CMOS POWER CONSUMPTION

AND
APPROACHES TOWARDS LOW
POWER DESIGN

BHANU PRASAD N
ROLL NO : 14

08/25/21
 Contents

• Introduction
• Power consumption components
• Motivation for low power design
• Low power design methodologies
• Practical problems in low power design
• Low power design applications
• Multi threshold voltage cmos
 introduction
• Reduction of power consumption makes a device more reliable. The need
for devices that consume a minimum amount of power

• was a major driving force behind the development of CMOS technologies.

As a result, CMOS devices are best known for low power consumption.

• However, for minimizing the power requirements of a board or a system,

simply knowing that CMOS devices may use less power than equivalent
devices from other technologies does not help much.

• It is important to know not only how to calculate power consumption, but

also to understand how factors such as input voltage level, input rise time,
power-dissipation capacitance, and output loading affect the power
consumption of a device
 Power consumption components
• High frequencies impose a strict limit on power consumption in
computer systems as a whole. Therefore, power consumption of each
device on the board should be minimized. Power calculations determine
power-supply sizing, current requirements,cooling/heatsink
requirements, and criteria for device selection. Power calculations also
can determine the maximum reliable operating frequency.
• Two components determine the power consumption in a CMOS circuit:

• 1) Static power consumption

• 2) Dynamic power consumption

• CMOS devices have very low static power consumption, which is the
result of leakage current. This power consumption occurs when all
inputs are held at some valid logic level and the circuit is not in charging
states. But, when switching at a high frequency, dynamic power
consumption can contribute significantly to overall power consumption.
• Charging and discharging a capacitive output load further increases this
dynamic power consumption.
Static power dissipation
 Cont
• As shown in Figure 1, if the input is at logic 0, the n-MOS device is
OFF, and the p-MOS device is ON (Case 1). The output voltage is
VCC, or logic 1.

• Similarly, when the input is at logic 1, the associated n-MOS device

is biased ON and the p-MOS device is OFF. The output voltage is
GND, or logic 0. Note that one of the transistors is always OFF
when the gate is in either of these logic states. Since no current
flows into the gate terminal, and there is no dc current path from
VCC to GND, the resultant quiescent (steady-state) current is zero,
hence, static power consumption is zero.

• However, there is a small amount of static power consumption due

to reverse-bias leakage between diffused regions and the substrate.
This leakage inside a device can be explained with a simple model
that describes the parasitic diodes of a CMOS inverter, as shown in
Figure 2.
Figure 2
cont
 Dynamic power consumption
• The dynamic power consumption of a CMOS IC is calculated by adding the
transient power consumption (Pt), and capacitive-load power consumption
(Pl).
Transient Power Consumption
• Transient power consumption is due to the current that flows only when the
transistors of the devices are switching from one logic state to another. This
is a result of the current required to charge the internal nodes (switching
current) plus the through current
• (current that flows from VCC to GND when the p-channel transistor and n-
channel transistor turn on briefly at the same time during the logic transition).
• The frequency at which the device is switching, plus the rise and fall times
of the input signal, as well as the internal nodes of the device, have a direct
effect on the duration of the current spike. For fast input transition rates,the
through current of the gate is negligible compared to the switching current.
• For this reason, the dynamic supply current is governed by the internal
capacitance of the IC and the charge and discharge current of the load
capacitance.
 Motivation for Low-Power Design
• Scaling of Si CMOS technology
• Higher functionality with smaller chips
• Higher performance at lower cost
• Portability
• New portable compute-intensive applications
• Multi-media
• Video display and capture
• Audio reproduction & capture
• Handwriting recognition
• Notebook computer
• Personal data assistant
• Implantable medical electronics
• Need for satisfactory battery life span
Low power design methodologies
 Logic/circuit level
• Use of more static style over dynamic style;
• Reduce the switching activity by logic optimization
• Optimum clock and bus loading;
• Clever circuit techniques that minimize device count
and internal swing;
• Custom design may improve the power, however, the
design cost increases;
• Reduce VDO in "on-critical paths and proper transistor
sizing;
• Use of multi vt logic circuits and
• Re-encoding of sequential circuits.
 System level
The system level is also important to the whole process of power
optimization.
• Some techniques are: .

• Utilize low system clocks. Higher frequencies are generated with on-chip
phase locked loop.

• High-level of integration. Integrate off-chip memories (ROM, RAM, etc.)

and other ICs such as digital and analog peripherals.
 Architectural level
• At the architecture level, several approaches can be applied to the
design:
• Power management techniques where un used blocks are
shutdown;
• Low-power architectures based on parallelism, pipelining, etc.;
• Memory partition with selectively enabled blocks;
• Reduction of the number of global busses; and
• Minimization of instruction set for simple decoding and execution.
 Algorithm level

• Minimizing the number of operations and hence the number of

hardware resources; and

• Data coding far minimum switching activity

 Device \ process level
• One way to reduce the power dissipation is to reduce the power supply
voltage.
• However the delay increases significantly, particularly when VDD
approaches the threshold voltage. To overcome this problem, the devices
should be scaled
• properly. The advantages of scaling for low-power operation are the
following:
• Improved devices’ characteristics for low-voltage operation. This is due
to the improvement of the current drive capabilities;
• Reduced capacitances through small geometries and junction capacitances;
• Availability of multiple and variable threshold devices. This results
in good management of active and standby power trade-off;
 Applications

• Battery powered portable systems

• Ex :laptops, palmtops, language translators
• Electronic pocket communication products such 8s; cordless and
cellular telephones, PDAs (Personal Digital Assistants), pagers, ete.
• Sub GHz processors for high-performance workstations and computers.
• 100 MHz systems and over are emerging, and 500 MHz and higher will

be common by the end of the decade.

• Other applications such as WLANs (Wireless Local Area Network) and
electronic goads (calculators, hearing aids, watches, ete.).
Parallelism
pipelining
Multi threshold voltage cmos
 conclusion
• Low dynamic power techniques at several levels of
abstractions have been discussed
• Algorithmic and architectural decisions can influence the
power dissipation of a circuit by orders of magnitude.
• Therefore, CAD tools that help the designer to analyze the
power of the circuit at these levels are needed. At lower levels
of the design, the power reduction techniques offer some
savings but less than those expected at higher levels