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MEMS & NEMS

(Micro & Nanosystems)

Microelectromechanical Systems
&
Nanoelectromechanical Systems

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Outline

 What is MEMS? Or NEMS?

 Who cares? (& why)

 A few applications

 How do you make these things?

 Where’s it going in future?

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MEMS & NEMS NEMS [2]

Size Difference
MEMS

[1]
[1]

103 102 101 1 10-1 10-2 10-3 10-4 10-5 10-6 10-7 10-8 10-9 10-10 10-11 10-12
mete
Visible r
light
Diameter of hair ~ 60μm
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Introduction to MEMS

 MST - Microsystems Technology (European)

 MEMS - Microelectromechanical Systems (U.S.)
The classic definition of MEMS is any device that
 a. is fabricated using extensions of microelectronic processing (film
deposition, photolithography, etch, plus additional fab processes;
 b. contains mechanically moving parts or permits fluid motion through
its components;
 c. may also contain microelectronic circuitry to control the device, sense
an output, or reconfigure itself under electronic control or feedback.

microsensors (physical, chemical & biological)

micromachines
microrobotics (walkers/swimmers/flyers microrobots)
microactuators (micro/nano assembly)
micromanipulators (mirrors, optical aligners)
microfluidics (micropumps, valves)
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Introduction to MEMS

Courtesy of Sandia National Laboratories

MEMS Vs. Integrated Circuits (IC’s)

 One way to look at it:

 IC’s move and sense electrons
 MEMS move and sense mass
 Another:
 IC’s use Semiconductor processing technologies
 MEMS can use a variety of processes including Semiconductor but
also Bulk, LIGA, Surface Micromachining…
 Packaging
 IC packaging consists of electrical connections in and out of a
sealed environment
 MEMS packaging not only includes input and output of electrical
signals, but may also include optical connections, fluidic capillaries,
gas channels and openings to the environment. A much greater
challenge.
 MEMS and IC’s
 IC’s
 IC’s are based on the transistor – a basic unit or building block of IC’s.
 Most IC’s are Silicon based, depositing a relatively small set of materials.
 Equipment tool sets and processes are very similar between different IC
fabricators and applications – there is a dominant front end technology
base.
 MEMS
 Does not have a basic building block – there is no MEMS equivalent of a
transistor.
 Some MEMS are silicon based and use sacrificial surface
micromachining (CMOS based) technology.
 Some MEMS are hybrids (different wafer materials bonded), some are
plastic based or ceramic utilizing a variety of processes – Surface & bulk
micromachining, LIGA, electrodeposition, hot plastic embossing,
extrusion on the micro scale etc.
 There is no single dominant front end technology base but emerging and
established MEMS applications have started to “self-select dominant
front-end technology pathways” (MANCEF 2nd Roadmap).
More on “What are MEMS?”

 MEMS devices first took off in the sensor industry.

 Most MEMS devices have at least one transducer element.
 To sense
 To actuate
 Transducer is a device or system that converts one form of
energy to another – force to voltage, voltage to force, …
MEMS in Mobile Devices
MEMS

Image Courtesy of Sandia National Laboratories, SUMMiTTM Technologies, www.mems.sandia.gov

Spider mite with legs on a mirror drive assembly

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MEMS

Who is involved?

Top 10 Companies (by sales)

Texas Instruments ($883M), Hewlett-Packard, Bosch, Lexmark, Seiko-
Epson, STMicroelectronics, Canon, Freescale, Analog Devices, &
Denos ($170M).

Other Big Players

IBM, Lucent, Agere, Ford, Honeywell, Intel, Saab, ...

Government Interest
DARPA, DOD, NASA, DOC, NSF, …

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MEMS Current Applications

 Accelerometers
 Micro Optical Electro Mechanical Systems (MOEMS)
 Digital Mirror Devices (DMD) used in Projection Devices
 Deformable Mirrors
 Optical Switches
 Inkjet Print Heads (Microfluidics)
 Pressure Sensors
 Gyrometers
 Magnetic heads for hard drives
 Seismic Activities - Thermal transfer

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Ink Jet
 Ink jet printers are MEMS based – late 1970’s, IBM and HP
MEMS Current Applications
Biomedical

 Micro-arrayed biosensors
 Virus detection
 DNA Chip PCR (Polymerase Chain Reaction)
 Neuron probes (nerve damage/repair)
 Retina/Cochlear Implants
 Micro Needles
 ChemLab
 Micro Fluidic Pumps
- Insulin Pump (drug delivery)

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Micro Needles
 MEMS needle within the opening of a small hypodermic needle
 Smaller size reduces pain and tissue damage – now there are
much smaller MEMS needle arrays.
 The plastic needle array is made through a standard MEMS
fabrication process to make the molds, micro injection process is
used to create the arrays. Procter and Gamble
Plastic Needle Array
Biomedical Applications
Micromachine needles used to deliver drugs

75 microns

Courtesy of Sandia National

Laboratories
 MEMS Current Applications
Detection systems

 Hand held detectors – biological & chemical microsensors

 Chem’s Lab on a Chip (security applications)
 Micro and Radio Frequency (RF) Switches
 RFID (radio-frequency identification) Technologies
 Modern “bar-coding” system increasingly used on toll roads and
materials handling applications
 Data Storage Systems
 IBM Millipede storage system – AFM tip writes data bit by
melting a depression into polymer mediaum and reads data by
sensing depressions.

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MEMS Fabrication---Surface Micromachining

Sacrifical layer
deposition
Resist
deposition
Exposure

Resist
development
Layer
etch
Resist
removal
Structural layer
deposition
5 steps photo-
lithography
e.g. freestanding PolySi bridge
Sacrificial layer
etch
Drying

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 Grand Challenges
Difficult Challenges Potential Solutions
Integration of MEMS in the Package Standardization for MEMS packaging to support
integration.
Packages are needed that reduce or eliminate
mechanical stress and enhancing hermeticity.
Package data that can be used to accurately
predict the effect of the package on device
performance.

Testing of MEMS More testing towards the wafer level.

Validated tools to predict device performance from
wafer tests.
Methodologies for “Design for Test” or
“Design for NO Test.”

Validated accelerated life testing for
MEMS
More knowledge of the physics of failure is
required to develop accelerated life tests.
Need to share information. Individual solutions
exist but are not being generalized across the
industry.
NEMS – Definition

Nanosystems

• involve electronic and non-electronic elements and

functions on the nano scale for
• sensing, actuation, signal processing, display, control
functions and / or interface.

This may also include aspects like

• design, simulation, fabrication, reproducibility, system
partitioning, package, test, stability and reliability.

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NEMS

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NEMS – application: nanotubes
Field-emission display by Samsung

prototype 1999
Functional principle 2001

Technologies: Surface micro machining, electric arc discharge, PECVD

Application: mobile communication devices, broadcasting technologies
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 MEMS & NEMS---Difference in Fabrication
Ref.: Franklin, et.al.: Integration of suspended
Sacrifical layer carbon nanotube arrays into electronic
deposition devices and electromechanical systems.
Applied Physics Letter, Vol. 81, no. 5, 29 July
Resist 2002
Stanford University, Dep. of Chemistry
deposition
Exposure

Resist
catalyst
development e.g. freestanding
Layer Carbon Nanotube bridge
etch
Resist
removal
Structural layer
deposition
5 steps photo-
lithography
e.g. freestanding PolySi bridge
Sacrificial layer
etch
Planar Technology Self Assembly
Drying vs.
for Microstructures of Nanostructures

NEMS are not just miniaturized MEMS

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Nanotechnology meets MEMS
Impact of Miniaturization

 Potential Positive Impacts

 Reduction of disease.
 Job opportunities in new fields.
 Low-cost energy.
 Cost reductions with improved efficiencies.
 Improved product and building materials.
 Transportation improvements
 Potential Negative Impacts
 Material toxicity
 Non-biodegradable materials.
 Unanticipated consequences.
 Job losses due to increased manufacturing efficiencies.

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Conclusion

Technologies:
What remains to be done in Microsystem technology?
- Process technology diversity will be reduced by the “market” for
faster application specific design and test
- Material understanding and modeling in micro and nano scale for
effective design and reliability (incl. package) must be promoted

Market:
Microsystems and IC industry market
- MST – Technology will enable and/or help to maintain IC Industry’s
growth by providing solutions for cost reduction.

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Conclusion

What is the difference between MEMS & NEMS?

- Size, fabrication, function:
NEMS are not just miniaturized MEMS

A video for MEMS:

http://www.youtube.com/watch?v=ZuE4oVrtEQY

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