PROGRAM TITLE: BTEC BUSINESS

UNIT TITLE: INNOVATION & COMMERCIALIZATION

ASSIGNMENT NUMBER: 1.

ASSIGNMENT NAME: 1.

SUBMISSION DATE: Wednesday, April 14, 2021

DATE RECEIVED: Sunday, April 25, 2021.

TUTORIAL LECTURER: Ms. Pham Huong Thuy

WORD COUNT:

STUDENT NAME: LE THI LINH

STUDENT ID: BKC1924

MOBILE NUMBER: 0378804361

Summative Feedback:
STRENGTHS:
1. The report is a result of the student’s effort on research and analysis of many aspects of a company’s innovations.
2. Before conducting deep research on the company’s innovations, the student undertook the definition of innovations
and the comparison between innovation and invention via various sources. Then she found out the firm’s recent
innovations as well as explained the importance and reasons for these innovations.
3. The student then demonstrated the company’s vision and approaches to enhance and maximize innovations among
their employees and create a good working atmosphere. As a result of that, she also recommended further
approaches and policies to encourage more employees’ creativity.
4. The model of 4Ps of Innovation was explained theorically. The explanation and application of innovation funnel on
the company’s new product development were presented in details.
5. Some frugal innovations and the reasons for them were stated briefly

WEAKNESSES AND RECOMMENDATIONS:

1. The report introduction should not copy exactly from the assignment’s brief.
2. The comparison between invention and innovation should be supported by examples rather than just the theory.
3. Although your recommendations to develop more innovation culture within the company were appropriate but they
were vague. In the future, your recommendations should be more detailed and strategic that can be applied for the
large corporation like Intel.
4. Although some quotes were cited but the length of the quotes should not exceed two sentences. The quotes of more
than two sentences should be paraphrased

GRADE: MERIT. DATE: 28/04/2021

Internal verification:

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 I. REPORT INTRODUCTION.

The report was written by Le Thi Linh - Head of Research and Development Department of Intel
Company Ward. The report includes 1. Explain the innovation and the origin of the innovation. 2.
Explain the difference between invention and innovation. 3. Explain the importance of innovation to
organizations with examples from your company. 4. Briefly introduce your vision, leadership (in
general), organizational culture, and teamwork within your company. 5. Analyze how your vision,
leadership, organizational culture, and teamwork can hinder OR promote innovation in your company.
Then, make recommendations for the company to promote and develop an environment and culture of
innovation. 6. 4P interpretation of innovation and innovation funnel. Then analyze how your company
should adopt the innovation funnel to review and formulate innovative ideas. 7. Explain economical
innovation and provide at least ONE example of how it is used OR should be used in the company you
have chosen. 8. Evaluate the role of thrifty innovation in the company you have chosen.

II. COMPANY’S INTRODUCTION.

Intel Corporation (Integrated Electronics) was established in 1968 in Santa Clara, California, USA, is
a manufacturer of products such as microprocessor chips for computers, motherboards, flash drives,
network cards, and other equipment. Another computer. Initially, Intel was the memory manufacturer
SRAM and DRAM, and this was the first flagship event for the future memory chip manufacturers.

By 2020, Intel will have 110 600 employees in all offices and production and business locations
around the globe. In 2005 Intel's revenue reached more than $ 38 billion, and Intel ranked 50th among
the largest companies in the world. Intel makes products such as microprocessor chips for computers,
motherboards, flash drives, network cards, and other computer equipment. Intel is also the world's
largest semiconductor device maker, and the inventor of the x86-generation series of microprocessors
that processors found in personal computers. Intel makes motherboards, network cards, integrated
circuits, memory chips, graphics chips, embedded processors, and other information
technology-related devices.

III. Innovation Explanation.

The definition of Crossan and Apaydin, based on the definition of the OECD handbook, is considered
the most complete in an industry review of how the technology industry describes innovation:
Innovation is production or adoption, assimilation, and exploitation of a value-added novelty in
economic and social spheres; renewal and enlargement of products, services, and markets;
development of new methods of production; and the establishment of new management systems. It is
both a process and an outcome.

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 Baragheh et al. tried to establish a multidisciplinary term based on their survey and came up with the
following definition:

"Innovation is a multi-stage mechanism through which companies transform innovations into

new/improved goods, services, or processes in order to advance, succeed, and distinguish themselves
in their marketplace."

The research of Distanont and Khongmalai (2018) defines: Innovation is new things, different from
existing ones, that are developed based on current knowledge and meet the needs of the market.

IV. The difference between invention and innovation.

Invention Innovation

It is about making new items and launching It’s about making new things in the existing new
newer services. product.

The invention is for the company introduction. Innovation did increase the productivity of the
company.

It started the company with its products and Innovation deals with current trends and
services. innovated the products into newer forms.

It increases the company’s values. It increases the business values.

It requires scientific skills. Its marketing and strategic skills are required.

It relies on the theory of the product It relies on the practical implementations of the
product.

(Gadget, 2019)

Significant differences between invention and innovation are classified below:

The appearance of an idea for a product or process that has never been done before is called an
invention. Implementing an idea for a product or process for the first time is called innovation.

Inventions are related to the creation of new products. Innovation, on the other hand, means adding
value or making a change in an existing product.
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 This invention came up with a new idea and how it works in theory. Contrary to innovation, it is all
about the practical implementation of new ideas.

Inventions require scientific skills. Unlike innovation, which requires a wide range of marketing,
technical and strategic skills.

Invention happens when a new idea strikes a scientist. In contrast, innovation arises when there is a
demand for a new product or improvisation in an existing product.

Inventions related to a single product or process. To combat this, innovation focuses on a combination
of different products and services.

While the invention is limited to the research and development department of the organization.
Innovation is spread throughout the organization.

(Gadget, 2019)

V. The company’s innovations, the importance and sources of these innovations to the organization.

Innovative projects from Intel Corporation.

Innovative projects from Intel Corporation. Intel has great ambitions and is increasingly aware of the
urgency of working with others and tackling world challenges that no one can solve on their own.

First, Intel's circular economic strategy.

Intel's circular economic strategy is to prolong product life, maximize return value, and reduce
environmental impact. While Intel employees have driven value from optimizing product margins for
decades, the Reverse Logistics Group at GSC formalized its initiatives according to its philosophy.
recurring economy last year. By adopting this new philosophy, the team will extend product life by
increasing repair capabilities, extending product warranties and leveraging return data. If a returned
product cannot be reused or repaired, it will be recycled or recalled by Intel Resale Corporation (IRC).
IRC manages semiconductor resale, finished products, precious metal recovery, and more.

(Intel, 2021)

Second, Intel launches the largest solar farm outside of the US. Intel opens the largest solar farm in
Malaysia.

Operations at Intel Malaysia are harnessing solar energy to power six buildings on the company's
Kulim and Penang campus. Operations at Intel Malaysia are harnessing solar energy to power six
buildings on the company's Kulim and Penang campus, thanks to the newly installed 3.2 megawatts
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 (MW) solar installation. completed in January. The installation is achieving a total installed capacity of
4.1 MW, powered by NEFIN, a renewable energy developer. Project is Intel's largest solar farm
outside of the US Solar project, which begins in 2020, contributes about 15% of Intel's global,
on-premises solar PV capacity.

(Intel, 2021)

Reason: According to a newly released official report, Intel's Global Supply Chain (GSC) teams have
partnered to ensure that less than 1% of product materials returned to Intel are buried in storage.
garbage. Building on the momentum of sustainable businesses, Intel engineers have also formed a
team to reduce the footprint of packaging materials used in shipping and increase the choice of
sustainable materials. Stakeholders have growing expectations for a resilient and responsible supply
chain throughout the product life cycle. Intel's RISE 2030 targets reflect a comprehensive framework
for meeting those needs, and the cyclic economic strategies will allow Intel to reduce environmental
impact, extend product life, and reuse. maximum, opening up new revenue streams and reducing the
total cost of ownership - a real win-win formula .

(Intel, 2021)

Intel's continued investments in alternative energy are a key pillar of Intel's continued commitment to
operating its manufacturing facilities with the lowest impact on the environment. The use of locally
generated renewable energy at Intel Malaysia is an important part of Intel's efforts as a responsible
corporate citizen to do better for Earth and is part of its goal. Intel's RISE 2030 is 100% renewable
energy.

(Intel, 2021)

The importance of innovation: Successful innovation

Last year, the IRC collected and recycled more than 3.8 million pounds of metallic e-waste from 23
countries - including products returned and site waste. And last year these efforts saved more than 4
million kilowatt hours of energy, equivalent to powering more than 650 US homes for the whole year.
Intel conservatively estimates that it has removed more than 16,000 tons of plastic materials since
these initiatives began. In addition to the environmental benefits of these efforts, Intel's circular
economic strategy has resulted in an added value of $ 30 million by 2020.

(Intel, 2021)

VI. The company’s vision, leadership, and organizational culture, and teamwork.

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 The Company’ vision is to create world-changing technology that enriches the lives of every person
on earth. The company is on a journey to become a trusted leader in performance, unleashing the full
potential of data. And design solutions that help manage the largest client buildings with reliable
computing power from cloud to network, according to the ideas of Moore's Law.

(Intel, 2021)

At Intel, the employees' values ​are determined by them. The values ​of each employee guide the way
they make decisions, treat each other, and serve customers. They reinforce the way our employees
achieve their goal: Create world-changing technology, enriching every person's life on earth. Not
simply words, employees' values ​are the common thread that unites them.

The employees are bold and creative. They take risks, fail quickly and learn from their mistakes to
make the next time they become better, faster and smarter. They listen, learn and anticipate customers'
needs to fulfill their ambitions. The success of our customers is the success of every Intel employee.
Employees at Intel value, respect, and trust each other. They are committed to teamwork instead of
individual success. Each employee gets stronger together. Dedicated innovators, we bring joy to work
every day! Intel provides quality and ensures a safe workplace. At the company there is the discipline
to provide products and services that customers and the Company's partners can always trust. Intel
employees are committed to being open, honest, ethical, and timely with information and feedback.
Intel builds challenges in the spirit of the best results possible.

(Intel, 2021)

VII. The recommendations for the company to foster and develop an environment and culture of
innovation.

In matters of innovation culture, people and technology should be considered as the top priority. Intel
should invest in people's capabilities and skills. Create an open and inclusive environment to attract
talent from many different sources. Integrating innovation efforts in the workplace is also crucial to
speeding up the transition, giving the right rewards and incentives to encourage innovation and skills
enhancement, thereby keeping the pace at bay. innovation by opening up human possibilities. And
Intel should also leverage the value of data through the development of new products and services, as
well as new data-driven revenue streams to increase organizational competitiveness. Make use of
insights-driven by data in enterprise-wide decision-making and collaboration to create a culture of
knowledge-sharing.

VIII. 4Ps of innovation (chỉ nói lý thuyết) and the innovation funnel and the application of the
innovation funnel to the company’s innovation process.
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1, 4Ps of innovation.

Product, method, place, and paradigm are the four P's of innovation, according to Tidd and Bessant,
and are described as follows:

(Model 4 Ps of innovation by Bessant & Tidd, 2013).

Product innovation, which leads to changes in the things (products/services) that a business offers, is
the first thing that comes to mind as we think about innovation.

Method invention refers to changes in the way products are manufactured and delivered.

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Position creativity refers to a change in the way products/services are launched, or, to put it another
way, where the offering's target is and what the story is behind it.

Paradigm innovation is a change in the basic philosophical models that frame what the company does,
or alternatively, how the enterprise frames what it does.

(Tidd & Bessant 2005).

2, The innovation funnel.

The Innovation Funnel is a method for screening a constant stream of ideas for viability. The Funnel
Management Process, also known as the Innovation Funnel, is a popular tool for implementing an
innovative and realistic action plan that many companies use.

(Toolshero, 2021).

Intel's five Silicon chip design and manufacturing processes:

Silicon chips are now commonplace. They also expanded the Internet's capacity, allowing for the
revolutionization of mobile computing, the automation of factories, the enhancement of phone power,
and the enrichment of home entertainment.

It takes a lot of effort to make those chips. On a piece of Silic, Intel's fabrication technology has
produced circuits the size of a thousand strands of hair. Microprocessors, the most complex of chips,
can have hundreds of millions or even billions of transistors bound by thin copper wires. Each
transistor functions as an open/close switch, regulating the current flowing through it in a fraction of a
second to transmit, retrieve, and process data.

Stage 1: Design

A pattern, or drawing, is used to start the development of Silic chips. Intel considers a number of
factors at this point, including: Which chip type should be used and why? What is the maximum
number of transistors that can be packed onto the chip? What is the most appropriate chip size? What
technologies would be used in the manufacture of chips? When would chips be available on the
market? Where is the chip going to be made and tested?

Intel collaborates with Intel clients, tech companies, and Intel marketing, engineering, and research
personnel to address these concerns. The design team used the feedback parameters to identify and
design the chip's features. Intel developed the logic diagram, which is a symbolic representation of the

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millions of transistors and connections that regulate the current flowing through the whole chip, after
the chip specification was defined. After this point, the designer produces physical representations of
each chip layer and its transistors. During photolithography, these stencil-like shapes (also known as
Masks) are used to protect some parts of the chip from ultraviolet rays. Intel uses a workstation with a
computer-aided design (CAD) application to complete design, testing, and simulation. This procedure
takes approximately two years and requires the constant efforts of 200 individuals. Gordon Moore
forecasted the pace in advancement of semiconductor technology in 1965. Moore's Law states that
every two years, the transistor density on an integrated chip doubles. Moore's Law has proven to be
remarkably reliable over the years. Intel's 4004 chip had 2,300 transistors in 1971. The Itanium
microprocessor had over a billion transistors in 2005. Intel proceeds to demonstrate that the legislation
is right. Manufacturing is the process of creating a semiconductor chip, and manufacturing plants, or
Fabs, are the factories where the chip is made. The “additive” in chip construction varies depending on
the chip's intended application. To complete the fabrication process, Intel uses various components and
up to 300 steps, including chemicals, steam, and light.

Stage 2: Fabrication process

It all started with Silic. Intel builds the chip day by day on wafers made of pure Silic - the main
ingredient in coastal sand. This is used Silic because it is a natural quality that is susceptible to
oxidation. Unlike insulators such as glass (which always prevent current from passing) or an electrical
quality like copper (which always allows current to pass through), can convert Silic into electrical or
insulating qualities. Silic is chemically prepared to reach a purity of 99.9999 percent before being used
to make wafers. The polished Silic is melted and transformed into a cylindrical bar. The Silicon chips
are thinly cut into wafers and polished to a fine, mirror-like finish. Intel used 2-inch wafers when it
first began producing chips, but now it uses 300 mm (12-inch) and 200 mm (8-inch) wafers to achieve
better throughput and lower costs.

Multi-layered structure Intel forms layers of transistors and conducts electricity on the chip's wafer
using a photolithographic "printing" technique.

Wafer classification is the final step in the fabrication process, and is an electrical inspection that
identifies and removes inactive chips. A series of checks are run on the computer system to ensure that
the chip's electrical circuits satisfy technological specifications and operate as intended. Intel produces
chips in special areas such as Cleanrooms in these advanced processing plants. The air in a clean room
must also be "extra" clean because invisible particles or debris will disrupt complicated circuits on the
chip (thousands of times the cleanliness of the operating room in a hospital). Before approaching the
cleanroom, technicians put on special clothing known as "rabbit suits." Dirt, such as lint or fur, is kept

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out of the wafer by the garment. In a production facility, automation is also crucial. When wafer
batches move into forward-opening bins, they are kept clean and processed easily and effectively
(FOUP). Each FOUP has a barcode that marks the components that went into making the chip. This
mark guarantees that the product is handled correctly at any stage of the production process. A FOUP
at the 300 mm plant can carry up to 25 wafers and weighs over 11 kg (25 pounds). Since this weight is
too high to be handled safely by labor, automation requires it to be met.

Stage 3: Production process.

The method of creating transistors on computer chips is extremely detailed and complicated. The
below is a rundown of the key stages in the procedure:

Coating and insulation: In a high-temperature oven in the presence of oxygen, an insulating layer is
"implanted" on the polished wafer's surface. After that, the wafer is coated with a photoelectric, a
light-sensitive substance that, like photographic film, transforms chemically when exposed to
ultraviolet rays.

Masking is the process of concealing something. The mask (created during the design phase) describes
the circuit form on each chip plate. The mask is aligned onto the wafer by a complex computer known
as a planner. It emits ultraviolet rays from the mask's open regions. The photocell in the illuminated
part becomes a transparent, sticky layer.

Acid etching: Photoelectric contact sections are cut to expose the underlying silicon-oxygen coating.
Etching is a technique for removing the exposed silicon-oxygen layer. After that, the remaining optical
trace is absorbed, leaving a silicon-oxygen sample on the wafer.

Layering: Other electrically conductive components, such as polycrystalline silicon (polysilicon), are
layered on the wafers by thorough etching and masking steps. A circuit pattern is peculiar to each
material sheet. To shape transistors and contacts, several layers are mounted on top of the wafer and
then removed at small points. In a three-dimensional structure, they would become the chip's
semiconductor circuit.

Doping: Ions of different chemical compounds are bombarded into open areas of the wafer, changing
the way silicon absorbs electricity in those areas. Etching is the method of transforming silicon into
silicon transistors, allowing the transistor to turn on and off, corresponding to binary numbers 1 and 0.
These binary representations are then translated into letters, numbers, colors, and pictures, resulting in
a data storage platform on your computer.

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 Electronic switches are created by repetitive masking and etching steps to establish a bond with other
layers on the wafer.

Metal layering: Laminated metal is used to provide electrical contacts between the chip's layers. In this
point, Intel employs copper.

Finishing the wafer: There are millions of transistors on a single wafer. Each transistor controls the
flow of current by acting as an open or closed switch. As a positive voltage is applied to the
transistor's gate terminal, electrons are drawn in (this gate creates a channel between the source and
the drain of the transistor so that the electron can pass through). A negative voltage through the gate,
on the other hand, prevents current from passing into the transistor.

Stage 4: Packing.

After being graded, the wafer is shipped to Intel's assembly plant, where it is cut into individual chips
called dies using a precision saw. Each chip is placed together into a foundation (in addition to
protecting the chip, the base is also responsible for providing power and electrical connections to the
motherboard on the computer). These are the completed ICs that would be mounted on the
motherboard of a server, a mobile phone, or a PDA…

Stage 5: Examine.

Each product is put through a series of power and reliability tests by Intel. They affirm that the device
must run at the specified speed over the entire operating temperature spectrum. Chips must be able to
tolerate the impact of a multitude of environmental factors so they can be found in a wide range of
devices, from automobile engines to aircraft and notebook computers. The chips are encrypted,
visualized, packed, and shipped to Intel customers once they have been accepted.

(Intel, 2012)

IX. The company’s frugal innovation.

Intel on May 22, 207 announced that its future line of microprocessors would be environmentally
friendly products. Specifically, lead will be removed during the manufacture of these products.

According to Intel, the first products with "green" microprocessor chips will be released later this year.
Those are the next generation Core 2 Duo, Core 2 Quad and Xeon chip products that are manufactured
on 45-nanometer technology lines.

The claim to manufacture lead-free microprocessor chips also means that Intel is responding to calls
from environmental groups to reduce the use of hazardous materials used to make the machine. count.
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 In addition to the calls of environmental activists, technology companies are also under great pressure
from consumers. Currently, consumers are more aware of environmental issues and they tend to
choose safe products.

(Intel,2007)

X. The role of frugal innovation.

frugal innovation helps the company save more production costs. When exporting Core, Quad and
Xeon chips the company has spent a lot of money on raw materials, but when it comes to making
products without lead the company has a value added of 30 million dollars by 2020 Based on the
dynamics of sustainable business practices, Intel engineers have also formed a team to reduce the
footprint of packaging materials used in shipping and increase the sustainability of material choices.

(Intel, 2021)

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Reference List.
Baregheh, Anahita; Rowley, Jennifer; Sambrook, Sally (4 September 2009). "Towards a multidisciplinary
definition of innovation". Management Decision. 47 (8): 1323–1339.eh, Anahita; Rowley, Jennifer;
Sambrook, Sally (4 September 2009).

Distanont, A. and Khongmalai, O. (2018). The role of innovation in creating a competitive

advantage,Kasetsart Journal of Social Sciences (2018). p. 1-7.

Edison, H., Ali, N.B., & Torkar, R. (2014). Towards innovation measurement in the software industry.
Journal of Systems and Software 86(5), 1390–407.

Gadget. (2019). Difference between invention and innovation. Difference between invention and innovation.
https://vi.gadget-info.com/difference-between-invention
Intel. (2021). At Intel, Our Values Define Us. Intel's Values.
https://www.intel.com/content/www/us/en/corporate-responsibility/our-values.html
Intel. (2021). Vision. Company Overview.
https://www.intel.com/content/www/us/en/company-overview/company-overview.html
Intel. (2021, April 21). Intel Unveils Its Largest Solar Farm Outside US. Intel Newsroom.
https://www.intel.com/content/www/us/en/newsroom/news/earth-day-repair-reuse-recycle.html#gs.z359n2
Intel. (2021, April 22). Earth Day at Intel: Repair, Reuse, Recycle. News.
https://www.intel.com/content/www/us/en/newsroom/news/earth-day-repair-reuse-recycle.html#gs.z2yl6h

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