ERSA IR Profiling

ERSA IR650A / IR550A plus
Basic profile recommendation for IRSoft v4.5 or higher

for SnPb and lead-free applications
Last update: September 15, 2008 – v2.3
This document contains basic profile recommendations for the

ERSA IR rework systems:
IR650A IR550A plus
All profiles are based on the following alloys:

• Leaded process: Sn63Pb37 (eutectic SnPb solder), TL=183 °C
• Lead-free process: Sn95.5Ag3.8Cu0.7 (SAC solder), TL=217 °C – 218 °C
In case of the use of another alloy with a different melting point the profiles have to be
adapted first! (TL, peak temperature, position of break points or soak zone etc.)
This document does not show desoldering profiles!

• A well working soldering profile is the best desoldering profile, too. Just switch the
profile type from “Soldering profile” to “Desoldering profile”.
• The requirements of a board are valid for a desoldering process as well!
Basic profiles are not usable for every application!

• These profiles provide a basic structure for many standard applications. The
intention is to show how to set up different profile shapes.
• Generally, in many cases the profiles should be modified to meet the requirements
of a specific board and component more exactly.
• In difficult cases we recommend to do an evaluation with a special prepared
measure board.
ERSA GmbH
15.09.08 schr / AT ERSA-IR_Profile-recommendation_IRSoftv4-5.doc -1-
Important hints, valid for all profiles:
ERSA IR650A and IR550A plus are closed loop systems:

The ERSA Closed Loop Reflow Technology allows presetting the target profile for the
target component directly instead of setting the temperatures for the heaters. The ERSA
DynamicIR principle delivers the right amount of energy for every application automatically
and it compensates for other environmental influences. The base of a closed loop control
is the temperature feedback of the control sensor. A reliable and stable temperature
measurement is an important condition for controlling the temperature process exactly.
Sketch:
Closed loop
control at
IR650A with
DynamicIR
ERSA GmbH
ERSA provides two different temperature sensor technologies:
1. IRS – non-contact measurement (pyrometric IR-measurement)

o The IRS (infrared sensor) measures the temperature of the component
surface by a pyrometric sensor without touching the board or the
component.
o The IRS has a measure field. It’s NOT limited to the laser pointer spot size.
Make sure the IRS has a clear view of the target component. Make sure the
measure field doesn’t miss the board, e.g. on small boards or if the target
component is located close to the border of the PCB. Otherwise the IRS
could partially measure the bottom side heater.
Schematics of IRS
IRS measuring
Elliptical measure field size:
IR650A: 10 mm x 20 mm
IR550A: 20 mm x 40 mm
o Reflective surfaces on target and / or adjacent components can cause

inaccurate temperature readings. Examples of reflective surface:
Open silicon DIE (on chip or stand-alone)
CPU
Polished, brushed or sand blasted metallic surface (also partially)
Power BGA (metallic surface)
Other very reflective surface (shiny painting etc.)
ERSA GmbH
o If required, the IRS reading can be improved by covering the surface of a

problematic component by a PTFE-Glass-Cloth-Tape (Order-No. 0IR6500-
46). This tape changes the structure of the component surface to the IRS
while the heat transfer to the component body is still possible. After the
process the tape can be removed without leaving residues:
PTFE-Glass-Cloth-Tape, ERSA Order-No. 0IR6500-46
2. TC – contact measurement by a type K thermocouple

o For best results the original ERSA AccuTC sensor (Order-No. 0IR6500-01)
should be used:
ERSA AccuTC thermocouple (sheath thermocouple)
ERSA GmbH
o The sensor tip has to be placed close beside the target component. A
distance of 1 – 2 mm is known to be perfect. Avoid placing the sensor tip at
the edge of the target component and don’t push it below (except for THT).
1 – 2 mm
min. 3 mm
Sketch of AccuTC placement
o The sensor tip has to be placed as flat as possible onto the board surface.
This improves the thermal transfer between measuring spot and sensor.
Hereby the TC should deliver an optimal temperature reading. A minimum of
3 mm of the tip shaft (starting from the tip) has to lay flat on the board
surface.
Example for correct placement of the AccuTC thermocouple (0IR6500-01)
o Note: The shaft of the AccuTC must not be bent too sharply! Otherwise
there’s a risk of breakage!
ERSA GmbH
o For an easy and exact positioning use the ERSA Flexpoint TC-holder (Order-
No. 0IR5500-35).
Flexpoint TC-holder in combination with AccuTC thermocouple
o In case of using open TC wires make sure that the TC is in good condition.
Also the fixture to the board is an important point. Just laying the TC tip on
the board is not enough. The wire tip should be glued to the board surface by
qualified glue (thermally conductive glue) or at least it should be securely
attached using Kapton® tape. Nevertheless a sheath thermocouple is
recommended.
Real measuring point
9 X
The two wires of an uninsulated TC must NOT be twisted because the
last contact point would become the measuring point!
ERSA GmbH
Temperature gradients and energy balance:

• Quick gradients cause high thermal load to the board and the component
surface. Especially for high mass boards and components there is some time
necessary to distribute the heat within and between board and component (mass
layers etc.). A THT profile has to be used without top side heater!
Simplified model for the heat energy transfer at a BGA:
ΔT
ΔT
• Quick temp. gradients • Slow temp. gradients

• Short process time • Longer process time
• Higher heater power • Lower heater power
Large ΔT between solder ball Small ΔT between solder ball

and component surface. and component surface.
Conclusion:
Quick temperature gradients cause a much higher surface
temperature than slow temperature gradients at the same solder ball
level target peak temperature. Hereby the temperature limit of the
target component surface can be exceeded easily – especially on high
mass applications with extensive heat energy requirements.
ERSA GmbH
• The higher the Energy level of the bottom side heater, the lower the heating power
from the top side (while going with same gradient) and the same in reverse. This is
automatically controlled by the ERSA True Closed Loop Control with DynamicIR!
So by a higher Energy level a sensitive component on the top side of a board can
be protected. But keep in mind to take a look at the bottom side surface
temperature! By some trials a good balance can be found.
• The “Flat Peak” time4 after T3 provides an adjustable plateau at the peak
temperature for balancing:
o the temperature of the low and high mass spots within board and
component.
o the temperature between board and component.
o the temperature between board surface and board core.
o the temperature between component surface and solder level (balls). This
limits also the surface temperature of the component!
ERSA GmbH
Linear profile:
Leaded application
Lead-free application
Profile setting hints:

• Adjustable, constant gradient during entire process. Controller for gradient: time1
• T1, T2 and T3 are set to peak temperature, time2 and time3 have to be set to 0 s.
These settings disable the area between T1 and T3.
• Like in all profiles, the Energy level must be set to a suitable value for the individual
application.
Range of application:
• Mainly for light and medium mass boards and components (PBGA, QFP, SOIC etc.)
• With very slow gradients also useful for high mass boards and components.
Special notes:
• On medium and quick gradients extensive thermal load to the target surface.
• Powerful support from bottom side heater required (Energy level), especially on
high mass applications.
ERSA GmbH
Bended linear profile (linear profile with one break point):
Leaded application

• T2 and T3 are set to peak temperature; time3 has to be set to 0 s. These settings
disable the area between T2 and T3.
• Break point, first and second gradient can be controlled by Tinit, T1, T2, time1 and
time2.
• Perfect for many applications, especially high mass boards and components
(MBGA, CBGA etc.)
• Also for sensitive surface (plastic components etc.)
Special notes:
• Low thermal load to the surface at the target area after break point T1.
• A higher temperature-time-coefficient could be caused by a very slow second
gradient. Check the flux system for compatibility!
ERSA GmbH
15.09.08 schr / AT ERSA-IR_Profile-recommendation_IRSoftv4-5.doc - 10 -
Double bended linear profile (linear profile with two break points):
Leaded application

• The two break points, the first, second and third gradient can be controlled by Tinit,
T1, T2, T3, time1, time2 and time3.
• Perfect for very high mass or very sensitive applications. Especially for heavy mass
boards and components (MBGA, CBGA etc.),
• Very sensitive surface, e.g. card slots, SMD plastic connectors, BGA processor
sockets etc.
Special notes:
• Reduction of the thermal load to the surface of the target component after each
break point (T1, T2).
• Careful heat transfer even on high energy requirement.
• A higher temperature-time-coefficient could be caused by a very slow third gradient.
Check the flux system for compatibility!
ERSA GmbH
Soak zone profile:
Leaded application

• The two break points, the first, second and third gradient can be controlled by Tinit,
T1, T2, T3, time1, time2 and time3.
• Standard BGA applications on boards with medium mass.
• Other standard components without sensitive surface.
Special notes:
• Ramp T2 – T3: System runs with more heater power caused by a higher gradient
(adjustable by time3). This causes a higher thermal load to the board and
component surface (depending on the gradient adjustment). Because of this the
soak zone profile is NOT recommended for very sensitive components and very
high mass applications.
ERSA GmbH
Special profile for THT (bottom side heater only):
Leaded application

• Gradient control is disabled (time1 - time3 = 0s).
• THT component which are not allowed to be heated from the top side, e.g. PTH
plugs and sockets, processors and many others.
Special notes:
• The IR650A top radiator has to be completely switched off in the heater
configuration. All energy is provided from the bottom side.
• IR650A allows an automatic process.
• IR550A plus can run manually only by activation of the profile and switching off
bottom side heater Standby (Parameters / System settings). Don’t swing in the top
side heater arm – do not start a normal process!
• The ERSA Accu-TC has to be used instead of the IRS! It should be placed below
the component, if possible.
ERSA GmbH

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ERSA IR650A / IR550A plus

Basic profile recommendation for IRSoft v4.5 or higher

This document contains basic profile recommendations for the

IR650A IR550A plus

All profiles are based on the following alloys:

This document does not show desoldering profiles!

Basic profiles are not usable for every application!

Important hints, valid for all profiles:

ERSA IR650A and IR550A plus are closed loop systems:

ERSA provides two different temperature sensor technologies:

1. IRS – non-contact measurement (pyrometric IR-measurement)

o Reflective surfaces on target and / or adjacent components can cause

 Open silicon DIE (on chip or stand-alone)

 Polished, brushed or sand blasted metallic surface (also partially)

Power BGA (metallic surface)

 Other very reflective surface (shiny painting etc.)

o If required, the IRS reading can be improved by covering the surface of a

PTFE-Glass-Cloth-Tape, ERSA Order-No. 0IR6500-46

2. TC – contact measurement by a type K thermocouple

ERSA AccuTC thermocouple (sheath thermocouple)

Example for correct placement of the AccuTC thermocouple (0IR6500-01)

Flexpoint TC-holder in combination with AccuTC thermocouple

Real measuring point

Temperature gradients and energy balance:

Simplified model for the heat energy transfer at a BGA:

• Quick temp. gradients • Slow temp. gradients

Large ΔT between solder ball Small ΔT between solder ball

Profile setting hints:

Bended linear profile (linear profile with one break point):

Profile setting hints:

Profile setting hints:

Soak zone profile:

Profile setting hints:

Special profile for THT (bottom side heater only):

Profile setting hints:

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Open silicon DIE (on chip or stand-alone)

Polished, brushed or sand blasted metallic surface (also partially)

Other very reflective surface (shiny painting etc.)