To achieve broad impedance bandwidth and wide CP bandwidth, several CP antenna arrays, such as

the patch antenna array, slot antenna array, helical antenna array, and grid antenna array, were
designed in multilayer structures, using low temperature co-fired ceramic (LTCC) technology [3]-[9].
The LTCC manufacturing process has the advantages of high reliability, low line loss, and low
fabrication tolerance in designing RF components, including antenna

one major solution for industries is to achieve a low fabrication cost and low profile antenna.
Although the conventional printed circuit board (PCB) technology with single-layer structure and
easy fabrication can achieve low cost and low profile mm-wave antennas around 60 GHz, these
provide a narrow impedance bandwidth, compared with LTCC technology.

It is an inexpensive material whose frequency-dependent relative dielectric constant and high

dielectric loss have limited its use to frequencies less than 10 GHz. Therefore, the proposed antenna
array is printed on Teflon substrate (Taconic RF-30, εr = 2.9, and tan δ = 0.002 at 60 GHZ) by using
the single-layer conventional PCB manufacturing process, to provide low manufacturing cost and low
profile (0.05 λ0 at 60 GHZ). The broad impedance bandwidth (53.3-66.5 GHz) is achieved by using an
edge-coupled parasitic patch structure, and the broad CP bandwidth (55-66 GHz, axial ratio (AR) < 3
dB) is also achieved by using a novel series sequential rotation feeding network. A 4 x 4 element
patch antenna array is designed to obtain high gain (>12 dBic).

It consists of a 4 x 4 element array, and a novel series sequential rotation feeding network. To apply
the RF package application, and to measure the radiation pattern with a probe station, the feed
structure is designed and optimized by a coplanar waveguide (CPW) to microstrip (MS) transition.