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LM1086
SNVS039J – JUNE 2000 – REVISED APRIL 2015
TO-220 TO-263
1
2
3
1
2
3
WSON
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM1086
SNVS039J – JUNE 2000 – REVISED APRIL 2015 www.ti.com
Table of Contents
1 Features .................................................................. 1 7.4 Device Functional Modes........................................ 11
2 Applications ........................................................... 1 8 Application and Implementation ........................ 13
3 Description ............................................................. 1 8.1 Application Information............................................ 13
4 Revision History..................................................... 2 8.2 Typical Applications ................................................ 13
5 Pin Configuration and Functions ......................... 3 9 Power Supply Recommendations...................... 18
6 Specifications......................................................... 4 10 Layout................................................................... 18
6.1 Absolute Maximum Ratings ...................................... 4 10.1 Layout Guidelines ................................................. 18
6.2 ESD Ratings ............................................................ 4 10.2 Layout Example .................................................... 18
6.3 Recommended Operating Conditions....................... 4 10.3 Thermal Considerations ........................................ 19
6.4 Thermal Information .................................................. 5 11 Device and Documentation Support ................. 21
6.5 Electrical Characteristics........................................... 5 11.1 Development Support ........................................... 21
6.6 Typical Characteristics .............................................. 7 11.2 Trademarks ........................................................... 21
7 Detailed Description .............................................. 9 11.3 Electrostatic Discharge Caution ............................ 21
7.1 Overview ................................................................... 9 11.4 Glossary ................................................................ 21
7.2 Functional Block Diagram ......................................... 9 12 Mechanical, Packaging, and Orderable
7.3 Feature Description................................................. 10 Information ........................................................... 21
4 Revision History
Changes from Revision I (August 2014) to Revision J Page
• Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section ................................................................................................. 4
8-Pin WSON
Package NGN
Top View
ADJ/GND 1 8 VOUT
VIN 2 7 VOUT
VOUT
N/C 3 6 VOUT
N/C 4 5 N/C
3-Pin TO-220
Package NDE
Top View
3-Pin DDPAK/TO-263
Package KTT
Top View
Pin Functions
PIN
NUMBER I/O DESCRIPTION
NAME
KTT/NDE NGN
Adjust pin for the adjustable output voltage version. Ground pin for the fixed
ADJ/GND 1 1 ––
output voltage versions.
VOUT 2, TAB 6, 7, 8, PAD O Output voltage pin for the regulator.
VIN 3 2 I Input voltage pin for the regulator.
N/C 3, 4, 5 –– No Connection
6 Specifications
6.1 Absolute Maximum Ratings
(1) (2)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
LM1086-ADJ 29 V
LM1086-1.8 27 V
Maximum Input to Output Voltage Differential LM1086-2.5 27 V
LM1086-3.3 27 V
LM1086-5.0 25 V
Power Dissipation (3) Internally Limited
Junction Temperature (TJ) (4) 150 °C
Lead Temperature 260, to 10 sec °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) Power dissipation is kept in a safe range by current limiting circuitry. Refer to Overload Recovery in Application and Implementation. The
value θJA for the WSON package is specifically dependent on PCB trace area, trace material, and the number of thermal vias. For
improved thermal resistance and power dissipation for the WSON package, refer to Application Note AN-1187 (literature number
SNOA401).
(4) The maximum power dissipation is a function of TJ(MAX) , θJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(MAX)–T A)/θJA. All numbers apply for packages soldered directly into a PC board. Refer to Thermal
Considerations
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(1) The maximum power dissipation is a function of TJ(MAX) , θJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(MAX)–T A)/θJA. All numbers apply for packages soldered directly into a PC board. Refer to Thermal
Considerations.
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(5) Dropout voltage is specified over the full output current range of the device.
(6) The minimum output current required to maintain regulation.
Figure 1. Dropout Voltage vs Output Current Figure 2. Short-Circuit Current vs Input/Output Difference
Figure 3. Load Regulation vs Temperature Figure 4. Percent Change in Output Voltage vs Temperature
Figure 5. Adjust Pin Current vs Temperature Figure 6. Maximum Power Dissipation vs Temperature
Figure 7. Ripple Rejection vs Frequency (LM1086-ADJ) Figure 8. Ripple Rejection vs Output Current (LM1086-ADJ)
Figure 9. Ripple Rejection vs Frequency (LM1086-5) Figure 10. Ripple Rejection vs Output Current (LM1086-5)
Figure 11. Line Transient Response Figure 12. Load Transient Response
7 Detailed Description
7.1 Overview
A basic functional diagram for the LM1086-ADJ (excluding protection circuitry) is shown in Figure 13. The
topology is basically that of the LM317 except for the pass transistor. Instead of a Darlingtion NPN with its two
diode voltage drop, the LM1086 uses a single NPN. This results in a lower dropout voltage. The structure of the
pass transistor is also known as a quasi LDO. The advantage of a quasi LDO over a PNP LDO is its inherently
lower quiescent current. The LM1086 is specified to provide a minimum dropout voltage of 1.5V over
temperature, at full load.
When the adjustable regulator is used (Figure 15), the best performance is obtained with the positive side of the
resistor R1 tied directly to the output terminal of the regulator rather than near the load. This eliminates line drops
from appearing effectively in series with the reference and degrading regulation. For example, a 5V regulator with
0.05-Ω resistance between the regulator and load will have a load regulation due to line resistance of 0.05 Ω × IL.
If R1 (=125 Ω) is connected near the load the effective line resistance will be 0.05 Ω (1 + R2/R1) or in this case,
it is 4 times worse. In addition, the ground side of the resistor R2 can be returned near the ground of the load to
provide remote ground sensing and improve load regulation.
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.2.2 Adjustable at 5 V
The application shown in Figure 19 outlines a simple 5-V output application made possible by the LM1086-ADJ.
This application can provide 1.5 A at high efficiencies and very low drop-out.
10 Layout
Once the devices power is determined, the maximum allowable (θJA (max)) is calculated as:
θJA (max) = TR(max)/PD = TJ(max) − TA(max)/PD
The LM1086 has different temperature specifications for two different sections of the IC: the control section and
the output section. The Thermal Information table shows the junction to case thermal resistances for each of
these sections, while the maximum junction temperatures (TJ(max)) for each section is listed in the Absolute
Maximum Ratings section of the datasheet. TJ(max) is 125°C for the control section, while TJ(max) is 150°C for the
output section.
θJA (max) should be calculated separately for each section as follows:
θJA (max, CONTROL SECTION) = (125°C - TA(max))/PD (6)
θJA (max, OUTPUT SECTION) = (150°C - TA(max))/PD (7)
The required heat sink is determined by calculating its required thermal resistance (θHA (max)).
θHA (max) = θJA (max) − (θJC + θCH) (8)
(θHA (max)) should also be calculated twice as follows:
(θHA (max)) = θJA (max, CONTROL SECTION) - (θJC (CONTROL SECTION) + θCH) (9)
(θHA (max)) = θJA(max, OUTPUT SECTION) - (θJC (OUTPUT SECTION) + θCH) (10)
If thermal compound is used, θCH can be estimated at 0.2 C/W. If the case is soldered to the heat sink, then a
θCH can be estimated as 0 C/W.
After, θHA (max) is calculated for each section, choose the lower of the two θHA (max) values to determine the
appropriate heat sink.
11.2 Trademarks
All trademarks are the property of their respective owners.
11.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
www.ti.com 30-Sep-2021
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 30-Sep-2021
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com 30-Sep-2021
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com 3-Jun-2023
B0 W
Reel
Diameter
Cavity A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
W Overall width of the carrier tape
P1 Pitch between successive cavity centers
Sprocket Holes
Q1 Q2 Q1 Q2
Pocket Quadrants
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 3-Jun-2023
Width (mm)
H
W
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 3-Jun-2023
TUBE
T - Tube
height L - Tube length
W - Tube
width
Pack Materials-Page 3
MECHANICAL DATA
NDE0003B
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MECHANICAL DATA
KTT0003B
TS3B (Rev F)
BOTTOM SIDE OF PACKAGE
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PACKAGE OUTLINE
NGN0008A SCALE 3.000
WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
4.1 B
A
3.9
PIN 1 ID
DETAIL A
PIN 1 ID
C
0.8 MAX
SEATING PLANE
0.05 0.08 C
0.00
2.2 0.05
EXPOSED SYMM
THERMAL PAD (0.2) TYP
6X 0.8
4
5
2X SYMM
9
2.4 3 0.05
SEE
DETAIL A
8
1
0.35
(0.25) 8X
0.25
(0.2) 0.6
(0.25) 8X 0.1 C A B
0.4
PIN 1 ID (0.15) 0.05 C
4214794/A 11/2019
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
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EXAMPLE BOARD LAYOUT
NGN0008A WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
(2.2)
8X (0.5) SYMM
1
8X (0.3) 8
SYMM 9
(3)
(1.25)
6X (0.8)
4 5
(R0.05) TYP
( 0.2) VIA
TYP (0.85)
(3.3)
EXPOSED EXPOSED
METAL METAL
4214794/A 11/2019
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
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EXAMPLE STENCIL DESIGN
NGN0008A WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
0.59
SYMM METAL
8X (0.5) TYP
1
8X (0.3) 8
4X (1.31)
SYMM
9
(0.755)
6X (0.8)
5
4
(R0.05) TYP
4X (0.98)
(3.3)
EXPOSED PAD 9:
78% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE:20X
4214794/A 11/2019
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
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