ChE 323- Chemical Engineering for Microelectronics

Spring 2011
The purpose of this course is to introduce chemical engineering principles learned in courses
like ChE317 and ChE353 to the broader field of microelectronics. This course will introduce the
students the following topics: (a) the basic science of semiconductor, (b) the engineering
involved in silicon production (c) crystal growth processes, (d) major steps involved in
fabrication engineering (such as oxidation of silicon, doping, etching, chemical vapor
deposition, lithography, ion implementation etc.). As chemical engineers we will look at each
step of the fabrication engineering in the light of fluid transport, heat transfer, mass transfer
and reaction engineering.

Instructor: Thomas Edison

Office: CPE2.710
Office phone: 471- 4438
Office hours: Tue, Th, 11:00 to 1:00 pm; others hours by appointment
Email: tedison@che.utexas.edu

Lectures: MWF 1:00 -2:00 at CPE 2.222

Textbooks:

“Introduction to Microelectronic Fabrication” (2/ed.) Jaeger, R. C. (Prentice Hall), 2000.

“Process Engineering analysis in Semiconductor Device Fabrication”, Middleman, S. and Hochberg, A. K.

(McGraw-Hill, Inc.), 1993.

“Fabrication Engineering at the Micro- and Nanoscale” (3/ed.) Campbell, S. A. (Oxford) 2008.

Optional Book:

“Silicon VLSI Technology, Fundamentals, Practice and modeling”, Plummer, J. D., Deal, M. D.
and Griffin, P. B. (Prentice Hall), 1997

Homework:

Homework will be assigned weekly (normally on Friday’s) and is due the following Friday in
class. Duplicate assignment solutions are unacceptable even if you work together as a group.

Exams and dates:

There are two in class midterm exams and a take home final exam.
Midterm Exam I Feb 25th during class
Midterm Exam II April 11th during class
Final Grade: Midterm exams 50%
Final Exam 20%
Homework 30%

Topics to be covered:

I) Semiconductor Substrates
II) Silicon production, Crystal growth processes
III) Basic steps of wafer fabrication
IV) Diffusion
V) Thermal Oxidation
VI) Doping/ Ion Implantation
VII) Rapid thermal processing
VIII) Microlithography
IX) Etching
X) Chemical Vapor deposition
XI) Semiconductor manufacturing environment: Clean room, wafer cleaning