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Conference Record of the 1996 IEEE International Symposium on Electrical Insulation, Montreal, Quebec, Canada, June 16-19,1996

Non Destructive Testing of High Volltage Cables by Non-Electrical Methods


Jean-Marie FOURMIGUI;
Electricit6 de France - Research and Development Division
BP no1, Route de Sens
F-77250 MORET SUR LOING - FRANCE

Abstract .- Today, many electrical methods such as partiall to search among the existing solutions for non-electrical and
discharges detection and high voltage breakdown tests yield non-destructive techniques able to detect defects.
fruitful information on the insulation quality and have been
performed by most manufacturers as quality control tests. We 1. DEFECTS TO BE DETECTED
have investigated the capability of conventional non-destructive
testing (NDT) methods to detect these defects just after processing, One has usually limited knowledge about defects that could
i.e., before the metallic shield and the polymeric jacket are added. cause a cable failure, for three reasons:
Three methods have been investigated : X-ray tomography,
ultrasonic testing and thermography. The three methods were Defects on cable are fortunately unusual and are often
tested on high voltage cables in which artificial defects were due to water penletration (problem which is not treated
previously inserted. These defects simulate voids and metallic here).
contaminants. The first step of investigations was carried on
defects with a size of at least 300 p.In this paper, the three When an electric breakdown occurs, the power
methods are first presented and discussed. Then, the results dissipated by the short circuit melts, and possibly
obtained are detailed as well as the possible applications of these vaporizes, the insulator. This destruction takes place
techniques for processing, quality control and qualification over an area much larger than the area of the defect.
purposes.
It is difficult to get some information about the nature,
INTRODUCTION frequency and harmfulness of defects generated by
cable production means.
Synthetic insulated high voltage cables require a high level of
reliability that is mainly provided by clean raw materials and Nevertheless, existing work can be used to estimate the severity
processing. In the past, many papers showed that impurities of some defects encountered on synthetically insulated cables
such as metallic or organic contaminants as well as voids and (see [1,2]). Most of these defects lead to the formation of
protrusions of the semiconductive shields are responsible for partial discharges that degenerate into an "electrical tree" and
premature failures of the insulation. Most of the cable cause breakdown. They act either by strengthening the local
manufacturers and even some utilities use tests to check the electrical field, or by forming a medium that facilitates
whole length of cable before energizing in the network. These discharges.
tests are generally high voltage tests which are either
destructive when breakdown occurs or non-destructive when The characteristics and size indicated in this article are related
partial discharges are detected. Sometimes, intensityholtage to discharges inception as, indicated in documents taken from
characteristics and loss tangent measurements can also help in the bibliography. However, larger defects can exist and, in
finding manufacturing defects that could lead to failure. some configurations, do not cause discharges or defects, at
least in the short term. This is why one may be interested in a
The aim is then to develop the necessary resources to satisfy technique capable of demonstrating defects even if they are
appraisal needs of the network operator. When a failure occurs larger than the given sizes.
(electrical breakdown of the insulation), the question arises as
to whether or not the line should be replaced. If the defect 1.1. Interface defects
causing the breakdown is unique, there is no need to suspect
the entire line and it is sufficient to reconnect the two ends. These defects may occur between the different layers forming
However, if inspection shows up a generic defect that is the insulation, either between the internal shield and the
repeated at regular intervals along the line, it may be necessary insulation, or between the insulation and the external shield. In
to replace the entire cable. Using the same tools, we may wish this case there is an adhesion defect between these layers linked
to use non-destructive testing methods to evaluate the quality to the extrusion phase or the chemical cross-linking operation
of equipment proposed by cable suppliers. In the very high (see Fig. 1). This volume is filled with gas, usually gaseous
voltage field (critical equipment in the electricity transmission products derived from the: decomposition of peroxide (cross-
network), NDT testing methods that are not used just now linking agent for XLPE insulated cable). It is assumed that this
could satisfy the zero defect requirement that are essential for type of defect can be dangerous for the insulation, if larger than
this type of equipment. The purpose of this research program is a critical size of 50 pm.
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Another type of interface defect is caused by protuberances in 2.1. X-ray Tomography
the shield material (semi-conductor composite) in the
insulation (see Fig. 1). This type of defect increases the field X-ray tomography is a non-destructive technique which allows
that may lead to the development of partial discharges. It is the observation of the internal part of the tested item. It is now
assumed that a protuberance with a radius of 100 to 200 pm is applied in many industrial fields. The principle relies on the
the critical size at which discharges occur for usual HV cable numerical recording of several X-ray cross sections of the item
electrical fields. Note that the shape of these defects does have (see Fig. 3). Each record corresponds to the density profile of
a major effect : an oblong shape form along the line of the the item. This record is repeated for a set of different angles
electrical field is worse for field enhancement. from 0" to 360". Then, the 2D image of the item cross section
is computed and generally displayed as a colored map showing
densities.
Interface defects (a) Protuberance of
shield into the
insulator (b)

Set of detectors

Fig. 1 : Examplesf interface defects

1.2. Solid or gaseous inclusions

This type of defects occurs in the bulk of the insulation. They Fig. 3 : Principle of tomography testing.
may be in the form of gaseous cavities (see Fig. 2-a) or solid
inclusions (see Fig. 2-b). For solid inclusions, there is a critical
size of about 50 pm for a metallic impurity, and 200 pm for a 2.2. Ultrasonic testing
dielectric impurity. A gaseous cavity larger than 50 pm is
known to be dangerous. When a high frequency (MHz) acoustic wave (ultrasonic)
propagates through a material and meets an other material
(change of acoustic impedance), then a reflection occurs and
Solid inclusion (b)
Gaseous cavity (a) part o f the wave is reflected and possibly detected. Considering
that principle, the ultrasonic testing can yield fruitful
information on the size, the shape and the location of internal
defects. Even large items can be tested and this is generally
easily performed. The principle of ultrasonic testing is
illustrated on Fig. 4.

transducer transducer
for emission for reception

M
Fig. 2 : Examples of defects inside the insulation

2. TECHNIQUES UNDER INVESTIGATION

Three techniques were tested on cables : X-ray tomography,


ultrasonic testing and thermography. Note that that these
techniques are widely used for medical purposes and are
respectively known as scanner, ultrasonography and
thermography. Whatever is their use, they are based on the
same physical principles which are briefly recalled below.
-
(Tested item
I
- Defect
I1
Fig. 4 : Principle of ultrasonic testing.

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2.3. Thermography to simulate defects, metallic wires were inserted and holes were
drilled as illustrated on Fig. 5 . These wires and holes range
Thermography consists in measuring the temperature at the from 0.3 mm to 1 mm diameter and were inserted at various
surface of a tested item. This is performed using a high locations :
precision infrared camera. In our case, a thermal wave is
generated through the cable and the temperature is recorded at the inner polyethyleneisemiconductive layer interface,
the outer surface. The occurrence of an internal defect leads to the middle ofthe insulation wall,
a perturbation of the thermal flow and then to local changes on
the surface temperature as illustrated on Fig. 5. 0 the outer polyethyleneisemiconductive layer interface.

isotemDerature CUmeS with defect-


Surface temperature :
without defect 4. RESUL,TS

4.1. Tomography

Several cross sections of the cable were performed under


different experimental conditions to best detect the artificial
defects. It appears that it is easier to detect metallic defects than
holes. The deeper in the insulation wall the defect is inserted,
the lower the sensibility of the method. At this stage of the
Variable source
program, it seems that a hole of 0.3 mm located near the core is
difficult to detect with this technique. At the opposite, it seems
possible to detect easfly smaller metallic inclusions. An
example of computed image for a cable drilled with 0.4 and 1
Fig. 5 : Principle of thermography testing. mm diameter holes is given on Fig. 6. The shadows located
near the core are due to tlhe presence of the metallic core and to
3. EXPERIMENTAL the image computation. The core was hidden for confidentiality
but one could see each wire separately.
cylindrical holes and rod

.........
t

Fig. 5 : Location of holes and rod into the insulation wall.

The tests were all performed on 20 cm to 30 cm long cable


samples. These have either copper or aluminum core (diameter
between 3 cm and 5 cm), they are polyethylene insulated Fig. 6 : Computed image of a cable drilled with 0.4 and 1 mm
(thickness around 2 cm), the PVC jacket and the metallic shield diameter holes.
were removed except the outer semiconductive layer. In order

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IX-ray tomography I Ultrasonic testing I Thermography
NDT Technique
Detection I 1 mm hole
0.3 mm hole
IYES
Difficultnear intemal shield
I YES
Difficult near internal shield
I NO
NO
I
1 mm rod YES YES NO
0.3 mm rod YES YES NO
Time for testing Long Short Very long
cost High Medium Medium

4.2. Ultrasonic testing surface. Due to very long thermal processes, the temperature
perturbation generated by the artificial defects is homogenized
The same type of cable with defects in the range 0.4 - 1 mm before it gets to the surface. It was also assumed than the outer
was submitted to an ultrasonic control. The results yield the semiconductive layer, whose thermal conductivity is much
conclusion that these defects give an echo and can be detected. higher than for polyethylene, could be responsible for this lack
As with tomography, the worst situation is a 0.4 mm hole of sensibility.
located near the core. A typical result is illustrated on Fig 7.
The upper scan is related to a cable without defect and the 5. DISCUSSION
lower corresponds to the insertion of a 0.4 mm hole.
This work shows that NDT techniques are able to detect defects
with sizes lower 1 mm and that 300 pm can not be considered
as a limit. It is evident that the detection limits depend on the
defect size and on its location in the insulation wall. The
sensibility of each technique also depends on the time available
to perform the testing and some are very time consuming.
Seal wthoul deied
These characteristics are summarized in Table 1.

CONCLUSION

Although preliminary, these results are very promising for


different purposes such as quality control and appraisal after
failure. Further work in that direction will be performed in
order to get better knowledge on the intrinsic limitations of
Scai Vmh a3 mn hole defect in the middle oftheitisolation wall these methods concerning applications to cables. Other
techniques will probably be tested and we are still searching for
new NDT techniques.

ACKNOWLEDGMENT

We thank J. Berdala from C2bles Pirelli for his kind


collaboration providing the cable samples.

Fig. 7 : Typical results of ultrasonic testing (hole 0.4 mm) REFERENCES


4.3. Thermography [ I ] Densley R.J., Bartnikas R., Bernstein B., (( Multiple Stress Aging
A thermal step was applied to the tested cable by heating the of Solid-Dielectric Extruded Dry-Cured Insulation Systems for Power
aluminum core at 80°C. The outer surface initially at room Transmission Cables )), IEEE Transactions on Power Delivery, Vol. 9,
temperature gets to more than 40°C. At the present time, it was No. 1, January 1994.
not possible to detect 1 mm diameter rod inserted near the
surface which was considered as the most suitable situation for [2] Fukuda T., ((Technological Progress in High Voltage Power
detection. It seems that the very high thermal resistance of Cables in Japan, Parts I and 11 n, Electrical Insulation Magazine,
polyethylene does not allow temperature changes to reach the Vol4., 1988, pp. 9-14 and pp. 15-20.

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