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LM317A
SNVSAC2A – MARCH 2015 – REVISED JUNE 2020
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM317A
SNVSAC2A – MARCH 2015 – REVISED JUNE 2020 www.ti.com
Table of Contents
1 Features .................................................................. 1 8.4 Device Functional Modes........................................ 12
2 Applications ........................................................... 1 9 Application and Implementation ........................ 14
3 Description ............................................................. 1 9.1 Application Information............................................ 14
4 Revision History..................................................... 2 9.2 Typical Applications ................................................ 14
5 Device Comparison Table..................................... 3 10 Power Supply Recommendations ..................... 25
6 Pin Configuration and Functions ......................... 4 11 Layout................................................................... 25
11.1 Layout Guidelines ................................................. 25
7 Specifications......................................................... 5
11.2 Layout Examples................................................... 30
7.1 Absolute Maximum Ratings ...................................... 5
7.2 ESD Ratings.............................................................. 5 12 Device and Documentation Support ................. 32
7.3 Recommended Operating Conditions....................... 5 12.1 Documentation Support ........................................ 32
7.4 Thermal Information .................................................. 5 12.2 Receiving Notification of Documentation Updates 32
7.5 Electrical Characteristics........................................... 6 12.3 Support Resources ............................................... 32
7.6 Typical Characteristics .............................................. 7 12.4 Trademarks ........................................................... 32
12.5 Electrostatic Discharge Caution ............................ 32
8 Detailed Description ............................................ 10
12.6 Glossary ................................................................ 32
8.1 Overview ................................................................. 10
8.2 Functional Block Diagram ....................................... 11 13 Mechanical, Packaging, and Orderable
8.3 Feature Description................................................. 12
Information ........................................................... 32
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
CASE IS OUTPUT
Surface-Mount NDP Package
4-Pin TO-252
Plastic NDE Package Front View
3-Pin TO-220
Front View
Pin Functions
PIN
I/O DESCRIPTION
NAME TO-220 SOT-223 TO-252 TO
ADJ 1 1 1 2 — Adjust pin
VIN 3 3 3 1 I Input voltage pin for the regulator
VOUT 2, TAB 2, 4 2, TAB 3, CASE O Output voltage pin for the regulator
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1) (2)
MIN MAX UNIT
Power dissipation Internally Limited
Input-output voltage differential −0.3 40 V
Storage temperature, Tstg −65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(1) Manufacturing with less than 500-V HBM is possible with the necessary precautions. Pins listed as ±3000 V may actually have higher
performance.
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application
report.
(2) When surface mount packages are used (SOT-223, TO-252), the junction to ambient thermal resistance can be reduced by increasing
the PCB copper area that is thermally connected to the package. See Heatsink Requirements for heatsink techniques.
(3) No heatsink.
(1) IMAX = 1.5 A for the NDE (TO-220). IMAX = 1.0 A for the DCY (SOT-223) package.
IMAX = 0.5 A for the NDT (TO) and NDP (TO-252) packages. Device power dissipation (PD) is limited by ambient temperature (TA),
device maximum junction temperature (TJ), and package thermal resistance (θJA). The maximum allowable power dissipation at any
temperature is : PD(MAX) = ((TJ(MAX) – TA) / θJA). All minimum and maximum limits are ensured to TI's Average Outgoing Quality Level
(AOQL).
(2) Regulation is measured at a constant junction temperature, using pulse testing with a low duty cycle. Changes in output voltage due to
heating effects are covered under the specifications for thermal regulation.
NDE PACKAGE
DEVICE
Figure 13. Line Transient Response Figure 14. Load Transient Response
8 Detailed Description
8.1 Overview
In operation, the LM317A develops a nominal 1.25-V reference voltage, VREF, between the output and
adjustment terminal. The reference voltage is impressed across program resistor R1 and, because the voltage is
constant, a constant current I1 then flows through the output set resistor R2 giving an output voltage calculated
by Equation 1:
æ R2 ö
VOUT = 1.25 V ç 1 + + I ADJ (R2 )
è R1 ÷ø (1)
Because the 100-μA current from the adjustment terminal represents an error term, the LM317A was designed to
minimize IADJ and make it very constant with line and load changes. To do this, all quiescent operating current is
returned to the output, establishing a minimum load current requirement. If there is insufficient load on the output,
the output will rise.
With the TO package, care should be taken to minimize the wire length of the output lead. The ground of R2 can
be returned near the ground of the load to provide remote ground sensing and improve load regulation.
æ R2 ö
VOUT = 1.25 V ç 1 + + I ADJ (R2 )
è R1 ÷ø
D1 protects against C1
D2 protects against C2
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
R3
267
1%
NOTE
The selection of R1 determines a minimum load current for the PNP to turn on. The higher
the resistor value, the lower the load current must be before the transistors turn on.
LM317A
600 mV
-Short circuit current is approximately , or 210 mA
R3
(Compared to LM117's higher current limit)
—At 50 mA output only ¾ volt of drop occurs in R3 and R4
LM317A
LM317A
LM317A
LM317A
11 Layout
Figure 37. θJA vs Copper (2-oz.) Area for the SOT-223 Figure 38. Maximum Power Dissipation vs TAMB for the
Package SOT-223 Package
Figure 39. θJA vs 2-oz. Copper Area for TO-252 Figure 40. Maximum Allowable Power Dissipation vs
Ambient Temperature for TO-252
Figure 41. Maximum Allowable Power Dissipation vs 2-oz. Copper Area for TO-252
Figure 42. Top View of the Thermal Test Pattern in Actual Scale
Figure 43. Bottom View of the Thermal Test Pattern in Actual Scale
12.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
12.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
www.ti.com 11-Jan-2021
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
LM317AEMP NRND SOT-223 DCY 4 1000 Non-RoHS Call TI Call TI -40 to 125 N07A
& Green
LM317AEMP/NOPB ACTIVE SOT-223 DCY 4 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 N07A
LM317AH ACTIVE TO NDT 3 500 RoHS & Green AU Level-1-NA-UNLIM -40 to 125 ( LM317AHP+, LM317
AHP+)
LM317AH/NOPB ACTIVE TO NDT 3 500 RoHS & Green AU Level-1-NA-UNLIM -40 to 125 ( LM317AHP+, LM317
AHP+)
LM317AMDT NRND TO-252 NDP 3 75 Non-RoHS Call TI Call TI -40 to 125 LM317
& Green AMDT
LM317AMDT/NOPB ACTIVE TO-252 NDP 3 75 RoHS & Green SN Level-2-260C-1 YEAR -40 to 125 LM317
AMDT
LM317AMDTX NRND TO-252 NDP 3 2500 Non-RoHS Call TI Call TI -40 to 125 LM317
& Green AMDT
LM317AMDTX/NOPB ACTIVE TO-252 NDP 3 2500 RoHS & Green SN Level-2-260C-1 YEAR -40 to 125 LM317
AMDT
LM317AT NRND TO-220 NDE 3 45 Non-RoHS Call TI Call TI -40 to 125 LM317AT P+
& Green
LM317AT/NOPB ACTIVE TO-220 NDE 3 45 RoHS-Exempt SN Level-1-NA-UNLIM -40 to 125 LM317AT P+
& Green
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 11-Jan-2021
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 9-Jun-2020
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 9-Jun-2020
Pack Materials-Page 2
MECHANICAL DATA
NDE0003B
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MECHANICAL DATA
6,70 (0.264)
6,30 (0.248)
3,10 (0.122)
2,90 (0.114)
4
0,10 (0.004) M
Gauge Plane
1 2 3
0,25 (0.010)
0,84 (0.033) 0°–10°
2,30 (0.091)
0,66 (0.026)
0,10 (0.004) M
4,60 (0.181) 0,75 (0.030) MIN
1,70 (0.067)
1,80 (0.071) MAX 1,50 (0.059)
0,35 (0.014)
0,23 (0.009)
Seating Plane
4202506/B 06/2002
10.42
9.40
6.22 1.27
B
5.97 0.88 A
(2.345)
2.285 (2.5)
2 5.46 6.73
4.57
4.96 6.35
3
0.88
3X 1.02 PKG
0.64 OPTIONAL
0.25 C A B 0.64
8 8
TOP & BOTTOM
1.14
0.89 C
2.55 MAX
SEATING PLANE
4.32 MIN
2 4
4219870/A 03/2018
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration TO-252.
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EXAMPLE BOARD LAYOUT
NDP0003B TO-252 - 2.55 mm max height
TRANSISTOR OUTLINE
4 SYMM
(4.57) (5.5)
(R0.05) TYP
(4.38) (2.285)
PKG
4219870/A 03/2018
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature numbers
SLMA002(www.ti.com/lit/slm002) and SLMA004 (www.ti.com/lit/slma004).
5. Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled, plugged or tented.
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EXAMPLE STENCIL DESIGN
NDP0003B TO-252 - 2.55 mm max height
TRANSISTOR OUTLINE
(1.35) TYP
2X (2.15)
(0.26)
2X (1.3) (R0.05) TYP
(1.32) TYP
(4.57)
16X (1.12)
16X (1.15)
(4.38)
PKG
4219870/A 03/2018
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
7. Board assembly site may have different recommendations for stencil design.
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MECHANICAL DATA
NDT0003A
H03A (Rev D)
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