Advances in Interconnect Technologies: An International Journal 

(AITIJ)

https://airccse.com/aitij/index.html

Scope & Topics

Advances in Interconnect Technologies: An International Journal (AITIJ) invites original

and significant contributions relating to the theory, design, performance and reliability of
interconnect, including materials, analysis, modeling and simulation of interconnect. The journal
proposes to stimulate the development of latest technology in industry and academia. High
quality review papers and short communications are also acceptable.

Research areas suitable for publication include, but are not limited to the following fields:

Topics of interest include, but are not limited to, the following

 EmergingMaterials
 CNT/ GrapheneInterconnects
 Modeling and Simulation
 Testing
 RFIC
 OpticalInterconnects
 WirelessInterconnects
 MicrostripLines
 Analog and MixedSignals
 Dedicated Software and Systems for Developing Interconnect Technology
 On-Chip and Off-ChipInterconnects
 EMC/EMI
 FPGA/ASICs
 FabricationTechniques
 NeuralNetworks
 ParasiticsIssues
 OptimizationTechniques

Paper Submission

Authors are invited to submit papers for this journal through

Email aitijjournal@airccse.comor Submission System. Submissions must be original and
should not have been published previously or be under consideration for publication while being
evaluated for this Journal.
Important Dates

Submission Deadline : September 18, 2021

Notification : October 18, 2021
Final Manuscript Due : October 26, 2021
Publication Date : Determined by the Editor-in-Chief

 Contact Us

Here’s where you can reach us: aitijjournal@yahoo.com or aitijjournal@airccse.com