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DSA7003

Silicon PNP epitaxial planar type


For low frequency amplification
Unit: mm
Complementary to DSC7003
 Features
 Low collector-emitter saturation voltage VCE(sat)
 Halogen-free / RoHS compliant
(EU RoHS / UL-94 V-0 / MSL: Level 1 compliant)

 Marking Symbol: 4A

 Packaging
DSA7003×0L Embossed type (Thermo-compression sealing): 1 000 pcs / reel (standard)

 Absolute Maximum Ratings Ta = 25°C


Parameter Symbol Rating Unit
Collector-base voltage (Emitter open) VCBO –60 V
Collector-emitter voltage (Base open) VCEO –50 V 1: Base
2: Collector
Emitter-base voltage (Collector open) VEBO –5 V
3: Emitter
Collector current IC –1 A
Panasonic MiniP3-F2-B
Peak collector current ICP –1.5 A JEITA SC-62
Collector power dissipation *1 PC 1 W Code TO-243
Junction temperature Tj 150 °C
Operating ambient temperature Topr –40 to +85 °C
Storage temperature Tstg –55 to +150 °C
Note) *1: Printed circuit board: Copper foil area of 1 cm2 or more, and the board thickness
of 1.7 mm for the collector portion
Absolute maximum rating without heat sink for PC is 0.5 W

 Electrical Characteristics Ta = 25°C±3°C


Parameter Symbol Conditions Min Typ Max Unit
Collector-base voltage (Emitter open) VCBO IC = –10 mA, IE = 0 –60 V
Collector-emitter voltage (Base open) VCEO IC = –2 mA, IB = 0 –50 V
Emitter-base voltage (Collector open) VEBO IE = –10 mA, IC = 0 –5 V
Collector-base cutoff current (Emitter open) ICBO VCB = –20 V, IE = 0 – 0.1 mA
hFE1 *2 VCE = –10 V, IC = –500 mA 120 340
Forward current transfer ratio *1 
hFE2 VCE = –5 V, IC = –1 A 50
Collector-emitter saturation voltage *1 VCE(sat) IC = –500 mA, IB = –50 mA – 0.4 V
Base-emitter saturation voltage *1 VBE(sat) IC = –500 mA, IB = –50 mA –1.2 V
Transition frequency fT VCE = –10 V, IC = –50 mA 120 MHz
Collector output capacitance
Cob VCB = –10 V, IE = 0, f = 1 MHz 14.5 30 pF
(Common base, input open circuited)
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
2. *1: Pulse measurement
*2: Rank classification
Code R S 0
Rank R S No-rank
hFE1 120 to 240 170 to 340 120 to 340
Marking Symbol 4AR 4AS 4A
Product of no-rank is not classified and have no marking symbol for rank.

Publication date: February 2014 Ver. FED 1


DSA7003
DSA7003_PC-Ta DSA7003_IC-VCE DSA7003_hFE-IC
PC  Ta IC  VCE hFE  IC
1 250 −1 200 350
Copper plate at the collector is −9 mA −8 mA Ta = 25°C VCE = −10 V
more than 1.0 cm2 in area, 1.7 mm IB = −10 mA
Ta = 85°C
Collector power dissipation PC (mW)

in thickness. −7 mA −6 mA 300

Forward current transfer ratio hFE


−1 000
1 000
−5 mA

Collector current IC (mA)


250
−800 −4 mA
25°C
750 200
−3 mA
−600
150 −40°C
500 −2 mA
−400
100
−1 mA
250
−200 50

0 0 0
0 40 80 120 160 200 0 −2 −4 −6 −8 −10 −12 −1 −10 −102 −103
Ambient temperature Ta (°C) Collector-emitter voltage VCE (V) Collector current IC (mA)

DSA7003_VCEsat-IC DSA7003_IC-VBE DSA7003_Cob-VCB


VCE(sat)  IC IC  VBE Cob  VCB
−10 −1 000 30
Collector-emitter saturation voltage VCE(sat) (V)

(Common base, input open circuited) Cob (pF)


IC / IB = 10 IE = 0
f = 1 MHz
VCE = −10 V Ta = 25°C
25
−800
Ta = 85°C
Collector current IC (mA)

−1 20
−600

Collector output capacitance


25°C 15

−400
−10−1 10
Ta = 85°C −40°C
25°C −200
5

−40°C
−10−2 0 0
−1 −10 −102 −103 0 − 0.2 − 0.4 − 0.6 − 0.8 −1.0 −1.2 −1 −10 −100
Collector current IC (mA) Base-emitter voltage VBE (V) Collector-base voltage VCB (V)

DSA7003_fT-IC
fT  IC
250
VCE = −10 V
Ta = 25°C
Transition frequency fT (MHz)

200

150

100

50

0
−1 −102 −103 −104
Collector current IC (mA)

Ver. FED 2
DSA7003

MiniP3-F2-B Unit: mm

 Land Pattern (Reference) (Unit: mm)

Ver. FED 3
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.

(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.

(3) The products described in this book are intended to be used for general applications (such as office equipment, communications
equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book.
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment,
life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of
the products may directly jeopardize life or harm the human body.
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with
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(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.

(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.

(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.

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