle：90±15 degrees / Inspection time: 5 secs per surface.
¾ Ambient illumination is to be 500-1100 Lux
¾ The inspection condition of Newton ring:
1. Inspection distance: 30cm / Inspection time: 5 sec
2. Ambient illumination is to be 500-1000 Lux (Incandescent lamp)
3. Inspection should be performed under the condition that LCD screen could reflect the mirror
image of lamp.
4. The criteria of Newton ring’s tinges and measure of area must follow up the worst-case sample.
5. The area of Newton ring:
For less than 2.8 inch LCM, the area is smaller than 7*7 square mm

For 2.8 to 7 inch LCM, the area is smaller than 10*10 square mm

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 6.2 Display inspection
Inspection Defects Accept Level Level

Total Number ≦ 2; 0.1mm< D≦0.2mm

Single Total Number ≦ 1; 0.2mm< D≦0.3mm Minor
Bright Dots Total Number ≦ 0; 0.3mm< D

2 adjacent 0 Minor
LCM QVGA type：
characteristic Total Number ≦ 2; S > 5mm.
inspection Single Minor
Dark Dots VGA type：
Total Number ≦ 4; S > 5mm.
Method:
Visual 2 adjacent 0 Minor
inspection
Dark or Bright lines 0 Minor
Condition: QVGA type：
LCM switch on Total Number ≦ 3;S > 5mm.
Minor
All Allowable Dots Defects VGA type：
Total Number ≦ 5;S > 5mm.
The black edge around display area must
Shift and tilt of screen viewed area Minor
be detected by front view.

0.03 < W ≦ 0.1 (mm)

Scratch Minor
L ≦ 5 (mm)N ≦ 2

LCM appearance
inspection 0.03 < W ≦ 0.1 (mm)
Minor
Lint (linear foreign objects) 0.3 < L ≦ 3.0 (mm) N ≦ 5
Method:
Visual
inspection Spots 0.1 < D ≦ 0.3 (mm) N ≦ 4 Minor

Condition: Fish eye on film 0.1 < D ≦ 0.4 (mm) N ≦ 4 Minor

LCM appearance
Breakage on film surface Not acceptable Minor

Total acceptable defect quantity ≦ 10 Minor

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 6.3 Main unit inspection
Gap inspection
Description Accept criteria
Can’t stuck up or no click feeling
1. Gap between each key and ME parts It couldn’t allow stuck up at pressing process.
2 The gap between the phone cover and the housing 0mm≦Gap≦ 0.2mm
3 Others, refer to production release spec Others, refer to production release spec

Description Accept criteria

6-1 The gap between the Battery cover and
The gap between the Battery cover housing ≦0.3mm
and housing

6-2 The gap around the AP key The gap around the AP key≦0.3mm

6-3 The gap between the Front bezel The gap between the Front bezel and housing
and housing (中框) (中框)≦0.2mm

6-4 The gap around the USB connector The gap around the USB connector≦0.3mm

6-5 The gap between the TW and AP The gap between the TW and AP key≦0.3mm
key

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6-6 The gap around the stylus The gap around the stylus≦0.2mm

6-7 The gap between the TW and the The gap between the TW and the
housing housing≦0.3mm

6-8 The gap between the X-tracker and The gap between the X-tracker and front
front bezel bezel≦0.4mm
6-9 The gap between Number key and The gap between Number key and qwerty key
qwerty key with housing with housing≦0.25mm
6-10 The gap between the Jog ball and The gap between the Jog ball and
housing housing≦0.3mm

Step inspection
Description Accept criteria
1. The step between the TW and Chassis -0.2mm≦(Step)≦0mm
The step between the housing and the phone cover Central area:
-0.2mm≦(Step)≦0.2mm
2.
Left & Right sides:
-0.25mm≦(Step)≦0.25mm
3-1 The step between the chassis and the housing -0.1mm≦(Step)≦0.1mm
3-2 The step between the GPS cover and the housing -0.15mm≦(Step)≦0.2mm

Scratch
Description Accept criteria

Exposure of substrate do not accept MI

Class A
Scratch : L≦4mm ,W≦0.2mm ,N≦2, S≧10mm

MI
Exposure of substrate do not accept
Scratch : L≦7mm ,W≦0.25mm ,N≦3, S≧10mm

Class B If IR window has scratch without any effective feeling then

don’t care

IR window scratch: L≦3mm,W≦0.2mm,N≦3

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 Label area don’t care
Class C Exposure of substrate do not accept MI
Scratch : L≦10mm ,W≦0.4mm ,N≦5, S≧5mm

Contamination dot/Granule dot/Cave granule

Description Accept criteria

D≦0.5mm ,N≦2,S ≧15 mm

Class A MI
( Ignored if D≦ 0.15mm )

Total: D≦0.6mm ,N≦4,S ≧15 mm

Class B MI
( Ignored if D≦ 0.25mm )

D≦0.9mm ,N≦4,S ≧10 mm

Class C MI
( Ignored if D≦ 0.25mm )

Burr….etc.

Description Accept criteria

Burr. Don’t accept hand scrape

MI

Bright mark

Description Accept criteria

L≦2.5mm,W≦0.25mm,N≦3 MI
Class A
L≦3.0mm,W≦0.25mm,N≦4 MI
Class B

Class C L≦3.0mm,W≦0.3mm,N≦5 MI

Lint

Description Accept criteria

MI
Class A L≦3mm , W≦0.2mm ,N≦2, S ≧5 mm

L≦5mm , W≦0.3mm ,N≦3, S ≧5 mm MI

Class B

Class C L≦10mm , W≦0.3 mm ,N≦3 MI

This definition is not applicable to LCM.

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7. Generic Spare Part List and Photos

7.1 SPL for Repair

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 THE PHOTO OF SPL IS GENERIC AND ONLY FOR REFERENCE, THE COLOR AND
APPEARANCE MAY BE DIFFERENT FROM THE SHIPPED PARTS, IF YOU WANT TO
APPLY THOSE PARTS, PLEASE CONTACT YOUR SERVICE ACCOUNT MANAGER FOR
MORE INFORMATION.
Note AS FOR PICTURE, PLEASE REFER TO THE TABLE AS BELOW.

FOR REFURBISHMENT PARTS, THE TABLE IS FOR YOUR REFERENCE. YOU CAN DO
THE REFURBISHMENT ONLY WHEN YOUR SERVICE MODEL IS ALLOWED TO DO THE
REFURBISHMENT.

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 7.2 Board Level 2.5 Repairs
„ Basic Repair Instructions for Component Replacement:
Step 1 Place the solder-proof tape to cover the surrounding area of the components which being replaced.

DO NOT overheat the tape and components to avoid the tape melted and the
CAUTION components damaged

Step 2 Use Heater Gun (HAKO850B, set the temperature between 350°C, Air Speed 3~5) to remove the
components.
Step 3 Wait till the temperature cool down before removing the solder-proof tape to avoid other components
being removed
Step 4 After the damaged or defective components have been replaced; clear the surroundings for solder
and flux residues.
Notice:
A. Checking the polarity of CON8, and the position can't be shifted.
B. Checking the polarity of SW8、SW7, and it can't be reversed.
C. All the parts of the PCB should be checked if it is missing or not.
D. The OP must to wear antistatic wrist band .Don't put boards together and avoid hitting them.
E. When you solder and repair that the soldering iron ,temperature must be setup 415℃. (The
temperature range is 415℃±5℃),and the solder wire's diameter is 0.4/0.5/0.6mm(SAC 305 (1.1%)
F. Please be noticed to follow below steps for main board repair which is equipped with Golden
Capacitor:
1. When replacing level 2.5 components located around the golden capacitor:
I. The temperature of the hot air blower must be under 400°c
II. When apply the hot air to the part / component, the heating time must be under 20
seconds (including the time of removing and soldering)
III. The temperature of the soldering iron must be under 350°c
IV. When apply the solder tip to the part / component, the heating time must be under 5
seconds
V. The solder tip must not contact with the golden capacitor
2. For BGA replacement: The golden capacitor must be removed before perform pre-heating,
heating, soldering and de-soldering process, and then it must be replaced with a new one
(please refer to 1.c. and 1.d. steps)
3. For main board which failed to pass the function test, the golden capacitor must be replaced
with a new one and must follow below soldering criteria: The temperature of the soldering iron
must be under 350°c When apply the solder tip to the part / component, the heating time must
be under 5 seconds The solder tip must not have a contact with the body of golden capacitor.

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 51H40613-XXM PCBA-MAIN BOARD(Side A)
Location P/N Description Q'ty Description

MAM2 75H00934-00M Connector B to B,90mohm,60P,0.4Pirch,0.3A,60V 1 LCM connector

GPS/Bluetooth
RGM3,
75H00825-00M Connector RF,4P,W.FL2-R-SMT-1(74),HIROSE 2 coaxial cable
RWM1
connector
PAM2 75H00897-00M Connector Device,4P,2.8Pitch,60mohm,2A,12V 1 Battery connector

Connector B to SIM/SD FPC

MAM4 75H00720-00M 1
B,1000mohm,20P,0.4Pitch,AXT3CN164BP1,0.3A,60V connector

PAM3 75H00228-02M Connector B to C,2P,0.8Pitch,0.5A,30V,40mohm 1 Vibrator connector

SIDE A PHOTO AND COMPONENT LOCATION

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 51H40613-XXM PCBA-MAIN BOARD(Side B)
Location P/N Description Q'ty Description
PAC65 16H00012-01M Gold Cap,0.02F,3.3V 1 Gold cap

AAU1 36H00783-00M Microphone,KNOWLES,SPU0410HR5H-PB 1 Microphone

AAM1 36H00832-01M Audio Jack,T-MEC,NJP018-D5AA-3602XH 1 Audio jack connector

MAM67 75H00979-00M Connector B to C ,30mohm,4P,0.6Pitch,0.2A,30V 1 Flash light connector

MAM1 75H00873-10M Connector I/O,5P,0.65Pitch,Reverse Type, FOXLINK 1 Micro USB connector

MAM5, Rigid-Flex board

75H00941-00M Connector B to B,90mohm,50P,0.4Pitch,0.3A,60V 2
MAM6 connector

SIDE B PHOTO AND COMPONENT LOCATION

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 7.3 FRU M/B additional parts location
P/N Description Qty
76H06054-00M Tape, main board-EMC25,conductive tape+mylar 1
76H06047-00M Tape,shielding bottom-EMC22,conductive tape+mylar 1

76H06047-00M
76H06054-00M

Black Mylar is in
top side

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8. RF Antenna Specification
ACE WCDMA Antenna Test Specification
Item Test Name TX Level Uplink / Downlink UA RF CN 1st Downlink cell power note
Camp@ W-CDMA
1 3 9613 / 10563 -60
Band ( 2100 )
2 BS Originate Cell 3 9613 / 10563 -60
Receiver Test
3 Fast Bit Error Rate 3 9613 / 10563 -104

4 Fast Bit Error Rate 3 9750 / 10700 -104 ≦ 0.1 %

5 Fast Bit Error Rate 3 9887 / 10837 -104

Transmitter Test
6 TX Power 3 9613 / 10563 -60
7 TX Power 3 9750 / 10700 -60 ≧18 dbm
8 TX Power 3 9887 / 10837 -60
ACE WCDMA Antenna Test Specification
1st Downlink cell
Item Test Name TX Level Uplink / Downlink UA RF CN note
power
Camp@ W-CDMA
1 3 2712 / 2937 -60
Band ( 900 )
2 BS Originate Cell 3 2712 / 2937 -60
Receiver Test
3 Fast Bit Error Rate 3 2712 / 2937 -104
4 Fast Bit Error Rate 3 2788 / 3012 -104 ≦ 0.1%
5 Fast Bit Error Rate 3 2863 / 3088 -104
Transmitter Test
6 TX Power 3 2712 / 2937 -60
7 TX Power 3 2788 / 3012 -60 ≧18 dbm
8 TX Power 3 2863 / 3088 -60

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 ACE GSM Antenna Test Specification
Item Test Name TX Level TCH 1st Downlink cell power note
1 Wait_Signal 0 600 -65
2 Power_Class 0 600 -65
PCS 1900 Receiver Test
Fast Bit Error
3 0 512 -104
Rate
Fast Bit Error
4 0 661 -104 ≦ 2.44 %
Rate
Fast Bit Error
5 0 810 -104
Rate
PCS 1900 Transmitter Test
6 TX Power 0 512 -65
7 TX Power 0 661 -65 ≧24 dbm
8 TX Power 0 810 -65
EGSM 900 Receiver Test (For EU SKU)
Fast Bit Error
9 5 975 -104
Rate
Fast Bit Error
10 5 38 -104 ≦ 2.44 %
Rate
Fast Bit Error
11 5 124 -104
Rate
EGSM 900 Transmitter Test (For EU SKU)
12 TX Power 5 975 -65
13 TX Power 5 42 -65 ≧28 dbm
14 TX Power 5 124 -65
DCS 1800 Receiver Test
Fast Bit Error
21 0 512 -104
Rate
Fast Bit Error
22 0 698 -104 ≦2.44 %
Rate
Fast Bit Error
23 0 885 -104
Rate
DCS 1800 Transmitter Test
24 TX Power 0 512 -65
25 TX Power 0 698 -65 ≧26 dbm
26 TX Power 0 885 -65

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