BYV32, BYVF32 & BYVB32 Series

Vishay Semiconductors
formerly General Semiconductor

Dual Ultrafast Rectifiers Reverse Voltage 50 to 200V

Forward Current 18A
Reverse Recovery Time 25ns

ITO-220AB (BYVF32 Series)

0.405 (10.27) 0.188 (4.77)
0.383 (9.72) 0.172 (4.36)
0.110 (2.80)
TO-220AB (BYV32 Series) 0.100 (2.54)

0.415 (10.54) MAX. 0.185 (4.70)

0.140 (3.56) 0.131 (3.39)
0.175 (4.44) DIA. DIA.
0.130 (3.30) 0.122 (3.08)
0.154 (3.91)
0.370 (9.40) 0.055 (1.39)
0.148 (3.74)
0.360 (9.14) 0.045 (1.14)
0.600 (15.5) 0.676 (17.2)
0.113 (2.87) 0.580 (14.5) 0.646 (16.4)
0.103 (2.62) 0.350 (8.89)
0.145 (3.68) 0.330 (8.38)
PIN
0.135 (3.43)
1 2 3
0.603 (15.32)
0.410 (10.41) 0.573 (14.55)
0.635 (16.13) 0.350 (8.89) 0.191 (4.85)
0.390 (9.91) 0.330 (8.38) 0.171 (4.35)
0.625 (15.87)
PIN 0.110 (2.80)
1 2 3 1.148 (29.16) 0.560 (14.22)
0.060 (1.52)
0.530 (13.46) 0.100 (2.54)
1.118 (28.40)
0.160 (4.06) PIN 1
0.110 (2.79) PIN 2
0.140 (3.56)
0.100 (2.54)
PIN 3
0.560 (14.22)
PIN 1 PIN 2 0.530 (13.46) 0.037 (0.94)
0.027 (0.69) 0.022 (0.55)
CASE 0.105 (2.67) 0.014 (0.36)
PIN 3
0.095 (2.41)
0.105 (2.67)
0.205 (5.20)
0.095 (2.41) 0.035 (0.90) 0.195 (4.95)
0.028 (0.70) 0.022 (0.56)
0.104 (2.65)
0.014 (0.36)
0.096 (2.45)
0.205 (5.20)
0.195 (4.95) TO-263AB (BYVB32 Series)
0.411 (10.45) 0.190 (4.83)
0.380 (9.65) 0.160 (4.06) 0.055 (1.40)
Mounting Pad Layout TO-263AB 0.045 (1.14)
0.245 (6.22)
0.42
(10.66)
MIN
K

0.33 Dimensions in inches 0.055 (1.40)

(8.38) and (millimeters) 0.360 (9.14)
0.047 (1.19)
0.320 (8.13) 0.624 (15.85)
0.63
1 K 2 0.591 (15.00)
(17.02)

0-0.01 (0-0.254)
0.110 (2.79)
0.090 (2.29)
0.037 (0.940) 0.021 (0.53)
PIN 1
0.08 0.027 (0.686)
(2.032) 0.014 (0.36)
0.12 PIN 2 K - HEATSINK
(3.05) 0.105 (2.67) 0.140 (3.56)
0.24
(6.096) 0.095 (2.41) 0.110 (2.79)
0.205 (5.20)
0.195 (4.95)

Features Mechanical Data

• Plastic package has Underwriters Laboratory Case: JEDEC TO-220AB, ITO-220AB & TO-263AB
Flammability Classification 94V-0 molded plastic body
• Dual rectifier construction, positive centertap Terminals: Plated leads, solderable per
• Glass passivated chip junctions MIL-STD-750, Method 2026
• Low power loss High temperature soldering guaranteed:
• Low forward voltage, high current capability 250°C, 0.16" (4.06mm) from case for 10 seconds
• High surge current capability Polarity: As marked Mounting Position: Any
• Superfast recovery times for high efficiency Mounting Torque: 10 in-lbs maximum
Weight: 0.08 oz., 2.24 g

Document Number 88558 www.vishay.com

26-Mar-03 1
BYV32, BYVF32 & BYVB32 Series
Vishay Semiconductors
formerly General Semiconductor

Maximum Ratings (TC = 25°C unless otherwise noted)

Parameter Symbol BYV32-50 BYV32-100 BYV32-150 BYV32-200 Unit

Maximum repetitive peak reverse voltage VRRM 50 100 150 200 V
Maximum RMS voltage VRMS 35 70 105 140 V
Maximum DC blocking voltage VDC 50 100 150 200 V
Maximum average forward rectified current at TC = 125°C IF(AV) 18 A
Peak forward surge current
8.3ms single half sine-wave superimposed IFSM 150 A
on rated load (JEDEC Method) per leg
Operating junction and storage temperature range TJ, TSTG –65 to +150 °C
(1)
4500
RMS Isolation voltage (BYVF type only) from terminals to (2)
VISOL 3500 V
heatsink with t = 1.0 second, RH ≤ 30% (3)
1500

Electrical Characteristics (T C = 25°C unless otherwise noted)

Parameter Symbol BYV32-50 BYV32-100 BYV32-150 BYV32-200 Unit

(4)
Maximum instantaneous forward voltage per leg at:
at IF = 20A VF 1.15 V
at IF = 5.0A, TJ = 100°C 0.85
Maximum DC reverse current per leg TJ = 25°C 10
IR µA
at rated DC blocking voltage TJ = 100°C 600
Maximum reverse recovery time per leg at
trr 25 ns
IF = 1A, VR = 30V, di/dt = 100A/µs, Irr = 10% IRM
Typical junction capacitance per leg at 4V, 1MHz CJ 45 pF

Thermal Characteristics (T C = 25°C unless otherwise noted)

Parameter Symbol BYV BYVF BYVB Unit

Thermal resistance from junction to case per leg RΘJC 1.6 5.0 1.6 °C/W

Notes:
(1) Clip mounting (on case), where lead does not overlap heatsink with 0.110” offset
(2) Clip mounting (on case), where leads do overlap heatsink
(3) Screw mounting with 4-40 screw, where washer diameter is ≤ 4.9mm (0.19”)
(4) Pulse test: 300µs pulse width, 1% duty cycle

www.vishay.com Document Number 88558

2 26-Mar-03
 BYV32, BYVF32 & BYVB32 Series
Vishay Semiconductors
formerly General Semiconductor

Ratings and
Characteristic Curves (TA = 25°C unless otherwise noted)
Maximum Non-Repetitive Peak
Forward Current Derating Curve Forward Surge Current Per Leg
20 150
Average Forward Rectified Current (A)

Resistive or Inductive Load

18 TJ = 150°C

Peak Forward Surge Current (A)

125 10ms Single Half Sine-Wave
16 (JEDEC Method)

100
12
75
8.0
50

4.0
25

0 0
0 25 50 75 100 125 150 1 10 100
Case Ambient Temperature (°C) Number of Cycles at 50 HZ

Typical Instantaneous Typical Reverse Leakage

Forward Characteristics Per Leg Characteristics Per Leg
100 1000
IF – Instantaneous Forward Current (A)

IR – Instantaneous Reverse

TJ = 125°C
Leakage Current (mA)

10 100 TC = 100°C

TJ = 25°C
1 10

0.1 1
Pulse Width = 300µs TC = 25°C
1% Duty Cycle

0.01 0.1
0.1 0.3 0.5 0.7 0.9 1.1 1.3 0 20 40 60 80 100
Instantaneous Forward Voltage (V) Percent of Rated Peak Reverse Voltage (%)

Typical Junction Capacitance Per Leg

60
TJ = 25°C
f = 1.0 MHZ
50 Vsig = 5mVp-p
pF – Junction Capacitance

40

30

20

10

0
1 10 100
Reverse Voltage (V)

Document Number 88558 www.vishay.com

26-Mar-03 3