C-Array Info

No.21-S-004.
D-E1_Array
Walsin Technology Corporation
SPECIFICATIONS
of
MULTILAYER CHIP CAPACITOR
Production Type :
C-Array Series Production
Version 2002DEC
WALSIN TECHNOLOGY CORPORATION

YANG-MEI PLANT:
566-1, KAO-SHI ROAD, 5 LIN, YANG-MEI, TAO-YUAN, TAIWAN, R.O.C
Sheet no. 1 TEL:886-3-4758711 FAX:886-3-4755197
Downloaded from Arrow.com.

No.21-S-004.D-E1_Array

YANG-MEI PLANT:
Sheet no. 2 TEL:886-3-4758711 FAX:886-3-4755197

MLCC PART NUMBER CODES

HOW TO ORDER
Y 4C3 N 101 J 500 L T
SIZE CODE
4C:4 pcs 0603
Chip Array
3:Pitch=0.03
in inches
PACKING CODE
PRODUCT CODE =0.08mm
T= Reeled
Y : Array
DIELECTRIC
N=COG(NPO)
B=X7R
F=Y5V
CAPACITANCE
(Picofarads)
Two significant digits
TERMINATION
followed by no.of zeros
N=Ag/Ni/SnPb
101=100pF
B=Cu/Ni/SnPb
102=1000pF CAPACITANCE L=Ag/Ni/Sn
152=1500pF TOLERANCE(EIA CODE)
C=Cu/Ni/Sn
103=10000pF
B = +/- 0.1 pF VOLTAGE(VDCW)
C = +/- 0.25 pF Two significant digits
D = +/- 0.50 pF
F = +/- 1.0 %
followed by no.of zeros
G = +/- 2.0 % 100=10V
J = +/- 5.0 % 160=16V
K = +/- 1 0 % 250=25V
M = +/- 20 %
Z = -20% / +80 %
500=50V
B,C = for Cap <= 5 pF 101=100V
D = for 5pF < Cap < 10 pF 102=1000V
NPO : B,C, D,F,G, J, K, 202=2000V
X7R : J,K, M
Y5V : M, Z 302=3000V

YANG-MEI PLANT:
Sheet no. 3 TEL:886-3-4758711 FAX:886-3-4755197

NPO SPECIFICATIONS
NPO SERIAL PRODUCTS
：
Above product satisfies the requirements as follow：
N Test Items Test Condition Requirements
O
.
1Visual &Mechanical *No remarkable defect.
. *Dimensions to conform to individual
specification sheet.
2Capacitance ≦1000pF 1.0±0.2Vrms，1MHz±10％ *Shall not exceed the limits given in the
. ＞1000pF 1.0±0.2Vrms，1KHz±10％ detailed spec.
3Q Value ≦1000pF 1.0±0.2Vrms，1MHz±10％ *More than 30pF: Q≧1000

. ＞1000pF 1.0±0.2Vrms，1KHz±10％ *Less than 30pF: Q≧400+20C
4Dielectric strength *To apply voltage(<50V)：250％ of No evidence of damage or flash over during test.
. rated voltage for 1~5 sec.
*Charge & discharge current less than 50mA.
100V Cut-off, set at 10mA 100V ≧ 3 times V DC
200V ~ 300V TEST= 15 200V ~ 300V ≧ 2 times V DC
500V ~ 999V RAMP=0 500V ~ 999V ≧ 1.5 times V DC
1000 ~ 3000V 1000V ~ 3000V ≧ 1.2 times V DC
5Insulation resistance To apply rated voltage for max. 120sec. 10GΩ MIN. or 500Ω-F MIN. , whichever is
. smaller.
Rated Voltage: To apply rated voltage 10GΩ
>
100V ~ 500V
Rated Voltage: To apply 500V*60sec > 10GΩ

>500V
6Temperature With no electrical load Within ±30ppm/℃

. coefficient -55 ~ 125℃ at 25℃
7Bending test *The middle part of substrate shall be *No remarkable damage.
. pressurized by means of the pressurizing *Cap change：±5.0％MAX. or ±0.5pF
rod at a rate of about 1 mm per second MAX. , whichever is larger.
until the deflection becomes 1 mm and This capacitance change means the change of
then the pressure shall be maintained Capacitance under specified flexure of
for 5 ±1 sec. (Appendix 1) substrate from the capacitance measured
*Measurement to be made after keeping before the test.
at room temp. for 24±2 hours
8Solderability *Solder temperature：230±5℃ 90％MIN. coverage of all metalized area.

. *Dipping time：2±0.5 sec
*Solder：SN63A
9Resistance to *Solder temperature：260±5℃ *No remarkable damage.

. soldering heat *Dipping time：10±1 sec *Cap change：±2.5％MAX. or ±0.25pF
*Solder：SN63A MAX. , whichever is larger.
*Measurement to be made after keeping *Q & I.R. ＆Dielectric strength：
at room temp. for 24 ±2 hours. To meet initial requirements.
*25％max. Leaching on each edge.

YANG-MEI PLANT:
Sheet no. 4 TEL:886-3-4758711 FAX:886-3-4755197


NPO SPECIFICATIONS
NPO SERIAL PRODUCTS
Above product satisfies the requirements as follow：：
NO. Test Items Test Condition Requirements
10. Temperature cycle *Test temp.：-55℃ ~ 125℃ *No remarkable damage.
*Test step：1) -55℃-3/+0℃ 30±3 min. *Cap change：±2.5％MAX. or ±0.25pF
2) room temp. 2~3 min. MAX. , whichever is larger.
3)125℃+3/-0℃ 30±2min. *Q & I.R. ＆ Dielectric strength：
4) room temp. 2~3 min. To meet initial requirements.
*Conduct the five cycles according to
the temperatures and time.
*Measurement to be made after keeping
at room temp. for 24 ±2 hours.
11 Humidity (Damp Heat) *Test temp.：40±2℃ *No remarkable damage.
steady state *Humidity：90~95％RH *Cap change：±5.0％MAX. or ±0.5pF
*Test time：1000+24/-0hrs. MAX. , whichever is larger.
*Measurement to be made after keeping *Q value: More than 30pF Q≧350
at room temp. for 24 ±2 hrs. 10pF≦C<30pF Q≧275+2.5C
Less than 10pF Q≧200+10C
*I.R.：1GΩ MIN. or 50Ω-F MIN. ,
whichever is smaller.
12. Humidity (Damp Heat) *Test temp.：40±2℃ *No remarkable damage.
Load *Humidity：90~95％RH *Cap change：±7.5％MAX. or ±0.75pF
*Test time：1000+24/-0 hrs. MAX. , whichever is larger.
*To apply voltage： *Q value: More than 30pF Q≧200
rated voltage (Max. 500V) C< 30PF Q≧100+10/3C
*Measurement to be made after keeping I.R.：500MΩ MIN. or 25Ω-F MIN. ,
at room temp. for 24 ±2 hours. whichever is smaller.
13. Adhesive strength of *Pressurizing force： 1kg (10N) *No remarkable damage or removal of the
termination *Test time : 10 ±1 sec terminations.
(Appendix 2)
14. Vibration Resistance *Vibration frequency：10~55 Hz/min. *No remarkable damage.

*Total amplitude：1.5mm *Cap change & Q：To meet initial requirements.
*Test time：6 hrs.(Two hours each in
three mutually perpendicular directions.)
15. High Temperature Load *Test temp.：125±3℃ *No remarkable damage.
(Endurance) *To apply voltage： *Cap change：±3.0％MAX. or ±0.3pF
(1) V<500V:200% of rated voltage. MAX. , whichever is larger.
(2) V≧500V,<1000V: *Q value: More than 30pF Q≧350
150% of rated voltage. 10pF≦C<30pF Q≧275+2.5C
(3) V≧1000V: 120% of rated Less than 10pF Q≧200+10C
voltage.(Max.3600V) *I.R.：1GΩ MIN. or 50Ω-F MIN. ,
*Test time：1000+24/-0 hrs. whichever is smaller.

YANG-MEI PLANT:
Sheet no. 5 TEL:886-3-4758711 FAX:886-3-4755197


X7R SPECIFICATIONS
X7R SERIAL PRODUCTS
：
1. Visual &Mechanical *No remarkable defect.
*Dimensions to conform to individual
2. Capacitance 1.0±0.2Vrms，1KHz±10％ *Shall not exceed the limits given in the

detailed spec.
3. Dissipation factor 1.0±0.2Vrms，1KHz±10％ *≦2.5％Rated voltage: ≧50V

*≦3.5％Rated voltage: 25V, 16V
*≦5.0％Rated g voltage: 10V
4. Dielectric strength *To apply voltage(<50V)：250％ of rated No evidence of damage or flash over during
voltage for 1~5 sec. test.
*Charge & discharge current less than
50mA
100V Cut off, set at 10mA 100V >= 3 times V DC
200V ~ 300V TEST=15 200V ~ 300V >= 2 times V DC
500V ~ 999V RAMP=0 500V~ 999V >= 1.5 times V DC
1000V ~ 3000V 1000V ~ 3000V >= 1.2 times V DC
5. Insulation resistance To apply rated voltage for max. 120sec. 10GΩ MIN. or 500Ω-F MIN. , whichever
is smaller.
Rated Voltage: To apply rated voltage > 10GΩ
100V ~ 500V
Rated Voltage: To apply 500V*60sec >10GΩ
> 500V
6. Temperature coefficient With no electrical load Within ±15％.
-55 ~ 125℃ at 25℃
7. Bending test *The middle part of substrate shall be *No remarkable damage.
pressurized by means of the pressurizing *Cap change：≦±12.5％.
rod at a rate of about 1 mm per second This capacitance change means the change of
until the deflection becomes 1 mm and capacitance under specified flexure of
then the pressure shall be maintained for substrate from the capacitance measured
5 sec. (Appendix 1) before the test.
at room temp. for 24±2 hours
8. Solderability *Solder temperature：230±5℃ 90％MIN. coverage of all metalized area.

*Dipping time：2±0.5 sec
*Solder：SN63A
9. Resistance to soldering *Solder temperature：260±5℃ *No remarkable damage.

heat *Dipping time：10±1 sec *Cap change：＜±7.5％.
*Solder：SN63A *DF value & I.R.：To meet initial standard
*Measurement to be made after keeping value.
at room temp. for 48 ±4 hours. *Dielectric Strength：no defect.
*25% max. Leaching on each edge.

YANG-MEI PLANT:
Sheet no. 6 TEL:886-3-4758711 FAX:886-3-4755197


X7R SPECIFICATIONS
X7R SERIAL PRODUCTS
：
10. Temperature cycle *Test step：1) -55℃-3/+0℃ 30±3 min. *No remarkable damage.
2) room temp. 2~3 min. *Cap change：＜±7.5％
3) 125℃+3/-0℃ 30±2 min. *D.F value & I.R.：To meet initial standard
4) room temp. 2~3min. value.
*Conduct the five cycles according to
the temperatures and time.

steady state *Humidity：90~95％RH *Cap change：＜±12.5％
*Test time：1000+24/-0 hrs. *DF value：
*Measurement to be made after keeping *≦3.0% Rated voltage: 50V
at room temp. for 48 ±4 hrs. *≦5.0% Rated voltage: 25V, 16V
*≦7.5% Rated voltage: 10V
*I.R.：1GΩ MIN. or 50Ω-F MIN. ,
Load *Humidity：90~95％RH *Cap change：＜±12.5％
*Test time：1000+24/-0 hrs. *DF value：
*To apply voltage： *≦3.0% Rated voltage: 50V
rated voltage (Max. 500V) *≦5.0% Rated voltage: 25V, 16V
*Measurement to be made after keeping *≦7.5% Rated voltage: 10V
at room temp. for 48 ±2 hours. *I.R.：500MΩ MIN. or 25Ω-F MIN. ,
13. Adhesive strength of Pressurizing force： 1kg (10N) No remarkable damage or removal of the
termination *Test time : 10 ±1 sec (Appendix 2) terminations.
14. Vibration Resistance *Vibration frequency：10~55 Hz/min. *No remarkable damage.

*Total amplitude：1.5mm *Cap change & DF：To meet initial
*Test time：6 hrs.(Two hours each in requirements.

(Endurance) *To apply voltage： *Cap change：＜±12.5％
(1) V<500V:200% of rated voltage. *DF value
(2) V≧500V,<1000V: *≦3.0% Rated voltage: 50V
150% of rated voltage. *≦5.0% Rated voltage: 25V, 16V
(3) V≧1000V:120% of rated *≦7.5% Rated voltage: 10V
voltage.(Max.3600V) *I.R.：1GΩ MIN. or 50Ω-F MIN. ,
*Test time：1000+24/-0 hrs. whichever is smaller.

YANG-MEI PLANT:
Sheet no. 7 TEL:886-3-4758711 FAX:886-3-4755197


Y5V SPECIFICATIONS
Y5V SERIAL PRODUCTS
：
1. Visual &Mechanical *No remarkable defect.
*Dimensions to conform to individual
2. Capacitance 1.0±0.2Vrms，1KHz±10％，25℃ * Shall not exceed the limits given in the
detailed spec.
3. Dissipation factor 1.0±0.2Vrms，1KHz±10％，25℃ *DF≦5.0% (≧50V)
*DF≦5.0% (25V)
[Except 0603 ≧0.1μF; 0805≧0.33μF
1206≧1μF, DF≦7%]
*DF≦7.0% (C<1.0μF、16V) ;
*DF≦9.0% (C≧1.0μF、16V)
*DF≦12.5%(10V)
4. Dielectric strength *To apply voltage(<50V)：250％ of rated No evidence of damage or flash over during test.
voltage for 1~5 sec.
*Charge & discharge current less than
50mA.
100V Cut off, set at 10mA 100V ≧ 3 times V DC
200V ~ 300V TEST=15 200V ~ 300V ≧ 2 times V DC
500V ~ 999V RAMP=0 500V ~ 999V ≧ 1.5 times V DC
1000V ~ 3000V 1000V ~ 3000V ≧ 1.2 times V DC
5. Insulation resistance To apply rated voltage for max. 120sec. 10GΩ MIN. or 500Ω-F MIN. , whichever is
smaller.
Rated Voltage: To apply rated >10GΩ
100V ~ 500V voltage
Rated Voltage: To apply 500*60sec >10GΩ
>500V
6. Temperature coefficient With no electrical load Within +30％ / -80％
-25℃ ~ 85℃ at 20℃
7. Bending test *The middle part of substrate shall be *No remarkable damage.
pressurized by means of the pressurizing *Cap change：≦±30%
rod at a rate of about 1 mm per second This capacitance change means the change of
until the deflection becomes 1 mm and Capacitance under specified flexure of
then the pressure shall be maintained for substrate from the capacitance measured
5 sec. (Appendix 1) before the test.
at room temp. for 48±4hours
8. Solderability *Solder temperature：230±5℃ 90％MIN. coverage of all metalized area.
*Dipping time：2±0.5 sec
*Solder：SN63A
9. Resistance to soldering *Solder temperature：260±5℃ *No remarkable damage.
heat *Dipping time：10±1 sec *Cap change：＜±20％.
*Solder：SN63A *D.F value & I.R.：To meet initial standard
*Measurement to be made after keeping value.
at room temp. for 48±4 hours. *Dielectric strength：no defect.
*25% max. Leaching on each edge.

YANG-MEI PLANT:
Sheet no. 8 TEL:886-3-4758711 FAX:886-3-4755197


Y5V SPECIFICATIONS
Y5V SERIAL PRODUCTS
Above product satisfies the requirements as follow：：
10. Temperature cycle *Test temp.：-25℃~ 85℃ *No remarkable damage.
*Test step：1) -25℃-3/+0. 30±3 min. *Cap change：＜±20％
2) room temp. 2~3 min. *D.F value & I.R.：To meet initial standard
3) 85℃+3/-0 30±2 min. value.
4) room temp. 2~3 min.
*Conduct the five cycles according to the
temperatures and time.
steady state *Humidity：90~95％RH *Cap change：＜±30％
*Test time：1000 +24/-0 hrs. *DF value：
*Measurement to be made after keeping *≦7.5％Rated voltage:≧50V
at room temp. for 48 ±4 hrs. *≦7.5％Rated voltage:25V
[Except 0603 ≧0.1μF; 0805≧0.33μF, 1206≧1μF, DF≦10%]
*DF≦10.0% (C<1.0 μF、16V) ;
*DF≦12.5% (C≧1.0 μF、16V)
*DF≦15%(10V)
I.R.：1GΩ MIN or 50Ω-F MIN ,whichever is smaller
Load *Humidity：90~95％RH *Cap change：＜±30％
*Test time：1000 +24/-0 hrs. *DF value：
*To apply voltage： *≦7.5％Rated voltage:≧50V
rated voltage (Max. 500V) *≦7.5％Rated voltage:25V
*Measurement to be made after keeping [Except 0603 ≧0.1μF; 0805≧0.33μF,1206≧1μF, DF≦10%]
at room temp. for 48 ±4 hours. *DF≦10.0% (C<1.0μF 、16V) ;
*DF≦12.5% (C≧1.0μF 、16V)
*DF≦15%(10V)
*I.R.：500MΩ MIN. or 25Ω-F MIN.,whichever is smaller.
13. Adhesive strength of *Pressurizing force：1kg (10N) No remarkable damage or removal of the terminations.
termination *Test time:10±1sec (Appendix2)
14 Vibration Resistance *Vibration frequency：10~55 Hz/min. *No remarkable damage.
*Total amplitude：1.5mm *Cap change & DF : To meet initial
*Test time：6 hrs.(Two hours each in requirements
(Endurance) *To apply voltage： *Cap change：≦±30%
(1) V<500V:200% of rated voltage. *DF value：
(2) V≧500V,<1000V: *≦7.5％Rated voltage:≧50V
150% of rated voltage. *≦7.5％Rated voltage:25V
(3) V≧1000V:120% of rated [Except 0603 ≧0.1μF; 0805≧0.33μF ,1206≧1μF, DF≦10%]
voltage.(Max.3600V) *DF≦10.0% (C<1.0μF 、16V) ;
*Test time：1000+24/-0 hrs. *DF≦12.5% (C≧1.0μF 、16V)
*Measurement to be made after keeping *DF≦15%(10V)
at room temp. for 48 ±4 hours. *I.R.：1GΩ MIN. or 50Ω-F MIN. ,whichever is smaller.

YANG-MEI PLANT:
Sheet no. 9 TEL:886-3-4758711 FAX:886-3-4755197

Specification of Structure and Capacitance

Range
DIMENSIONS
Case Size Length Width S T BW P

4*0603 3.2±0.15 1.6±0.15 0.3±0.2 0.8±0.1 0.4±0.15 0.8±0.15
CAPACITANCE RANGE
100
150
220
270
330
470
680
820
101
151
181
221
331
471
681
821
102
152
222
332
472
682
103
153
223
333
473
683
104
16V
NPO 25V
50V
16V
X7R 25V
50V
16V
Y5V 25V
50V

YANG-MEI PLANT:
Sheet no. 10 TEL:886-3-4758711 FAX:886-3-4755197

Chip Capacitors on Tape and Reel

YANG-MEI PLANT:
Sheet no. 11 TEL:886-3-4758711 FAX:886-3-4755197

DESCRIPTION OF THE STANDARD SHIPPING

LABEL
a. Customer name g. Quantity and WALSIN P/N or customer P/N in bar code
b. WALSIN order serial number and item number h. Material serial number of WALSIN
c. Customer P/O i. Shipping date
d. Customer P/N j. Order bar code including serial number and item numberSerial
number of the label
e. Description of specifications
f. Quantity
Information of caution/precaution handling of chip : 1. No bumping & pressurizing when carry. 2. Keep out of water.
Walsin Standard Label (MLCC) :
st
1 Column : 0603 NPO 7.0pF +-0.50pF50V <<Content: product description>>
(1). 0603: Size (2). NPO : Dielectric (3). 7.0pF : Capacitance (4) +/-0.50pF: Tolerance
2nd Column : 0603N7R0D500NT 1001000010 4000 <<Content: Part number + batch number of taping
+quantity per reel(pcs)>>
(1). 0603N7R0D500NT: Part number
(2). 1001000010: Batch number of taping (2.1) 000010: random number
(3). 4000: quantity per reel (unit: pieces)
3rd Column: Bar code <<Content:The reading is same as 2nd column>>

0603N7R0D500NT 1001000010 4 (Quantity unit: Kpcs)
4th Column: -11980293-083001181402- 16 0100002974 002

(1). - : Tap (6). 0100002974 : Batch number of bulk
(2). 11980293 : Employee number (7). 002 : Series of copies
(3). 083001 : Mouth , Date, Year (The date of printing) (4). 181402 : Hour, minute, second (Printing Time)
(5). 16 : Copies of label(with same batch number)

YANG-MEI PLANT:
Sheet no. 12 TEL:886-3-4758711 FAX:886-3-4755197

Appendix 1 Bending test

1.Testing Substrate:
The testing substrate shall the testing substrate A given in Fig.1, the substrate shall be that of class GE4 specified in JIS C6484
or at least the equivalent, the thickness shall be 1.6mm and thickness of copper foil be 0.035mm.
1.6
Unit : mm
External Size of Capacitor Dimensions of Pattern
Symbol W*L a b c d
0402 0.5*1.0 0.4 1.5 0.5 1.0
0603 0.8*1.6 1.0 3.0 1.2 1.0
0805 1.25*2.0 1.2 4.0 1.65 1.0
1206 1.6*3.2 2.2 5.0 2.0 1.0
1210 2.5*3.2 2.2 5.0 2.9 1.0
1812 3.2*4.5 3.5 7.0 3.7 1.0
2.Testing Method:
2.1 The capacitor shall be soldered to testing substrate A.
2.2 The substrate shall be so placed with it’s surface on which capacitor is mounted downwards that the center of capacitor
coincides with the center of supports as illustrated in Fig2.
Fig.2 Flexural test of substrate

YANG-MEI PLANT:
Sheet no. 13 TEL:886-3-4758711 FAX:886-3-4755197

Appendix 2 Adhesive strength of termination

1.Testing Substrate:
The testing substrate shall be the testing substrate A illustrated in Fig.1.
Fig.1 Testing substrate A
Unit : mm
External Size of Capacitor Dimensions of Pattern
Symbol W*L a b c
0402 0.5*1.0 0.4 1.5 0.5
0603 0.8*1.6 1.0 3.0 1.2
0805 1.25*2.0 1.2 4.0 1.65
1206 1.6*3.2 2.2 5.0 2.0
1210 2.5*3.2 2.2 5.0 2.9
1812 3.2*4.5 3.5 7.0 3.7
Remark : Material of substrate shall be alumina or glass fabric base epoxy resin.
Alumina : purity 95% or more, thickness 0.6mm or more.
Glass fabric base epoxy resin : Class GE4 specified in JIS C6484 or the equivalent.
Thickness 1.6mm and copper foil thickness 0.035mm.
2.Testing Method:
The pressurizing force shall be gradually applied to the center side surface of capacitor in the capacitor in the direction
horizontal and parallel to the testing substrate as shown in Fig.2.
Fig.2 Direction of Pressurizing
1Kg(10N)
Testing substrate
capacitor

YANG-MEI PLANT:
Sheet no. 14 TEL:886-3-4758711 FAX:886-3-4755197

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No.21-S-004.

Walsin Technology Corporation

WALSIN TECHNOLOGY CORPORATION

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Walsin Technology Corporation

WALSIN TECHNOLOGY CORPORATION

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Walsin Technology Corporation

MLCC PART NUMBER CODES

Y 4C3 N 101 J 500 L T

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Walsin Technology Corporation

3Q Value ≦1000pF 1.0±0.2Vrms，1MHz±10％ *More than 30pF: Q≧1000

Rated Voltage: To apply 500V*60sec > 10GΩ

6Temperature With no electrical load Within ±30ppm/℃

8Solderability *Solder temperature：230±5℃ 90％MIN. coverage of all metalized area.

9Resistance to *Solder temperature：260±5℃ *No remarkable damage.

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Walsin Technology Corporation

14. Vibration Resistance *Vibration frequency：10~55 Hz/min. *No remarkable damage.

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Walsin Technology Corporation

2. Capacitance 1.0±0.2Vrms，1KHz±10％ *Shall not exceed the limits given in the

3. Dissipation factor 1.0±0.2Vrms，1KHz±10％ *≦2.5％Rated voltage: ≧50V

8. Solderability *Solder temperature：230±5℃ 90％MIN. coverage of all metalized area.

9. Resistance to soldering *Solder temperature：260±5℃ *No remarkable damage.

WALSIN TECHNOLOGY CORPORATION

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Walsin Technology Corporation

11 Humidity (Damp Heat) *Test temp.：40±2℃ *No remarkable damage.

14. Vibration Resistance *Vibration frequency：10~55 Hz/min. *No remarkable damage.

15. High Temperature Load *Test temp.：125±3℃ *No remarkable damage.

WALSIN TECHNOLOGY CORPORATION

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Walsin Technology Corporation

WALSIN TECHNOLOGY CORPORATION

Downloaded from Arrow.com.

Walsin Technology Corporation

WALSIN TECHNOLOGY CORPORATION

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Walsin Technology Corporation

Specification of Structure and Capacitance

Case Size Length Width S T BW P

WALSIN TECHNOLOGY CORPORATION

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Walsin Technology Corporation

Chip Capacitors on Tape and Reel

WALSIN TECHNOLOGY CORPORATION

Downloaded from Arrow.com.

Walsin Technology Corporation

DESCRIPTION OF THE STANDARD SHIPPING

Walsin Standard Label (MLCC) :

3rd Column: Bar code <<Content:The reading is same as 2nd column>>

4th Column: -11980293-083001181402- 16 0100002974 002

WALSIN TECHNOLOGY CORPORATION

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Walsin Technology Corporation

Appendix 1 Bending test

WALSIN TECHNOLOGY CORPORATION

9Resistance to Solder temperature：260±5℃ No remarkable damage.

14. Vibration Resistance Vibration frequency：10~55 Hz/min. No remarkable damage.

9. Resistance to soldering Solder temperature：260±5℃ No remarkable damage.

11 Humidity (Damp Heat) Test temp.：40±2℃ No remarkable damage.

14. Vibration Resistance Vibration frequency：10~55 Hz/min. No remarkable damage.

15. High Temperature Load Test temp.：125±3℃ No remarkable damage.